WO2016080061A1 - Appearance inspection device - Google Patents

Appearance inspection device Download PDF

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Publication number
WO2016080061A1
WO2016080061A1 PCT/JP2015/076156 JP2015076156W WO2016080061A1 WO 2016080061 A1 WO2016080061 A1 WO 2016080061A1 JP 2015076156 W JP2015076156 W JP 2015076156W WO 2016080061 A1 WO2016080061 A1 WO 2016080061A1
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WO
WIPO (PCT)
Prior art keywords
imaging
electronic component
angular position
position adjusting
adjusting means
Prior art date
Application number
PCT/JP2015/076156
Other languages
French (fr)
Japanese (ja)
Inventor
木村　浩之
Original Assignee
上野精機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 上野精機株式会社 filed Critical 上野精機株式会社
Publication of WO2016080061A1 publication Critical patent/WO2016080061A1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements

Definitions

  • the present invention relates to an appearance inspection apparatus that performs an appearance inspection of an electronic component.
  • Patent Documents 1 and 2 disclose an invention for inspecting the appearance of a side portion of an electronic component based on an image containing a plurality of side portions of the electronic component.
  • the electronic component when the electronic component is large (for example, the length of the side portion is 10 mm or more), if an attempt is made to fit a plurality of side portions of the electronic component into one image, the imaging range per pixel increases, and detection accuracy is increased. There has been a problem of lowering.
  • the plurality of support portions that hold the electronic components have a rotating body that is mounted in a circular shape at a predetermined pitch in plan view, and in an apparatus that sequentially inspects the appearance of the plurality of electronic components, Due to the presence of a motor or the like that rotates the body, it is difficult to provide a plurality of imaging means at positions where a plurality of sides of the electronic component can be simultaneously imaged.
  • This invention is made
  • the visual inspection apparatus is the visual inspection apparatus that visually inspects the side portions A, B, C, and D of a plurality of electronic components, and a plurality of supports that respectively hold the plurality of electronic components.
  • the unit is mounted in a circular shape at intervals in a plan view, and intermittently rotates around a vertical rotation axis, and the plurality of electronic components together with the plurality of support units are captured at imaging positions P and Q.
  • R, S sequentially, a rotating body, imaging means ⁇ for imaging the side A of the electronic component arranged at the imaging position P, and the electronic component arranged at the imaging position Q, An angular position adjusting unit q that rotates by a predetermined angle with respect to a vertical rotation axis, and an imaging unit ⁇ that images the side B of the electronic component rotated by the angular position adjusting unit q at the imaging position Q.
  • the electronic component arranged at the imaging position R An angular position adjusting unit r that rotates by a predetermined angle with respect to a vertical rotation axis, and an imaging unit ⁇ that images the side portion C of the electronic component rotated by the angular position adjusting unit r at the imaging position R.
  • an angular position adjusting means s for rotating the electronic component arranged at the imaging position S by a predetermined angle with respect to a vertical rotation axis, and an electronic component rotated by the angular position adjusting means s.
  • the side part D is provided with an imaging means ⁇ that images at the imaging position S.
  • the visual inspection apparatus that meets the above-mentioned object is a visual inspection apparatus that visually inspects the side portions A, B, C, and D of a plurality of electronic components, and a plurality of supports that respectively hold the plurality of electronic components.
  • the unit is mounted in a circular shape at intervals in a plan view, and intermittently rotates around a vertical rotation axis, and the plurality of electronic components together with the plurality of support units are captured at imaging positions P and Q.
  • R, and S a rotating body that is sequentially arranged, an imaging means ⁇ that images the side portion A of the electronic component that is disposed at the imaging position P, and the electronic component on which the side portion A is imaged.
  • the image position P is adjusted by a predetermined angle with respect to the vertical rotation axis at the image pickup position P, and the side B of the electronic component arranged at the image pickup position Q is picked up.
  • Means ⁇ and the electronic component on which the side portion B is imaged An angle position adjusting means q '' for rotating the position Q by a predetermined angle with respect to a vertical rotation axis, and an imaging means ⁇ for imaging the side portion C of the electronic component arranged at the imaging position R.
  • An angle position adjusting unit r ′′ for rotating the electronic component on which the side portion C has been imaged at the image pickup position R by a predetermined angle with respect to a vertical rotation axis, and the image pickup position S.
  • Imaging means ⁇ for imaging the side portion D of the electronic component.
  • the appearance inspection apparatus since the plurality of side portions of the electronic component are imaged by separate imaging means, the appearance of the plurality of side portions of the electronic component is suppressed from lowering the detection accuracy. Can be inspected.
  • the appearance inspection apparatus 10 includes a plurality of support portions 16 that respectively hold a plurality of electronic components 11 in a circular shape with a space in plan view.
  • Imaging means 18, 19, 20, 21 (images respectively) for imaging the rotating body 17 attached to the side parts 12, 13, 14, 15 (side parts A, B, C, D, respectively) of the electronic component 11.
  • an electronic component 11 that is an object of appearance inspection is provided on a plate-like main body portion 22 and a side portion 15 of the electronic component 11, and a plurality of lead wires protruding from one side of the main body portion 22. 23.
  • the side parts 12, 13, 14, and 15 are sequentially arranged counterclockwise in a plan view.
  • the plurality of electronic components 11 are arranged at predetermined positions while being stored in a tube, taken out from the tube, and sequentially supplied to the appearance inspection apparatus 10.
  • the appearance inspection apparatus 10 includes a motor 25 in which an output shaft 24 (an example of a vertical rotation shaft) arranged vertically protrudes upward, and a disk-shaped rotating body 17 to which the output shaft 24 is connected at the center. ing.
  • the motor 25 rotates the rotating body 17 clockwise by a predetermined angle by one operation. Therefore, the rotating body 17 rotates intermittently around the output shaft 24 by the intermittent operation of the motor 25.
  • each support portion 16 is arranged at a predetermined pitch in the circumferential direction of the rotating body 17, and an upward force is applied by an elastic body (not shown).
  • each support portion 16 adsorbs and holds the upper surface 27 of the electronic component 11 by vacuum pressure.
  • a plurality of lifting means 28 are fixed above the outer peripheral portion of the rotating body 17 by a support member (not shown) at a predetermined interval. Since each elevating means 28 is fixed, it does not move with the rotation of the rotating body 17.
  • the plurality of support portions 16 are respectively positioned directly below the plurality of lifting and lowering means 28 in a state where the rotary body 17 is temporarily stopped. Each support portion 16 rotates the rotary body 17 by the motor 25 operating once. Directly below the lifting / lowering means 28 on the downstream side in the direction.
  • Each lifting / lowering means 28 can push down the support part 16 disposed immediately below to lower the support part 16, and the height position of the support part 16 can be adjusted.
  • Each support portion 16 is disposed at the upper limit position by an upward force applied from the elastic body in a state where no downward force is applied from the elevating means 28.
  • the elevating means 28 has a servo motor.
  • a single support portion 16 is disposed in a state where the rotating body 17 is temporarily stopped.
  • the electronic component 11 is sucked and held by a vacuum pressure.
  • the support portion 16 holding the electronic component 11 is raised to the upper limit position when the lifting / lowering means 28 is actuated again. ,Moving.
  • acquisition position the position where the support unit 16 acquires the electronic component 11 is also referred to as “acquisition position”.
  • imaging positions P, Q, R, and S where the side parts 12, 13, 14, and 15 of the electronic component 11 are imaged are provided on the downstream side in the rotation direction of the rotator 17 at the acquisition position. ing.
  • the imaging positions P, Q, R, and S are indicated as P, Q, R, and S, respectively.
  • the imaging positions P, Q, R, and S are provided in order toward the downstream side in the rotation direction of the rotating body 17.
  • the rotator 17 rotates intermittently around the output shaft 24, and together with the plurality of support portions 16, the electronic components 11 held by the support portions 16 are sequentially moved to the imaging positions P, Q, R, and S. ,Deploy.
  • angular position adjusting means 30, 31, and 32 for rotating the electronic component 11 by a predetermined angle (90 degrees in the present embodiment) immediately below the support portion 16 that is temporarily stopped. , 33 are arranged.
  • the angular position adjusting means 31, 32, and 33 correspond to the angular position adjusting means q, r, and s, respectively.
  • the angular position adjusting means 32 (the same applies to the angular position adjusting means 30, 31, 33) is attached to the base table 34 via a slide mechanism 35, as shown in FIGS.
  • the angular position adjusting means 32 includes a holding unit 36 to which the electronic component 11 is fixed, and a motor 38 that rotates the holding unit 36 clockwise with a vertical rotation shaft 37 as a reference.
  • the slide mechanism 35 has a known structure having a drive source, a ball screw, and a guide, and advances and retracts the angular position adjusting means 32 in the horizontal direction.
  • the slide mechanisms 35 attached to the angular position adjusting means 31, 32, and 33 correspond to the slide mechanisms F, G, and H, respectively.
  • a groove 39 for accommodating the electronic component 11 is formed on the upper side of the circular holding portion 36 in plan view.
  • the groove 39 is provided from the center of the holding portion 36 toward one side in a plan view, and the upper half is opened by the groove 39 on one side of the holding portion 36 in a plan view.
  • the electronic component 11 is inserted into the groove 39 in a state where a plurality of lead wires 23 are arranged on the opened side of the holding portion 36.
  • the rotation shaft 37 is connected to the lower center of the holding portion 36, and the holding portion 36 rotates with respect to the center of the holding portion 36.
  • the imaging means 20 is fixed to the base 34 to which the angular position adjusting means 32 is attached.
  • the imaging center of the imaging means 20 is the center of the holding portion 36 of the angular position adjusting means 32 and the side surface in plan view. Viewed, it is directed above the holding portion 36 of the angular position adjusting means 32.
  • the imaging means 20, the electronic component 11 disposed at the imaging position R, and the rotation center of the rotating body 17 are arranged on a straight line in plan view in order, as shown in FIG. .
  • the slide mechanism 35 attached to the angular position adjusting unit 32 moves the angular position adjusting unit 32 (the holding unit 36 of the angular position adjusting unit 32) forward and backward along the imaging path of the imaging unit 20.
  • the imaging means may be disposed between the electronic component disposed at the imaging position R and the rotation center of the rotating body, and the diameter of the rotating body may be increased so that the side surface of the electronic component can be imaged.
  • the number of electronic components that can be inspected per unit time is reduced. This is because when the diameter of the rotating body is increased, the rotational moment increases, and it becomes necessary to slow down the operation when the rotating body starts rotating or when the rotating body is temporarily stopped.
  • the positional relationship (third positional relationship) among the adjusting unit 33, the imaging unit 21, the electronic component 11 disposed at the imaging position S, the slide mechanism 35 attached to the angular position adjusting unit 33, and the rotating body 17 is an angle.
  • the electronic component 11 held by the support unit 16 and transported to the imaging position P is disposed so that the side portion 15 faces the imaging unit 18 in a plan view.
  • the support portion 16 is disposed at the upper limit position as shown in FIG. 4A, 4 ⁇ / b> B, 4 ⁇ / b> C, and 4 ⁇ / b> D illustrate the state of the electronic component 11 and the holding unit 36 as viewed from the imaging unit 18.
  • the electronic component 11 is lowered together with the support unit 16 by the operation of the lifting and lowering unit 28 provided above the support unit 16, and as shown in FIG. It is inserted into the groove 39 and is fixed to the holding portion 36 of the angular position adjusting means 30.
  • the support unit 16 releases the holding state of the electronic component 11 by the support unit 16 by vacuum breakage or release to the atmosphere, passes the electronic component 11 to the holding unit 36, and operates the lifting means 28.
  • the support part 16 rises above the electronic component 11.
  • the electronic component 11 rotates 90 degrees clockwise together with the holding portion 36 of the angular position adjusting means 30 by driving the motor 38 of the angular position adjusting means 30 as shown in FIG. That is, the electronic component 11 disposed at the imaging position P is released from the support unit 16 and rotates in a state of being separated from the support unit 16. Thereby, in the imaging position P, as shown in FIG. 1, the electronic component 11 has the side portion 12 disposed opposite to the imaging means 18.
  • the lifting / lowering means 28 is operated, and the electronic component 11 is lifted upward from the holding portion 36 of the angular position adjusting means 30 by the support portion 16 as shown in FIG.
  • the imaging unit 18 can capture an image, and the entire side portion 12 is imaged by the imaging unit 18. That is, the imaging unit 18 images the side part 12 of the electronic component 11 arranged at the imaging position P.
  • the coaxial illumination 40 and the box illumination 41 are fixed to the base table 34 to which the angular position adjusting means 32 is attached.
