JP2019071352A - Illuminating device and method of manufacturing the same - Google Patents

Abstract

To provide an illuminating device with a frame that efficiently reflects light to the side emitted from a light emitting element toward an immediately above direction.SOLUTION: An illuminating device 10 includes: a packaged substrate 12 provided with a light emitting area 12a on an upper surface; a plurality of light emitting elements 14 packaged in the light emitting area 12a; a wire 18 electrically connecting the plurality of light emitting elements to each other; a frame body 20 provided around the light emitting area 12a, and having an inner wall surface 20a with a curved surface convex downward; and a sealing material 22 which seals the light emitting elements 14 and the wire 18 inside the frame body 20.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a lighting device mounted on various lighting fixtures and a method of manufacturing the same.

  In recent years, a lighting device using a plurality of LED elements has been adopted as a light source for lighting in place of a light bulb or a fluorescent light. Patent Document 1 describes a light emitting device that includes a mounting substrate, a plurality of LED elements, a sealing resin, and a resin frame, and is used as a lighting device. The sealing resin covers, protects and seals the LED element. The resin frame provided around the sealing resin functions as a dam material that prevents the flow of the sealing resin. Further, the inner wall surface of the resin frame functions as a reflecting surface that reflects light emitted laterally from the LED element upward.

JP 2017-38031 A

  However, the inner wall surface of the resin frame described in Patent Document 1 is a curved surface that is “convex upward”. For this reason, when light emitted laterally from the LED element is reflected by the inner wall surface of the resin frame, light may be guided not only directly above the LED element but also outward. Therefore, in the light emitting device described in Patent Document 1, the light emission intensity in the direction immediately above the LED element becomes weak. This invention is made in view of such a situation, and an object of this invention is to provide the illuminating device provided with the frame which reflects the light emission to the side direction from a light emitting element in a just overhead direction efficiently.

  The lighting apparatus according to the present invention is provided around a light emitting area, a mounting substrate having a light emitting area on the top surface, a plurality of light emitting elements mounted in the light emitting area, a wire electrically connecting the plurality of light emitting elements. It has a frame which an inner wall surface equips with a convex curved surface below, and a sealing material which seals a light emitting element and a wire inside a frame.

  A method of manufacturing a lighting device according to the present invention comprises: applying a fluid frame material around a plurality of light emitting elements of a mounting substrate on which a plurality of light emitting elements electrically connected by wires are mounted; After pressing the upper portion of the fluid frame material from above with the flat bottom surface of the pressing member, the pressing member is lifted to form at least a part of the inner wall surface of the fluid frame material into a downwardly convex curved surface It has a forming step, a curing step of curing a fluid frame material to form a frame, and a filling step of filling a sealing material inside the frame.

  In the lighting device of the present invention, the inner wall surface of the frame provided around the light emitting element is provided with a downwardly convex curved surface. Therefore, the light emitted laterally from the light emitting element can be efficiently reflected in the directly upward direction. Further, in the method of manufacturing a lighting device according to the present invention, after pressing the upper portion of the fluid frame material from above with a flat bottom, the pressing member is lifted to make the inner wall surface of the frame material convex downward. ing. For this reason, the inner wall surface of the frame can be easily formed to be a convex curved surface downward.

The top view (a) and sectional drawing (b) of the illuminating device of embodiment. The top view (a) and sectional drawing (b) which show the wiring board installation process which manufactures the illuminating device of embodiment. The top view (a) and sectional drawing (b) which show the covering material formation process of manufacturing the illuminating device of embodiment. The top view (a) and sectional drawing (b) which show the mounting * wiring process which manufactures the illuminating device of embodiment. The top view (a) and sectional drawing (b) which show the application | coating process which manufactures the illuminating device of embodiment. Sectional drawing which shows the shaping | molding process which manufactures the illuminating device of embodiment. Sectional drawing which shows the formation process and hardening process which manufacture the illuminating device of embodiment.

  Hereinafter, a lighting device of the present invention and a method of manufacturing the same will be described based on embodiments with reference to the drawings. Note that the drawings schematically represent the lighting device, components of the lighting device, and peripheral members of the lighting device, and the dimensions and dimensional ratio of these actual products are not necessarily equal to the dimensions and dimensional ratio in the drawings. I do not do it. Further, unless otherwise specified, in the present specification, for convenience, directions such as “upper” and “lower” are indicated on the basis of the direction of the lighting device shown in FIG. The overlapping description is appropriately omitted, and the same reference numeral may be given to the same member.

