JP2019019217A5 - - Google Patents
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- Publication number
- JP2019019217A5 JP2019019217A5 JP2017138507A JP2017138507A JP2019019217A5 JP 2019019217 A5 JP2019019217 A5 JP 2019019217A5 JP 2017138507 A JP2017138507 A JP 2017138507A JP 2017138507 A JP2017138507 A JP 2017138507A JP 2019019217 A5 JP2019019217 A5 JP 2019019217A5
- Authority
- JP
- Japan
- Prior art keywords
- component
- following
- diaminodiphenylmethane
- phenol
- manufactured
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- CMLFRMDBDNHMRA-UHFFFAOYSA-N 2h-1,2-benzoxazine Chemical compound C1=CC=C2C=CNOC2=C1 CMLFRMDBDNHMRA-UHFFFAOYSA-N 0.000 description 1
- -1 benzoxazine compound Chemical class 0.000 description 1
- LGEVRIFLFCVXDI-UHFFFAOYSA-N diphenylmethanediamine;phenol Chemical compound OC1=CC=CC=C1.C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 LGEVRIFLFCVXDI-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017138507A JP6946088B2 (ja) | 2017-07-14 | 2017-07-14 | 硬化樹脂用組成物、該組成物の硬化物、該組成物および該硬化物の製造方法、ならびに半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017138507A JP6946088B2 (ja) | 2017-07-14 | 2017-07-14 | 硬化樹脂用組成物、該組成物の硬化物、該組成物および該硬化物の製造方法、ならびに半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019019217A JP2019019217A (ja) | 2019-02-07 |
| JP2019019217A5 true JP2019019217A5 (https=) | 2020-09-10 |
| JP6946088B2 JP6946088B2 (ja) | 2021-10-06 |
Family
ID=65355350
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017138507A Active JP6946088B2 (ja) | 2017-07-14 | 2017-07-14 | 硬化樹脂用組成物、該組成物の硬化物、該組成物および該硬化物の製造方法、ならびに半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6946088B2 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022118627A (ja) * | 2021-02-02 | 2022-08-15 | Ｅｎｅｏｓ株式会社 | 硬化樹脂用組成物、該組成物の硬化物、該組成物および該硬化物の製造方法、ならびに半導体装置 |
| TW202519571A (zh) * | 2023-10-31 | 2025-05-16 | 日商拓自達電線股份有限公司 | 導電性組成物 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014148562A (ja) * | 2013-01-31 | 2014-08-21 | Nippon Zeon Co Ltd | 硬化性樹脂組成物、フィルム、プリプレグ、及び硬化物 |
| US9850375B2 (en) * | 2013-08-23 | 2017-12-26 | Elite Electronic Material (Kunshan) Co. Ltd. | Resin composition, copper clad laminate and printed circuit board using same |
| JP2016060809A (ja) * | 2014-09-17 | 2016-04-25 | 日本ゼオン株式会社 | 硬化性樹脂組成物、硬化性樹脂成形体、硬化物、積層体、複合体および多層プリント配線板 |
| JP6460899B2 (ja) * | 2015-04-24 | 2019-01-30 | 積水化学工業株式会社 | 半導体接合用接着剤 |
| PT3450499T (pt) * | 2016-04-28 | 2024-01-12 | Jxtg Nippon Oil & Energy Corp | Composição de resina curável e produto curado obtido a partir da mesma |
| US20200095422A1 (en) * | 2016-12-09 | 2020-03-26 | Jxtg Nippon Oil & Energy Corporation | Curable resin composition, cured product obtained from the same, method for hardening the same, and semiconductor device |
| JP7306987B2 (ja) * | 2017-03-31 | 2023-07-11 | Ｅｎｅｏｓ株式会社 | 硬化樹脂用組成物、該組成物の硬化物、該組成物および該硬化物の製造方法、ならびに半導体装置 |
-
2017
- 2017-07-14 JP JP2017138507A patent/JP6946088B2/ja active Active
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