  • the coaxial illumination 40 and the box illumination 41 illuminate the electronic component 11 disposed above the holding portion 36 of the angular position adjusting means 32.
  • the coaxial illumination 40 and the box illumination 41 are also respectively applied to the base table 34 to which the angular position adjusting means 30 is attached, the base table 34 to which the angular position adjusting means 31 is attached, and the base table 34 to which the angular position adjusting means 33 is attached. It is attached.
  • the electronic component 11 on which the side portion 12 has been imaged is conveyed from the imaging position P to the imaging position Q by the rotation of the rotating body 17 by a predetermined angle, and the side portion 13 is imaged by the imaging means 19 at the imaging position Q. Thereafter, the electronic component 11 is conveyed to the imaging position R and the side portion 14 is imaged by the imaging means 20, and then is conveyed to the imaging position S and the side portion 15 is imaged by the imaging means 21.
  • the imaging of the side part 13 of the electronic component 11 at the imaging position Q, the imaging of the side part 14 of the electronic component 11 at the imaging position R, and the imaging of the side part 15 of the electronic component 11 at the imaging position S are performed electronically at the imaging position P. Each is performed in the same procedure as when the side portion 12 of the component 11 is imaged.
  • elevating unit 28 for elevating and lowering the support unit 16 disposed at the imaging position Q, and the support unit disposed at the imaging position R.
  • elevating means 28 for elevating and lowering the support unit 16 disposed at the imaging position R, and above the support unit 16 disposed at the imaging position S, the imaging position S.
  • elevating means 28 for elevating and lowering the support portion 16 arranged in the area.
  • the electronic component 11 arranged at the imaging position Q descends together with the support 16 at the imaging position Q along with the operation of the elevating means 28 (elevating means q ′), and the holding portion 36 of the angular position adjusting means 31. It will be in the state fixed to.
  • the electronic component 11 fixed to the holding unit 36 of the angular position adjusting unit 31 rotates 90 degrees clockwise together with the holding unit 36 of the angular position adjusting unit 31, and then the angular position adjusting unit 31 is supported by the support unit 16.
  • the entire side portion 13 is picked up by the image pickup means 19.
  • the electronic component 11 arranged at the imaging position R descends together with the support unit 16 and is fixed to the holding unit 36 of the angular position adjustment unit 32 in accordance with the operation of the elevating unit 28 (elevating unit r ′) at the imaging position R. In this state, it rotates 90 degrees clockwise together with the holding part 36 of the angular position adjusting means 32. Thereafter, the electronic component 11 is lifted upward from the holding portion 36 of the angular position adjusting means 32 by the support portion 16, and the entire side portion 14 is imaged by the imaging means 20.
  • the electronic component 11 arranged at the imaging position S descends together with the support portion 16 in accordance with the operation of the elevating means 28 (elevating means s ′) at the imaging position S, and the holding portion 36 of the angular position adjusting means 33. And is rotated 90 degrees clockwise together with the holding portion 36 of the angular position adjusting means 33. Thereafter, the electronic component 11 is lifted upward from the holding portion 36 of the angular position adjusting means 33 by the support portion 16, and the entire side portion 15 is imaged by the imaging means 21.
  • the electronic parts 11 that have been imaged on the side portions 12, 13, 14, and 15 are inspected for the presence or absence of defects or wrinkles using the images obtained by imaging the side portions 12, 13, 14, and 15, and the inspection results are displayed. Based on this, the product level is determined.
  • the electronic component 11 determined to be non-defective is separated from the electronic component 11 not determined to be non-defective, released from the support unit 16 on the downstream side of the imaging position S, and stored in a tube or tape. Note that the electronic component 11 can be attached to a wafer instead of being stored in a tube or a tape.
  • the side parts 12, 13, 14, and 15 of the electronic component 11 are imaged by the imaging means 18, 19, 20, and 21, respectively, the side parts 12, 13, 14, and 15 of the electronic component 11 are captured. Appearance inspection can be performed with high accuracy. Further, by using an imaging unit having a larger number of pixels than the imaging units 18, 19, 20, and 21, a plurality of the side parts 12, 13, 14, and 15 of the electronic component 11 are accommodated in one image and an appearance inspection is performed. Compared to the case, the manufacturing cost of the appearance inspection apparatus can be suppressed.
  • the support portion 16 is designed to be rotatable and the electronic component 11 is rotated by the rotation operation of the support portion.
  • the electronic component 11 can be stably rotated as compared with the case where the electronic component 11 is rotated at each imaging position.
  • the support portion 16 holds the upper surface 27 of the electronic component 11 by suction, and a groove 39 into which the electronic component 11 is fitted is provided in each of the holding portions 36 of the angular position adjusting means 30, 31, 32, 33. Since it is formed, it is possible to smoothly transfer the electronic component 11 between the support portion 16 and each of the angular position adjusting means 30, 31, 32, and 33.
  • the support part 16 can be raised / lowered, compared with designing the holding
  • the slide mechanism 35 for advancing and retracting the angular position adjusting means 30 moves the angular position adjusting means 30 along with the electronic component 11 fixed to the holding portion 36 of the angular position adjusting means 30 along the imaging direction of the imaging means 18.
  • the angular position adjusting means 30 advances and retreats within a range in which the electronic component 11 that has advanced and retracted together with the angular position adjusting means 30 is again sucked and held by the support portion 16.
  • the imaging unit 18 is a single-focus camera, but the distance between the imaging unit 18 and the electronic component 11 is adjusted, and the side portion 12 imaged by the imaging unit 18 of the electronic component 11 is adjusted to the focus of the imaging unit 18.
  • the angular position adjusting means 30 is not necessarily provided at the imaging position P. Further, it may be designed such that only the holding portion of the angular position adjusting means advances and retracts instead of the entire angular position adjusting means moving forward and backward.
  • the imaging unit 18 can image the side part 12 of the electronic component 11 arranged at the imaging position P.
  • the appearance inspection apparatus 10 that images the side parts 12, 13, 14, and 15 of the electronic component 11 after rotating the electronic component 11 at the imaging positions P, Q, R, and S has been described.
  • the electronic component 11 may be rotated after imaging the side portions 12, 13, and 14 of the electronic component 11 at the imaging positions P, Q, and R, respectively.
  • the following is a modified example of the appearance inspection apparatus 10, and the appearance shown in FIG. 6 is obtained by rotating the electronic component 11 after imaging the side portions 12, 13, and 14 of the electronic component 11 at the imaging positions P, Q, and R, respectively.
  • the inspection device 50 will be described.
  • symbol as the external appearance inspection apparatus 10 is attached
  • the appearance inspection apparatus 50 is configured to rotate the electronic component 11 by a predetermined angle (90 degrees in this embodiment), angular position adjusting means 51, 52, 53, 54 (angular position adjusting means). 51, 52 and 53 respectively correspond to the angular position adjusting means p ′′, q ′′ and r ′′) at the imaging positions P, Q, R and S, respectively. Furthermore, it includes elevating means 28 (elevating means p ′, q ′, r ′) for elevating and lowering the support portions 16 arranged at the imaging positions P, Q, R. As shown in FIG. 7, the angular position adjusting means 51 is attached to the base table 34 via a slide mechanism 55 (sliding mechanism E ′) that moves the angular position adjusting means 51 in the horizontal direction.
  • a slide mechanism 55 sliding mechanism E ′
  • the angular position adjusting means 52, 53, and 54 are also fixed to the base table 34 via slide mechanisms 55 that move the angular position adjusting means 52, 53, and 54 in the horizontal direction.
  • the slide mechanism 55 that advances and retracts the angular position adjusting means 52 and the slide mechanism 55 that advances and retracts the angular position adjusting means 53 correspond to the slide mechanisms F ′ and G ′, respectively.
  • the arrangement and configuration of each of the angular position adjusting means 51, 52, 53, and 54 are the same as those of the angular position adjusting means 30, 31, 32, and 33 of the appearance inspection apparatus 10, and thus detailed description thereof is omitted.
  • the electronic component 11 acquired from the outside by the support unit 16 is held by the support unit 16 in a state where the side portion 12 is arranged on the outer side in the radial direction of the rotating body 17. Then, the electronic component 11 is sent to the imaging position P by the rotation of the rotating body 17 by a predetermined angle in the clockwise direction, and the side portion 12 is imaged by the imaging means 18. Thereafter, the electronic component 11 is lowered together with the support portion 16, transferred from the support portion 16 to the holding portion 36 of the angular position adjusting means 51, and fixed to the holding portion 36 of the angular position adjusting means 51. The support part 16 transfers the electronic component 11 to the holding part 36 of the angular position adjusting means 51 and moves up.
  • the electronic component 11 rotates together with the holding portion 36 of the angular position adjusting means 51 clockwise by 90 degrees with respect to the rotation shaft 37 (centering on the rotation shaft 37), and is supported by the lowered support portion 16. Adsorbed and held.
  • the electronic component 11 is lifted above the holding portion 36 of the angular position adjusting means 51 by the support portion 16. Accordingly, the angular position adjusting means 51 rotates the electronic component 11 on which the side portion 12 is imaged at the imaging position P by a predetermined angle.
  • the rotating body 17 rotates clockwise by a predetermined angle, whereby the electronic component 11 is conveyed to the imaging position Q, the side portion 13 is imaged by the imaging means 19, and then the angular position adjusting means at the imaging position Q. 52 rotates the electronic component 11 by 90 degrees clockwise.
  • the rotating body 17 rotates again by a predetermined angle in the counterclockwise direction, whereby the electronic component 11 is conveyed to the imaging position R and the side portion 14 is imaged by the imaging means 20.
  • the angular position adjusting means 53 rotates the electronic component 11 by 90 degrees clockwise.
  • the rotating body 17 rotates again by a predetermined angle in the clockwise direction, whereby the electronic component 11 is conveyed to the imaging position S, and the side portion 15 is imaged by the imaging means 21.
  • the electronic component 11 is sent to the downstream side in the rotation direction of the rotating body 17 by the rotation of the rotating body 17 without being rotated at the imaging position S.
  • An appearance inspection of the electronic component 11 is performed using each image obtained by imaging the side portions 12, 13, 14, and 15 of the electronic component 11.
  • the relationship between the operations of the support unit 16, the imaging unit 19 and the angular position adjustment unit 52 at the imaging position Q and the relationship between the operations of the support unit 16, the imaging unit 20 and the angular position adjustment unit 53 at the imaging position R are as follows.
  • the relationship between the operations of the support unit 16, the imaging unit 18, and the angular position adjustment unit 51 in P is the same.
  • the relationship among the operations of the support unit 16, the imaging unit 21, and the angular position adjustment unit 54 at the imaging position S is that the electronic part 11 is not rotated at the imaging position S except for the support unit 16, the imaging unit 18, and the imaging position P.
  • the relationship between the operations of the angular position adjusting means 51 is basically the same.
  • the slide mechanism 55 attached to the angular position adjusting unit 51 moves the angular position adjusting unit 51 (that is, the holding unit 36 of the angular position adjusting unit 51) in the imaging direction of the imaging unit 18 (along the imaging path).
  • the side part 12 of the electronic component 11 can be arranged at the focal point of the imaging means 18 by being advanced and retracted.
  • the slide mechanism 55 attached to each of the angular position adjusting means 52, 53, and 54 is connected to the angular position adjusting means 52 (that is, the angular position adjusting means).
  • the side part 13 of the electronic component 11 can be arranged at the focal point of the imaging unit 19 by moving the holding unit 36 of the adjusting unit 52 back and forth in the imaging direction of the imaging unit 19 (along the imaging path).
  • the slide mechanism 55 attached to the angular position adjusting unit 53 advances and retracts the angular position adjusting unit 53 (that is, the holding unit 36 of the angular position adjusting unit 53) in the imaging direction of the imaging unit 20 (along the imaging path).
  • the side portion 14 of the electronic component 11 can be arranged at the focal point of the imaging means 20.
  • the slide mechanism 55 attached to the angular position adjusting unit 54 advances and retracts the angular position adjusting unit 54 (that is, the holding unit 36 of the angular position adjusting unit 54) in the imaging direction of the imaging unit 21 (along the imaging path).
  • the side portion 15 of the electronic component 11 can be disposed at the focal point of the imaging means 21.
  • the shape of the electronic component is not particularly limited and may not be provided with a lead wire, and the groove of the holding portion is formed in a shape corresponding to the shape of the electronic component.
  • the electronic component does not need to be taken out from the tube and supplied to the appearance inspection apparatus, and may be taken out from the tape or supplied from the tray.
  • the electronic component can be supplied to the appearance inspection apparatus by a ball feeder, or the electronic component can be removed from the wafer and directly supplied to the appearance inspection apparatus.