  Fig.1 (a) has shown the upper surface of the illuminating device 10 which concerns on embodiment of this invention. FIG. 1B shows a vertical cross section in the vicinity of the central portion of the lighting device 10. 2 to 7 show each step of the method of manufacturing the lighting device 10. FIG. The method of manufacturing the lighting device 10 includes a wiring board installation step, a covering material formation step, a mounting / wiring step, an application step, a forming step, a curing step, and a filling step. FIG. 2A is a view for explaining the wiring board installation step, and shows the upper surface of the lighting device 10. FIG.2 (b) has shown the vertical cross section of central part vicinity of the illuminating device 10 of Fig.2 (a).

  FIG. 3A is a view for explaining the covering material forming step, and shows the upper surface of the lighting device 10. FIG.3 (b) has shown the perpendicular cross section of central part vicinity of the illuminating device 10 of Fig.3 (a). FIG. 4A is a diagram for explaining the mounting and wiring process, and shows the upper surface of the lighting device 10. FIG.4 (b) has shown the perpendicular cross section of central part vicinity of the illuminating device 10 of Fig.4 (a). FIG. 5A is a view for explaining the application process, and shows the upper surface of the illumination device 10. FIG.5 (b) has shown the perpendicular cross section of central part vicinity of the illuminating device 10 of Fig.5 (a). FIG. 6 and FIG. 7 are diagrams for explaining the forming process, and show a vertical cross section of the lighting device 10. As shown in FIG. FIG. 7 is also a view for explaining the curing step, and FIG. 1 is also a view for explaining the filling step.

  As shown in FIG. 1, the lighting device 10 includes a mounting substrate 12, a plurality of light emitting elements 14, a wiring substrate 16, wires 18, a frame 20, and a sealing material 22. The mounting substrate 12 is made of aluminum or an aluminum alloy having high thermal conductivity, and is a substantially square plate-like member. A circular light emitting region 12 a is provided at the center of the upper surface of the mounting substrate 12. Forty light emitting elements 14 are mounted in the light emitting area 12 a. The arrangement and electrical connection of the 40 light emitting elements 14 will be described later.

  The number 40 of the light emitting elements 14 is an example, and the number of the plurality of light emitting elements 14 is not particularly limited. Each light emitting element 14 is a blue light emitting element of the same type and the same size provided with a gallium nitride based compound semiconductor in order to obtain white light emission for general illumination. The blue light emitting device includes a base made of sapphire glass, a diffusion layer obtained by diffusion-growing an n-type semiconductor and a p-type semiconductor on the base, and an n-type provided on the upper surface of the n-type semiconductor and the p-type semiconductor. An electrode and a p-type electrode are provided.

  As shown in FIG. 2, a wiring board 16 is provided on the top surface of the mounting board 12. The wiring board 16 is a substantially square plate-like member made of glass epoxy resin. At the center of the wiring board 16, an opening 16a which is a circular hole is provided. That is, the opening 16a opens the light emitting region 12a. The wiring substrate 16 has a first electrode 24 and a second electrode 26 on the top surface thereof. The first electrode 24 and the second electrode 26 are provided to face each other so as to sandwich the opening 16a. The first electrode 24 and the second electrode 26 are electrodes for electrically connecting the first wire 28 and the second wire 30 which supply power from the outside, respectively. The first electrode 24 and the second electrode 26 are formed on the upper surface of the wiring board 16 by, for example, gold plating.

  The first electrode 24 is a first element connection area 24 a to which the light emitting element 14 is electrically connected through the wire 18, and an outer side of the first element connection area 24 a to which the first electric wire 28 is connected. And an external connection area 24b. The first element connection region 24a has a shape of a part of an annular ring along the outside of the opening 16a. The first external connection area 24b has a shape in which one corner of a rectangle (including a square) is cut out in a fan shape consisting of a part of the opening 16a and a part of the first element connection area 24a. There is.

  The second electrode 26 is a second element connection area 26 a to which the light emitting element 14 is electrically connected through the wire 18, and a second electric wire 30 connected to the outside of the second element connection area 26 a And two external connection areas 26b. The shapes of the second element connection region 26a and the second external connection region 26b are the same as the shapes of the first element connection region 24a and the first external connection region 24b, respectively. The first electric wire 28 and the second electric wire 30 are peripheral members of the lighting device 10 and are not included in the components of the lighting device 10.

  It is preferable that the first external connection area 24 b and the second external connection area 26 b be provided at different corners of the wiring board 16. If the first external connection area 24b and the second external connection area 26b are separated, it is easy to solder the first electric wire 28 to the first external connection area 24b and the second electric wire 30 to the second external connection area 26b. It is from. In the present embodiment, the first external connection region 24 b and the second external connection region 26 b are provided at the diagonal of the wiring substrate 16 with the opening 16 a interposed therebetween. The first external connection area 24 b and the second external connection area 26 b may be provided at adjacent corners of the wiring board 16.

