JP2019005197A - Game machine - Google Patents

Abstract

To provide a proper board configuration.SOLUTION: Plural signal wirings formed of a first pattern 42AK10 and a second pattern 42AK11 of wiring, are configured so that, at a wiring part 42AK1Z, a signal wiring formed of the second pattern 42AK11 of a wiring corresponds to a first shape part 42AK11L which is formed into a first shape being a linear shape or almost linear shape, and a signal wiring formed of a first pattern 42AL10 of a wiring includes a second shape part 42AL10M being a second shape such as a meander shape different from the first shape part 42AK11L. On the wiring part 42AK2Z, a signal wiring formed of the second pattern 42AK11 of a wiring includes a second shape part 42AK11M corresponding to the first shape part 42AL10L on the signal wiring formed of the fist pattern 42AK10 of the wiring.SELECTED DRAWING: Figure 25

Description

  The present invention relates to a gaming machine capable of playing a game such as a pachinko gaming machine.

  In a gaming machine such as a pachinko gaming machine, a technique related to a signal line for connecting electrical components such as a CPU and a ROM has been proposed (for example, Patent Document 1).

JP 2014-223336 A

  According to the technique described in Patent Document 1, an appropriate board configuration may not be obtained, for example, signal synchronization is likely to be disturbed.

  This invention is made in view of the said actual condition, and aims at provision of the game machine in which a suitable board | substrate structure is possible.

(1) In order to achieve the above object, a gaming machine according to the claims of the present application is a gaming machine capable of playing a game (for example, pachinko gaming machine 1 or the like), and a first pattern (for example, a plurality of signal wirings) A first pattern 42AK10 of wiring and the like (for example, a second pattern 42AK11 of wiring) are formed (for example, see FIG. 25A), and a plurality of electrical components (for example, RAM 102) are formed by the plurality of signal wirings. And the CPU 103) are connected to each other, and the signal wiring constituted by one of the first pattern and the second pattern has a first shape that is straight or substantially straight. Corresponding to the first shape portion (for example, the first shape portion 42AK10L), the other pattern of the first pattern and the second pattern. The signal wiring includes a second shape portion (for example, the second shape portion 42AK11M) that has a second shape different from the first shape, and the first shape portion ( Corresponding to the first shape portion 42AK11L, for example, the signal wiring constituted by the one pattern includes the second shape portion (for example, the second shape portion 42AK10M).
According to such a configuration, an appropriate substrate configuration is possible.

(2) In the gaming machine of the above (1), the first pattern and the second pattern may be formed such that the wiring length of each signal wiring is the same or substantially the same.
According to such a configuration, an appropriate substrate configuration is possible.

(3) In the gaming machine of the above (1) or (2), the second shape portion is formed in different directions between the signal wiring constituted by the first pattern and the signal wiring constituted by the second pattern. (See, for example, FIG. 26).
According to such a configuration, an appropriate substrate configuration is possible.

(4) In any one of the above gaming machines (1) to (3), the second shape portion is different between a signal wiring constituted by the first pattern and a signal wiring constituted by the second pattern. The wiring width may be formed (see, for example, FIG. 27).
According to such a configuration, an appropriate substrate configuration is possible.

(5) In the gaming machine according to any one of (1) to (4), the second shape portion includes a signal wiring constituted by the first pattern and a signal wiring constituted by the second pattern in parallel. Alternatively, a parallel wiring portion formed substantially in parallel may be included (see, for example, FIG. 28A).
According to such a configuration, an appropriate substrate configuration is possible.

(6) In the gaming machine according to any one of (1) to (5), the second shape portion in the signal wiring constituted by the first pattern or the second pattern is constituted by another pattern. A circuit component (for example, circuit component 42AK1R) mounted so as to be connected to the signal wiring may be provided (see, for example, FIGS. 29A and 29B).
According to such a configuration, an appropriate substrate configuration is possible.

(7) In the gaming machine according to any one of (1) to (6), a wiring portion (for example, a first shape) different from the second shape portion in the signal wiring constituted by the first pattern or the second pattern. The circuit component (for example, the circuit component 42AK2R) mounted so as to be connected to the unit 42AK52L (for example, see FIG. 29A) may be provided.
According to such a configuration, an appropriate substrate configuration is possible.

It is a front view of the pachinko gaming machine in this embodiment. It is a block diagram which shows the various control boards etc. which were mounted in the pachinko game machine. It is a rear view of the frame for gaming machines. It is a disassembled perspective view of the state which looked at the substrate case. It is a disassembled perspective view of the state which looked at the substrate case. It is a 6th page figure showing a base member. It is a 6th page figure showing a cover member. It is a perspective view of the state which looked at the receptacle. It is a rear view of the state which looked at the receptacle. It is sectional drawing of the state which looked at the receptacle. It is a figure which shows the transmission path | route corresponding to wiring. It is a figure which shows the transmission path | route of a power supply voltage. It is a figure which shows the relationship etc. of wiring length. It is a figure which shows the structural example of a filter circuit. It is a figure which shows the structural example of a noise prevention circuit. It is a figure which shows a power supply monitoring circuit. It is a figure which shows the structural example of the part in which the pattern of wiring was formed. It is a figure which shows the area | region and area for demonstrating the pattern of wiring. It is an enlarged view of the area | region shown by FIG. It is a figure which shows the example of a setting corresponding to the pattern of wiring. It is an enlarged view of the area | region shown by FIG. It is an enlarged view of the area | region shown by FIG. It is sectional drawing which shows the structural example of a main board | substrate. It is a figure which shows the other structural example about the pattern of wiring. It is a figure which shows the structural example which concerns on characteristic part 42AK. It is a figure which shows the structural example in which the 2nd shape part is formed in a different direction. It is a figure which shows the structural example in which the several signal wiring is formed in the wiring width from which it differs. It is a figure which shows the structural example in which the 2nd shape part is correspondingly formed. It is a figure which shows the structural example mounted so that a circuit component might be connected. It is a figure which shows the structural example which concerns on characteristic part 43AK. It is a figure which shows the structural example which concerns on characteristic part 44AK. It is the disassembled perspective view which looked at the board case, board | substrate, and heat sink of the game machine which concern on characteristic part 45AK from the back. It is the disassembled perspective view which looked at the board case, board | substrate, and heat sink of the game machine which concern on characteristic part 45AK from the front. It is sectional drawing which showed a mode that the heat sink and a board | substrate are attached to a board | substrate case in the order of attachment ((a)-(b)). It is sectional drawing which showed a mode that a heat sink and a board | substrate are attached to a board | substrate case in order of attachment ((a)-(b)) following FIG. It is a top view for demonstrating the relationship between a heat sink and an electronic component. It is explanatory drawing for demonstrating the flow of the air in a substrate case. It is sectional drawing which showed a mode that a heat sink and a board | substrate were attached to the board | substrate case of the game machine which concerns on other Embodiment 1. FIG. It is sectional drawing which showed a mode that a heat sink and a board | substrate were attached to the board | substrate case of the game machine which concerns on other Embodiment 2. FIG.

  FIG. 1 is a front view of a pachinko gaming machine 1 according to this embodiment. The pachinko gaming machine 1 includes a gaming board 2 and a gaming machine frame 3. In addition, the pachinko gaming machine 1 includes an outer frame that rotatably supports the gaming machine frame 3. The game board 2 is a gauge board constituting the game board surface. The gaming machine frame 3 is a frame for fixing the gaming board 2. A game area surrounded by guide rails and the like is formed on the game board 2. A game ball (game medium) launched from the launch device passes through the launch path and is driven into the game area. In the gaming machine frame 3, a glass door frame having a glass window is rotatably provided.

  At predetermined positions on the game board 2, a first special symbol display device 4A, a second special symbol display device 4B, an image display device 5, an ordinary winning ball device 6A, an ordinary variable winning ball device 6B, a special variable winning ball device 7, A normal symbol display 20, a first hold indicator 25A, a second hold indicator 25B, a universal hold indicator 25C, a passing gate 41, and the like are provided. In addition, the game board surface in the game area may be provided with a windmill, a number of obstacle nails, a general winning port, an out port, and the like. A game effect lamp 9 is provided in the periphery of the game area. Speakers 8 </ b> L and 8 </ b> R are provided at the upper left and right positions of the gaming machine frame 3.

  A hitting operation handle (operation knob) is provided at the lower right position of the gaming machine frame 3. The hitting operation handle is operated by a player or the like to launch the game ball toward the game area, and the resilience of the game ball is adjusted according to the operation amount (rotation amount). A predetermined position of the gaming machine frame 3 below the gaming area is provided with an upper plate (batting ball supply tray) that holds (stores) game balls and a lower plate that holds (stores) extra balls from the upper plate. It has been. A stick controller 31A is attached to the member forming the lower plate, and a push button 31B is provided to the member forming the upper plate.

  On the screens of the first special symbol display device 4A, the second special symbol display device 4B, and the image display device 5, a special symbol and a decorative symbol are variably displayed. These variable indications are based on the occurrence of the first start winning due to the game ball passing (entering) the first starting winning opening formed in the normal winning ball device 6A, or on the normal variable winning ball device 6B. Execution is possible based on the occurrence of the second start winning due to the game ball passing (entering) through the formed second starting winning opening. Each of the first special symbol display device 4A and the second special symbol display device 4B is configured by using, for example, a 7-segment or dot matrix LED (light emitting diode) and the like. A special symbol (special symbol) which is information (special identification information) is displayed variably (variably displayed). The image display device 5 is configured using, for example, an LCD (liquid crystal display device) or the like, and forms a display area for displaying various effect images. On the screen of the image display device 5, the special symbol (first special symbol) by the first special symbol display device 4A and the special symbol (second special symbol) by the second special symbol display device 4B in the special symbol game are displayed. Corresponding to each of the variable displays, a decorative symbol as identification information (decorative identification information) is variably displayed in a decorative symbol display area serving as a plurality of variable display portions such as three. This variable display of decorative designs is also included in the variable display game. As an example, “left”, “middle”, and “right” decorative symbol display areas 5L, 5C, and 5R are arranged on the screen of the image display device 5.

  On the screen of the image display device 5, a hold storage display area 5H is arranged. In the hold memory display area 5H, a hold display for displaying the variable display hold number (special figure hold memory number) corresponding to the special figure game in an identifiable manner is performed. The hold display only needs to be capable of being displayed in correspondence with the hold storage of information regarding variable display. With the hold storage display area 5H or instead of the hold storage display area 5H, hold display using the first hold display 25A and the second hold display 25B may be performed.

  FIG. 2 is a block diagram illustrating a configuration example of various substrates and peripheral devices. The pachinko gaming machine 1 is equipped with various control boards such as a main board 11, an effect control board 12, an audio control board 13, and a lamp control board 14 as shown in FIG. The pachinko gaming machine 1 is also equipped with a relay board 15, a driver board 19, a power board 92, and the like. In addition, for example, various substrates such as a payout control substrate, an information terminal substrate, a launch control substrate, an interface substrate, and a touch sensor substrate may be mounted. Various control boards are not only electronic circuit boards such as printed wiring boards on which electrical components are mounted by forming conductor patterns, but also electrical components are mounted (mounted) on electronic circuit boards to achieve specific electrical functions. This is a concept including an electronic circuit mounting board configured as described above.

  The power supply board 92 is configured to be able to supply power from an AC power supply, which is an external power supply (commercial power supply), to electrical components including various control boards such as the main board 11 and the effect control board 12. The power supply board 92 includes, for example, a rectifier circuit for converting alternating current (AC) to direct current (DC), a power supply circuit for converting a predetermined direct current voltage to a specific direct current voltage (for example, direct current 12V, direct current 5V, etc.), and the like. Have. The voltage generated by the power supply board 92 may be supplied to the main board 11 and the effect control board 12 through the drawer relay board.

  On the main board 11, a game control microcomputer 100, a switch circuit 110, a solenoid circuit 111 and the like are mounted. In the main board 11, signals taken from various detection switches such as the gate switch 21, the start port switch (the first start port switch 22 </ b> A and the second start port switch 22 </ b> B), and the count switch 23 are passed through the switch circuit 110. It is transmitted to the game control microcomputer 100. The gate switch 21 detects a game ball (gate passing ball) that has passed through the passing gate 41. Based on the detection of the gate passing ball by the gate switch 21, variable display of the normal symbol by the normal symbol display 20 can be executed. The first start port switch 22A detects a game ball that has passed (entered) the first start winning port. The second start port switch 22B detects a game ball that has passed (entered) the second start winning port. The count switch 23 detects a game ball that has passed (entered) through the big winning opening. When a game ball that has passed through various winning holes such as the first starting winning hole, the second starting winning hole, and the big winning hole is detected, a predetermined number of balls corresponding to each winning hole is determined. As a game ball is paid out.

  On the main board 11, a solenoid drive signal from the game control microcomputer 100 is transmitted to the solenoid 81 for the ordinary electric accessory and the solenoid 82 for the big prize door through the solenoid circuit 111. The solenoid 81 for the ordinary electric accessory is in a state where the game ball is difficult to pass (or a state where it does not pass) and a state where it is easy to pass (or a state where it passes) through the second start winning opening formed in the normally variable winning ball device 6B. And changeable. The solenoid 82 for the special winning opening door allows the special winning opening formed in the special variable winning ball apparatus 7 to be changed between a state in which a game ball cannot pass and a state in which it can pass. A command signal for performing display control of the first special symbol display device 4A, the second special symbol display device 4B, the normal symbol display device 20 and the like is transmitted from the main board 11.

  The game control microcomputer 100 mounted on the main board 11 is, for example, a one-chip microcomputer, and includes a ROM 101 that stores a game control program and fixed data, and a RAM 102 that provides a game control work area. A CPU 103 that executes a game control program to perform a control operation, a random number circuit 104 that updates a numerical data indicating a random number value independently of the CPU 103, and an I / O (Input / Output port) 105 It is prepared for. As an example, in the game control microcomputer 100, a process for controlling the progress of the game in the pachinko gaming machine 1 is executed by the CPU 103 executing a program read from the ROM 101. In the game control microcomputer 100 mounted on the main board 11, various random values used for controlling the progress of the game are obtained by, for example, a random number circuit 104 or a game random counter provided in a predetermined area of the RAM 102. The numerical data shown is counted (generated) in an updatable manner. The random number used for controlling the progress of the game is also called a game random number.

  The effect control board 12 is based on reception of a control signal (effect control command) transmitted from the main board 11 via the relay board 15, the image display device 5, the speakers 8 </ b> L and 8 </ b> R, the game effect lamp 9, and the effect motor. It is possible to control the production operation by the electrical parts for production such as 60 and the production LED 61. On the effect control board 12, an effect control CPU 120, ROM 121, RAM 122, display control unit 123, random number circuit 124, I / O 125, and the like are mounted.

  The effect control CPU 120 mounted on the effect control board 12 uses the effect control program read from the ROM 121, fixed data, and the like to execute a process for controlling the effect operation by the effect electric parts. The display control unit 123 mounted on the effect control board 12 determines the control content of the display operation in the image display device 5 based on the display control command from the effect control CPU 120. For example, the display control unit 123 performs control for executing decorative display variable display and various effect displays by determining the switching timing of effect images to be displayed on the display screen of the image display device 5.

  A controller sensor unit 35A and a push sensor 35B are connected to the effect control board 12. The controller sensor unit 35A includes a tilt direction sensor and a trigger sensor. The tilt direction sensor makes it possible to detect the tilt direction of the operation rod using a plurality of sensors when the tilt operation is performed on the operation rod of the stick controller 31A. The trigger sensor makes it possible to detect the presence / absence of a push / pull operation on the trigger button provided on the operation stick of the stick controller 31A. That is, the controller sensor unit 35A can detect a player's operation using the stick controller 31A, such as a tilting operation with respect to the operating rod of the stick controller 31A or a push-pull operation with respect to the trigger button. The push sensor 35B can detect a player's operation using the push button 31B, such as a pressing operation on the push button 31B. On the effect control board 12, for example, a random counter for effects provided in a predetermined area of the random number circuit 124 or the RAM 122 counts numerical data indicating various random numbers used for controlling the execution of the effect in an updatable manner ( Generated). The random number used to control the execution of the effect is also referred to as an effect random number.

  The effect control board 12 includes a first board 12A and a second board 12B that is board-to-board connected to the first board 12A. The first board 12A is equipped with the CPU 120 for effect control, the graphics processor of the display control unit 123, and the like, and the second board 12B is an electrical component in which data unique to the model such as the ROM 121 and the image data memory is stored. Is installed. The graphics processor of the display control unit 123 may be a microprocessor that integrates the functions of the effect control CPU 120, or may be a microprocessor that is configured as a separate chip from the effect control CPU 120.

  The sound control board 13 is a control board for sound output control provided separately from the effect control board 12, and outputs sound from the speakers 8 </ b> L and 8 </ b> R based on commands and control data from the effect control board 12. A processing circuit for executing audio signal processing for the purpose is mounted. If a graphics controller or the like constituting the display control unit 123 mounted on the effect control board 12 can execute audio signal processing, a band filter, an amplifier circuit, or the like may be mounted on the audio control board 13. Alternatively, the audio control board 13 may be omitted, and a band filter, an amplifier circuit, and the like may be mounted on the effect control board 12. The lamp control board 14 is a control board for lamp output control that is provided separately from the effect control board 12, and lighting or lighting in the game effect lamp 9 or the like based on commands or control data from the effect control board 12. It includes a lamp driver circuit that turns off the lights. The driver board 19 is a control board for driving electrical components that is provided separately from the presentation control board 12, and various motors included in the presentation motor 60 based on commands and control data from the presentation control board 12. A driver circuit and the like are mounted for performing rotation control of the LED and lighting control of various LEDs included in the production LED 61. The output signal from the driver board 19 is transmitted toward each motor included in the effect motor 60 and each LED included in the effect LED 61.

  In the pachinko gaming machine 1, a predetermined game using a game ball as a game medium is performed, and a predetermined game value can be given based on the game result. As an example of a game using a game ball, a predetermined operation is performed based on a predetermined operation (for example, a rotation operation) performed by a player on a hitting operation handle provided at a lower right position of the gaming machine frame 3 in the pachinko gaming machine 1. A game ball as a game medium is launched toward a game area by a launch motor provided in the hit ball launching device. When the game ball that has flowed down the game area passes (enters) through various winning holes, the game ball as a prize ball is paid out. If the variable symbol display result for special symbols and decorative symbols is “big hit”, the big prize opening is opened and the game ball easily passes (enters), which is an advantageous state advantageous to the player. It becomes a big hit game state.

  The advantageous state is not limited to the big hit gaming state, and may include a special gaming state such as a short time state or a probable change state. In addition, the upper limit number of round games that can be executed in the big hit game state is the first round number (for example, “15”) larger than the second round number (for example, “7”), and it can be executed in the short time state. The upper limit number of variable displays is a first number (for example, “100”) greater than the second number (for example, “50”), and the big hit probability in the probability variation state is higher than the second probability (for example, 1/50). The number of consecutive chunks, which is one probability (for example, 1/20), and the number of repeated control that is repeatedly controlled to the big hit gaming state without being controlled to the normal state is greater than the second consecutive number of channels (for example, “5”) It may include a game situation that is more advantageous for the player, such as a part or all of the fact that the number of consecutive channels (for example, “10”) is reached.

  In the main board 11, when the power supply from the power supply board 92 is started, the CPU 103 of the game control microcomputer 100 is activated, and the CPU 103 starts executing the game control main process. In the game control main process, the CPU 103 performs necessary initial settings after setting the interrupt disabled. When the initial setting is completed, the interrupt processing is enabled and loop processing is started. Thereafter, an interrupt request signal is sent from the CTC to the CPU 103 every predetermined time (for example, 2 milliseconds), and the CPU 103 periodically executes game control timer interrupt processing.

  Game control timer interrupt processing includes switch processing, main-side error processing, information output processing, game random number update processing, special symbol process processing, normal symbol process processing, command control processing, and the like. In the switch processing, the state of detection signals input from various switches is determined. In the main-side error processing, abnormality diagnosis of the pachinko gaming machine 1 is performed, and a warning can be generated if necessary. In the information output process, predetermined data supplied to the hall management computer is output. In the game random number update process, at least a part of the game random number is updated by software. In the special symbol process, various types of processing are selected and executed in order to perform special symbol display control, open / close operation setting of the special prize opening, and the like in a predetermined procedure. In the normal symbol process, various types of processing are selected and executed in order to perform normal symbol display control and tilting operation setting of the movable wing piece in the normal variable winning ball apparatus 6B.

  In the special symbol process, a start winning determination process is first executed. After the start winning determination process is executed, the process selected according to the value of the special figure process flag is executed. Processes that can be selected at this time include special symbol normal processing, variation pattern setting processing, special symbol variation processing, special symbol stop processing, jackpot release pre-processing, jackpot release during processing, jackpot release after processing, jackpot end processing, etc. It only has to be.

  In the start winning determination process, it is determined whether or not a first start winning or a second start winning has occurred, and if it has occurred, a setting for updating the special figure holding memory number is performed. In the special symbol normal process, it is determined whether or not to start execution of the special symbol game. In the special symbol normal process, it is determined whether or not the variable display result of the special symbol or the decorative symbol is “big hit”. Further, in the special symbol normal process, setting of a confirmed special symbol in the special symbol game is performed in accordance with the variable display result. In the variation pattern setting process, the variation pattern is determined based on the variable display result. In the special symbol variation process, a setting for varying the special symbol, a setting for measuring the elapsed time from the start of variation, and the like are performed. In the special symbol stop process, the setting for stopping the change of the special symbol and stopping and displaying (deriving) the fixed special symbol that is the variable display result is performed.

  In the big hit release pre-processing, the variable display result corresponds to “big hit”, and settings are made to open the big winning opening in the big hit gaming state. In the big hit opening process, it is determined whether or not to return the big winning opening from the open state to the closed state. In the process after opening the jackpot, after returning the grand prize opening to the closed state, it is determined whether or not the number of rounds has reached the upper limit. If not, the next round can be executed. Settings are made to end the big hit gaming state. In the big hit end process, after waiting until a waiting time corresponding to the execution period of the ending effect for notifying the end of the big hit gaming state elapses, settings for starting the probability change control and the short time control are performed.

  In the effect control board 12, when power supply from the power supply board 92 is started, the effect control CPU 120 starts executing the effect control main process. In the effect control main process, a command analysis process, an effect control process process, and an effect random number update process are executed every time a timer interrupt occurs after predetermined initialization. In the command analysis process, an effect control command transmitted from the main board 11 is analyzed, and a flag corresponding to the analysis result is set. In the effect control process, various processes are selected and executed in order to control the electric parts for effects according to a predetermined procedure. In the effect random number update process, the count value for generating the effect random number is updated by software.

  In the production control process, first, a hold display update process is executed. After executing the hold display update process, the process selected according to the value of the effect process flag is executed. Processes that can be selected at this time may include variable display start waiting processing, variable display start setting processing, variable display effect processing, variable display stop processing, jackpot display processing, jackpot effect processing, ending effect processing, and the like. .

  In the hold display update process, settings for updating the display of the hold storage display area 5H according to the number of special figure hold memories are performed. In the variable display start waiting process, it is determined whether or not to start variable display of special symbols and decorative symbols. In the variable display start setting process, setting for starting variable display of decorative symbols is performed. In the variable display effect processing, setting for controlling the electric parts for the effect according to the effect control pattern is performed in response to the variable display of the decorative design. In the variable display stop process, control for deriving a definite decorative symbol that is a variable display result by stopping variable display of the decorative symbol is performed.

  In the jackpot display process, control for executing an effect (fanfare effect) for notifying the occurrence of the jackpot corresponding to the variable display result corresponding to “big hit” is performed. In the big hit effect processing, setting for controlling the electric parts for the production according to the production control pattern is performed corresponding to the big hit gaming state. In the ending effect process, setting for controlling the execution of the ending effect is performed in response to the end of the big hit gaming state.

  FIG. 3 is a rear view of the gaming machine frame 3 provided in the pachinko gaming machine 1. A ball tank 150 and a terminal board 154 are provided on the upper back of the gaming machine frame 3. A supply passage 151, a payout device 152, and a prize ball passage 153 are also provided. On the back surface of the game board 2, a board case 400 for a game control board, a board case 800 for an effect control board, and a cover body 301 are provided. The substrate case 400 accommodates the main substrate 11. The board case 800 houses the effect control board 12. The cover body 301 is configured using a transparent synthetic resin or the like, and covers the substrate case 800 and the upper portion of the substrate case 400. A payout control board 91 and a power supply board 92 are provided below the board case 400 for a game control board so as to overlap each other.

  With reference to FIGS. 4-7, the structure of the board | substrate case 800 for presentation control boards is demonstrated. FIG. 4 is an exploded perspective view showing a state in which the substrate case 800 is viewed from an obliquely upper left rear portion. FIG. 5 is an exploded perspective view showing a state in which the substrate case 800 is viewed obliquely from the upper right side. FIG. 6 is a six-side view showing the base member 801. FIG. 7 is a six-side view showing the cover member 802. The substrate case 800 includes a base member 801 and a cover member 802, and is assembled so as to sandwich the effect control substrate 12 from the front and rear. The base member 801 covers the front side of the effect control board 12, and the cover member 802 covers the back side of the effect control board 12.

  The base member 801 is made of a transparent thermoplastic synthetic resin, and includes a base plate 801a formed in a vertically long and substantially rectangular shape, and side walls 801b to 801e erected on the top, bottom, left and right sides toward the back side. It is formed in a box shape that opens toward the back side. The base plate 801a includes bosses 803 and 804, a locking bar 805, a locking hook 806, a locking hole 807, a locked portion 808, a screw hole 810 of a one-way screw 809, a mounting hole 811, a board support rib 812, 813, step portions 814a and 814b, and a rib 815 are provided.

  The cover member 802 is made of a transparent thermoplastic synthetic resin, and includes a base plate 821a that is formed in a vertically long and substantially rectangular shape, and side walls 821b to 811e that are erected on the top, bottom, left and right sides toward the back side. It is formed in a box shape that opens toward the back side. In the base plate 821a, a screw hole 823 into which a screw 822 is screwed, a positioning convex portion 824, a screw hole 826 into which a screw 825 is screwed, a positioning convex portion 827, a locking hook 831, a locking piece 832, a locking A part 833, an attachment piece 834 in which an attachment hole 834a for the one-way screw 809 is formed, a switch opening 835 for allowing the volume adjustment switch 835a to face the outside, and connector openings 836 and 837 are provided.

  The connector opening 836 is formed in a vertically long shape on the upper right side of the base plate 821a so that the various board-side connectors KCN10 mounted on the first board 12A face the outside. The various board-side connectors KCN10 only need to include the receptacles KRE1 to KRE4. The receptacle KRE1 is a connector port for main board wiring. The receptacle KRE2 is a connector port for power supply board wiring. The receptacle KRE3 is a connector port for driver board wiring. The receptacle KRE4 is a connector port for voice control board wiring. In addition, the arrangement of the receptacle and the wiring to be connected may be arbitrarily changed according to the specifications of the pachinko gaming machine 1.

  The receptacle KRE1 for main board wiring has a configuration of a wiring connection device that can detachably connect signal wiring (main board wiring) electrically connected to the main board 11. The receptacle KRE2 for power supply board wiring has a configuration of a wiring connection device that can detachably connect signal wiring (power supply board wiring) electrically connected to the power supply board 92. The receptacle KRE3 for driver board wiring has a configuration of a wiring connection device that can removably connect signal wiring (driver board wiring) electrically connected to the driver board 19. The receptacle KRE4 for voice control board wiring has a configuration of a wiring connection device that can removably connect signal wiring (voice control board wiring) electrically connected to the voice control board 13.