  • a support part is not limited to what adsorb
  • the direction of travel of the light reflected by the side part of the electronic component may be bent using a prism or a mirror so that the imaging unit can image the side part of the electronic component.
  • the rotating body is not limited to a disk shape, and the rotating direction of the rotating body and the rotating direction of the electronic components at the imaging positions P, Q, R, and S may be counterclockwise.
  • the appearance inspection apparatus since the plurality of side portions of the electronic component are imaged by separate imaging means, respectively, the appearance of the plurality of side portions of the electronic component is inspected while suppressing a decrease in detection accuracy. Is possible. Therefore, utilization in the industry which manufactures an electronic component can be expected.

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
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  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

An appearance inspection device 10 inspects appearance of side surfaces 12, 13, 14 and 15 of a plurality of electronic components 11 by: sequentially disposing the electronic components 11 at image pickup positions P, Q, R and S by intermittently rotating a rotating body 17 having a plurality of supporting sections 16 attached thereto, said supporting sections holding the electronic components 11, respectively; picking up, by means of an image pickup means 18, an image of the side portion 12 of the electronic component 11 disposed at the image pickup position P; picking up an image of the side portion 13 of the electronic component 11 by means of an image pickup means 19 by rotating the electronic component 11 by a predetermined angle by means of an angular position adjusting means 31, said electronic component being disposed at the image pickup position Q; picking up an image of a side portion 14 of the electronic component 11 by means of an image pickup means 20 by rotating the electronic component 11 by a predetermined angle by means of an angular position adjusting means 32, said electronic component being disposed at an image pickup position R; and picking up an image of a side portion 15 of the electronic component 11 by means of an image pickup means 21 by rotating the electronic component 11 by a predetermined angle by means of an angular position adjusting means 33, said electronic component being disposed at an image pickup position S.

Description

外観検査装置Appearance inspection device
本発明は、電子部品の外観検査を行う外観検査装置に関する。 The present invention relates to an appearance inspection apparatus that performs an appearance inspection of an electronic component.
ベアチップやＣＳＰ（Ｃｈｉｐ　Ｓｉｚｅ　Ｐａｃｋａｇｅ）を含む各種電子部品は、出荷前に、欠けや疵の有無等が検査される。この検査は、電子部品の外観を撮像した画像を基に行われ、その具体例が、特許文献１、２に記載されている。特許文献１、２には、電子部品の複数の側部を収めた画像を基に、電子部品の側部の外観を検査する発明が開示されている。 Various electronic parts including bare chips and CSP (Chip Size Package) are inspected for chipping or wrinkles before shipping. This inspection is performed based on an image obtained by imaging the appearance of an electronic component, and specific examples thereof are described in Patent Documents 1 and 2. Patent Documents 1 and 2 disclose an invention for inspecting the appearance of a side portion of an electronic component based on an image containing a plurality of side portions of the electronic component.
特開２０００－２８３７３２号公報JP 2000-283732 A 特開２００３－２５４７２６号公報JP 2003-254726 A
しかしながら、電子部品が大きい（例えば、側部の長さが１０ｍｍ以上）場合、電子部品の複数の側部を一つの画像に収めようとすると、１画素あたりの撮像範囲が大きくなって、検出精度が低下するという課題があった。
また、電子部品を保持する複数の支持部が、平面視して、所定ピッチで円状に取り付けられた回転体を有し、複数の電子部品の外観を、順次、検査する装置においては、回転体を回転させるモータ等の存在により、電子部品の複数の側部をそれぞれ同時に撮像可能な位置に、複数の撮像手段を設けるのは困難であった。
本発明は、かかる事情に鑑みてなされるもので、電子部品の複数の側部の外観を、検出精度の低下を抑制して、検査する外観検査装置を提供することを目的とする。 However, when the electronic component is large (for example, the length of the side portion is 10 mm or more), if an attempt is made to fit a plurality of side portions of the electronic component into one image, the imaging range per pixel increases, and detection accuracy is increased. There has been a problem of lowering.
In addition, the plurality of support portions that hold the electronic components have a rotating body that is mounted in a circular shape at a predetermined pitch in plan view, and in an apparatus that sequentially inspects the appearance of the plurality of electronic components, Due to the presence of a motor or the like that rotates the body, it is difficult to provide a plurality of imaging means at positions where a plurality of sides of the electronic component can be simultaneously imaged.
This invention is made | formed in view of this situation, and it aims at providing the external appearance inspection apparatus which suppresses the fall of a detection accuracy and suppresses the external appearance of the some side part of an electronic component.
前記目的に沿う第１の発明に係る外観検査装置は、複数の電子部品の側部Ａ、Ｂ、Ｃ、Ｄを外観検査する外観検査装置において、前記複数の電子部品をそれぞれ保持する複数の支持部が、平面視して、間隔を空け円状に取り付けられ、鉛直の回転軸を中心に間欠的に回転して、前記複数の支持部と共に、前記複数の電子部品を、撮像位置Ｐ、Ｑ、Ｒ、Ｓに、順次、配置する回転体と、前記撮像位置Ｐに配置された前記電子部品の側部Ａを撮像する撮像手段αと、前記撮像位置Ｑに配置された前記電子部品を、鉛直の回転軸を基準にして、所定角度、回転させる角度位置調整手段ｑと、前記角度位置調整手段ｑによって回転された前記電子部品の側部Ｂを、前記撮像位置Ｑで撮像する撮像手段βと、前記撮像位置Ｒに配置された前記電子部品を、鉛直の回転軸を基準にして、所定角度、回転させる角度位置調整手段ｒと、前記角度位置調整手段ｒによって回転された前記電子部品の側部Ｃを、前記撮像位置Ｒで撮像する撮像手段γと、前記撮像位置Ｓに配置された前記電子部品を、鉛直の回転軸を基準にして、所定角度、回転させる角度位置調整手段ｓと、前記角度位置調整手段ｓによって回転された前記電子部品の側部Ｄを、前記撮像位置Ｓで撮像する撮像手段δとを備える。 The visual inspection apparatus according to the first aspect of the present invention is the visual inspection apparatus that visually inspects the side portions A, B, C, and D of a plurality of electronic components, and a plurality of supports that respectively hold the plurality of electronic components. The unit is mounted in a circular shape at intervals in a plan view, and intermittently rotates around a vertical rotation axis, and the plurality of electronic components together with the plurality of support units are captured at imaging positions P and Q. , R, S sequentially, a rotating body, imaging means α for imaging the side A of the electronic component arranged at the imaging position P, and the electronic component arranged at the imaging position Q, An angular position adjusting unit q that rotates by a predetermined angle with respect to a vertical rotation axis, and an imaging unit β that images the side B of the electronic component rotated by the angular position adjusting unit q at the imaging position Q. And the electronic component arranged at the imaging position R, An angular position adjusting unit r that rotates by a predetermined angle with respect to a vertical rotation axis, and an imaging unit γ that images the side portion C of the electronic component rotated by the angular position adjusting unit r at the imaging position R. And an angular position adjusting means s for rotating the electronic component arranged at the imaging position S by a predetermined angle with respect to a vertical rotation axis, and an electronic component rotated by the angular position adjusting means s. The side part D is provided with an imaging means δ that images at the imaging position S.
前記目的に沿う第２の発明に係る外観検査装置は、複数の電子部品の側部Ａ、Ｂ、Ｃ、Ｄを外観検査する外観検査装置において、前記複数の電子部品をそれぞれ保持する複数の支持部が、平面視して、間隔を空け円状に取り付けられ、鉛直の回転軸を中心に間欠的に回転して、前記複数の支持部と共に、前記複数の電子部品を、撮像位置Ｐ、Ｑ、Ｒ、Ｓに、順次、配置する回転体と、前記撮像位置Ｐに配置された前記電子部品の前記側部Ａを撮像する撮像手段αと、前記側部Ａが撮像された前記電子部品を、前記撮像位置Ｐで、鉛直の回転軸を基準にして、所定角度、回転させる角度位置調整手段ｐ’’と、前記撮像位置Ｑに配置された前記電子部品の前記側部Ｂを撮像する撮像手段βと、前記側部Ｂが撮像された前記電子部品を、前記撮像位置Ｑで、鉛直の回転軸を基準にして、所定角度、回転させる角度位置調整手段ｑ’’と、前記撮像位置Ｒに配置された前記電子部品の前記側部Ｃを撮像する撮像手段γと、前記側部Ｃが撮像された前記電子部品を、前記撮像位置Ｒで、鉛直の回転軸を基準にして、所定角度、回転させる角度位置調整手段ｒ’’と、前記撮像位置Ｓに配置された前記電子部品の前記側部Ｄを撮像する撮像手段δとを備える。 The visual inspection apparatus according to the second invention that meets the above-mentioned object is a visual inspection apparatus that visually inspects the side portions A, B, C, and D of a plurality of electronic components, and a plurality of supports that respectively hold the plurality of electronic components. The unit is mounted in a circular shape at intervals in a plan view, and intermittently rotates around a vertical rotation axis, and the plurality of electronic components together with the plurality of support units are captured at imaging positions P and Q. , R, and S, a rotating body that is sequentially arranged, an imaging means α that images the side portion A of the electronic component that is disposed at the imaging position P, and the electronic component on which the side portion A is imaged. The image position P is adjusted by a predetermined angle with respect to the vertical rotation axis at the image pickup position P, and the side B of the electronic component arranged at the image pickup position Q is picked up. Means β and the electronic component on which the side portion B is imaged An angle position adjusting means q '' for rotating the position Q by a predetermined angle with respect to a vertical rotation axis, and an imaging means γ for imaging the side portion C of the electronic component arranged at the imaging position R. An angle position adjusting unit r ″ for rotating the electronic component on which the side portion C has been imaged at the image pickup position R by a predetermined angle with respect to a vertical rotation axis, and the image pickup position S. Imaging means δ for imaging the side portion D of the electronic component.
第１、第２の発明に係る外観検査装置は、電子部品の複数の側部をそれぞれ別個の撮像手段で撮像するので、電子部品の複数の側部の外観を、検出精度の低下を抑制して、検査可能である。 In the appearance inspection apparatus according to the first and second inventions, since the plurality of side portions of the electronic component are imaged by separate imaging means, the appearance of the plurality of side portions of the electronic component is suppressed from lowering the detection accuracy. Can be inspected.
本発明の一実施例に係る外観検査装置の説明図である。It is explanatory drawing of the external appearance inspection apparatus which concerns on one Example of this invention. 同外観検査装置の角度位置調整手段及び撮像手段の側部図である。It is a side view of the angular position adjustment means and imaging means of the same appearance inspection apparatus. 同外観検査装置の角度位置調整手段及び撮像手段の斜視図である。It is a perspective view of the angle position adjustment means and imaging means of the same appearance inspection apparatus. （Ａ）、（Ｂ）、（Ｃ）、（Ｄ）は、それぞれ、電子部品の撮像の様子を示す説明図である。(A), (B), (C), (D) is an explanatory view showing a state of imaging of an electronic component, respectively. 本発明の一実施例に係る外観検査装置の説明図である。It is explanatory drawing of the external appearance inspection apparatus which concerns on one Example of this invention. 変形例に係る外観検査装置の説明図である。It is explanatory drawing of the external appearance inspection apparatus which concerns on a modification. 同外観検査装置の角度位置調整手段及び撮像手段の斜視図である。It is a perspective view of the angle position adjustment means and imaging means of the same appearance inspection apparatus.
続いて、添付した図面を参照しつつ、本発明を具体化した実施例につき説明し、本発明の理解に供する。
図１、図２に示すように、本発明の一実施例に係る外観検査装置１０は、複数の電子部品１１をそれぞれ保持する複数の支持部１６が、平面視して、間隔を空け円状に取り付けられた回転体１７と、電子部品１１の側部１２、１３、１４、１５（それぞれ側部Ａ、Ｂ、Ｃ、Ｄ）をそれぞれ撮像する撮像手段１８、１９、２０、２１（それぞれ撮像手段α、β、γ、δ）とを備え、複数の電子部品１１の側部１２、１３、１４、１５を外観検査する装置である。以下、詳細に説明する。 Subsequently, embodiments of the present invention will be described with reference to the accompanying drawings for understanding of the present invention.
As shown in FIGS. 1 and 2, the appearance inspection apparatus 10 according to one embodiment of the present invention includes a plurality of support portions 16 that respectively hold a plurality of electronic components 11 in a circular shape with a space in plan view. Imaging means 18, 19, 20, 21 (images respectively) for imaging the rotating body 17 attached to the side parts 12, 13, 14, 15 (side parts A, B, C, D, respectively) of the electronic component 11. Means α, β, γ, δ) for visually inspecting the side parts 12, 13, 14, 15 of the plurality of electronic components 11. Details will be described below.
