JP2019014018A - Processing device - Google Patents

Abstract

To make it possible to measure the thickness of a work-piece without using a measuring device independently of a processing device.SOLUTION: An image of a subject and scale 810 indicating a raising and lowering range of a condenser lens composing imaging means are displayed in a scale display area 81 of a touch panel 8, the condenser lens is raised or lowered according to an operator instruction on the scale 810, thereby focusing the condenser lens. The height position of the condenser lens at the time is displayed in a height position display area 812 of the touch panel 8 and the height of the upper surface of the subject is measured. Accordingly, the thickness of a work-piece can be measured, eliminating the need to provide a measuring device independently of a processing device.SELECTED DRAWING: Figure 6

Description

  The present invention relates to a processing apparatus that processes a workpiece held on a holding table.

  In a processing apparatus that cuts or grinds a workpiece held on a holding table, the position of the tool is controlled on the basis of the holding surface of the holding table to perform processing. For example, in a cutting apparatus that cuts a workpiece by cutting a cutting blade that rotates at a high speed into the workpiece, the position of the cutting blade when the tip of the cutting blade contacts the holding surface of the holding table (hereinafter referred to as “reference position”). .) And the value of the thickness of the workpiece held on the holding surface, and the depth of cut from the position displaced from the reference position by the thickness of the workpiece is adjusted. Thus, a cutting blade is cut into the workpiece to a desired depth to perform cutting. If the workpiece is taped, the cutting device stores the value obtained by adding the thickness of the workpiece and the tape thickness, and the cutting depth is such that the cutting blade cuts slightly into the tape. Is adjusted (for example, refer to Patent Document 1).

  Also in a laser processing apparatus that performs laser processing by irradiating a workpiece held on a holding surface of a holding table with a laser beam, the height position of the holding surface and the thickness value of the workpiece are stored. Thus, the laser beam can be focused and processed at a desired height position of the workpiece. Also in a grinding apparatus that grinds an exposed surface by bringing a rotating grinding wheel into contact with the exposed surface of the workpiece held on the holding surface of the holding table, the height position of the holding surface and the thickness of the workpiece By storing this value, the exposed surface can be ground by a desired amount.

JP, 2014-201452, A

  However, since the thickness of the workpiece or the thickness of the workpiece plus the thickness of the tape is measured using a measuring device other than the processing device, the operator uses the measuring device to measure the thickness. The recorded value is recorded on paper or the like, and the recorded value is manually input to the processing apparatus. Therefore, an incorrect value may be input to the processing apparatus, and in this case, there is a problem that desired processing cannot be performed.

  The present invention has been considered in view of such a problem, and an object of the present invention is to be able to measure the thickness of a workpiece without using a measuring device different from the processing device.

The present invention relates to a holding table for holding a workpiece, a processing means for processing the workpiece held by the holding table, an imaging means for imaging the holding table and the upper surface of the workpiece, and at least the imaging means. And a touch panel used to input at least processing conditions. The imaging means collects illumination that emits illumination light that illuminates an object to be imaged, and reflected light of the illumination light. A concentrator that illuminates, an imaging unit that images the reflected light, and an elevating unit that raises and lowers the condenser to focus the imaging unit on the upper surface of the object to be imaged. Captured image display means for displaying an image picked up by the image pickup means in a picked-up image display area of the touch panel, and a scale table for displaying a scale with a scale indicating an ascending / descending range of the condenser in the scale display area of the touch panel A height position display means for displaying a height position value of the condenser on the scale in a height position display area of the touch panel, and the lifting means is driven in accordance with an instruction on the scale. Elevating drive means for raising and lowering the condenser, and the imaging means images the workpiece while the imaging unit is focused on the upper surface of the imaging object, and the height of the condenser The position is displayed in the height position display area, and the upper surface height of the object to be imaged is measured.
The processing apparatus includes storage means for storing a value displayed in the height position display area, and numerical value transfer means for transferring the value stored in the storage means to a setting area for setting processing conditions. It is desirable.
In addition, the processing apparatus includes a storage unit that stores a value displayed in the height position display area, a calculation unit that calculates the thickness of the workpiece from the value stored in the storage unit, and the storage unit It is desirable to include a second numerical value transfer means for transferring the stored value or the value calculated by the calculation means to a setting area for setting the machining conditions.

