JP2019083344A - Luminescence device and method of manufacturing the same - Google Patents

Abstract

To provide a luminescence device in which an uneven luminescence color is almost not generated, and its manufacturing method.SOLUTION: A manufacturing method of a luminescence device includes: a bonding process of bonding a first surface of a wavelength conversion member and a first surface of a diffusion member; a first luminescence element disposing process of disposing a luminescence element on a second surface of the diffusion member opposite to the first surface of the diffusion member; a first light transmitting member forming process of covering a side surface of the luminescence element and a part of the second surface of the diffusion member with a light transmitting member; a first covering member forming process of covering an outer surface of the light transmitting member and a part of the second surface of the diffusion member with a covering member; and a first cutting process of cutting the wavelength conversion member, the diffusion member and the covering member.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a light emitting device provided with a light emitting element and a method of manufacturing the same.

  A light emitting device using a light emitting element and a phosphor is known. For example, there is known a light emitting device having a transparent resin that covers the side of a semiconductor light emitting element, a white reflecting member that covers the transparent resin, and a phosphor member that covers these (for example, Patent Documents 1 and 2).

JP 2012-227470 A JP, 2013-012545, A

  In such a light emitting device, a light emitting device which is less likely to cause light emission color unevenness is required.

Embodiments of the present invention include the following configurations.
Bonding the first surface of the wavelength conversion member and the first surface of the diffusion member whose thickness is about a half of the thickness of the wavelength conversion member, and facing the first surface of the diffusion member Forming a light emitting element on the second surface of the diffusion member, which is the first surface, a first light emitting element arranging step, a side surface of the light emitting element and a part of the second surface of the diffusion member Forming the first light-transmissive member, covering the outer surface of the light-transmissive member and a part of the second surface of the diffusion member with a covering member, forming the first covering member, and the wavelength conversion member And a first cutting step of cutting the diffusion member and the covering member.
Further, the embodiment of the present invention also includes the following configuration.
A second light emitting element disposing step of disposing a light emitting element on a first surface of the sheet, and covering a side surface of the light emitting element and a part of the first surface of the sheet with a light transmitting member A member forming step, a second covering member forming step of covering the outer surface of the light transmitting member and a part of the first surface of the sheet with a covering member, and a peeling step of peeling the sheet from the light emitting element; A step of forming a diffusion member and a wavelength conversion member in this order on the light emitting element and the light transmitting member, wherein the thickness of the diffusion member is about half of the thickness of the wavelength conversion member A method of manufacturing a light emitting device, comprising: a forming step; and a second cutting step of cutting the covering member.
In addition, the light emitting device manufactured with the above configuration includes the following configuration.
A first surface, a second surface opposite to the first surface, and a plurality of side surfaces between the first surface and the second surface, and a pair of electrodes on the second surface side A light-emitting element having a light-transmitting element, a light-transmitting member covering a part of at least one side surface, a covering member covering an outer surface of the light-transmitting member to expose a pair of electrodes, A light emitting device comprising: a diffusion member covering a light emitting member; and a wavelength conversion member covering the diffusion member.

  According to the solution described above, it is possible to provide a light emitting device and a method of manufacturing the same in which the light emission color unevenness is reduced.

FIG. 1A is a schematic plan view of the light emitting device according to the first embodiment. FIG.1 (b) is a schematic sectional drawing in alignment with the AA of FIG. 1 (a). FIG. 2A to FIG. 2E are schematic cross-sectional views for explaining the method of manufacturing the light emitting device according to the first embodiment. FIG. 3A is a schematic plan view of the light emitting device according to the second embodiment. FIG.3 (b) is a schematic sectional drawing in alignment with the BB line of Fig.3 (a). FIG. 4A to FIG. 4F are schematic cross-sectional views for explaining the method of manufacturing the light emitting device according to the second embodiment. FIG. 5 is a schematic plan view of the light emitting device.

  Hereinafter, embodiments of the present invention will be described in detail based on the drawings. In the following description, terms that indicate a specific direction or position (for example, "upper", "lower", "right", "left" and other terms including those terms) are used as needed. . The use of these terms is to facilitate the understanding of the invention with reference to the drawings, and the technical scope of the present invention is not limited by the meaning of these terms. Further, portions denoted by the same reference numerals in multiple drawings indicate the same portions or members.

