JP2019050090A - バスバーアッセンブリ - Google Patents
バスバーアッセンブリ Download PDFInfo
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- JP2019050090A JP2019050090A JP2017172884A JP2017172884A JP2019050090A JP 2019050090 A JP2019050090 A JP 2019050090A JP 2017172884 A JP2017172884 A JP 2017172884A JP 2017172884 A JP2017172884 A JP 2017172884A JP 2019050090 A JP2019050090 A JP 2019050090A
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- bus bar
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- 229920005989 resin Polymers 0.000 claims abstract description 45
- 239000011347 resin Substances 0.000 claims abstract description 45
- 239000002184 metal Substances 0.000 claims abstract description 30
- 238000013459 approach Methods 0.000 claims description 3
- 238000010292 electrical insulation Methods 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 description 29
- 238000000576 coating method Methods 0.000 description 14
- 238000012986 modification Methods 0.000 description 13
- 230000004048 modification Effects 0.000 description 13
- 239000011248 coating agent Substances 0.000 description 11
- 238000000034 method Methods 0.000 description 8
- 230000000712 assembly Effects 0.000 description 5
- 238000000429 assembly Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000004070 electrodeposition Methods 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
- B05D5/12—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/14—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/08—Flat or ribbon cables
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4817—Conductive parts for containers, e.g. caps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4839—Assembly of a flat lead with an insulating support, e.g. for TAB
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09154—Bevelled, chamferred or tapered edge
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/049—Wire bonding
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Installation Of Bus-Bars (AREA)
- Insulated Conductors (AREA)
- Non-Insulated Conductors (AREA)
- Connection Of Batteries Or Terminals (AREA)
- Inverter Devices (AREA)
Abstract
【解決手段】本発明に係るバスバーアッセンブリは、導電性金属平板の第1バスバーと、導電性金属平板の第2バスバーであって、前記第1バスバーの対向側面との間に間隙が存する状態で前記第1バスバーと同一平面内に配置された第2バスバーと、前記間隙内に充填され、前記第1及び第2バスバーの対向側面を連結する絶縁性樹脂層とを有している。好ましくは、前記第1及び第2バスバーの少なくとも一方の対向側面は厚み方向一方側から他方側へ行くに従って前記第1及び第2バスバーの他方に近接する傾斜面とされる。
【選択図】図1
Description
特に、上下方向に関し小型化を図る為に前記一の平板状バスバーと前記他の平板状バスバーとの間の絶縁性樹脂の厚みを薄くすると、両バスバー間にリーク電流が流れる恐れがある。
図1(a)に、本実施の形態に係るバスバーアッセンブリ1Aの平面図を、図1(b)に、図1(a)におけるIb-Ib線に沿った断面図を、それぞれ示す。
前記第1及び第2バスバー10a、10bは、一方が正極側電極として作用し、他方が負極側電極として作用する。
前記第1製造方法は、前記第1及び第2バスバー10a、10bと同一厚みのバスバーアッセンブリ形成領域120を有する導電性金属平板100を用意する工程と、前記バスバーアッセンブリ形成領域120に、厚み方向一方側の第1表面121及び厚み方向他方側の第2表面122の間を貫通するスリット125を形成するスリット形成工程とを有している。
また、図3(a)に、図2におけるIII部拡大図を、図3(b)に、図3(a)におけるIIIb−IIIb線に沿った断面図を、それぞれ示す。
斯かる構成を備えることにより、前記スリット125を精度良く形成することができる。
これに代えて、前記塗装工程を、絶縁性樹脂の粉体を用いた静電粉体塗装によって行うことができる。
若しくは、前記スリット125内への樹脂の充填性を十分に担保できる場合には、前記塗装工程を、スプレー塗装によって行うことも可能である。
前記硬化工程は、前記塗装工程で塗装された塗料を適宜な温度で加熱処理することによって行われる。
図5に、前記第2製造方法を説明する為の断面図を示す。
詳しくは、前記導電性金属平板100に、互いに対して平行なスリット125を3本形成し、前記3本のスリット125内に充填させた絶縁性樹脂を硬化し、前記3本のスリット125を幅方向に横断するように前記導電性金属平板100を切断することによって、前記第1変形例に係るバスバーアッセンブリ1Bを容易に製造することができる。
