JP2018536845A - 相対圧センサ - Google Patents
相対圧センサ Download PDFInfo
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- JP2018536845A JP2018536845A JP2018519803A JP2018519803A JP2018536845A JP 2018536845 A JP2018536845 A JP 2018536845A JP 2018519803 A JP2018519803 A JP 2018519803A JP 2018519803 A JP2018519803 A JP 2018519803A JP 2018536845 A JP2018536845 A JP 2018536845A
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- substrate
- cavity
- channel
- pressure sensor
- sensing device
- Prior art date
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- 239000000758 substrate Substances 0.000 claims abstract description 127
- 239000012528 membrane Substances 0.000 claims abstract description 32
- 239000007788 liquid Substances 0.000 claims description 48
- 239000000853 adhesive Substances 0.000 claims description 33
- 230000001070 adhesive effect Effects 0.000 claims description 33
- 238000000034 method Methods 0.000 claims description 29
- 239000010408 film Substances 0.000 claims description 15
- 239000010409 thin film Substances 0.000 claims description 8
- 230000001154 acute effect Effects 0.000 claims description 3
- 238000001514 detection method Methods 0.000 description 27
- 239000000463 material Substances 0.000 description 7
- 229920000642 polymer Polymers 0.000 description 7
- 239000012530 fluid Substances 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 230000003993 interaction Effects 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 239000004634 thermosetting polymer Substances 0.000 description 3
- 239000000835 fiber Substances 0.000 description 2
- 239000002210 silicon-based material Substances 0.000 description 2
- 239000012080 ambient air Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 229920006336 epoxy molding compound Polymers 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L7/00—Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements
- G01L7/02—Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements in the form of elastically-deformable gauges
- G01L7/08—Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements in the form of elastically-deformable gauges of the flexible-diaphragm type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
- B41J2/17503—Ink cartridges
- B41J2/17513—Inner structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
- B41J2/17503—Ink cartridges
- B41J2/17556—Means for regulating the pressure in the cartridge
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/149—Housings of immersion sensor, e.g. where the sensor is immersed in the measuring medium or for in vivo measurements, e.g. by using catheter tips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L27/00—Testing or calibrating of apparatus for measuring fluid pressure
- G01L27/002—Calibrating, i.e. establishing true relation between transducer output value and value to be measured, zeroing, linearising or span error determination
- G01L27/005—Apparatus for calibrating pressure sensors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
- G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
- G01L9/0054—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements integral with a semiconducting diaphragm
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/02—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning
- G01L9/06—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning of piezo-resistive devices
Abstract
Description
Claims (15)
- 相対圧センサを備える装置であって、
前記相対圧センサは、
基板と、
該基板の面内のキャビティであって、該基板内に床部を有するキャビティと、
前記キャビティから伸びる通路と、
圧力検出デバイスを支持する膜であって、前記床部に対向して前記基板に取り付けられた膜
