JP2019078540A - Visual inspection device - Google Patents

Abstract

To provide a visual inspection device which can efficiently perform visual inspection of an electronic component by allowing an oblique illumination lamp to be arranged in the vicinity of an imaging position for the electronic component.SOLUTION: In a visual inspection device 10, a first oblique illumination lamp 30 which emits light obliquely traveling toward an inspection surface A of an electronic component W placed in an imaging position S is disposed between a first reflection unit 36 disposed on the front side of the inspection surface A and the electronic component W placed in the imaging position S, and an aperture 32 through which an optical axis of first imaging means 12 passes and a cutout 33 which is continuous to the aperture 32 and is pierced by a support member 11 are formed in the first oblique illumination lamp 30. A second oblique illumination lamp 31 which emits light obliquely traveling toward an inspection surface B of the electronic component W placed in the imaging position S is disposed between a second reflection unit 37 disposed on the front side of the inspection surface B and the electronic component W placed in the imaging position S, and an aperture 34 through which an optical axis of second imaging means 13 passes and a cutout 35 which is continuous to the aperture 34 and is pierced by the support member 11 are formed in the second oblique illumination lamp 31.SELECTED DRAWING: Figure 3

Description

The present invention relates to an appearance inspection apparatus that inspects the appearance of an electronic component.

Various electronic components such as diodes, transistors, capacitors, inductors, ICs (Integrated Circuits), etc. are inspected for appearance of cracks, chips and the like by appearance inspection before shipment. The appearance inspection is performed based on an image obtained by imaging an electronic component, and a specific example thereof is described in, for example, Patent Document 1.
The appearance inspection apparatus described in Patent Document 1 performs imaging of an electronic component by an imaging unit (camera) in a state in which light is irradiated to the electronic component disposed at an imaging position.

In the appearance inspection apparatus, two illumination means for applying light to the electronic component are provided on both sides of the imaging position, and the electronic component is provided between one illumination means and the imaging position and between the other illumination means and the imaging position The prism which changes the advancing direction of the light reflected by is provided. The illumination means irradiates light traveling in a direction perpendicular to the inspection surface of the electronic component onto the inspection surface of the electronic component. Since the light reflected by the inspection surface of the electronic component can be changed in the traveling direction by the prism, the imaging means can be disposed at a position where there is no mechanism or the like for supporting the electronic component.
The electronic component moves horizontally and passes over the upper side of one illumination means and the upper side of one prism, and then descends and is placed at the imaging position. Then, the electronic component ascends after imaging, moves horizontally from above the imaging position, and is conveyed while passing above the other prism and above the other illumination means.

JP, 2015-127689, A JP 2008-241342 A

However, since the appearance inspection apparatus described in Patent Document 1 includes a prism between the illumination unit and the electronic component, the ring-shaped oblique light illumination (illuminating light traveling obliquely with respect to the inspection surface of the electronic component) Low angle illumination could not be placed near electronic components. Depending on the type and size of the electronic component, by irradiating the light traveling obliquely to the inspection surface of the electronic component, it is possible to crack the electronic component or to irradiate the light perpendicularly to the inspection surface of the electronic component. It becomes possible to detect a chip stably.

Further, as can be seen from the ring illumination B16e shown in FIG. 8 of Patent Document 2, the ring-shaped oblique illumination generally is compared to the horizontally long illumination means (bar illumination) described in Patent Document 1. Big. Therefore, as shown in FIGS. 14A and 14B, two ring-shaped illuminations 101 and 102 are provided on both sides of the imaging position centering on the imaging position, and the electronic component 103 is horizontally moved to After passing the upper side, the electronic component 103 is lowered and disposed at the imaging position, and after the electronic component 103 is imaged, the electronic component 103 is lifted from the imaging position and horizontally moved to pass the upper side of the illumination 102 Then, as compared with the case described in Patent Document 1, the moving distance of the electronic component 103 becomes longer. As a result, there arises a problem that the number of electronic components to be visually inspected per unit time is reduced.
The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide an appearance inspection apparatus capable of arranging oblique light illumination near an imaging position of an electronic component and efficiently inspecting the appearance of the electronic component. I assume.

An appearance inspection apparatus according to a first aspect of the present invention is an appearance inspection apparatus for inspecting the appearance of an electronic component having inspection surfaces A and B arranged in parallel, wherein the inspection surfaces A and B are conveyed upstream and downstream in the transport direction. A support member for supporting the electronic component and conveying the electronic component to an imaging position in a state of being disposed on each side, and first and second imaging images of the inspection surfaces A and B of the electronic component disposed at the imaging position. An imaging unit; and a first light reflecting portion disposed on the front side of the inspection surface A of the electronic component disposed at the imaging position, and changing the traveling direction of light to obtain an image of the first imaging unit. A first optical path adjusting unit for directing an optical axis to the inspection surface A, the electronic component transported to the imaging position by the support member, and the electronic component disposed from the first light reflecting portion to the imaging position The first photographing toward the inspection surface A of the electronic component An opening P1 for passing the optical axis of the means is formed, and it is disposed between the electronic component disposed at the imaging position and the first light reflecting portion, and disposed at the imaging position from the periphery of the opening P1. Oblique illumination for emitting light directed obliquely to the inspection surface A of the electronic component, and the second illumination light disposed on the front side of the inspection surface B of the electronic component disposed at the imaging position A second light path adjustment unit having a light reflection unit and changing the traveling direction of light to direct the optical axis of the second imaging unit toward the inspection surface B; and the imaging position from the second light reflection unit An optical axis of the second imaging means directed to the inspection surface B of the electronic component disposed in the opening, and an opening P2 for passing the electronic component conveyed from the imaging position to another position by the support member; The electronic component formed and disposed at the imaging position; A second oblique illumination disposed between the light reflecting portions and irradiating obliquely light from the periphery of the opening P2 to the inspection surface B of the electronic component disposed at the imaging position, The first oblique illumination is formed with a notch Q1 which is continuous with the opening P1 and through which the support member which conveys the electronic component to the imaging position passes, and the second oblique illumination includes the notch Q1. A notch Q2 which is continuous with the opening P2 and through which the support member which conveys the electronic component from the imaging position to another position is formed.