この効果は、前記バスバーアッセンブリ1C、1DにLED等の発熱性を有する半導体素子が装着される場合に特に有効となる。
10a〜10d バスバー
11 第1表面
12 第2表面
13 対向側面
30 絶縁性樹脂層
40 間隙
Claims (4)
- 導電性金属平板の第1バスバーと、導電性金属平板の第2バスバーであって、前記第1バスバーの対向側面との間に間隙が存する状態で前記第1バスバーと同一平面内に配置された第2バスバーと、前記間隙内に充填され、前記第1及び第2バスバーの対向側面を連結する絶縁性樹脂層とを有していることを特徴とするバスバーアッセンブリ。
- 前記第1及び第2バスバーの少なくとも一方の対向側面は厚み方向一方側から他方側へ行くに従って前記第1及び第2バスバーの他方に近接する傾斜面とされていることを特徴とする請求項1に記載のバスバーアッセンブリ。
- 前記第1及び第2バスバーの双方の対向側面が厚み方向一方側から他方側へ行くに従って互いに対して近接する傾斜面とされていることを特徴とする請求項2に記載のバスバーアッセンブリ。
- 前記絶縁性樹脂層は、前記間隙に加えて前記第1及び第2バスバーの厚み方向一方側及び他方側の少なくとも一方の表面に設けられていることを特徴とする請求項1から3の何れかに記載のバスバーアッセンブリ。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017172884A JP6637003B2 (ja) | 2017-09-08 | 2017-09-08 | バスバーアッセンブリ |
PCT/JP2018/031315 WO2019049687A1 (ja) | 2017-09-08 | 2018-08-24 | バスバーアッセンブリ |
EP18854980.2A EP3675141B1 (en) | 2017-09-08 | 2018-08-24 | Bus bar assembly |
CN201880004382.1A CN109983548B (zh) | 2017-09-08 | 2018-08-24 | 母线组件 |
CN202111622273.6A CN114334233B (zh) | 2017-09-08 | 2018-08-24 | 母线组件 |
US16/642,789 US11127672B2 (en) | 2017-09-08 | 2018-08-24 | Busbar assembly |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017172884A JP6637003B2 (ja) | 2017-09-08 | 2017-09-08 | バスバーアッセンブリ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019050090A true JP2019050090A (ja) | 2019-03-28 |
JP6637003B2 JP6637003B2 (ja) | 2020-01-29 |
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ID=65634776
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017172884A Active JP6637003B2 (ja) | 2017-09-08 | 2017-09-08 | バスバーアッセンブリ |
Country Status (5)
Country | Link |
---|---|
US (1) | US11127672B2 (ja) |
EP (1) | EP3675141B1 (ja) |
JP (1) | JP6637003B2 (ja) |
CN (2) | CN114334233B (ja) |
WO (1) | WO2019049687A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US12106869B2 (en) | 2019-09-27 | 2024-10-01 | Suncall Corporation | Busbar assembly and method for manufacturing the same |
US12126158B2 (en) | 2019-06-25 | 2024-10-22 | Suncall Corporation | Busbar assembly and method for manufacturing the same |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7271333B2 (ja) * | 2019-06-25 | 2023-05-11 | サンコール株式会社 | バスバーアッセンブリ及びその製造方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1087300A2 (en) * | 1999-09-23 | 2001-03-28 | TVM Group, Inc. | Computer bus bar assembly |
JP2007215340A (ja) * | 2006-02-10 | 2007-08-23 | Denso Corp | 積層型ブスバーアセンブリ及びそのモールド装置 |
WO2012053580A1 (ja) * | 2010-10-20 | 2012-04-26 | 矢崎総業株式会社 | メタルコア基板及び該メタルコア基板を用いた電気接続箱 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7659531B2 (en) * | 2007-04-13 | 2010-02-09 | Fairchild Semiconductor Corporation | Optical coupler package |
US20090001404A1 (en) * | 2007-06-29 | 2009-01-01 | Ohata Takafumi | Semiconductor light emitting device, process for producing the same, and led illuminating apparatus using the same |
JP5217800B2 (ja) * | 2008-09-03 | 2013-06-19 | 日亜化学工業株式会社 | 発光装置、樹脂パッケージ、樹脂成形体並びにこれらの製造方法 |
KR100888236B1 (ko) * | 2008-11-18 | 2009-03-12 | 서울반도체 주식회사 | 발광 장치 |
JP2011035264A (ja) * | 2009-08-04 | 2011-02-17 | Zeniya Sangyo Kk | 発光素子用パッケージ及び発光素子の製造方法 |
TWI392066B (zh) * | 2009-12-28 | 2013-04-01 | 矽品精密工業股份有限公司 | 封裝結構及其製法 |
