JP2018537856A - 縦型電界効果トランジスタおよびその製造方法 - Google Patents
縦型電界効果トランジスタおよびその製造方法 Download PDFInfo
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- JP2018537856A JP2018537856A JP2018527893A JP2018527893A JP2018537856A JP 2018537856 A JP2018537856 A JP 2018537856A JP 2018527893 A JP2018527893 A JP 2018527893A JP 2018527893 A JP2018527893 A JP 2018527893A JP 2018537856 A JP2018537856 A JP 2018537856A
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Abstract
【解決手段】縦型電界効果トランジスタを製造する方法であって、第1の陥凹部を基板内に形成することと、第1の陥凹部の第1の下部表面から第1のドレインをエピタキシャル成長させることと、基板内に形成された第2の陥凹部の第2の下部表面から第2のドレインをエピタキシャル成長させることと、第1のドレインおよび第2のドレイン上にチャネル材料をエピタキシャル成長させることと、チャネル材料内にトラフを形成して、第1のドレイン上に1つまたは複数のフィン・チャネルをおよび第2のドレイン上に1つまたは複数のフィン・チャネルを形成することであって、第1のドレインの上方のトラフは第1のドレインの表面まで延在し、第2のドレインの上方のトラフは第2のドレインの表面まで延在する、形成することと、1つまたは複数のフィン・チャネルの各々上にゲート構造を形成することと、第1のドレインおよび第2のドレインと関連付けられるフィン・チャネルの各々上にソースを成長させることとを含む、方法。
【選択図】図42
Description
Claims (20)
- 縦型電界効果トランジスタを製造する方法であって、
第1の下部表面を有する第1の陥凹部を基板内に形成することと、
前記第1の陥凹部の前記第1の下部表面から第1のドレインをエピタキシャル成長させることと、
前記基板内に形成された第2の陥凹部の第2の下部表面から第2のドレインをエピタキシャル成長させることと、
前記第1のドレインおよび前記第2のドレイン上にチャネル材料をエピタキシャル成長させることと、
前記チャネル材料内にトラフを形成して、前記第1のドレイン上に1つまたは複数のフィン・チャネルを、および前記第2のドレイン上に1つまたは複数のフィン・チャネルを形成することであって、前記第1のドレインの上方の前記トラフは、前記第1のドレインの表面まで延在し、前記第2のドレインの上方の前記トラフは、前記第2のドレインの表面まで延在する、前記形成することと、
前記1つまたは複数のフィン・チャネルの各々上にゲート構造を形成することと、
前記第1のドレインおよび前記第2のドレインと関連付けられる前記フィン・チャネルの各々上にソースを成長させることと、
を含む、方法。 - 前記第1のドレインと前記第2のドレインとの間にあるシャロウ・トレンチ・アイソレーション領域を前記基板内に形成することと、前記フィン・チャネルの間の前記トラフの各々内に第1の低誘電率誘電体スペーサを形成することとをさらに含む、請求項1に記載の方法。
- 前記第1のドレインへの第1のドレイン接点を形成することと、第1のゲートへの第1のゲート接点を形成することと、前記第1のドレインと関連付けられる前記フィン・チャネル上の前記ソースの各々への第1のソース接点を形成することとをさらに含む、請求項1に記載の方法。
- 前記第1のドレイン上に1から25個のフィン・チャネルが形成され、前記第2のドレイン上に1から25個のフィン・チャネルが形成される、請求項1に記載の方法。
- 前記フィン・チャネルは、30nmから400nmの範囲内の高さを有し、前記フィン・チャネルは真性シリコンを含む、請求項1に記載の方法。
- 前記第1のドレイン、および、前記第1のドレインと関連付けられる前記フィン・チャネル上の前記ソースは、nドープ材料を含み、前記第2のドレイン、および、前記第2のドレインと関連付けられる前記フィン・チャネル上のソースは、pドープ材料を含む、請求項1に記載の方法。
- 前記ゲート構造は、原子層堆積(ALD)またはプラズマ強化原子層堆積(PE−ALD)により前記フィン・チャネル上に形成される仕事関数金属(WFM)キャップを備える、請求項1に記載の方法。
- 前記WFMキャップの各々は、5nmから15nmの範囲内の厚さまで形成され、前記WFMキャップの各々上の前記ゲートは、2nmから5nmの範囲内の厚さまで形成される、請求項7に記載の方法。
- 縦型電界効果トランジスタを製造する方法であって、
シャロウ・トレンチ・アイソレーション領域を基板内に形成することと、
第1の下部表面を有する第1の陥凹部を基板内に形成することと、
前記第1の陥凹部の前記第1の下部表面から第1のドレインをエピタキシャル成長させることと、
前記基板内に形成された第2の陥凹部の第2の下部表面から第2のドレインをエピタキシャル成長させることであって、前記シャロウ・トレンチ・アイソレーション領域は、前記第1のドレインと前記第2のドレインとの間にある、前記エピタキシャル成長させることと、
前記第1のドレインおよび前記第2のドレイン上にチャネル材料をエピタキシャル成長させることであって、前記チャネル材料は真性シリコンを含む、前記成長させることと、
前記チャネル材料内にトラフを形成して、前記第1のドレイン上に1つまたは複数のフィン・チャネルを、および前記第2のドレイン上に1つまたは複数のフィン・チャネルを形成することであって、前記第1のドレインの上方の前記トラフは、前記第1のドレインの表面まで延在し、前記第2のドレインの上方の前記トラフは、前記第2のドレインの表面まで延在する、前記形成することと、