An appearance inspection apparatus according to a second aspect of the present invention is an appearance inspection apparatus for inspecting the appearance of an electronic component having inspection surfaces A and B arranged in parallel, wherein the inspection surfaces A and B are conveyed upstream and downstream in the transport direction. A support member for supporting the electronic component from above and transporting it to an imaging position in a state of being disposed on each side, and a third and a third for imaging the inspection surfaces A and B of the electronic component disposed at the imaging position 4 and the third light reflecting portion disposed on the front side of the inspection surface A of the electronic component at the same height as the electronic component disposed at the imaging position, and the traveling direction of light Third optical path adjusting means for directing the optical axis of the third imaging means to the inspection plane A, and the inspection plane of the electronic component disposed at the imaging position from the third light reflecting portion A notch for passing the optical axis of the third imaging means toward A 1 is disposed between the electronic component disposed at the imaging position and the third light reflecting portion with the notch T1 disposed on the upper side, and disposed at the imaging position A third oblique illumination for emitting light obliquely directed to the inspection surface A of the electronic component, and a front side of the inspection surface B of the electronic component at the same height as the electronic component disposed at the imaging position A fourth light path adjusting means for moving the light axis of the fourth imaging means toward the inspection surface B by changing the traveling direction of light, and the fourth light A notch T2 is formed to pass the optical axis of the fourth imaging means toward the inspection surface B of the electronic component disposed at the imaging position from the reflecting portion, and the electronic component disposed at the imaging position Between the second light reflecting portion and the fourth light reflecting portion, with the notch T2 disposed on the upper side, And fourth oblique light illumination for emitting light directed obliquely to the inspection surface B of the electronic component disposed at the imaging position, and the support member is horizontally moved to reflect the third light to the electronic component. The electronic component is disposed at the imaging position, and is elevated to move the electronic component upward from the imaging position for horizontal movement. The electronic component is allowed to pass above the fourth oblique illumination and above the fourth light reflecting portion in order.

An appearance inspection apparatus according to a first aspect of the present invention has a first light reflecting portion disposed on the front side of an inspection surface A of an electronic component disposed at an imaging position, and changes the traveling direction of light to The first optical path adjustment means for directing the optical axis of the imaging means to the inspection surface A, and the optical axis of the first imaging means for the inspection surface A of the electronic component disposed at the imaging position from the first light reflecting portion A first oblique light illumination having an opening P1 to be formed and being disposed between the electronic component disposed at the imaging position and the first light reflecting portion and emitting light obliquely directed to the inspection surface A of the electronic component; The second light reflecting portion disposed on the front side of the inspection surface B of the electronic component disposed at the imaging position, changing the traveling direction of the light, and setting the optical axis of the second imaging unit to the inspection surface B Second light path adjustment means for directing, and a second image pickup hand headed to the inspection surface B of the electronic component disposed at the image pickup position from the second light reflection portion An opening P2 for passing the optical axis of the light source, and disposed between the electronic component disposed at the imaging position and the second light reflecting portion to irradiate light obliquely directed to the inspection surface B of the electronic component Since two oblique illuminations are provided, the first and second oblique illuminations can be arranged near the imaging position of the electronic component.
In addition, the electronic component transported to the imaging position by the support member passes through the opening P1 of the first oblique light illumination, and the notch through which the support member transports the electronic component to the imaging position passes through the first oblique illumination. Q1 is formed, and the electronic component transported from the imaging position to another position by the support member passes through the opening P2 of the second oblique illumination, and for the second oblique illumination, the electronic component is moved from the imaging position to another location Since the notch Q2 through which the supporting member to be conveyed passes is formed, the moving distance of the supporting means is shortened and movement of the supporting means is reduced as compared to adopting oblique light illumination without the notch through which the supporting member can pass. It is possible to shorten the time required to reduce the number of electronic components to be visually inspected per unit time.
Then, since the inspection surfaces A and B of the electronic component are imaged by the first and second imaging means, respectively, a clear image is obtained as compared with the case where the inspection surfaces A and B of the electronic component are imaged by one imaging device You can get

An appearance inspection apparatus according to a second aspect of the present invention has a third light reflecting portion disposed on the front side of the inspection surface A of the electronic component disposed at the imaging position, and changes the traveling direction of the light. The light path of the third light path adjusting means for directing the light axis of the image pickup means to the inspection surface A, and the light axis of the third image pickup means for the inspection surface A of the electronic component disposed at the image pickup position from the third light reflecting portion The notch portion T1 is formed, and the notch portion T1 is disposed on the upper side between the electronic component disposed at the imaging position and the first light reflecting portion, and is disposed obliquely with respect to the inspection surface A of the electronic component. A third light source for emitting light toward the light, and a fourth light reflecting portion disposed on the front side of the inspection surface B of the electronic component disposed at the imaging position, and changing the traveling direction of the light Fourth light path adjustment means for directing the optical axis of the image pickup means 4 to the inspection surface B, and an electron arranged from the fourth light reflecting portion at the image pickup position A notch T2 is formed which allows the optical axis of the fourth imaging means toward the inspection surface B of the article to pass, and the notch T2 is on the upper side between the electronic component disposed at the imaging position and the fourth light reflecting portion Since it is installed in a distributed state and provided with a fourth oblique light illumination for irradiating light directed obliquely to the inspection surface B of the electronic component, the third and fourth oblique illuminations are provided in the vicinity of the imaging position of the electronic component It can be arranged.
In addition, the support member moves horizontally to cause the electronic component to sequentially pass above the third light reflecting portion and above the third oblique light illumination, descend and arrange the electronic component at the imaging position, and ascend to move the electronic component Is moved upward from the imaging position, and is moved horizontally to cause the electronic component to pass above the fourth oblique light illumination and above the fourth light reflecting portion in order, so that oblique light illumination is not provided with a notch on the upper side. Compared to adopting, it is possible to shorten the distance for lowering the support means to the imaging position, and it is possible to suppress the decrease in the number of electronic components to be visually inspected per unit time.
Then, since the inspection surfaces A and B of the electronic component are imaged by the third and fourth imaging means, respectively, a clear image is obtained as compared with the case where the inspection surfaces A and B of the electronic component are imaged by one imaging device You can get