The processing apparatus according to the present invention can focus the imaging unit by simply performing an operation such as shifting the position indicated by the operator touching with a finger on the scale displayed on the touch panel. Since the value of the time scale is displayed on the touch panel, the height of the upper surface of the object to be imaged can be measured in the processing apparatus, and thereby the thickness of the object to be processed can be measured. Therefore, a measuring device different from the processing device is not necessary.
In addition, the value displayed in the height position display area is stored in the storage means, and the value is transferred to the input area for setting the processing conditions by the numerical value transfer means, whereby the value of the thickness of the workpiece is obtained. Since it is no longer necessary to make a note and manually input, it is possible to eliminate input errors and prevent errors in processing conditions.
Further, the value displayed in the height position display area is stored in the storage means, the calculation means calculates the thickness of the workpiece from the value, and the second numerical value transfer means calculates the value calculated by the calculation means. By transferring to the setting area for setting machining conditions, it is not necessary to write down the thickness value of the work piece and manually enter it, eliminating input errors and preventing errors in machining conditions. can do.

It is a partially broken perspective view which shows an example of a processing apparatus. It is sectional drawing which shows the state which match | combined the focus of the imaging part with the upper surface of the tape. It is a functional block diagram which shows a control means and a memory | storage means. It is explanatory drawing which shows the state which measures the height position of the upper surface of a tape in the thickness measurement screen displayed on the touch panel. It is explanatory drawing which shows the example of the device data input screen displayed on the touch panel. It is explanatory drawing which shows the state which measures the height position of the upper surface of a wafer in the thickness measurement screen displayed on the touch panel. It is sectional drawing which shows the state which match | combined the focus of the imaging part with the upper surface of the wafer. It is a front view which shows the example of the state which a blade cuts into a workpiece. It is a front view which shows another example of the state in which a blade cuts into a workpiece. It is explanatory drawing which shows another example of the device data input screen displayed on the touch panel.

  A cutting apparatus 1 shown in FIG. 1 is an apparatus that cuts a workpiece held on a holding table 2 with a cutting means 3 that is a processing means provided inside a processing chamber 10.

  A workpiece to be held on the holding table 2, for example, a wafer W, has a tape T attached to the back surface, and a ring-shaped frame F attached to the outer peripheral portion of the tape T. It will be in the state supported by F. Hereinafter, the wafer W supported by the frame F via the tape T is referred to as a wafer unit U.

  The holding table 2 includes a suction holding unit 21 that sucks and holds the wafer W, a frame body 22 that supports the suction holding unit 21, and a fixing unit 23 that is attached to the frame body 22 and fixes the frame F. The holding table 2 is movable in the X axis direction.

  The cutting means 3 includes a blade 30 attached to the tip of a spindle having an axis in the Y-axis direction, and an image pickup means 31 for picking up an image of the wafer W and detecting a line to be cut, and the rotating blade 30. Is a processing means for cutting the wafer W by cutting it into the wafer W.

  The cutting means 3 is sent in the Y-axis direction by the index feeding means 4 and is sent in the Z-axis direction by the cutting feed means 5.

  When the pulse motor (not shown) rotates the ball screw 40, the index feed means 4 moves in the Y axis direction with the moving plate 41 guided by the guide rail 42, and accordingly moves the cutting means 3 in the Y axis direction.

  When the pulse motor 50 rotates a ball screw (not shown), the cutting and feeding means 5 moves up and down in the Z-axis direction while the elevating plate 51 is guided by the guide rail 52, and as a result, the cutting means 3 moves up and down in the Z-axis direction.