  8 to 10 show a configuration example of the receptacle KRE1. FIG. 8A is a perspective view showing a state in which the left rear portion is viewed obliquely from below. FIG. 8B is a perspective view showing a state in which the left rear portion is viewed obliquely from above. FIG. 9 is a rear view showing a state in which the vicinity of the receptacle KRE1 is viewed from the back side (rear side) outside the cover member 802. FIG. FIG. 10 is a cross-sectional view showing the vicinity of the receptacle KRE1 as seen from below. The receptacle KRE1 includes a housing in which an insertion port OP1 is formed, and terminals TA01 to TA03.

  The insertion port OP1 is an opening through which a connector plug provided on the main board wiring can be inserted and attached. Terminals TA01 to TA03 are made of metal such as copper, for example, and correspond to a plurality of terminals provided in the connector plug when the connector plug of the main board wiring is inserted into the insertion port OP1. It is a metal member that is in electrical contact with a terminal disposed at a position. In the receptacle KRE1, the terminals TA01 and TA03 serving as a pair of ground terminals are surface-mounted on the board of the effect control board 12 at positions sandwiching both sides of the terminal TA02 serving as a signal terminal. In the main board wiring, a ground line serving as a pair of ground voltage lines may be provided at positions sandwiching both sides of the signal line serving as a signal transmission line. Alternatively, a coaxial cable may be used as the main board wiring so that the inner conductor of the coaxial cable is electrically connected to the terminal TA02 and the outer conductor of the coaxial cable is electrically connected to the terminals TA01 and TA03. Good.

  In the receptacle KRE1, the terminals TA01 to TA03 are drawn to the outside at the side surface PL1 serving as a terminal arrangement surface, and can be joined to a connection pad provided on the board of the effect control board 12 (first board 12A). The method for bonding the terminal to the connection pad may be a metal bonding method using solder or the like, or an adhesive bonding method such as conductive resin bonding or anisotropic conductive member bonding. Fixing brackets SS01 and SS02 are provided on the side of the side surface PL2 which is the back side of the side surface PL1.

  In the cover member 802 of the substrate case 800, among the connector openings 836, the opening region 836a formed corresponding to the receptacle KRE1 has a narrower opening width than the opening regions formed corresponding to the other receptacles. It may be formed as follows. Terminals TA01 to TA03 of receptacle KRE1 are each formed to have an exposed portion that is exposed from substrate case 800 in opening region 836a and a covered portion that is covered by substrate case 800 and is not exposed. For example, in the terminals TA01 to TA03, the tip end portion to be joined to the corresponding connection pad may be included in the covering portion that is covered with the cover member 802 of the substrate case 800 and is not exposed.

  If the component housing portion 802a and the opening peripheral portion 840 that forms the inner peripheral wall surface 836b serving as the inner end surface in the opening region 836a are integrally formed on the cover member 802 of the substrate case 800 via the gradient portion 821e1. Good. The component accommodating part 802a is formed so that at least one part of the electrical component mounted on the board | substrate of the production | presentation control board 12 can be accommodated. In the opening region 836a, the distance between the inner peripheral wall surface 836b and the receptacle KRE1 is the distance between the inner peripheral wall surface 836b farther from the component housing portion 802a and the side surface PL2 of the receptacle KRE1 is the opening width W1. An opening width W2 is an interval between the inner peripheral wall surface 836b on the near side and the side surface PL1 serving as the terminal arrangement surface of the receptacle KRE1. The arrangement of the opening region 836a and the receptacle KRE1 may be adjusted so that the opening width W2 is wider than the opening width W1. In the terminals TA01 to TA03 of the receptacle KRE1, the front end portion which is a surface mounted by being bonded to the corresponding connection pad is covered with an opening peripheral portion 840 that forms an inner peripheral wall surface 836b in the opening region 836a. A space SP1 as a space is formed near the mounting position of the receptacle KRE1 by the opening peripheral edge portion 840 of the cover member 802 and the board surface of the effect control board 12.

  Terminal TA01 is joined to dummy pad DP1 provided on the substrate of effect control substrate 12. The terminal TA03 is joined to a dummy pad DP2 provided on the board of the effect control board 12. The terminals TA01 and TA03 are joined to the connection pad GPA1. The connection pad GPA1 only needs to be connected to the wiring layer LY4 on which the grounding wiring pattern is formed, through a through hole provided in the effect control board 12. The board cross section of the effect control board 12 shown in FIG. 10 has a wiring layer LY2 formed between the insulating layer LY1 and the insulating layer LY3, and the side on which the receptacle KRE1 is surface-mounted is protected with, for example, polyimide. It is sufficient that the layer LY0 is formed. As described above, the wiring pattern in the effect control board 12 may be formed in the wiring layer LY2 provided between the insulating layer LY1 and the insulating layer LY3 that are the inner layer portions in the board of the effect control board 12. Alternatively, the wiring pattern on the effect control board 12 may be formed on the surface of the effect control board 12. The terminal TA02 is bonded to a connection pad that is electrically connected to a wiring pattern for signal transmission.

  Fixing bracket SS01 provided in receptacle KRE1 is joined to dummy pad DP3 provided on the board of effect control board 12. Fixing bracket SS02 included in receptacle KRE1 is joined to dummy pad DP4 provided on the board of effect control board 12. As described above, the fixing brackets SS01 and SS02 are provided on the board of the effect control board 12 on the side face PL2 which is the back side of the side face PL1 on which the terminals TA01 to TA03 are arranged. What is necessary is just to make it join to.

  When an effect control command is transmitted from the main board 11 to the effect control board 12, the main board wiring for transmitting the command may have only one signal line serving as a signal transmission line. . Correspondingly, in the receptacle KRE1 that is surface-mounted on the board of the effect control board 12, only the terminal TA02 serving as a signal terminal may be provided. In this case, the area of the joint surface on the substrate of the effect control board 12 according to the lateral width and depth of the receptacle KRE1 is relative to the amount of protrusion from the substrate surface of the effect control board 12 according to the height of the receptacle KRE1. Since it becomes easy to reduce, there exists a possibility that the joint strength by surface mounting of receptacle KRE1 cannot fully be ensured. Therefore, in the receptacle KRE1, the terminals TA01 and TA03 serving as a pair of ground terminals are surface-mounted on the board of the effect control board 12 at positions sandwiching both sides of the terminal TA02 serving as a signal terminal. As a result, an appropriate substrate configuration capable of sufficiently ensuring the bonding strength by surface mounting of the receptacle KRE1 becomes possible. In addition, since both sides of the terminal TA02 serving as a signal terminal are sandwiched between a pair of terminals TA01 and TA03 serving as a ground terminal, an appropriate substrate configuration that is less susceptible to noise can be achieved.

  In receptacle KRE1, terminal TA01 is joined to dummy pad DP1 provided on the substrate of effect control board 12, and terminal TA03 is joined to dummy pad DP2 provided on the substrate of effect control board 12. Further, the tips of the terminals TA01 to TA03 are arranged so as to be covered with the cover member 802 of the substrate case 800. As described above, since the terminals TA01 and TA03 are bonded to the dummy pads DP1 and DP2, an appropriate substrate configuration capable of sufficiently securing the bonding strength by the surface mounting of the receptacle KRE1 is possible. Since the tip portions of the terminals TA01 to TA03 are covered with the cover member 802 of the substrate case 800, an appropriate substrate configuration capable of protecting important parts in surface mounting such as a joint portion between the terminal and the substrate surface becomes possible. Note that the terminal TA02 serving as a signal terminal may be bonded to the dummy pad or may not be bonded to the dummy pad. Signal deterioration due to the influence of the conductor shape may be prevented by preventing the terminal TA02 serving as a signal terminal from being bonded to the dummy pad.

  In receptacle KRE1, fixing bracket SS01 is joined and fixed to dummy pad DP3 provided on the substrate of effect control board 12 on the side of side PL2 which is the back side of side PL1 where terminals TA01 to TA03 are arranged. The metal fitting SS02 is joined to a dummy pad DP4 provided on the board of the effect control board 12. As described above, since the fixing metal fittings SS01 and SS02 are bonded to the dummy pads DP3 and DP4, an appropriate substrate configuration that can sufficiently secure the bonding strength due to the surface mounting of the receptacle KRE1 becomes possible. Note that, regardless of the method of joining the metal members such as the fixing metal fittings SS01 and SS02 on the substrate, for example, arbitrary fixing such as bonding a fixing member using a synthetic resin similar to the housing of the receptacle KRE1 onto the substrate. What is necessary is just to be able to join a member on a substrate.

  The component accommodating portion 802a in the cover member 802 of the substrate case 800 is formed so as to accommodate at least a part of the electrical components mounted on the substrate of the effect control substrate 12, and the inner peripheral wall surface 836b and the receptacle KRE1 in the opening region 836a. The opening width W2 on the side close to the component housing portion 802a is formed wider than the opening width W1 on the far side. The side close to the component housing portion 802a is the side PL1 that serves as a terminal arrangement surface from which the terminals TA01 to TA03 are drawn out in the receptacle KRE1. On the other hand, the side far from the component housing portion 802a is the side of the side surface PL2 that is the back side of the terminal arrangement surface in the receptacle KRE1. Accordingly, the distance between the inner peripheral wall surface 836b and the receptacle KRE1 in the opening region 836a is such that the opening width W2 on the side corresponding to the side surface PL1 serving as the terminal arrangement surface is the opening width on the side corresponding to the side surface PL2 serving as the back surface of the terminal arrangement surface. It is formed wider than W1. Since the opening width is adjusted in this way, for example, an appropriate substrate configuration in which the cover member 802 can be easily attached, removed, and aligned is possible. Further, it is possible to configure an appropriate substrate that can suppress damage caused by collision between the terminal arrangement surface of the receptacle KRE1 and the cover member 802 when the cover member 802 is attached or removed.

  Terminals TA01 to TA03 of receptacle KRE1 are each formed with an exposed portion that is not covered and exposed by cover member 802 of substrate case 800 and a covered portion that is covered and not exposed by cover member 802 of substrate case 800 in opening region 836a. The Thus, unlike the exposed portion, each terminal TA01 to TA03 is formed with a covered portion that is covered and not exposed, so that it is possible to protect important parts in surface mounting, such as a joint portion between the terminal and the substrate surface. Appropriate substrate configuration is possible.

  At the terminals TA01 to TA03 of the receptacle KRE1, the mounting positions that are surface-mounted so as to be joined to the corresponding connection pads on the board of the effect control board 12 are the openings of the cover member 802 that forms the inner peripheral wall surface 836b in the opening region 836a. Covered by a peripheral edge 840. Then, a space SP1 close to the mounting position of the receptacle KRE1 is formed by the opening peripheral edge portion 840 of the cover member 802 and the board surface of the effect control board 12. As described above, since the opening peripheral edge portion 840 of the cover member 802 and the board surface of the effect control board 12 are arranged so as to be adjustable in position, an appropriate board configuration capable of protecting the mounting position of the receptacle KRE1 is possible.

  FIG. 11A shows a transmission path corresponding to the main board wiring. As shown in FIG. 11A, the signal SCD supplied to the terminal TA02 at the receptacle KRE1 for main board wiring is input to the effect control CPU 120 via the input driver circuit 130. The terminals TA01 and TA03 of the receptacle KRE1 are grounded (connected to the ground line).

  FIG. 11B shows a transmission path corresponding to the power supply substrate wiring. The receptacle KRE2 for wiring the power supply board includes terminals TA11 to TA30. Among these, the terminals TA11 and TA12 and the terminals TA29 and TA30 corresponding to the outside in the receptacle KRE2 are all grounded (connected to the ground line). In addition to the terminals TA11, TA12, TA29, and TA30, the terminals TA25 and TA26 are grounded (connected to the ground line). A power supply voltage VSL2 of DC 34V is supplied to the terminals TA13 and TA14 of the receptacle KRE2. A power supply voltage VDD2 of DC 12V is supplied to terminals TA15 to TA20 of the receptacle KRE2. A power supply voltage VCC2 of DC 5V is supplied to terminals TA21 to TA24 of the receptacle KRE2. A DC 12V power supply voltage VDD3 is supplied to the terminals TA27 and TA28 of the receptacle KRE2.

  The direct current 34V power supply voltage VSL2 supplied from the power supply board 92 to the effect control board 12 via the power supply board wiring connected to the receptacle KRE2 for power supply board wiring is directly output from the effect control board 12 as the power supply voltage VSL. Then, it is supplied to the driver board 19 via the driver board wiring connected to the receptacle KRE3 for driver board wiring. For example, in the receptacle KRE2 for power supply substrate wiring, the terminals TA13 and TA14 that receive the supply of the power supply voltage VSL2 are connected to the power supply line LSL, and the power supply line LSL is connected to a predetermined terminal in the receptacle KRE3 for driver substrate wiring. . As shown in FIG. 4, the receptacle KRE2 for power supply board wiring is provided adjacent to the receptacle KRE3 for driver board wiring, and the power supply line LSL is an effect control that does not approach the main electric circuits and electrical components on the effect control board 12. What is necessary is just to arrange | position so that the edge part of the board | substrate 12 may be passed.

  FIG. 12 shows a transmission path of the power supply voltage VSL. In the power supply substrate 92, a power supply voltage VSL2 of DC 34V is generated from a commercial power supply that is an external power supply, using the transformer circuit 501, the DC voltage generation circuit 502, and the like. For example, in the transformer circuit 501, a power supply voltage of AC 24V is generated. The DC voltage generation circuit 502 includes a rectifier circuit and a smoothing circuit, and rectifies and smoothes an AC 24V power supply voltage to generate a DC 34V power supply voltage VSL2. Since the direct current 34V power supply voltage VSL2 is not subjected to voltage control by feedback control or the like, the direct current 34V power supply voltage VSL2 also fluctuates due to fluctuations in the alternating current 24V power supply voltage. Thus, the DC 34V power supply voltage VSL2 supplied to the terminals TA13 and TA14 of the receptacle KRE2 is a DC voltage having a large fluctuation range (ripple component) in which voltage control is not performed. On the other hand, the DC 12V power supply voltage VDD2 supplied to the terminals TA15 to TA20 of the receptacle KRE2, the DC 5V power supply voltage VCC2 supplied to the terminals TA21 to TA24 of the receptacle KRE2, and the terminals TA27 and TA28 of the receptacle KRE2. The DC 12V power supply voltage VDD3 may be any DC voltage that is voltage-controlled by feedback control in the power supply substrate 92 and has a smaller fluctuation width (ripple component) than the DC 34V power supply voltage VSL. .

  In the effect control board 12, the power supply line LSL corresponding to the DC power supply voltage VSL of 34V does not include a stabilization circuit such as a filter circuit for stabilizing the voltage. On the other hand, in the driver substrate 19, the power supply voltage VSL of DC 34V is input to the filter circuit 511, and the voltage is stabilized. Further, in the effect control board 12, a stabilization circuit for stabilizing the voltage by a filter circuit or the like is interposed in a power supply line corresponding to a power supply voltage different from the power supply voltage VSL of 34V DC.

  For example, in the receptacle KRE2 for power supply substrate wiring, the terminals TA15 to TA20 to which the DC 12V power supply voltage VDD2 is supplied are connected to the filter circuit 131a, and the terminals TA21 to TA24 to which the DC 5V power supply voltage VCC2 is supplied are filtered. Terminals TA27 and TA28 connected to the circuit 131b and supplied with a 12V DC power supply voltage VDD3 are connected to the filter circuit 131c. The output section of the filter circuit 131a is connected to a power supply line LDS that supplies a power supply voltage VDS of DC 12V, and the output section of the filter circuit 131b is connected to a power supply line LCC that supplies a power supply voltage VCC of DC 5V. The output unit is connected to a power supply line LDC that supplies a power supply voltage VDC of DC 12V. Thus, the filter circuit 131a is interposed between the terminals TA15 to TA20 of the receptacle KRE2 and the power supply line LDS corresponding to the power supply voltage VDS of DC 12V, and the filter circuit 131b is connected to the terminals TA21 to TA24 of the receptacle KRE2 and the power supply voltage of DC 5V. The filter circuit 131c is interposed between the terminals TA27 and TA28 of the receptacle KRE2 and the power supply line LDC corresponding to the DC power supply voltage VDC of 12V.

  The power supply line LSL is provided to supply a power supply voltage VSL of DC 34V. The power supply line LDS is provided to supply a power supply voltage VDS of DC 12V. The power supply line LCC is provided for supplying a power supply voltage VCC of DC 5V. The power supply line LDC is provided for supplying a power supply voltage VDC of 12V DC. Therefore, the power supply line LSL without the filter circuit is provided to supply a higher power supply voltage than any of the power supply lines LDS, LCC, and LDC with the filter circuit interposed.

  In the receptacle KRE2, six terminals TA15 to TA20 to which a DC 12V power supply voltage VDD2 is supplied, four terminals TA21 to TA24 to which a DC 5V power supply voltage VCC2 is supplied, and two terminals to which a DC 12V power supply voltage VDD3 is supplied. While terminals TA27 and TA28 are provided, two terminals TA13 and TA14 to which a power supply voltage VSL2 of DC 34V is supplied are provided. Therefore, in the receptacle KRE2, among the terminals to which the power supply voltage is supplied, the number of terminals TA15 to TA20, TA21 to TA24, TA27, and TA28 connected to the filter circuit is equal to the terminal TA13 that is not connected to the filter circuit. More than the number of terminals of TA14. The number of terminals corresponding to each power supply voltage may be set according to the power supply capacity and the load current.

  In the receptacle KRE2, a DC 12V power supply voltage VDD2 is supplied to the terminals TA15 to TA20, a DC 5V power supply voltage VCC2 is supplied to the terminals TA21 to TA24, and a DC 12V power supply voltage VDD3 is supplied to the terminals TA27 and TA28. Thus, the power supply voltage VSL2 of DC 34V is supplied to the terminals TA13 and TA14. A filter circuit 131a is interposed between the terminals TA15 to TA20 of the receptacle KRE2 and the power supply line LDS for supplying the DC 12V power supply voltage VDS, and supplies the terminals TA21 to TA24 of the receptacle KRE2 and the DC power supply voltage VCC of 5V. The filter circuit 131b is interposed between the power line LCC and the terminals TA27 and TA28 of the receptacle KRE2 and the power line LDC supplying the DC 12V power voltage VDC. On the other hand, no filter circuit is interposed between the terminals TA13 and TA14 of the receptacle KRE2 and the power supply line LSL for supplying the power supply voltage VSL of DC 34V. As described above, the power supply lines LDS, LCC, and LDC in which the filter circuit is interposed can supply a plurality of types of power supply voltages such as DC 12V or DC 5V, and the power supply line LSL in which the filter circuit is not interposed is one type of DC 34V. Can be supplied. In the receptacle KRE2, the terminals TA13 and TA14 are arranged outside the terminals TA15 to TA24 and the like. Alternatively, the receptacle KRE2 includes terminals arranged inside the terminals TA13 and TA14 among the terminals TA15 to TA24, TA27, and TA28, such as the terminals TA15 to TA24.

  In the receptacle KRE2, terminals TA13 to TA24, TA27, and TA28 are arranged between the terminals TA11 and TA12 and the terminals TA29 and TA30. Terminals TA13 to TA24, TA27, and TA28 are all terminals to which a power supply voltage is supplied, and serve as power supply voltage terminals connected to various power supply voltages. On the other hand, the terminals TA11 and TA12 and the terminals TA29 and TA30 are terminals to which no power supply voltage is supplied, and are ground terminals connected to the ground voltage. Therefore, in the receptacle KRE2, terminals TA13 to TA24, TA27, and TA28 that are power supply voltage terminals are arranged between the terminals TA11 and TA12 that are ground terminals and the terminals TA29 and TA30.

  In the receptacle KRE2, the terminals TA13 and TA14 and the terminals TA15 to TA24 are arranged between the terminals TA11 and TA12 and the terminals TA25 and TA26, and the terminals TA25 and TA26 are connected between the terminals TA29 and TA30. TA27 and TA28 are arranged. Terminals TA13 and TA14 are terminals to which a power supply voltage VSL2 of DC 34V is supplied, and are power supply voltage terminals connected to the power supply voltage VSL2. Terminals TA15 to TA20 are terminals to which a 12V DC power supply voltage VDD2 is supplied and are connected to the power supply voltage VDD2. Terminals TA21 to TA24 are terminals to which a power supply voltage VCC2 of DC 5V is supplied, and are power supply voltage terminals connected to the power supply voltage VCC2. Terminals TA27 and TA28 are terminals to which a DC power supply voltage VDD3 of 12V is supplied, and are power supply voltage terminals connected to the power supply voltage VDD3. Therefore, terminals TA13 and TA14 as power supply voltage terminals connected to the power supply voltage VSL2 of DC 34V, and terminals TA15 to TA24, TA27 and TA28 as power supply voltage terminals connected to power supply voltages other than the power supply voltage VSL2 of DC 34V. The terminals TA15 to TA24, which are part of the terminals TA15 and TA24, are arranged between the terminals TA11 and TA12 serving as ground terminals and the terminals TA25 and TA26. Among the terminals TA15 to TA24, TA27, and TA28 as power supply voltage terminals connected to a power supply voltage other than the DC 34V power supply voltage VSL2, the other terminals TA27 and TA28 serve as ground terminals. Arranged between TA25, TA26 and terminals TA29, TA30.

  The DC 12V power supply voltage VDD3 supplied to the terminals TA27 and TA28 is used by the step-down converter circuit 132 to generate a DC 1.05V power supply voltage. The power supply voltage of DC 1.05 V is supplied to a specific microprocessor such as a graphics processor of the display control unit 123, for example. Therefore, in the receptacle KRE2, among the terminals TA13 to TA24, TA27, and TA28 connected to the power supply voltage, the terminals TA13 and TA14 connected to the DC 34V power supply voltage VSL2 having a relatively large fluctuation range (ripple component) are These are arranged farthest from TA 27 and TA 28 connected to a 12 V DC power supply voltage VDD 3 used for generating a power supply voltage supplied to a specific microprocessor such as a graphics processor of the display control unit 123.

  In the effect control board 12, the power supply voltage VSL2 of DC 34V may be stabilized and then output as the power supply voltage VSL. However, the installation of the circuit element that stabilizes the direct current 34V power supply voltage VSL2 that has no direct use in the production control board 12 causes an increase in the number of parts and the board volume, and the power loss and the manufacturing cost also increase. Further, the installation of special circuit elements may make it difficult to reuse and share the production control board 12. Therefore, the DC 34V power supply voltage VSL2 that is not subjected to voltage control is output as it is from the effect control board 12 as the power supply voltage VSL, and is input to the filter circuit 511 by the driver board 19 to stabilize the voltage. As a result, an appropriate board configuration that prevents an increase in the number of components and the board volume, power loss, and an increase in manufacturing cost becomes possible. In addition, an appropriate board configuration in which the production control board 12 can be easily reused and shared is possible. In addition, the power supply line LSL is arranged away from the main electric circuits and electric components in the effect control board 12, so that an appropriate board configuration that prevents the adverse effect of noise due to a DC voltage having a large fluctuation range (ripple component) is obtained. It becomes possible.

  In the effect control board 12, a power supply line LSL for supplying a power supply voltage VSL of DC 34V is a power supply line LDS for supplying a power supply voltage VDS of DC 12V, a power supply line LCC for supplying a power supply voltage VCC of DC 5V, and a power supply of DC 12V Compared with any of the power supply lines LDS for supplying the voltage VDS, a direct current of 34 V, which is a high power supply voltage, is supplied. In general, a stabilization circuit that stabilizes a high power supply voltage tends to have a larger circuit element volume and power loss than a stabilization circuit that stabilizes a low power supply voltage, and the cost of the circuit element is higher. It tends to be a thing. Therefore, an appropriate substrate configuration that prevents an increase in substrate volume, power loss, and increase in manufacturing cost is possible by not including a filter circuit in the power supply line LSL that supplies the power supply voltage VSL of 34 V DC, which is a high power supply voltage. become.

  In the receptacle KRE2, a power supply voltage VSL of DC 34V is supplied to the two terminals TA13 and TA14. In contrast, in the receptacle KRE2, a DC 12V power supply voltage VDD2 is supplied to the six terminals TA15 to TA20, and a DC 5V power supply voltage VCC2 is supplied to the four terminals TA21 to TA24. Is supplied with a power supply voltage VDD3 of DC 12V. Therefore, in the effect control board 12, the number of terminals TA15 to TA24, TA27, and TA28 connected to any of the filter circuits 131a to 131c among the terminals to which the power supply voltage is supplied in the receptacle KRE2 is the filter circuit. More than the number of terminals TA13 and TA14 not connected to. Since the number of terminals is set in this manner, for example, an appropriate board that improves the degree of freedom in wiring design according to the use of the power supply voltage and the power supply capacity, etc. for which the voltage is to be stabilized by the effect control board 12 Configuration is possible.

  In the receptacle KRE2, among the terminals to which the power supply voltage is supplied, the terminals TA15 to TA24, TA27, and TA28 connected to any one of the filter circuits 131a to 131c on the effect control board 12 receive the power supply voltage VDD2 of DC 12V. Terminals TA15 to TA20 that can be supplied, terminals TA21 to TA24 that can supply a power supply voltage VCC2 of DC 5V, and terminals TA27 and TA28 that can supply a power supply voltage VDD3 of DC 12V are included. On the other hand, in the receptacle KRE2, among the terminals to which the power supply voltage is supplied, the terminals TA13 and TA14 that are not connected to the filter circuit in the effect control board 12 can supply the power supply voltage VSL2 of DC 34V. The power supply voltage is not supplied. For this reason, the number of types of power supply voltages that can be supplied differs depending on whether the power supply line includes a filter circuit or the power supply line does not include a filter circuit. More specifically, the power supply line in which the filter circuit is interposed can supply a plurality of types of power supply voltages such as a power supply voltage VDD2 of DC 12V, a power supply voltage VCC2 of DC 5V, and a power supply voltage VDD2 of DC 12V. A power supply line without intervening can supply one type of power supply voltage, that is, a power supply voltage VSL of DC 34V. As described above, since the number of types of power supply voltages that can be supplied corresponding to the power supply line is different, the wiring design can be freely set according to the use of the power supply voltage to be stabilized by the production control board 12, for example. Appropriate substrate configuration to improve the degree is possible.

  The terminals TA13 and TA14 connected to the power supply line not including the filter circuit are disposed outside the terminals TA15 to TA24 connected to the power supply line including the filter circuit. Such an arrangement of terminals enables an appropriate board configuration that improves the degree of freedom in wiring design according to, for example, the use of a power supply voltage for which the voltage is to be stabilized by the effect control board 12. In addition, it is possible to realize an appropriate board configuration that shortens the wiring length for outputting the power supply voltage VSL2 of 34V DC supplied to the terminals TA13 and TA14 as it is to the driver board 19 as the power supply voltage VSL.

  In the receptacle KRE2, the terminals TA13 to TA24, TA27, and TA28 are power supply voltage terminals connected to various power supply voltages. On the other hand, in the receptacle KRE2, the terminals TA11 and TA12 and the terminals TA29 and TA30 are all ground terminals connected to the ground voltage. The terminals TA13 to TA24, TA27, and TA28 are disposed between the terminals TA11 and TA12 and the terminals TA29 and TA30. Such an arrangement of terminals enables an appropriate substrate configuration that is less susceptible to noise. In addition, an appropriate substrate configuration that shields the power supply voltage and prevents the generation of noise can be realized.

