JP2019006072A - Electric conductive circuit fabric and manufacturing method thereof - Google Patents

Abstract

To provide an electric conductive circuit fabric which has durability for deformation such as bending and high conductivity and can design electric conductive pattern shape freely, and to provide a manufacturing method thereof.SOLUTION: An electric conductive circuit fabric is consisted by laminating a circuit pattern-like conductive member consisting of an electric conductive fabric on a nonconductive backing fabric. The electric conductive fabric has a metal layer coating on at least one surface of a fabric structured by first yarn and second yarn at right angles to the first yarn. It is preferable that the angle of either of the first yarn or the second yarn of the electric conductive fabric for third yarn or fourth yarn at right angles to the third yarn structuring the backing fabric is 5-40°.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a conductive circuit fabric. The present invention also relates to a method for producing a conductive circuit fabric.

  Various proposals have been made for fabrics having conductive circuits and methods for producing the same. For example, Patent Document 1 discloses a conductive fabric including a first insulating layer on a fabric, a conductive layer provided on the first insulating layer, and a second insulating layer provided on the conductive layer. It is disclosed. It is described that the conductive layer can be formed by various printing methods using a conductive paste in which a conductive filler such as metal powder and a resin are dissolved or dispersed in an appropriate organic solvent. On the other hand, Patent Document 2 discloses a method of weaving or knitting a conductive yarn.

  In the method of printing a conductive paste as described in Patent Document 1, the conductivity may be insufficient. There is a problem that the fabric tends to be hard and heavy because it is necessary to increase the amount of the conductive paste to be printed in order to increase the conductivity, and further, there is a possibility that the fabric cannot follow the flexibility of the fabric and may crack. The technique of weaving or knitting conductive yarn disclosed in Patent Document 2 has problems such as requiring a special device and having a low degree of freedom in the shape of the conductive pattern.

International Publication No. 2016/114339 JP 2013-019064 A

  An object of the present invention is to provide a conductive circuit fabric having high conductivity that is durable against deformation such as bending, and capable of freely designing a conductive pattern shape, and a method for manufacturing the same. .

  The inventors of the present invention provide a conductive circuit fabric obtained by laminating a conductive member obtained by cutting a conductive fabric having a metal layer coated on at least one surface into a desired circuit pattern on the surface of a base fabric. The present invention has been completed by finding that it has a conductive property that is durable against deformation such as bending.

  That is, the present invention is a conductive circuit fabric obtained by laminating a conductive member having a circuit pattern made of a conductive fabric on a non-conductive base fabric, and the conductive fabric includes a first yarn and A conductive circuit fabric comprising a metal layer covering at least one surface of a woven fabric composed of a second yarn generally orthogonal to the first yarn.

  The first yarn or the second yarn of the conductive fabric with respect to the third yarn constituting the base fabric or the fourth yarn substantially orthogonal to the third yarn. It is preferable that the circuit pattern-shaped conductive member is laminated on the base fabric so that the angle formed by any one of the yarns satisfies 5 to 40 °. According to this, even when it is bent in various directions, it is possible to obtain a conductive circuit fabric in which the conductivity does not decrease.

  It is preferable that the metal layer contains copper or silver as a main component. The sheet resistance of the conductive member is preferably 0.10 Ω / □ (square) or less. It is preferable that the conductive member and the base fabric are laminated via an insulating adhesive layer.

  Furthermore, the present invention provides a conductive woven fabric by forming a metal layer on at least one surface of a woven fabric composed of a first yarn and a second yarn generally orthogonal to the first yarn. A first step, a second step of laminating an insulating adhesive layer on one side of the conductive fabric, and sticking an adhesive sheet on the other side of the conductive fabric, and at least the conductive fabric and the insulating property A third step of cutting the adhesive layer into a desired circuit pattern, a fourth step of contacting the insulating adhesive layer to the surface of the non-conductive base fabric, and peeling the adhesive sheet after bonding, It is a manufacturing method of the conductive circuit fabric which has these.

  In the fourth step, the first yarn of the conductive fabric or the third yarn constituting the base fabric or the fourth yarn substantially orthogonal to the third yarn, It is preferable to abut and adhere so that the angle formed by any one of the second yarns satisfies 5 to 40 °.