外観検査の対象である電子部品１１は、図１に示すように、板状の本体部２２と、電子部品１１の側部１５に設けられ、本体部２２の一側から突出した複数のリード線２３とを備えている。電子部品１１は、平面視して、側部１２、１３、１４、１５が、順に、反時計回りに配されている。
本実施例において、複数の電子部品１１は、チューブに格納された状態で所定の位置に配置され、チューブから取り出されて、順次、外観検査装置１０に供給される。 As shown in FIG. 1, an electronic component 11 that is an object of appearance inspection is provided on a plate-like main body portion 22 and a side portion 15 of the electronic component 11, and a plurality of lead wires protruding from one side of the main body portion 22. 23. In the electronic component 11, the side parts 12, 13, 14, and 15 are sequentially arranged counterclockwise in a plan view.
In the present embodiment, the plurality of electronic components 11 are arranged at predetermined positions while being stored in a tube, taken out from the tube, and sequentially supplied to the appearance inspection apparatus 10.
外観検査装置１０は、鉛直に配された出力軸２４（鉛直の回転軸の一例）が上方に突出したモータ２５と、中心に、出力軸２４が連結された円盤状の回転体１７とを備えている。モータ２５は、一回の作動で、回転体１７を、所定角度、時計回りに回動させる。従って、回転体１７は、モータ２５の間欠的な作動により、出力軸２４を中心に間欠的に回転する。 The appearance inspection apparatus 10 includes a motor 25 in which an output shaft 24 (an example of a vertical rotation shaft) arranged vertically protrudes upward, and a disk-shaped rotating body 17 to which the output shaft 24 is connected at the center. ing. The motor 25 rotates the rotating body 17 clockwise by a predetermined angle by one operation. Therefore, the rotating body 17 rotates intermittently around the output shaft 24 by the intermittent operation of the motor 25.
回転体１７には、図２に示すように、鉛直方向に長い複数のガイド２６が固定され、複数のガイド２６それぞれには、支持部１６が昇降可能に取り付けられている。各支持部１６は、回転体１７の周方向に所定のピッチで配され、図示しない弾性体によってそれぞれ上向きの力が加えられている。
本実施例では、各支持部１６が、真空圧によって電子部品１１の上面２７を吸着して保持する。 As shown in FIG. 2, a plurality of guides 26 that are long in the vertical direction are fixed to the rotating body 17, and a support portion 16 is attached to each of the plurality of guides 26 so as to be movable up and down. Each support portion 16 is arranged at a predetermined pitch in the circumferential direction of the rotating body 17, and an upward force is applied by an elastic body (not shown).
In the present embodiment, each support portion 16 adsorbs and holds the upper surface 27 of the electronic component 11 by vacuum pressure.
図１、図２に示すように、回転体１７の外周部の上方には、所定間隔で、図示しない支持部材によって複数の昇降手段２８が固定されている。各昇降手段２８は、固定されているため、回転体１７の回転に伴い移動することはない。複数の支持部１６は、回転体１７が一時停止した状態で、複数の昇降手段２８の直下にそれぞれ位置し、各支持部１６は、モータ２５が一回作動することによって、回転体１７の回転方向下流側にある昇降手段２８の直下に送られる。 As shown in FIGS. 1 and 2, a plurality of lifting means 28 are fixed above the outer peripheral portion of the rotating body 17 by a support member (not shown) at a predetermined interval. Since each elevating means 28 is fixed, it does not move with the rotation of the rotating body 17. The plurality of support portions 16 are respectively positioned directly below the plurality of lifting and lowering means 28 in a state where the rotary body 17 is temporarily stopped. Each support portion 16 rotates the rotary body 17 by the motor 25 operating once. Directly below the lifting / lowering means 28 on the downstream side in the direction.
各昇降手段２８は、直下に配置された支持部１６を下方に押して、支持部１６を降下させることができ、支持部１６の高さ位置を調整可能である。各支持部１６は、昇降手段２８から下向きの力が与えられていない状態で、弾性体から与えられる上向きの力により、上限位置に配される。
本実施例では、昇降手段２８が、サーボモータを有している。 Each lifting / lowering means 28 can push down the support part 16 disposed immediately below to lower the support part 16, and the height position of the support part 16 can be adjusted. Each support portion 16 is disposed at the upper limit position by an upward force applied from the elastic body in a state where no downward force is applied from the elevating means 28.
In this embodiment, the elevating means 28 has a servo motor.
チューブから取り出された電子部品１１の上方には、回転体１７が一時停止した状態で、一の支持部１６が配され、その支持部１６は、昇降手段２８の作動により、電子部品１１の上面２７に接触する高さまで降下し、真空圧によって、電子部品１１を吸着して保持する。
電子部品１１を保持した支持部１６は、昇降手段２８が再び作動することによって、上限位置まで上昇し、モータ２５の作動により、回転体１７の回転方向下流側に、昇降手段２８の配置ピッチ分、移動する。
以下、支持部１６が電子部品１１を取得する位置を、「取得位置」とも言う。 Above the electronic component 11 taken out from the tube, a single support portion 16 is disposed in a state where the rotating body 17 is temporarily stopped. The electronic component 11 is sucked and held by a vacuum pressure.
The support portion 16 holding the electronic component 11 is raised to the upper limit position when the lifting / lowering means 28 is actuated again. ,Moving.
Hereinafter, the position where the support unit 16 acquires the electronic component 11 is also referred to as “acquisition position”.
取得位置の回転体１７の回転方向下流側には、図１に示すように、電子部品１１の側部１２、１３、１４、１５が撮像される撮像位置Ｐ、Ｑ、Ｒ、Ｓが設けられている。なお、図１（図５についても同じ）では、撮像位置Ｐ、Ｑ、Ｒ、Ｓをそれぞれ、Ｐ、Ｑ、Ｒ、Ｓとして記している。
撮像位置Ｐ、Ｑ、Ｒ、Ｓは、回転体１７の回転方向下流側に向かって、順に、設けられている。回転体１７は、出力軸２４を中心に間欠的に回転して、複数の支持部１６と共に、各支持部１６に保持された電子部品１１を、撮像位置Ｐ、Ｑ、Ｒ、Ｓに、順次、配置する。 As shown in FIG. 1, imaging positions P, Q, R, and S where the side parts 12, 13, 14, and 15 of the electronic component 11 are imaged are provided on the downstream side in the rotation direction of the rotator 17 at the acquisition position. ing. In FIG. 1 (the same applies to FIG. 5), the imaging positions P, Q, R, and S are indicated as P, Q, R, and S, respectively.
The imaging positions P, Q, R, and S are provided in order toward the downstream side in the rotation direction of the rotating body 17. The rotator 17 rotates intermittently around the output shaft 24, and together with the plurality of support portions 16, the electronic components 11 held by the support portions 16 are sequentially moved to the imaging positions P, Q, R, and S. ,Deploy.
撮像位置Ｐ、Ｑ、Ｒ、Ｓそれぞれには、一次停止した支持部１６の直下に、電子部品１１を、所定角度（本実施例では、９０度）回転させる角度位置調整手段３０、３１、３２、３３が配されている。本実施例では、角度位置調整手段３１、３２、３３が、それぞれ角度位置調整手段ｑ、ｒ、ｓに該当する。 At each of the imaging positions P, Q, R, and S, angular position adjusting means 30, 31, and 32 for rotating the electronic component 11 by a predetermined angle (90 degrees in the present embodiment) immediately below the support portion 16 that is temporarily stopped. , 33 are arranged. In the present embodiment, the angular position adjusting means 31, 32, and 33 correspond to the angular position adjusting means q, r, and s, respectively.
角度位置調整手段３２（角度位置調整手段３０、３１、３３についても同じ）は、図２、図３に示すように、ベース台３４に、スライド機構３５を介して取り付けられている。角度位置調整手段３２は、電子部品１１が固定される保持部３６と、保持部３６を鉛直の回転軸３７を基準にして、時計回りに回転させるモータ３８を備えている。
スライド機構３５は、駆動源、ボールねじ及びガイドを有する周知の構造を備えて、角度位置調整手段３２を、水平方向に進退させる。本実施例では、角度位置調整手段３１、３２、３３それぞれに取り付けられたスライド機構３５が、それぞれ、スライド機構Ｆ、Ｇ、Ｈに該当する。 The angular position adjusting means 32 (the same applies to the angular position adjusting means 30, 31, 33) is attached to the base table 34 via a slide mechanism 35, as shown in FIGS. The angular position adjusting means 32 includes a holding unit 36 to which the electronic component 11 is fixed, and a motor 38 that rotates the holding unit 36 clockwise with a vertical rotation shaft 37 as a reference.
The slide mechanism 35 has a known structure having a drive source, a ball screw, and a guide, and advances and retracts the angular position adjusting means 32 in the horizontal direction. In the present embodiment, the slide mechanisms 35 attached to the angular position adjusting means 31, 32, and 33 correspond to the slide mechanisms F, G, and H, respectively.
平面視して円形の保持部３６には、上側に、電子部品１１を収める溝３９が形成されている。溝３９は、平面視して保持部３６の中央から一側に向かって設けられ、保持部３６の平面視して一側は、上半分が、溝３９によって開口されている。電子部品１１は、図４（Ｂ）、（Ｃ）に示すように、保持部３６の開口された一側に複数のリード線２３を配した状態で、溝３９に嵌入される。
回転軸３７は、図２、図３に示すように、保持部３６の下側中央に連結され、保持部３６は、保持部３６の中心を基準にして回転する。 A groove 39 for accommodating the electronic component 11 is formed on the upper side of the circular holding portion 36 in plan view. The groove 39 is provided from the center of the holding portion 36 toward one side in a plan view, and the upper half is opened by the groove 39 on one side of the holding portion 36 in a plan view. As shown in FIGS. 4B and 4C, the electronic component 11 is inserted into the groove 39 in a state where a plurality of lead wires 23 are arranged on the opened side of the holding portion 36.
As shown in FIGS. 2 and 3, the rotation shaft 37 is connected to the lower center of the holding portion 36, and the holding portion 36 rotates with respect to the center of the holding portion 36.
角度位置調整手段３２が取り付けられたベース台３４には、撮像手段２０が固定され、撮像手段２０の撮像中心は、平面視して、角度位置調整手段３２の保持部３６の中心、かつ、側面視して、角度位置調整手段３２の保持部３６の上方に向けられている。本実施例では、撮像手段２０と撮像位置Ｒに配置された電子部品１１と回転体１７の回転中心とは、図１に示すように、順に、平面視して、直線上に配されている。角度位置調整手段３２に取り付けられたスライド機構３５は、角度位置調整手段３２（角度位置調整手段３２の保持部３６）を、撮像手段２０の撮像経路に沿って進退させる。 The imaging means 20 is fixed to the base 34 to which the angular position adjusting means 32 is attached. The imaging center of the imaging means 20 is the center of the holding portion 36 of the angular position adjusting means 32 and the side surface in plan view. Viewed, it is directed above the holding portion 36 of the angular position adjusting means 32. In the present embodiment, the imaging means 20, the electronic component 11 disposed at the imaging position R, and the rotation center of the rotating body 17 are arranged on a straight line in plan view in order, as shown in FIG. . The slide mechanism 35 attached to the angular position adjusting unit 32 moves the angular position adjusting unit 32 (the holding unit 36 of the angular position adjusting unit 32) forward and backward along the imaging path of the imaging unit 20.
平面視して、撮像手段を、撮像位置Ｒに配置された電子部品と回転体の回転中心の間に配置して、電子部品の側面を撮像できるように、回転体の径を大きくすることも可能であるが、その場合、単位時間に検査できる電子部品の数が減少することとなる。これは、回転体の径を大きくすると、回転モーメントが大きくなり、回転体が回転を開始する際や、回転体を一時停止する際の動作を遅くする必要性が生じるためである。 In plan view, the imaging means may be disposed between the electronic component disposed at the imaging position R and the rotation center of the rotating body, and the diameter of the rotating body may be increased so that the side surface of the electronic component can be imaged. In this case, the number of electronic components that can be inspected per unit time is reduced. This is because when the diameter of the rotating body is increased, the rotational moment increases, and it becomes necessary to slow down the operation when the rotating body starts rotating or when the rotating body is temporarily stopped.