Embodiment 1
The light emitting device 10 according to the present embodiment shown in FIGS. 1A and 1B includes a light emitting element 20, a light transmitting member 30 provided on the side 23 of the light emitting element 20, and a light transmitting member 30. And a covering member 40 covering the outer surface 33. The light emitting device 10 can include the diffusion member 50 on the first surface (upper surface) 11 side functioning as a light emitting surface and the wavelength conversion member 60 on the first surface (upper surface) 51 side of the diffusion member.

  FIG. 1B is a schematic cross-sectional view taken along the line A-A in FIG. 1 (a line orthogonal to a pair of opposing side surfaces 23 of the light emitting element 20). As shown in FIG. 1B, the light emitting element 20 can include a light transmitting substrate 27 and a semiconductor laminate 28 formed on the lower surface side of the light transmitting substrate 27. The light emitting element 20 includes a first surface (upper surface) 21 on the translucent substrate 27 side, a second surface (lower surface) 22 on the semiconductor laminate 28 side facing the first surface 21, and a first surface. A plurality of side surfaces 23 are provided between 21 and the second surface 22. The light emitted from the light emitting element 20 passes from the semiconductor laminate 28 through the translucent substrate 27 or from the semiconductor laminate 28 to the side surface 23 of the light emitting element 20, the translucent member 30, the diffusion member 50, and the wavelength conversion member 60 , And is taken out to the first surface 11 side of the light emitting device 10.

  A pair of electrodes 251 and 252 for energizing the light emitting element 20 is provided on the second surface 22 of the light emitting element 20 (on the side of the semiconductor stack 28 in FIG. 1B). Note that in the present specification, the “second surface 22” of the light emitting element 20 refers to the surface of the light emitting element 20 in a state in which the electrodes 251 and 252 are not included. In the present embodiment, the second surface 22 coincides with the lower surface of the semiconductor stack 28.

  Each of the two electrodes 251, 252 constituting a pair of electrodes can have any shape. For example, the electrodes 251 and 252 can be a rectangle extending in one direction when viewed from the second surface 12 side of the light emitting device 10. The electrodes 251 and 252 may not have the same shape. In addition, the two electrodes 251 and 252 can be disposed arbitrarily as long as they are separated from each other.

  The translucent member 30 is provided to cover at least the light emitting layer on the side surface 23 of the light emitting element 20, and guides light emitted from the side surface 23 in the direction of the first surface 11 of the light emitting device 10. . That is, before the light reaching the side surface 23 of the light emitting element 20 is reflected by the side surface 23 and attenuated in the light emitting element 20, the light can be extracted to the outside of the light emitting element 20 through the translucent member 30. By providing the translucent member 30, the loss of light can be suppressed, and the light extraction efficiency of the light emitting device 10 can be improved.

  In particular, when the side surface 23 of the light emitting element 20 is inclined with respect to the second surface 22, for example, when the angle formed by the side surface 23 of the light emitting element 20 and the second surface 22 is an acute angle, The effect of the light emitting member 30 becomes remarkable. For example, in the manufacturing process of the light emitting element 20, when the light emitting element 20 is singulated by cleavage, the side surface 23 of the light emitting element 20 may not be perpendicular to the second surface 22. In general, the light emitting element 20 is a parallelogram in a cross section taken along the line A-A in FIG. 1 (FIG. 1B). That is, the first surface 21 and the second surface 22 are parallel, the two opposing side surfaces 23 are parallel, and each side surface 23 emits light inclined with respect to the first surface 21 and the second surface 22. The element 20 is obtained. The angle between the one side surface 23 and the second surface 22 is an obtuse angle, so that the light reflected by the one side surface 23 is directed toward the first surface 21 of the light emitting element 20 as it is. It can be taken outside. However, since the angle with the second surface 22 is acute for the other side surface 23, the light reflected by the other side surface 23 is directed toward the second surface 22 in the light emitting element 20. It can be attenuated.

  By covering the other side surface 23 with the light transmitting member 30, the light reaching the other side surface 23 can be extracted to the outside of the light emitting device 10 through the light transmitting member 30. In addition to cleavage of the light emitting element, for example, after laminating an n-type semiconductor layer, a light emitting layer (active layer), and a p-type semiconductor layer on a sapphire substrate, a part of the p-type semiconductor layer And, a part of the light emitting layer may be etched to expose a part of the n-type semiconductor layer or a part of the sapphire substrate. In such a case, the side surfaces of the p-type semiconductor layer, the active layer, the n-type semiconductor layer, and the sapphire substrate may be inclined depending on the etching conditions and the like. Also in such a case, by covering the inclined side surface with the light transmitting member 30, light can be extracted to the outside of the light emitting device through the light transmitting member 30.