  A cleaning means 6 for cleaning the wafer W after cutting is disposed at the rear part of the cutting apparatus 1. The cleaning means 6 includes a spinner table 60 that holds and rotates the wafer unit U, and a frame fixing portion 61 that fixes the frame F is disposed around the spinner table 60. Although not shown, a nozzle for ejecting the cleaning liquid is also provided above the spinner table 60.

On the front surface of the cutting apparatus 1, a touch panel 8 used for inputting processing conditions, displaying images, and the like is provided. Inside the cutting device 1, there is provided a control means 7 that performs display processing on the touch panel 8, processing information input from the touch panel 8, and the like. The control means 7 includes at least a CPU and a memory.
Yes.

  As illustrated in FIG. 2, the imaging unit 31 includes an illumination 311 that emits illumination light that illuminates an object to be imaged, a condenser lens 312 that is a condenser that collects reflected light of the illumination light, and reflection of illumination light. An imaging unit 310 that images light and an elevating unit 313 that raises and lowers the condenser lens 312 to focus on the object to be imaged are provided. The imaging unit 310 receives the reflected light of the illumination light and photoelectrically converts it to form a captured image and sends it to the control means 7.

  Although not shown, the elevating means 313 includes, for example, a ball screw extending in the Z-axis direction, a pulse motor that rotates the ball screw, and a lens support that is screwed into the ball screw and supports the condenser lens 312. The rotation angle of the pulse motor is detected by the encoder 314, and the rotation angle information of the pulse motor is transferred from the encoder 314 to the control means 7. The control means 7 grasps the height position of the condenser lens 312 in the Z-axis direction based on the rotation angle information.

  As shown in FIG. 2, the upper surface 22 a of the frame body 22 constituting the holding table 2 is formed flush with the upper surface 21 a of the suction holding unit 21. Therefore, when the imaging unit 31 images the upper surface 22 a of the frame body 22, the height position of the upper surface 21 a of the suction holding unit 21 as viewed from the elevating unit 313 can be grasped.

  As illustrated in FIG. 3, the control unit 7 includes a captured image display unit 70 that displays an image captured by the imaging unit 31 on the touch panel 8. As shown in FIG. 4, the captured image display unit 70 displays the image captured by the imaging unit 31 in the captured image display area 80 on the thickness measurement screen 8 a of the touch panel 8. This thickness measurement screen 8a is a screen display for measuring the thickness of the tape T as preparation before starting the cutting of the wafer W.

  The control means 7 includes a scale display means 71 (see FIG. 3) for displaying the ascending / descending range of the condenser lens 312 shown in FIG. 2 on the scale display area 81 of the touch panel 8 as a scale 810 with a scale shown in FIG. Yes. In the scale display area 81, the scale display unit 71 uses the scale display unit 71 to indicate the current height position of the condenser lens 312 on the scale 810 and the height position at which the value on the scale 810 pointed to by the instruction unit 811 is displayed. A display area 812 is displayed. The height position display area 812 is displayed as a cell in the illustrated example. The display of the height position of the condenser lens 312 in the height position display area 812 is performed by the height position display means 72 shown in FIG.

  As shown in FIG. 3, the control means 7 is provided with an elevating drive means 73 that drives the elevating means 313 shown in FIG. 2 to move the condenser lens 312 in the Z-axis direction. The elevating drive means 73 drives the elevating means 713 by shifting the pointing portion 811 shown in FIG. 4 in the up and down direction, which is the extending direction of the scale 810, while the operator touches it. Move in the axial direction.

  As shown in FIG. 3, the control means 7 is connected to a storage means 75 having a storage element such as a memory. The storage unit 75 stores the height position information displayed in the height position display area 812 in the storage unit 75 under the control of the control unit 7.

  The control unit 7 includes a calculation unit 76 that calculates the thickness of the wafer W from the value stored in the storage unit 75. Further, the control means 7 uses the value stored in the storage means 75 as a wafer thickness input area 86 or tape, which is a setting area provided on the device data input screen 8b for setting the device conditions shown in FIG. First numerical value transfer means 74 for transferring to the thickness input area 87 is provided. Further, the controller 7 transfers the value calculated by the calculator 76 to the wafer thickness input area 86 which is provided on the device data input screen 8b shown in FIG. 5 and is a setting area for setting processing conditions. Numerical value transfer means 77 is provided.