角度位置調整手段３０、撮像手段１８、撮像位置Ｐに配置された電子部品１１、角度位置調整手段３０に取り付けられたスライド機構３５及び回転体１７の位置関係（第１の位置関係）と、角度位置調整手段３１、撮像手段１９、撮像位置Ｑに配置された電子部品１１、角度位置調整手段３１に取り付けられたスライド機構３５及び回転体１７の位置関係（第２の位置関係）と、角度位置調整手段３３、撮像手段２１、撮像位置Ｓに配置された電子部品１１、角度位置調整手段３３に取り付けられたスライド機構３５及び回転体１７の位置関係（第３の位置関係）は、それぞれ、角度位置調整手段３２、撮像手段２０、撮像位置Ｒに配置された電子部品１１及び回転体１７の位置関係（第４の位置関係）と同じである。即ち、第１、第２、第３、第４の位置関係は同じである。 The positional relationship (first positional relationship) of the angular position adjusting means 30, the imaging means 18, the electronic component 11 disposed at the imaging position P, the slide mechanism 35 attached to the angular position adjusting means 30, and the rotating body 17 and the angle The positional relationship (second positional relationship) between the position adjusting unit 31, the imaging unit 19, the electronic component 11 disposed at the imaging position Q, the slide mechanism 35 attached to the angular position adjusting unit 31, and the rotating body 17, and the angular position The positional relationship (third positional relationship) among the adjusting unit 33, the imaging unit 21, the electronic component 11 disposed at the imaging position S, the slide mechanism 35 attached to the angular position adjusting unit 33, and the rotating body 17 is an angle. This is the same as the positional relationship (fourth positional relationship) of the position adjusting unit 32, the imaging unit 20, the electronic component 11 disposed at the imaging position R, and the rotating body 17. That is, the first, second, third, and fourth positional relationships are the same.
支持部１６に保持されて、撮像位置Ｐに搬送された電子部品１１は、図５に示すように、平面視して、側部１５が、撮像手段１８に対向して配置されている。このとき、支持部１６は、図４（Ａ）に示すように、上限位置に配されている。なお、図４（Ａ）、（Ｂ）、（Ｃ）、（Ｄ）には、撮像手段１８から見た電子部品１１及び保持部３６の様子が描かれている。
その後、電子部品１１は、支持部１６の上方に設けられた昇降手段２８の作動により、支持部１６と共に降下し、図４（Ｂ）に示すように、角度位置調整手段３０の保持部３６の溝３９内に嵌入されて、角度位置調整手段３０の保持部３６に固定された状態となる。
本実施例では、支持部１６が、真空破壊、あるいは、大気開放によって、支持部１６による電子部品１１の保持状態を解除して、電子部品１１を保持部３６に受け渡し、昇降手段２８の作動により、支持部１６は、電子部品１１の上方に上昇する。 As shown in FIG. 5, the electronic component 11 held by the support unit 16 and transported to the imaging position P is disposed so that the side portion 15 faces the imaging unit 18 in a plan view. At this time, the support portion 16 is disposed at the upper limit position as shown in FIG. 4A, 4 </ b> B, 4 </ b> C, and 4 </ b> D illustrate the state of the electronic component 11 and the holding unit 36 as viewed from the imaging unit 18.
Thereafter, the electronic component 11 is lowered together with the support unit 16 by the operation of the lifting and lowering unit 28 provided above the support unit 16, and as shown in FIG. It is inserted into the groove 39 and is fixed to the holding portion 36 of the angular position adjusting means 30.
In the present embodiment, the support unit 16 releases the holding state of the electronic component 11 by the support unit 16 by vacuum breakage or release to the atmosphere, passes the electronic component 11 to the holding unit 36, and operates the lifting means 28. The support part 16 rises above the electronic component 11.
次に、電子部品１１は、角度位置調整手段３０のモータ３８の駆動により、図４（Ｃ）に示すように、角度位置調整手段３０の保持部３６と共に、時計回りに９０度、回転する。即ち、撮像位置Ｐに配置された電子部品１１は、支持部１６から解放され、支持部１６から離れた状態で回転する。これにより、撮像位置Ｐにおいて、電子部品１１は、図１に示すように、側部１２が、撮像手段１８に対向配置される。 Next, the electronic component 11 rotates 90 degrees clockwise together with the holding portion 36 of the angular position adjusting means 30 by driving the motor 38 of the angular position adjusting means 30 as shown in FIG. That is, the electronic component 11 disposed at the imaging position P is released from the support unit 16 and rotates in a state of being separated from the support unit 16. Thereby, in the imaging position P, as shown in FIG. 1, the electronic component 11 has the side portion 12 disposed opposite to the imaging means 18.
そして、昇降手段２８が作動して、電子部品１１は、図４（Ｄ）に示すように、支持部１６によって、角度位置調整手段３０の保持部３６から上方に持ち上げられて、側部１２全体が、撮像手段１８から撮像可能な状態となり、側部１２全体が撮像手段１８によって撮像される。即ち、撮像手段１８は、撮像位置Ｐに配置された電子部品１１の側部１２を撮像する。 Then, the lifting / lowering means 28 is operated, and the electronic component 11 is lifted upward from the holding portion 36 of the angular position adjusting means 30 by the support portion 16 as shown in FIG. However, the imaging unit 18 can capture an image, and the entire side portion 12 is imaged by the imaging unit 18. That is, the imaging unit 18 images the side part 12 of the electronic component 11 arranged at the imaging position P.
角度位置調整手段３２が取り付けられたベース台３４には、図２、図３に示すように、同軸照明４０及びボックス照明４１が固定されている。同軸照明４０及びボックス照明４１は、角度位置調整手段３２の保持部３６の上方に配された電子部品１１を照らす。同軸照明４０及びボックス照明４１は、角度位置調整手段３０が取り付けられたベース台３４、角度位置調整手段３１が取り付けられたベース台３４及び角度位置調整手段３３が取り付けられたベース台３４にもそれぞれ取り付けられている。 As shown in FIGS. 2 and 3, the coaxial illumination 40 and the box illumination 41 are fixed to the base table 34 to which the angular position adjusting means 32 is attached. The coaxial illumination 40 and the box illumination 41 illuminate the electronic component 11 disposed above the holding portion 36 of the angular position adjusting means 32. The coaxial illumination 40 and the box illumination 41 are also respectively applied to the base table 34 to which the angular position adjusting means 30 is attached, the base table 34 to which the angular position adjusting means 31 is attached, and the base table 34 to which the angular position adjusting means 33 is attached. It is attached.
側部１２が撮像された電子部品１１は、回転体１７の所定角度の回転により、撮像位置Ｐから撮像位置Ｑに搬送され、撮像位置Ｑにおいて側部１３が撮像手段１９により撮像される。その後、電子部品１１は、撮像位置Ｒに搬送されて側部１４が撮像手段２０により撮像され、次に、撮像位置Ｓに搬送されて側部１５が撮像手段２１により撮像される。
撮像位置Ｑにおける電子部品１１の側部１３の撮像、撮像位置Ｒにおける電子部品１１の側部１４の撮像、及び、撮像位置Ｓにおける電子部品１１の側部１５の撮像は、撮像位置Ｐで電子部品１１の側部１２が撮像されたのと同じ手順でそれぞれ行われる。 The electronic component 11 on which the side portion 12 has been imaged is conveyed from the imaging position P to the imaging position Q by the rotation of the rotating body 17 by a predetermined angle, and the side portion 13 is imaged by the imaging means 19 at the imaging position Q. Thereafter, the electronic component 11 is conveyed to the imaging position R and the side portion 14 is imaged by the imaging means 20, and then is conveyed to the imaging position S and the side portion 15 is imaged by the imaging means 21.
The imaging of the side part 13 of the electronic component 11 at the imaging position Q, the imaging of the side part 14 of the electronic component 11 at the imaging position R, and the imaging of the side part 15 of the electronic component 11 at the imaging position S are performed electronically at the imaging position P. Each is performed in the same procedure as when the side portion 12 of the component 11 is imaged.
即ち、撮像位置Ｑに配置された支持部１６の上方には、撮像位置Ｑに配置された支持部１６を昇降する昇降手段２８（昇降手段ｑ’）があり、撮像位置Ｒに配置された支持部１６の上方には、撮像位置Ｒに配置された支持部１６を昇降する昇降手段２８（昇降手段ｒ’）があり、撮像位置Ｓに配置された支持部１６の上方には、撮像位置Ｓに配置された支持部１６を昇降する昇降手段２８（昇降手段ｓ’）がある。
そして、撮像位置Ｑに配置された電子部品１１は、撮像位置Ｑにおいて、昇降手段２８（昇降手段ｑ’）の作動に伴い、支持部１６と共に降下して、角度位置調整手段３１の保持部３６に固定された状態となる。角度位置調整手段３１の保持部３６に固定された電子部品１１は、角度位置調整手段３１の保持部３６と共に、９０度、時計回りに回転し、その後、支持部１６によって、角度位置調整手段３１の保持部３６から上方に持ち上げられ、側部１３全体が、撮像手段１９により撮像される。 That is, above the support unit 16 disposed at the imaging position Q, there is an elevating unit 28 (elevating unit q ′) for elevating and lowering the support unit 16 disposed at the imaging position Q, and the support unit disposed at the imaging position R. Above the unit 16, there is an elevating means 28 (elevating means r ′) for elevating and lowering the support unit 16 disposed at the imaging position R, and above the support unit 16 disposed at the imaging position S, the imaging position S. There is an elevating means 28 (elevating means s ′) for elevating and lowering the support portion 16 arranged in the area.
Then, the electronic component 11 arranged at the imaging position Q descends together with the support 16 at the imaging position Q along with the operation of the elevating means 28 (elevating means q ′), and the holding portion 36 of the angular position adjusting means 31. It will be in the state fixed to. The electronic component 11 fixed to the holding unit 36 of the angular position adjusting unit 31 rotates 90 degrees clockwise together with the holding unit 36 of the angular position adjusting unit 31, and then the angular position adjusting unit 31 is supported by the support unit 16. The entire side portion 13 is picked up by the image pickup means 19.
撮像位置Ｒに配置された電子部品１１は、撮像位置Ｒにおいて、昇降手段２８（昇降手段ｒ’）の作動に伴い、支持部１６と共に降下して、角度位置調整手段３２の保持部３６に固定された状態となり、角度位置調整手段３２の保持部３６と共に、９０度、時計回りに回転する。その後、電子部品１１は、支持部１６によって、角度位置調整手段３２の保持部３６から上方に持ち上げられ、側部１４全体が、撮像手段２０により撮像される。そして、撮像位置Ｓに配置された電子部品１１は、撮像位置Ｓにおいて、昇降手段２８（昇降手段ｓ’）の作動に伴い、支持部１６と共に降下して、角度位置調整手段３３の保持部３６に固定された状態となり、角度位置調整手段３３の保持部３６と共に、９０度、時計回りに回転する。その後、電子部品１１は、支持部１６によって、角度位置調整手段３３の保持部３６から上方に持ち上げられ、側部１５全体が、撮像手段２１により撮像される。 The electronic component 11 arranged at the imaging position R descends together with the support unit 16 and is fixed to the holding unit 36 of the angular position adjustment unit 32 in accordance with the operation of the elevating unit 28 (elevating unit r ′) at the imaging position R. In this state, it rotates 90 degrees clockwise together with the holding part 36 of the angular position adjusting means 32. Thereafter, the electronic component 11 is lifted upward from the holding portion 36 of the angular position adjusting means 32 by the support portion 16, and the entire side portion 14 is imaged by the imaging means 20. Then, the electronic component 11 arranged at the imaging position S descends together with the support portion 16 in accordance with the operation of the elevating means 28 (elevating means s ′) at the imaging position S, and the holding portion 36 of the angular position adjusting means 33. And is rotated 90 degrees clockwise together with the holding portion 36 of the angular position adjusting means 33. Thereafter, the electronic component 11 is lifted upward from the holding portion 36 of the angular position adjusting means 33 by the support portion 16, and the entire side portion 15 is imaged by the imaging means 21.
側部１２、１３、１４、１５の撮像が完了した電子部品１１は、側部１２、１３、１４、１５を撮像した画像を用いて欠けや疵の有無等が検査され、その検査結果等を基に、製品レベルが判定される。良品と判定された電子部品１１は、良品と判定されなかった電子部品１１と分けられ、撮像位置Ｓの下流側で、支持部１６から解放されて、チューブ、あるいは、テープに格納される。なお、電子部品１１は、チューブやテープに格納される代わりに、ウェハに貼り付けることもできる。 The electronic parts 11 that have been imaged on the side portions 12, 13, 14, and 15 are inspected for the presence or absence of defects or wrinkles using the images obtained by imaging the side portions 12, 13, 14, and 15, and the inspection results are displayed. Based on this, the product level is determined. The electronic component 11 determined to be non-defective is separated from the electronic component 11 not determined to be non-defective, released from the support unit 16 on the downstream side of the imaging position S, and stored in a tube or tape. Note that the electronic component 11 can be attached to a wafer instead of being stored in a tube or a tape.
