JP2019054077A - Component mounting apparatus and component mounting method - Google Patents

Abstract

To provide a component mounting apparatus and a component mounting method capable of generally correcting the suction posture regardless of the type of component and improving the mounting quality of the component on a substrate.SOLUTION: A component mounting method includes suctioning a component PT by a mounting head 15 (step ST3), then recognizing the component PT (step ST4), determining whether the component PT can be attached to a substrate KB based on the recognition result (step ST5), mounting the component PT determined to be mountable to the substrate KB on the substrate KB by the mounting head 15 (step ST6), mounting the component PT determined to be unfit to the substrate KB on a component mounting portion 18 by the mounting head 15 (step ST7), and then resuctioning the component PT by the mounting head 15 on the basis of the recognition result obtained by recognizing the component PT in step ST4 (step ST10).SELECTED DRAWING: Figure 3

Description

  The present invention relates to a component mounting apparatus and a component mounting method in which a component is adsorbed by a mounting head and mounted on a substrate.

  The component mounting apparatus sucks a component with a nozzle provided in the mounting head, recognizes the component with a component camera, and then mounts the component on the substrate. In such a component mounting apparatus, in order to improve the mounting quality of the component on the board, it is determined whether or not it can be mounted on the board based on the result of recognizing the part by the component camera and cannot be mounted on the board. The parts determined to be discarded are not mounted on the board.

  In the above determination, the component cannot be mounted when the position where the nozzle sucks the component deviates from the original target suction position than when the component has an abnormality such as deformation. Many have been empirically known. For this reason, conventionally, instead of discarding a component that has been determined to be unmountable on the board, the component is once placed at a predetermined position, the posture of the component is corrected by the posture correction means, and then re-used by the nozzle. What adsorb | sucks is known (for example, refer the following patent document 1).

JP 2008-192904 A

  However, the posture correction means disclosed in the above-mentioned Patent Document 1 is limited in the types of components that can correct the posture due to its configuration. For this reason, the suction posture cannot be corrected universally regardless of the type of component, and there is a problem that it is difficult to improve the mounting quality of the component on the board.

  Therefore, an object of the present invention is to provide a component mounting apparatus and a component mounting method capable of correcting the suction posture in a general manner regardless of the type of component and improving the mounting quality of the component on the board.

  The component mounting apparatus according to the present invention includes a mounting head that sucks a component, a recognition unit that recognizes the component sucked by the mounting head, and a component that is mounted on the substrate based on a result of the recognition unit recognizing the component. A determination unit that determines whether or not mounting is possible; and a component placement unit on which the component is placed by the mounting head when the determination unit determines that the component cannot be mounted on the substrate. The mounting head mounts the component on the substrate when the determination unit determines that the component can be mounted on the substrate, and the determination unit mounts the component on the substrate. If it is determined that the component is not possible, the component is placed on the component placement unit, and then the recognition unit re-sucks the component based on the result of recognition of the component.

  The component mounting method of the present invention is based on a component suction step for sucking a component by a mounting head, a component recognition step for recognizing the component sucked by the mounting head, and a result of recognizing the component in the component recognition step. A determination step for determining whether or not the component can be mounted on the substrate; and a component mounting for mounting the component determined to be mountable on the substrate in the determination step on the substrate by the mounting head A component placement step of placing the component, which is determined to be unmountable on the substrate in the determination step, on the component placement portion by the mounting head, and the component placement step. A re-adsorption step of re-adsorbing the component placed on the component placement unit by the mounting head based on a result of recognizing the component in the component recognition step.

  According to the present invention, the suction posture can be corrected universally regardless of the type of component, and the mounting quality of the component on the board can be improved.

The perspective view of the component mounting apparatus in one embodiment of this invention The block diagram which shows the control system of the component mounting apparatus in one embodiment of this invention The flowchart which shows the flow of the component mounting operation | work by the component mounting apparatus in one embodiment of this invention The figure which shows an example of the state which attracted | sucked components with the mounting head with which the component mounting apparatus in one embodiment of this invention is equipped. (A) (b) The top view of the component mounting part explaining the operation | movement of the component mounting apparatus in one embodiment of this invention The figure which shows the state which re-sucked components with the mounting head with which the component mounting apparatus in one embodiment of this invention is equipped.

  Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a component mounting apparatus 1 according to an embodiment of the present invention. The component mounting apparatus 1 includes a base 11, a substrate transport unit 12, a plurality of parts feeders 13, a head moving mechanism 14, a mounting head 15, a substrate camera 16, a component camera 17, and a component placement unit 18. The part PT is mounted on the substrate KB sent from another apparatus and operates so as to be sent out to the downstream process side. Here, for convenience of explanation, the left-right direction of the component mounting apparatus 1 as viewed from the operator OP is the X-axis direction, and the front-back direction is the Y-axis direction. Also, the vertical direction is the Z-axis direction.

  In FIG. 1, the board | substrate conveyance part 12 is provided with a pair of conveyor mechanism 12a arrange | positioned before and behind the base 11. FIG. The substrate transport unit 12 transports the substrate KB in the X-axis direction by the conveyor mechanism 12a, and positions the substrate KB at a predetermined predetermined work position. Each parts feeder 13 is attached to the front side of the base 11 (the front side seen from the operator OP). Each parts feeder 13 is, for example, a tape feeder, and supplies the parts PT to the parts supply port 13K located at the end on the rear side (the back side as viewed from the operator OP).

  In FIG. 1, the head moving mechanism 14 includes a fixed table 14a, a moving table 14b, and a moving plate 14c. The fixed table 14a is fixed to the base 11 and extends in the Y-axis direction. The moving table 14b extends in the X-axis direction, and one end thereof is movable along the fixed table 14a. The moving plate 14c is movably provided along the moving table 14b.

  In FIG. 1, the mounting head 15 is attached to a moving plate 14 c of the head moving mechanism 14. The head moving mechanism 14 moves the mounting head 15 in the XY plane by moving the moving table 14b in the Y-axis direction relative to the fixed table 14a and moving the moving plate 14c relative to the moving table 14b.

  In FIG. 1, the mounting head 15 includes a plurality of nozzles 15a. Each nozzle 15a extends downward, and a component suction opening is formed at the lower end. Each nozzle 15a moves up and down in the Z-axis direction by the operation of the nozzle drive mechanism 15A, and rotates around the Z-axis.

  In FIG. 1, the mounting head 15 includes a control valve 15B. The control valve 15B is connected to a vacuum source (not shown), and generates a suction force at the component suction opening of each nozzle 15a. Each nozzle 15a sucks the component PT supplied from the parts feeder 13 to the component supply port 13K by the suction force generated in the component suction opening.

  In FIG. 1, the substrate camera 16 is attached to the mounting head 15 with the imaging optical axis directed downward. The component camera 17 is provided in a region on the near side (on the side of the worker OP) of the substrate transport unit 12 on the base 11 with the imaging optical axis directed upward. Here, the component mounting portion 18 is formed of a tray-like member and is provided on the base 11.

  In FIG. 2, the control device 20 included in the component mounting apparatus 1 controls the operation of transporting and positioning the substrate KB by the substrate transport unit 12. The control device 20 controls the operation of supplying the parts PT by the parts feeders 13. The control device 20 controls the movement of the mounting head 15 by the head moving mechanism 14. Further, the control device 20 controls the raising and lowering and rotating operations of the nozzle 15a by the nozzle driving mechanism 15A. Further, the control device 20 controls the operation of sucking the part PT of the nozzle 15a by the control valve 15B. The control device 20 controls the imaging of the board camera 16 and the component camera 17 respectively. The image data obtained by the imaging of the board camera 16 and the image data obtained by the imaging operation of the component camera 17 are respectively sent to the control device 20 for image recognition.

  In FIG. 2, the control device 20 is connected to a touch panel 21 (FIG. 1) provided in the component mounting device 1. The touch panel 21 functions as an input device for the operator OP to make a necessary input to the control device 20, and the control device 20 displays the state of the component mounting apparatus 1 on the worker OP or gives a work instruction to the worker OP. Function as an output device.

  Next, a procedure (component mounting method) of component mounting work by the component mounting apparatus 1 will be described based on the flowchart shown in FIG. The component mounting work is started when the operator OP performs a work start operation from the touch panel 21. When the operator OP performs a work start operation, first, the substrate transport unit 12 is activated to receive the substrate KB from the outside, and the substrate KB is loaded and positioned at the work position (substrate loading step of step ST1).