  When cutting the wafer W using the cutting apparatus 1 shown in FIG. 1, the wafer unit U is placed on the holding table 2 and fixed. As shown in FIG. 2, the lower surface Tb of the tape T is sucked by the suction holding unit 21 of the holding table 2, whereby the wafer W is sucked and held via the tape T. Further, the frame F is fixed by the fixing portion 23. In this state, the tape T is exposed on the frame body 22, and the upper surface Wa of the wafer W is exposed on the suction holding unit 21.

  Since there may be an error in the thickness values of the wafer W and the tape T, the cutting process is started after these thicknesses are individually measured. Therefore, the control means 7 displays the thickness measurement screen 8a shown in FIG.

  On the thickness measurement screen 8a, the captured image formed by the imaging unit 31 is displayed in the captured image display area 80. The captured image is displayed by the captured image display means 70 shown in FIG. 3 that has received the transfer of the captured image from the imaging unit 310.

  Further, the scale display unit 71 shown in FIG. 3 displays an instruction unit 811 on the scale 810 of the thickness measurement screen 8a shown in FIG. 4 in order to grasp the height position of the condenser lens 312 in the elevating unit 313. Display. Here, the position of the instruction unit 811 is recognized by the scale display unit 71 by reading the output value of the encoder 314 in the elevating unit 313. Further, the height position display means 72 displays the numerical value indicating the height position of the condenser lens 312 in the height position display area 812 by reading the output value of the encoder 314.

  The control means 7 displays four arrow buttons 82 on the thickness measurement screen 8a. These are buttons for moving the imaging area by the imaging means 31, and the AF button 83 is a button for instructing the imaging means 31 to perform autofocus. When this button is touched, the lifting means 313 is The condenser lens 312 is moved up and down to automatically focus on the object to be imaged.

  The device data button 84 on the thickness measurement screen 8a is a button for instructing the control means 7 to display the device data input screen 8b shown in FIG. 5, for example, and the dress data button 85 is the blade 30 shown in FIG. It is a button for instructing the control means 7 to display a condition input screen when dressing.

  The device data input screen 8b shown in FIG. 5 is a screen for inputting the conditions of the wafer W to be cut and the cutting conditions. The wafer thickness input area 86 into which the thickness of the wafer W is input and the thickness of the tape T The tape thickness input area 87 for inputting the height, the blade height input area 88 for inputting the height position of the blade 30 at the time of cutting, the dress data button 85 similar to the one displayed on the thickness measurement screen 8a, the workpiece There are an auto-alignment button 89 that is touched when automatically detecting a position where an object is to be cut, a data reading button 90 that is touched when reading measured data, and the like. These buttons are displayed by the control means 7.

  When the operator tries to cut the wafer W, the operator touches one of the plurality of arrow buttons 82 displayed on the thickness measurement screen 8a, so that the boundary between the frame 22 of the holding table 2 and the suction holding unit 21 is reached. The image pickup means 31 is positioned immediately above. Note that the holding table 2 moves in the X direction when the left and right arrows of the arrow buttons 82 are touched, and the imaging means 31 moves in the Y axis direction when the up and down arrows are touched.

  Next, when the operator touches the AF button 83, the lifting / lowering means 313 shown in FIG. 2 raises / lowers the condenser lens 312 under the control of the lifting / lowering driving means 73, and the focus of the imaging unit 310 is brought to the upper surface Ta of the tape T. Match. As the condenser lens 312 is raised and lowered, the scale display unit 71 shown in FIG. 3 instructs the scale 810 in FIG. 4 based on the information sent from the encoder 314 corresponding to the raising and lowering of the condenser lens 312. The part 811 is moved up and down. In conjunction with this, the height position display means 72 displays the height position display area 812 while changing the position of the instruction unit 811.