The first surface of the light emitting element 20 and the diffusion member 50 may be bonded by an adhesive 35. The adhesive 35 is preferably translucent, and the material may be the same as or different from that of the translucent member 30. In addition, an adhesive member may be provided not only between the light emitting element and the diffusion member but also between the light transmissive member and the diffusion member. In that case, for example, as described later, when the adhesive member is disposed on the sheet-like diffusion member, and the light emitting element 20 is placed thereon, the adhesive member is protruded outside the side of the light emitting element 20 Can be provided.
At this time, the adhesive may be provided in contact with the side surface of the light emitting element. By providing the light-transmissive member 30 after providing such an adhesive member, a region in contact with the adhesive member and a region in contact with the light-transmissive member exist on the side surface of the light emitting element. In other words, the adhesive member and the translucent member are formed to overlap on the side surface of the light emitting element.

  The shape of the diffusion member 50 can be a shape whose upper surface is flat, convex, concave, or provided with a plurality of concavities and convexities. Further, the top view shape can be a quadrangle, a circle, an ellipse or the like. In the case of a convex shape, the height, that is, the height from the first surface 21 of the light emitting element to the second surface 62 of the wavelength conversion member can be 80 μm or less. However, the thickness of the wavelength conversion member may differ depending on the composition, amount, etc. of the phosphor used for the wavelength conversion member. For example, the thickness of the diffusion member 50 should be about half the thickness of the wavelength conversion member 60 Can.

  The pair of electrodes 251 and 252 of the light emitting element 20 are exposed from the covering member 40 and exposed to the second surface (lower surface) 12 of the light emitting device 10. Thereby, the external electrode provided in the board | substrate etc. in which the light emitting element 20 is mounted, and the electrodes 251 and 252 of the light emitting element 20 can be connected. In addition, it is preferable that the light emitting element 20 be covered with the covering member 40 in order to protect the light emitting element 20 from the external environment except the part in which the electrodes 251 and 252 of the second surface 22 are provided.

  When covering the second surface 22 of the light emitting element 20 with the covering member 40, the electrodes 251 and 252 formed on the second surface 22 of the light emitting element 20 are exposed on the surface (second surface 12) of the light emitting device 10. Let's do it. For example, the side surfaces of the electrodes 251, 252 may be covered by the covering member 40, but the surfaces 251s, 252s of the electrodes 251, 252 adjust the thickness of the covering member 40 so as not to cover the covering member 40. The surfaces 251s and 252s of the electrodes may protrude from the covering member 40, or may be substantially flush (see FIG. 1B).

  As described above, the light emitting device 10 can include the diffusion member 50 on the first surface 21 side of the light emitting element 20. By providing the diffusion member diffusion member 50, it is possible to suppress the uneven light emission color emitted from the wavelength conversion member 60.

  Referring back to FIG. 1 (b), as described above, the light emitting device 10 can include the wavelength conversion member 60 on the first surface 11 side. The wavelength conversion member 60 is a member for converting a part of light transmitted through the inside into another wavelength. The wavelength conversion member 60 contains a phosphor which is excited by the light transmitted through the inside thereof. When the light emitting device 10 includes the wavelength conversion member 60, the light emitting device 10 having an emission color different from the emission color of the light emitting element 20 can be obtained. For example, the light emitting device 10 that emits white light can be obtained by combining the light emitting element 20 that emits blue light and the wavelength conversion member 60 that absorbs blue light and emits yellow fluorescence.

  The diffusion member 50 is desirably provided to cover the first surface 21 of the light emitting element 20 and the first surface 31 of the light transmissive member 30. The light generated by the light emitting element 20 is directly extracted from the first surface 21 of the light emitting element 20 or is emitted from the side surface 23 of the light emitting element 20 and passes through the light transmitting member 30. It is taken out indirectly from the surface 31 of one. Therefore, by arranging the diffusion member 50 so as to cover the first surface 21 of the light emitting element 20 and the first surface 31 of the light transmitting member 30, substantially all of the light generated by the light emitting element 20 can be , And can be passed through the diffusion member 50. By passing through the diffusion member 50, it is possible to suppress color unevenness of the light emission of the light emitting device 10.

