JP2019054086A - 光電変換素子とその製造方法 - Google Patents
光電変換素子とその製造方法 Download PDFInfo
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Abstract
Description
t=(Aサイトイオン半径+Xサイトイオン半径)/{21/2×(Bサイトイオン半径+Xサイトイオン半径)}
まず、厚さが700μmのガラス基板上に、透明電極として厚さが150nmのITO膜を複数形成した。ITO膜は、光電変換部の設置数に対応させて8個形成した。すなわち、8直列のモジュールに対応するように形成した。次いで、8個のITO膜の左側のエッジ部分にそれぞれMoとAuの積層構造を有する導電層を形成した。Mo層は透明電極とAu層との間の密着層として用いた。導電層の幅は約0.5mm、厚さはMo層が50nm、Au層が300nmとした。8個のITO膜とその上の一部の領域のみに設けられた導電層とを有するガラス基板上に、透明電極側中間層として酸化ニッケルのナノ粒子(NiOxNP)の積層体を形成した。酸化ニッケルのナノ粒子の粒径は約7nmで、膜厚は約20nmである。従って、図7の断面拡大写真に示すように、透明電極側中間層はナノ粒子が2〜3層積み重なった積層膜となっている。
活性層をペロブスカイト材料から有機薄膜に変更すると共に、第1対向電極側中間層を製膜しなかったこと以外は、実施例1と同様にして光電変換素子モジュールを作製した。有機薄膜タイプの活性層は、p型半導体材料としてPTB7を用い、n型半導体材料としてPC70BMを用いたバルクヘテロ型とし、膜厚は約100nmとした。活性層インクの溶媒としてモノクロロベンゼンを用いた。塗布後に60℃で120分間乾燥させた。
導電層をMo膜とAu膜の積層構造からMo膜とAl膜とMo膜の積層構造に変更したこと以外は、実施例1と同様にして光電変換素子モジュールを作製した。スクライブツールの圧力が0.001〜0.3mN/μm2の範囲において、スクライブ走査部のほぼ全域で残渣が認められ、導電層を露出させることができなかった。直列配線抵抗は平均で83Ωであった。この値は光電変換効率に大きく悪影響を与える値である。圧力を0.4mN/μm2まで上げた場合、導電層の削れが発生してしまった。この場合、残渣は認められず、直列配線抵抗は0.2Ωであった。
スクライブ部の下地として導電層を形成せずに、ITO層上に直接酸化ニッケルのナノ粒子層を製膜したこと以外は、実施例1と同様にして光電変換素子モジュールを作製した。スクライブツールの圧力が0.001〜0.4mN/μm2の範囲において、スクライブ走査部のほぼ全域で残渣が認められ、ITO層を露出させることはできなかった。
基板をガラスからポリエチレンナフタレート(PEN)に変更したこと以外は、実施例1と同様にして光電変換素子モジュールを作製した。PEN基板の厚さは125μmである。スクライブツールの圧力が0.002〜0.2mN/μm2の範囲において、PC60BM層、ペロブスカイト層、NiOxNP層の3層がほとんど残渣なく削り取られ、導電層を露出させることができた。また、導電層まで削り取られてしまうことはなかった。直列配線抵抗は0.2Ωであった。圧力を0.001mN/μm2まで下げたところ、一部残渣が認められた。これらの結果は、全て基板がガラスの場合と同じであり、良好な結果である。圧力を0.3mN/μm2まで上げたところ、ITO層の損傷が認められた。この結果は、基板が軟質のPENであるため、圧力を高くするとPEN基板が変形し、それに伴ってPEN基板上のITOが損傷したものと解釈できる。
Claims (14)
- 透明基板と、
前記透明基板上に設けられた第1の透明電極と、前記第1の透明電極上に配置された第1の活性層と、前記第1の活性層上に配置された第1の対向電極とを備える第1の光電変換部と、
前記透明基板上に前記第1の透明電極と隣接して設けられ、かつ前記第1の透明電極と分離された第2の透明電極と、前記第2の透明電極の前記第1の透明電極と隣接する一部の領域上に形成され、貴金属を主成分とする導電層と、少なくとも前記導電層上に配置され、微粒子の積層体を有する微粒子層と、前記微粒子層上を含む前記第2の透明電極上に配置された第2の活性層と、前記第2の活性層上に配置された第2の対向電極とを備える第2の光電変換部と、