  When the focus of the imaging unit 310 is aligned with the upper surface Ta of the tape T, the height position information of the condenser lens 312 at that time is displayed in the height position display area 812. In the example shown in FIG. 4, 0.883 mm is the height position of the condenser lens 312.

  Note that the origin (position where the instructing unit 811 points to 0 mm) in the lifting / lowering means 313 is the position in the Z-axis direction of the condenser lens 312 when the focus of the condenser lens 312 is aligned with the upper surface 22a of the frame body 22; This origin is measured in advance before the wafer unit U is held on the holding table 2 and is stored in the control means 7.

  If the operator confirms the captured image displayed in the captured image display area 80 and determines that the focus does not match the upper surface Ta of the tape T even by autofocus, the operator touches the instruction unit 811 with a finger, for example. By moving the finger up and down, the instruction unit 811 is moved up and down little by little. Then, the lifting / lowering driving means 73 shown in FIG. 3 drives the lifting / lowering means 313 to raise and lower the condenser lens 312 in the same direction as the finger moving direction and in proportion to the finger moving range. The operator moves the instruction unit 811 up and down on the scale 810 while looking at the captured image displayed in the captured image display area 80 until focus is achieved. Note that the numerical value displayed in the height position display area 812 also changes as the instruction unit 811 is moved up and down. When the operator determines that the subject is in focus, the operator removes his / her finger from the instruction unit 811. The numerical value displayed in the height position display area 812 at this time is the height position of the condenser lens 312 when the upper surface Ta of the tape T is in focus, and this value is the storage means shown in FIG. 75.

  Next, when the operator touches the device data button 84, the control means 7 displays the device data input screen 8b shown in FIG. When the operator touches the data reading button 90, the height position information stored in the storage means 75 is read into the control means 7. Since the control unit 7 sets the height position of the condenser lens 312 when the focus of the imaging unit 310 is aligned with the upper surface 22a of the frame body 22 to 0, the value of the height position stored in the storage unit 75 is , Meaning the thickness of the tape T. Accordingly, the first numerical value transfer means 74 shown in FIG. 3 inputs and displays 0.883 mm as the value of the height position in the tape thickness input area 87 of the device data input screen 8b.

  Next, when the operator touches the auto alignment button 89 on the device data input screen 8b, the thickness measurement screen 8c shown in FIG. Then, while the imaging unit 31 moves above the wafer W, the characteristic circuit pattern P formed on the upper surface Wa of the wafer W shown in FIG. 6 is imaged. The image information including the characteristic circuit pattern P is stored in the control unit 7 in advance, and the control unit 7 performs pattern matching between the stored image and the actually captured image while performing autofocus. As shown in FIG. 7, when the focus of the imaging unit 310 is aligned with the upper surface Wa of the wafer W and the images match, the movement of the imaging unit 31 is stopped at that position. Then, 1.383 mm which is the height position information of the condenser lens 312 at that time shown in FIG. 6 is displayed in the height position display area 812, and this height position information is stored in the storage means 75. If the focus is not completely achieved by autofocus, the operator focuses while looking at the captured image displayed in the captured image display area 80 as in the case of focusing on the upper surface Ta of the tape T. The instruction unit 811 is moved up and down on the scale 810. When the operator determines that the subject is in focus, the operator removes his / her finger from the instruction unit 811. At this time, the numerical value displayed in the height position display area 812 is stored in the storage means 75 shown in FIG.