KR101762348B1 (ko) * | 2010-06-11 | 2017-07-27 | 가부시키가이샤 아데카 | 규소 함유 경화성 조성물, 그 규소 함유 경화성 조성물의 경화물 및 그 규소 함유 경화성 조성물로 형성되는 리드 프레임 기판 |
JP2012023281A (ja) * | 2010-07-16 | 2012-02-02 | Nitto Denko Corp | 発光装置の製法 |
US8933548B2 (en) * | 2010-11-02 | 2015-01-13 | Dai Nippon Printing Co., Ltd. | Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements |
KR101825473B1 (ko) * | 2011-02-16 | 2018-02-05 | 삼성전자 주식회사 | 발광소자 패키지 및 그 제조방법 |
JP5690683B2 (ja) | 2011-07-22 | 2015-03-25 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP6050975B2 (ja) * | 2012-03-27 | 2016-12-21 | 新光電気工業株式会社 | リードフレーム、半導体装置及びリードフレームの製造方法 |
JP2013239539A (ja) * | 2012-05-14 | 2013-11-28 | Shin Etsu Chem Co Ltd | 光半導体装置用基板とその製造方法、及び光半導体装置とその製造方法 |
US9313897B2 (en) * | 2012-09-14 | 2016-04-12 | Infineon Technologies Ag | Method for electrophoretically depositing a film on an electronic assembly |
CN103682018B (zh) * | 2012-09-21 | 2017-04-26 | 展晶科技(深圳)有限公司 | 发光二极管及其制造方法 |
CN104937326B (zh) * | 2013-01-25 | 2018-10-26 | 亮锐控股有限公司 | 照明组件和用于制造照明组件的方法 |
DE102013202551A1 (de) * | 2013-02-18 | 2014-08-21 | Heraeus Materials Technologies GmbH & Co. KG | Verfahren zur Herstellung eines Substrats mit einer Kavität |
CN103490001A (zh) * | 2013-07-01 | 2014-01-01 | 宁波康强电子股份有限公司 | 一种离散型emc封装的led引线框架 |
DE102014111483A1 (de) * | 2014-08-12 | 2016-02-18 | Osram Opto Semiconductors Gmbh | Herstellung eines optoelektronischen Bauelements und optoelektronisches Bauelement |
JP6765804B2 (ja) * | 2014-11-28 | 2020-10-07 | エルジー イノテック カンパニー リミテッド | 発光素子パッケージ |
JP6487769B2 (ja) | 2015-05-18 | 2019-03-20 | サンコール株式会社 | 積層バスバーユニットの製造方法 |
DE102015109953A1 (de) * | 2015-06-22 | 2016-12-22 | Osram Opto Semiconductors Gmbh | Herstellung elektronischer Bauelemente |
-
2017
- 2017-09-08 JP JP2017172884A patent/JP6637003B2/ja active Active
-
2018
- 2018-08-24 CN CN202111622273.6A patent/CN114334233B/zh active Active
- 2018-08-24 US US16/642,789 patent/US11127672B2/en active Active
- 2018-08-24 EP EP18854980.2A patent/EP3675141B1/en active Active
- 2018-08-24 WO PCT/JP2018/031315 patent/WO2019049687A1/ja unknown
- 2018-08-24 CN CN201880004382.1A patent/CN109983548B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1087300A2 (en) * | 1999-09-23 | 2001-03-28 | TVM Group, Inc. | Computer bus bar assembly |
JP2007215340A (ja) * | 2006-02-10 | 2007-08-23 | Denso Corp | 積層型ブスバーアセンブリ及びそのモールド装置 |
WO2012053580A1 (ja) * | 2010-10-20 | 2012-04-26 | 矢崎総業株式会社 | メタルコア基板及び該メタルコア基板を用いた電気接続箱 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US12126158B2 (en) | 2019-06-25 | 2024-10-22 | Suncall Corporation | Busbar assembly and method for manufacturing the same |
US12106869B2 (en) | 2019-09-27 | 2024-10-01 | Suncall Corporation | Busbar assembly and method for manufacturing the same |
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CN109983548B (zh) | 2022-01-07 |
EP3675141B1 (en) | 2023-11-29 |
EP3675141A4 (en) | 2021-04-07 |
CN114334233A (zh) | 2022-04-12 |
US11127672B2 (en) | 2021-09-21 |
CN109983548A (zh) | 2019-07-05 |
JP6637003B2 (ja) | 2020-01-29 |
US20200258833A1 (en) | 2020-08-13 |
CN114334233B (zh) | 2024-06-11 |
WO2019049687A1 (ja) | 2019-03-14 |
EP3675141A1 (en) | 2020-07-01 |
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