JP2019046995A - 固体撮像装置 - Google Patents
固体撮像装置 Download PDFInfo
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- JP2019046995A JP2019046995A JP2017169466A JP2017169466A JP2019046995A JP 2019046995 A JP2019046995 A JP 2019046995A JP 2017169466 A JP2017169466 A JP 2017169466A JP 2017169466 A JP2017169466 A JP 2017169466A JP 2019046995 A JP2019046995 A JP 2019046995A
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- 239000007787 solid Substances 0.000 title abstract 3
- 239000012535 impurity Substances 0.000 claims abstract description 145
- 238000006243 chemical reaction Methods 0.000 claims abstract description 33
- 238000003384 imaging method Methods 0.000 claims description 32
- 239000010410 layer Substances 0.000 description 36
- 239000002344 surface layer Substances 0.000 description 35
- 239000004065 semiconductor Substances 0.000 description 32
- 238000004088 simulation Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 238000005259 measurement Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 230000007423 decrease Effects 0.000 description 4
- 238000002955 isolation Methods 0.000 description 3
- 238000011144 upstream manufacturing Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 206010047571 Visual impairment Diseases 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/148—Charge coupled imagers
- H01L27/14831—Area CCD imagers
- H01L27/14843—Interline transfer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
- H01L27/14605—Structural or functional details relating to the position of the pixel elements, e.g. smaller pixel elements in the center of the imager compared to pixel elements at the periphery
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
- H01L27/14607—Geometry of the photosensitive area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/148—Charge coupled imagers
- H01L27/14806—Structural or functional details thereof
- H01L27/14812—Special geometry or disposition of pixel-elements, address lines or gate-electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/148—Charge coupled imagers
- H01L27/14831—Area CCD imagers
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
- H04N25/73—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors using interline transfer [IT]
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
Description
Claims (5)
- 第一方向に並んだ複数の光電変換部と、
対応する前記光電変換部と前記第一方向に交差する第二方向で並び、かつ、対応する前記光電変換部で発生した電荷を転送する転送部と、を備え、
前記光電変換部は、入射光に応じて電荷を発生する光感応領域を有し、
前記光感応領域は、第一不純物領域と、前記第一不純物領域に比して不純物濃度が高い第二不純物領域と、を含み、
前記第二不純物領域は、前記光感応領域において、前記第二方向で前記転送部とは反対側に位置する一端又は前記一端の近傍から前記転送部側に位置する他端まで設けられており、
前記第二不純物領域の平面視での形状は、前記光感応領域における前記第二方向に沿った中心線に対して線対称であり、
前記第二不純物領域の前記第一方向での幅は、前記一端から前記他端に向かう転送方向で増加しており、
前記光感応領域を前記第二方向にn分割(nは2以上の整数)した各区間における前記第二不純物領域の前記幅の増加率は、前記転送方向で次第に大きくなっている、固体撮像装置。 - 前記各区間における前記第二不純物領域の前記幅は、隣り合う前記各区間における前記光感応領域の電位差が一定となるように設定されている、請求項1に記載の固体撮像装置。
- 前記各区間は、前記光感応領域を前記第二方向にn等分(nは2以上の整数)した各区間である、請求項1又は2に記載の固体撮像装置。
- 前記各区間は、前記光感応領域を、前記第二方向での幅が前記転送方向で次第に狭くなるように分割した各区間である、請求項1又は2に記載の固体撮像装置。
- 前記各区間のうち前記他端に最も近い区間における前記第二不純物領域の前記幅の増加率は、前記他端側で大きくなるよう変化している、請求項1〜4の何れか一項に記載の固体撮像装置。
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017169466A JP2019046995A (ja) | 2017-09-04 | 2017-09-04 | 固体撮像装置 |
EP18850934.3A EP3680937A4 (en) | 2017-09-04 | 2018-07-19 | SOLID IMAGING DEVICE |
CN201880057247.3A CN111095562A (zh) | 2017-09-04 | 2018-07-19 | 固体摄像装置 |
KR1020207008856A KR102495285B1 (ko) | 2017-09-04 | 2018-07-19 | 고체 촬상 장치 |
US16/643,110 US11942506B2 (en) | 2017-09-04 | 2018-07-19 | Solid state imaging device |
PCT/JP2018/027111 WO2019044246A1 (ja) | 2017-09-04 | 2018-07-19 | 固体撮像装置 |
TW107128772A TWI829645B (zh) | 2017-09-04 | 2018-08-17 | 固體攝像裝置 |
JP2023115747A JP2023139087A (ja) | 2017-09-04 | 2023-07-14 | 固体撮像装置 |