  In the receptacle KRE2, the terminals TA15 to TA24, TA27, and TA28 are first power supply voltage terminals that are connected to a power supply voltage different from the DC power supply voltage VSL2. On the other hand, in the receptacle KRE2, the terminals TA13 and TA14 become second power supply voltage terminals connected to the power supply voltage VSL2 of DC 34V. In the receptacle KRE2, the terminals TA11 and TA12 are first ground terminals connected to the ground voltage, the terminals TA25 and TA26 are second ground terminals connected to the ground voltage, and the terminals TA29 and TA30 are connected to the ground voltage. A third ground terminal. In the receptacle KRE2, the terminals TA13 and TA14 included in the second power supply voltage terminal, the terminals TA15 to TA24 included in the first power supply voltage terminal, the terminals TA11 and TA12 included in the first ground terminal, and the second The terminals TA27 and TA28 which are disposed between the terminals TA25 and TA26 included in the ground terminal and are included in the first power supply voltage terminal are included in the terminals TA25 and TA26 included in the second ground terminal and the third ground terminal. Arranged between terminals TA29 and TA30. Such an arrangement of terminals enables an appropriate substrate configuration that is less susceptible to noise. In particular, the terminals TA25 and TA26 included in the second ground terminal are included in the terminals TA13 and TA14 included in the second power supply voltage terminal and the terminals TA15 to TA24 included in the first power supply voltage terminal and the first power supply voltage terminal. By disposing them between TA27 and TA28, an appropriate substrate configuration that is less susceptible to noise becomes possible. In addition, an appropriate substrate configuration that efficiently shields the power supply voltage and prevents the generation of noise can be realized. In addition, the terminals TA13 and TA14 connected to the DC 34V power supply voltage VSL2 are connected to the DC 12V power supply voltage VDD3 used to generate a power supply voltage to be supplied to a specific microprocessor such as a graphics processor of the display control unit 123. Therefore, it is possible to make an appropriate substrate configuration in which a specific microprocessor is hardly affected by noise.

  In the effect control board 12, the power supply voltage VDL is branched at the branch point DB1 from the power supply voltage VDD2 supplied at the terminals TA15 to TA20 of the receptacle KRE2. After the power supply voltage VDL is branched at such a branch point DB1, the power supply voltage VDS is stabilized by the filter circuit 131a. The power supply voltage VDL is a DC 12V power supply voltage used for driving a specific electrical component such as a specific LED included in the production LED 61. The power supply voltage VDS is a DC 12V power supply voltage that is supplied to the amplifier circuit 521 and used to output an audio signal. Thus, the filter circuit 131a stabilizes the power supply voltage VDS after branching the one power supply voltage VDD2 into the power supply voltage VDL and the power supply voltage VDS. The effect control board 12 may be provided with an amplifying circuit 521 so that audio signals supplied to the speakers 8L and 8R can be output.

  FIG. 13A shows the relationship between the wiring lengths of the wirings for supplying the power supply voltage VDS. In the effect control board 12, the power supply line LDS for supplying the power supply voltage VDS to the amplifier circuit 521 includes a wiring having a wiring length LL1 from the branch point DB1 to the input part of the filter circuit 131a and an output part of the filter circuit 131a. It is only necessary to include a wiring having a wiring length LL2 to the input portion of the amplifier circuit 521. And the arrangement | positioning of the wiring and circuit in the presentation control board 12 should just be adjusted so that wiring length LL2 may become shorter than wiring length LL1. Thus, the wiring length LL2 from the filter circuit 131a to the amplifier circuit 521 is shorter than the wiring length LL1 from the branching point DB1 to the filter circuit 131a after the power supply voltage VDS is branched. The amplifier circuit 521 and the filter circuit 131a are not limited to those installed on the effect control board 12, and may be installed on the sound control board 13.

  FIG. 13B shows a transmission path of the power supply voltage VDS when the amplifier circuit 521 and the filter circuit 131a are installed on the sound control board 13. In the power supply board 92, a DC 12V power supply voltage VDD2 is generated from a commercial power supply that is an external power supply, using the transformer circuit 501, the DC voltage generation circuit 502, and the like. A power supply voltage VDD2 of DC 12V is supplied to terminals TA15 to TA20 in a receptacle KRE2 for power supply substrate wiring. In the effect control board 12, after the power supply voltage VDL is branched at the branch point DB1 from the power supply voltage VDD2 supplied at the terminals TA15 to TA20 of the receptacle KRE2, it is directly output from the effect control board 12 as the power supply voltage VDS. The sound control board 13 may be supplied via a voice control board wiring connected to the receptacle KRE4 for the voice board wiring. For example, in the receptacle KRE2 for power supply board wiring, the terminals TA15 to TA20 that receive the supply of the power supply voltage VDD2 are connected to the power supply line LDS, and the power supply line LDS is connected to a predetermined terminal in the receptacle KRE4 for voice control board wiring. Just do it. In the effect control board 12, the power supply line LDS corresponding to the DC 12V power supply voltage VDS may not include a stabilization circuit for stabilizing the voltage of the filter circuit or the like. On the other hand, in the sound control board 13, the power supply voltage VDS of DC 12V is input to the filter circuit 131a to stabilize the voltage. The stabilized power supply voltage VDS may be supplied to the amplifier circuit 521.

  The voice control board 13 may be provided with a voice control IC 522, a voice data ROM 523, and the like. The sound control IC 522 executes signal processing for generating sound and sound effects in accordance with a command (such as sound number data) output from the effect control CPU 120 of the effect control board 12 or the like. The voice data ROM 523 stores control data corresponding to the sound number data. The control data corresponding to the sound number data is a collection of data indicating in time series the output mode of sound and sound effects in a predetermined period (for example, a decorative symbol variable display period). Various configurations provided on the sound control board 13 may be provided on the effect control board 12, and the sound control board 13 may not be provided.

  The amplifier circuit 521 that can amplify an audio signal generated by the audio control IC 522 and output it to the speakers 8L, 8R, etc. has a sound quality such that when the power supply voltage fluctuates, the output audio signal is distorted. May be adversely affected. Therefore, the DC 12V power supply voltage VDS is stabilized by the filter circuit 131a and then supplied to the amplifier circuit 521. In the effect control board 12, after one power supply voltage VDD2 is branched into a power supply voltage VDL for driving a specific electrical component and a power supply voltage VDS for supplying to the amplifier circuit 521, the filter circuit 131a is used. The stabilized power supply voltage VDS is supplied to the amplifier circuit 521. In this manner, by supplying the power supply voltage VDS stabilized using the filter circuit 131a to the amplifier circuit 521, an appropriate substrate configuration that allows the amplifier circuit 521 to operate stably becomes possible.

  In the power supply line LDS corresponding to the power supply voltage VDS supplied to the amplifier circuit 521, the wiring length LL2 from the filter circuit 131a to the amplifier circuit 521 is supplied to the filter circuit 131a after the power supply voltage VDL is branched at the branch point DB1. It becomes shorter than the wiring length LL1 until input. As described above, by shortening the wiring length until the power supply voltage VDS stabilized using the filter circuit 131a is supplied to the amplifier circuit 521, it is difficult to be affected by noise, and the amplifier circuit 521 can be operated stably. Substrate construction is possible.

  In the effect control board 12, the power supply voltage VCL is branched from the power supply voltage VCC2 supplied at the terminals TA21 to TA24 of the receptacle KRE2. After the power supply voltage VCL is branched, the power supply voltage VCC is stabilized by the filter circuit 131b. The power supply voltage VCL is a DC 5V power supply voltage used for driving a specific electrical component such as a specific motor included in the effect motor 60 or a specific LED included in the effect LED 61. The power supply voltage VCC is a direct current power supply of direct current 5V used for driving a predetermined electric circuit such as the CPU 120 for effect control. Thus, the filter circuit 131b stabilizes the power supply voltage VDD after the one power supply voltage VCC2 is branched into the power supply voltage VCL and the power supply voltage VDD.

  In the effect control board 12, the power supply voltage VDD3 supplied at the terminals TA27 and TA28 of the receptacle KRE2 is stabilized by the filter circuit 131c, and then branched so that the power supply voltage VDC can be supplied. The power supply voltage VDC is a DC 12V power supply voltage used for monitoring the occurrence of power interruption. The power supply voltage VDD3 is input to the step-down converter circuit 132 after being stabilized by the filter circuit 131c. The step-down converter circuit 132 is a circuit that converts a 1-input 2-output DC voltage. The step-down converter circuit 132 shown in FIG. 11 receives a voltage obtained by stabilizing the power supply voltage VDD3 of DC 12V by the filter circuit 131c, and converts it into a power supply voltage of DC 1.05V and a power supply voltage of DC 3.3V. Output. The output section of the step-down converter circuit 132 is connected to a power supply line L10 that supplies a power supply voltage of DC 1.05V and a power supply line L33 that supplies a power supply voltage of DC 3.3V. A power supply voltage of DC 1.05V is used for driving a predetermined electric circuit such as a graphics processor included in the display control unit 123, for example. The power supply voltage of DC 3.3V is used for driving a predetermined electric circuit such as an image data memory included in the ROM 121 or the display control unit 123, for example. The power supply voltage of DC 3.3V is also input to the regulator circuit 133. The regulator circuit 133 may be a linear-type stabilized power supply circuit such as a series regulator such as an LDO (Low Drop-Out) regulator. A DC 3.3V power supply voltage is input and a DC 1.5V power supply voltage is input. Convert to and output. The output part of the regulator circuit 133 is connected to a power supply line L15 that supplies a power supply voltage of DC 1.5V. The power supply voltage of DC 1.5V is used for driving a predetermined electric circuit such as the RAM 122, for example.

  FIG. 14 shows a configuration example of the filter circuits 131a to 131c. FIG. 14A shows a configuration example of the filter circuit 131a corresponding to the power supply voltage VDS. FIG. 14B shows a configuration example of the filter circuit 131b corresponding to the power supply voltage VCC. FIG. 14C illustrates a configuration example of the filter circuit 131c corresponding to the power supply voltage VDC.

  The filter circuit 131a illustrated in FIG. 14A may be configured using a three-terminal capacitor 85a, bypass capacitors C10 and C11, and an electrolytic capacitor C1. The bypass capacitors C10 and C11 are noise countermeasure electrical components that prevent high-frequency noise compared to the electrolytic capacitor C1, and are also referred to as decoupling capacitors. The electrolytic capacitor C1 is a noise countermeasure electrical component that prevents low-frequency noise as compared with the bypass capacitors C10 and C11. The input terminal (IN) of the three-terminal capacitor 85a serves as an input part of the filter circuit 131a and is supplied with a power supply voltage VDD2 of DC 12V. The output terminal (OUT) of the three-terminal capacitor 85a serves as an output section of the filter circuit 131a, and supplies a DC 12V power supply voltage VDS whose voltage is stabilized. The ground terminal (GND) of the three-terminal capacitor 85a is grounded (connected to the ground line). A 0.1 μF bypass capacitor C10, a 47 μF bypass capacitor C11, and a 1000 μF electrolytic capacitor C1 are connected between the output terminal of the three-terminal capacitor 85a and the ground terminal.

  The filter circuit 131b illustrated in FIG. 14B may be configured using a three-terminal capacitor 85b, bypass capacitors C12 and C13, and an electrolytic capacitor C2. The bypass capacitors C12 and C13 are noise countermeasure electrical components that prevent high-frequency noise as compared with the electrolytic capacitor C2. The electrolytic capacitor C2 is an electrical component for noise countermeasures that prevents low-frequency noise as compared with the bypass capacitors C12 and C13. The input terminal (IN) of the three-terminal capacitor 85b serves as an input part of the filter circuit 131b and is supplied with a power supply voltage VCC2 of DC 5V. The output terminal (OUT) of the three-terminal capacitor 85b serves as an output part of the filter circuit 131b, and supplies a DC 5V power supply voltage VCC with a stabilized voltage. The ground terminal (GND) of the three-terminal capacitor 85b is grounded (connected to the ground line). Between the output terminal and the ground terminal of the three-terminal capacitor 85b, a 0.1 μF bypass capacitor C12, a 47 μF bypass capacitor C13, and a 1000 μF electrolytic capacitor C2 are connected.

  The filter circuit 131c shown in FIG. 14C may be configured using a three-terminal capacitor 85c, a bypass capacitor C14, and an electrolytic capacitor C3. The bypass capacitor C14 is a noise countermeasure electrical component that prevents high-frequency noise as compared with the electrolytic capacitor C3. The electrolytic capacitor C3 is a noise countermeasure electrical component that prevents low frequency noise as compared to the bypass capacitor C14. The input terminal (IN) of the three-terminal capacitor 85c serves as an input part of the filter circuit 131c, and is supplied with a power supply voltage VDD3 of DC 12V. An output terminal (OUT) of the three-terminal capacitor 85c serves as an output section of the filter circuit 131c, and supplies a DC 12V power supply voltage VDC with a stabilized voltage. The ground terminal (GND) of the three-terminal capacitor 85c is grounded (connected to the ground line). Between the output terminal of the three-terminal capacitor 85c and the ground terminal, a 0.1 μF bypass capacitor C14 and a 1000 μF electrolytic capacitor C3 are connected.

  The filter circuits 131a to 131c function as a stabilization circuit that stabilizes the voltage of each power supply path. For example, the filter circuit 131a stabilizes the DC 12V power supply voltage VDS supplied by the power supply line LDS. The filter circuit 131b stabilizes the DC power supply voltage VCC of 5V supplied from the power supply line LCC. The filter circuit 131c stabilizes the DC 12V power supply voltage supplied by the power supply line LDC. In addition to the filter circuits 131a to 131c, the effect control board 12 may be provided with a noise prevention circuit that prevents the occurrence of noise at various power supply voltages.

  FIG. 15 shows a configuration example of a noise prevention circuit provided on the effect control board 12. FIG. 15A shows a configuration example of the noise prevention circuit 135a corresponding to the LED DC12V (DC 12V) called the power supply voltage VDL. FIG. 15B shows a configuration example of the noise prevention circuit 135b corresponding to the LED / motor DC 5V (DC 5V) of the power supply voltage VCL. FIG. 15C shows a configuration example of the noise prevention circuit 135c corresponding to the IC DC5V (DC 5V) called the power supply voltage VCC and the DC DC 3.3V (DC 3.3V) called the DC power supply voltage 3.3V. ing.

  A noise prevention circuit 135a shown in FIG. 15A is configured using a capacitor C20 and a resistor R20 connected in series, a capacitor C21 and a resistor R21 connected in series, and a capacitor C22 and a resistor R22 connected in series. It only has to be. Any of these configurations may be connected to the power supply line LDL that supplies the power supply voltage VDL and the ground terminal (ground line) that supplies the ground voltage. Capacitors C20, C21 and C22 may all be 0.1 μF bypass capacitors. The resistors R20, R21, and R22 only need to have a resistance value of 22Ω.

  The noise prevention circuit 135b illustrated in FIG. 15B may be configured using a capacitor C23 and a resistor R23 connected in series, and a capacitor C24 and a resistor R24 connected in series. Any of these configurations may be connected to the power supply line LCL that supplies the power supply voltage VCL and the ground terminal (ground line) that supplies the ground voltage. Capacitors C23 and C24 may be any bypass capacitors of 0.1 μF. The resistors R23 and R24 only need to have a resistance value of 22Ω.

  The noise prevention circuit 135c illustrated in FIG. 15C may be configured using capacitors C25 to C28. The capacitor C25 only needs to be connected to the power supply line LCC that supplies the power supply voltage VCC and the ground terminal (ground line) that provides the ground voltage. Capacitors C26, C27, and C28 only need to be connected to a power supply line L33 that supplies a power supply voltage of 3.3V DC and a ground terminal (ground line) that provides a ground voltage. All of the capacitors C25 to C28 may be 0.1 μF bypass capacitors.

  In the noise prevention circuit 135a shown in FIG. 15A, resistors R20, R21, and R22 are used in addition to the capacitors C20, C21, and C22. In the noise prevention circuit 135b shown in FIG. 15B, resistors R23 and R24 are used in addition to the capacitors C23 and C24. On the other hand, in the noise prevention circuit 135c shown in FIG. 15C, capacitors C25 to C28 are used, and no resistors are used. Thus, in the noise prevention circuits 135a and 135b, resistors R20, R21, and R22 and resistors R23 and R24 are used as circuit elements different from the noise prevention circuit 135c.

  The power supply voltage VDL stabilized by the noise prevention circuit 135a shown in FIG. 15A is used to drive a specific electrical component such as a specific LED included in the effect LED 61, for example. The power supply line LDL supplies a power supply voltage VDL for driving a specific electrical component such as a specific LED included in the production LED 61, for example. The power supply voltage VCL stabilized by the noise prevention circuit 135b shown in FIG. 15B drives a specific electrical component such as a specific motor included in the effect motor 60 or a specific LED included in the effect LED 61. Used to do. The power supply line LCL supplies a power supply voltage VCL for driving a specific electrical component such as a specific motor included in the effect motor 60 or a specific LED included in the effect LED 61. The power supply voltage VCC stabilized by the noise prevention circuit 135c shown in FIG. 15C and the direct-current 3.3V power supply voltage are specified by, for example, an image data memory included in the effect control CPU 120, the ROM 121, or the display control unit 123. It is used to drive an electric circuit including the control circuit. The power supply line LCC supplies a power supply voltage VCC for driving an electric circuit including a specific control circuit, for example, an effect control CPU 120. The power supply line L33 supplies a power supply voltage of DC 3.3V for driving an electric circuit including a specific control circuit such as the ROM 121 or the image data memory of the display control unit 123, for example. As described above, in the noise prevention circuits 135a and 135b corresponding to the power supply voltage for driving a specific electric component such as a motor or LED, the noise prevention corresponding to the power supply voltage for driving a specific electric circuit such as a CPU or ROM is performed. As circuit elements different from the circuit 135c, resistors R20, R21, R22 and resistors R23, R24 are used.

  In a load circuit using a current-driven circuit element such as a specific motor included in the effect motor 60 or a specific LED included in the effect LED 61, an excessive inrush current is generated due to a transient phenomenon of the load circuit. There is a risk that the electrical components will be damaged. Therefore, in the noise prevention circuit 135a, the resistor R20 is connected in series to the capacitor C20, the resistor R21 is connected in series to the capacitor C21, and the resistor R22 is connected in series to the capacitor C22. In the noise prevention circuit 135b, a resistor R23 is connected in series to the capacitor C23, and a resistor R24 is connected in series to the capacitor C24. When power supply voltage VDL is stable, capacitors C20, C21, and C22 are in a charged state, and resistors R20, R21, and R22 are in a non-conductive state, so that it is possible to prevent power loss. When the power supply voltage VCL is stable, the capacitors C23 and C24 are in a charged state and the resistors R23 and R24 are in a non-conductive state, so that it is possible to prevent power loss. On the other hand, in a semiconductor integrated circuit such as the effect control CPU 120, the ROM 121, or the image data memory of the display control unit 123, a voltage-driven circuit element such as a CMOS circuit is used, and the input impedance becomes relatively large. Therefore, inrush current due to circuit transients is unlikely to occur. Therefore, the noise prevention circuit 135c uses the capacitors C25 to C28, but does not need to use a resistor. In this way, by constructing a noise prevention circuit using different circuit elements according to the characteristics of the circuit and electric components to be supplied with the power supply voltage, it is possible to prevent the increase of the substrate volume and the manufacturing cost while preventing the noise. An appropriate substrate configuration that prevents the occurrence can be realized.

  FIG. 16 shows a power supply monitoring circuit 140 using the power supply voltage VDC. In the effect control board 12, the power supply voltage VDC is used to monitor the occurrence of power interruption. The power monitoring circuit 140 is configured by using, for example, a power failure monitoring reset module IC, and is a circuit that realizes power monitoring means capable of outputting a power interruption signal. For example, when the power supply voltage VDC exceeds a predetermined value (for example, 10 V), the power supply monitoring circuit 140 outputs a power-off signal in an off state (high level). On the other hand, when the period during which the power supply voltage VDC is equal to or lower than the predetermined value continues for a predetermined standby time or longer, an on-state (low level) power-off signal is output. The power-off signal output from the power monitoring circuit 140 is transmitted to the effect control CPU 120.

  The power supply voltage VDC to be monitored for outputting the power-off signal is used to generate a 1.05V DC power supply voltage, a 3.3V DC power supply voltage, and a 1.5V DC power supply voltage. A power supply voltage of DC 1.05V is used for driving a predetermined electric circuit such as a graphics processor included in the display control unit 123, for example. The power supply voltage of DC 3.3V is used for driving a predetermined electric circuit such as an image data memory included in the ROM 121 or the display control unit 123, for example. The power supply voltage of DC 1.5V is used for driving a predetermined electric circuit such as the RAM 122, for example. By monitoring the power supply voltage VDC used for generating the power supply voltage supplied to such an electric circuit, a power-off signal is output (turned on) before the operation state of the electric circuit becomes unstable. Therefore, malfunction in various electric circuits can be prevented.

  In the effect control board 12, the power supply voltage VDD3 supplied from the terminals TA27 and TA28 of the receptacle KRE2 is stabilized by the filter circuit 131c and then input to the step-down converter circuit 132. Step-down converter circuit 132 uses the input voltage to generate a 1.05V DC power supply voltage and a 3.3V DC power supply voltage higher than 1.05V DC. A power supply voltage of 3.3 V DC is input to the regulator circuit 133. The regulator circuit 133 generates a power supply voltage of DC 1.5V using the input voltage. The power supply voltage of 1.5V DC is higher than 1.05V DC but lower than 3.3V DC. In this way, using the step-down converter circuit 132 and the regulator circuit 133, a DC 1.05V power supply voltage, a DC 1.5V power supply voltage higher than the DC 1.05V, and a DC 3 higher than the DC 1.5V are used. .3V power supply voltage can be generated, and the step-down converter circuit 132 outputs a direct current 1.05V power supply voltage and a direct current 3.3V power supply voltage, while the regulator circuit 133 outputs a direct current 1. Outputs 5V power supply voltage.

  After the power supply voltage VDD3 is stabilized by the filter circuit 131c, the branched DC 12V power supply voltage VDC is supplied to the power supply monitoring circuit 140 that monitors the occurrence of power interruption. Therefore, the input voltage of the step-down converter circuit 132 is common to the power supply voltage VDC of 12 V DC, and the input voltage of the step-down converter circuit 132 is the monitoring target of the power supply monitoring circuit 140. Note that a bypass capacitor having a predetermined capacity (for example, 47 μF) may be connected to the input side of step-down converter circuit 132 after branching power supply voltage VDC.

  Among the power supply voltages generated by using the step-down converter circuit 132 and the regulator circuit 133, a power supply voltage of 1.05V direct current that is the lowest voltage value is a specific value such as a graphics processor of the display control unit 123. Supplied to the microprocessor. The power supply voltage of DC 1.05V is not limited to that supplied to the graphics processor of the display control unit 123, and may be supplied to an arbitrary microprocessor, for example, the CPU 120 for effect control.

  Of the power supply voltages generated by using the step-down converter circuit 132 and the regulator circuit 133, the DC 3.3V power supply voltage having the largest voltage value and the highest voltage is supplied to the ROM 121 or the image data memory of the display control unit 123, for example. Supplied. The ROM 121 only needs to be able to be activated before electrical components driven by a power supply voltage of DC 1.5V.

  Of the power supply voltages generated using the step-down converter circuit 132 and the regulator circuit 133, a power supply voltage of 1.5V DC that is higher than 1.05V DC and lower than 3.3V DC is supplied to the RAM 122, for example. The RAM 122 is a temporary storage memory that can be stored and read by a DDR (Double Data Rate) method, for example, and functions as a memory module such as a single in-line memory module (SIMM) or a dual in-line memory module (DIMM). Configure the substrate. The board constituting the RAM 122 may be configured as another board that can be detachably connected to the effect control board 12. In this case, the DC 1.5V power supply voltage is supplied to a board different from the effect control board 12.

  When a step-down converter circuit having one input and three outputs is used in place of the step-down converter circuit 132 and the regulator circuit 133, a special dedicated circuit is required, which may increase the manufacturing cost. Further, the amount of heat generated in a single circuit may increase, and the electric circuit may be damaged. Therefore, the step-down converter circuit 132 receives the power supply voltage VDD3 stabilized by the filter circuit 131c (the same applies to the power supply voltage VDC), and outputs a power supply voltage of DC 1.05V and a power supply voltage of DC 3.3V. . In the regulator circuit 133, a power supply voltage of DC 3.3V is input, and a power supply voltage of DC 1.5V is output. As a result, it is possible to prevent an increase in manufacturing cost and to achieve an appropriate substrate configuration that dissipates heat generated in the electric circuit.

  The power supply voltage VDC that is the same as or substantially the same as the voltage supplied to the step-down converter circuit 132 is supplied to the power supply monitoring circuit 140, and the occurrence of power interruption is monitored. Thus, since the power supply voltage VDC used for generating various power supply voltages by the step-down converter circuit 132 and the regulator circuit 133 is the monitoring target of the power supply monitoring circuit 140, for example, the pachinko gaming machine 1 such as the graphics processor of the display control unit 123 is used. Before the operation state of the electric circuit important for performing the production in becomes unstable, an appropriate board configuration for detecting the occurrence of power interruption becomes possible.

  The power supply voltage of 1.05 V DC output from the step-down converter circuit 132 is supplied to a specific microprocessor such as a graphics processor of the display control unit 123, for example. By outputting a power supply voltage of 1.05V DC from the step-down converter circuit 132, when a power interruption occurs, the power supply voltage of 1.05V DC is changed until a longer time elapses than the configuration output from the regulator circuit 133. Can be maintained. As a result, when a power interruption occurs, an appropriate board configuration that continues the operation of an electric circuit important for executing an effect in the pachinko gaming machine 1, such as a graphics processor of the display control unit 123, as much as possible. It becomes possible.

  The DC 3.3V power supply voltage output from the step-down converter circuit 132 is supplied to, for example, the ROM 121, and is started before the electrical components such as the RAM 122 driven by the DC 1.5V power supply voltage output from the regulator circuit 133. It becomes possible. As a result, when the power is turned on, for example, an appropriate board configuration that allows the storage data in the ROM 121 to be immediately read out by the CPU 120 for effect control is possible.

  The power supply voltage of 1.5V DC output from the regulator circuit 133 may be supplied to a circuit configured as a board different from the effect control board 12, such as the RAM 122, for example. In this way, by causing the regulator circuit 133 different from the step-down converter circuit 132 to output a power supply voltage of DC 1.5V supplied to a board different from the effect control board 12, an increase in manufacturing cost is prevented, An appropriate substrate configuration that dissipates heat generated in the electric circuit becomes possible.

(Explanation regarding the feature 30AK)
FIG. 17 shows a configuration example of a portion in which a wiring pattern for connecting the CPU 103 and the RAM 102 is formed on one substrate surface (front surface) of the main substrate 11 with respect to the characteristic portion 30AK of the present embodiment. In the main board 11, in order to connect a plurality of electrical components such as the RAM 102 and the CPU 103 by a plurality of signal wirings, wiring patterns constituting the plurality of signal wirings are formed. The CPU 103 is an electrical component configured to be able to execute a predetermined process regarding control of the game in the pachinko gaming machine 1, and the RAM 102 is an electrical component configured to be able to store information related to the execution of the process by the CPU 103.

  One or a plurality of ground conductors are arranged in the area around or between the signal wirings with respect to the wiring patterns constituting the plurality of signal wirings. The ground conductor functions as a reference ground or a characteristic impedance adjustment ground, and is maintained at the ground voltage. In the configuration example shown in FIG. 17, as a plurality of ground conductors, a ground conductor 30AK10G and a ground conductor 30AK11G are arranged in a region around a plurality of signal wires, and a ground conductor 30AK20G is arranged in a region between the plurality of signal wires. . As described above, one or a plurality of ground conductors may be provided in an airspace portion that is a blank area in which wiring patterns constituting a plurality of signal wirings are not provided. Thereby, the electromagnetic interference by the electromagnetic wave noise radiated | emitted from several signal wiring and the electromagnetic wave noise between signal wiring can be prevented or suppressed.