  The conductive circuit fabric of the present invention has high conductivity that is durable to bending without impairing flexibility as a fabric. In addition, since the pattern shape of the conductive circuit can be freely designed, an effect of suppressing the manufacturing cost can be expected.

It is a schematic diagram explaining the cross-sectional structure of the conductive circuit fabric of this invention. It is a schematic diagram explaining the lamination | stacking state of the electrically-conductive member and base fabric in the conductive circuit fabric of this invention. FIG. 3 is an enlarged view of a region B surrounded by a double dashed circle in FIG. 2.

  The configuration of the conductive circuit fabric 1 of the present invention will be described with reference to FIG. The conductive fabric 6 covers at least one surface of the fabric 4 on the basis of the fabric 4 woven from the first yarn and the second yarn substantially orthogonal to the first yarn. And a metal layer 5. The first yarn and the second yarn may be yarns using fibers made of an organic compound or an inorganic substance. Examples of fibers made of organic compounds include natural fibers such as cotton, hemp, wool, and silk, regenerated fibers such as rayon and cupra, semi-synthetic fibers such as acetate and triacetate, polyamide (nylon 6, nylon 66, etc.), and polyester. (Polyethylene terephthalate, polytrimethylene terephthalate, etc.), synthetic fibers such as polyurethane and polyacryl, and the like may be used, and two or more of these may be combined. Examples of the fiber made of an inorganic material include glass fiber, metal fiber, and carbon fiber. From the viewpoint of flexibility and versatility, it is preferably a yarn using fibers made of an organic compound. The first yarn and the second yarn may be yarns made of the same fiber material, or may be yarns made of different fiber materials. The total fineness of the yarn is preferably 11 to 167 dtex. When the total fineness is within this range, a highly flexible conductive circuit fabric 1 can be obtained.

  The structure of the fabric 4 composed of the first yarn and the second yarn is not particularly limited. Conventionally known fabric structures such as plain weave, twill weave and satin weave can be used. At this time, the first yarn may be a warp of the fabric 4, and the second yarn may be a weft. Conversely, the second yarn may be a warp and the first yarn may be a weft. The extension direction of the first yarn and the second yarn is approximately 90 °. That is, a fabric structure in which warp and weft are orthogonal to each other is adopted.

  A metal layer 5 is formed on at least one surface of the fabric 4 to obtain the conductive fabric 6 of the present invention. Examples of the method for forming the metal layer 5 on at least one surface of the fabric 4 include dry methods such as vapor deposition and sputtering, and wet methods such as electroless plating and electroplating. A wet method is preferable from the viewpoint of production cost, productivity, and continuity of the metal layer. In the formation of the metal layer by the wet method, the metal layer 5 can be simultaneously formed on both surfaces of the fabric 4 as well as on one surface of the fabric 4, so that there is an advantage that higher conductivity can be obtained. As a method of forming the metal layer 5 by electroless plating or electroplating, a conventionally known plating method can be used.

  Examples of the metal that is the main component of the metal layer 5 include copper, silver, gold, nickel, tin, and zinc. From the viewpoint of conductivity and production cost, copper or silver is preferable. The thickness of the metal layer 5 is preferably 0.5 to 10 μm. If the thickness of the metal layer 5 is within this range, the effect of high flexibility and high conductivity can be obtained. Further, the metal layer 5 may be a single layer or may have a laminated structure of two or more layers. The sheet resistance of the conductive fabric 6 of the present invention and the conductive member 6 obtained by cutting the conductive fabric into a circuit pattern is preferably 0.10 Ω / □ or less. A method for measuring the sheet resistance will be described later.