前記フィン・チャネルの間の前記トラフの各々内に第1の低誘電率誘電体スペーサを形成することと、
前記1つまたは複数のフィン・チャネルの各々上にゲート構造を形成することと、
前記第1のドレインおよび前記第2のドレインと関連付けられる前記フィン・チャネルの各々上にソースを成長させることと、
を含む、方法。 - 前記フィン・チャネルは、30nmから400nmの範囲内の高さを有し、前記フィン・チャネルは真性シリコンを含む、請求項9に記載の方法。
- 前記ゲート構造は、20nmから300nmの範囲内の高さを有する、請求項9に記載の方法。
- 前記1つまたは複数のフィン・チャネルの各々上の、各々のゲート構造は、5nmから15nmの範囲内の厚さまで形成されるWFMキャップと、2nmから5nmの範囲内の厚さまで形成される、前記WFMキャップの各々上のゲートとを備える、請求項9に記載の方法。
- 前記ゲートはタングステンを含む、請求項12に記載の方法。
- 縦型電界効果トランジスタであって、
基板内の第1の陥凹部であって、第1の下部表面を有する前記第1の陥凹部と、
前記第1の陥凹部の前記第1の下部表面上の第1のドレインであって、前記第1の下部表面と同じ結晶方位を有する前記第1のドレインと、
前記基板内の第2の陥凹部であって、第2の下部表面を有する前記第2の陥凹部と、
前記基板内に形成された第2の陥凹部の前記第2の下部表面上の第2のドレインであって、前記第2の下部表面と同じ結晶方位を有する前記第2のドレインと、
前記第1のドレイン上の1つまたは複数のフィン・チャネルであって、前記第1の下部表面と同じ結晶方位を有する前記1つまたは複数のフィン・チャネルと、
前記第2のドレイン上の1つまたは複数のフィン・チャネルであって、前記第2の下部表面と同じ結晶方位を有する前記1つまたは複数のフィン・チャネルと、
前記フィン・チャネルの各々上のゲート構造と、
前記第1のドレインおよび前記第2のドレインと関連付けられる前記フィン・チャネルの各々上のソースであって、前記フィン・チャネルと同じ結晶方位を有する前記ソースと、
を備える、縦型電界効果トランジスタ。 - 前記基板内のシャロウ・トレンチ・アイソレーション領域であって、前記第1のドレインと前記第2のドレインとの間にある前記シャロウ・トレンチ・アイソレーション領域と、前記フィン・チャネルの間のトラフの各々内の第1の低誘電率誘電体スペーサとをさらに備える、請求項14に記載の縦型電界効果トランジスタ。
- 前記第1のドレインと電気的に接触する第1のドレイン接点と、第1のゲートと電気的に接触する第1のゲート接点と、前記第1のドレインと関連付けられる前記フィン・チャネル上の前記ソースの各々と電気的に接触する第1のソース接点とをさらに備える、請求項14に記載の縦型電界効果トランジスタ。
- 1から25個のフィン・チャネルが、前記第1のドレイン上にあり、前記第1のドレインと電気的に接触し、1から25個のフィン・チャネルが、前記第2のドレイン上にあり、前記第2のドレインと電気的に接触する、請求項14に記載の縦型電界効果トランジスタ。
- 前記フィン・チャネルは、30nmから400nmの範囲内の高さを有する、請求項14に記載の縦型電界効果トランジスタ。
- 前記第1のドレイン、および、前記第1のドレインと関連付けられる前記フィン・チャネル上の前記ソースは、nドープ材料を含み、前記第2のドレイン、および、前記第2のドレインと関連付けられる前記フィン・チャネル上の前記ソースは、pドープ材料を含む、請求項14に記載の縦型電界効果トランジスタ。
- 前記第1のドレイン、および、前記第1のドレインと関連付けられる前記フィン・チャネル上の前記ソースは、ホウ素ドープ・シリコン・ゲルマニウム(SiGe−B)を含み、前記第2のドレイン、および、前記第2のドレインと関連付けられる前記フィン・チャネル上の前記ソースは、リン・ドープ炭化ケイ素(SiC−P)を含み、前記フィン・チャネルは真性シリコンを含む、請求項14に記載の縦型電界効果トランジスタ。
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PCT/IB2016/057645 WO2017103832A1 (en) | 2015-12-18 | 2016-12-15 | Vertical transistor fabrication and devices |
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CN108431953B (zh) | 2021-09-28 |
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US20170179303A1 (en) | 2017-06-22 |
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US9941411B2 (en) | 2018-04-10 |
US20180226494A1 (en) | 2018-08-09 |
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US10388757B2 (en) | 2019-08-20 |
US20170263781A1 (en) | 2017-09-14 |
CN108431953A (zh) | 2018-08-21 |
US20170179259A1 (en) | 2017-06-22 |
US9793374B2 (en) | 2017-10-17 |
WO2017103832A1 (en) | 2017-06-22 |
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