前記第2の活性層の表面から前記微粒子層を貫通して前記導電層の表面を露出させるように設けられたスクライブ溝と、前記スクライブ溝内に埋め込まれた前記第1の対向電極の一部からなる導電部とを備え、前記導電部及び前記導電層を介して前記第1の対向電極と前記第2の透明電極とを電気的に接続する接続部と
を具備する光電変換素子。 - 前記導電層は、金、銀、白金、パラジウム、イリジウム、ロジウム、オスミウム、及びルテニウムからなる群より選ばれる少なくとも1つの貴金属元素を、主成分として含む金属層である、請求項1に記載の光電変換素子。
- 前記第1の光電変換部は、前記第1の透明電極上に設けられ、微粒子の積層体を有する第1の透明電極側中間層を備え、
前記第2の光電変換部は、前記導電層上を含む前記第1の透明電極上に、前記微粒子層として設けられた第2の透明電極側中間層を備える、請求項1又は請求項2に記載の光電変換素子。 - 前記第1及び第2の透明電極側中間層は、電子輸送層又は正孔輸送層として機能する無機材料、有機材料、又は炭素材料の微粒子を有する、請求項3に記載の光電変換素子。
- 前記第1の光電変換部は、前記第1の活性層と前記第1の対向電極との間に配置された第1の対向電極側中間層を備え、
前記第2の光電変換部は、前記第2の活性層と前記第2の対向電極との間に配置された第2の対向電極側中間層を備える、請求項3又は請求項4に記載の光電変換素子。 - 前記第1の活性層の一部は、前記第1の透明電極側中間層の厚さ方向の一部に達するように設けられており、
前記第2の活性層の一部は、前記第2の透明電極側中間層の厚さ方向の一部に達するように設けられている、請求項3ないし請求項5のいずれか1項に記載の光電変換素子。 - 前記第1の対向電極と前記第2の透明電極とを電気的に接続する接続部の直列配線抵抗が5Ω以下である、請求項1ないし請求項6のいずれか1項に記載の光電変換素子。
- 前記スクライブ溝は、メカニカルスクライブ溝である、請求項1ないし請求項7のいずれか1項に記載の光電変換素子。
- 透明基板上に、第1の透明電極と、前記第1の透明電極と隣接し、かつ前記第1の透明電極と分離された第2の透明電極とを形成する工程と、
前記第2の透明電極の前記第1の透明電極と隣接する一部の領域上に、貴金属を主成分とする導電層を形成する工程と、
少なくとも前記導電層上に微粒子の積層体を有する微粒子層を形成する工程と、
前記微粒子層上を含めて前記第1の透明電極及び前記第2の透明電極を覆うように、前記透明基板上に活性層を形成する工程と、
前記活性層及び前記微粒子層を前記導電層の形成領域に沿ってスクライブし、前記活性層の表面から前記微粒子層を貫通して前記導電層の表面を露出させるスクライブ溝を形成する工程と、
前記スクライブ溝で分割された前記活性層上に、前記第1の透明電極及び前記第2の透明電極に対応させて第1の対向電極及び第2の対向電極を形成する工程とを具備し、
前記スクライブ溝内に前記第1の対向電極の一部を充填することによって、前記導電層を介して前記第1の対向電極と前記第2の透明電極とを電気的に接続する、光電変換素子の製造方法。 - 前記スクライブ溝として前記活性層及び前記微粒子層をメカニカルスクライブすることによりメカニカルスクライブ溝を形成する、請求項9に記載の光電変換素子の製造方法。
- 前記メカニカルスクライブ溝を、先端部が矩形形状のメカニカルスクライブ加工刃を用いて、前記活性層及び前記微粒子層を切削加工することにより形成する、請求項10に記載の光電変換素子の製造方法。
- 前記導電層は、金、銀、白金、パラジウム、イリジウム、ロジウム、オスミウム、及びルテニウムからなる群より選ばれる少なくとも1つの貴金属元素を、主成分として含む金属層である、請求項9ないし請求項11のいずれか1項に記載の光電変換素子の製造方法。
- 前記微粒子層として、前記第1の透明電極及び前記第2の透明電極を覆うように、透明電極側中間層を形成する、請求項9ないし請求項12のいずれか1項に記載の光電変換素子の製造方法。
- 前記透明電極側中間層は、電子輸送層又は正孔輸送層として機能する無機材料、有機材料、又は炭素材料の微粒子を有する、請求項13に記載の光電変換素子の製造方法。
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