このように、電子部品１１の側部１２、１３、１４、１５はそれぞれ、撮像手段１８、１９、２０、２１によって、撮像されるので、電子部品１１の側部１２、１３、１４、１５の外観検査を、高精度に、行うことができる。また、撮像手段１８、１９、２０、２１に比べ、画素数が多い撮像手段を用いて、電子部品１１の側部１２、１３、１４、１５の複数を１つの画像に収めて外観検査を行う場合に比べ、外観検査装置の製造コストを抑制可能である。 Thus, since the side parts 12, 13, 14, and 15 of the electronic component 11 are imaged by the imaging means 18, 19, 20, and 21, respectively, the side parts 12, 13, 14, and 15 of the electronic component 11 are captured. Appearance inspection can be performed with high accuracy. Further, by using an imaging unit having a larger number of pixels than the imaging units 18, 19, 20, and 21, a plurality of the side parts 12, 13, 14, and 15 of the electronic component 11 are accommodated in one image and an appearance inspection is performed. Compared to the case, the manufacturing cost of the appearance inspection apparatus can be suppressed.
また、支持部１６とは別に、電子部品１１を回転させる角度位置調整手段３０、３１、３２、３３を設けているため、支持部を回転可能に設計し、支持部の回転動作によって電子部品１１を各撮像位置で回転させる場合に比べ、安定的に、電子部品１１を回転させることができる。
更に、支持部１６は電子部品１１の上面２７を吸着保持するものであり、かつ、角度位置調整手段３０、３１、３２、３３それぞれの保持部３６に、電子部品１１が嵌入される溝３９が形成されていることから、支持部１６と角度位置調整手段３０、３１、３２、３３それぞれとの電子部品１１の受け渡しを円滑に行うことができる。
そして、支持部１６は昇降可能であるため、角度位置調整手段それぞれの保持部を昇降可能に設計するのに比べ、外観検査装置を簡素な構造にすることができる。 Further, since the angular position adjusting means 30, 31, 32, 33 for rotating the electronic component 11 are provided separately from the support portion 16, the support portion is designed to be rotatable and the electronic component 11 is rotated by the rotation operation of the support portion. The electronic component 11 can be stably rotated as compared with the case where the electronic component 11 is rotated at each imaging position.
Further, the support portion 16 holds the upper surface 27 of the electronic component 11 by suction, and a groove 39 into which the electronic component 11 is fitted is provided in each of the holding portions 36 of the angular position adjusting means 30, 31, 32, 33. Since it is formed, it is possible to smoothly transfer the electronic component 11 between the support portion 16 and each of the angular position adjusting means 30, 31, 32, and 33.
And since the support part 16 can be raised / lowered, compared with designing the holding | maintenance part of each angular position adjustment means so that raising / lowering is possible, an external appearance inspection apparatus can be made a simple structure.
ここで、角度位置調整手段３０を進退させるスライド機構３５は、角度位置調整手段３０を、角度位置調整手段３０の保持部３６に固定された電子部品１１と共に、撮像手段１８の撮像方向に沿って進退させることができる。角度位置調整手段３０は、角度位置調整手段３０と共に進退した電子部品１１が、再び、支持部１６によって、吸着保持される範囲で進退することになる。これにより、撮像手段１８は単焦点のカメラであるが、撮像手段１８と電子部品１１の距離を調整して、電子部品１１の撮像手段１８によって撮像される側部１２を、撮像手段１８の焦点に配置して撮像することが可能である。これは、角度位置調整手段３１を進退させるスライド機構３５、角度位置調整手段３２を進退させるスライド機構３５及び角度位置調整手段３３を進退させるスライド機構３５についても同じである。 Here, the slide mechanism 35 for advancing and retracting the angular position adjusting means 30 moves the angular position adjusting means 30 along with the electronic component 11 fixed to the holding portion 36 of the angular position adjusting means 30 along the imaging direction of the imaging means 18. Can be advanced or retreated. The angular position adjusting means 30 advances and retreats within a range in which the electronic component 11 that has advanced and retracted together with the angular position adjusting means 30 is again sucked and held by the support portion 16. As a result, the imaging unit 18 is a single-focus camera, but the distance between the imaging unit 18 and the electronic component 11 is adjusted, and the side portion 12 imaged by the imaging unit 18 of the electronic component 11 is adjusted to the focus of the imaging unit 18. It is possible to take an image by arranging them. The same applies to the slide mechanism 35 that advances and retracts the angular position adjusting means 31, the slide mechanism 35 that advances and retracts the angular position adjusting means 32, and the slide mechanism 35 that advances and retracts the angular position adjusting means 33.
なお、撮像位置Ｐに、必ずしも、角度位置調整手段３０を設ける必要はない。また、角度位置調整手段の全体が進退する代わりに、角度位置調整手段の保持部のみが進退するように、設計してもよい。撮像位置Ｐに角度位置調整手段３０を設けない場合、電子部品１１が撮像位置Ｐに搬送される前に、電子部品１１の側部１２を、平面視して、回転体１７の径方向外側に配置する機構を設けることで、撮像手段１８は、撮像位置Ｐに配された電子部品１１の側部１２を撮像可能である。 Note that the angular position adjusting means 30 is not necessarily provided at the imaging position P. Further, it may be designed such that only the holding portion of the angular position adjusting means advances and retracts instead of the entire angular position adjusting means moving forward and backward. When the angular position adjusting means 30 is not provided at the imaging position P, before the electronic component 11 is transported to the imaging position P, the side portion 12 of the electronic component 11 is viewed in a plan view on the radially outer side of the rotating body 17. By providing the arrangement mechanism, the imaging unit 18 can image the side part 12 of the electronic component 11 arranged at the imaging position P.
ここまで、撮像位置Ｐ、Ｑ、Ｒ、Ｓにおいて、電子部品１１を回動させた後に、電子部品１１の側部１２、１３、１４、１５をそれぞれ撮像する外観検査装置１０を説明したが、撮像位置Ｐ、Ｑ、Ｒにおいて、電子部品１１の側部１２、１３、１４をそれぞれ撮像した後に、電子部品１１を回動させてもよい。
以下、外観検査装置１０の変形例であり、撮像位置Ｐ、Ｑ、Ｒにおいて、電子部品１１の側部１２、１３、１４をそれぞれ撮像した後に、電子部品１１を回動させる図６に示す外観検査装置５０について説明する。なお、外観検査装置１０と同じ構成については、外観検査装置１０と同じ符号を付して詳しい説明は省略する。 Up to this point, the appearance inspection apparatus 10 that images the side parts 12, 13, 14, and 15 of the electronic component 11 after rotating the electronic component 11 at the imaging positions P, Q, R, and S has been described. The electronic component 11 may be rotated after imaging the side portions 12, 13, and 14 of the electronic component 11 at the imaging positions P, Q, and R, respectively.
The following is a modified example of the appearance inspection apparatus 10, and the appearance shown in FIG. 6 is obtained by rotating the electronic component 11 after imaging the side portions 12, 13, and 14 of the electronic component 11 at the imaging positions P, Q, and R, respectively. The inspection device 50 will be described. In addition, about the same structure as the external appearance inspection apparatus 10, the same code | symbol as the external appearance inspection apparatus 10 is attached | subjected and detailed description is abbreviate | omitted.
外観検査装置５０は、図６、図７に示すように、電子部品１１を、所定角度（本実施例では９０度）、回転させる角度位置調整手段５１、５２、５３、５４（角度位置調整手段５１、５２、５３は、それぞれ角度位置調整手段ｐ’’、ｑ’’、ｒ’’に該当する）を、撮像位置Ｐ、Ｑ、Ｒ、Ｓにそれぞれ備えている。更に、撮像位置Ｐ、Ｑ、Ｒに配置された支持部１６をそれぞれ昇降する昇降手段２８（昇降手段ｐ’、ｑ’、ｒ’）を備えている。
角度位置調整手段５１は、図７に示すように、角度位置調整手段５１を水平方向に進退させるスライド機構５５（スライド機構Ｅ’）を介して、ベース台３４に取り付けられている。 As shown in FIGS. 6 and 7, the appearance inspection apparatus 50 is configured to rotate the electronic component 11 by a predetermined angle (90 degrees in this embodiment), angular position adjusting means 51, 52, 53, 54 (angular position adjusting means). 51, 52 and 53 respectively correspond to the angular position adjusting means p ″, q ″ and r ″) at the imaging positions P, Q, R and S, respectively. Furthermore, it includes elevating means 28 (elevating means p ′, q ′, r ′) for elevating and lowering the support portions 16 arranged at the imaging positions P, Q, R.
As shown in FIG. 7, the angular position adjusting means 51 is attached to the base table 34 via a slide mechanism 55 (sliding mechanism E ′) that moves the angular position adjusting means 51 in the horizontal direction.
角度位置調整手段５２、５３、５４も、角度位置調整手段５２、５３、５４をそれぞれ水平方向に進退させるスライド機構５５を介して、それぞれベース台３４に固定されている。角度位置調整手段５２を進退させるスライド機構５５及び角度位置調整手段５３を進退させるスライド機構５５は、それぞれスライド機構Ｆ’、Ｇ’に該当する。
その他、角度位置調整手段５１、５２、５３、５４それぞれの配置及び構成は、外観検査装置１０の角度位置調整手段３０、３１、３２、３３と同じであるので、詳細な説明は省略する。 The angular position adjusting means 52, 53, and 54 are also fixed to the base table 34 via slide mechanisms 55 that move the angular position adjusting means 52, 53, and 54 in the horizontal direction. The slide mechanism 55 that advances and retracts the angular position adjusting means 52 and the slide mechanism 55 that advances and retracts the angular position adjusting means 53 correspond to the slide mechanisms F ′ and G ′, respectively.
In addition, the arrangement and configuration of each of the angular position adjusting means 51, 52, 53, and 54 are the same as those of the angular position adjusting means 30, 31, 32, and 33 of the appearance inspection apparatus 10, and thus detailed description thereof is omitted.
支持部１６が外部から取得した電子部品１１は、図６に示すように、側部１２が回転体１７の半径方向外側に配された状態で、支持部１６によって保持される。そして、電子部品１１は、回転体１７の時計回りの所定角度の回転により、撮像位置Ｐに送られ、側部１２が、撮像手段１８によって撮像される。その後、電子部品１１は、支持部１６と共に降下し、支持部１６から角度位置調整手段５１の保持部３６に受け渡されて、角度位置調整手段５１の保持部３６に固定された状態となる。支持部１６は、電子部品１１を角度位置調整手段５１の保持部３６に受け渡し、上昇する。 As shown in FIG. 6, the electronic component 11 acquired from the outside by the support unit 16 is held by the support unit 16 in a state where the side portion 12 is arranged on the outer side in the radial direction of the rotating body 17. Then, the electronic component 11 is sent to the imaging position P by the rotation of the rotating body 17 by a predetermined angle in the clockwise direction, and the side portion 12 is imaged by the imaging means 18. Thereafter, the electronic component 11 is lowered together with the support portion 16, transferred from the support portion 16 to the holding portion 36 of the angular position adjusting means 51, and fixed to the holding portion 36 of the angular position adjusting means 51. The support part 16 transfers the electronic component 11 to the holding part 36 of the angular position adjusting means 51 and moves up.
次に、電子部品１１は、角度位置調整手段５１の保持部３６と共に、回転軸３７を基準にして（回転軸３７を中心に）、９０度、時計回りに回転し、降下した支持部１６により吸着保持される。そして、電子部品１１は、支持部１６によって角度位置調整手段５１の保持部３６の上方に持ち上げられる。従って、角度位置調整手段５１は、側部１２が撮像された電子部品１１を、撮像位置Ｐで、所定角度回転させることになる。
その後、回転体１７が時計回りに所定角度、回転することによって、電子部品１１は、撮像位置Ｑに搬送され、側部１３が撮像手段１９によって撮像され、その後、撮像位置Ｑで角度位置調整手段５２が、電子部品１１を９０度時計回りに回転させる。 Next, the electronic component 11 rotates together with the holding portion 36 of the angular position adjusting means 51 clockwise by 90 degrees with respect to the rotation shaft 37 (centering on the rotation shaft 37), and is supported by the lowered support portion 16. Adsorbed and held. The electronic component 11 is lifted above the holding portion 36 of the angular position adjusting means 51 by the support portion 16. Accordingly, the angular position adjusting means 51 rotates the electronic component 11 on which the side portion 12 is imaged at the imaging position P by a predetermined angle.
Thereafter, the rotating body 17 rotates clockwise by a predetermined angle, whereby the electronic component 11 is conveyed to the imaging position Q, the side portion 13 is imaged by the imaging means 19, and then the angular position adjusting means at the imaging position Q. 52 rotates the electronic component 11 by 90 degrees clockwise.