It is an explanatory view of an appearance inspection device concerning a 1st embodiment of the present invention. It is explanatory drawing of the various members provided for the imaging of the electronic component arrange | positioned in imaging position R. FIG. FIG. 6 is an explanatory view of various members provided for imaging of the electronic component disposed at the imaging position S. FIG. 6 is an explanatory view of various members provided for imaging of the electronic component disposed at the imaging position S. In (A), (B), and (C), the state in which the electronic component moves above the imaging position S, the state of the electronic component disposed at the imaging position S, and the electronic component from above the imaging position S It is explanatory drawing which shows a mode that it moves. (A), (B) is explanatory drawing which respectively shows the arrangement | positioning relationship of the electronic component and 1st oblique light illumination which were distribute | arranged to the imaging position S, and the arrangement | positioning relationship of the same electronic component and 2nd oblique light illumination. (A) and (B) are explanatory drawings which show a mode that an electronic component passes through the opening part of 1st oblique illumination, respectively, and a mode that an electronic component passes through the opening part of 2nd diagonal illumination, respectively. It is an explanatory view of oblique light illumination concerning a modification. It is explanatory drawing of the various members provided for the imaging of the electronic component arrange | positioned in the imaging position V in the external appearance inspection apparatus which concerns on the 2nd Embodiment of this invention. FIG. 8 is an explanatory view of various members provided for imaging of the electronic component disposed at the imaging position V. (A), (B) is explanatory drawing which respectively shows the arrangement | positioning relationship of the electronic component and the 3rd oblique light illumination which were distribute | arranged to the imaging position V, and the arrangement | positioning relationship of the same electronic component and 4th oblique light illumination. (A), (B) is explanatory drawing which respectively shows a mode that an electronic component passes above the 3rd oblique illumination, and a mode that an electronic component passes above the 4th diagonal illumination. In (A), (B), and (C), the state in which the electronic component moves above the imaging position V, the state of the electronic component disposed at the imaging position V, and the electronic component from above the imaging position V It is explanatory drawing which shows a mode that it moves. (A) and (B) are explanatory drawings each showing the conveyance path of the electronic component by the external appearance inspection apparatus which concerns on a comparative example.

Next, embodiments of the present invention will be described with reference to the attached drawings for understanding of the present invention.
As shown in FIGS. 1 and 3, an appearance inspection apparatus 10 according to a first embodiment of the present invention is an apparatus for inspecting the appearance of an electronic component W having inspection surfaces A and B arranged in parallel, A support member 11 for supporting the electronic component W and transporting it to the imaging position S, and imaging means 12 and 13 for imaging the inspection surfaces A and B of the electronic component W disposed at the imaging position S (first and second Imaging means). The details will be described below.

In the present embodiment, as shown in FIGS. 1, 2 and 3, the electronic component W to be subjected to the appearance inspection has a rectangular parallelepiped shape, and is rectangular (including a square shape) in plan view. The electronic component W has four side surfaces, and the four side surfaces are the inspection surfaces A, B, C, and D to be subjected to the appearance inspection by the appearance inspection apparatus 10, respectively. The inspection surface A and the inspection surface B are parallel, and the inspection surface C and the inspection surface D are parallel.

In the appearance inspection apparatus 10, a plurality of (in the present embodiment, 12 but not limited thereto) support members 11 are mounted so as to be able to move up and down, and are provided with a disk-shaped rotating body 14 disposed horizontally. .
As shown in FIG. 1, the rotary body 14 is connected to a rotary shaft 15 vertically disposed at the center, is given a driving force from a servomotor (not shown) via the rotary shaft 15, and intermittently rotates at a predetermined angle. In the present embodiment, the rotating body 14 rotates 30 ° in one rotation operation.

The support member 11 is a cylindrical suction nozzle which is provided in the outer peripheral portion of the rotary member 14 at equal intervals (in the present embodiment, at intervals of 30 ° position) and which is long in the vertical direction, as shown in FIGS. The upper surface of the electronic component W is attracted by vacuum pressure below the rotating body 14 to hold the electronic component W.
As shown in FIG. 1 and FIG. 2, the inspection surfaces A and B of the electronic component W are disposed on the upstream side and the downstream side of the rotational direction (conveyance direction) of the rotary body 14, and the inspection surfaces C and D are It is hold | maintained at the support member 11 in the state distribute | arranged respectively to the radial direction outer side and inner side.

The support member 11 repeats the movement and the temporary stop along the circumferential direction of the rotating body 14 by the intermittent rotation of the rotating body 14.
Further, at each position where the support member 11 is temporarily stopped, as shown in FIGS. 1, 2 and 3, a pressing mechanism 16 for lowering the temporarily stopped support member 11 is attached to a member not shown. . The pressing mechanism 16 has a lifting member 17 which is raised and lowered by the operation of a servomotor and a servomotor (not shown), and the lifting member 17 contacts the support member 11 from above by lowering from above the support member 11. Push down.

The support member 11 is attached to the rotating body 14 in a state of being biased upward by a coil spring (not shown). When the lift 17 is not in contact with the support member 11, the support member 11 is elevated by a coil spring as shown in FIGS. 5A and 5C, and a predetermined position (hereinafter referred to as a “pass line Say)). Therefore, the support member 11 is disposed on the pass line while moving by the rotation of the rotating body 14 and while the lifting piece 17 is not in contact at the primary stop position.

The electronic component W held by the support member 11 is sequentially immediately above the imaging position R of the inspection surfaces C and D and immediately above the imaging position S of the inspection surfaces A and B by the intermittent rotation of the rotating body 14. Be placed. The electronic component W disposed immediately above the imaging position R is pushed down by the elevating piece 17 together with the support member 11 holding the electronic component W and disposed at the imaging position R, as shown in FIG. The inspection surfaces C and D are respectively imaged by 18 and 19. The electronic component W disposed immediately above the imaging position S is pushed down by the elevating piece 17 together with the support member 11 holding the electronic component W and disposed at the imaging position S, as shown in FIG. A and B are imaged by the imaging means 12 and 13, respectively.