US18/428,396 US20240170528A1 (en) | 2017-09-04 | 2024-01-31 | Solid state imaging device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017169466A JP2019046995A (ja) | 2017-09-04 | 2017-09-04 | 固体撮像装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023115747A Division JP2023139087A (ja) | 2017-09-04 | 2023-07-14 | 固体撮像装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2019046995A true JP2019046995A (ja) | 2019-03-22 |
Family
ID=65525373
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017169466A Pending JP2019046995A (ja) | 2017-09-04 | 2017-09-04 | 固体撮像装置 |
JP2023115747A Pending JP2023139087A (ja) | 2017-09-04 | 2023-07-14 | 固体撮像装置 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023115747A Pending JP2023139087A (ja) | 2017-09-04 | 2023-07-14 | 固体撮像装置 |
Country Status (7)
Country | Link |
---|---|
US (2) | US11942506B2 (ja) |
EP (1) | EP3680937A4 (ja) |
JP (2) | JP2019046995A (ja) |
KR (1) | KR102495285B1 (ja) |
CN (1) | CN111095562A (ja) |
TW (1) | TWI829645B (ja) |
WO (1) | WO2019044246A1 (ja) |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002231926A (ja) * | 2001-02-01 | 2002-08-16 | Fuji Photo Film Co Ltd | ラインセンサおよびそれを用いた放射線画像情報読取装置 |
JP2009070902A (ja) * | 2007-09-11 | 2009-04-02 | Fujifilm Corp | 撮像素子及び撮像装置 |
JP2010040594A (ja) * | 2008-07-31 | 2010-02-18 | National Univ Corp Shizuoka Univ | 高速電荷転送フォトダイオード、ロックインピクセル及び固体撮像装置 |
JP2010103197A (ja) * | 2008-10-21 | 2010-05-06 | Sharp Corp | 固体撮像装置及び電子情報機器 |
JP2011054596A (ja) * | 2009-08-31 | 2011-03-17 | Renesas Electronics Corp | Ccdイメージセンサ |
JP2013172136A (ja) * | 2012-02-23 | 2013-09-02 | Sharp Corp | 固体撮像素子及び固体撮像素子の製造方法 |
JP2015090907A (ja) * | 2013-11-05 | 2015-05-11 | 浜松ホトニクス株式会社 | リニアイメージセンサ |
JP2015090906A (ja) * | 2013-11-05 | 2015-05-11 | 浜松ホトニクス株式会社 | 電荷結合素子及びその製造方法、並びに固体撮像装置 |
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2017
- 2017-09-04 JP JP2017169466A patent/JP2019046995A/ja active Pending
-
2018
- 2018-07-19 US US16/643,110 patent/US11942506B2/en active Active
- 2018-07-19 WO PCT/JP2018/027111 patent/WO2019044246A1/ja unknown
- 2018-07-19 KR KR1020207008856A patent/KR102495285B1/ko active IP Right Grant
- 2018-07-19 CN CN201880057247.3A patent/CN111095562A/zh active Pending
- 2018-07-19 EP EP18850934.3A patent/EP3680937A4/en active Pending
- 2018-08-17 TW TW107128772A patent/TWI829645B/zh active
-
2023
- 2023-07-14 JP JP2023115747A patent/JP2023139087A/ja active Pending
-
2024
- 2024-01-31 US US18/428,396 patent/US20240170528A1/en active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002231926A (ja) * | 2001-02-01 | 2002-08-16 | Fuji Photo Film Co Ltd | ラインセンサおよびそれを用いた放射線画像情報読取装置 |
JP2009070902A (ja) * | 2007-09-11 | 2009-04-02 | Fujifilm Corp | 撮像素子及び撮像装置 |
JP2010040594A (ja) * | 2008-07-31 | 2010-02-18 | National Univ Corp Shizuoka Univ | 高速電荷転送フォトダイオード、ロックインピクセル及び固体撮像装置 |
JP2010103197A (ja) * | 2008-10-21 | 2010-05-06 | Sharp Corp | 固体撮像装置及び電子情報機器 |
JP2011054596A (ja) * | 2009-08-31 | 2011-03-17 | Renesas Electronics Corp | Ccdイメージセンサ |
JP2013172136A (ja) * | 2012-02-23 | 2013-09-02 | Sharp Corp | 固体撮像素子及び固体撮像素子の製造方法 |
JP2015090907A (ja) * | 2013-11-05 | 2015-05-11 | 浜松ホトニクス株式会社 | リニアイメージセンサ |
JP2015090906A (ja) * | 2013-11-05 | 2015-05-11 | 浜松ホトニクス株式会社 | 電荷結合素子及びその製造方法、並びに固体撮像装置 |
Also Published As
Publication number | Publication date |
---|---|
EP3680937A4 (en) | 2021-05-05 |
TW201921664A (zh) | 2019-06-01 |
EP3680937A1 (en) | 2020-07-15 |
CN111095562A (zh) | 2020-05-01 |
KR20200043466A (ko) | 2020-04-27 |
US20240170528A1 (en) | 2024-05-23 |
US20200212098A1 (en) | 2020-07-02 |
JP2023139087A (ja) | 2023-10-03 |
KR102495285B1 (ko) | 2023-02-06 |
TWI829645B (zh) | 2024-01-21 |
US11942506B2 (en) | 2024-03-26 |
WO2019044246A1 (ja) | 2019-03-07 |
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