を備えることからなる、装置。 - 前記基板の前記面内のチャンネルと、
前記通路を形成するために前記チャンネルに対向して前記基板に固定されたカバー
をさらに備える、請求項1の装置。 - 前記カバーは接着剤を含む、請求項2の装置。
- 前記カバーは薄膜から構成される、請求項2の装置。
- 前記キャビティは、
前記基板によって形成された床部と、
前記基板によって形成された側壁
を備えることからなる、請求項1の装置。 - 前記膜は平面内を伸びる主要寸法を有し、前記側壁は該平面に垂直に伸びる、請求項5の装置。
- 前記膜は、平面内を伸びる主要寸法を有し、前記側壁と該平面は、前記キャビティ内で鋭角をなす、請求項5の装置。
- 液体室をさらに備える請求項1の装置であって、前記通路は、該液体室の内部及び外部から伸びる、請求項1の装置。
- 前記圧力検出デバイスは、ピエゾ抵抗素子を有するホイートストンブリッジを備える、請求項1の装置。
- 液体室と相対圧センサとカバーを備える液体供給源であって、
前記相対圧センサは、
基板と、
前記基板内のキャビティと、
前記キャビティに対向する圧力検出デバイスと、
前記基板内のチャンネルであって、前記キャビティに接続されたチャンネル
を備え、
前記カバーは、通路を形成するために前記チャンネルに対向して前記基板に固定され、
前記通路は、前記液体室の内部から外部へと伸びることからなる、液体供給源。 - 相対圧センサを形成するための方法であって、
基板内にチャンネルを形成するステップであって、該チャンネルは、該基板内のキャビティに接続されることからなる、ステップと、
圧力検出デバイスを前記キャビティに対向させて設けるステップと、
前記キャビティから通じる通路を形成するために、カバーを前記チャンネルに対向させて前記基板に固定するステップ
を含む方法。 - 基板内にチャンネルを形成する前記ステップ及び圧力検出デバイスを設ける前記ステップが、
前記圧力検出デバイスを支持する膜の上において、台上に犠牲層を形成するステップであって、該犠牲層は、前記キャビティ及び前記チャンネルを画定することからなる、ステップと、
前記犠牲層の上に前記基板を形成するステップと、
前記犠牲層を除去するステップと、
前記基板、前記膜、及び前記圧力検出デバイスを前記台から分離するステップ
を含むことからなる、請求項11の方法。 - 圧力検出デバイスを設ける前記ステップが、前記圧力検出デバイスを支持する膜を、前記基板内の前記キャビティに対向させて、前記基板に取り付けるステップを含むことからなる、請求項11の方法。
- 前記チャンネルは、前記キャビティの床部に平行な面内を伸びる、請求項11の方法。
- 前記膜は、前記キャビティに対向する面を有し、該キャビティは、該面に対して直角と鋭角のいずれかをなす側壁を有する、請求項11の方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/US2015/057728 WO2017074334A1 (en) | 2015-10-28 | 2015-10-28 | Relative pressure sensor |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018536845A true JP2018536845A (ja) | 2018-12-13 |
JP6499378B2 JP6499378B2 (ja) | 2019-04-10 |
Family
ID=58630879
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018519803A Expired - Fee Related JP6499378B2 (ja) | 2015-10-28 | 2015-10-28 | 相対圧センサ |
Country Status (6)
Country | Link |
---|---|
US (1) | US20190226930A1 (ja) |
EP (1) | EP3368874A4 (ja) |
JP (1) | JP6499378B2 (ja) |
CN (1) | CN108463703B (ja) |
TW (1) | TWI613431B (ja) |
WO (1) | WO2017074334A1 (ja) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20220026300A1 (en) * | 2018-11-27 | 2022-01-27 | Grundfos Holding A/S | A cover for a pressure sensor |
BR112021010760A2 (pt) | 2018-12-03 | 2021-08-31 | Hewlett-Packard Development Company, L.P. | Circuitos lógicos |
AU2018451721B2 (en) | 2018-12-03 | 2023-05-18 | Hewlett-Packard Development Company, L.P. | Logic circuitry |
BR112021010672A2 (pt) | 2018-12-03 | 2021-08-24 | Hewlett-Packard Development Company, L.P. | Circuitos lógicos |
CA3121183A1 (en) | 2018-12-03 | 2020-06-11 | Hewlett-Packard Development Company, L.P. | Logic circuitry |
CN113168442B (zh) | 2018-12-03 | 2023-12-22 | 惠普发展公司,有限责任合伙企业 | 逻辑电路系统 |
US11338586B2 (en) | 2018-12-03 | 2022-05-24 | Hewlett-Packard Development Company, L.P. | Logic circuitry |
US20210216491A1 (en) | 2018-12-03 | 2021-07-15 | Hewlett-Packard Development Company, L.P. | Logic Circuitry |
US20210046760A1 (en) | 2018-12-03 | 2021-02-18 | Hewlett-Packard Development Company, L.P. | Logic circuitry |
WO2021080607A1 (en) | 2019-10-25 | 2021-04-29 | Hewlett-Packard Development Company, L.P. | Logic circuitry package |
US10894423B2 (en) | 2018-12-03 | 2021-01-19 | Hewlett-Packard Development Company, L.P. | Logic circuitry |
US20210221122A1 (en) | 2018-12-03 | 2021-07-22 | Hewlett-Packard Development Company, L.P. | Logic circuitry package |
CN113661379A (zh) * | 2019-04-05 | 2021-11-16 | 惠普发展公司,有限责任合伙企业 | 流体特性传感器 |
CN113614496A (zh) * | 2019-04-05 | 2021-11-05 | 惠普发展公司,有限责任合伙企业 | 流体特性传感器 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05332860A (ja) * | 1992-05-27 | 1993-12-17 | Canon Inc | 感圧センサ及びこれを用いた記録装置 |
JPH08247873A (ja) * | 1995-03-13 | 1996-09-27 | Tokai Rika Co Ltd | 圧力センサ |