  Generally, when the light emitting element 20 is lit, light emitted from the first surface 21 passes through the wavelength conversion member 60 and is taken out, but the blue wavelength from the first surface 21 of the light emitting element 20 is strong. It is considered that the large amount of blue light is contained in the light emitted from the wavelength conversion member as the cause of uneven light emission color. By providing the diffusion member 50 between the first surface of the light emitting element and the wavelength conversion member, the blue wavelength emitted from the first surface 21 of the light emitting element 20 is reduced and suppressed by passing through the wavelength conversion member 60 Light will be extracted.

  The wavelength conversion member 60 is desirably provided so as to cover the first surface 51 of the diffusion member 50 and the first surface 31 of the light-transmissive member 30. Furthermore, the diffusion member 50 and the wavelength conversion member 60 can cover the entire top surface of the covering member. In other words, the side surface of the diffusion member 50 and the side surface of the wavelength conversion member 60 are flush with the side surface of the covering member 40.

<Manufacturing method>
A method of manufacturing the light emitting device 10 according to the present embodiment will be described with reference to FIG. In the method of manufacturing a light emitting device according to the present embodiment, a plurality of light emitting devices 10 can be manufactured simultaneously.

  The sheet-like wavelength conversion member 600 (second surface 62) is adhered to the sheet-like diffusion member 500 by hot melt or an adhesive. The thickness of the wavelength conversion member may be, for example, 40 to 80 μm, preferably 80 μm. In addition, since the thickness of the wavelength conversion member differs depending on the type of phosphor to be used, it is most preferable that the thickness is about twice the thickness of the diffusion member.

  The laminated body in which the diffusion member 500 and the wavelength conversion member 600 are adhered has the diffusion member 500 side up, and the first surface 21 of the light emitting element 20 with the adhesive 35 on the first surface 52 of the diffusion member 500. Are bonded (Fig. 2 (a)). The thickness of the diffusion member can be, for example, 10 to 50 μm, and preferably 30 to 40 μm so that blue light emitted from the light emitting element 20 can be suppressed. However, since the thickness of the wavelength conversion member differs depending on the particle diameter of the phosphor used for the wavelength conversion member, the diffusion member preferably has a half thickness of the wavelength conversion member 600.

  When the light emitting element 20 is disposed on the diffusion member 500 using the adhesive 35 (FIG. 2A), the first surface 21 of the light emitting element 20 is disposed to face the adhesive 35. The light emitting element 20 can be fixed to the diffusion member 500 by the adhesive 35. Instead of using an adhesive, it may be fixed to the diffusion member 500 by a translucent member 30 formed later.

  The translucent member 30 is formed to cover the side surface 23 of the light emitting element 20 and the region of the first surface 52 of the diffusion member 500 in the vicinity of the light emitting element 20 (FIG. 2B). When the light transmitting member 30 is formed of a light transmitting resin material, the liquid resin material 30L, which is a raw material of the light transmitting member 30, is used to form the first side of the light emitting element 20 using a dispenser or the like. 2 (b) is applied along the boundary between the reference numerals 212 and 214 and the diffusion member 50. The liquid resin material 30L spreads on the diffusion member 50 and crawls up the side surface 23 of the light emitting element 20 by surface tension. Thereafter, the liquid resin material 30L is cured by heating or the like to obtain the translucent member 30. The translucent member 30 formed around a certain light emitting element 20 and the light emitting element 20 are disposed adjacent to each other. The light transmitting member 30 is formed so that the light transmitting member 30 formed around the light emitting element 20 does not contact.

  When the translucent member 30 is formed from the liquid resin material 30L, the outer surface 33 of the translucent member 30 is directed outward in the Z direction (that is, away from the side surface 23 of the light emitting element 20) by surface tension. It can be inclined (Fig. 2 (b)).