  It should be noted that the ground conductor is not limited to the one in which the plurality of ground conductors are arranged in both the area around the signal wiring and between the signal wirings, and the ground conductor is provided only in one area around the signal wiring or between the signal wirings. It may be arranged. Alternatively, such a ground conductor may not be disposed.

  FIG. 18 shows areas and sections for explaining in more detail the wiring patterns constituting the plurality of signal wirings shown in FIG. A region 30AK01R illustrated in FIG. 18 is a region at an end portion on the side where a plurality of signal wirings are connected to the CPU 103. A region 30AK10R shown in FIG. 18 is a region in which a plurality of signal wirings are all linear or substantially linear and have a first shape that is parallel or substantially parallel to each other. The region 30AK11R and the region 30AK12R shown in FIG. This is a region where the signal wiring of the part is a shape different from the linear shape and the substantially linear shape, and becomes a second shape that is not parallel or substantially parallel to the other signal wirings. In the section 30AK0SC shown in FIG. 18, a short distance pattern in which some of the plurality of signal wirings are connected at the shortest or substantially shortest distance and a signal wiring that is not included in the short distance pattern are longer than the short distance pattern. And a long distance pattern to be connected with each other.

  FIG. 19 is an enlarged view of the region 30AK01R shown in FIG. In the region 30AK01R shown in FIG. 19, the patterns of the wirings constituting the plurality of signal wirings include patterns 30AK10D to 30AK13D, pattern 30AK10CK, pattern 30AK10CS, pattern 30AK10RS, and patterns 30AK10A to 30AK14A.

  FIG. 20 shows an example of setting the signal type, the presence / absence of signal synchronization, and the presence / absence of a meandering shape corresponding to the wiring pattern shown in FIG. The signal types shown in FIG. 20 indicate the contents (uses) of electric signals transmitted through the signal wirings constituted by the patterns of the respective wirings. The signal synchronization shown in FIG. 20 indicates the presence / absence of synchronization with an electrical signal transmitted through another signal wiring. The meandering shape shown in FIG. 20 indicates whether or not each wiring pattern connecting the RAM 102 and the CPU 103 has a meandering shape different from the linear shape and the substantially linear shape. The meandering shape is also called a meander shape, zigzag shape, or folded shape, and the signal wiring is repeatedly bent with respect to the extending direction of the signal wiring in a predetermined section, for example, in a direction orthogonal or substantially orthogonal to the extending direction. Any shape that reciprocates may be used.

  In the setting example shown in FIG. 20, all of the wiring patterns 30AK10D to 30AK13D constitute a signal wiring for transmitting a data signal. A data signal transmitted through each signal wiring is transmitted in synchronization with a signal transmitted through another signal wiring, such as a clock signal and a data signal transmitted through another signal wiring. The wiring pattern 30AK10CK constitutes a signal wiring for transmitting a clock signal. The clock signal is transmitted in synchronization with a signal transmitted through another signal wiring, such as a data signal, an address signal, and a chip select signal. The wiring pattern 30AK10CS constitutes a signal wiring for transmitting a chip select signal. The chip select signal is transmitted in synchronization with a signal transmitted through another signal wiring, such as a clock signal. The wiring pattern 30AK10RS constitutes a signal wiring for transmitting a reset signal. The reset signal is transmitted asynchronously without being synchronized with a signal transmitted through another signal wiring. Each of the wiring patterns 30AK10A to 30AK14A constitutes a signal wiring for transmitting an address signal. An address signal transmitted through each signal wiring is transmitted in synchronization with a signal transmitted through another signal wiring, such as a clock signal and an address signal transmitted through another signal wiring.

  The wiring patterns 30AK10D to 30AK13D constituting the signal wiring for transmitting the data signal among the data signal, the clock signal, the chip select signal, and the address signal transmitted in synchronization with the signal transmitted through the other signal wiring include A wiring pattern 30AK10D having no meandering shape is included. The wiring pattern constituting the signal wiring for transmitting the data signal, clock signal, chip select signal, and address signal different from the data signal transmitted by the signal wiring formed by the wiring pattern 30AK10D is at least partially linear. Further, the meandering shape is different from the substantially linear shape.

  The signal wiring for transmitting the data signal that the wiring pattern 30AK10D constitutes is connected between the connection terminals in the RAM 102 and the CPU 103, as compared with the signal wiring for transmitting other data signals, clock signals, chip select signals, and address signals. The distance is longer. Therefore, at least a part of the wiring pattern constituting the signal wiring for transmitting the data signal, the clock signal, the chip select signal, and the address signal different from the data signal transmitted by the signal wiring formed by the wiring pattern 30AK10D is at least partially. Due to the meandering shape, the signal lines have the same or substantially the same wiring length. On the other hand, it is not necessary to provide a meandering shape in the wiring pattern 30AK10D.

  Thus, the signal wiring in which the distance between the connection terminals in the plurality of electrical components among the signal wirings for transmitting the synchronization signal is longer than the distance between the other connection terminals is, for example, a wiring portion having a meandering shape. The wiring pattern may be formed so as not to include a wiring portion having a shape different from the linear shape and the substantially linear shape. In other words, the signal wiring formed by the wiring pattern which does not include a linear shape such as a meandering shape or a shape different from the substantially linear shape while having a linear shape or a substantially linear shape is like a meandering shape. The distance between the connection terminals in the plurality of electrical components is longer than the signal wiring formed by the wiring pattern including a shape different from the straight line shape and the substantially straight line shape. Alternatively, among the signal wirings for transmitting the synchronization signal, the signal wiring in which the distance between the connection terminals in the plurality of electrical components is longer than the distance between the other connection terminals is, for example, a wiring portion having a meandering shape. The wiring pattern may be formed so as not to include a wiring portion having a shape different from the shape parallel to and substantially parallel to the signal wiring. In other words, the signal wiring formed by a wiring pattern that is parallel or substantially parallel to other signal wirings but does not include a parallel or substantially parallel shape such as a meandering shape is a meandering shape. The distance between the connection terminals in the plurality of electrical components is longer than the signal wiring formed by a wiring pattern including a shape different from the parallel and substantially parallel shape to the other signal wirings. Thereby, it is possible to prevent or suppress the occurrence of a delay time difference (skew) between signals transmitted through a plurality of signal wirings by making the wiring lengths of the respective signal wirings the same or substantially the same. By reducing the delay time difference between signals transmitted through a plurality of signal lines, the reliability of signals transmitted through the plurality of signal lines can be improved.

  The wiring pattern 30AK10RS is not provided with a meandering shape. The wiring pattern 30AK10RS constitutes a signal wiring for transmitting a reset signal that is an asynchronous signal. When an asynchronous signal such as a reset signal is transmitted, there is no need to consider a delay time difference from a signal transmitted through another signal wiring. Therefore, like the wiring pattern 30AK10RS constituting the signal wiring for transmitting the reset signal, the meandering shape is not provided in the wiring pattern constituting the signal wiring for transmitting the asynchronous signal. If the meandering shape is not provided in the wiring pattern, an increase in the area of the substrate on which the wiring pattern is arranged can be suppressed, and the size of the substrate can be reduced.

  As a wiring pattern not provided with a meandering shape, a wiring pattern constituting a dummy wiring maintained at the ground voltage may be arranged. For example, in the signal wiring formed by the wiring pattern 30AK10RS, the reset signal may be transmitted and the ground voltage may be maintained. The wiring pattern 30AK10RS includes wiring patterns 30AK10D to 30AK13D constituting a signal wiring for transmitting a data signal, wiring pattern 30AK10CK constituting a signal wiring for transmitting a clock signal, and a chip select signal. Arranged between a group of patterns composed of wiring patterns 30AK10CS constituting the signal wiring and a group of patterns composed of wiring patterns 30AK10A to 30AK14A constituting the signal wiring for transmitting the address signal. Yes. By using a signal wiring arranged between other signal wirings such as the wiring pattern 30AK10RS as a dummy wiring maintained at a ground voltage, electromagnetic interference due to electromagnetic wave noise in a plurality of signal wirings can be prevented or suppressed. . As the wiring pattern not provided with the meandering shape, a wiring pattern maintained at the power supply voltage may be arranged in place of the dummy wiring maintained at the ground voltage or together with the dummy wiring maintained at the ground voltage. For example, in the signal wiring formed by the wiring pattern 30AK10RS, the power supply voltage may be maintained instead of transmitting the reset signal. If the wiring pattern maintained at the power supply voltage is arranged close to the wiring pattern constituting the other signal wirings, electromagnetic wave noise may be generated due to electromagnetic coupling between the signal wirings. Therefore, when the wiring pattern maintained at the power supply voltage is arranged, the distance from the signal wiring is increased as compared with the case where the wiring pattern maintained at the ground voltage is arranged. A pattern may be formed. Thereby, prevention or suppression of electromagnetic interference due to electromagnetic wave noise in the signal wiring can be achieved.

  FIG. 21 is an enlarged view of the region 30AK10R shown in FIG. In the region 30AK10R, wiring patterns 30AK10CK, 30AK10CS, 30AK10RS, and 30AK10A to 14A are formed. These wiring patterns are formed in the region 30AK10R so that the plurality of signal wirings are all linear or substantially linear and parallel or substantially parallel to each other. As described above, in the region 30AK10R, the wiring patterns constituting the plurality of signal wirings are all formed to have a linear shape or a substantially linear shape, and the plurality of signal wirings have a shape parallel to or substantially parallel to each other. A wiring pattern is formed.

  FIG. 22 is an enlarged view of the region 30AK11R shown in FIG. Similar to the region 30AK10R, wiring patterns 30AK10CK, 30AK10CS, 30AK10RS, and 30AK10A to 14A are formed in the region 30AK11R. These wiring patterns are formed in the region 30AK11R so that at least one signal wiring has a linear shape or a substantially linear shape, while other signal wirings have shapes different from the linear shape and the substantially linear shape. It is formed to become. In the region 30AK11R shown in FIG. 22, for example, a wiring pattern 30AK10CK constituting a signal wiring for transmitting a clock signal and a wiring pattern 30AK10CS constituting a signal wiring for transmitting a chip select signal have a plurality of bent portions. Although it includes, all are formed so that it may become a linear shape or a substantially linear shape. In addition, in the region 30AK11R shown in FIG. 22, the wiring pattern 30AK10RS constituting the signal wiring for transmitting the reset signal is formed to have a linear shape or a substantially linear shape not including the bent portion. On the other hand, in the region 30AK11R shown in FIG. 22, the wiring patterns 30AK10A to 30AK14A constituting the signal wiring for transmitting the address signal are formed in a meandering shape by a plurality of bent portions, Are formed to have different shapes.

  In the portion where the meandering shape is formed, the signal wiring may be bent in a direction orthogonal to the original extending direction, for example, via a plurality of bent portions. In each bent portion, it is only necessary to form a wiring pattern in which the extending direction of the signal wiring is changed by bending the signal wiring to form an angle (obtuse angle) larger than a right angle. In this case, the signal wiring is bent so that the amount of bending at each bent portion is smaller than a right angle. In the portion where the meandering shape is formed, the signal wiring can be extended in the first extending direction and the second extending direction orthogonal to or substantially orthogonal to the first extending direction. A plurality of bent portions may be provided between the wiring pattern constituting the signal wiring in the direction and the wiring pattern constituting the signal wiring in the second extending direction. As described above, the extending direction of the signal wiring is changed through the plurality of bent portions in which the bending amount of the signal wiring is smaller than the predetermined angle. By reducing the amount of bending, it is possible to prevent the pattern width of the wiring from changing greatly at the bent portion, to prevent the characteristic impedance of the transmission line from changing suddenly, and to prevent electromagnetic waves due to electromagnetic wave noise in multiple signal wirings. Interference can be prevented or suppressed.

  In each signal wiring, a plurality of bent portions may be arranged so that the positions of the bent portions are longer than a predetermined length from the positions of the bent portions in other signal wirings. The predetermined length may be a predetermined length from the viewpoint of substrate design, for example, a certain length included in a range of 2 mm to 5 mm. In the bent portion of the signal wiring, electromagnetic noise is likely to be generated due to a change in characteristic impedance. The bent portion formed by the wiring pattern constituting one signal wiring included in the plurality of signal wirings approaches the bent portion formed by the wiring pattern constituting another signal wiring included in the plurality of signal wirings. When arranged, the signal transmitted through each signal wiring may be easily affected by electromagnetic noise. Therefore, a bent portion formed by a wiring pattern constituting one signal wiring included in a plurality of signal wirings and a bent portion formed by a wiring pattern constituting another signal wiring included in the plurality of signal wirings are provided. In addition, by arranging the gaps so as to be longer than the predetermined length, it is possible to prevent or suppress electromagnetic interference caused by electromagnetic wave noise in a plurality of signal wirings.

  In the region 30AK11R, at least one signal wiring is formed to have a shape different from parallel and substantially parallel. In the region 30AK11R shown in FIG. 22, for example, a wiring pattern 30AK10CK constituting a signal wiring for transmitting a clock signal and a wiring pattern 30AK10CS constituting a signal wiring for transmitting a chip select signal are both plural. As a whole, the signal wirings are formed in parallel or substantially in parallel with each other through the bent portion. On the other hand, in the region 30AK11R shown in FIG. 22, the wiring patterns 30AK10A to 30AK14A constituting the signal wiring for transmitting the address signal are formed in a meandering shape by a plurality of bent portions. The signal wiring is formed to have a shape different from parallel or substantially parallel.

  In the region 30AK11R shown in FIG. 22, at least one signal wiring out of the plurality of signal wirings has a shape such as a meandering shape different from the parallel and substantially parallel shapes. In this region 30AK11R, a conductor is not provided on at least the same substrate as the signal wiring in the space region 30AK0SP close to the wiring pattern constituting the signal wiring. The space area 30AK0SP is close to the wiring patterns 30AK10A to 30AK13A provided with a meandering shape in the area 30AK11R among the wiring patterns 30AK10A to 30AK14A constituting the signal wiring for transmitting the address signal, for example. Since no conductor is provided in the space region 30AK0SP, it is possible to prevent or suppress electromagnetic interference due to electromagnetic wave noise in a plurality of signal wirings. When a conductor is provided in a region close to the meandering wiring pattern, electromagnetic waves may be emitted from the signal wiring, and electromagnetic noise is generated due to electromagnetic coupling between the signal wiring and the conductor. There is a risk. Therefore, for example, a conductor is not provided in a region close to a wiring pattern provided with a meandering shape, such as the space region 30AK0SP, thereby preventing or suppressing electromagnetic interference due to electromagnetic wave noise in a plurality of signal wirings. It is done.

  FIG. 23 is a cross-sectional view showing a configuration example of the main board 11 formed as a multilayer wiring board. The main substrate 11 shown in FIG. 23 has a multilayer structure formed by overlaying synthetic resins, and various wiring patterns can be formed on the surface or inner layer of each layer. A plurality of electronic components such as the RAM 102 and the CPU 103 are electrically connected through the wiring pattern formed on the main substrate 11 having such a multilayer structure. The multilayer structure of the main substrate 11 shown in FIG. 23 includes a surface layer 30AK1S, a ground layer 30AK1L, a power supply layer 30AK2L, a wiring layer 30AK3L, a power supply layer 30AK4L, and a back surface layer 30AK2S.

  A surface layer 30AK1S is provided on the surface serving as one substrate surface of the main substrate 11, and a wiring pattern 30AK10P and a pattern 30AK11P constituting a signal wiring are formed. A back surface layer 30AK2S is provided on the back surface which is the other substrate surface of the main substrate 11, and a wiring pattern 30AK20P constituting a signal wiring is formed. The wiring pattern 30AK10P formed on the front surface layer 30AK1S of the main substrate 11 and the wiring pattern 30AK20P formed on the back surface layer 30AK2S through the through holes 30AK1H penetrating the front surface layer 30AK1S and the back surface layer 30AK2S of the main substrate 11 Electrically connected. The wiring pattern 30AK11P formed on the front surface layer 30AK1S of the main substrate 11 and the wiring pattern 30AK20P formed on the back surface layer 30AK2S through the through holes 30AK2H penetrating the front surface layer 30AK1S and the back surface layer 30AK2S of the main substrate 11 Electrically connected. As described above, the main substrate 11 is provided with the wiring patterns 30AK10P and 30AK11P constituting the signal wiring in the surface layer 30AK1S provided on the surface serving as one substrate surface, and the back surface serving as the other substrate surface. A through hole 30AK1H and a through hole 30AK2H are provided to electrically connect the wiring pattern 30AK20P constituting the signal wiring in the back layer 30AK2S.

  The wiring length of each signal wiring included in the plurality of signal wirings connecting the RAM 102 and the CPU 103 shown in FIG. 23 is the wiring patterns 30AK10P and 30AK11P formed on the front surface layer 30AK1S and the wirings formed on the back surface layer 30AK2S. In addition to the wiring length of the signal wiring formed by the pattern 30AK20P, the lengths of the through holes 30AK1H and the through holes 30AK2H are the same or substantially the same. In the main board 11 having the multilayer structure shown in FIG. 23, the signal lines including the lengths of the through holes 30AK1H and the through holes 30AK2H have the same or substantially the same wiring length, and signals transmitted through a plurality of signal wirings Generation of a delay time difference can be prevented or suppressed. By reducing the delay time difference between signals transmitted through a plurality of signal wirings in a multilayer wiring substrate such as the main substrate 11, the reliability of signals transmitted through the plurality of signal wirings can be improved.

  In the main substrate 11 having the multilayer structure shown in FIG. 23, a ground layer 30AK1L is provided as a conductor layer adjacent to the surface layer 30AK1S. One or a plurality of ground conductors are arranged in the ground layer 30AK1L, and the ground conductors are maintained at the ground voltage. The wiring pattern 30AK10P and the pattern 30AK11P constituting the signal wiring in the surface layer 30AK1S have a shape different from the linear shape and the substantially linear shape such as a meandering shape in at least one of the patterns, and a plurality of signal wirings are parallel and substantially parallel. It may be formed so as to include a region having a shape different from a simple shape. In the ground layer 30AK1L as the conductor layer adjacent to the surface layer 30AK1S, signal transmission is not performed. Since no signal is transmitted in the conductor layer adjacent to the surface layer 30AK1S on which the wiring pattern 30AK10P and the pattern 30AK11P are formed, signals transmitted through the plurality of signal wirings formed by the wiring pattern 30AK10P and the pattern 30AK11P are electromagnetic waves. It is also possible to prevent or suppress the influence of electromagnetic noise on other signal wirings from becoming less susceptible to noise.

  In the back surface layer 30AK2S of the main substrate 11 having the multilayer structure shown in FIG. 23, the wiring pattern 30AK20P constituting the signal wiring has a shape different from the linear shape and the substantially linear shape, such as a meandering shape, and the plurality of signal wirings are parallel and substantially You may form so that the area | region used as a shape different from a parallel shape may be included. In the power supply layer 30AK4L as the conductor layer adjacent to the back layer 30AK2S, no signal is transmitted. In the power supply layer 30AK4L, one or a plurality of power supply conductors are arranged, and the power supply conductors are maintained at the power supply voltage. Since signals are not transmitted in the conductor layer adjacent to the back surface layer 30AK2S on which the wiring pattern 30AK20P is formed, signals transmitted through a plurality of signal wirings formed by the wiring pattern 30AK20P are not easily affected by electromagnetic noise. Thus, the influence of electromagnetic noise on other signal wirings can also be prevented or suppressed. In a multilayer wiring board such as the main board 11, no signal transmission is performed in a conductor layer adjacent to a layer provided with a plurality of signal wirings, thereby preventing or suppressing electromagnetic interference due to electromagnetic wave noise in the plurality of signal wirings. Is planned.

  In the wiring layer 30AK3L of the main substrate 11 having the multilayer structure shown in FIG. 23, the wiring pattern constituting the signal wiring is different from the linear shape and the substantially linear shape such as a meandering shape, and the plurality of signal wirings are parallel and substantially parallel. It may be formed so as to include a region having a shape different from a simple shape. In the power supply layer 30AK2L and the power supply layer 30AK4L as the conductor layers adjacent to the wiring layer 30AK3L, signal transmission is not performed. In a multilayer wiring board such as the main board 11, no signal is transmitted in a conductor layer adjacent to the wiring layer 30AK3L on which a plurality of signal wirings are provided, thereby preventing electromagnetic interference due to electromagnetic noise in the plurality of signal wirings or Suppression is achieved. However, in the wiring layer 30AK3L which is an inner conductor layer provided on the multilayer wiring board, when the wiring pattern constituting the signal wiring is formed so as to include a region having a meandering shape or the like, the signal wiring When a failure due to disconnection or the like occurs, it may be difficult to confirm the state of the signal wiring in the wiring layer 30AK3L from the outside of the substrate. On the other hand, areas such as the surface layer 30AK1S and the back surface layer 30AK2S of the main substrate 11 in which the pattern of the wiring that constitutes the signal wiring on the one substrate surface or the other substrate surface of the main substrate 11 has a meandering shape or the like. In the case where it is formed so as to include, an appropriate substrate configuration that makes it easy to check the state of the signal wiring in the front surface layer 30AK1S and the back surface layer 30AK2S from the outside of the substrate when a failure due to disconnection of the signal wiring or the like occurs is possible. Become.

  The through holes penetrating the front surface layer 30AK1S and the back surface layer 30AK2S of the main substrate 11 are not limited to the through holes 30AK1H and the through holes 30AK2H shown in FIG. It may be used to make the wiring lengths of the wirings the same or substantially the same. Of the wiring patterns constituting the plurality of signal wirings, for example, the signal wiring is arranged only on the surface layer 30AK1S of the main substrate 11 without through the through holes such as the through hole 30AK1H and the through hole 30AK2H. A formed pattern may be included. The signal wiring in which the distance between the connection terminals in the plurality of electrical components is longer than the distance between the other connection terminals, such as the signal wiring for transmitting the data signal formed by the wiring pattern 30AK10D, is the through hole 30AK1H and the through hole 30AK1H. The signal wiring may be arranged only on the surface layer 30AK1S of the main substrate 11 without through a through hole such as the hole 30AK2H. In other words, the signal wiring formed by the wiring pattern formed in one conductor layer such as the surface layer 30AK1S without passing through the through hole is formed in the plurality of conductor layers such as the surface layer 30AK1S and the back surface layer 30AK2S. The distance between the connection terminals in the plurality of electrical components is longer than the signal wiring formed by the wiring pattern formed so as to be electrically connectable via the wiring.

  When a plurality of signal wirings are provided adjacent to each other, a small blank area is formed like the space area 30AK0SP shown in FIG. It is also conceivable that a through hole is provided in this blank region and has a through hole electrode in which a conductive material such as copper is embedded so as to be electrically connected to another conductor layer such as the ground layer 30AK1L. In a configuration in which a conductor such as a through-hole electrode is provided in the blank area, for example, a large number of through-hole electrodes may be arranged in order to stabilize the electric field distribution in the blank area. In this case, not only the surface layer 30AK1S of the main substrate 11 but also the back surface layer 30AK2S is provided with structures corresponding to through-hole electrodes such as bumps, which restricts the design of the wiring pattern on the substrate. Inconvenience may occur. In addition, in the ground layer 30AK1L and the power supply layers 30AK2L, 30AK4L, etc., which are inner conductor layers provided on the multilayer wiring board, when a through hole electrode is provided, the pattern of the conductor layer is removed around the through hole electrode. As a result, the pattern in the inner conductive layer such as the ground layer 30AK1L, the power supply layer 30AK2L, and 30AK4L is divided, and there is a possibility that the design of the pattern in the conductive layer becomes difficult. In addition, instead of the through-hole electrode, a conductor such as a dummy pad is provided in the blank area, and in a configuration in which the conductor is not connected to other conductor layers, the conductor is affected by external electromagnetic noise, There is a possibility that the conductor may have an adverse effect such as electromagnetic interference due to the influence of electromagnetic noise on a plurality of signal wirings. On the other hand, since the conductor is not provided in the space region 30AK0SP close to the wiring pattern constituting the signal wiring, it is possible to prevent or suppress the occurrence of these disadvantages.

  In addition, a blank area formed when a plurality of signal wirings are provided adjacent to each other like a space area 30AK0SP shown in FIG. 22 is different from the constituent material of the board, such as a screw hole for fixing the board. A structure in which the material is used may not be provided. When screw holes for fixing the board are provided, when the board is fixed by screwing, the screw components are affected by electromagnetic noise from the outside, and other signal wirings are also adversely affected by electromagnetic interference. May cause inconvenience. In addition, a structure using a synthetic resin or dielectric material having a dielectric constant different from that of the insulating layer included in the substrate, or a structure using a synthetic resin or metal material having an electric conductivity different from that of the conductor layer included in the substrate. If the structure is provided in a blank area adjacent to a plurality of signal wirings, these structures are affected by electromagnetic noise from the outside, or these structures affect the plurality of signal wirings by electromagnetic noise. May cause inconveniences such as electromagnetic interference. In contrast, blank regions such as the space region 30AK0SP close to the wiring pattern constituting the signal wiring are not provided with a structure using a material different from the constituent material of the substrate. This can be prevented or suppressed.

  In section 30AK0SC shown in FIG. 18, one pattern 30AK13D of wiring patterns 30AK10D to 30AK13D forming a plurality of signal wirings for transmitting a data signal has a shape different from a linear shape and a substantially linear shape, such as a meandering shape. Thus, it is formed so as to include a portion of the signal wiring having a shape different from the shape parallel to and substantially parallel to the other signal wiring. On the other hand, at least the pattern 30AK10D and the pattern 30AK11D are formed in the section 30AK0SC so as not to include a meandering shape, but to have a linear shape or a substantially linear shape and signal wirings in parallel or substantially parallel to each other. . Therefore, the pattern 30AK10D and the pattern 30AK11D are patterns in which the signal wiring connects the sections 30AK0SC with the shortest or substantially the shortest. On the other hand, the pattern 30AK12D and the pattern 30AK13D are patterns in which the signal wiring connects the section 30AK0SC with a longer distance than the patterns 30AK10D and 30AK11D.

  In the section 30AK0SC, the signal wiring that the pattern 30AK13D configures has a linear shape such as a meandering shape and a shape that is different from the substantially linear shape, and the signal wiring that the other patterns 30AK10D to 30AK12D configure has a linear shape or It is formed to have a substantially linear shape. In this way, in the portion where the signal wiring constituted by one wiring pattern among the wiring patterns constituting the plurality of signal wirings has a shape different from the linear shape such as a meandering shape and the substantially linear shape, The signal wiring constituted by the wiring pattern may be formed in a linear shape or a substantially linear shape. A portion in which a signal wiring constituted by one wiring pattern has a shape different from a linear shape such as a meandering shape and a substantially linear shape indicates that a signal wiring constituted by another wiring pattern has a linear shape or a substantially linear shape. You may form so that it may not overlap with the part which becomes. A wiring pattern is formed so that portions that are different from a linear shape and a substantially linear shape, such as a meandering shape, do not overlap for a plurality of signal wirings, thereby suppressing an increase in the board area on which wiring patterns are arranged Thus, the substrate can be downsized.