  As in the case of the conductive fabric 6, the non-conductive base fabric 2 in the present invention is woven from a third yarn and a fourth yarn generally orthogonal to the third yarn. It is a woven fabric. The third yarn and the fourth yarn may be yarns using non-conductive fibers made of an organic compound or an inorganic substance. Non-conductive fibers made of organic compounds include, for example, natural fibers such as cotton, hemp, wool and silk, regenerated fibers such as rayon and cupra, semi-synthetic fibers such as acetate and triacetate, polyamide (nylon 6, nylon 66) Etc.), synthetic fibers such as polyester (polyethylene terephthalate, polytrimethylene terephthalate, etc.), polyurethane, polyacryl and the like, and two or more of these may be combined. Examples of the non-conductive fiber made of an inorganic material include glass fiber. From the viewpoints of flexibility and versatility, it is preferably a yarn using a nonconductive fiber made of an organic compound. The third yarn and the fourth yarn may be yarns made of the same fiber material, or may be yarns made of different fiber materials. The total fineness of the yarn is preferably 7 to 170 dtex. When the total fineness is within this range, a highly flexible conductive circuit fabric 1 can be obtained.

  The structure of the base fabric 2 composed of the third yarn and the fourth yarn is not particularly limited. Conventionally known fabric structures such as plain weave, twill weave and satin weave can be used. At this time, the third yarn may be a warp of the base fabric 2, and the fourth yarn may be a weft. Conversely, the fourth yarn may be a warp and the third yarn may be a weft. The extension direction of the third yarn and the fourth yarn is approximately 90 °. That is, a fabric structure in which warp and weft are orthogonal to each other is adopted.

  In the present invention, the conductive member 6 obtained by cutting the conductive fabric into a circuit pattern and the non-conductive base fabric 2 are preferably laminated with an insulating adhesive layer 3 interposed therebetween. The insulating adhesive layer 3 is made of polyurethane resin, phenoxy resin, silicone resin, polyester resin, epoxy resin, acrylic resin, ethylene-vinyl acetate copolymer resin, polyvinyl butyral resin, polyvinyl chloride resin. It is preferably made of an insulating resin such as a polymer resin. The insulating adhesive layer 3 made of these insulating resins is a paste-like composition having adhesiveness, and can be an insulating adhesive layer 3 of a type that is cured by heat or light. Alternatively, the insulating adhesive layer 3 made of a so-called hot-melt type resin that exhibits adhesiveness by being melted by heat from a once cured state may be used. The thickness of the insulating adhesive layer 3 is preferably in the range of 10 to 100 μm. If the thickness of the insulating adhesive layer 3 is within this range, a highly flexible conductive circuit fabric can be obtained.

  In the conductive circuit fabric 1 of the present invention, a laminated state of the conductive member 6 made of a conductive fabric and the base fabric 2 will be described with reference to FIGS. 2 and 3. The third yarn 73 and the fourth yarn 74 drawn with broken lines are drawn so as to form a lattice so as to be substantially orthogonal to each other, which schematically shows the base fabric 2. It is. In FIG. 2, a “U” -shaped conductive member 6 (gray-filled portion) is laminated on the upper surface of the base fabric 2. The conductive member 6 is obtained by cutting a conductive fabric into a “U” shape, and includes a first yarn and a second yarn drawn with a solid line. In addition, the part of the base fabric 2 that should be invisible by laminating the conductive members 6 is also drawn for easy explanation.

FIG. 3 is an enlarged view of a region B surrounded by a double dashed circle in FIG. The conductive member 6 includes a first yarn 71 and a second yarn 72 that is substantially orthogonal to the first yarn 71. Here, for the third yarn 73 or the fourth yarn 74 constituting the base fabric 2, any one of the first yarn 71 or the second yarn 72 of the conductive fabric 6 is used. When the angle formed by the yarn is 5 to 40 °, it is possible to obtain a conductive circuit fabric having conductive durability against bending in various directions. That is, it is preferable to arrange the conductive member 6 with respect to the base fabric 2 in a bias with respect to each texture. The texture generally means the direction of warp or weft extension of the fabric. For example, in FIG. 3, the angle θ ₁ formed by the first yarn 71 with respect to the third yarn 73 is preferably 5 to 40 °. At this time, the angle θ ₂ formed by the first yarn 71 with respect to the fourth yarn 74 is θ ₂ = 90 ° − because the third yarn 73 and the fourth yarn 74 are substantially orthogonal to each other. the θ _1. Similarly, since the first yarn 71 and the second yarn 72 are substantially orthogonal to each other, the angle formed by the second yarn 72 with respect to the third yarn 73 is θ ₂ , and the fourth yarn The angle formed by the second yarn 72 with respect to the strip 74 is θ ₁ . Therefore, as long as the base fabric 2 and the conductive fabric 6 are composed of two yarns that are substantially orthogonal to each other, if the angle formed by any one of the yarns of each fabric is defined, the base fabric 2 and the conductive fabric 6 are electrically conductive. It is possible to define a laminated state arranged in a bias with the conductive fabric 6.