  When the substrate transport unit 12 positions the substrate KB at the work position, the mounting head 15 moves above the substrate KB and causes the substrate camera 16 to recognize the substrate KB (substrate recognition process in step ST2). In the recognition of the substrate KB, the substrate camera 16 recognizes the substrate mark MK (FIG. 1) provided at the corner of the substrate KB. Based on the position of the substrate mark MK recognized by the substrate camera 16, the control device 20 grasps the positional deviation of the substrate KB from the work position.

  The mounting head 15 moves above the parts feeder 13 when the substrate camera 16 recognizes the substrate KB. And the component PT which the parts feeder 13 supplies to the component supply port 13K is adsorb | sucked by the nozzle 15a (component adsorption process of step ST3).

  When the mounting head 15 sucks the component PT, the mounting head 15 moves above the component camera 17. When the part PT is positioned above the part camera 17, the part camera 17 recognizes the part PT adsorbed by the mounting head 15 from the nozzle 15a from below as a recognition means (part recognition process in step ST4). Then, the determination unit 20a (FIG. 2) of the control device 20 determines whether or not the component PT attracted by the mounting head 15 can be mounted on the substrate KB based on the result recognized by the component camera 17, that is, the component PT. It is determined whether or not it can be mounted on the substrate KB (determination step of step ST5). The component camera 17 may recognize the side surface of the component PT that the mounting head 15 has attracted by the nozzle 15a.

  In the above determination, the determination unit 20a, specifically, if the component PT recognized by the component camera 17 has a predetermined posture and positional relationship with respect to the nozzle 15a, the component PT with respect to the substrate KB. It is determined that mounting is possible. On the other hand, when the recognized component PT does not have a predetermined posture and positional relationship with respect to the nozzle 15a, it is determined that the component PT cannot be mounted on the substrate KB. In addition, when the component PT cannot be correctly recognized due to the condition of the illumination state when the component camera 17 recognizes the component PT, the posture and positional relationship of the component PT attracted by the nozzle 15a cannot be grasped. It is determined that the attachment to the substrate KB is impossible.

  Therefore, even if there is no abnormality in the component PT itself, it may be determined that the mounting to the substrate KB is impossible because the position where the nozzle 15a sucks the component PT is shifted from the original target suction position. obtain. FIG. 4 shows that the position where the mounting head 15 sucks the component PT by the nozzle 15a (actual suction position JC) is deviated from the position (target suction position MC) that should be sucked by the determination unit 20a. An example in which it is determined that mounting on the board KB is impossible is shown.

  In the determination process of step ST5, when the determination unit 20a determines that the component PT can be mounted on the substrate KB, the mounting head 15 moves above the substrate KB. Then, the mounting head 15 mounts the sucked component PT at a predetermined position (target mounting position) on the substrate KB (component mounting step of step ST6).

  On the other hand, in the determination process of step ST5, when it is determined by the determination unit 20a that the component PT cannot be mounted on the substrate KB, the mounting head 15 removes the sucked component PT from the component placement unit. 18 (part placement step of step ST7). At this time, the mounting head 15 places the component PT at a predetermined position (hereinafter referred to as a component placement position) on the component placement unit 18.

  When the mounting head 15 places the component PT at the component placement position on the component placement portion 18, the mounting head 15 moves so that the board camera 16 is positioned above the component placement position. Then, the substrate camera 16 images the component PT from above as an imaging unit (component imaging process in step ST8). When the board camera 16 images the component PT, the determination unit 20b (FIG. 2) of the control device 20 selects the component PT placed on the component placement unit 18 based on the result of the board camera 16 imaging the component PT. It is determined whether or not the mounting head 15 can perform suction (re-suction), that is, whether or not the component PT can be re-sucked by the mounting head 15 (determination step of step ST9).

  Here, when the posture of the component PT on the component placement unit 18 obtained from the captured image of the board camera 16 matches the prestored normal posture of the component PT, the determination unit 20b It is determined that the component PT can be re-sucked. On the other hand, the determination unit 20b is a component obtained from an image captured by the board camera 16 because the part PT has fallen on the part placement unit 18 or the part PT has deviated from the imaging field of view of the board camera 16. If the posture of the PT does not match the normal posture of the component PT stored in advance, it is determined that the component PT cannot be re-sucked.