JP2002154219A (ja) * | 2000-10-27 | 2002-05-28 | Hewlett Packard Co <Hp> | インク容器 |
JP2005091166A (ja) * | 2003-09-17 | 2005-04-07 | Matsushita Electric Works Ltd | 半導体圧力センサ |
JP2006510508A (ja) * | 2002-12-19 | 2006-03-30 | テレコム・イタリア・エッセ・ピー・アー | 特にインクジェットプリントヘッド用の、攻撃性のある液体に対して液圧超小型回路を保護被覆するための工程 |
US20060144151A1 (en) * | 2002-07-16 | 2006-07-06 | Peter Krause | Pressure transmitter having a pressure sensor of micromechanical design |
JP2012002812A (ja) * | 2010-06-18 | 2012-01-05 | General Electric Co <Ge> | センサ、及びセンサを製造する方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2729005B2 (ja) * | 1992-04-01 | 1998-03-18 | 三菱電機株式会社 | 半導体圧力センサ及びその製造方法 |
US5581038A (en) * | 1994-04-04 | 1996-12-03 | Sentir, Inc. | Pressure measurement apparatus having a reverse mounted transducer and overpressure guard |
JPH0886711A (ja) * | 1994-09-16 | 1996-04-02 | Omron Corp | 圧力センサ装置とこの圧力センサ装置を使用したガスメータ |
JPH08226861A (ja) * | 1995-02-22 | 1996-09-03 | Omron Corp | 圧力センサ並びにその実装構造 |
JP2003004567A (ja) * | 2001-06-19 | 2003-01-08 | Omron Corp | 圧力センサ及び血圧計 |
US7508040B2 (en) * | 2006-06-05 | 2009-03-24 | Hewlett-Packard Development Company, L.P. | Micro electrical mechanical systems pressure sensor |
FR2919486B1 (fr) * | 2007-07-31 | 2009-10-02 | Captomed Entpr Unipersonnelle | Capteur de pression auto-etalonnable. |
DE102011081887A1 (de) * | 2011-08-31 | 2013-02-28 | Robert Bosch Gmbh | Polymerschichtsystem-Drucksensorvorrichtung und Polymerschichtsystem-Drucksensorverfahren |
CN103063351B (zh) * | 2012-12-21 | 2016-05-11 | 上海华虹宏力半导体制造有限公司 | 微机电系统压力传感器及其制作方法、微机电系统 |
US8878316B2 (en) * | 2013-02-22 | 2014-11-04 | Continental Automotive Systems, Inc. | Cap side bonding structure for backside absolute pressure sensors |
DE102014207480A1 (de) * | 2014-04-17 | 2015-10-22 | Robert Bosch Gmbh | Vorrichtung zum Erfassen eines Parameters eines Gases, Verfahren zum Betreiben einer derartigen Vorrichtung und Messsystem zum Bestimmen eines Parameters eines Gases |
-
2015
- 2015-10-28 EP EP15907441.8A patent/EP3368874A4/en not_active Withdrawn
- 2015-10-28 CN CN201580084006.4A patent/CN108463703B/zh not_active Expired - Fee Related
- 2015-10-28 JP JP2018519803A patent/JP6499378B2/ja not_active Expired - Fee Related
- 2015-10-28 WO PCT/US2015/057728 patent/WO2017074334A1/en active Application Filing
-
2016
- 2016-06-14 TW TW105118577A patent/TWI613431B/zh not_active IP Right Cessation
-
2019
- 2019-04-04 US US16/375,409 patent/US20190226930A1/en not_active Abandoned
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05332860A (ja) * | 1992-05-27 | 1993-12-17 | Canon Inc | 感圧センサ及びこれを用いた記録装置 |
JPH08247873A (ja) * | 1995-03-13 | 1996-09-27 | Tokai Rika Co Ltd | 圧力センサ |
JP2002154219A (ja) * | 2000-10-27 | 2002-05-28 | Hewlett Packard Co <Hp> | インク容器 |
US20060144151A1 (en) * | 2002-07-16 | 2006-07-06 | Peter Krause | Pressure transmitter having a pressure sensor of micromechanical design |
JP2006510508A (ja) * | 2002-12-19 | 2006-03-30 | テレコム・イタリア・エッセ・ピー・アー | 特にインクジェットプリントヘッド用の、攻撃性のある液体に対して液圧超小型回路を保護被覆するための工程 |
JP2005091166A (ja) * | 2003-09-17 | 2005-04-07 | Matsushita Electric Works Ltd | 半導体圧力センサ |
JP2012002812A (ja) * | 2010-06-18 | 2012-01-05 | General Electric Co <Ge> | センサ、及びセンサを製造する方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2017074334A1 (en) | 2017-05-04 |
EP3368874A1 (en) | 2018-09-05 |
CN108463703B (zh) | 2021-07-09 |
TWI613431B (zh) | 2018-02-01 |
EP3368874A4 (en) | 2019-06-05 |
TW201715214A (zh) | 2017-05-01 |
JP6499378B2 (ja) | 2019-04-10 |
US20190226930A1 (en) | 2019-07-25 |
CN108463703A (zh) | 2018-08-28 |
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