As shown in FIG. 2, the imaging means 18 and 19 are disposed outside the rotating body 14 in plan view, and the optical axis advances in the radial direction of the rotating body 14. In the vicinity of the imaging position R, as shown in FIG. 1 and FIG. 2, annular oblique illuminations 20 and 21 for irradiating light to the inspection surfaces C and D of the electronic component W disposed at the imaging position R are disposed. It is done. The oblique light illumination 20 irradiates the inspection surface C of the electronic component W disposed at the imaging position R with light advancing obliquely to the inspection surface C, and the oblique illumination 21 is an electronic component W disposed at the imaging position R The inspection surface D is irradiated with light traveling obliquely to the inspection surface D.

Then, at the height position of the imaging position R, the mirrors 22 and 23 respectively disposed on the front side of the inspection surfaces C and D of the electronic component W disposed at the imaging position R are provided, and imaging is performed below the mirror 22 A mirror 24 is provided on the front side of the means 18, and a mirror 25 is provided on the front side of the imaging means 19 below the mirror 23.
The optical axis of the imaging means 18 travels in the radial direction (horizontal direction) of the rotating body 14, is reflected upward by the mirror 24, is reflected in the radial direction of the rotating body 14 by the mirror 22, and passes through the opening 26 of the oblique light 20. Go to the inspection surface C of the electronic component W disposed at the imaging position R. Therefore, the imaging unit 18 can image the inspection surface C of the electronic component W disposed at the imaging position R.

The optical axis of the imaging means 19 travels in the radial direction of the rotating body 14, is reflected upward by the mirror 25, is reflected in the radial direction of the rotating body 14 by the mirror 23, passes through the opening 27 of the oblique light illumination 21, and the imaging position R Toward the inspection surface D of the electronic component W arranged in Therefore, the imaging unit 19 can image the inspection surface D of the electronic component W disposed at the imaging position R.

A coaxial illumination 28 for emitting light in the same direction as the optical axis of the imaging means 18 is provided between the imaging means 18 and the mirror 24, and the light of the imaging means 19 is provided between the imaging means 19 and the mirror 25. Coaxial illumination 29 is provided which emits light in the same direction as the axis. The coaxial illumination 28 includes a light source unit 28 a and a half mirror 28 b that reflects the light emitted from the light source unit 28 a and directs the light to the mirror 24. The coaxial illumination 29 reflects the light emitted from the light source unit 29 a and the light source unit 29 a And a half mirror 29b which is directed to the mirror 25.
The light emitted from the coaxial illumination 28 is sequentially reflected by the mirrors 24 and 22 and reaches the inspection surface C of the electronic component W disposed at the imaging position R, and the light emitted from the coaxial illumination 29 is a mirror 25 , 23 sequentially to reach the inspection surface D of the electronic component W disposed at the imaging position R. The optical axis of the imaging means 18 passes through the half mirror 28 b to advance to the mirror 24, and the optical axis of the imaging means 19 passes through the half mirror 29 b to advance to the mirror 25.

Further, as shown in FIG. 3 and FIG. 4, the imaging means 12 and 13 are arranged such that the optical axis is parallel to the substantially radial direction of the rotating body 14.
In the vicinity of the imaging position S, as shown in FIG. 1, FIG. 3, and FIG. 4, oblique light illuminations 30, 31 for irradiating light to the inspection surfaces A and B of the electronic component W disposed at the imaging position S. 1, second oblique illumination) is arranged. The oblique illuminations 30, 31 are arranged at the same height.

As shown in FIG. 6A, the oblique illumination 30 removes a part of the annular ring having the opening 32 (opening P1) formed at its center, and the notch 33 (notching) continuous with the opening 32. Q1) is C-shaped and fixed by a support (not shown) with the notch 33 disposed on the upper side. The oblique light illumination 30 applies light to the inspection surface A of the electronic component W disposed at the imaging position S from the periphery of the opening 32, as shown in FIG. The light emitted from the oblique light illumination 30 advances obliquely to the inspection surface A of the electronic component W disposed at the imaging position S and strikes the inspection surface A.

As shown in FIG. 6 (B), the oblique light illumination 31 removes a part of the annular ring having the opening 34 (opening P2) formed at its center, and the notch 35 (notch continuing to the opening 34). Q2) is formed in the C shape, and is fixed by a support (not shown) with the notch 35 disposed on the upper side.
The oblique light illumination 31 applies light to the inspection surface B of the electronic component W disposed at the imaging position S from the periphery of the opening 34, as shown in FIG. The light emitted from the oblique light illumination 31 advances obliquely to the inspection surface B of the electronic component W disposed at the imaging position S and strikes the inspection surface B.

The oblique illuminations 30, 31 have the same shape as shown in FIGS. 6 (A), (B), 7 (A), (B), and the electronic parts in which the notches 33, 35 are arranged at the imaging position S It is disposed at a position higher than the component W and the electronic component W disposed in the pass line. The electronic component W disposed at the imaging position S is lower than the upper end of the opening 32 of the oblique light 30 and the upper end of the opening 34 of the oblique light 31, as shown in FIGS. 6A and 6B. It is disposed at a position higher than the lower end of the opening 32 and the lower end of the opening 34 of the oblique illumination 31.
6A is a view of the electronic component W and the oblique light illumination 30 disposed at the imaging position S from the oblique light illumination 31 side, and FIG. 6B is disposed at the imaging position S from the oblique light illumination 30 side. It is the figure which looked at the electronic component W and oblique light illumination 31 which were done. In FIGS. 7A and 7B, the electronic component W is disposed in the pass line.

At the same height as the electronic component W disposed at the imaging position S, as shown in FIGS. 3, 6A and 6B, the front of the inspection surface A of the electronic component W disposed at the imaging position S A mirror 36 (first light reflecting portion) disposed on the side and a mirror 37 (second light reflecting portion) disposed on the front side of the inspection surface B of the electronic component W are provided. As shown in FIGS. 6A and 6B, the mirror 36 is provided at a position lower than the notch 33 of the oblique light illumination 30, and the mirror 37 is provided at a position lower than the notch 35 of the oblique light illumination 31.