Next, when the operator touches the device data button 84, the device data input screen 8b shown in FIG. 5 is displayed. When the operator touches the data reading button 90, 1.383 mm which is the height position information of the condenser lens 312 when the upper surface Wa of the wafer W stored in the storage unit 75 is in focus is the control unit 7. Is read. Since the control unit 7 sets the height position of the condenser lens 312 when the focus of the imaging unit 310 is aligned with the upper surface 22a of the frame body 22 to 0, the value of the height position stored in the storage unit 75 is Means a value obtained by adding the thickness of the wafer W and the thickness of the tape T.
Furthermore, the height position of the cutting blade 30 when the tip of the cutting blade 30 contacts the upper surface 22a of the frame 22 of the holding table 2 is set to zero.
The calculating means 76 subtracts 0.883 mm, which is the thickness of the tape T previously measured and input to the tape thickness input area 87, from 1.383 mm, which is the value stored in the storage means 75, and 0.500 mm, which is the thickness of the wafer W excluding the thickness, is calculated. Then, the second numerical value transfer means 77 shown in FIG. 3 inputs and displays the calculated value of 0.500 mm, which is the thickness of the wafer W, in the wafer thickness input area 86 of the device data input screen 8b. As described above, the calculated value of the thickness of the wafer W is input and displayed in the wafer thickness input area 86. The sum of the values input to the wafer thickness input area 86 and the tape thickness input area 87 is used for the purpose of speeding up autofocusing when imaging and aligning the upper surface Wa of the wafer W held by the holding table 2. used.

  The operator inputs the height position of the blade 30 at the time of cutting in the blade height input area 88 on the device data input screen 8b. For example, in the case where the wafer W is completely cut and cut to a position of 10 μm (0.010 mm) cut from the upper surface Ta of the tape T, the value entered by the operator in the tape thickness input area 87 is 0.883 mm to 0.8 mm. Subtract 010 mm, and input 0.873 mm, which is the calculation result, into the blade height input area 88.

  When the blade height is set in this way, the cutting means 3 moves in the Y-axis direction by the distance between the circuit pattern P shown in FIG. 6 detected by auto-alignment and the street S to be cut, and the blade 30 and the cutting are moved. Position alignment in the Y-axis direction with the street to be attempted is performed. Then, the blade 30 is rotated at a high speed, and the cutting feed means 5 shown in FIG. 1 lowers the cutting means 3 so that the lower end of the blade 30 is located at the position input to the blade height input area 88. Then, the street S of the wafer W is cut by cutting and feeding the holding table 2 in the X-axis direction, the blade 30 is slightly cut into the tape T, and the street S is completely cut. The control means 7 recognizes the position of the lower end of the blade 30 by the number of pulses sent to the pulse motor 50 of the cutting feed means 5 shown in FIG. Since the control means 7 positions the blade 30 at a position displaced by the value input in the blade height input area 88 shown in FIG. 5 with respect to the upper surface 22a of the frame body 22, the cutting depth is determined. Can be controlled.

  When one street S is cut in this way and then the same cutting is performed while indexing and feeding the cutting means 3 at intervals between adjacent streets, all streets in the same direction are cut. When the same cutting is performed after the holding table 2 is rotated 90 degrees, all the streets are cut vertically and horizontally and divided into individual chips.

  Since the information input on the device data input screen 8b is accurate, cutting can be performed without an error in the cutting depth. Accordingly, it is possible to prevent the blade 30 from being cut deeper than necessary, or the blade 30 from being cut deeply and being left uncut.

  In the above embodiment, the control means 7 recognizes the height position of the condenser lens 312 based on the information read from the encoder 314. However, when the elevating means 313 has a scale, Based on the read value of the scale, the height position of the condenser lens 312 can be recognized.

  In the above embodiment, the tape T is attached to the lower surface of the wafer W, the wafer W not attached to the tape T is held by the holding table 2, and the cutting depth is shallower than the thickness of the wafer W. In the half-cut cutting process, the height position information of the condenser lens 312 when the upper surface Wa of the wafer W stored in the storage means 75 is in focus is the thickness of the wafer W. The first numerical value transfer means 74 inputs the stored thickness of the wafer W into the wafer thickness input area 86. Then, the operator inputs the height position of the blade 30 at the time of cutting in the blade height input area 88. For example, as shown in FIG. 9, when cutting by cutting 0.100 mm above the upper surface 22 a of the frame body 22, 0.100 mm is input into the blade height input area 88.