  The conductive woven fabric 6 in which the metal layer 5 is formed on at least one surface of the woven fabric 4 exhibits the property of having the highest rate of decrease in conductivity when bent in the extending direction of the yarns constituting the woven fabric 4. That is, the conductivity is most easily lowered when the first yarn or the second yarn is bent along a line parallel to the extending direction. However, as described above, when laminating the conductive fabric 6 and the base fabric 4, it becomes possible to compensate for this problem by laminating with a bias of 5 to 40 degrees with respect to each texture. The conductive circuit fabric 1 having high durability with respect to bending in various directions can be obtained.

  In the method for producing a conductive circuit fabric according to the present invention, a metal layer is formed on at least one surface of a woven fabric composed of a first yarn and a second yarn substantially orthogonal to the first yarn. A first step of obtaining a conductive fabric, a second step of laminating an insulating adhesive layer on one side of the conductive fabric, and sticking an adhesive sheet on the other side of the conductive fabric, at least the above A third step of cutting out the conductive fabric and the insulating adhesive layer into a desired circuit pattern, and contacting the adhesive adhesive layer to the surface of the non-conductive substrate fabric and bonding the adhesive sheet, It consists of the 4th process to peel.

  In the first step, the conductive fabric 6 is formed by forming a metal layer 5 on at least one surface of the fabric 4 obtained by a normal weaving method using the first yarn and the second yarn. obtain. As described above, as a method of forming the metal layer 5, either a dry method or a wet method can be adopted, but a wet method such as an electroless plating method or an electroplating method is preferable.

  In the second step, the insulating adhesive layer 3 is laminated on one surface of the conductive fabric 6 obtained in the first step. The material of the insulating adhesive layer 3 is as described above. Examples of the method for laminating the insulating adhesive layer 3 include a coating method and a laminating method. The surface on which the insulating adhesive layer 3 is laminated is preferably the surface opposite to the surface on which the metal layer 5 is formed. Next, an adhesive sheet is stuck on the other surface of the conductive fabric 6. Commercially available products such as PET75-RC611, PET75-RB105, and PET75-RB107 (all manufactured by Nichiei Kako Co., Ltd.) can be used as the pressure-sensitive adhesive sheet. Or the material of the structure which apply | coated the adhesive composition to the single side | surface of the resin base material can be produced and used. Examples of such a resin base material include a PET film. Examples of the pressure-sensitive adhesive composition include acrylic pressure-sensitive adhesives.

  In the third step, at least the conductive fabric 6 and the insulating adhesive layer 3 are cut into a desired circuit pattern. Here, the adhesive sheet is preferably not cut out from the viewpoint of handling in the subsequent step. For the cutting, a method using a cutting machine, a cutting method using a cutter, a cutting method using a laser processing machine, or the like is employed. In order to facilitate the subsequent process without cutting the adhesive sheet, a cutting method using a laser processing machine is preferable. After being cut into a desired pattern, unnecessary portions are peeled off from the adhesive sheet and removed.

  In the fourth step, the insulating adhesive layer 3 is brought into contact with a desired position of the base fabric 2 to perform adhesion. When the insulating adhesive layer 3 is a paste-like resin composition, adhesion is performed according to the properties of the resin composition, such as heating, drying, and light irradiation. When the insulating adhesive layer 3 is composed of a hot melt type resin composition, adhesion is achieved by thermocompression bonding. Then, the adhesive sheet is peeled off, and the conductive circuit fabric 1 of the present invention in which the circuit pattern made of the conductive fabric is laminated at a desired position on the surface of the base fabric 2 is obtained.