The width of the notches 33 of the oblique light illumination 30 and the width of the notches 35 of the oblique light illumination 31 are larger than the width (diameter) of the support member 11 so that the support members 11 can pass through the notches 33, 35 It is designed.
The oblique light illumination 30 is disposed between the electronic component W disposed at the imaging position S and the mirror 36, and the oblique illumination 31 is disposed between the electronic component W disposed at the imaging position S and the mirror 37.
A mirror 38 is provided below the mirror 36 on the front side of the imaging means 12, and a mirror 39 is provided below the mirror 37 on the front side of the imaging means 13.

The optical axis of the imaging means 12 travels substantially inward (horizontally) in the radial direction of the rotating body 14 as shown in FIGS. 3 and 4, is reflected upward by the mirror 38, and is substantially tangential to the rotating body 14 by the mirror 36. The light is reflected (horizontally), passes through the opening 32 of the oblique light illumination 30, and travels toward the inspection surface A of the electronic component W disposed at the imaging position S. Therefore, the imaging unit 12 can image the inspection surface A of the electronic component W disposed at the imaging position S.
In the present embodiment, the optical path adjustment means 41 (first optical path adjustment means) for changing the traveling direction of light to direct the optical axis of the imaging means 12 to the inspection surface A of the electronic component W disposed at the imaging position S Are configured to have mirrors 36 and 38.

The optical axis of the imaging means 13 travels inward (horizontal) in the substantially radial direction of the rotary body 14, is reflected upward by the mirror 39, is reflected in the substantially tangential direction (horizontal) of the rotary body 14 by the mirror 37, and oblique light illumination 31 Toward the inspection surface B of the electronic component W disposed at the imaging position S through the opening 34 of Therefore, the imaging unit 13 can image the inspection surface B of the electronic component W disposed at the imaging position S.
In the present embodiment, the optical path adjusting means 42 (second optical path adjusting means) for changing the traveling direction of light to direct the optical axis of the imaging means 13 to the inspection surface B of the electronic component W disposed at the imaging position S Are configured to have mirrors 37 and 39.

A coaxial illumination 43 (first coaxial illumination) for emitting light in the same direction as the optical axis of the imaging unit 12 is disposed between the imaging unit 12 and the mirror 38, and between the imaging unit 13 and the mirror 39, Coaxial illumination 44 (second coaxial illumination) for emitting light in the same direction as the optical axis of the imaging means 13 is provided.
The coaxial illuminations 43 and 44 have the same structure as the coaxial illuminations 28 and 29, and each include a light source unit and a half mirror. The light emitted from the coaxial illumination 43 travels in the same direction as the optical axis of the imaging means 12 and is sequentially reflected by the mirrors 38 and 36 to reach the inspection surface A of the electronic component W disposed at the imaging position S, The inspection surface A is illuminated with light traveling perpendicularly to the inspection surface A.

The light emitted from the coaxial illumination 44 travels in the same direction as the optical axis of the imaging means 13 and is sequentially reflected by the mirrors 39 and 37 to reach the inspection surface B of the electronic component W disposed at the imaging position S, The inspection surface B is illuminated with light traveling perpendicularly to the inspection surface B.
In addition, the mirrors 22-25, the mirrors 36-39, and the coaxial illuminations 28, 29, 43, and 44 are each being fixed to the support member which is not shown in figure.

The electronic component W held by the support member 11 and temporarily stopped above the imaging position R by the rotation of the rotary member 14 is lowered together with the support member 11 by the lowering of the elevation piece 17 and disposed at the imaging position R. The inspection surfaces C and D are imaged by the imaging means 18 and 19, respectively. Then, the electronic component W ascends along with the support member 11 by the elevation of the elevating piece 17 and is disposed in the pass line, and then moves horizontally as shown in FIG. It is disposed above the position S, and is lowered together with the support member 11 by the lowering of the lifting and lowering piece 17, and is disposed at the imaging position S as shown in FIG. 5 (B).

As shown in FIG. 7A, the mirror 36 is provided at a position lower than the electronic component W disposed in the pass line, and the electronic component W is horizontally directed from above the imaging position R to above the imaging position S. When moving, as shown in FIG. 5 (A) and FIG. 7 (A), it passes above the mirror 36, passes through the inside of the opening 32 of the oblique light illumination 30, and is disposed above the imaging position S. When the electronic component W passes through the opening 32 of the oblique illumination 30, the support member 11 passes through the notch 33 of the oblique illumination 30, as shown in FIG. 7A.
Therefore, the support member 11 which transports the electronic component W to the imaging position S moves horizontally to pass the electronic component W above the mirror 36 and the inside of the opening 32 of the oblique light illumination 30 in order and descends to move the electronic component W. The support member 11 is disposed at the imaging position S, and the support member 11 passes through the notch 33 of the oblique light illumination 30.

Then, after the inspection surface A is imaged by the imaging unit 12, the inspection surface B of the electronic component W disposed at the imaging position S is imaged by the imaging unit 13. That is, the imaging units 12 and 13 respectively image the inspection surfaces A and B of the electronic component W at different timings.
The imaging unit 12 images the inspection surface A of the electronic component W in a state where the oblique illumination 30 emits light and the oblique illumination 31 does not emit light (a state in which the light is not illuminated). The oblique light illumination 31 emits light, and the oblique light illumination 30 does not emit light, and the inspection surface B of the electronic component W is imaged. Thereby, the imaging unit 12 can image the inspection surface A of the electronic component W in a backlit state (that is, a state in which the electronic component W is not illuminated from the inspection surface B side), and the imaging unit 13 That is, the inspection surface B of the electronic component W can be imaged in a state where the electronic component W is not illuminated from the inspection surface A side.

The imaging of the inspection surface A of the electronic component W may be performed by irradiating the coaxial illumination 43 instead of the oblique light illumination 30. The imaging of the inspection surface B of the electronic component W may be performed by the oblique light illumination 31 Instead of the illumination, the coaxial illumination 44 may be illuminated. In that case, the imaging unit 12 emits light while the coaxial illumination 43 emits light, and the oblique illuminations 30, 31 and the coaxial illumination 44 do not emit light, and the imaging unit 13 emits light by the coaxial illumination 44. The oblique illuminations 30, 31 and the coaxial illumination 43 perform imaging in a non-illuminated state.