  FIG. 24 shows another example of forming a wiring pattern in which portions where a plurality of signal wirings have a meandering shape do not overlap. Also in the region 30AK20R shown in FIG. 24, in the portion where the signal wiring constituted by one wiring pattern among the wiring patterns constituting the plurality of signal wirings has a meandering shape, the signal constituted by the other wiring pattern The wiring is formed in a linear shape or a substantially linear shape. Then, when the first meandering portion, which is a portion where the first signal wiring constituted by the first wiring pattern has a meandering shape, ends, the second wiring constituted by the second wiring pattern different from the first wiring pattern. A pattern of wirings constituting a plurality of signal wirings is formed so that the second meandering part, which is a part where the signal wirings have a meandering shape, is started. In the first meandering portion, the wiring pattern including the second wiring pattern constituting the second signal wiring is the signal wiring constituted by each pattern as the wiring pattern constituting the signal wiring other than the first signal wiring. May be formed so as to have a parallel or substantially parallel shape. In the second meandering portion, the wiring pattern including the first wiring pattern constituting the first signal wiring is the signal wiring constituted by each pattern as the wiring pattern constituting the signal wiring other than the second signal wiring. May be formed so as to have a parallel or substantially parallel shape. Since the second meandering portion is started after the end of the first meandering portion, the first meandering portion is arranged so as not to overlap the second meandering portion. Thereby, even when a portion that is different from a linear shape and a substantially linear shape such as a meandering shape for a large number of signal wirings is provided, an increase in the substrate area on which the wiring pattern is arranged is suppressed as much as possible. The size of the substrate can be reduced.

(Explanation regarding feature 42AK)
FIG. 25 shows a configuration example of a portion where a plurality of signal wirings configured by wiring patterns are formed with respect to the characteristic portion 42AK of the present embodiment. The wiring pattern shown in FIG. 25 only needs to constitute a plurality of signal wirings for connecting a plurality of electrical components such as the RAM 102 and the CPU 103 on the main substrate 11. In the configuration example shown in FIG. 25, a pattern of wirings that constitute two signal wirings is shown as a wiring pattern that constitutes a plurality of signal wirings. FIG. 25A shows a case where the wiring interval W1 is W1 <W2 which is narrower than the wiring interval W2, and FIG. 25B shows a case where the wiring interval W1 is W1> W2 which is wider than the wiring interval W2. The wiring interval W1 is a wiring interval based on a wiring pattern in a portion where the same signal wiring has a meandering shape. The wiring interval W2 is a wiring interval between wiring patterns that constitute different signal wirings adjacent to each other in parallel or substantially in parallel.

  The wiring pattern constituting the two signal wirings shown in FIG. 25A includes a first wiring pattern 42AK10 and a second wiring pattern 42AK11. The first wiring pattern 42AK10 and the second wiring pattern 42AK11 are configured so that each of the signal wirings includes a wiring portion 42AK1Z and a wiring portion 42AK2Z according to the shape of the signal wiring constituted by the wiring patterns. Is forming.

  In the wiring part 42AK1Z, the signal wiring constituted by the first wiring pattern 42AK10 forms the second shape part 42AK10M, and the signal wiring constituted by the second wiring pattern 42AK11 forms the first shape part 42AK11L. . In the wiring portion 42AK2Z, the signal wiring constituted by the first wiring pattern 42AK10 forms the first shape portion 42AK10L, and the signal wiring constituted by the second wiring pattern 42AK11 forms the second shape portion 42AK11M. . The first shape portions 42AK10L and 42AK11L are formed so that the signal wiring has a linear shape or a substantially linear first shape. The second shape portions 42AK10M and 42AK11M are formed so that the signal wiring has a second shape different from the linear shape and the substantially linear shape, such as a meandering shape. In addition, 2nd shape part 42AK10M and 42AK11M are not limited to a meandering shape, What is necessary is just to be formed so that it may become arbitrary shapes different from a linear shape and a substantially linear shape.

  As described above, the plurality of signal wirings configured by the first wiring pattern 42AK10 and the second wiring pattern 42AK11 are formed in the wiring portion 42AK1Z, and the signal wiring configured by the second wiring pattern 42AK11 is linear or Corresponding to the first shape portion 42AK11L, which is a substantially linear first shape, the signal wiring constituted by the first pattern 42AK10 of the wiring has a second shape such as a meandering shape different from the first shape portion 42AK11L. The second shape portion 42AK10M is included. That is, in the wiring portion 42AK1Z, the signal wiring constituted by the first wiring pattern 42AK10 includes the second shape portion 42AK11M corresponding to the first shape portion 42AK11L in the signal wiring constituted by the second wiring pattern 42AK11. It is out.

  In addition, a plurality of signal wirings configured by the first wiring pattern 42AK10 and the second wiring pattern 42AK11 are linear or substantially straight at the wiring portion 42AK2Z. Corresponding to the first shape portion 42AK10L that is the first shape of the shape, the signal wiring constituted by the second pattern 42AK11 of the wiring has a second shape such as a meandering shape different from the first shape portion 42AK10L. The shape portion 42AK11M is included. That is, in the wiring portion 42AK2Z, the signal wiring constituted by the second pattern 42AK11 of the wiring includes the second shape portion 42AK11M corresponding to the first shape portion 42AK10L in the signal wiring constituted by the first pattern 42AK10 of the wiring. It is out.

  In the second shape portion 42AK10M and the second shape portion 42AK11M in which the signal wiring shown in FIG. 25A has a second shape such as a meandering shape, the second shape portion 42AK10M is included in the wiring portion 42AK1Z, and the second shape portion 42AK11M. Is included in the wiring portion 42AK2Z. Thereby, arrangement | positioning of 2nd shape part 42AK10M and 2nd shape part 42AK11M does not mutually overlap. In addition, the wiring length of each signal wiring is formed to be the same or substantially the same. Since the signal wiring constituted by the first pattern 42AK10 of wiring and the second pattern 42AK11 of wiring is formed so as to include the second shape part 42AK10M and the second shape part 42AK11M, the wiring pattern The increase in the area of the substrate on which the substrate is disposed is suppressed, and the substrate can be downsized.

  The wiring pattern constituting the two signal wirings shown in FIG. 25B includes a third wiring pattern 42AK12 and a fourth wiring pattern 42AK13. The third wiring pattern 42AK12 and the fourth wiring pattern 42AK13 are arranged so that each of the signal wirings includes a wiring part 42AK3Z and a wiring part 42AK4Z according to the shape of the signal wiring constituted by the wiring patterns. Is forming.

  The signal wiring constituted by the third wiring pattern 42AK12 and the fourth wiring pattern 42AK13 is a first or substantially linear signal wiring constituted by the fourth wiring pattern 42AK13 in the wiring portion 42AK3Z. Corresponding to the first shape portion 42AK13L having the shape, the signal wiring constituted by the third pattern 42AK12 of the wiring has the second shape portion 42AK12M having a second shape such as a meandering shape different from the first shape portion 42AK13L. Contains. That is, in the wiring portion 42AK3Z, the signal wiring constituted by the third wiring pattern 42AK12 includes the second shape portion 42AK12M in correspondence with the first shape portion 42AK13L in the signal wiring constituted by the fourth pattern 42AK13 of the wiring. It is out.

  Further, the signal wiring constituted by the third wiring pattern 42AK12 and the fourth wiring pattern 42AK13 has a linear shape or a substantially linear shape at the wiring portion 42AK4Z. Corresponding to the first shape portion 42AK12L having the first shape, the signal wiring formed by the fourth pattern 42AK13 of the wiring has a second shape portion having a second shape such as a meandering shape different from the first shape portion 42AK12L. 42AK13M is included. That is, in the wiring portion 42AK4Z, the signal wiring constituted by the fourth pattern 42AK13 of the wiring includes the second shape portion 42AK13M corresponding to the first shape portion 42AK12L in the signal wiring constituted by the third pattern 42AK12 of the wiring. It is out.

  In the second shape portion 42AK12M and the second shape portion 42AK13M in which the signal wiring shown in FIG. 25B has a second shape such as a meandering shape, the second shape portion 42AK12M is included in the wiring portion 42AK3Z, and the second shape portion 42AK13M. Is included in the wiring portion 42AK4Z. Thereby, arrangement | positioning of 2nd shape part 42AK12M and 2nd shape part 42AK13M does not mutually overlap. In addition, the wiring length of each signal wiring is formed to be the same or substantially the same. Since the signal wiring constituted by the third wiring pattern 42AK12 and the fourth wiring pattern 42AK13 is formed so as to include the second shape portion 42AK12M and the second shape portion 42AK13L, the wiring pattern An increase in the area of the substrate on which the substrate is disposed is suppressed, and the substrate can be reduced in size.

  In the configuration example shown in FIG. 25A, each signal wiring is formed so that the wiring interval W2 is wider than the wiring interval W1. For example, in the second shape portion 42AK10M and the second shape portion 42AK11M, the same signal wiring folded back by the bending portion forms a meandering shape that reciprocates at a wiring interval W1, whereas the second shape portion 42AK10M is configured by the first pattern 42AK10 of the wiring. When the signal wiring and the signal wiring constituted by the second pattern 42AK11 of the wiring are parallel or substantially parallel to each other, the wiring interval W2 between the adjacent signal wirings is set to be wider than the wiring interval W1. Signal wiring is formed. As described above, since the wiring interval W2 between adjacent signal wirings is wider than the wiring interval W1 in the same signal wiring, adverse effects due to a short circuit or the like occurring in one signal wiring are caused by other signal wirings. It is possible to prevent or suppress the signal from being transmitted.

  In the configuration example shown in FIG. 25B, each signal wiring is formed so that the wiring interval W2 is narrower than the wiring interval W1. For example, in the second shape portion 42AK12M and the second shape portion 42AK13M, the same signal wiring folded back by the bending portion forms a meandering shape that reciprocates at the wiring interval W1, whereas the second shape portion 42AK12M and the second shape portion 42AK13M are configured by the third pattern 42AK12 of the wiring. The wiring interval W2 between the adjacent signal wirings is narrower than the wiring interval W1 when the signal wiring and the signal wiring configured by the fourth pattern 42AK13 of the wiring are parallel or substantially parallel to each other. Signal wiring is formed. Thus, since the wiring interval W2 between adjacent signal wirings is narrower than the wiring interval W1 in the same signal wiring, one signal wiring and other signal wirings are shorter than a short circuit inside one signal wiring. The short circuit between the two is more likely to occur. A short circuit generated between one signal wiring and another signal wiring can be easily detected using a test point provided in each signal wiring. For example, a short circuit between one signal wiring and another signal wiring can be detected by contacting a test probe with a test point provided in each signal wiring and performing an electrical characteristic inspection of the signal wiring. .

  As shown in FIG. 25A, on the other hand, the signal wiring constituted by the wiring second pattern 42AK11 corresponds to the wiring part 42AK1Z forming the first shape part 42AK11L, and the wiring first pattern 42AK10. The signal wiring constituted by forms the second shape portion 42AK10M. On the other hand, the signal wiring constituted by the first pattern 42AK10 of the wiring corresponds to the wiring part 42AK1Z forming the first formation part 42AK10L, and the signal wiring constituted by the second pattern 42AK11 of the wiring has the second shape. Part 42AK11M is formed. As shown in FIG. 25B, on the other hand, the signal wiring constituted by the wiring fourth pattern 42AK13 corresponds to the wiring part 42AK3Z forming the first shape part 42AK13L, and the wiring third pattern 42AK12. The signal wiring constituted by forms the second shape portion 42AK12M. On the other hand, the signal wiring constituted by the third pattern 42AK12 of the wiring corresponds to the wiring part 42AK4Z forming the first shape part 42AK12L, and the signal wiring constituted by the fourth pattern 42AK13 of the wiring has the second shape. Part 42AK13M is formed. The correspondence of each signal wiring constituted by each wiring pattern is, for example, a predetermined arbitrary relationship such as a vertical relationship, a horizontal relationship, or a range less than a predetermined distance when viewed from a direction perpendicular to the substrate surface such as the main substrate 11. If the signal wiring is within the position range, the relationship may be established, and if the signal wiring is not within the position range, the relationship may be invalid.

  In the example shown in FIG. 25A or FIG. 25B, the signal wiring constituted by other wiring patterns corresponding to the first shape portion in the signal wiring constituted by one wiring pattern is the second. A signal wiring composed of one wiring pattern forms a second shape corresponding to the first shape portion in the signal wiring composed of the wiring part forming the shape and another wiring pattern. In the wiring part, each signal wiring is formed so that the wiring interval W1 is common and the wiring interval W2 is also common. More specifically, the signal wiring constituted by the first pattern 42AK10 of the wiring corresponds to the first shape portion 42AK11L in the signal wiring constituted by the second pattern 42AK11 of the wiring shown in FIG. Corresponding to the first shape portion 42AK10L in the signal wiring constituted by the wiring portion 42AK1Z forming the two shape portions 42AK10M and the first pattern 42AK10 of the wiring, the signal wiring constituted by the second pattern 42AK11 of the wiring is provided. In the wiring part 42AK2Z forming the second shape part 42AK11M, each signal wiring is formed so that the wiring interval W1 is common (constant), and the wiring interval W2 is also common (constant). This facilitates wiring pattern design on the substrate surface. In addition, since the difference in shape among the plurality of signal wirings is suppressed, variation in characteristic impedance among the signal wirings is suppressed, and signal quality in the plurality of signal wirings can be made uniform.

  In addition, the signal wiring constituted by the pattern of the other wiring corresponding to the first shape portion in the signal wiring constituted by the pattern of one wiring forms the second shape and the wiring portion of the other wiring. One of the wiring interval W1 and the wiring interval W2 is a wiring portion in which the signal wiring formed by the pattern of one wiring forms the second shape corresponding to the first shape portion in the signal wiring formed by the pattern. Or each signal wiring may be formed so that both may differ. For example, in the wiring portion 42AK1Z and the wiring portion 42AK2Z shown in FIG. 25A, the wiring interval W2 is made common, while the wiring interval W1 is larger in the wiring portion 42AK2Z than in the wiring portion 42AK1Z. A wiring may be formed. In such a case, the wiring pattern design on the substrate surface can be flexibly performed.

  FIG. 26 shows a configuration example in which the second shape portions of a plurality of signal wirings configured by wiring patterns are formed in different directions. In the configuration example shown in FIG. 26A, wiring patterns constituting three signal wirings are shown as wiring patterns constituting a plurality of signal wirings. In the configuration example shown in FIG. 26B, the wiring patterns constituting the four signal wirings are shown as the wiring patterns constituting the plurality of signal wirings.

  A wiring pattern constituting the three signal wirings shown in FIG. 26A includes a first wiring pattern 42AK20, a second wiring pattern 42AK21, and a third wiring pattern 42AK22. The signal wiring constituted by the first wiring pattern 42AK20 includes a portion for forming the second shape portion 42AK20M. The signal wiring constituted by the second pattern 42AK21 of the wiring includes a portion for forming the second shape portion 42AK21M. The signal wiring constituted by the third wiring pattern 42AK22 includes a portion for forming the second shape portion 42AK22M. The second shape portion 42AK20M and the second shape portion 42AK21M have a meandering shape that reciprocates in the first direction such as the left-right direction. On the other hand, the second shape portion 42AK22M has a meandering shape that turns back and forth in a second direction different from the first direction, for example, the up-down direction. In addition, each 2nd shape part is not limited to a meandering shape, What is necessary is just to be formed so that it may become arbitrary shapes different from a linear shape and a substantially linear shape.

  As described above, the second shape portion 42AK20M in the signal wiring constituted by the first pattern 42AK20 of wiring is the first (common) parallel (parallel) to the second shape portion 42AK21M in the signal wiring constituted by the second pattern 42AK21 of wiring. It is formed in the direction. On the other hand, the second shape part 42AK22M in the signal wiring constituted by the third wiring pattern 42AK22 is the second shape part 42AK20M constituted by the first pattern of wiring and the second shape constituted by the second pattern of wiring. The shape part 42AK21M is formed in a second direction different from the first direction in which the shape part 42AK21M is formed. Since the second shape portions are formed in different directions in the plurality of signal wirings, the wiring pattern design on the substrate surface can be easily and flexibly performed. In addition, an increase in the area of the substrate on which the wiring pattern is arranged is suppressed, and the substrate can be reduced in size.

  The wiring patterns constituting the four signal wirings shown in FIG. 26B include a fourth wiring pattern 42AK23, a fifth wiring pattern 42AK24, a sixth wiring pattern 42AK25, and a seventh wiring pattern 42AK26. . The signal wiring constituted by the fourth pattern 42AK23 of the wiring includes a portion for forming two second shape portions 42AK23M1 and 42AK23M2. The signal wiring constituted by the fifth pattern 42AK24 of wiring includes a portion for forming one second shape portion 42AK24M. The signal wiring constituted by the sixth pattern 42AK25 of wiring includes a portion for forming one second shape portion 42AK25M. The signal wiring constituted by the seventh pattern 42AK26 of wiring includes a portion for forming two second shape portions 42AK26M1 and 42AK26M2. Among the plurality of second shape portions shown in FIG. 26B, the second shape portions 42AK23M1, 42AK25M, and 42AK26M2 have a meandering shape that folds back and forth in the first direction, for example, the vertical direction. On the other hand, the second shape portions 42AK23M2, 42AK24M, and 42AK26M1 have meandering shapes that reciprocate in a second direction different from the first direction, such as the left-right direction.

  As shown in FIG. 26 (B), a plurality of signal wirings configured by wiring patterns include a signal wiring including a portion forming one second shape portion and a portion forming a plurality of second shape portions. There may be a signal wiring including. Or the several signal wiring comprised by the pattern of wiring may contain only the part in which each signal wiring forms one 2nd shape part. Or the several signal wiring comprised by the pattern of wiring may contain the part in which each signal wiring forms several 2nd shape part. The second shape portion 42AK23M1 in the signal wiring constituted by the fourth pattern 42AK23 of wiring shown in FIG. 26B is the second shape portion 42AK25M in the signal wiring constituted by the sixth pattern 42AK25 of wiring and the seventh shape of wiring. It is formed in a first direction common (parallel) to the second shape portion 42AK26M2 in the signal wiring constituted by the pattern 42AK26. The second shape portion 42AK23M2 in the signal wiring constituted by the fourth wiring pattern 42AK23 is constituted by the second shape portion 42AK24M in the signal wiring constituted by the fifth wiring pattern 42AK24 and the seventh pattern 42AK26 of the wiring. The signal wiring is formed in the second direction common (parallel) to the second shape portion 42AK26M1. On the other hand, the second shape portions 42AK23M2, 42AK24M, and 42AK26M1 are formed in a second direction different from the first direction in which the second shape portions 42AK23M1, 42AK25M, and 42AK26M2 are formed.

  The signal wiring constituted by the fourth pattern 42AK23 of wiring includes a second shape portion 42AK23M1 formed in the first direction and a second shape portion 42AK23M2 formed in the second direction. The signal wiring constituted by the seventh wiring pattern 42AK26 includes a second shape portion 42AK26M1 formed in the second direction and a second shape portion 42AK26M2 formed in the first direction. Thus, even one signal wiring configured by the same wiring pattern may include a plurality of second shape portions formed in different directions. Further, the signal wiring constituted by the pattern of one wiring is different from the second shape part formed in a common (parallel) direction and the second shape part in the signal wiring constituted by the pattern of other wiring. You may include the 2nd shape part currently formed in the direction. Since the second shape portion is formed in different directions in one or a plurality of signal wirings, the wiring pattern design on the substrate surface can be easily and flexibly performed. In addition, an increase in the area of the substrate on which the wiring pattern is arranged is suppressed, and the substrate can be reduced in size.

  FIG. 27 shows a configuration example in which a plurality of signal wirings configured by wiring patterns are formed with different wiring widths. In the configuration example shown in FIG. 27, the pattern of wirings constituting four signal wirings is shown as a wiring pattern constituting a plurality of signal wirings. FIG. 27A shows a case where the wiring width is different in the entire signal wiring, and FIG. 27B shows a case where the wiring width is different in a part of the signal wiring.

  The wiring patterns constituting the four signal wirings shown in FIG. 27A include a first wiring pattern 42AK30, a second wiring pattern 42AK31, a third wiring pattern 42AK32, and a fourth wiring pattern 42AK43. . The signal wiring constituted by the first wiring pattern 42AK30 includes a portion for forming the second shape portion 42AK30M. The signal wiring constituted by the second wiring pattern 42AK31 includes a portion for forming the second shape portion 42AK31M. The signal wiring constituted by the third wiring pattern 42AK32 includes a portion for forming the second shape portion 42AK32M. The signal wiring constituted by the fourth pattern 42AK33 of the wiring includes a portion for forming the second shape portion 42AK33M.

  The signal wiring constituted by the first wiring pattern 42AK30 is formed to have the same or substantially the same wiring width as the signal wiring constituted by the second wiring pattern 42AK31. The signal wiring constituted by the third wiring pattern 42AK32 is formed to have the same or substantially the same wiring width as the signal wiring constituted by the fourth wiring pattern 42AK33. On the other hand, the signal wiring constituted by the first wiring pattern 42AK30 and the signal wiring constituted by the second wiring pattern 42AK31 are constituted by the fourth wiring pattern 42AK33 constituted by the third wiring pattern 42AK32. Compared with the signal wiring constituted by the above, the entire signal wiring is formed to have a wider wiring width. Thus, the first wiring pattern 42AK30 and the second wiring pattern 42AK31 constitute a signal wiring having a wide wiring width, and the third wiring pattern 42AK32 and the fourth wiring pattern 42AK33 constitute a signal wiring having a narrow wiring width. doing.

  The signal wiring configured by the first wiring pattern 42AK30 and the signal wiring configured by the second wiring pattern 42AK31 may transmit a common type of electrical signal such as a first type differential signal, for example. Good. In addition, the signal wiring configured by the third wiring pattern 42AK32 and the signal wiring configured by the fourth wiring pattern 42AK33, for example, a common type such as a second type of differential signal different from the first type. The electrical signal may be transmitted. On the other hand, the signal wiring constituted by the first wiring pattern 42AK30 and the signal wiring constituted by the second wiring pattern 42AK31 and the signal wiring constituted by the third wiring pattern 42AK32 and the fourth pattern 42AK33 of the wiring. Different types of electrical signals may be transmitted to the signal wiring configured by the above. As described above, the plurality of signal wirings configured by the wiring pattern may be formed so as to have different wiring widths depending on the type of electric signal to be transmitted. Alternatively, the plurality of signal wirings configured by the wiring pattern may be formed to have the same or substantially the same wiring width when the types of transmitted electrical signals are common. Note that the plurality of signal wirings configured by the wiring pattern may include signal wirings formed to have different wiring widths even when the types of transmitted electrical signals are common. Alternatively, the plurality of signal wirings configured by the wiring pattern include signal wirings formed to have the same or substantially the same wiring width even when the types of transmitted electrical signals are different. Also good. Since the plurality of signal wirings are formed to have different wiring widths, it is possible to easily adjust the characteristic impedance of each signal wiring and to perform appropriate transmission according to the type of electric signal.

  The wiring patterns constituting the four signal wirings shown in FIG. 27B include a fifth wiring pattern 42AK34, a sixth wiring pattern 42AK35, a seventh wiring pattern 42AK36, and an eighth wiring pattern 42AK37. . The signal wiring constituted by the fifth pattern 42AK34 of the wiring includes a portion for forming the second shape portion 42AK34M. The signal wiring constituted by the sixth pattern 42AK35 of the wiring includes a portion for forming the second shape portion 42AK35M. The signal wiring constituted by the seventh pattern 42AK36 of the wiring includes a portion for forming the second shape portion 42AK36M. The signal wiring constituted by the eighth pattern 42AK37 of wiring includes a portion for forming the second shape portion 42AK37M.

  The signal wiring constituted by the fifth wiring pattern 42AK34 and the signal wiring constituted by the sixth wiring pattern 42AK35 are configured such that a part of the wiring width is different from the wiring width in the other part. For example, the second shape portion 42AK34M in the signal wiring constituted by the fifth wiring pattern 42AK34 is formed so as to have a wider wiring width than other portions in the same signal wiring. The second shape portion 42AK35M in the signal wiring constituted by the sixth pattern 42AK35 of the wiring is formed so as to have a wider wiring width than other portions in the same signal wiring. Thus, the fifth pattern 42AK34 of the wiring forms a signal wiring having a wide wiring width in the second shape portion 42AK34M, and forms a signal wiring having a narrow wiring width in a portion other than the second shape portion 42AK34M. The sixth pattern 42AK35 of the wiring constitutes a signal wiring having a wide wiring width in the second shape portion 42AK35M, and constitutes a signal wiring having a narrow wiring width in a portion other than the second shape portion 42AK35M. In addition, it is not limited to what comprises a signal wiring with a wide wiring width in a 2nd shape part, A signal wiring with a wide wiring width is comprised in the 1st shape part which becomes linear shape or substantially linear shape, Also good.

  The signal wiring constituted by the fifth pattern 42AK34 of the wiring is formed so that the wiring width of the second shape portion 42AK34M is different from that of other portions, so that the wiring width of the same signal wiring is different. The signal wiring constituted by the sixth pattern 42AK35 of the wiring is formed so that the wiring width of the second shape portion 42AK35M is different from that of other portions, so that the wiring width of the same signal wiring is different. On the other hand, the signal wiring constituted by the seventh pattern 42AK36 of the wiring and the signal wiring constituted by the eighth pattern 42AK37 of the wiring are formed so that the wiring width is the same or substantially the same in the same signal wiring. Yes. Since one or a plurality of signal wirings are formed to have different wiring widths, characteristic impedance in each signal wiring can be easily adjusted, and appropriate transmission according to the type of electric signal and the like is possible. Become.

  FIG. 28 shows a configuration example in which the second shape portions of a plurality of signal wirings configured by wiring patterns are formed correspondingly. In the configuration example shown in FIG. 28, a pattern of wirings constituting two signal wirings is shown as a wiring pattern constituting a plurality of signal wirings. FIG. 28A shows a case where two signal wirings meander in substantially parallel, and FIG. 28B shows a case where two signal wirings meander in a direction away from each other.

  The wiring pattern constituting the two signal wirings shown in FIG. 28A includes a first wiring pattern 42AK40 and a second wiring pattern 42AK41. The first wiring pattern 42AK40 and the second wiring pattern 42AK41 have meandering shapes that reciprocate in a common (parallel) direction such as the vertical direction. In this meandering shape, when the signal wiring constituted by the first wiring pattern 42AK40 is bent and protrudes in a direction approaching the signal wiring constituted by the second wiring pattern 42AK41 with respect to the extending direction DR1, The signal wiring constituted by the second pattern 42AK41 of the wiring is bent and protrudes in a direction away from the signal wiring constituted by the first pattern 42AK40 of the wiring with respect to the extending direction DR1. Thereafter, when the signal wiring constituted by the first pattern 42AK40 of the wiring is bent in a direction away from the signal wiring constituted by the second pattern 42AK41 of the wiring with respect to the extending direction DR1, the wiring of the wiring is restored. The signal wiring constituted by the second pattern 42AK41 is bent and returned in a direction approaching the signal wiring constituted by the first pattern 42AK40 of the wiring with respect to the extending direction DR1. Further, in this meandering shape, the signal wiring constituted by the first wiring pattern 42AK40 is bent and protrudes in a direction away from the signal wiring constituted by the second wiring pattern 42AK41 with respect to the extending direction DR1. In addition, the signal wiring constituted by the second wiring pattern 42AK41 is bent and protrudes in a direction approaching the signal wiring constituted by the first wiring pattern 42AK40 with respect to the extending direction DR1. Thereafter, when the signal wiring constituted by the first pattern 42AK40 of the wiring is bent in the direction approaching the signal wiring constituted by the second pattern 42AK41 of the wiring with respect to the extending direction DR1, the wiring of the wiring is restored. The signal wiring constituted by the second pattern 42AK41 is bent and returned in a direction away from the signal wiring constituted by the first pattern 42AK40 of the wiring with respect to the extending direction DR1. Thus, the first wiring pattern 42AK40 and the second wiring pattern 42AK41 form a meandering signal wiring that folds back and forth substantially in parallel while maintaining substantially the same wiring spacing. The shape is not limited to the meandering shape, and may be any shape different from the linear shape and the substantially linear shape.