  The mounting substrate 12 may be made of a ceramic having high thermal conductivity, such as aluminum oxide, aluminum nitride, or silicon nitride. If the mounting substrate 12 is an insulator, installation of the wiring substrate 16 can be omitted. When the wiring substrate 16 is not installed, the first electrode 24 and the second electrode 26 may be formed directly on the outer surface of the light emitting region 12 a on the upper surface of the mounting substrate 12.

  As shown in FIG. 3, the lighting device 10 further includes a covering material 32 on the wiring substrate 16 that exposes at least a portion of the upper surface of the first electrode 24 and at least a portion of the upper surface of the second electrode 26. . The exposed part of the upper surface of the first electrode 24 is a part of the first external connection area 24b, and the exposed part of the upper surface of the second electrode 26 is a part of the second external connection area 26b. In the present embodiment, the covering material 32 is made of a photoresist resin. For this reason, the exposed part of the upper surface of the 1st electrode 24 and the 2nd electrode 26 can be formed correctly and simply.

  Further, as shown in FIG. 4, one of the n-type electrode and the p-type electrode of a certain light-emitting element 14 and the other of the n-type electrode and the p-type electrode of the adjacent light-emitting element 14 are sequentially via the wire 18. It is electrically connected. And the wire 18 arrange | positioned at the edge part of the light emission area | region 12a is electrically connected to the 1st element connection area | region 24a or the 2nd element connection area | region 26a. Thus, five light emitting groups in which eight light emitting elements 14 are connected in series are provided in parallel between the first element connection area 24 a and the second element connection area 26 a.

  As shown in FIG. 7, the frame 20 is provided around the light emitting region 12a, and the inner wall surface 20a is provided with a curved surface convex downward. Here, the curved surface in which the inner wall surface 20a of the frame 20 is convex downward is a cross section of the inner wall surface 20a of the frame 20 when the frame 20 is cut in the vertical direction from the inside to the outside of the frame 20. It says that the shape is a downward convex curve. It is preferable that most or all of the inner wall surface 20a of the frame 20 is a curved surface that is convex downward. Since the inner wall surface 20a of the frame 20 is provided with a convex curved surface downward, the light emitted from the light emitting element 14 to the side can be efficiently reflected in the upward direction.

  The frame 20 is made of, for example, a white light-shielding resin. In the present embodiment, the light emitting region 12 a is a region inside the frame 20. The frame 20 functions as a dam material for the sealing material 22 described later. For this reason, it is preferable that the height of the frame 20 be constant. It is because the height of the sealing material 22 filled after forming the frame 20 can be made uniform. If the height of the sealing material 22 is uniform, light is emitted from the lighting device 10 in a state where variation in luminance from the light emitting element 14 is suppressed.

  As shown in FIG. 1, the sealing material 22 seals the light emitting element 14 and the wire 18 inside the frame 20. The light emitting element 14 and the wire 18 are protected by the sealing material 22. The sealing material 22 is a transparent resin base material containing a predetermined amount of a fluorescent agent. For example, a sealant is prepared by mixing a fluorescent agent composed of yttrium aluminum garnet (YAG) as a raw material of fluorescent particles or a dye as a raw material of pigment particles into an epoxy resin base material or silicone resin base material. 20 can be produced.

  Below, the manufacturing method of the illuminating device 10 is demonstrated. As described above, the method of manufacturing the lighting device 10 includes the wiring substrate installation step, the covering material formation step, the mounting / wiring step, the application step, the forming step, the curing step, and the filling step. In the wiring board installation step, as shown in FIG. 2, the wiring board 16 provided with the first electrode 24 and the second electrode 26 is fixed on the mounting board 12 via an adhesive or the like.

  In the covering material forming step, as shown in FIG. 3, the wiring substrate 16 is covered with the covering material 32. At this time, a part of the first external connection area 24b and a part of the second external connection area 26b are exposed. At these exposed portions, the first wire 28 and the second wire 30 are soldered to the first outer connection area 24 b and the second outer connection area 26 b, respectively. Further, in the covering material forming step, the inner portion of the first element connection region 24a and the inner portion of the second element connection region 26a are also exposed. At these exposed portions, the wires 18 connected to the light emitting element 14 are connected to the first element connection area 24 a or the second element connection area 26 a.