  When the determination unit 20b determines that the component PT can be re-adsorbed, the mounting head 15 adsorbs (re-adsorbs) the component PT placed on the component placement unit 18 (in step ST10). (Part re-suction process), the process returns to the part recognition process in step ST4. In the re-suction of the component PT, the mounting head 15 re-sucks the component PT in consideration of the deviation amount between the nozzle 15a and the component PT calculated based on the result of the component camera 17 recognizing the component PT. To do.

  For example, as shown in FIG. 4 described above, when the actual suction position JC is deviated from the target suction position MC, the mounting head 15 uses the component placement position O defined on the component placement portion 18 and the actual suction position. The component PT is placed on the component placement portion 18 so that the position JC coincides with the plan view (FIG. 5A). If the determination unit 20b determines that the component PT cannot be re-sucked in the determination process of step ST9, the mounting head 15 moves the nozzle 15a to the target suction position MC of the component PT, and the component PT. Is adsorbed (re-adsorbed) (FIG. 5B and FIG. 6).

  On the other hand, when the determination unit 20b determines in the determination process of step ST9 that the component PT cannot be re-adsorbed, the notification control unit 20c (FIG. 2) of the control device 20 activates the touch panel 21 to operate the touch panel 21. To perform a predetermined notification operation (notification step of step ST11). Then, after the component mounting operation is stopped (step ST12 stopping step), the operator OP waits for input from the touch panel 21 (step ST13 input waiting step).

  Here, in the notification operation performed by the touch panel 21 in the notification process of step ST11, the operator OP is instructed to cancel the fall state of the component PT and to place the component PT on the component placement unit 18 in the correct posture. Is included. As described above, in the present embodiment, the touch panel 21 serves as a notification unit that performs a predetermined notification operation when the determination unit 20b determines that re-adsorption of the component PT is impossible.

  The operator OP who has received the notification in the notification process of step ST11 performs a predetermined input (resumption input) for resuming the operation from the touch panel 21 after the part PT is placed in the correct posture. If there is a restart input during the input waiting process in step ST13, the process returns to the component imaging process in step ST8, and the board camera 16 captures the part PT again. Then, after this imaging, when the determination unit 20b determines that the component PT can be re-sucked in step ST9, the mounting head 15 re-sucks the component PT (step ST10). Then, through the component recognition process (step ST4) and the determination process (step ST5) again, the mounting head 15 mounts the component PT on the substrate KB (step ST6).

  Thus, in the present embodiment, the mounting head 15 mounts the component PT on the substrate KB when the determination unit 20a determines that the component PT can be mounted on the substrate KB, and the determination unit 20a If it is determined that the component PT cannot be mounted on the board KB, the component PT is placed on the component placing unit 18 and then the component PT is re-reinstalled based on the result of the component camera 17 recognizing the component PT. The component camera 17 recognizes the component PT again (re-executes the component recognition step in step ST4).

  Since the part PT re-sucked in the re-suction process of step ST10 has a suction attitude corrected with respect to the nozzle 15a (that is, with respect to the mounting head 15), the determination through the re-part recognition process (step ST4) is performed. There is an extremely high possibility that it will be determined that the substrate KB can be mounted in the process (step ST5). Further, even in the state of illumination when the component camera 17 recognizes the component PT, if it is an accidental recognition error due to an irradiation angle or the like on the component PT, a determination step through a second component recognition step (step ST4). The possibility that it is determined in (Step ST5) that the substrate KB can be mounted is extremely high. For this reason, even if the component PT is determined to be unmountable on the substrate KB when the component PT is recognized, it can be mounted on the substrate KB.

  When the mounting head 15 mounts the component PT on the substrate KB in step ST6, it is determined whether or not all components PT to be mounted on the substrate KB have been mounted on the substrate KB (completion determining step in step ST14). . If the mounting of all the parts PT to be mounted on the board KB is not completed, the process returns to step ST3, and an example from the adsorption of the part PT to the mounting of the part PT on the board KB is shown. This process is continuously repeated. On the other hand, if the mounting of all the parts PT to the substrate KB is completed in step ST14, the substrate transport unit 12 unloads the substrate KB to the downstream process side (substrate unloading step of step ST15). Thereby, the component mounting work per board KB is completed.