  An outer surface 33 of the translucent member 30 and a portion of the first surface 52 of the diffusion member 500 not covered by the translucent member 30 (that is, the exposed portion of the first surface 52); It covers by the covering member 400 (FIG.2 (c)). Furthermore, the portion of the second surface 22 of the light emitting element 20 not covered by the electrodes 251 and 252 (that is, the exposed portion of the second surface 22) may also be covered by the covering member 40. At this time, the thickness (the dimension in the -Z direction) of the covering member 400 is adjusted so that a part of the electrodes 251 and 252 (for example, the surfaces 251s and 252s of the electrodes 251 and 252) is exposed from the covering member 40. Is preferred. That is, based on the first surface 52 of the diffusion member 50, the height of the second surface 42 of the covering member 40 may be equal to or less than the heights of the surfaces 251s and 252s of the electrodes 251 and 252.

  The covering member 400, the sheet-like diffusion member 500, and the sheet-like wavelength conversion member 600 are cut with a dicer or the like along a broken line X1 passing through the middle of the adjacent light emitting elements 20 (FIG. 2D). As a result, the individual light emitting devices 10 are singulated (FIG. 2E). Thus, a plurality of light emitting devices 10 including one light emitting element 20 can be manufactured at the same time.

Second Embodiment
The light emitting device 15 according to the second embodiment is shown in FIGS. 3 (a) and 3 (b). Moreover, the manufacturing method is shown to Fig.4 (a)-(f). The second embodiment includes the light emitting element 20, the light transmitting member 30 provided on the side surface 23 side of the light emitting element 20, and the covering member 40 covering the outer surface 33 of the light transmitting member 30. The light emitting device 15 can include the diffusion member 50 on the first surface (upper surface) side functioning as a light emitting surface and the wavelength conversion member 60 on the first surface (upper surface) side of the diffusion member. A difference from the first embodiment is that the diffusion member 50 covering the light emitting element 20 and the upper surface of the light transmitting member 30 is not provided on the entire upper surface of the covering member 40. The end 34 of the diffusion member 50 and the end of the wavelength conversion member 60 are separated from the side surface of the covering member 40. In other words, the side surface of the diffusion member 50 and the side surface of the wavelength conversion member 60 are located inside the side surface of the covering member 40. Thereby, it can reduce that the spreading | diffusion member 50 and the wavelength conversion member 60 peel with the coating member 40 by external contact.

<Manufacturing method>
A method of manufacturing the light emitting device 15 according to the second embodiment will be described with reference to FIG. The manufacturing method of the second embodiment does not use a sheet containing a phosphor and a diffusion material, but uses a sheet (for example, a heat resistant sheet) not containing a phosphor and a diffusion agent. This sheet is a member that is eventually removed and does not remain in the light emitting device. That is, in the first embodiment, although the wavelength conversion member and the diffusion member constituting the light emitting device are each in the form of a sheet and used as part of a support member for collectively supporting a plurality of light emitting elements in the process. On the other hand, the second embodiment is characterized in that each step is performed using a sheet that does not constitute a light emitting device as a support member. In the second embodiment, the wavelength conversion member including the phosphor and the diffusion member are formed in the latter half of the process. Here, the latter half of the process is specifically a process after forming the light transmitting member.

  The light emitting element 20 is disposed on the upper surface 71 of the sheet 70 via the adhesive 35 (FIG. 4A). The sheet 70 is a member which is finally peeled off and does not remain in the light emitting device. The light transmitting member 30 is formed to cover the side surface of the light emitting element 20 fixed to the upper surface 71 of the sheet 70 (FIG. 4B), and then the covering member 400 is formed (FIG. 4C). The details of each step are the same as the manufacturing method of the first embodiment.

  After forming the covering member 400 as shown in FIG. 4C, the electrode surface of the light emitting element is attached (reversed) to another heat resistant sheet. Then, the heat-resistant sheet 70 is peeled off from the upper surface of the light emitting element. Thereby, as shown in FIG. 4D, the adhesive formed on the first surface 21 of the light emitting element 20 is exposed. At the same time, the upper surface of the translucent member and the upper surface 400a of the covering member 400 are also exposed. Next, as shown in FIG. 4E, the separately prepared diffusion member 50 and the wavelength conversion member 60 are formed on the light emitting element and the light transmitting member in this order.

  As a method of forming the diffusion member 50 and the wavelength conversion member 60, there is a method of bonding the singulated diffusion member 50 and the wavelength conversion member 60 with an adhesive. The sheet of the diffusion member 50 and the sheet of the wavelength conversion member 60 may be bonded in advance and then divided into pieces, or each of the sheets may be bonded after being separated into pieces. In addition, the wavelength conversion member may be provided on the diffusion member sheet by known techniques such as potting, a spray method, an electrostatic coating method, and a printing method, and then it may be singulated. Alternatively, a diffusion member may be provided on the sheet of the wavelength conversion member by potting, a spray method, an electrostatic coating method, a printing method or the like, and then it may be singulated.