  Thus, the signal wiring constituted by the first wiring pattern 42AK40 is formed in parallel or substantially parallel to the signal wiring constituted by the second wiring pattern 42AK41, and has a shape different from the linear shape and the substantially linear shape. It is formed to become. By forming the second shape part that is parallel or substantially parallel to the plurality of signal wirings, but having a shape different from the linear shape and the substantially linear shape, wiring pattern design on the substrate surface is easy and flexible. Can be done. In addition, an increase in the area of the substrate on which the wiring pattern is arranged is suppressed, and the substrate can be reduced in size.

  The wiring pattern constituting the two signal wirings shown in FIG. 28B includes a third wiring pattern 42AK42 and a fourth wiring pattern 42AK43. The third wiring pattern 42AK42 and the fourth wiring pattern 42AK43 have meandering shapes that reciprocate in a common (parallel) direction such as the vertical direction. In this meandering shape, when the signal wiring constituted by the third pattern 42 of wiring is bent and protrudes in the direction away from the signal wiring constituted by the fourth pattern 42AK43 of wiring with respect to the extending direction DR1, The signal wiring constituted by the fourth pattern 42AK43 of the wiring is bent and protrudes in a direction away from the signal wiring constituted by the third pattern 42AK42 of the wiring with respect to the extending direction DR1. When the signal wiring constituted by the third pattern 42AK42 of the wiring is bent and returned in the direction approaching the signal wiring constituted by the fourth pattern 42AK43 of the wiring with respect to the extending direction DR1 from the protrusion due to the protrusion In addition, the signal wiring constituted by the fourth pattern 42AK43 of the wiring is bent and returned in a direction approaching the signal wiring constituted by the third pattern 42AK42 of the wiring with respect to the extending direction DR1. In this way, the third pattern 42AK42 of wiring and the fourth pattern 42AK43 of wiring form meandering signal wiring that reciprocates in a folded manner that protrudes in a direction away from each other while changing the wiring interval and then returns in a direction of approach. Yes.

  Thus, the signal wiring constituted by the third wiring pattern 42AK42 is formed in a common (parallel) direction to the signal wiring constituted by the fourth wiring pattern 42AK43, and is different from the linear shape and the substantially linear shape. It is formed to have a shape. By forming the second shape portion that is different from the linear shape and the substantially linear shape, such as being bent in a direction in which a plurality of signal wirings are separated and projected in a direction approaching and returning. The wiring pattern design can be easily and flexibly performed. In addition, an increase in the area of the substrate on which the wiring pattern is arranged is suppressed, and the substrate can be reduced in size.

  FIG. 29 illustrates a configuration example in which circuit components are mounted so as to be connected to a plurality of signal wirings configured by wiring patterns. In the configuration example shown in FIG. 29A, wiring patterns constituting four signal wirings are shown as wiring patterns constituting a plurality of signal wirings. The wiring patterns constituting these four signal wirings include a first wiring pattern 42AK50, a second wiring pattern 42AK51, a third wiring pattern 42AK52, and a fourth wiring pattern 42AK53. The signal wiring constituted by the second wiring pattern 42AK51 includes a portion for forming the first shape portion 42AK51L and a portion for forming the second shape portion 42AK51M. The signal wiring constituted by the third wiring pattern 42AK52 includes a portion for forming the first shape portion 42AK52L and a portion for forming the second shape portion 42AK52M.

  In the second shape portion 42AK51M in the signal wiring constituted by the second wiring pattern 42AK51 shown in FIG. 29A, the circuit component 42AK1R connected to the signal wiring constituted by the first wiring pattern 42AK50 is connected to the wiring. The second pattern 42AK51 is mounted so as to be connected to the signal wiring. The circuit component 42AK1R may be a circuit element such as a resistance element. The circuit component 42AK1R may include a passive element such as a capacitor or a coil, in part or in whole, together with the resistance element or instead of the resistance element. The circuit component 42AK1R may include a part of or all of active elements such as diodes, transistors such as bipolar transistors and MOS transistors, and thyristors instead of or in addition to passive elements such as resistance elements, capacitors, and coils. . The circuit component 42AK1R may constitute a functional circuit such as a filter circuit, a noise prevention circuit, or another IC chip. The circuit component 42AK1R supplies a specific power supply voltage to the signal wiring constituted by the second wiring pattern 42AK51 when the signal wiring constituted by the first wiring pattern 42AK50 is maintained at a specific power supply voltage. It may function as a pull-up resistor that enables it. Alternatively, the circuit component 42AK1R can supply the ground voltage to the signal wiring constituted by the second pattern 42AK51 of the wiring when the signal wiring constituted by the first pattern 42AK50 of the wiring is maintained at the ground voltage. It may function as a pull-down resistor. Alternatively, the circuit component 42AK1R may be a functional circuit in which the resistance element can be switched between a pull-up resistor and a pull-down resistor by the polarity switching unit.

  FIG. 29B is an enlarged view showing a connection portion of the circuit component 42AK1R. In the second shape portion 42AK51M shown in FIG. 29B, three folded portions are shown in which the signal wiring constituted by the second pattern 42AK51 of the wiring is folded back via the folded portion. These three folding parts include a first folding part 42AK51M1, a second folding part 42AK51M2, and a third folding part 42AK51M3. The circuit component 42AK1R is mounted to be connected to the signal wiring constituted by the second pattern 42AK51 of the wiring and the signal wiring constituted by the first pattern 42AK50 of the wiring at the second folding portion 42AK51M2. Yes. In the second folded portion 42AK51M2 shown in FIG. 29 (B), a shape is formed in which the same signal wiring folded back through the folded portion reciprocates at a wiring interval W3. On the other hand, in the first folded portion 42AK51M1 and the third folded portion 42AK51M3, a shape is formed in which the same signal wiring folded back via the bent portion reciprocates at the wiring interval W4. Further, the interval between the first folded portion 42AK51M1 and the second folded portion 42AK51M2 and the interval between the second folded portion 42AK51M2 and the third folded portion 42AK51M3 are also formed to be the wiring interval W4. The signal wiring is formed so that the wiring interval W3 is wider than the wiring interval W4. As described above, the wiring interval W3 in the second folded portion 42AK51M2 where the circuit component 42AK1R is mounted is wider than the wiring interval W4 in the portion where the circuit component 42AK1R is not mounted in the second shape portion 42AK51M. It can be easily mounted and the transmission characteristics in the signal wiring can be adjusted appropriately.

  Note that the wiring interval W3 in the second folded portion 42AK51M2 on which the circuit component 42AK1R is mounted is not limited to the wiring interval W4 wider than the wiring interval W4 in the portion where the circuit component 42AK1R is not mounted in the second shape portion 42AK51M. W3 may be the same as or substantially the same as the wiring interval W4, and the wiring interval W3 may be formed to be narrower than the wiring interval W4. Further, the circuit component 42AK1R is not limited to be mounted so as to be connected to the signal wiring constituted by the second pattern 42AK52 of the wiring at the second folding part 42AK51M2, but the first folding part 42AK51M1 or the third folding part. The part 42AK51M3 may be mounted so as to be connected to the signal wiring constituted by the second wiring pattern 42AK52.

  As described above, the second shape portion 42AK51M in the signal wiring constituted by the second pattern 42AK51 of the wiring shown in FIG. 29A or the like is connected to the signal wiring constituted by the first pattern 42AK50 of the wiring. The circuit component 42AK1R mounted on is provided. By mounting circuit components on the second shape portion, it is possible to appropriately adjust transmission characteristics and the like in the signal wiring. In addition, an increase in the area of the substrate on which the wiring pattern is arranged is suppressed, and the substrate can be reduced in size.

  In the first shape portion AK52L of the signal wiring constituted by the third wiring pattern 42AK52 shown in FIG. 29A, the circuit component 42AK2R connected to the signal wiring constituted by the fourth wiring pattern 42AK53 is connected to the wiring. It is mounted so as to be connected to the signal wiring constituted by the third pattern 42AK52. The circuit component 42AK2R may be a circuit element such as a resistance element. The circuit component 42AK2R may include a passive element such as a capacitor or a coil, in part or in whole, together with the resistive element or instead of the resistive element. The circuit component 42AK2R may include a part or all of an active element such as a diode, a transistor such as a bipolar transistor or a MOS transistor, or a thyristor instead of or in addition to a passive element such as a resistance element, a capacitor, or a coil. . The circuit component 42AK2R may constitute a functional circuit such as a filter circuit, a noise prevention circuit, or another IC chip. The circuit component 42AK2R supplies a specific power supply voltage to the signal wiring constituted by the third wiring pattern 42AK52 when the signal wiring constituted by the fourth wiring pattern 42AK53 is maintained at the specific power supply voltage. It may function as a pull-up resistor that enables it. Alternatively, the circuit component 42AK2R can supply the ground voltage to the signal wiring constituted by the third wiring pattern 42AK52 when the signal wiring constituted by the fourth wiring pattern 42AK53 is maintained at the ground voltage. It may function as a pull-down resistor. Alternatively, the circuit component 42AK2R may be a functional circuit in which the resistance element can be switched between a pull-up resistor and a pull-down resistor by the polarity switching unit.

  As described above, the first shape portion 42AK52L different from the second shape portion 42AK52M in the signal wiring constituted by the third pattern 42AK52 of the wiring shown in FIG. 29A is constituted by the fourth pattern 42AK53 of the wiring. A circuit component 42AK2R mounted so as to be connected to the signal wiring is provided. By mounting circuit components on a portion different from the second shape portion, it is possible to appropriately adjust transmission characteristics and the like in the signal wiring. In addition, an increase in the area of the substrate on which the wiring pattern is arranged is suppressed, and the substrate can be reduced in size.

  Each signal wiring may be formed so that the wiring width in the portion where the circuit component 42AK1R and the circuit component 42AK2R are mounted has a different wiring width from the portion where the circuit component 42AK1R and the circuit component 42AK2R are not mounted. For example, each signal wiring may be formed so that the wiring width in the portion where the circuit component 42AK1R and the circuit component 42AK2R are mounted is wider than the wiring width in the portion where the circuit component 42AK1R and the circuit component 42AK2R are not mounted. As described above, the plurality of signal wirings configured by the wiring pattern may be formed so as to have a wiring width different from that of the portion not mounted, corresponding to the portion where the circuit component is mounted. Since the wiring width is different depending on the portion where the circuit component is mounted, the characteristic impedance in each signal wiring can be easily adjusted, and appropriate transmission by the signal wiring becomes possible.

  When the signal wiring having the first shape portions 42AK10L, 42AK11L, 42AK12L, 42AK13L and the second shape portions 42AK10M, 42AK11M, 42AK12M, 42AK13M as shown in FIG. 25 (A) and FIG. 25 (B) is formed. For example, as shown in FIG. 26, the second shape portion may be formed in a different direction as shown in FIG. 26. For example, as shown in FIG. For example, as shown in FIG. 28, the second shape portion may be formed substantially in parallel with or away from the wiring. For example, as shown in FIG. A circuit component connected to a part different from the two-shaped part may be mounted, or a part or all of these parts may be combined. .

(Explanation regarding the feature 43AK)
FIG. 30 shows an example of a configuration in which a test point serving as a specific conductor portion for connection confirmation is provided in the second shape portion of a plurality of signal wirings configured by wiring patterns with respect to the characteristic portion 43AK of the present embodiment. ing. In the configuration example shown in FIG. 30, the wiring patterns constituting the two signal wirings are shown as the wiring patterns constituting the plurality of signal wirings. The wiring patterns constituting these two signal wirings include a first wiring pattern 43AK10 and a second wiring pattern 43AK11. The signal wiring constituted by the first pattern 43AK10 of wiring includes a portion for forming the first shape portion 43AK10L and a portion for forming the second shape portion 43AK10M. The signal wiring constituted by the second pattern 43AK11 of wiring includes a portion for forming the first shape portion 43AK11L and a portion for forming the second shape portion 43AK11M. The first shape portions 43AK10L and 43AK11L are formed such that the signal wiring has a first shape that is linear or substantially linear. The second shape portions 43AK10M and 43AK11M are formed so that the signal wiring has a second shape different from the linear shape and the substantially linear shape, such as a meandering shape. In addition, 2nd shape part 43AK10M and 43AK11M are not limited to meandering shape, What is necessary is just to be formed so that it may become arbitrary shapes different from linear shape and substantially linear shape.

  At least a part of the plurality of signal wirings constituted by the first wiring pattern 43AK10 and the second wiring pattern 43AK11 is, for example, the first wiring pattern 42AK10 and the second wiring pattern 42AK11 shown in FIG. Or the third pattern 42AK12 of wiring and the fourth pattern 42AK13 of wiring shown in FIG. 25B may be formed. For example, the signal wiring configured by the wiring second pattern 43AK11 corresponds to the first shape portion 43AK11L having the first shape of the linear shape or the substantially linear shape, and the signal wiring configured by the first pattern 43AK10 of the wiring. However, what is necessary is just to include 2nd shape part 43AK10M, such as a meander shape different from 1st shape part 43AK11L. In addition, the signal wiring constituted by the first pattern 43AK10 of the wiring corresponds to the first shape portion 43AK10L having the linear shape or the substantially linear shape, and the signal wiring constituted by the second pattern 43AK11 of the wiring is the first. What is necessary is just to include 2nd shape part 43AK10M, such as a meander shape different from shape part 43AK10L.

  A test point 43AK10TP is provided as a specific conductor portion for connection confirmation in the second shape portion 43AK10M in the signal wiring constituted by the first pattern 43AK10 of the wiring. A test point 43AK11TP is provided as a specific conductor part for connection confirmation in the second shape part 43AK11M in the signal wiring constituted by the second pattern 43AK11 of the wiring. The test points 43AK10TP and 43AK11TP may be formed using a metal material such as solder or copper foil. The test points 43AK10TP and 43AK11TP have, for example, a diameter W6 when formed in a circle is larger than the wiring width W5 in the signal wiring constituted by the first pattern 43AK10 of wiring and the signal wiring constituted by the second pattern 43AK11 of wiring. It is formed to be large (wide). Note that the test points 43AK10TP and 43AK11TP are not limited to being formed in a circular shape, and may be any shape as long as they are formed in an arbitrary shape such as a square shape or a strip shape. Whatever the test points 43AK10TP and 43AK11TP are in any shape, the average shape is only required to be larger (wider) than the wiring width in the signal wiring. By providing the test points 43AK10TP and 43AK11TP, variation in characteristic impedance among a plurality of signal wirings may be suppressed. Thereby, homogenization of signal quality in a plurality of signal wirings is achieved.

  For example, when a test probe is brought into contact with the test point 43AK10TP and the test point 43AK11TP, a short circuit is caused between the signal wiring constituted by the first wiring pattern 43AK10 and the signal wiring constituted by the second wiring pattern 43AK11. The presence or absence of occurrence can be inspected. In addition to the test points 43AK10TP and 43AK11TP, a test point serving as a specific conductor portion for connection confirmation may be provided. As an example, a test point may be provided in addition to the test point 43AK10TP in the signal wiring constituted by the first wiring pattern 43AK10. A test probe is brought into contact with this test point and the test point 43AK10TP provided in the second shape portion 43AK10M, thereby inspecting the occurrence of disconnection in the signal wiring constituted by the first pattern 43AK10 of the wiring. be able to. In addition to being able to inspect for the occurrence of a short circuit or disconnection, it may be configured so that, for example, an oscilloscope can be used to check and inspect the signal waveform instead of the inspection.

  As described above, the test point 43AK10TP is provided in the second shape part 43AK10M in which the signal wiring shown in FIG. 30 has a second shape such as a meandering shape, and the test point 43AK11TP is provided in the second shape part 43AK11M. By providing a test point in the second shape portion of the signal wiring, the wiring pattern is properly arranged, and various structures are appropriately arranged to suppress an increase in the board area and to reduce the board size. be able to. Further, the test points 43AK10TP and 43AK11TP are formed using a metal material and are formed so as to be wider than the wiring width of the signal wiring. By forming the test point so as to be larger (wider) than the wiring width of such a signal wiring, it is possible to easily contact the test probe and inspect the electrical characteristics of the signal wiring. In addition, the wiring pattern can be appropriately arranged, and various structures can be appropriately arranged to suppress an increase in the board area, thereby reducing the size of the board.

  When the test points 43AK10TP and 43AK11TP as shown in FIG. 30 are provided, the plurality of signal wirings configured by the wiring pattern are formed with the second shape portions formed in different directions as shown in FIG. 26, for example. For example, as shown in FIG. 27, the whole or a part of the signal wiring may be formed with different wiring widths. For example, as shown in FIG. 28, the second shape portion is formed corresponding to a direction substantially parallel or away. For example, as shown in FIG. 29, a circuit component connected to the second shape portion or a portion different from the second shape portion may be mounted, and a part or all of these may be formed. Also good.

(Explanation regarding the feature 44AK)
FIG. 31 relates to the characteristic portion 44AK of the present embodiment. In the main board 11 configured as a multilayer wiring board, the signal wiring including the second shape is provided on one surface, and the other surface serves as a specific conductor portion for connection confirmation. The example of a structure in case the test point is provided is shown. At least a part of the characteristic portion 44AK illustrated in FIG. 31 may be formed in the same manner as the configuration example illustrated in FIG. For example, the feature portion 44AK may have a multilayer structure formed by overlapping synthetic resins. The multilayer structure of the main substrate 11 shown in FIG. 31 includes a surface layer 44AK1S, a ground layer 44AK1L, a power supply layer 44AK2L, a wiring layer 44AK3L, a power supply layer 44AK4L, and a back surface layer 44AK2S.

  A surface layer 44AK1S is provided on the surface serving as one substrate surface of the main substrate 11, and a wiring pattern 44AK10P and a pattern 44AK11P constituting a signal wiring are formed. A back surface layer 44AK2S is provided on the back surface which is the other substrate surface of the main substrate 11, and a wiring pattern 44AK20P constituting a signal wiring is formed. The wiring pattern 44AK10P formed on the surface layer 44AK1S of the main substrate 11 is the same as the wiring pattern 44AK20P formed on the back surface layer 44AK2S through the through hole 44AK1H penetrating the surface layer 44AK1S and the back surface layer 44AK2S of the main substrate 11. Electrically connected. The wiring pattern 44AK11P formed on the surface layer 44AK1S of the main substrate 11 is similar to the wiring pattern 44AK20P formed on the back surface layer 44AK2S through the through hole 44AK2H that penetrates the surface layer 44AK1S and the back surface layer 44AK2S of the main substrate 11. Electrically connected. As described above, the main substrate 11 is provided with the wiring patterns 44AK10P and 44AK11P constituting the signal wiring in the surface layer 44AK1S provided on the surface serving as one substrate surface, and the back surface serving as the other substrate surface. A through hole 44AK1H and a through hole 44AK2H that can electrically connect the wiring pattern 44AK20P constituting the signal wiring in the back surface layer 44AK2S are provided.

  The wiring pattern 44AK10P formed on the surface layer 44AK1S has portions for forming the first shape portion and the second shape portion, for example, like the first pattern 43AK10 and the second pattern 43AK11 of the wiring shown in FIG. It is sufficient that a plurality of signal wirings are formed so as to include them. The signal wiring constituted by the first pattern 43AK10 of wiring and the second pattern 43AK11 of wiring shown in FIG. 30 is the same as that of the first shape having a linear shape or a substantially linear shape. Corresponding to the first shape portion 43AK11L, the signal wiring constituted by the first pattern 43AK10 of the wiring may include the second shape portion 43AK10M having a meandering shape different from the first shape portion 43AK11L. In addition, the signal wiring constituted by the first pattern 43AK10 of the wiring corresponds to the first shape portion 43AK10L having the linear shape or the substantially linear shape, and the signal wiring constituted by the second pattern 43AK11 of the wiring is the first. What is necessary is just to include 2nd shape part 43AK10M, such as a meander shape different from shape part 43AK10L.

  Then, corresponding to the test point 43AK10TP provided in the second shape portion 43AK10M and the test point 43AK11TP provided in the second shape portion 43AK11M shown in FIG. 30, the test point 44AK10TP shown in FIG. 31 is a wiring pattern 44AK10P. As long as it is provided on the signal wiring. The test point 44AK10TP may be connected to a different conductor layer such as a wiring pattern 44AK20P formed on the back surface layer 44AK2S through the through hole 44AK1H. Note that the test point 44AK10TP is not limited to the wiring pattern 44AK20P formed on the back surface layer 44AK2S, and may be any arbitrary different from the surface layer 44AK1S on which the test point 44AK10TP is provided, such as a wiring pattern formed on the wiring layer 44AK3L. What is necessary is just to be connected with the conductor layer. By connecting the conductor layer and the test point, which are different from the layer provided with the test point, through the through hole, it is possible to easily inspect the electrical characteristics of the signal wiring and the conductor layer. In addition, the wiring pattern can be appropriately arranged, and various structures can be appropriately arranged to suppress an increase in the board area, thereby reducing the size of the board.

  Also for the wiring pattern 44AK11P formed on the surface layer 44AK1S, a plurality of signal wirings may be formed so as to include portions for forming the first shape portion and the second shape portion. As described above, the plurality of signal wirings configured by the wiring pattern 44AK11P includes a second shape portion different from the linear shape and the substantially linear shape on one surface of the substrate, such as the surface layer 44AK1S of the main substrate 11. Is formed. On the other hand, a test point 44AK11TP is provided on the back surface layer 44AK2S. The test point 44AK11TP is provided on a signal wiring constituted by, for example, a wiring pattern 44AK20P, and may be connected to a different conductor layer such as a wiring pattern 44AK11P formed on the surface layer 44AK1S through the through hole 44AK2H. . By providing the test points 44AK10TP and 44AK11P, variation in characteristic impedance in a plurality of signal wirings may be suppressed. Thereby, homogenization of signal quality in a plurality of signal wirings is achieved. By providing the signal wiring including the second shape portion on one surface of the substrate and providing the test point on the other surface of the substrate, the electrical characteristics inspection of the signal wiring and the conductor layer can be easily performed. In addition, the wiring pattern can be appropriately arranged, and various structures can be appropriately arranged to suppress an increase in the board area, thereby reducing the size of the board.

  For example, it suffices if a test probe is brought into contact with the test point 44AK10TP to inspect whether or not a short circuit has occurred in a plurality of signal wirings constituted by the wiring pattern 44AK10P. Further, for example, by bringing a test probe into contact with the test point 44AK10TP and the test point 44AK11TP, whether or not disconnection occurs in the signal wiring constituted by the wiring pattern 44AK20P formed in the back surface layer 44AK2S or in the through hole 44AK1H is checked. It only needs to be inspected. In addition, the presence or absence of occurrence of disconnection in a plurality of signal wirings configured by the wiring pattern 44AK10P, the presence or absence of occurrence of short circuit or disconnection in the plurality of signal wirings configured by the wiring pattern 44AK11P, and the configuration by the wiring pattern 44AK20P There may be provided test points that enable inspection of whether or not a short circuit occurs in the plurality of signal wirings, whether or not a short circuit occurs in the through hole 44AK1H, and whether or not a short circuit or disconnection occurs in the through hole 44AK2H.

  The test point that is the specific conductor part for connection confirmation is not limited to the one provided with a dedicated electrode pad for contacting the test probe. For example, circuit components can be connected to adjust the characteristic impedance of the signal wiring. What is necessary is just to be comprised using arbitrary electrode pads, such as an electrode pad provided in this. The specific conductor portion such as a test point is a conductor layer different from a layer provided with a plurality of signal wirings and a test point among a plurality of layers included in the multilayer wiring substrate by a through hole provided in the multilayer wiring substrate. By being electrically connected to each other, it is possible to appropriately perform an electrical property test on the multilayer wiring board. For example, a specific conductor part such as a test point is provided on the other substrate surface different from the one substrate surface on which the wiring pattern is formed, such as the substrate surface on the back side, so that electrical characteristics inspection on a multilayer wiring substrate is appropriate Can be done. In addition, the wiring pattern can be appropriately arranged, and various structures can be appropriately arranged to suppress an increase in the board area, thereby reducing the size of the board.

  When the test points 44AK10TP and 44AK11TP as shown in FIG. 31 are provided, the plurality of signal wirings configured by the wiring pattern are formed with the second shape portions in different directions as shown in FIG. 26, for example. For example, as shown in FIG. 27, the whole or a part of the signal wiring may be formed with different wiring widths. For example, as shown in FIG. For example, as shown in FIG. 29, a circuit component connected to the second shape portion or a portion different from the second shape portion may be mounted, and a part or all of these may be formed. Also good.

(Explanation regarding feature 45AK)
Hereinafter, the board case 45AK10 of the gaming machine according to the characteristic portion 45AK, and the board 45AK50 and the heat sink 45AK40 housed in the board case 45AK10 will be described in detail with reference to the drawings. FIG. 32 is an exploded perspective view of the board case 45AK10, the board 45AK50, and the heat sink 45AK40 of the gaming machine according to the embodiment of the present invention as seen from the rear. FIG. 33 is an exploded perspective view of the board case 45AK10, the board 45AK50, and the heat sink 45AK40 of the gaming machine according to the embodiment of the present invention as seen from the front. In the following description, in order to facilitate understanding, the front-rear direction shown in FIG. 32 and the like are defined, and the vertical and horizontal directions when the substrate case 45AK10 and the like are viewed from the front are defined as the vertical and horizontal directions of the substrate case 45AK10 and the like. explain.

  The substrate case 45AK10 is configured by combining a front case 45AK20 constituting the front and a rear case 45AK30 constituting the rear. Inside the substrate case 45AK10, an accommodation space for accommodating a substrate 45AK50 on which electronic components such as a CPU, a ROM, and a connector are mounted and a heat sink 45AK40 is formed.

  The front case 45AK20 is made of, for example, a synthetic resin having thermoplasticity, and is formed in a substantially rectangular shape in plan view. The front case 45AK20 has a box shape with the rear opened. Two protrusions 45AK21 protruding upward are formed on the upper edge of the front case 45AK20. Further, two projecting portions 45AK22 projecting downward are formed on the lower edge of the front case 45AK20.

  Similarly to the front case 45AK20, the rear case 45AK30 is made of, for example, a synthetic resin having thermoplasticity, and is formed in a substantially rectangular shape in plan view. The rear case 45AK30 includes a base plate 45AK30a that forms a rear surface, and an upper wall 45AK30b, a right wall 45AK30c, a lower wall 45AK30d, and a left wall 45AK30e that are erected forward from the base plate 45AK30a. Accordingly, the rear case 45AK30 has a box shape with the front opened, and the accommodating portion is deeper than that of the front case 45AK20. On the upper wall 45AK30b of the rear case 45AK30, two locking portions 45AK31 having insertion holes 45AK31a through which the protruding portions 45AK21 formed in the front case 45AK20 are inserted are formed. In addition, the lower wall 45AK30d of the rear case 45AK30 is formed with two locking portions 45AK38 (FIG. 33) on which the protrusion 45AK22 formed on the front case 45AK20 is hooked.

  When combining the front case 45AK20 and the rear case 45AK30, first, the protrusion 45AK21 of the front case 45AK20 is inserted into the insertion hole 45AK31a of the rear case 45AK30. Then, the lower portion of the front case 45AK20 is pressed against the rear case 45AK30, and the protrusion 45AK22 of the front case 45AK20 is hooked on the locking portion 45AK38 of the rear case 45AK30. Thereby, the front case 45AK20 and the rear case 45AK30 are combined, and an accommodation space for the substrate 45AK50 and the like is formed inside.