  In the component mounting work according to the above flowchart, when it is determined in step ST9 that the re-adsorption of the component PT is impossible, the process proceeds from step ST11 to step ST12 and the component mounting work is stopped. However, if it is determined in step ST9 that the part PT cannot be re-adsorbed, the process may proceed from step ST11 to step ST14. In this case, the component PT placed on the component placement unit 18 is not re-adsorbed, but thereafter, after proceeding from step ST14 to step ST3, the component PT is mounted again at the target mounting position. If so, there will be no particular problem in the progress of the component mounting work.

  Even if the component PT is adsorbed in a predetermined posture and positional relationship, if there is a setting error in the lamp value of the illumination, etc., the determination unit 20a attaches the component PT to the board KB in the determination process of step ST5. Will continue to be determined to be impossible. Therefore, if the number of retries in the determination process in step ST5 is set for the part PT and it is determined that mounting on the board KB is impossible even if the determination process in step ST5 is repeated a predetermined number of times, the determination in step ST5 is performed. It may be determined that there is a problem in the process, and that effect may be notified to the operator OP.

  As described above, in the component mounting apparatus 1 (component mounting method) in the present embodiment, the component PT adsorbed by the mounting head 15 is recognized, and the mounting of the component PT on the board KB is performed based on the recognized result. Whether it is possible is determined. The component PT determined to be mountable on the substrate KB is mounted on the substrate KB as it is, and the component PT determined to be unmountable on the substrate KB is mounted on the component placement unit 18. After placement, the component PT is re-adsorbed based on the recognition result of the component PT that has already been performed, and then mounted on the substrate KB. For this reason, the suction posture with respect to the mounting head 15 can be corrected universally regardless of the type of the component PT, and the mounting quality of the component PT on the substrate KB can be improved.

  Although the embodiment of the present invention has been described so far, the present invention is not limited to the above. For example, in the above-described embodiment, the component placement unit 18 is made of a tray-like member, but the component placement unit 18 is not necessarily a tray-like member. Moreover, the component mounting part 18 may not be an independent member, for example, may be a partial region on the base 11 or the like.

  Provided are a component mounting apparatus and a component mounting method capable of correcting the suction posture in general for any kind of component and improving the mounting quality of the component on the substrate.

DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 15 Mounting head 16 Board | substrate camera (imaging means)
17 Component camera (recognition means)
18 component placement unit 20a determination unit 20b determination unit 21 touch panel (notification means)
KB board PT parts

Claims (6)

A mounting head that picks up parts,
Recognizing means for recognizing the component sucked by the mounting head;
A determination unit that determines whether or not the component can be mounted on a board based on a result of the recognition unit recognizing the component;
A component placement unit on which the component is placed by the mounting head when the determination unit determines that the component cannot be mounted on the substrate;
The mounting head mounts the component on the substrate when the determination unit determines that the component can be mounted on the substrate, and the determination unit cannot mount the component on the substrate. A component mounting apparatus that re-sucks the component based on the result of the recognition unit recognizing the component after the component is placed on the component placement unit when the component is determined to be.   An imaging unit that images the component placed on the component mounting unit by the mounting head, and a determination that determines whether the component can be re-sucked by the mounting head based on a result of the imaging unit imaging the component The component mounting apparatus according to claim 1, wherein the mounting head re-sucks the component when the determination unit determines that the component can be re-sucked.   The component mounting apparatus according to claim 2, further comprising a notification unit configured to perform a predetermined notification operation when the determination unit determines that the component cannot be re-sucked. A component adsorption process for adsorbing components with the mounting head;
A component recognition step for recognizing the component adsorbed by the mounting head;
A determination step of determining whether or not the component can be mounted on the board based on the result of recognizing the component in the component recognition step;
A component mounting step of mounting the component, which is determined to be mountable on the substrate in the determination step, to the substrate by the mounting head;
A component placement step of placing the component, which is determined to be impossible to mount the component on the substrate in the determination step, on a component placement portion by the mounting head;
A component mounting method including a re-adsorption step of re-adsorbing the component placed on the component placement unit in the component placement step by the mounting head based on a result of recognizing the component in the component recognition step.   An imaging step for imaging the component placed on the component placement unit in the component placement step, and whether or not the component can be re-sucked by the mounting head based on a result of imaging the component in the imaging step The component mounting method according to claim 4, wherein the re-suction step is executed when it is determined in the determination step that re-suction of the component is possible.   The component mounting method according to claim 5, wherein a notification step of performing a predetermined notification operation is performed when it is determined in the determination step that re-adsorption of the component is not possible.

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