  Further, as shown in FIG. 4D, the diffusion member 50 and the wavelength conversion member 60 are formed on the molded product embedded in the covering member 400 in a state in which the upper surfaces of the light emitting element and the light transmitting member are exposed. , Potting, a spray method, an electrostatic coating method, a printing method, or the like. In this case, it is preferable to cover the upper surface of the covering member, which is to be cut later, with a mask or the like.

  In the case where the wavelength conversion member and the diffusion member are formed in the latter half of the process, as shown in FIG. 1, by using a sheet which continuously covers a plurality of light emitting elements, not a singulated sheet. A light emitting device can be provided in which the wavelength conversion member is provided on the entire top surface of the light emitting device. Similarly, the sheet of the wavelength conversion member and the sheet of the diffusion member are not predivided in advance, but are attached in the second half of the process in a state before being singulated as shown in FIG. A light emitting device can be provided in which the wavelength conversion member is provided on the entire top surface of the device.

  Finally, the covering member 400 is cut with a dicer or the like along the dashed line X2 (FIG. 4E) passing through the middle of the adjacent light emitting elements 20. As a result, the individual light emitting devices 15 are singulated (FIG. 4E). Thus, a plurality of light emitting devices 15 including one light emitting element 20 can be manufactured at the same time.

  Below, the material etc. which were suitable for each structural member of the light-emitting device of Embodiment 1, 2 are demonstrated.

(Light-emitting element 20)
As the light emitting element 20, for example, a semiconductor light emitting element such as a light emitting diode can be used. The semiconductor light emitting device can include the light transmitting substrate 27 and the semiconductor laminate 28 formed thereon.

  As the light emitting element 20, a square shape in top view can be used. In addition, the light-emitting device 17 can also have a polygonal shape other than a square, for example, a hexagonal shape shown in FIG. By using a hexagonal light emitting element, the width of the light transmitting member 30 (the distance between the side surface of the light emitting element when viewed from the upper surface side and the end of the light transmitting member) can be reduced. As a result, the area of the light emitting unit to be irradiated can be reduced, and high luminance can be maintained, so that color unevenness can be reduced. In addition, by using a hexagonal light-emitting element, uniform illuminance distribution can be easily obtained from the light-emitting device, and a point-like light-emitting device with a small light-emitting portion can be obtained.

(Transparent substrate 27)
For the light-transmissive substrate 27 of the light-emitting element 20, for example, a light-transmissive insulating material such as sapphire (Al 2 O 3) or spinel (MgA 12 O 4), or a semiconductor material (eg, A nitride based semiconductor material can be used.

  The semiconductor stack 28 includes a plurality of semiconductor layers. An example of the semiconductor laminate 28 includes three semiconductor layers: a first conductive semiconductor layer (for example, an n-type semiconductor layer), a light emitting layer (active layer), and a second conductive semiconductor layer (for example, a p-type semiconductor layer). (See Figure 3). The semiconductor layer can be formed of, for example, a semiconductor material such as a group III-V compound semiconductor or a group II-VI compound semiconductor. Specifically, a nitride-based semiconductor material (for example, InN, AlN, GaN, InGaN, AlGaN, InGaAlN, etc.) such as InXAlYGa1-X-YN (0 ≦ X, 0 ≦ Y, X + Y ≦ 1) may be used. it can.

  As the electrodes 251 and 252 of the light emitting element 20, an electrically good conductor can be used, and a metal such as Cu is suitable.

(Transparent member 30)
The translucent member 30 can be formed of a translucent material such as translucent resin or glass. As the translucent resin, in particular, a thermosetting translucent resin such as a silicone resin, a silicone modified resin, an epoxy resin, and a phenol resin is preferable. Since the translucent member 30 is in contact with the side surface 23 of the light emitting element 20, the light transmitting member 30 is easily affected by the heat generated in the light emitting element 20 when it is lit. A thermosetting resin is suitable for the light transmitting member 30 because it is excellent in heat resistance. In addition, it is preferable that the translucent member 30 has the high transmittance | permeability of light. Therefore, in general, it is preferable that an additive that reflects, absorbs or scatters light is not added to the light-transmissive member 30. However, it may be preferable to add an additive to the translucent member 30 in order to impart desirable characteristics.
For example, various fillers may be added to adjust the refractive index of the light-transmissive member 30 or to adjust the viscosity of the light-transmissive member (liquid resin material 300) before curing.