  In the rear case 45AK30, a plurality of air holes 45AK32 are formed in the upper wall 45AK30b, and a plurality of air holes 45AK33 (FIG. 33) are formed in the lower wall 45AK30d. As a result, an air passage along the vertical direction is secured in the substrate case 45AK10. The base plate 45AK30a of the rear case 45AK30 has four insertion convex portions 45AK36 for positioning the substrate 45AK50, screw holes 45AK37a to 45AK37e for screwing the substrate 45AK50, and four corners of the heat sink 45AK40. Four positioning portions 45AK34 for positioning and six support portions 45AK35 that abut on and support the heat sink 45AK40 positioned by the four positioning portions 45AK34 are formed.

  The insertion protrusions 45AK36 are formed at the four corners of the base plate 45AK30a. Each of the insertion protrusions 45AK36 is a columnar protrusion that is inserted into an insertion hole 45AK50a formed in the substrate 45AK50.

  Each of the four positioning portions 45AK34 has an angle shape, and is disposed so as to be able to contact the corner portion of the heat sink 45AK40 on an orthogonal surface.

  As shown in the enlarged view of FIG. 33, the support portion 45AK35 is disposed in the notch 45AK30f of the base plate 45AK30a, and has a protrusion 45AK35a that protrudes forward from the base plate 45AK30a. The support portion 45AK35 is in a cantilever state in which only one end is supported by the base plate 45AK30a. Therefore, the support portion 45AK35 is elastically deformed and displaced rearward when a backward stress acts on the protrusion 45AK35a. On the other hand, when the backward stress does not act on the protrusion 45AK35a, the support 45AK35 returns to the front and returns to the original state.

  The heat sink 45AK40 is formed, for example, by processing aluminum having excellent heat conductivity. The heat sink 45AK40 includes a rectangular base plate 45AK41 and five rectangular fins 45AK42 standing on the base plate 45AK41. Each of the fins 45AK42 extends in the vertical direction and is arranged in parallel in the horizontal direction.

  The board 45AK50 is a printed board on which various electronic components such as a CPU, a ROM, and a connector are mounted. The board 45AK50 has screw insertion holes 45AK55a through which four insertion holes 45AK50a provided at positions corresponding to the insertion protrusions 45AK36 formed in the rear case 45AK30 and screws 45AK81a to 45AK81e for fixing the board 45AK50 are inserted. To 45AK55e.

  Further, the substrate 45AK50 is provided with a heat generating electronic component 45AK60, and a non-heat generating electronic component 45AK51 and an electronic component 45AK52. The electronic component 45AK60, the electronic component 45AK51, and the electronic component 45AK52 have a rectangular shape. In particular, the electronic component 45AK60 has a substantially square shape. Among the non-heat-generating electronic components, the electronic component 45AK52 is higher (thickness) than the electronic component 45AK51. In other words, in FIG. 32, the electronic component 45AK52 protrudes far behind the electronic component 45AK51. Here, the exothermic electronic component refers to an electronic component that generates heat that requires heat dissipation measures in order to prevent malfunction of the electronic component. On the other hand, a non-heat-generating electronic component refers to an electronic component that generates heat only to the extent that it is not necessary to take measures for heat dissipation, or generates no heat at all.

  Of the non-exothermic electronic components, the low-profile electronic component 45AK51 is disposed above the exothermic electronic component 45AK60. Among the non-exothermic electronic components, the high electronic component 45AK52 is disposed on the right side of the exothermic electronic component 45AK60. Further, the directions of the non-heat-generating electronic component 45AK51 and the electronic component 45AK52 are arranged such that each side is parallel to the side of the rectangular substrate 45AK50 when viewed in plan. On the other hand, the heat-generating electronic component 45AK60 is arranged such that each side does not become parallel to the side of the rectangular substrate 45AK50 when viewed in plan. A heat conductive sheet 45AK70 is attached to the heat-generating electronic component 45AK60 so as to be interposed between the electronic component 45AK60 and the heat sink 45AK40 and transmit the heat to the heat sink 45AK40. The heat conductive sheet 45AK70 covers substantially the entire electronic component 45AK60.

  The heat conductive sheet 45AK70 can be adopted from a known heat conductive sheet of a type in which both surfaces are adhered, a flexible heat conductive sheet mainly made of silicone, non-silicone, or ceramic. The heat conductive sheet 45AK70 is interposed between the electronic component 45AK60 and the heat sink 45AK40 and adheres both.

(Installation of heat sink 45AK40 and board 45AK50)
Next, a procedure for attaching the heat sink 45AK40 and the substrate 45AK50 to the substrate case 45AK10 will be described. FIG. 34 is a cross-sectional view showing the state of attaching the heat sink 45AK40 and the substrate 45AK50 to the substrate case 45AK10 in the order of attachment ((a) to (b)). FIG. 35 is a cross-sectional view showing the state of attaching the heat sink 45AK40 and the substrate 45AK50 to the substrate case 45AK10 in the order of attachment ((a) to (b)) following FIG. 34 and 35 are cross-sectional views taken along the cross-sectional line AA in FIG.

  As shown in FIG. 34A, first, the rear case 45AK30 is placed on a table or the like, and the heat sink 45AK40 is placed on the rear case 45AK30. As shown in FIG. 34B, the heat sink 45AK40 is placed on the positioning portion 45AK34 formed on the base plate 45AK30a so that the fins 45AK42 extend in the vertical direction. Thereby, the heat sink 45AK40 can be positioned with respect to the rear case 45AK30. At this time, the fins 45AK42b and the fins 45AK42d of the heat sink 45AK40 are in contact with the protrusions 45AK35a of the support 45AK35.

  Subsequently, as shown in FIG. 34B, a substrate 45AK50 in which a heat conductive sheet 45AK70 is attached to the electronic component 45AK60 is installed in the rear case 45AK30. At that time, the insertion convex portion 45AK36 formed in the rear case 45AK30 is inserted into the insertion hole 45AK50a formed in the substrate 45AK50 shown in FIG. 33, and the substrate 45AK50 is attached to the rear case 45AK30 as shown in FIG. Placed on. In this manner, the insertion protrusion 45AK36 is inserted into the insertion hole 45AK50a, whereby the substrate 45AK50 is positioned with respect to the rear case 45AK30.

  Subsequently, as shown in FIG. 35 (a), screws 45AK81a to 45AK81e (in FIG. 35 (a), only the screw 45AK81e is shown) are inserted into the board 45AK50 and tightened into the corresponding screw holes 45AK37a to 45AK37e. Accordingly, the heat sink 45AK40 and the substrate 45AK50 supported by the support portion 45AK35 are pressed toward the rear case 45AK30. Thereby, as shown in FIG. 35 (b), the support portion 45AK35 is elastically deformed, and the tip thereof is displaced rearward by a distance L. The support portion 45AK35 elastically deformed in this way presses the heat sink 45AK40 that abuts forward. On the other hand, the screws 45AK81a to 45AK81e press the substrate 45AK50 pressed forward through the heat sink 45AK40. As a result, the heat sink 45AK40 and the heat conductive sheet 45AK70 are in close contact with each other, and the electronic component 45AK60 and the heat conductive sheet 45AK70 are in close contact with each other. With such a configuration, heat generated from the electronic component 45AK60 is transmitted to the heat sink 45AK40 via the heat conductive sheet 45AK70, and is radiated from the heat sink 45AK40.

(About the effects of the feature 45AK)
The effect of the gaming machine according to the characteristic portion 45AK will be described with reference to the drawings. FIG. 36 is a plan view for explaining the relationship between the heat sink 45AK40 and the electronic component 45AK60. FIG. 37 is an explanatory diagram for explaining the flow of air in the substrate case 45AK10. 36 is a view of the heat sink 45AK40 as viewed from the fin 45AK42 side, the electronic component 45AK60 is indicated by a broken line which is a hidden line. Further, a heat conduction sheet 45AK70 is interposed between the heat sink 45AK40 and the electronic component 45AK60 to conduct heat. For convenience, the illustration of the heat conduction sheet 45AK70 is omitted, and the heat sink is provided from the entire surface of the electronic component 45AK60. It is assumed that heat is conducted to 45AK40. The electronic component 45AK61 indicated by a two-dot chain line is a comparative example shown for comparison with the electronic component 45AK60.

  As shown in FIG. 36, when viewed in plan, the rectangular electronic component 45AK60 is arranged such that the sides 45AK60a to 45AK60d are not parallel to the sides 45AK40a to 45AK40d of the rectangular heat sink. That is, by rotating the electronic component 45AK61 having each side parallel to the sides 45AK40a to 45AK40d of the heat sink by the predetermined angle θ around the center point O, the electronic component 45AK60 can be arranged. The predetermined angle θ is approximately 45 °, for example. In addition, since the electronic component 45AK60 has a substantially square shape, the diagonal line of the electronic component 45AK60 faces in the vertical and horizontal directions. By arranging the electronic component 45AK60 in this manner, the vertex 45AK60f of the electronic component 45AK60 is on the right side (left side in the figure) of the fin 45AK42b, and the vertex 45AK60e of the electronic component 45AK60 is on the left side (right side in the figure) of the fin 45AK42d. Can be arranged. On the other hand, in the electronic component 45AK61 of the comparative example, which is arranged so as to coincide with the heat sink 45AK40, all the parts are on the right side (left side in the figure) of the fin 45AK42b or on the left side of the fin 45AK42d (right side in the figure). Is not located). Accordingly, the electronic component 45AK60 can transmit a large amount of heat to the fins 45AK42b and the fins 45AK42d, and can effectively use the fins 45AK42b and the fins 45AK42d when radiating heat. Thereby, the heat dissipation effect of the heat generated from the electronic component 45AK60 can be enhanced. In addition, although the arrangement | positioning aspect of the electronic component 45AK60 with respect to the heat sink 45AK40 was described above, this is technically equivalent even if it describes as an arrangement | positioning aspect of the heat sink 45AK40 with respect to the electronic component 45AK60.

  In addition, heat generated from the electronic component 45AK60 is not only transmitted to the heat sink 45AK40 and radiated, but part of the heat is radiated directly from the electronic component 45AK60. Thus, the amount of heat radiated directly from the electronic component 45AK60 increases as the length of the electronic component 45AK60 in the left-right direction increases. Here, as shown in FIG. 36, the width W1 in the left-right direction of the electronic component 45AK60 is larger than the width W2 in the left-right direction of the electronic component 45AK61, which is a comparative example. Therefore, the arrangement of the electronic component 45AK60 can dissipate more heat generated from the electronic component 45AK60 directly upward. Thereby, the heat dissipation effect of the heat generated from the electronic component 45AK60 can be enhanced.

  As shown in FIG. 37, an air hole 45AK33 through which air flows is formed in the lower portion of the rear case 45AK30, and an air hole 45AK32 for discharging air is formed in the upper portion of the rear case 45AK30. . As a result, an air passage along the vertical direction is secured in the substrate case 45AK10. The air (arrow Y1) flowing in from the air hole 45AK33 moves upward. The air that has moved upward eventually passes between the fins 45AK42 formed on the heat sink 45AK40 (arrow Y2). At this time, the heat of the heat sink 45AK40 is removed and the air is warmed. The warmed air passes between the electronic components 45AK51 having a low height disposed above the heat sink 45AK40 (arrow Y3) or passes behind the electronic components 45AK51 having a low height (arrow Y4) and moves upward. And move. Eventually, the air that has moved upward is discharged from an air hole 45AK32 formed in the upper part of the rear case 45AK30 (arrow Y5). Thus, by arranging the electronic component 45AK51 having a low height above the heat sink 45AK40, air can be passed not only between the electronic components 45AK51 but also behind the electronic component 45AK51. On the other hand, the high electronic component 45AK52 is not disposed above and below the heat sink 45AK40, but is disposed on the right side (left side in the figure). Thereby, the heat dissipation effect of the heat generated from the electronic component 45AK60 can be enhanced without hindering the flow of air moving from below to above.

  In addition, by making the longitudinal direction of the electronic component 45AK51 coincide with the vertical direction, it is possible to increase the space between the electronic components 45AK51. Thereby, the heat dissipation effect of the heat generated from the electronic component 45AK60 can be enhanced without hindering the flow of air moving upward.

  Further, the heat sink 45AK40 is arranged so that the fins 45AK42 arranged in parallel in the left-right direction face the up-down direction. Thereby, the air which moves upwards from below can be passed between the fins 45AK42 along the vertical direction. Thereby, the heat dissipation effect of the heat generated from the electronic component 45AK60 can be enhanced without hindering the flow of air moving upward.

  Further, the heat conductive sheet 45AK70 interposed between the electronic component 45AK60 and the heat sink 45AK40 is a flexible heat conductive sheet that adheres to both surfaces. Therefore, the heat conductive sheet 45AK70 can be closely attached to the electronic component 45AK60 and the heat sink 45AK40 without a gap. Thereby, the heat generated from the electronic component 45AK60 can be smoothly transferred to the heat sink 45AK40 via the heat conductive sheet 45AK70.

  The rear case 45AK30 is provided with a support portion 45AK35 that presses the heat sink 45AK40 against the heat-generating electronic component 45AK60. As a result, the heat sink 45AK40 and the electronic component 45AK60 press the heat conductive sheet 45AK70 and adhere to the heat conductive sheet 45AK70 without a gap. Thereby, the heat generated from the electronic component 45AK60 can be smoothly transferred to the heat sink 45AK40 via the heat conductive sheet 45AK70.

  32 and 33, the substrate 45AK50 is attached to the rear case 45AK30 by a plurality of screws 45AK81a to 45AK81e. Among the plurality of screws 45AK81a to 45AK81e, the screw 45AK81d and the screw 45AK81e are inserted into the screw insertion hole 45AK55d and the screw insertion hole 45AK55e in the vicinity of the electronic component 45AK60, and are fastened to the rear case 45AK30. In this manner, by tightening the screw 45AK81d and the screw 45AK81e to the rear case 45AK30 in the vicinity of the electronic component 45AK60, the heat sink 45AK40 bonded to the electronic component 45AK60 can be reliably pressed toward the rear case 45AK30. Thereby, the adhesion between the heat sink 45AK40 and the electronic component 45AK60 can be ensured.

  The support portion 45AK35 is disposed in the notch 45AK30f of the base plate 45AK30a, and a slight gap t (FIG. 34 (a)) is provided between the support portion 45AK35 and the notch 45AK30f. . From this gap t, the heat transferred to the heat sink 45AK40 can be released to the outside of the substrate case 45AK10. Thereby, the heat generated from the electronic component 45AK60 can be efficiently radiated.

  Further, when the substrate 45AK50 is not installed in the rear case 45AK30, the support portion 45AK35 is flush with the base plate 45AK30a of the rear case 45AK30 except for the protruding portion 45AK35a. On the other hand, when the substrate 45AK50 is installed in the rear case 45AK30, the support portion 45AK35 bends backward and causes a deviation from the base plate 45AK30a. In this way, heat can be easily released from the gap t due to the displacement generated between the support portion 45AK35 and the base plate 45AK30a. Thereby, the heat generated from the electronic component 45AK60 can be efficiently radiated.

(Explanation regarding other features)
For example, instead of being provided on a control board such as the main board 11 or the effect control board 12, the wiring pattern for connecting a plurality of electrical components shown in FIG. 17 or the like with a plurality of signal wirings is provided on the control board. , A connection member between substrates connecting a plurality of control boards, a connection member between circuit boards connecting the control board and other electrical components, a connection member between circuits connecting a plurality of electrical components, etc. You may provide in the some connection member which combined a part or all of these connection members. A part or all of the connecting member may be configured as a rigid printed wiring board, or a part or all of the connecting member may be configured as a flexible printed wiring board. In such a connection member, a parallel wiring portion in which a plurality of signal wirings have a first shape that is parallel or substantially parallel, and at least one signal wiring among the plurality of signal wirings has a second shape that is not parallel to other signal wirings. A wiring pattern may be formed so as to include the specific wiring portion. In addition, the wiring pattern may be formed so that the wiring lengths of the signal wirings included in the plurality of signal wirings are the same or substantially the same. Thereby, the increase in the area in the connection member which arrange | positions the pattern of wiring is suppressed, and size reduction of a structure can be achieved.

  The connection member may have a shape including a bent portion, such as an L shape, or may be a linear shape not including the bent portion. When the connecting member has a shape including a bent portion, the bent portion may have a square shape having a predetermined angle or an arc shape having a predetermined curvature. The wiring pattern may be formed on both surfaces of the connection member, or may be formed on one surface of the connection member. When the connecting member is configured as a multilayer printed wiring board, the wiring pattern may be formed on the surface layer of the connecting member or may be formed on the inner layer of the connecting member. When such a connection member is used, an increase in the area of the connection member for arranging the wiring pattern is suppressed by forming the plurality of signal wires so as to include the parallel wiring portion and the specific wiring portion. The size of the configuration can be reduced.

  When the connecting member is configured to include a flexible flex portion such as a flex-rigid wiring board and an inflexible rigid portion, for example, the connecting member is connected to the signal wiring at a rigid portion different from the flex portion. A circuit component configured as described above may be provided. Thereby, it is possible to prevent the circuit components from falling off. Further, an increase in the area of the connection member for arranging the wiring pattern is suppressed, and the configuration can be downsized.

  When the connecting member is configured to include a flexible flex portion such as a flexible printed wiring board or a flex-rigid wiring board, for example, between the surface as one surface and the back surface as the other surface, A through-hole such as a through hole or a via that can electrically connect the signal wiring may be provided. In this case, the flex portion may not be provided with a through portion. Or you may make it a penetration part not be provided in the bending part bent at the time of a connection also in a flex part. Thereby, the possibility that the signal wiring is disconnected can be reduced. Further, an increase in the area of the connection member for arranging the wiring pattern is suppressed, and the configuration can be downsized.

  The wiring pattern for electrically connecting the first component and the second component by a plurality of signal wirings is such that when the first component is connected to the first component, the plurality of signal wirings are connected at the first wiring interval. May be formed such that a plurality of signal wirings are connected at a second wiring interval different from the first wiring interval. Such a wiring pattern may be formed such that a plurality of signal wirings include an interval adjusting unit that adjusts the first wiring interval and the second wiring interval. In addition, the wiring pattern may be formed so that the wiring lengths of the signal wirings included in the plurality of signal wirings are the same or substantially the same. Thereby, a wiring space | interval can be adjusted and several components can be connected appropriately. Further, an increase in the area of the connection member for arranging the wiring pattern is suppressed, and the configuration can be downsized.

  Both the first component and the second component may be wiring connection components such as receptacles and connectors, or both may be electrical components such as a processor and a memory, or one is a wiring connection component and the other is an electrical component. It may be a part. Thereby, when various components are connected, the wiring interval can be adjusted, and a plurality of components can be appropriately connected. Further, an increase in the area of the connection member for arranging the wiring pattern is suppressed, and the configuration can be downsized.

(Explanation on deformation and application)
The present invention is not limited to the above embodiments, and various modifications and applications are possible. For example, the pachinko gaming machine 1 does not have to include all the technical features shown in the above embodiment, and the part described in the above embodiment so as to solve at least one problem in the prior art. It may be provided with the following structure. For example, any of the features described in the above embodiment may be provided as long as it has at least one feature that enables an appropriate substrate configuration. In addition, even if the configuration is not described in the above embodiment, at least one problem included in the same or similar problem as in the case of including the configuration described in the above embodiment is solved, or the above embodiment If it is possible to achieve at least one object or function included in the same or similar object or effect as in the case of having the structure described in (5), together with the structure described in the above embodiment, or in the above embodiment, It may replace with the structure demonstrated and may be provided.

  In the above embodiment, at least one signal wiring among the plurality of signal wirings that electrically connect the plurality of electrical components has a shape different from the linear shape and the substantially linear shape, and is parallel to the other signal wirings. As a shape different from the substantially parallel shape, it has been described as including a portion called a meander shape, meander shape, zigzag shape, or folded shape. On the other hand, a shape different from a linear shape and a substantially linear shape, or a shape different from a shape parallel to and substantially parallel to other signal wirings is different from a meandering shape such as a curved shape or a spiral shape. Any shape that can be extended or adjusted can be used. The at least one signal wiring among the plurality of signal wirings that electrically connect the plurality of electrical components includes a portion having a shape that can extend the wiring length, so that each signal wiring included in the plurality of signal wirings It is only necessary that the wiring lengths are the same or substantially the same, and that a delay time difference between signals transmitted through a plurality of signal wirings can be prevented or suppressed.

  The plurality of electrical components electrically connected by the plurality of signal wirings are not limited to the RAM 102 and the CPU 103 mounted on the main board 11, and may be any electrical components provided in a gaming machine such as the pachinko gaming machine 1. . For example, as a plurality of electrical components, the effect control CPU 120 and the RAM 122 mounted on the effect control board 12 are electrically connected by a plurality of signal wires, and at least one of the plurality of signal wires has a linear shape and The wiring pattern may be formed so as to have a shape different from the substantially linear shape and different from the shape parallel to and substantially parallel to the other signal wires. In this case, the effect control CPU 120 is an electrical component configured to be able to execute a predetermined process regarding the effect control in the pachinko gaming machine 1, and the RAM 122 can store information related to the execution of the process by the effect control CPU 120. It is the electric component comprised in the. Alternatively, an electrical component capable of storing information related to execution of processing by the CPU 103, such as the ROM 101, instead of the RAM 102 in the above embodiment may be used. Alternatively, it may be an electrical component capable of executing processing related to effects different from the effect control CPU 120, such as a graphics processor provided in the display control unit 123 instead of the effect control CPU 120. Furthermore, it may be an electrical component that can store information related to the execution of processing by the CPU 120 for effect control, such as the ROM 121 instead of the RAM 122. In addition, instead of the RAM 122, an electrical component that can store information related to execution of processing by the graphics processor of the effect control CPU 120 or the display control unit 123, such as an image data memory, may be used.

  The effect control board 12 may be configured as a multilayer wiring board, similarly to the main board 11 in the above embodiment. The plurality of signal wirings in the above embodiment are electrically connected to a plurality of processing devices such as a graphics processor included in the presentation control CPU 120 and the display control unit 123 mounted on the presentation control board 12, for example. A wiring pattern may be formed. Alternatively, the plurality of signal wirings are formed with wiring patterns so that a plurality of electrical components such as a graphics processor included in the display control unit 123 and an input / output port for video signals are electrically connected. It may be. In such a plurality of signal wirings to which a plurality of electrical components are connected, a wiring pattern is formed such that an arbitrary electrical circuit different from the plurality of electrical components such as a filter circuit and a buffer circuit is interposed. It may be a thing. With a plurality of signal wirings, for example, digital video signals indicating respective levels (RGB values) for the display colors of R (red), G (green), and B (blue) in the image display device 5 are transmitted in a parallel signal system. May be. Alternatively, in a plurality of signal wirings, signals relating to game control and effect control may be transmitted in a parallel signal system such as an LVDS (Low Voltage Differential Signal) system, for example. These parallel signal systems may require synchronized signal transmission in a plurality of signal wirings. Therefore, as in the above-described embodiment, the wiring length of each signal wiring included in the plurality of signal wirings is the same or substantially the same by forming the wiring pattern so that a portion having a meandering shape or the like is provided. The delay time difference between signals transmitted through a plurality of signal wirings can be reduced.

  In addition, it is not limited to the signal transmitted by a parallel signal system, For example, for image signals, such as a video signal supplied to the image display apparatus 5, speakers 8L and 8R, game effect lamp 9, effect motor 60, and effect LED 61 When the control signal supplied to the electrical component is transmitted by the serial signal system, the signal wiring for transmitting the clock signal and the signal wiring for transmitting the data signal are a plurality of the signal wirings in the above embodiment. It may be included in the signal wiring. Further, when video signals and control signals are transmitted by the serial signal system, signal wirings for transmitting signals by the differential signal transmission system may be included in the plurality of signal wirings in the above embodiment.

  For example, the signal wiring in which the distance between the connection terminals in the plurality of electrical components is longer than the other signal wirings, such as the signal wiring formed by the wiring pattern 30AK10D, is a shape different from the linear shape and the substantially linear shape, The wiring pattern may be formed so as to include a portion having a shape different from the shape parallel to and substantially parallel to the other signal wirings. Even if the distance between the connection terminals in the plurality of electrical components is shorter than the other signal wiring, the wiring length may be longer than the other signal wiring depending on the design of the wiring pattern on the substrate. In such a case, the selection of a signal wiring that includes a portion having a shape such as a meandering shape among a plurality of signal wirings and a signal wiring that does not include such a portion is a matter of design of the wiring pattern on the substrate. It may be arbitrarily changed depending on the case.

  A plurality of signal wirings constituted by wiring patterns are not limited to those having the same or substantially the same wiring length, but are formed in combination with an arbitrary configuration capable of adjusting a delay time difference (skew). It may be. For example, among a plurality of signal wirings, the relative permittivity of a dielectric disposed corresponding to one signal wiring is different from the relative permittivity of an insulator disposed corresponding to another signal wiring. By changing the signal propagation speed, the delay time difference (skew) in each signal wiring can be adjusted to be adjusted, and at least one signal wiring has a linear shape and a substantially linear first shape. May include a second shape portion having a different second shape.

  In the above embodiment, as shown in FIG. 37, the electronic components arranged with the sides inclined in the vertical and horizontal directions are the heat-generating electronic component 45AK60 and the electronic component 45AK62 provided around the electronic component 45AK60. . However, only the heat-generating electronic component 45AK60 may be inclined and other electronic components may not be inclined. Moreover, it is good also as the arrangement | positioning which inclines all the electronic components 45AK60.

  Further, the inclination angle of the heat sink with respect to the exothermic square electronic component is not limited to 45 °. That is, the degree of the inclination angle is not particularly limited as long as it is a heat sink arrangement that can sufficiently ensure a range in contact with the electronic component in the fin arrangement direction.

  Further, the shape of the heat-generating electronic component does not have to be substantially square, and may be rectangular. Even when a rectangular electronic component is adopted, heat generated from the electronic component can be obtained by arranging the heat sink so that the direction in which the fins are arranged matches the direction in which the diagonal line of the electronic component extends. The heat dissipation effect can be enhanced.

  Moreover, the heat conductive sheet affixed on the exothermic electronic component should just be provided in the range sufficient to conduct the heat emitted from the electronic component. For example, it may be provided in a range that covers the entire electronic component, or may be provided only in a range that generates heat (only a partial range of the electronic component). In addition, even if it is a case where a heat conductive sheet is provided when covering the whole electronic component, it is preferable to set it as the magnitude | size which does not contact the wiring of a board | substrate.

(About other Embodiment 1)
FIG. 38 is a cross-sectional view illustrating a state in which a heat sink and a substrate are attached to the substrate case of the gaming machine according to the other embodiment 1. Note that in the following description regarding other forms, the description will focus on differences from the above forms. In addition, about the member same as the said form, the same code | symbol shall be attached | subjected and the description is abbreviate | omitted. As shown in FIG. 38, the rear case 45AK130 is provided with a spring 45AK135 that abuts and supports the fins 45AK42 of the heat sink 45AK40 instead of the support portion 45AK35 shown in FIG. The spring 45AK135 is a compression coil spring, but a plate spring such as a spring washer may be employed. The rear case 45AK130 is formed with a plurality of air holes 45AK138 for releasing the heat of the heat sink 45AK40 to the outside. Note that the method of attaching the heat sink 45AK40 and the rear case 45AK130 of the substrate 45AK50 is the same as in the above embodiment. That is, the heat sink 45AK40 is placed in accordance with the positioning portion 45AK134. At this time, the fins 45AK42 are placed on the springs 45AK135. Subsequently, the substrate 45AK50 having the heat conductive sheet 45AK70 attached to the electronic component 45AK60 is aligned by being inserted into the insertion protrusion 45AK136, and placed on the heat sink 45AK40. Subsequently, the screw 45AK81e is inserted into the substrate 45AK50 and fastened to the screw hole 45AK37e. Thereby, the spring 45AK135 is pressed by the fins 45AK42 and contracts, and presses the fins 45AK42 toward the substrate 45AK50. Thereby, heat conductive sheet 45AK70 can be stuck to heat sink 45AK40 and electronic component 45AK60.