そして、回転体１７が、再び、反時計回りに所定角度、回転することによって、電子部品１１は、撮像位置Ｒに搬送され、側部１４が撮像手段２０によって撮像される。そして、撮像位置Ｒで、角度位置調整手段５３が、電子部品１１を９０度時計回りに回転させる。その後、回転体１７が、再度、時計回りに所定角度、回転することによって、電子部品１１は、撮像位置Ｓに搬送され、側部１５が、撮像手段２１によって撮像される。次に、電子部品１１は、撮像位置Ｓで回転されることなく、回転体１７の回転によって、回転体１７の回転方向下流側に送られる。電子部品１１の側部１２、１３、１４、１５を撮像した各画像を用いて電子部品１１の外観検査が行われる。 Then, the rotating body 17 rotates again by a predetermined angle in the counterclockwise direction, whereby the electronic component 11 is conveyed to the imaging position R and the side portion 14 is imaged by the imaging means 20. Then, at the imaging position R, the angular position adjusting means 53 rotates the electronic component 11 by 90 degrees clockwise. Thereafter, the rotating body 17 rotates again by a predetermined angle in the clockwise direction, whereby the electronic component 11 is conveyed to the imaging position S, and the side portion 15 is imaged by the imaging means 21. Next, the electronic component 11 is sent to the downstream side in the rotation direction of the rotating body 17 by the rotation of the rotating body 17 without being rotated at the imaging position S. An appearance inspection of the electronic component 11 is performed using each image obtained by imaging the side portions 12, 13, 14, and 15 of the electronic component 11.
撮像位置Ｑにおける支持部１６、撮像手段１９及び角度位置調整手段５２の各動作の関係と、撮像位置Ｒおける支持部１６、撮像手段２０及び角度位置調整手段５３の各動作の関係は、撮像位置Ｐにおける支持部１６、撮像手段１８及び角度位置調整手段５１の各動作の関係と同じである。撮像位置Ｓにおける支持部１６、撮像手段２１及び角度位置調整手段５４の各動作の関係は、撮像位置Ｓで電子部品１１が回転されない点を除き、撮像位置Ｐにおける支持部１６、撮像手段１８及び角度位置調整手段５１の各動作の関係と、基本的に同じである。 The relationship between the operations of the support unit 16, the imaging unit 19 and the angular position adjustment unit 52 at the imaging position Q and the relationship between the operations of the support unit 16, the imaging unit 20 and the angular position adjustment unit 53 at the imaging position R are as follows. The relationship between the operations of the support unit 16, the imaging unit 18, and the angular position adjustment unit 51 in P is the same. The relationship among the operations of the support unit 16, the imaging unit 21, and the angular position adjustment unit 54 at the imaging position S is that the electronic part 11 is not rotated at the imaging position S except for the support unit 16, the imaging unit 18, and the imaging position P. The relationship between the operations of the angular position adjusting means 51 is basically the same.
また、角度位置調整手段５１に取り付けられたスライド機構５５は、角度位置調整手段５１（即ち、角度位置調整手段５１の保持部３６）を、撮像手段１８の撮像方向に（撮像経路に沿って）進退させて、撮像手段１８の焦点に、電子部品１１の側部１２を配置可能である。
これは、角度位置調整手段５２、５３、５４それぞれに取り付けられたスライド機構５５についても同様であり、角度位置調整手段５２に取り付けられたスライド機構５５は、角度位置調整手段５２（即ち、角度位置調整手段５２の保持部３６）を、撮像手段１９の撮像方向に（撮像経路に沿って）進退させて、撮像手段１９の焦点に、電子部品１１の側部１３を配置可能である。 Further, the slide mechanism 55 attached to the angular position adjusting unit 51 moves the angular position adjusting unit 51 (that is, the holding unit 36 of the angular position adjusting unit 51) in the imaging direction of the imaging unit 18 (along the imaging path). The side part 12 of the electronic component 11 can be arranged at the focal point of the imaging means 18 by being advanced and retracted.
The same applies to the slide mechanism 55 attached to each of the angular position adjusting means 52, 53, and 54. The slide mechanism 55 attached to the angular position adjusting means 52 is connected to the angular position adjusting means 52 (that is, the angular position adjusting means). The side part 13 of the electronic component 11 can be arranged at the focal point of the imaging unit 19 by moving the holding unit 36 of the adjusting unit 52 back and forth in the imaging direction of the imaging unit 19 (along the imaging path).
角度位置調整手段５３に取り付けられたスライド機構５５は、角度位置調整手段５３（即ち、角度位置調整手段５３の保持部３６）を、撮像手段２０の撮像方向に（撮像経路に沿って）進退させて、撮像手段２０の焦点に、電子部品１１の側部１４を配置可能である。角度位置調整手段５４に取り付けられたスライド機構５５は、角度位置調整手段５４（即ち、角度位置調整手段５４の保持部３６）を、撮像手段２１の撮像方向に（撮像経路に沿って）進退させて、撮像手段２１の焦点に、電子部品１１の側部１５を配置可能である。 The slide mechanism 55 attached to the angular position adjusting unit 53 advances and retracts the angular position adjusting unit 53 (that is, the holding unit 36 of the angular position adjusting unit 53) in the imaging direction of the imaging unit 20 (along the imaging path). Thus, the side portion 14 of the electronic component 11 can be arranged at the focal point of the imaging means 20. The slide mechanism 55 attached to the angular position adjusting unit 54 advances and retracts the angular position adjusting unit 54 (that is, the holding unit 36 of the angular position adjusting unit 54) in the imaging direction of the imaging unit 21 (along the imaging path). Thus, the side portion 15 of the electronic component 11 can be disposed at the focal point of the imaging means 21.
以上、本発明の実施例を説明したが、本発明は、上記した形態に限定されるものでなく、要旨を逸脱しない条件の変更等は全て本発明の適用範囲である。
例えば、電子部品の形状に特に制限はなく、リード線を備えたものでなくてもよく、保持部の溝は、電子部品の形状に応じた形状に形成させる。
また、電子部品は、外観検査装置に対して、チューブから取り出されて供給される必要はなく、テープから取り出されて供給されてもよいし、トレイから取り出されて供給されてもよい。あるいは、ボールフィーダによって電子部品を外観検査装置に供給することや、電子部品をウェハから取り外し、直接、外観検査装置に供給することも可能である。 As mentioned above, although the Example of this invention was described, this invention is not limited to an above-described form, The change of the conditions etc. which do not deviate from a summary are all the application scopes of this invention.
For example, the shape of the electronic component is not particularly limited and may not be provided with a lead wire, and the groove of the holding portion is formed in a shape corresponding to the shape of the electronic component.
Further, the electronic component does not need to be taken out from the tube and supplied to the appearance inspection apparatus, and may be taken out from the tape or supplied from the tray. Alternatively, the electronic component can be supplied to the appearance inspection apparatus by a ball feeder, or the electronic component can be removed from the wafer and directly supplied to the appearance inspection apparatus.
そして、支持部は真空圧で電子部品を吸着して保持するものに限定されず、例えば、電子部品を把持して保持するものであってもよい。
更に、プリズムや、ミラーを用いて、電子部品の側部で反射した光の進行方向を曲げて、撮像手段が電子部品の側部を撮像できるようにしてもよい。
また、回転体は円盤状に限定されないのは言うまでもなく、回転体の回転する向きや、撮像位置Ｐ、Ｑ、Ｒ、Ｓにおける電子部品の回転方向は、反時計回りであってもよい。 And a support part is not limited to what adsorb | sucks and hold | maintains an electronic component with a vacuum pressure, For example, you may hold | grip and hold an electronic component.
Furthermore, the direction of travel of the light reflected by the side part of the electronic component may be bent using a prism or a mirror so that the imaging unit can image the side part of the electronic component.
Needless to say, the rotating body is not limited to a disk shape, and the rotating direction of the rotating body and the rotating direction of the electronic components at the imaging positions P, Q, R, and S may be counterclockwise.
本発明に係る外観検査装置においては、電子部品の複数の側部をそれぞれ別個の撮像手段で撮像するので、検出精度の低下を抑制して、電子部品の複数の側部の外観を検査することが可能である。従って、電子部品を製造する産業での利用が期待できる。 In the appearance inspection apparatus according to the present invention, since the plurality of side portions of the electronic component are imaged by separate imaging means, respectively, the appearance of the plurality of side portions of the electronic component is inspected while suppressing a decrease in detection accuracy. Is possible. Therefore, utilization in the industry which manufactures an electronic component can be expected.
１０：外観検査装置、１１：電子部品、１２、１３、１４、１５：側部、１６：支持部、１７：回転体、１８、１９、２０、２１：撮像手段、２２：本体部、２３：リード線、２４：出力軸、２５：モータ、２６：ガイド、２７：上面、２８：昇降手段、３０、３１、３２、３３：角度位置調整手段、３４：ベース台、３５：スライド機構、３６：保持部、３７：回転軸、３８：モータ、３９：溝、４０：同軸照明、４１：ボックス照明、５０：外観検査装置、５１、５２、５３、５４：角度位置調整手段、５５：スライド機構 10: Appearance inspection apparatus, 11: Electronic component, 12, 13, 14, 15: Side part, 16: Support part, 17: Rotating body, 18, 19, 20, 21: Imaging means, 22: Body part, 23: Lead wire, 24: output shaft, 25: motor, 26: guide, 27: upper surface, 28: lifting means, 30, 31, 32, 33: angular position adjusting means, 34: base table, 35: slide mechanism, 36: Holding unit, 37: rotating shaft, 38: motor, 39: groove, 40: coaxial illumination, 41: box illumination, 50: visual inspection device, 51, 52, 53, 54: angular position adjusting means, 55: slide mechanism

Claims (10)

  1. 複数の電子部品の側部Ａ、Ｂ、Ｃ、Ｄを外観検査する外観検査装置において、
    前記複数の電子部品をそれぞれ保持する複数の支持部が、平面視して、間隔を空け円状に取り付けられ、鉛直の回転軸を中心に間欠的に回転して、前記複数の支持部と共に、前記複数の電子部品を、撮像位置Ｐ、Ｑ、Ｒ、Ｓに、順次、配置する回転体と、
    前記撮像位置Ｐに配置された前記電子部品の側部Ａを撮像する撮像手段αと、
    前記撮像位置Ｑに配置された前記電子部品を、鉛直の回転軸を基準にして、所定角度、回転させる角度位置調整手段ｑと、
    前記角度位置調整手段ｑによって回転された前記電子部品の側部Ｂを、前記撮像位置Ｑで撮像する撮像手段βと、
    前記撮像位置Ｒに配置された前記電子部品を、鉛直の回転軸を基準にして、所定角度、回転させる角度位置調整手段ｒと、
    前記角度位置調整手段ｒによって回転された前記電子部品の側部Ｃを、前記撮像位置Ｒで撮像する撮像手段γと、
    前記撮像位置Ｓに配置された前記電子部品を、鉛直の回転軸を基準にして、所定角度、回転させる角度位置調整手段ｓと、
    前記角度位置調整手段ｓによって回転された前記電子部品の側部Ｄを、前記撮像位置Ｓで撮像する撮像手段δとを備えることを特徴とする外観検査装置。     In the appearance inspection apparatus that visually inspects the side parts A, B, C, and D of a plurality of electronic components,
    The plurality of support parts that respectively hold the plurality of electronic components are attached in a circular shape with a space in plan view, and rotate intermittently around a vertical rotation axis, together with the plurality of support parts, A rotating body that sequentially arranges the plurality of electronic components at imaging positions P, Q, R, and S;
    Imaging means α for imaging the side A of the electronic component disposed at the imaging position P;
    Angular position adjusting means q for rotating the electronic component arranged at the imaging position Q by a predetermined angle with respect to a vertical rotation axis;
    Imaging means β for imaging the side B of the electronic component rotated by the angular position adjusting means q at the imaging position Q;
    Angular position adjustment means r for rotating the electronic component arranged at the imaging position R by a predetermined angle with respect to a vertical rotation axis;
    Imaging means γ for imaging the side portion C of the electronic component rotated by the angular position adjusting means r at the imaging position R;
    Angular position adjusting means s for rotating the electronic component arranged at the imaging position S by a predetermined angle with respect to a vertical rotation axis;
    An appearance inspection apparatus comprising: an imaging unit δ that images the side portion D of the electronic component rotated by the angular position adjusting unit s at the imaging position S.