In the present embodiment, when the inspection surfaces A and B of the electronic component W are imaged, light traveling obliquely to the inspection surfaces A and B is irradiated, or light traveling vertically to the inspection surfaces A and B is irradiated. It is possible to select an image, and to clearly image the cracks and chips of the inspection surfaces A and B of the electronic component W. In this respect, the same applies to the imaging of the inspection surfaces C and D of the electronic component W, and it is possible to select whether to irradiate the inspection surface C of the electronic component W with light from the oblique light illumination 20 or with light from the coaxial illumination 28, It is possible to select whether to irradiate the light from the oblique light illumination 21 or the light from the coaxial illumination 29 to the inspection surface D of the part W.

The oblique illuminations 30, 31 are C-shaped, but this is not necessary. For example, as shown in FIG. 8, oblique illumination 52 in which notch 51 continuous with opening 50 is formed by removing a part of a square ring having a rectangular (including square) opening 50 formed at the center. , And may be employed in place of the oblique illuminations 30 and 31. When the oblique light illumination 52 is adopted, when the electronic component W is transported to the imaging position S, the support member 11 passes the notch 51 and the electronic component W passes through the inside of the opening 50.

The imaging means 12, 13, 18, 19 are single focus cameras, and the optical path from the imaging means 12 to the inspection surface A of the electronic component W and the optical path from the imaging means 13 to the inspection surface B of the electronic component W are Equally, the optical path from the imaging unit 18 to the inspection surface C of the electronic component W and the optical path from the imaging unit 19 to the inspection surface D of the electronic component W are equal. The imaging means 12 and 13 are fixed to a moving block (not shown), and the optical path length from the imaging means 12 to the inspection surface A by the movement of the rotating body 14 of the imaging means 12 and 13 substantially in the radial direction The optical path length from the imaging means 13 to the inspection surface B is adjusted, and the same applies to the imaging means 18 and 19 in this respect.

After the imaging of the inspection surfaces A and B of the electronic component W is completed, as shown in FIG. 5C, the support member 11 ascends with the electronic component W due to the elevation of the elevating piece 17 to image the electronic component W It is moved from the position S to the pass line (above the imaging position S), and is moved horizontally with the electronic component W by the rotation of the rotating body 14.
The mirror 37 is provided at a position lower than the electronic component W disposed in the pass line as shown in FIG. 7 (B), and the support member 11 is shown in FIGS. 5 (C) and 7 (B). As described above, the electronic component W is horizontally moved to sequentially pass through the inside of the opening 34 of the oblique light illumination 31 and above the mirror 37 and transport it to another position. When the electronic component W passes through the opening 34 of the oblique illumination 31, the support member 11 passes through the notch 35 of the oblique illumination 31.

The captured images of the inspection surfaces A, B, C and D of the potential component W can be configured by information processing means (for example, a CPU and a memory, not shown) from the imaging means 12, 13, 18 and 19 respectively. Is transferred to the information processing means, and it is determined whether or not there is an abnormality in appearance such as a crack or a chip on the inspection surfaces A, B, C, D of the potential component W.
Then, the electronic component W determined to have an appearance abnormality on any of the inspection surfaces A, B, C, and D is given to the sorter 46 shown in FIG. 1 and discharged, and there is no appearance abnormality. The determined electronic component W is enclosed in a tape by the taping unit 47 shown in FIG.

Next, an appearance inspection apparatus 60 according to a second embodiment of the present invention will be described with reference to FIGS. 9 to 13. In addition, about the structure similar to the external appearance inspection apparatus 10, the same code | symbol is attached | subjected and detailed description is abbreviate | omitted.
As shown in FIGS. 9 and 10, the appearance inspection apparatus 60 supports the electronic component W from above and transports the electronic component W to the imaging position V, and the electronic component W disposed at the imaging position V. Oblique light illumination for irradiating light to the inspection surfaces A and B of the electronic component W disposed at the imaging position V and the imaging devices 61 and 62 (third and fourth imaging devices) for imaging the inspection surfaces A and B, respectively 63, 64 (third and fourth oblique illuminations).

The image pickup means 61, 62 are arranged such that the optical axis is in the substantially radial direction of the rotary body 14, and the oblique light illuminations 63, 64 are arranged at the same height as the electronic component W arranged at the image pickup position V. .
As shown in FIG. 11A, the oblique light illumination 63 is U-shaped and provided with a notch 65 (notch T1), and is not shown in the state where the notch 65 is disposed at the upper center. It is fixed by a support. The oblique light illumination 63 applies light to the inspection surface A of the electronic component W disposed at the imaging position V, as shown in FIG. The light emitted from the oblique light illumination 63 advances obliquely to the inspection surface A of the electronic component W disposed at the imaging position V and strikes the inspection surface A.

As shown in FIG. 11B, the oblique light illumination 64 has the same shape as the oblique light illumination 63, is provided with the notch 66 (the notch T2), and the notch 66 is disposed at the upper center. It is fixed by a support (not shown). The oblique light illumination 64 illuminates the inspection surface B of the electronic component W disposed at the imaging position V, as shown in FIG. The light emitted from the oblique light illumination 64 advances obliquely to the inspection surface B of the electronic component W disposed at the imaging position V and strikes the inspection surface B.

The oblique light illuminations 63 and 64 are provided at a position lower than the pass line, as shown in FIGS. 11 (A), (B), 12 (A), (B) and 13 (A) to (C). The notches 65 and 66 are disposed at the same height as the electronic component W disposed at the imaging position V (at a position lower than the pass line).
11A is a view of the electronic component W and the oblique light illumination 63 disposed at the imaging position V from the oblique light illumination 64 side, and FIG. 11B is disposed at the imaging position V from the oblique light illumination 63 side. It is the figure which looked at the electronic component W and oblique light illumination 64 which were done. In FIGS. 12A and 12B, the electronic component W is disposed on the pass line.

At the same height as the electronic component W disposed at the imaging position V, the front surface of the inspection surface A of the electronic component W disposed at the imaging position V as shown in FIGS. A mirror 67 (third light reflecting portion) disposed on the side and a mirror 68 (fourth light reflecting portion) disposed on the front side of the inspection surface B of the electronic component W are provided. The mirrors 67 and 68, the notches 65 of the oblique illumination 63, and the notches 66 of the oblique illumination 64 are disposed at the same height.