(About other embodiment 2)
FIG. 39 is a cross-sectional view showing how the heat sink and the board are attached to the board case of the gaming machine according to another embodiment 2. As shown in FIG. 39, unlike the above embodiment, the rear case 45AK230 is not provided with a member that supports the fins 45AK242, such as the support portion 45AK35 (FIG. 33) and the spring 45AK135 (FIG. 38). The rear case 45AK230 has a plurality of air holes 45AK238 for releasing the heat of the heat sink 45AK240 to the outside.

  The board 45AK250 is formed with a screw insertion hole 45AK252 through which the screw 45AK251 is passed. The heat sink 45AK240 is formed with a screw hole 45AK243 for fastening the screw 45AK251. The heat sink 45AK240 and the substrate 45AK250 can be integrated by inserting the screw 45AK251 into the screw insertion hole 45AK252 formed in the substrate 45AK250 and tightening the screw 45AK251 into the screw hole 45AK243 formed in the heat sink 45AK240. At this time, the heat sink 45AK240 is drawn toward the substrate 45AK250 by sufficiently tightening the screw 45AK251. Thereby, heat conductive sheet 45AK270 can be stuck to heat sink 45AK240 and electronic component 45AK260.

  Receptacle KRE1 is not limited to the one that is surface-mounted on the board of effect control board 12, and may be any one that is surface-mounted on an arbitrary board such as the board of main board 11. The various power supply voltages are not limited to those supplied to the effect control board 12, but may be supplied to any control board such as the main board 11 or the payout control board. Various electric circuits and electrical components are not limited to those arranged on the effect control board 12, and may be arranged on an arbitrary control board such as the main board 11 or the payout control board.

  The present invention can be applied not only to the pachinko gaming machine 1 but also to a slot machine or the like. The slot machine is an arbitrary gaming machine that performs a predetermined game such as variable display of symbols that are a plurality of types of identification information, and that can give a predetermined game value based on the game result, more specifically, The game can be started by setting a predetermined number of bets (the number of medals or the number of credits) for one game, and a variable display device that variably displays a plurality of types of identification information (designs) that can be individually identified The display result of a plurality of reels, for example, is derived and displayed, and one game is completed, and a prize is awarded according to the display result (for example, cherry prize, watermelon prize, bell prize, replay prize, BB prize, RB prize, etc.) Is a gaming machine that can be generated. In such a slot machine, the hardware resources including a game control microcomputer for performing game control and software for performing a predetermined process cooperate with each other so that the pachinko game described in the above embodiment is performed. What is necessary is just to be comprised so that all or one part of the characteristics which the machine 1 has may be provided.

  In addition, the device configuration and various operations of the gaming machine can be arbitrarily changed and modified without departing from the spirit of the present invention. In addition, the gaming machine of the present invention is not limited to a payout type gaming machine that pays out a predetermined number of gaming media as prizes based on the occurrence of winnings, and is scored based on the occurrence of winnings by enclosing gaming media It can also be applied to an enclosed game machine that gives Slot machines are not limited to those where bets are set using medals and credits as gaming values, but only slot machines that set betting numbers using gaming balls as gaming values, or only credits as gaming values. It may be a full credit type slot machine that sets the number of bets using.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

(Explanation on problem solving means and effects)
As described above, in the gaming machine such as the pachinko gaming machine 1 according to the present application, in the wiring connection device such as the receptacle KRE1, the terminal TA01 serving as a pair of ground terminals at a position sandwiching both sides of the terminal TA02 serving as the signal terminal. Since TA03 is surface-mounted on the substrate of the effect control substrate 12, an appropriate substrate configuration becomes possible.

  The terminals TA01 and TA03 are joined to the dummy pads DP1 and DP2, and the tip portions of the terminals TA01 to TA03 are covered with the cover member 802 of the substrate case 800, thereby enabling an appropriate substrate configuration.

  The receptacle KRE1 is provided with fixing metal fittings SS01 and SS02 to be bonded to the dummy pads DP3 and DP4 on the side surface PL2 side, thereby enabling an appropriate substrate configuration.

  In the opening region 836a, the distance between the inner peripheral wall surface 836b and the receptacle KRE1 is formed such that the opening width W2 on the side closer to the component housing portion 802a is wider than the opening width W1 on the far side, thereby enabling an appropriate substrate configuration. Become.

  Terminals TA01 to TA03 of receptacle KRE1 are each formed with an exposed portion that is not covered and exposed by cover member 802 of substrate case 800 and a covered portion that is covered and not exposed by cover member 802 of substrate case 800 in opening region 836a. Thus, an appropriate substrate configuration is possible.

  The mounting position where the terminals TA01 to TA03 of the receptacle KRE1 are surface-mounted is covered by the opening peripheral edge 840, and the opening peripheral edge 840 and the board surface of the effect control board 12 form a space SP1 close to the mounting position. Appropriate substrate configuration is possible.

  Alternatively, the direct current 34 V power supply voltage VSL2 is output as it is as the power supply voltage VSL on the effect control board 12 and is input to the filter circuit 511 by the driver board 19 to stabilize the voltage, thereby enabling an appropriate board configuration. .

  Since the filter circuit is not interposed in the power supply line LSL that supplies the DC 34V power supply voltage VSL, an appropriate substrate configuration becomes possible.

  In the receptacle KRE2, the number of terminals TA15 to TA24, TA27, and TA28 connected to any of the filter circuits 131a to 131c is larger than the number of terminals TA13 and TA14 that are not connected to the filter circuit. Substrate configuration is possible.

  The terminals TA15 to TA24, TA27, and TA28 connected to any one of the filter circuits 131a to 131c can supply a plurality of types of power supply voltages. In the effect control board 12, the terminals TA13 and TA14 that are not connected to the filter circuit are one type. A power supply voltage can be supplied, and the terminals TA13 and TA14 are arranged outside the terminals TA15 to TA24 and the like, thereby enabling an appropriate substrate configuration.

  The power supply voltage terminals TA13 to TA24, TA27, TA28 are arranged between the terminals TA11, TA12, which are ground terminals, and the terminals TA29, TA30, which are ground terminals, so that an appropriate substrate configuration is possible. become.

  In the receptacle KRE2, terminals TA13 and TA14 included in the second power supply voltage terminal, terminals TA15 to TA24 included in the first power supply voltage terminal, terminals TA11 and TA12 included in the first ground terminal, and a second ground terminal The terminals TA27 and TA28 included in the first power supply voltage terminal are arranged between the terminals TA25 and TA26 included in the second ground terminal and the terminal TA29 included in the third ground terminal. , By being arranged between TA30, an appropriate substrate configuration becomes possible.

  Alternatively, after branching the one power supply voltage VDD2 into the power supply voltage VDL for driving a specific electric component and the power supply voltage VDS for supplying to the amplifier circuit 521 on the effect control board 12, the filter circuit 131a is By supplying the stabilized power supply voltage VDS to the amplifier circuit 521, an appropriate substrate configuration can be realized.

  By making the wiring length LL2 from the filter circuit 131a to the amplifier circuit 521 shorter than the wiring length LL1 from when the power supply voltage VDL is branched at the branch point DB1 to when it is input to the filter circuit 131a, an appropriate substrate configuration can be obtained. It becomes possible.

  Alternatively, in the noise prevention circuits 135a and 135b, an appropriate substrate configuration can be achieved by using resistors that are circuit elements different from the noise prevention circuit 135c.

  The noise prevention circuits 135a and 135b are provided corresponding to the power supply voltage for driving specific electric components such as motors and LEDs, and the noise prevention circuit 135c is used for the power supply voltage for driving specific electric circuits such as CPU and ROM. Providing correspondingly enables an appropriate substrate configuration.

  Alternatively, the step-down converter circuit 132 receives the power supply voltage VDD3 stabilized by the filter circuit 131c, and outputs a power supply voltage of DC 1.05V and a power supply voltage of DC 3.3V, and the regulator circuit 133 By inputting a power supply voltage of 3.3 V and outputting a power supply voltage of DC 1.5 V, an appropriate substrate configuration can be realized.

  The power supply voltage VDC that is the same as or substantially the same as the voltage supplied to the step-down converter circuit 132 is supplied to the power supply monitoring circuit 140, thereby enabling an appropriate substrate configuration.

  The power supply voltage of 1.05V DC output from the step-down converter circuit 132 is supplied to a specific microprocessor such as a graphics processor of the display control unit 123, for example, so that an appropriate substrate configuration can be realized.

  The DC 3.3V power supply voltage output from the step-down converter circuit 132 is supplied to the ROM 121, for example, and is started before the electrical components such as the RAM 122 driven by the DC 1.5V power supply voltage output from the regulator circuit 133. By being possible, an appropriate substrate configuration is possible.

  The power supply voltage of 1.5V DC output from the regulator circuit 133 is supplied to a circuit configured as a board different from the effect control board 12, such as the RAM 122, for example, so that an appropriate board configuration is possible.

(Explanation regarding problem solving means and effects of feature 30AK)
For example, a pachinko gaming machine 1 or other gaming machine capable of playing a game, for example, as shown in FIG. 17, a pattern constituting a plurality of signal wirings is formed, and a plurality of signal wirings such as a RAM 102 and a CPU 103 are used. A pattern includes a substrate such as a main substrate 11 to which components are connected, and a pattern includes a plurality of signal lines such as a region 30AK10R and a plurality of signal lines such as a region 30AK11R and a parallel wiring portion having a first shape in which a plurality of signal wires are parallel or substantially parallel. At least one of the wirings includes a specific wiring portion having a second shape that is not parallel to the other signal wirings, and the wiring lengths of the signal wirings included in the plurality of signal wirings are the same or substantially the same. Become. As a result, an appropriate substrate configuration that reduces the delay time difference between signals transmitted through a plurality of signal wirings becomes possible.

  For example, the signal wiring that does not include the second shape, such as the signal wiring formed by the wiring pattern 30AK10D, has a distance between the connection terminals in the plurality of electrical components such as the signal wiring formed by the wiring patterns 30AK11D to 30AK13D. It may be longer than the signal wiring including the shape. As a result, an increase in the area of the substrate on which the wiring pattern is arranged is suppressed, and an appropriate substrate configuration can be realized in order to reduce the size of the substrate.

  For example, a conductor may not be provided in a predetermined area close to the signal wiring having the second shape, such as the space area 30AK0SP. As a result, an appropriate substrate configuration is possible in which electromagnetic interference due to electromagnetic noise in a plurality of signal wirings is prevented or suppressed.

  The substrate is provided with through holes such as through holes 30AK1H and 30AK2H that can electrically connect the signal wiring provided on one surface of the substrate and the signal wiring provided on the other surface of the substrate. The wiring length of each signal wiring included in the signal wiring may be the same or substantially the same including the length of the through-hole for the signal wiring connected by the through-hole. As a result, an appropriate substrate configuration that reduces the delay time difference between signals transmitted through a plurality of signal wirings becomes possible.

  The substrate includes a plurality of layers such as a surface layer 30AK1S, a ground layer 30AK1L, a power supply layer 30AK2L, a wiring layer 30AK3L, a power supply layer 30AK4L, and a back layer 30AK2S, and a signal wiring having a second shape among the plurality of layers is provided. In the conductor layer such as the ground layer 30AK1L adjacent to the layer, signal transmission may not be performed. As a result, an appropriate substrate configuration is possible in which electromagnetic interference due to electromagnetic noise in a plurality of signal wirings is prevented or suppressed.

  As a plurality of electrical components, for example, a processing unit that can execute a predetermined process such as the CPU 103 and a storage unit that can store information related to the execution of the process such as the RAM 102 may be connected. As a result, it is possible to realize an appropriate board configuration that reduces the delay time difference between signals transmitted through a plurality of signal wirings connected to a processing unit and a storage unit as a plurality of electrical components.

  Alternatively, for example, a pachinko gaming machine 1 or other gaming machine capable of playing a game, for example, as shown in FIG. 17, a pattern constituting a plurality of signal wirings is formed, and a plurality of signal wirings such as a RAM 102 and a CPU 103 are formed. The circuit board includes a substrate such as the main substrate 11 to which the electrical components are connected, and a pattern includes a plurality of parallel wiring portions having a first shape in which a plurality of signal wirings are parallel or substantially parallel, such as the region 30AK10R, and a plurality of patterns such as the region 30AK11R. The signal wiring may include a specific wiring portion having a second shape different from the first shape, and the wiring lengths of the signal wirings included in the plurality of signal wirings may be the same or substantially the same. As a result, an appropriate substrate configuration that reduces the delay time difference between signals transmitted through a plurality of signal wirings becomes possible.

  Alternatively, for example, a pachinko gaming machine 1 or other gaming machine capable of playing a game, for example, as shown in FIG. 17, a pattern constituting a plurality of signal wirings is formed, and a plurality of signal wirings such as a RAM 102 and a CPU 103 are formed. The main substrate 11 and the like to which the electrical components are connected, and the pattern is a first shape in which at least one of the plurality of signal wirings includes a linear shape or a substantially linear shape, such as a wiring pattern 30AK10D, for example. And a second pattern in which other signal wirings that are not included in the first pattern, such as wiring patterns 30AK11D to 30AK13D, have a second shape different from the first shape. The first pattern and the second pattern have the same or substantially the same wiring length of each signal wiring included in the plurality of signal wirings. It may be made. As a result, an appropriate substrate configuration that reduces the delay time difference between signals transmitted through a plurality of signal wirings becomes possible.

  Alternatively, for example, a pachinko gaming machine 1 or other gaming machine capable of playing a game, for example, as shown in FIG. 17, a pattern constituting a plurality of signal wirings is formed, and a plurality of signal wirings such as a RAM 102 and a CPU 103 are formed. The circuit board includes a substrate such as the main substrate 11 to which the electrical components are connected, and the pattern includes a wiring that connects at least one signal wiring among the plurality of signal wirings to a predetermined section such as the section 30AK0SC at the shortest or substantially shortest distance. A pattern 30AK12D, 30AK13D, or the like of wiring that connects a first pattern such as the patterns 30AK10D, 30AK11D, and other signal wirings that are not included in the first pattern among a plurality of signal wirings at a distance longer than the first pattern, etc. The first pattern and the second pattern are included in the plurality of signal wirings. The wiring length of the signal lines may be made the same or substantially the same. As a result, an appropriate substrate configuration that reduces the delay time difference between signals transmitted through a plurality of signal wirings becomes possible.

  In the first pattern, the distance between the connection terminals in the plurality of electrical components may be longer than the second pattern. As a result, an increase in the area of the substrate on which the wiring pattern is arranged is suppressed, and an appropriate substrate configuration can be realized in order to reduce the size of the substrate.

  For example, a conductor may not be provided in a predetermined area close to the second pattern, such as the space area 30AK0SP. As a result, an appropriate substrate configuration is possible in which electromagnetic interference due to electromagnetic noise in a plurality of signal wirings is prevented or suppressed.

  The substrate includes, for example, a plurality of layers such as a surface layer 30AK1S, a ground layer 30AK1L, a power supply layer 30AK2L, a wiring layer 30AK3L, a power supply layer 30AK4L, and a back layer 30AK2S, and a signal wiring included in the second pattern among the plurality of layers is provided. Signal transmission may not be performed in a conductor layer such as the ground layer 30AK1L adjacent to the layer. As a result, an appropriate substrate configuration is possible in which electromagnetic interference due to electromagnetic noise in a plurality of signal wirings is prevented or suppressed.

(Explanation regarding problem solving means and effects of characteristic portion 42AK)
For example, a pachinko gaming machine 1 or other gaming machine capable of playing a game, for example, as shown in FIG. 25A, as a pattern constituting a plurality of signal wirings, for example, a first wiring pattern 42AK10 and a second wiring pattern A first pattern such as the pattern 42AK11 and a second pattern are formed, and a substrate such as the main substrate 11 to which a plurality of electrical components such as the RAM 102 and the CPU 103 are connected by a plurality of signal wirings is provided. The signal wiring constituted by one of the patterns corresponds to the first shape part that is a straight or substantially straight first shape, such as the first shape part 42AK10L, for example, and the other of the first pattern and the second pattern The signal wiring configured by the pattern of the second shape having a second shape different from the first shape, such as the second shape portion 42AK11M, for example. In correspondence with the first shape portion in the signal wiring constituted by the other pattern such as the first shape portion 42AK11L, the signal wiring constituted by one pattern such as the second shape portion 42AK10M is included. A second shape part is included. As a result, an increase in the area of the substrate on which the wiring pattern is arranged is suppressed, and an appropriate substrate configuration can be realized in order to reduce the size of the substrate.

  The first pattern and the second pattern may be formed so that the wiring length of each signal wiring is the same or substantially the same. As a result, an appropriate substrate configuration that reduces the delay time difference between signals transmitted through a plurality of signal wirings becomes possible.

  For example, as shown in FIG. 26, the second shape portion may be formed in different directions between the signal wiring constituted by the first pattern and the signal wiring constituted by the second pattern. Thereby, the pattern design of the wiring on the substrate surface can be easily and flexibly performed, the increase in the substrate area on which the wiring pattern is arranged is suppressed, and the substrate can be miniaturized.

  For example, as shown in FIG. 27, the second shape portion may be formed with different wiring widths for the signal wiring configured by the first pattern and the signal wiring configured by the second pattern. Thereby, the characteristic impedance in each signal wiring can be easily adjusted, and appropriate transmission according to the type of the electric signal or the like becomes possible.

  For example, as shown in FIG. 28A, the second shape portion is a parallel wiring portion in which the signal wiring constituted by the first pattern and the signal wiring constituted by the second pattern are formed in parallel or substantially in parallel. May be included. Thereby, the pattern design of the wiring on the substrate surface can be easily and flexibly performed, the increase in the substrate area on which the wiring pattern is arranged is suppressed, and the substrate can be miniaturized.

  For example, as shown in FIGS. 29A and 29B, the second shape portion of the signal wiring constituted by the first pattern or the second pattern is connected to the signal wiring constituted by another pattern. A circuit component such as the circuit component 42AK1R mounted in such a manner may be provided. As a result, transmission characteristics and the like in the signal wiring can be appropriately adjusted, an increase in the board area on which the wiring pattern is arranged is suppressed, and the board can be downsized.

  For example, as shown in FIG. 29 (A), it is mounted so as to be connected to a wiring part such as the first shape part 42AK52L different from the second shape part in the signal wiring constituted by the first pattern or the second pattern. A circuit component such as the circuit component 42AK2R may be provided. As a result, transmission characteristics and the like in the signal wiring can be appropriately adjusted, an increase in the board area on which the wiring pattern is arranged is suppressed, and the board can be downsized.

(Explanation regarding problem solving means and effects of characteristic portion 43AK)
For example, a pachinko gaming machine 1 or other gaming machine capable of playing a game, such as a first pattern 43AK10 for wiring and a second pattern 43AK11 for wiring as patterns constituting a plurality of signal wirings, for example, as shown in FIG. The first pattern and the second pattern are formed, and a substrate such as the main substrate 11 to which a plurality of electrical components such as the RAM 102 and the CPU 103 are connected by a plurality of signal wirings, and one of the first pattern and the second pattern is provided. Corresponding to the first shape portion that is a straight or substantially straight first shape, such as the first shape portions 43AK10L and 43AK11L, for example, the other of the first pattern and the second pattern. The signal wiring configured by the pattern is, for example, the first shape such as the second shape portion 43AK10M and 43AK11M. It includes a second profiles made different from the second shape, for example, test points 43AK10P, etc. 43AK11P, certain conductor portions for connection confirmation to the second shaped portion is provided. As a result, the wiring pattern can be appropriately arranged, various structures can be appropriately arranged, an increase in the board area can be suppressed, and the board can be downsized.

  The specific conductor portion is formed using, for example, a metal material such as solder or copper foil. For example, the signal wiring configured by the first pattern or the second pattern such as the wiring width W5 <diameter W6 shown in FIG. It may be formed so as to be wider than the wiring width. As a result, the electrical characteristics of the signal wiring can be easily inspected, the wiring pattern is properly arranged, and various structures are appropriately arranged to suppress an increase in the board area, thereby reducing the size of the board. Can be achieved.

  The substrate includes a plurality of layers such as a surface layer 44AK1S, a ground layer 44AK1L, a power supply layer 44AK2L, a wiring layer 44AK3L, a power supply layer 44AK4L, and a back surface layer 44AK2S shown in FIG. You may connect with the conductor layer different from the layer in which a conductor part is provided, for example, through-holes, such as through-hole 44AK1H and 44AK2H. As a result, it is possible to easily inspect the electrical characteristics of the signal wiring and the conductor layer, appropriately arrange the wiring pattern, and appropriately arrange various structures, thereby suppressing an increase in the board area. Can be miniaturized.

(Explanation regarding problem solving means and effects of feature 44AK)
For example, a pachinko gaming machine 1 or other gaming machine capable of playing a game, such as a first pattern 43AK10 for wiring and a second pattern 43AK11 for wiring as patterns constituting a plurality of signal wirings, for example, as shown in FIG. The first pattern and the second pattern are formed, and a substrate such as the main substrate 11 to which a plurality of electrical components such as the RAM 102 and the CPU 103 are connected by a plurality of signal wirings, and one of the first pattern and the second pattern is provided. Corresponding to the first shape portion that is a straight or substantially straight first shape, such as the first shape portions 43AK10L and 43AK11L, for example, the other of the first pattern and the second pattern. The signal wiring configured by the pattern is, for example, the first shape such as the second shape portion 43AK10M and 43AK11M. A signal including a second shape portion having a different second shape and including a second shape portion such as a signal wiring constituted by, for example, wiring patterns 44AK10P and 44AK11P on one surface of the substrate such as the surface layer 44AK1S shown in FIG. Wiring is provided, and a specific conductor portion for connection confirmation such as a test point 44AK11TP is provided on the other surface of the substrate such as the back layer 44AK2S. As a result, it is possible to easily inspect the electrical characteristics of the signal wiring and the conductor layer, appropriately arrange the wiring pattern, and appropriately arrange various structures, thereby suppressing an increase in the board area. Can be miniaturized.

(Explanation regarding problem solving means and effects of characteristic portion 45AK)
As shown in FIG. 36, when viewed in plan, the rectangular electronic component 45AK60 is arranged such that the sides 45AK60a to 45AK60d are not parallel to the sides 45AK40a to 45AK40d of the rectangular heat sink. Thereby, the heat dissipation effect of the heat generated from the electronic component 45AK60 can be enhanced.

  By rotating the electronic component 45AK61 having each side parallel to the sides 45AK40a to 45AK40d of the heat sink by a predetermined angle θ about the center point O, the electronic component 45AK60 can be arranged. The predetermined angle θ is approximately 45 °, for example. Thereby, the heat dissipation effect of the heat generated from the electronic component 45AK60 can be enhanced.

  The heat sink 45AK40 is arranged so that the fins 45AK42 arranged in parallel in the left-right direction face the up-down direction. Thereby, the air moving from the lower side to the upper side can be passed between the fins 45AK42 along the vertical direction, and the heat generated from the electronic component 45AK60 without hindering the flow of the air moving upward. The heat dissipation effect can be enhanced.

  The heat conductive sheet 45AK70 interposed between the electronic component 45AK60 and the heat sink 45AK40 is a flexible heat conductive sheet that adheres to both surfaces. Thereby, the heat generated from the electronic component 45AK60 can be smoothly transferred to the heat sink 45AK40 via the heat conductive sheet 45AK70, and the heat radiation effect of the heat generated from the electronic component 45AK60 can be enhanced.

  The rear case 45AK30 is provided with a support portion 45AK35 that presses the heat sink 45AK40 against the heat-generating electronic component 45AK60. Thereby, the heat generated from the electronic component 45AK60 can be smoothly transferred to the heat sink 45AK40 via the heat conductive sheet 45AK70, and the heat radiation effect of the heat generated from the electronic component 45AK60 can be enhanced.

DESCRIPTION OF SYMBOLS 1 ... Pachinko machine 11 ... Main board 12 ... Production control board 13 ... Audio control board 19 ... Driver board 120 ... Production control CPU
121… ROM
122 ... RAM
123 ... Display control units 131a to 131c, 511 ... Filter circuit 132 ... Step-down converter circuit 133 ... Regulator circuit 140 ... Power supply monitoring circuit 521 ... Amplifier circuit 800 ... Substrate case 802 ... Cover members KRE1-KRE4 ... Receptacles 30AK10G, 30AK11G, 30AK20G ... Ground conductors 30AK01R, 30AK10R, 30AK11R, 30AK12R,
30AK20R ... Area 30AK0SC ... Sections 30AK10D to 30AK13D, 30AK10CK, 30AK10CS,
30AK10RS, 30AK10A-30AK14A, 30AK10P,
30AK11P, 30AK20P ... wiring pattern 30AK1S ... surface layer 30AK2S ... back layer 30AK1L ... ground layer 30AK2L, 30AK4L ... power supply layer 30AK3L ... wiring layers 30AK1H, 30AK2H ... through holes 42AK10-42AK13, 42AK20-42AK
42AK30-42AK37, 42AK40-42AK43
42AK50-42AK53, 43AK10, 43AK11,
44AK10P, 44AK11P, 44AK20P ... Wiring patterns 42AK10L-42AK13L, 42AK51L, 42AK52L ... First shape portions 42AK10M-42AK13M, 42AK20M-42AK22M,
42AK23M1, 42AK23M2, 42AK24M, 42AK25M,
42AK26M1, 42AK26M2, 42AK30M to 42AK37M,
42AK51M, 42AK52M ... 2nd shape part 42AK51M1-42AK51M3 ... Folded part 42AK1Z-42AK4Z ... Wiring part 42AK1R, 42AK2R ... Circuit components 43AK10, 43AK11 ... Wiring pattern 43AK10L, 43AK11L ... 1st shape part 43AK10 , 43AK11TP ... Test point 44AK10P, 44AK11P, 44AK20P ... Wiring pattern 44AK1S ... Front layer 44AK2S ... Back layer 44AK1L ... Ground layer 44AK2L, 44AK4L ... Power supply layer 44AK3L ... Wiring layer 44AK1H, 44AK2K ... Board case 45AK20… front 45AK30 ... Rear case 45AK32, 45AK33 ... Air hole 45AK34 ... Positioning portion 45AK35 ... Supporting portion 45AK36 ... Insertion convex portion 45AK37 ... Screw hole 45AK40 ... Heat sink 45AK42 ... Fin 45AK50 ... Substrate 45AK60 ... Electronic component 45AK81a to Heat conduction sheet 45AK81a to 45AK81a … screw

Claims (1)

A gaming machine capable of playing games,
A first pattern and a second pattern constituting a plurality of signal wirings are formed,
Comprising a substrate to which a plurality of electrical components are connected by the plurality of signal wirings;
The signal wiring constituted by one of the first pattern and the second pattern corresponds to the first shape portion that is a straight or substantially straight first shape, and the first pattern and the second pattern The signal wiring constituted by the other pattern includes a second shape portion that is a second shape different from the first shape,
Corresponding to the first shape portion in the signal wiring constituted by the other pattern, the signal wiring constituted by the one pattern includes the second shape portion,
A gaming machine characterized by that.