  2. 請求項１記載の外観検査装置において、前記撮像位置Ｑに配置された前記支持部を昇降する昇降手段ｑ’と、前記撮像位置Ｒに配置された前記支持部を昇降する昇降手段ｒ’と、前記撮像位置Ｓに配置された前記支持部を昇降する昇降手段ｓ’とを更に備え、
    前記角度位置調整手段ｑ、ｒ、ｓはそれぞれ、前記電子部品を固定して回転する保持部を有し、
    前記撮像位置Ｑに配置された前記電子部品は、前記支持部と共に降下して、前記角度位置調整手段ｑの前記保持部に固定された状態となり、該角度位置調整手段ｑの該保持部と共に回転し、前記支持部によって、該角度位置調整手段ｑの該保持部から上方に持ち上げられ、前記側部Ｂが撮像され、
    前記撮像位置Ｒに配置された前記電子部品は、前記支持部と共に降下して、前記角度位置調整手段ｒの前記保持部に固定された状態となり、該角度位置調整手段ｒの該保持部と共に回転し、前記支持部によって、該角度位置調整手段ｒの該保持部から上方に持ち上げられ、前記側部Ｃが撮像され、
    前記撮像位置Ｓに配置された前記電子部品は、前記支持部と共に降下して、前記角度位置調整手段ｓの前記保持部に固定された状態となり、該角度位置調整手段ｓの該保持部と共に回転し、前記支持部によって、該角度位置調整手段ｓの該保持部から上方に持ち上げられ、前記側部Ｄが撮像されることを特徴とする外観検査装置。     The appearance inspection apparatus according to claim 1, wherein elevating means q 'for elevating and lowering the support portion arranged at the imaging position Q, elevating means r' for elevating and lowering the support portion arranged at the imaging position R, Elevating means s ′ for elevating and lowering the support portion disposed at the imaging position S;
    Each of the angular position adjusting means q, r, and s has a holding portion that fixes and rotates the electronic component,
    The electronic component arranged at the imaging position Q descends together with the support portion and is fixed to the holding portion of the angular position adjusting means q, and rotates together with the holding portion of the angular position adjusting means q. Then, the support part is lifted upward from the holding part of the angular position adjusting means q, and the side part B is imaged.
    The electronic component arranged at the imaging position R descends together with the support portion, is fixed to the holding portion of the angular position adjusting means r, and rotates together with the holding portion of the angular position adjusting means r. Then, the support part is lifted upward from the holding part of the angular position adjusting means r, and the side part C is imaged.
    The electronic component arranged at the imaging position S descends together with the support portion, is fixed to the holding portion of the angular position adjusting means s, and rotates together with the holding portion of the angular position adjusting means s. Then, the appearance inspection apparatus is characterized in that the side portion D is imaged by being lifted upward from the holding portion of the angular position adjusting means s by the support portion.
  3. 請求項２記載の外観検査装置において、前記角度位置調整手段ｑの前記保持部を、前記撮像手段βの撮像経路に沿って進退させるスライド機構Ｆと、前記角度位置調整手段ｒの前記保持部を、前記撮像手段γの撮像経路に沿って進退させるスライド機構Ｇと、前記角度位置調整手段ｓの前記保持部を、前記撮像手段δの撮像経路に沿って進退させるスライド機構Ｈとを更に備えることを特徴とする外観検査装置。 3. The appearance inspection apparatus according to claim 2, wherein the holding portion of the angular position adjusting unit q is moved forward and backward along the imaging path of the imaging unit β, and the holding unit of the angular position adjusting unit r. And a slide mechanism G that advances and retracts along the imaging path of the imaging means γ, and a slide mechanism H that advances and retracts the holding portion of the angular position adjusting means s along the imaging path of the imaging means δ. An appearance inspection apparatus characterized by
  4. 請求項２又は３記載の外観検査装置において、前記支持部は、前記電子部品の上面を吸着して保持することを特徴とする外観検査装置。 4. The appearance inspection apparatus according to claim 2, wherein the support portion sucks and holds the upper surface of the electronic component.
  5. 請求項２～４のいずれか１に記載の外観検査装置において、前記撮像位置Ｑに配置された前記電子部品は、前記支持部から解放された状態で、前記角度位置調整手段ｑの前記保持部と共に回転し、前記撮像位置Ｒに配置された前記電子部品は、前記支持部から解放された状態で、前記角度位置調整手段ｒの前記保持部と共に回転し、前記撮像位置Ｓに配置された前記電子部品は、前記支持部から解放された状態で、前記角度位置調整手段ｓの前記保持部と共に回転することを特徴とする外観検査装置。 The visual inspection apparatus according to any one of claims 2 to 4, wherein the electronic component disposed at the imaging position Q is released from the support portion and the holding portion of the angular position adjusting means q. The electronic component that rotates with the imaging position R rotates with the holding portion of the angular position adjusting means r in a state of being released from the support portion, and the electronic component that is disposed at the imaging position S. The appearance inspection apparatus, wherein the electronic component is rotated together with the holding portion of the angular position adjusting means s in a state where the electronic component is released from the support portion.
  6. 請求項１～５のいずれか１に記載の外観検査装置において、前記撮像手段αと前記撮像位置Ｐに配置された前記電子部品と前記回転体の回転中心とは、順に、平面視して、直線上に配され、前記撮像手段βと前記撮像位置Ｑに配置された前記電子部品と前記回転体の回転中心とは、順に、平面視して、直線上に配され、前記撮像手段γと前記撮像位置Ｒに配置された前記電子部品と前記回転体の回転中心とは、順に、平面視して、直線上に配され、前記撮像手段δと前記撮像位置Ｓに配置された前記電子部品と前記回転体の回転中心とは、順に、平面視して、直線上に配されることを特徴とする外観検査装置。 The visual inspection apparatus according to any one of claims 1 to 5, wherein the imaging unit α, the electronic component disposed at the imaging position P, and the rotation center of the rotating body are sequentially viewed in plan view, The image pickup means β, the electronic component arranged at the image pickup position Q, and the rotation center of the rotating body are arranged on a straight line in order in plan view, and the image pickup means γ The electronic component arranged at the imaging position R and the rotation center of the rotating body are arranged in a straight line in plan view in order, and the electronic component arranged at the imaging means δ and the imaging position S. And the rotation center of the rotating body are arranged on a straight line in plan view in order.
  7. 複数の電子部品の側部Ａ、Ｂ、Ｃ、Ｄを外観検査する外観検査装置において、
    前記複数の電子部品をそれぞれ保持する複数の支持部が、平面視して、間隔を空け円状に取り付けられ、鉛直の回転軸を中心に間欠的に回転して、前記複数の支持部と共に、前記複数の電子部品を、撮像位置Ｐ、Ｑ、Ｒ、Ｓに、順次、配置する回転体と、
    前記撮像位置Ｐに配置された前記電子部品の前記側部Ａを撮像する撮像手段αと、
    前記側部Ａが撮像された前記電子部品を、前記撮像位置Ｐで、鉛直の回転軸を基準にして、所定角度、回転させる角度位置調整手段ｐ’’と、
    前記撮像位置Ｑに配置された前記電子部品の前記側部Ｂを撮像する撮像手段βと、
    前記側部Ｂが撮像された前記電子部品を、前記撮像位置Ｑで、鉛直の回転軸を基準にして、所定角度、回転させる角度位置調整手段ｑ’’と、
    前記撮像位置Ｒに配置された前記電子部品の前記側部Ｃを撮像する撮像手段γと、
    前記側部Ｃが撮像された前記電子部品を、前記撮像位置Ｒで、鉛直の回転軸を基準にして、所定角度、回転させる角度位置調整手段ｒ’’と、
    前記撮像位置Ｓに配置された前記電子部品の前記側部Ｄを撮像する撮像手段δとを備えることを特徴とする外観検査装置。     In the appearance inspection apparatus that visually inspects the side parts A, B, C, and D of a plurality of electronic components,
    The plurality of support parts that respectively hold the plurality of electronic components are attached in a circular shape with a space in plan view, and rotate intermittently around a vertical rotation axis, together with the plurality of support parts, A rotating body that sequentially arranges the plurality of electronic components at imaging positions P, Q, R, and S;
    Imaging means α for imaging the side A of the electronic component disposed at the imaging position P;
    Angular position adjusting means p '' for rotating the electronic part imaged on the side portion A at the imaging position P by a predetermined angle with respect to a vertical rotation axis;
    Imaging means β for imaging the side B of the electronic component disposed at the imaging position Q;
    Angular position adjusting means q '' for rotating the electronic part imaged on the side portion B at the imaging position Q by a predetermined angle with respect to a vertical rotation axis;
    Imaging means γ for imaging the side part C of the electronic component disposed at the imaging position R;
    Angular position adjusting means r '' for rotating the electronic component imaged on the side portion C at the imaging position R by a predetermined angle with respect to a vertical rotation axis;
    An appearance inspection apparatus comprising: an imaging unit δ that images the side portion D of the electronic component disposed at the imaging position S.
  8. 請求項７記載の外観検査装置において、前記撮像位置Ｐに配置された前記支持部を昇降する昇降手段ｐ’と、前記撮像位置Ｑに配置された前記支持部を昇降する昇降手段ｑ’と、前記撮像位置Ｒに配置された前記支持部を昇降する昇降手段ｒ’とを更に備え、
    前記角度位置調整手段ｐ’’、ｑ’’、ｒ’’はそれぞれ、前記電子部品を固定して回転する保持部を有し、
    前記側部Ａが撮像された前記電子部品は、前記撮像位置Ｐで、前記支持部と共に降下して、前記角度位置調整手段ｐ’’の前記保持部に固定された状態となり、該角度位置調整手段ｐ’’の該保持部と共に回転し、前記支持部によって、該角度位置調整手段ｐ’’の該保持部の上方に持ち上げられ、
    前記側部Ｂが撮像された前記電子部品は、前記撮像位置Ｑで、前記支持部と共に降下して、前記角度位置調整手段ｑ’’の前記保持部に固定された状態となり、該角度位置調整手段ｑ’’の該保持部と共に回転し、前記支持部によって、該角度位置調整手段ｑ’’の該保持部の上方に持ち上げられ、
    前記側部Ｃが撮像された前記電子部品は、前記撮像位置Ｒで、前記支持部と共に降下して、前記角度位置調整手段ｒ’’の前記保持部に固定された状態となり、該角度位置調整手段ｒ’’の該保持部と共に回転し、前記支持部によって、該角度位置調整手段ｒ’’の該保持部の上方に持ち上げられることを特徴とする外観検査装置。     The appearance inspection apparatus according to claim 7, wherein elevating means p 'for elevating and lowering the support part arranged at the imaging position P, elevating means q' for elevating and lowering the support part arranged at the imaging position Q, Elevating means r ′ for elevating and lowering the support portion arranged at the imaging position R;
    Each of the angular position adjusting means p ″, q ″, r ″ has a holding part that fixes and rotates the electronic component,
    The electronic component on which the side portion A is imaged is lowered together with the support portion at the imaging position P, and is fixed to the holding portion of the angular position adjusting means p ″, and the angular position adjustment is performed. Rotating with the holding part of the means p '' and lifted above the holding part of the angular position adjusting means p '' by the support part;
    The electronic component on which the side portion B is imaged is lowered together with the support portion at the imaging position Q, and is fixed to the holding portion of the angular position adjusting means q ″, and the angular position adjustment is performed. Rotating with the holding part of the means q '' and lifted above the holding part of the angular position adjusting means q '' by the support part;
    The electronic component on which the side portion C is imaged is lowered together with the support portion at the imaging position R, and is fixed to the holding portion of the angular position adjusting means r ″, and the angular position adjustment is performed. An appearance inspection apparatus that rotates together with the holding portion of the means r ″ and is lifted above the holding portion of the angular position adjusting means r ″ by the support portion.
  9. 請求項８記載の外観検査装置において、前記角度位置調整手段ｐ’’の前記保持部を、前記撮像手段αの撮像経路に沿って進退させるスライド機構Ｅ’と、前記角度位置調整手段ｑ’’の前記保持部を、前記撮像手段βの撮像経路に沿って進退させるスライド機構Ｆ’と、前記角度位置調整手段ｒ’’の前記保持部を、前記撮像手段γの撮像経路に沿って進退させるスライド機構Ｇ’とを更に備えることを特徴とする外観検査装置。 9. The appearance inspection apparatus according to claim 8, wherein the holding portion of the angular position adjusting means p '' moves forward and backward along the imaging path of the imaging means α, and the angular position adjusting means q ''. The slide mechanism F ′ for moving the holding part of the imaging unit β along the imaging path and the holding unit of the angular position adjusting unit r ″ are advanced and retracted along the imaging path of the imaging unit γ. A visual inspection apparatus further comprising a slide mechanism G ′.
  10. 請求項８又は９記載の外観検査装置において、前記支持部は、前記電子部品の上面を吸着して保持することを特徴とする外観検査装置。 10. The appearance inspection apparatus according to claim 8, wherein the support portion sucks and holds the upper surface of the electronic component.
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