(Covering member 40, 403)
The covering members 40 and 403 are formed of a material such that the relation of the thermal expansion coefficient with respect to the light transmitting member 30 and the light emitting element 20 has a predetermined relation. That is, in the covering members 40 and 403, the thermal expansion coefficient difference ΔT40 between the covering members 40 and 403 and the light emitting element 20 is smaller than the thermal expansion coefficient difference ΔT30 between the light transmitting member 30 and the light emitting element 20. The material is selected. For example, when the light emitting element 20 includes the light transmitting substrate 27 of sapphire and the semiconductor stacked body 28 made of a GaN-based semiconductor, the thermal expansion coefficient of the light emitting element 20 is approximately 5 to 7 × 10 −6 / K. . On the other hand, when the translucent member 30 is formed of silicone resin, the coefficient of thermal expansion of the translucent member 30 is 2 to 3 × 10 −5 / K. Therefore, by forming the covering members 40 and 403 from a material having a thermal expansion coefficient smaller than that of the silicone resin, ΔT40 <ΔT30 can be obtained.

  When a resin material is used for the covering member 40, the thermal expansion coefficient is generally on the order of 10 -5 / K, which is an order of magnitude larger than that of the general light emitting element 20. However, the coefficient of thermal expansion of the resin material can be reduced by adding a filler or the like to the resin material. For example, by adding a filler such as silica to a silicone resin, it is possible to lower the coefficient of thermal expansion as compared to the silicone resin before adding the filler.

  The resin material that can be used for the covering member 40 is particularly preferably a thermosetting light-transmitting resin such as a silicone resin, a silicone-modified resin, an epoxy resin, or a phenol resin.

  The covering member 40 can be formed of a light reflecting resin. The light reflective resin means a resin material having a reflectance of 70% or more to the light from the light emitting element 20. The light reaching the covering member 40 is reflected to be directed to the first surface 11 (light emitting surface) of the light emitting device 10, whereby the light extraction efficiency of the light emitting device 10 can be enhanced.

  As the light reflective resin, for example, a light transmissive resin in which a light reflective material is dispersed can be used. As the light reflective material, for example, titanium oxide, silicon oxide, zirconium dioxide, potassium titanate, alumina, aluminum nitride, boron nitride, mullite and the like are preferable. The light reflective material may be used in the form of particles, fibers, thin plates or the like, but in particular, fibers are preferable because they can also be expected to lower the coefficient of thermal expansion of the covering members 40 and 403.

(Diffusion member 50)
The diffusion member 50 can be formed of a translucent material such as translucent resin or glass. As the translucent resin, in particular, a thermosetting translucent resin such as a silicone resin, a silicone modified resin, an epoxy resin, and a phenol resin is preferable. Since the diffusion member 50 is in contact with the first surface 21 of the light emitting element 20, the diffusion member 50 is easily affected by the heat generated in the light emitting element 20 at the time of lighting. A thermosetting resin is suitable for the diffusion member 50 because it is excellent in heat resistance. The diffusion member 50 preferably has a high light transmittance. Therefore, normally, it is preferable not to add an additive that reflects, absorbs or scatters light to the diffusion member 50. However, it may be preferable to add additives to the diffusion member 50 to impart desired properties. For example, in order to adjust the refractive index of the diffusion member 50, various fillers may be added.

(Wavelength conversion member 60)
The wavelength conversion member 60 contains a phosphor and a translucent material. A translucent resin, glass, etc. can be used as a translucent material. In particular, translucent resins are preferable, and thermoplastic resins such as silicone resins, silicone modified resins, epoxy resins, thermosetting resins such as phenol resins, polycarbonate resins, acrylic resins, methylpentene resins, and polynorbornene resins are preferably used. it can. In particular, silicone resins having excellent light resistance and heat resistance are preferable.