  In the fourth step, as described above, when the conductive fabric 6 and the base fabric 4 are brought into contact with each other and bonded, it is preferable to apply a bias of 5 to 40 ° with respect to each other. That is, one of the first yarn 71 and the second yarn 72 of the conductive fabric 6 with respect to the third yarn 73 or the fourth yarn 74 constituting the base fabric 2. It is preferable to contact and bond so that the angle formed by the stripes satisfies 5 to 40 °. By laminating with biasing in this way, it is possible to produce a conductive circuit fabric having high conductivity durability against bending in various directions.

  Examples The present invention will be described below with reference to examples, but the present invention is not limited to these examples.

[Examples 1 to 5]
A conductive fabric was prepared by the following procedure. First yarn: polyester processed yarn (33 dtex) as warp, second yarn: polyester processed yarn (69 dtex) as weft, plain weave (weave density: warp 189 / 2.54 cm, weft 120/2 .54 cm) fabric was produced. A pressure-sensitive adhesive sheet PET75-RC611 (manufactured by Nichiei Kako Co., Ltd.) was attached to one surface of the woven fabric to obtain a mask. The fabric with a mask was immersed in an aqueous solution containing 0.3 g / L of palladium chloride, 30 g / L of stannous chloride and 300 mL / L of 36% hydrochloric acid at room temperature for 30 seconds and then thoroughly washed with water (catalyst application). Thereafter, it was immersed in borohydrofluoric acid having an acid concentration of 0.1 N for 1 minute at 40 ° C. and then thoroughly washed with water (catalyst activation). Here, the adhesive sheet is peeled off and removed, cupric chloride 9 g / L, 37% formalin 9 mL / L, 32% sodium hydroxide 40 mL / L, N, N, N ′, N′-tetrakis (2-hydroxypropyl) It was immersed in a solution containing 20 g / L of ethylenediamine and a stabilizer at 40 ° C. for 15 minutes, whereby a 30 g / m ² copper film was uniformly formed on the surface of the fabric, and the fabric was thoroughly washed with water (electroless copper plating). The fabric was immersed in Dine Silver GPE-ST15 (manufactured by Daiwa Kasei Co., Ltd.) using the copper coating as the cathode, and after electroplating at an ambient density of 2 A / dm ² and room temperature for 1.5 minutes using an insoluble anode, Washed with water. As a result, a silver coating of 5 g / m ² was uniformly formed on the copper coating (electrosilver plating). Finally, drying was performed to obtain a conductive fabric in which a metal layer having a white copper-silver two-layer structure was formed on one side (the side on which the adhesive sheet was not attached).

  When the sheet resistance value of the obtained conductive fabric was measured with a 4-probe probe using Loresta MCP-T360 (manufactured by Mitsubishi Chemical Analytech Co., Ltd.), a value of 0.017Ω / □ was obtained. The thickness of the metal layer having a white copper-silver two-layer structure was 3 μm.

  SHM101-PUR (manufactured by Sea Dam Co., Ltd.) was laminated as an insulating adhesive layer on the surface of the conductive fabric where the metal layer was not formed. At the time of lamination, heat pressing was performed at 130 ° C. and 0.5 MPa for 30 seconds using a thermal transfer press HP-4536A-12 (manufactured by HASHIMA CORPORATION). Next, an adhesive sheet PET75-RC611 (manufactured by Nichiei Kako Co., Ltd.) was attached to the surface on which the metal layer of the conductive fabric was formed. This pressure-sensitive adhesive sheet has a two-layer structure of transparent PET film (75 μm thick) -acrylic pressure-sensitive adhesive.

The conductive fabric on which the insulating adhesive layer was laminated was cut into a rectangular shape having a width of 5 mm and a length of 45 mm to obtain a conductive member. For cutting, a high-precision laser cutting machine LS9000 (manufactured by Gravotech) was used, and laser was irradiated from the side where the insulating adhesive layer was laminated. The cutting conditions were CO ₂ laser with power (%) = 5 and speed (%) = 9.0. Under this condition, only the insulating adhesive layer and the conductive fabric were cut, and the adhesive sheet was not cut. Unnecessary portions of the insulating adhesive layer and the conductive fabric were removed to obtain a conductive member having a desired shape fixed on the adhesive sheet.

