JP2019079961A5 - - Google Patents
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- Publication number
- JP2019079961A5 JP2019079961A5 JP2017206518A JP2017206518A JP2019079961A5 JP 2019079961 A5 JP2019079961 A5 JP 2019079961A5 JP 2017206518 A JP2017206518 A JP 2017206518A JP 2017206518 A JP2017206518 A JP 2017206518A JP 2019079961 A5 JP2019079961 A5 JP 2019079961A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor processing
- processing sheet
- fixing tape
- jig fixing
- delamination
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 description 6
- 230000032798 delamination Effects 0.000 description 2
- 230000007774 longterm Effects 0.000 description 1
- 230000001012 protector Effects 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017206518A JP2019079961A (ja) | 2017-10-25 | 2017-10-25 | 半導体加工用シート |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017206518A JP2019079961A (ja) | 2017-10-25 | 2017-10-25 | 半導体加工用シート |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2019079961A JP2019079961A (ja) | 2019-05-23 |
| JP2019079961A5 true JP2019079961A5 (https=) | 2020-12-03 |
Family
ID=66628912
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017206518A Pending JP2019079961A (ja) | 2017-10-25 | 2017-10-25 | 半導体加工用シート |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2019079961A (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7465099B2 (ja) * | 2020-02-06 | 2024-04-10 | リンテック株式会社 | 保護膜形成用複合シート、及び保護膜付きチップの製造方法 |
| JP7114013B1 (ja) * | 2021-03-22 | 2022-08-05 | リンテック株式会社 | 治具固定用粘着シート、保護膜形成用複合シート、及び保護膜付きチップの製造方法 |
| JP7814992B2 (ja) * | 2021-03-22 | 2026-02-17 | リンテック株式会社 | 治具固定用粘着シート、保護膜形成用複合シート、及び保護膜付きチップの製造方法 |
| CN119563228A (zh) * | 2023-02-02 | 2025-03-04 | 琳得科株式会社 | 工件加工用片及其制造方法 |
| WO2024161721A1 (ja) * | 2023-02-02 | 2024-08-08 | リンテック株式会社 | ワーク加工用シート |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008066336A (ja) * | 2006-09-04 | 2008-03-21 | Lintec Corp | ウエハ加工用シート |
| JP6129705B2 (ja) * | 2013-09-27 | 2017-05-17 | リンテック株式会社 | 半導体加工用粘着シートおよび半導体装置の製造方法 |
| CN106463373B (zh) * | 2014-05-23 | 2020-01-03 | 琳得科株式会社 | 保护膜形成用复合片 |
-
2017
- 2017-10-25 JP JP2017206518A patent/JP2019079961A/ja active Pending
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