As the phosphor, one that can be excited by the light emission from the light emitting element 20 is used. For example, as a phosphor that can be excited by a blue light emitting element or an ultraviolet light emitting element, a cerium-activated yttrium aluminum garnet-based phosphor (Ce: YAG); Nitrogen-containing calcium aluminosilicate phosphor activated with europium and / or chromium (CaO-Al2O3-SiO2); europium activated silicate phosphor ((Sr, Ba) 2SiO4); β Nitride-based phosphors such as sialon phosphors, CASN-based phosphors, SCASN-based phosphors; KSF-based phosphors (K2SiF6: Mn); sulfide-based phosphors, quantum dot phosphors and the like. By combining these phosphors with a blue light emitting element or an ultraviolet light emitting element, light emitting devices of various colors (for example, white light emitting devices) can be manufactured.
The wavelength conversion member 60 may contain various fillers and the like for the purpose of adjusting the viscosity and the like.

(Sheet 70)
The sheet (heat-resistant sheet) 70 is preferably made of a material that can be used even in a high temperature range and has excellent insulation. As a material, a polyimide etc. are preferable.

  As mentioned above, although some embodiments according to the present invention have been illustrated, it is needless to say that the present invention is not limited to the above-described embodiments, and can be arbitrary without departing from the scope of the present invention. .

10, 15, 17 Light emitting device 11 First surface (upper surface) of light emitting device
12 Second side (bottom side) of light emitting device
20 light emitting element 21 first surface (upper surface) of the light emitting element
22 Second surface (bottom surface) of light emitting element
Reference Signs List 23 light emitting element side surface 251, 252 electrode 30 light transmitting member 33 light transmitting member outer surface 34 end of diffusion member 35 adhesive 40, 400 covering member 50 diffusion member 500 sheet-like diffusion member 600 sheet-like wavelength conversion Member 70 sheet (heat-resistant sheet)

Claims (9)

Bonding the first surface of the wavelength conversion member and the first surface of the diffusion member whose thickness is about half of the thickness of the wavelength conversion member;
A first light emitting element disposing step of disposing a light emitting element on a second surface of the diffusing member, which is a surface facing the first surface of the diffusing member;
A first light transmissive member forming step of covering the side surface of the light emitting element and a part of the second surface of the diffusion member with a light transmissive member;
A first covering member forming step of covering the outer surface of the light transmitting member and a part of the second surface of the diffusion member with a covering member;
A first cutting step of cutting the wavelength conversion member, the diffusion member, and the covering member;
A method of manufacturing a light emitting device comprising:   The method for manufacturing a light emitting device according to claim 1, wherein a thickness of the diffusion member used in the bonding step is 30 to 40 μm.   The method according to claim 1, wherein an adhesive is provided between the diffusion member and the light emitting element in the first light emitting element arranging step.   The method for manufacturing a light emitting device according to any one of claims 1 to 3, wherein the diffusion member and the wavelength conversion member used in the bonding step are in the form of a sheet. A second light emitting element disposing step of disposing the light emitting element on the first surface of the sheet;
A second light transmitting member forming step of covering the side surface of the light emitting element and a part of the first surface of the sheet with a light transmitting member;
A second covering member forming step of covering the outer surface of the light transmitting member and a part of the first surface of the sheet with a covering member;
Peeling off the sheet from the light emitting element;
It is a process of forming a diffusion member and a wavelength conversion member in this order on the light emitting element and the translucent member, and forming the diffusion member in which the thickness of the diffusion member is about half of the thickness of the wavelength conversion member Process,
A second cutting step of cutting the covering member;
A method of manufacturing a light emitting device comprising:   The method of manufacturing a light emitting device according to claim 5, wherein in the diffusion member forming step, the diffusion member covers at least a part of the covering member.   The method for manufacturing a light emitting device according to claim 5 or 6, wherein a thickness of the diffusion member used in the diffusion member forming step is 30 to 40 μm.   The method for manufacturing a light emitting device according to any one of claims 5 to 7, wherein an adhesive is provided between the diffusion member and the light emitting element in the diffusion member forming step. A light emitting element having a first surface to be an upper surface, a second surface opposite to the first surface, and a plurality of side surfaces between the first surface and the second surface;
A translucent member covering a part of the side surface of the light emitting element;
A covering member covering an outer surface of the light transmitting member;
A diffusion member covering the first surface of the light emitting element and the upper surface of the light transmissive member and having a thickness of 30 to 40 μm;
And a wavelength conversion member covering an upper surface of the diffusion member.

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