  As the non-conductive base fabric, a plain weave (weaving density: 189 warps) using a third yarn: polyester processed yarn (33 dtex) as a warp and a fourth yarn: polyester processed yarn (69 dtex) as a weft /2.54 cm, weft 120 / 2.54 cm). The insulating adhesive layer side of the conductive member cut out above is superimposed on a non-conductive base fabric, and heated at 130 ° C. and 0.5 MPa for 30 seconds with a thermal transfer press HP-4536A-12 (manufactured by Hashima Corporation). Press to contact and bond. Then, the adhesive sheet was peeled off to obtain a conductive circuit fabric.

  When cutting out the conductive member, the angle formed between the direction of the second yarn (weft) of the conductive fabric and the width direction of the conductive member is 0 ° (Example 1), 15 ° (Example 2), The angles were set to 35 ° (Example 3), 60 ° (Example 4), and 80 ° (Example 5). When the conductive member is laminated on the base fabric, the angle formed between the second thread (weft) of the conductive member (conductive fabric) and the fourth thread (weft) of the base fabric is 0 ° (implemented) Examples 1), 15 ° (Examples 2 and 4), and 35 ° (Examples 3 and 5).

About the obtained conductive circuit fabric, the resistance value change by bending was measured. Using a MIT bending fatigue tester (Toyo Seiki Seisakusho Co., Ltd.), the bending test was performed under the following conditions. The bending line is a line parallel to the width direction of the conductive member.
・ Cycle: 3,000 times ・ Bending radius: 0.38 mm
・ Bending speed: 175 cpm
・ Bending angle: ± 135 °
・ Load: 0kg
-Test piece size: 170 mm x 15 mm (base fabric), 45 mm x 5 mm (conductive member)

  Before and after the bending test, the resistance value of the conductive member in the conductive circuit fabric was measured at a position across the bending line. The measuring device used was a clip type probe of Multimeter 34410A (manufactured by Agilent). The increase rate of the resistance value after the bending test with respect to the resistance value before the bending test was calculated by the following formula 1 and evaluated.

[Example 6]
The same as Example 1 except that the base fabric was changed to the following.
Third yarn (warp): Polyester yarn (7 dtex)
Fourth yarn (weft): Polyester yarn (7 dtex)
Plain weave (weave density: warp 130 / 2.54cm, weft 130 / 2.54cm)

[Example 7]
The same as Example 2 except that the base fabric was changed to the following.
Third yarn (warp): Polyester yarn (7 dtex)
Fourth yarn (weft): Polyester yarn (7 dtex)
Plain weave (weave density: warp 130 / 2.54cm, weft 130 / 2.54cm)

[Example 8]
Example 5 is the same as Example 5 except that the base fabric was changed to the following.
Third yarn (warp): Polyester yarn (7 dtex)
Fourth yarn (weft): Polyester yarn (7 dtex)
Plain weave (weave density: warp 130 / 2.54cm, weft 130 / 2.54cm)

[Comparative Examples 1 and 2]
A thermosetting solder mask NPR3400 (manufactured by Nippon Polytech Co., Ltd.) was screen-printed on a release material WEKR78TPD-H (manufactured by Lintec Corporation: thickness 145 μm, layer configuration PP / paper / PP), and 130 ° C. and 30 ° C. in a hot air circulating drying furnace. The insulating layer A was formed by partial drying. For screen printing, a plate having an emulsion thickness of 15 μm, stainless steel 200 mesh, and wire diameter of 45 μm was used. The size of the insulating layer A was 6 mm wide and 25 mm long.

  Next, silver paste TR70901 (manufactured by Taiyo Ink Manufacturing Co., Ltd.) is screen-printed with a plate with an emulsion thickness of 15 μm, stainless steel 150 mesh and wire diameter of 55 μm, and dried by heating at 130 ° C. for 30 minutes in a circulating hot air oven. A pattern was formed. The wiring pattern had a width of 5 mm and a length of 45 mm, and was stacked so as to be placed 0.5 mm inside the insulating layer A in the width direction. The sheet resistance value of the obtained wiring pattern was 0.1Ω / □.