The oblique light illumination 63 is disposed between the electronic component W disposed at the imaging position V and the mirror 67, and the oblique illumination 64 is disposed between the electronic component W disposed at the imaging position V and the mirror 68.
A mirror 69 is provided below the mirror 67 on the front side of the imaging means 61, and a mirror 70 is provided below the mirror 68 on the front side of the imaging means 62.

As shown in FIGS. 9 and 10, the optical axis of the imaging means 61 travels substantially inward (horizontally) in the radial direction of the rotary body 14, is reflected upward by the mirror 69, and is substantially tangential to the rotary body 14 by the mirror 67. The light is reflected (horizontally), passes through the notch 65 of the oblique light illumination 63, and travels toward the inspection surface A of the electronic component W disposed at the imaging position V.
In the present embodiment, the optical path adjusting means 71 (third optical path adjusting means) for changing the traveling direction of light to direct the optical axis of the imaging means 61 to the inspection surface A of the electronic component W disposed at the imaging position V Are configured to have mirrors 67 and 69.

The optical axis of the imaging means 62 travels inward (horizontally) in the substantially radial direction of the rotary body 14, is reflected upward by the mirror 70, is reflected in the substantially tangential direction (horizontal) of the rotary body 14 by the mirror 68, and oblique light illumination 64 Toward the inspection surface B of the electronic component W disposed at the imaging position V after passing through the notch 66.
In the present embodiment, the optical path adjusting means 72 (fourth optical path adjusting means) for changing the traveling direction of light and directing the optical axis of the imaging means 62 to the inspection surface B of the electronic component W disposed at the imaging position V Are configured to have mirrors 68 and 70.

Between the imaging means 61 and the mirror 69, coaxial illumination 73 which emits light in the same direction as the optical axis of the imaging means 61 is installed. The light emitted from the coaxial illumination 73 is sequentially reflected by the mirrors 69 and 67 and illuminates the inspection surface A of the electronic component W disposed at the imaging position V with light traveling perpendicularly to the inspection surface A. Between the imaging means 62 and the mirror 70, coaxial illumination 74 which emits light in the same direction as the optical axis of the imaging means 62 is installed. The light emitted from the coaxial illumination 74 is sequentially reflected by the mirrors 70 and 68 and illuminates the inspection surface B of the electronic component W disposed at the imaging position V with light traveling perpendicularly to the inspection surface B. The coaxial illuminations 73 and 74 have the same structure as the coaxial illuminations 28 and 29, and each include a light source unit and a half mirror.

As shown in FIG. 13A, the support member 11 moves horizontally to pass the upper part of the mirror 67 and the upper part of the oblique light illumination 63 in order to the electronic component W disposed in the pass line and the upper part of the imaging position V. The electronic component W is placed at the imaging position V as shown in FIG. 13 (B). The electronic component W disposed at the imaging position V is irradiated with light by the oblique light illumination 63, and after the inspection surface A is imaged by the imaging unit 61 in a state where the oblique light illumination 64 is not irradiated with light, the oblique light illumination 64 is The inspection surface B is imaged by the imaging means 62 in a state where the light is emitted and the oblique illumination 63 does not emit light. That is, the imaging means 61 and 62 respectively image the inspection surfaces A and B of the electronic component W at different timings.

After the inspection surfaces A and B of the electronic component W are imaged, the support means 11 ascends along with the elevation of the lifting and lowering piece 17, and the electronic component W is moved upward from the imaging position V as shown in FIG. Move to and place on the pass line. Then, the support member 11 moves horizontally to cause the electronic component W to pass above the oblique light illumination 64 and above the mirror 68 in order.

The imaging of the inspection surface A of the electronic component W may be performed by irradiating the coaxial illumination 73 instead of irradiating the oblique light illumination 63, and the imaging of the inspection surface B of the electronic component W may be performed by irradiating the oblique light illumination 64 Alternatively, coaxial illumination 74 may be used. In that case, the imaging means 61 performs imaging in a state in which the coaxial illumination 73 emits light, the oblique illuminations 63 and 64 and the coaxial illumination 74 do not emit light, and the imaging means 62 emits light in the coaxial illumination 74 The oblique illuminations 63 and 64 and the coaxial illumination 73 perform imaging in a non-illuminated state.

As mentioned above, although embodiment of this invention was described, this invention is not limited to the above-mentioned form, The change of the conditions which do not deviate from a summary, etc. are all the application scopes of this invention.
For example, coaxial illumination is not necessarily required, and the rotating body may not be discoid. The first light reflecting portion, the second light reflecting portion, the third light reflecting portion, and the fourth light reflecting portion may not be mirrors but may be prisms or beam splitters.

Further, in the appearance inspection apparatus 10 according to the first embodiment described above, there is no need to design each member so that the rotating body is arranged horizontally (the rotation axis is vertical) and the support member is moved up and down. The rotating body may be disposed vertically (the rotation axis is horizontal), and the support member may be reciprocated horizontally. When the rotating body is arranged vertically and the support member is designed to reciprocate horizontally, the oblique light illumination is arranged so that the notch is arranged on the rotating body side, and the rotation of the rotating body causes the support member to be notched. And the electronic component held by the support member may pass through the opening of the oblique illumination.
Then, in a state in which the first and second oblique illuminations are irradiating light or in a state in which the two coaxial illuminations are irradiating light, the first and second imaging means are the inspection surface A of the electronic component , And B may be imaged at the same timing. When the first and second imaging means perform imaging at the same timing, the imaging time of the electronic component can be shortened as compared to when the first and second imaging means perform imaging at different timings, and as a result, It is possible to make the appearance inspection more efficient. Furthermore, coaxial illumination is not necessary.

In the appearance inspection apparatus 60 according to the second embodiment, the third and fourth oblique illuminations are not limited to the U-shape, and may be, for example, a V-shape.
Then, in a state in which the third and fourth oblique illuminations are irradiating light, or in a state in which the two coaxial illuminations are irradiating light, the third and fourth imaging means are the inspection surface A of the electronic component. , And B may be imaged at the same timing. Furthermore, coaxial illumination is not necessary.