  In the mounting and wiring process, as shown in FIG. 4, a plurality of light emitting elements 14 are mounted on the light emitting region 12 a of the mounting substrate 12 by die bonding paste. Thereafter, the plurality of light emitting elements 14 are connected to one another via the wires 18. In addition, the wire 18 of the edge part when the some light emitting element 14 is connected is connected to the 1st element connection area | region 24a or the 2nd element connection area | region 26a. In the coating process, as shown in FIG. 5, a fluid frame material 34 is coated around the plurality of light emitting elements 14, ie, around the light emitting area 12a. At this time, the frame material 34 is applied so as to be higher than the light emitting element 14 and the wire 18. Each of the inner wall surface 34a and the outer wall surface 34a of the applied fluid frame material 34 has a convex curved surface upward.

  In the forming step, as shown in FIG. 6, the upper portion of the fluid frame material 34 is pushed from above by the flat bottom surface 36 a of the flat pressing member 36. Thereafter, when the pressing member 36 is lifted, as shown in FIG. 7, the flowable frame material 34 is lifted together with the pressing member 36 while being attached to the bottom surface 36 a and changes in shape. Then, the frame material 34 separates from the bottom surface 36a at a certain height, and the inner wall surface 34a and the outer wall surface 34a of the frame material 34 form a downwardly convex curved surface. As described above, at least the inner wall surface 34a of the frame material 34 can be easily converted into a curved surface that is convex downward by using the pressing member 36 having the flat bottom surface 36a. In addition, as a material of the pressing member 36, resin, ceramics, metal, etc. may be mentioned, but there is no particular limitation.

  In the molding process, the fluid frame material 34 is formed so that the bottom surface 36 a is parallel to the top surface of the mounting substrate 12, that is, the bottom surface 36 a is horizontal to the mounting substrate 12 disposed horizontally. It is preferable to push the top from above. This is because the frame 20 has a fixed height, and the height of the sealing material 22 can be made uniform. Also, the pressing member may have an annular shape. It is preferable that the shape of the flat bottom of the ring-shaped pressing member matches the shape of the area to which the fluid frame material 34 is applied in the application step. This is a pressing member provided with a flat bottom having a necessary and sufficient size, and is excellent in terms of the manufacturing cost of the pressing member and the power energy of the vertical movement accompanying the weight reduction of the pressing member.

  In the curing step, as shown in FIG. 7, the fluid frame material 34 applied around the light emitting area 12 a is cured to form a frame 20. In the present embodiment, the flowable frame material 34 in which the inner wall surface 34a and the outer wall surface 34b are convex downward is hardened by leaving it to be hardened, and the inner wall surface 20a and the outer wall surface are convex downward curved surfaces. A frame 20 comprising 20b is obtained. In the filling step, as shown in FIG. 1, the inside of the frame 20 is filled with the sealing material 22. Thus, a lighting device 10 as shown in FIG. 1 is obtained. The end of the first electric wire 28 and the end of the second electric wire 30 supplied from the motherboard or the like are exposed to the exposed portion of the first external connection area 24b of the lighting device 10 and the exposed portion of the second external connection area 26b. Each is connected by soldering (not shown).

DESCRIPTION OF SYMBOLS 10 illumination apparatus 12 mounting board 12a light emission area 14 light emitting element 16 wiring board 16a opening 18 wire 20 frame 20 frame 20a inner wall surface 20b outer wall surface 22 sealing material 24 1st electrode 24a 1st element connection area 24b 1st external connection area 26 Second electrode 26a Second element connection area 26b Second external connection area 28 First electric wire 30 Second electric wire 32 Coating material 34 Frame material 34a Inner wall surface 34b Outer wall surface 36 Press member 36a Bottom surface

Claims (6)

A mounting substrate having a light emitting area on the top surface,
A plurality of light emitting elements mounted in the light emitting region;
A wire electrically connecting the plurality of light emitting elements;
A frame provided around the light emitting region, the inner wall surface having a curved surface convex downward,
A sealing material for sealing the light emitting element and the wire inside the frame;
A lighting device having In claim 1,
The illuminating device whose height of the said frame is constant. Applying a fluid frame material around the plurality of light emitting elements of the mounting substrate on which the plurality of light emitting elements electrically connected by wires are mounted;
After pressing the upper portion of the fluid frame material from above with the flat bottom surface of the pressing member, the pressing member is lifted, and at least a part of the inner wall surface of the fluid frame material is curved downward. Forming process to form
Curing the flowable frame material to form a frame;
Filling the inner side of the frame with a sealing material;
A method of manufacturing a lighting device comprising: In claim 3,
In the forming step, there is provided a method of manufacturing a lighting device in which the upper portion of the fluid frame material is pressed from above such that the flat bottom surface is parallel to the top surface of the mounting substrate. In claim 3 or 4,
The manufacturing method of the illuminating device whose said press member is ring shape. In claim 5,
The manufacturing method of the illuminating device with which the shape of the said flat bottom corresponds with the shape of the area | region which apply | coats the said fluid frame material at the said application | coating process.

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