  Next, a thermosetting solder mask NPR3400 (manufactured by Nippon Polytech Co., Ltd.) was screen-printed on the wiring pattern with an emulsion thickness of 15 μm, stainless steel 200 mesh, wire diameter 45 μm, and 130 ° C. for 30 minutes in a hot air circulating drying oven. The insulating layer B was formed by drying. The shape of the insulating layer B was the same as the wiring pattern.

  Urethane hot melt adhesive TF-108U (manufactured by Murayama Chemical Laboratory Co., Ltd.) is a plate with emulsion thickness 15μm, stainless steel 80mesh, wire diameter 71μm, and is screen-printed with the same dimensions as the insulation layer B. An adhesive resin layer was formed by drying at 100 ° C. for 10 minutes in a circulation drying furnace.

  The same base fabric as in Example 1 was used as the base fabric. The adhesive resin layer side is overlaid on the surface of the base fabric, and is hot-pressed at 130 ° C. and 0.5 MPa for 30 seconds with a thermal transfer press HP-4536A-12 (manufactured by Hashima Co., Ltd.). The conductive circuit fabric was obtained by peeling. In this comparative example, since the conductive member is made of a cured product of silver paste TR70901 (manufactured by Taiyo Ink Manufacturing Co., Ltd.) sandwiched between insulating layers A and B, the arrangement angle in the bending test is not considered. Regarding the base fabric, the angles formed by the fourth yarn (weft) direction and the width direction of the conductive member (parallel to the bending line in the bending test) are 0 ° (Comparative Example 1) and 45 ° (Comparative Example 2). ).

  The conductive circuit fabric of the present invention is used not only as a signal line for transmitting a signal from a sensor or the like, a conductor for supplying power, but also as a circuit board having various functions by mounting electronic components. It can be used as a circuit fabric. It retains flexibility as a fabric and has a wide range of industrial applications as a base material for wearable devices.

DESCRIPTION OF SYMBOLS 1 Conductive circuit fabric 2 Base fabric 3 Insulating adhesive layer 4 Fabric 5 Metal layer 6 Conductive member (conductive fabric)
71 First yarn 72 Second yarn 73 Third yarn 74 Fourth yarn θ ₁ Angle formed by the first yarn and the third yarn θ ₂ First yarn and first yarn The angle between the four threads

Claims (7)

  A conductive circuit fabric obtained by laminating a conductive member having a circuit pattern made of a conductive fabric on a non-conductive base fabric, the conductive fabric comprising a first yarn and the first yarn A conductive circuit fabric comprising a metal layer covering at least one surface of a woven fabric composed of a second yarn generally orthogonal to the yarn.   The first yarn or the second yarn of the conductive fabric with respect to the third yarn constituting the base fabric or the fourth yarn substantially orthogonal to the third yarn. The conductive member according to claim 1, wherein the conductive member in a circuit pattern is laminated on the base fabric so that an angle formed by any one of the yarns satisfies 5 to 40 °. Circuit fabric.   The conductive circuit fabric according to claim 1, wherein the metal layer contains copper or silver as a main component.   The conductive circuit fabric according to claim 1 or 2, wherein a sheet resistance of the conductive member is 0.1 Ω / □ (square) or less.   The conductive circuit fabric according to claim 1 or 2, wherein the conductive member and the base fabric are laminated via an insulating adhesive layer. A first step of obtaining a conductive fabric by forming a metal layer on at least one surface of a fabric composed of a first yarn and a second yarn generally orthogonal to the first yarn;
A second step of laminating an insulating adhesive layer on one surface of the conductive fabric, and attaching an adhesive sheet to the other surface of the conductive fabric;
A third step of cutting out at least the conductive fabric and the insulating adhesive layer into a desired circuit pattern;
A fourth step in which the insulating adhesive layer is brought into contact with the surface of the non-conductive base fabric, and the pressure-sensitive adhesive sheet is peeled off after being adhered;
A method for producing a conductive circuit fabric comprising:   In the fourth step, the first yarn of the conductive fabric or the third yarn constituting the base fabric or the fourth yarn substantially orthogonal to the third yarn, The method for producing a conductive circuit fabric according to claim 6, wherein the second yarn is brought into contact and bonded so that an angle formed by any one of the second yarns satisfies 5 to 40 °.