  In the above embodiment, the upper surface 22a of the frame 22 is used as a reference, but the upper surface Wa of the wafer W may be used as a reference. When the upper surface Wa of the wafer W is used as a reference, the control unit 7 causes the touch panel 8 to display a device data input screen 8d shown in FIG. 10 instead of the device data input screen 8b shown in FIG. In the device data input screen 8d, the blade height input area 88 of the device data input screen 8b shown in FIG. 5 is changed to a blade cutting amount input area 88a. As shown in FIG. 9, in the case of cutting by cutting 0.100 mm above the upper surface 22a of the frame body 22, the thickness of the wafer W is 0 as set in the wafer thickness input area 86 of FIG. If it is 883 mm, 0.873 mm is input to the changed blade cutting amount input area 88a.

  Moreover, in the said embodiment, although the cutting device 1 was mentioned as an example of a processing apparatus, if it is an apparatus which recognizes the thickness of a workpiece in a process, a processing apparatus will not be limited to a cutting apparatus, For example, a grinding apparatus In addition, a polishing apparatus, a laser processing apparatus, and the like are also included.

1: Cutting device 10: Processing chamber 2: Holding table 21: Suction holding unit 21a: Upper surface 22: Frame body 22a: Upper surface 23: Fixed unit 3: Cutting unit 30: Blade 31: Imaging unit 310: Imaging unit 311: Illumination 312 :Condenser lens
313: Lifting means 314: Encoder 4: Index feeding means 40: Ball screw 41: Moving plate 42: Guide rail 5: Cutting feed means 50: Pulse motor 51: Lifting plate 52: Guide rail 6: Cleaning means 60: Spinner table 61: Frame fixing unit 7: Control means 70: Captured image display means 71: Scale display means 72: Height position display means 73: Elevating drive means 74: First numerical value transfer means 75: Storage means 76: Calculation means 77: Second numerical value Transfer means 8: Touch panel 8a, 8c: Thickness measurement screen 8b: Device data input screen 80: Captured image display area 81: Scale display area 810: Scale 811: Instruction unit 812: Height position display area 82: Arrow button 83: AF button 84: Device data button 85: Dress data button 86: Way Thickness input area 87: Tape thickness input area 88: Blade height input area 89: Auto alignment button 88a: Blade cut amount input area 90: Data read button U: Wafer unit W: Wafer Wa: Upper surface P: Circuit pattern T: Tape Ta : Upper surface F: Frame

Claims (3)

A holding table for holding the workpiece, a processing means for processing the workpiece held by the holding table, an imaging means for imaging the holding table and the upper surface of the workpiece, and a control for controlling at least the imaging means A processing apparatus comprising means and a touch panel used for inputting processing conditions at least,
The imaging means includes: an illumination that emits illumination light that illuminates the object to be imaged; a condenser that collects reflected light of the illumination light; an imaging unit that captures the reflected light; Elevating means for focusing the imaging unit on the upper surface of the imaging object,
The control means includes
Captured image display means for displaying an image captured by the imaging means in a captured image display area of the touch panel;
A scale display means for displaying a scale with a scale indicating the raising and lowering range of the condenser in the scale display area of the touch panel;
A height position display means for displaying a value of a height position of the condenser on the scale in a height position display area of the touch panel;
Elevating drive means for driving the elevating means in accordance with an instruction on the scale by an operator to elevate the condenser;
With
The imaging means images the workpiece while the imaging unit is in focus on the top surface of the imaging object, and the height position of the condenser is displayed in the height position display area so that the imaging object is A processing device that measures the height of the top surface. Storage means for storing the value displayed in the height position display area;
Numerical value transfer means for transferring the value stored in the storage means to a setting area for setting machining conditions;
The processing apparatus according to claim 1, comprising: Storage means for storing the value displayed in the height position display area;
Calculating means for calculating the thickness of the workpiece from the value stored in the storage means;
Second numerical value transfer means for transferring the value calculated by the calculation means to a setting area for setting machining conditions;
The processing apparatus according to claim 1, comprising:

Images