10: appearance inspection device, 11: support member, 12, 13: imaging means, 14: rotating body, 15: rotation axis, 16: pressing mechanism, 17: elevation piece, 18, 19: imaging means, 20, 21: oblique light Illumination, 22, 23, 24, 25: mirror, 26, 27: opening, 28: coaxial illumination, 28a: light source unit, 28b: half mirror, 29: coaxial illumination, 29a: light source unit, 29b: half mirror, 30 , 31: oblique illumination, 32: opening, 33: notch, 34: opening, 35: notch, 36, 37, 38, 39: mirror, 41, 42: optical path adjustment means, 43: coaxial illumination, 44 A: coaxial illumination 46: sorter 47: taping unit 50: opening 51: notch 52: oblique illumination 60: visual inspection device 61, 62: imaging means 63 64: oblique illumination 65 66: Notched part, 67, 6 , 69 and 70: mirror, 71, 72: optical path adjusting means, 73, 74: coaxial illumination, A, B, C, D: the inspection surface, R, S, V: imaging position, W: electronic components

Claims (7)

In an appearance inspection apparatus for performing an appearance inspection on an electronic component having inspection surfaces A and B arranged in parallel,
A support member for supporting the electronic component and transporting it to an imaging position in a state where the inspection surfaces A and B are respectively disposed on the upstream side and the downstream side in the transport direction;
First and second imaging means for respectively imaging the inspection surfaces A and B of the electronic component disposed at the imaging position;
It has a first light reflecting portion disposed on the front side of the inspection surface A of the electronic component disposed at the imaging position, changes the traveling direction of light, and sets the optical axis of the first imaging means to First light path adjusting means for moving to the inspection surface A;
The electronic component transported to the imaging position by the support member, and the optical axis of the first imaging means toward the inspection surface A of the electronic component disposed at the imaging position from the first light reflecting portion An opening P1 for passing the light, and the electronic light disposed between the electronic component disposed at the imaging position and the first light reflecting portion and disposed at the imaging position from the periphery of the opening P1 A first oblique illumination which emits light directed obliquely to the inspection surface A of the part;
It has a second light reflecting portion disposed on the front side of the inspection surface B of the electronic component disposed at the imaging position, changes the traveling direction of light, and sets the optical axis of the second imaging means to Second light path adjusting means for moving to the inspection surface B;
It is transported from the imaging position to another position by the optical axis of the second imaging means toward the inspection surface B of the electronic component disposed from the second light reflecting portion to the imaging position, and by the support member An opening P2 for passing the electronic component is formed, and the opening P2 is disposed between the electronic component disposed at the imaging position and the second light reflecting portion, and disposed at the imaging position from the periphery of the opening P2 A second oblique illumination for emitting light obliquely directed to the inspection surface B of the electronic component;
The first oblique illumination is formed with a notch Q1 which is continuous with the opening P1 and through which the support member which conveys the electronic component to the imaging position passes, and the second oblique illumination includes the notch Q1. A visual inspection apparatus characterized in that a notch Q2 is formed which is continuous with the opening P2 and through which the support member for conveying the electronic component passes from the imaging position to another position. The appearance inspection apparatus according to claim 1, wherein the first light reflecting portion and the second light reflecting portion have the same height as the electronic component disposed at the imaging position, and the notch Q1 and the notch Q2 Provided at lower positions respectively
The support member moves horizontally to cause the electronic component to sequentially pass over the first light reflecting portion and the inside of the opening P1, and descend to arrange the electronic component at the imaging position and ascend. The visual inspection apparatus characterized in that the electronic component is moved upward from the imaging position and is moved horizontally to cause the electronic component to pass through the inside of the opening P2 and above the second light reflecting portion in order. The appearance inspection apparatus according to claim 1 or 2, wherein the first and second imaging means pick up images at different timings.
The appearance inspection apparatus according to claim 1, wherein the first and second imaging units pick up an image at the same timing. In an appearance inspection apparatus for performing an appearance inspection on an electronic component having inspection surfaces A and B arranged in parallel,
A support member for supporting the electronic component from above and transporting it to an imaging position in a state where the inspection surfaces A and B are respectively disposed on the upstream side and downstream side in the transport direction;
Third and fourth imaging means for imaging the inspection surfaces A and B of the electronic component disposed at the imaging position, and
A third light reflecting portion disposed on the front side of the inspection surface A of the electronic component at the same height as the electronic component disposed at the imaging position, and changing the traveling direction of light; Third optical path adjusting means for directing the optical axis of the imaging means of No. 3 to the inspection surface A;
A notch T1 is formed which passes the optical axis of the third imaging means toward the inspection surface A of the electronic component disposed at the imaging position from the third light reflecting portion, and is disposed at the imaging position Between the electronic component and the third light reflecting portion, the notch T1 is disposed on the upper side, and is disposed obliquely with respect to the inspection surface A of the electronic component disposed at the imaging position. A third oblique illumination to illuminate the traveling light;
A fourth light reflecting portion disposed on the front side of the inspection surface B of the electronic component at the same height as the electronic component disposed at the imaging position, and changing the traveling direction of light; Fourth optical path adjusting means for causing the optical axis of the imaging means of No. 4 to the inspection surface B;
A notch T2 is formed which passes through the optical axis of the fourth imaging means toward the inspection surface B of the electronic component disposed from the fourth light reflecting portion to the imaging position, and is disposed at the imaging position Between the electronic component and the fourth light reflecting portion, the notch T2 is disposed on the upper side, and is disposed obliquely with respect to the inspection surface B of the electronic component disposed at the imaging position. A fourth oblique illumination to illuminate the
The supporting member moves horizontally to cause the electronic component to sequentially pass above the third light reflecting portion and above the third oblique light illumination and descend to place the electronic component at the imaging position and ascend. And moving the electronic component upward from the imaging position and moving it horizontally to cause the electronic component to sequentially pass above the fourth oblique illumination and above the fourth light reflecting portion. Inspection device. 6. The appearance inspection apparatus according to claim 5, wherein said third and fourth imaging means pick up images at different timings. 6. The appearance inspection apparatus according to claim 5, wherein said third and fourth imaging means pick up images at the same timing.

Images