JP2018533822A - モジュラーコネクタ - Google Patents
モジュラーコネクタ Download PDFInfo
- Publication number
- JP2018533822A JP2018533822A JP2018524271A JP2018524271A JP2018533822A JP 2018533822 A JP2018533822 A JP 2018533822A JP 2018524271 A JP2018524271 A JP 2018524271A JP 2018524271 A JP2018524271 A JP 2018524271A JP 2018533822 A JP2018533822 A JP 2018533822A
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- contact
- plug
- jack
- contacts
- network interface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 32
- 229910052802 copper Inorganic materials 0.000 claims description 32
- 239000010949 copper Substances 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 7
- 238000003780 insertion Methods 0.000 claims description 6
- 230000037431 insertion Effects 0.000 claims description 6
- 230000008569 process Effects 0.000 claims description 6
- 230000006835 compression Effects 0.000 claims description 3
- 238000007906 compression Methods 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 13
- PQHZWWBJPCNNGI-UHFFFAOYSA-N 1,3,5-trichloro-2-(2,5-dichlorophenyl)benzene Chemical compound ClC1=CC=C(Cl)C(C=2C(=CC(Cl)=CC=2Cl)Cl)=C1 PQHZWWBJPCNNGI-UHFFFAOYSA-N 0.000 description 10
- 239000000463 material Substances 0.000 description 8
- 239000003990 capacitor Substances 0.000 description 7
- 230000008878 coupling Effects 0.000 description 7
- 238000010168 coupling process Methods 0.000 description 7
- 238000005859 coupling reaction Methods 0.000 description 7
- 230000007704 transition Effects 0.000 description 7
- 230000004888 barrier function Effects 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 6
- 230000013011 mating Effects 0.000 description 6
- 239000004033 plastic Substances 0.000 description 6
- 238000005452 bending Methods 0.000 description 4
- 239000000969 carrier Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 230000015556 catabolic process Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000006731 degradation reaction Methods 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 238000002955 isolation Methods 0.000 description 3
- 230000010363 phase shift Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 230000002829 reductive effect Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 230000009191 jumping Effects 0.000 description 1
- 239000002991 molded plastic Substances 0.000 description 1
- 239000006225 natural substrate Substances 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6461—Means for preventing cross-talk
- H01R13/6467—Means for preventing cross-talk by cross-over of signal conductors
- H01R13/6469—Means for preventing cross-talk by cross-over of signal conductors on substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6591—Specific features or arrangements of connection of shield to conductive members
- H01R13/6594—Specific features or arrangements of connection of shield to conductive members the shield being mounted on a PCB and connected to conductive members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
- H01R24/60—Contacts spaced along planar side wall transverse to longitudinal axis of engagement
- H01R24/62—Sliding engagements with one side only, e.g. modular jack coupling devices
- H01R24/64—Sliding engagements with one side only, e.g. modular jack coupling devices for high frequency, e.g. RJ 45
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2107/00—Four or more poles
Landscapes
- Details Of Connecting Devices For Male And Female Coupling (AREA)
Abstract
【選択図】図2
Description
Claims (15)
- ネットワークインターフェースコネクタであって、
ジャックハウジングと、
前記ジャックハウジング内に配置されたジャックコンタクトアセンブリと、を備え、
前記ジャックコンタクトアセンブリは、プラグコンタクト部及び信号出力部をそれぞれが有する第1及び第2の細長コンタクトの組、及び前記プラグコンタクト部に近接して結合されたフレキシブル回路基板、とを備え、
前記プラグコンタクト部がそれぞれ同一平面上にあり、前記プラグコンタクト部と前記信号出力部との間に信号経路が画定されるように前記細長コンタクトが構成され、
前記フレキシブル回路基板が、係合したそれぞれのコンタクト間のキャパシタンス補償を提供するように構成され、該キャパシタンス補償が、前記プラグコンタクト部と前記対応する信号出力部との間に画定された前記信号経路から位置ずれしている
ネットワークインターフェースコネクタ。 - 前記細長コンタクトの前記プラグコンタクト部はそれぞれ、プラグコネクタに対応するコンタクトと係合するように構成された第1の側面と、前記フレキシブル回路基板に結合された第2の側面とを含む、請求項1に記載のネットワークインターフェースコネクタ。
- 前記フレキシブル回路基板は、両側に第1及び第2の銅層が塗布されたフレキシブル基板を含む、請求項1又は2に記載のネットワークインターフェースコネクタ。
- 前記フレキシブル回路基板内の制御されたキャパシタンスは、前記ジャックコンタクトアセンブリに結合された隣接するプラグコンタクト間の常駐キャパシタンスを相殺するように構成され、前記制御キャパシタンスの値は、制御された誘電率及び前記フレキシブル基板の厚さ、さらに前記第1の銅層及び前記第2の銅層にそれぞれ関連する第1及び第2の銅板の重複領域に基づく、請求項3に記載のネットワークインターフェースコネクタ。
- 前記第1の銅板は、前記第2の銅板に対して小さく且つ囲まれている、請求項4に記載のネットワークインターフェースコネクタ。
- 前記フレキシブル回路基板は、第1及び第2の対向端部間の中間部分で前記細長コンタクトに結合され、前記第1の銅層及び前記第2の銅層の前記重複領域が前記第1及び第2の対向端部のうちの1つ又は複数に関連付けられている、請求項4又は5に記載のネットワークインターフェースコネクタ。
- 前記フレキシブル回路基板は、前記中央部分から弓状に曲げられている、請求項6に記載のネットワークインターフェースコネクタ。
- 前記細長コンタクトのそれぞれを受け入れる少なくとも1つのコンタクトアライメント部材をさらに備える、請求項1〜7の何れか一項に記載のネットワークインターフェースコネクタ。
- 前記少なくとも1つのコンタクトアライメント部材が、前記細長コンタクト上にモールドされ且つ絶縁材料で形成されている、請求項8に記載のネットワークインターフェースコネクタ。
- 前記細長コンタクトはそれぞれ、前記プラグコンタクトと前記信号出力部との間で前記少なくとも1つのコンタクトアライメント部材に結合される、請求項8に記載のネットワークインターフェースコネクタ。
- 前記ジャックハウジングの内壁と前記少なくとも1つのコンタクトアラインメント部材との間に取り付けられた電気的に絶縁された圧縮バネをさらに備え、前記ジャックコンタクトアセンブリに垂直力を印加するように構成される、請求項8〜10の何れか一項に記載のネットワークインターフェースコネクタ。
- 前記細長コンタクトの第1の組の前記信号出力部が第1の同一平面のアレイに保持され、前記細長コンタクトの第2の組の前記信号出力部が、前記第1の同一平面上のアレイに平行な第2の同一平面アレイに保持される、請求項1〜11の何れか一項に記載のネットワークインターフェースコネクタ。
- 前記細長コンタクトの各々は、前記プラグコンタクト部から前記信号出力部の遠位に延びる引込コンタクト部をさらに備え、該引込コンタクト部が、挿入プロセスの間の完全挿入、及びプラグコンタクト部によるプラグコンタクトの係合の前に、対応するプラグコンタクト部と係合するように構成されている、請求項1〜12の何れか一項に記載のネットワークインターフェースコネクタ。
- 前記ジャックコンタクトアセンブリを取り囲む絶縁性のコンタクトガイドフレームをさらに備え、
前記コンタクトガイドフレームが、前記コンタクトアセンブリを囲み、且つ前記細長コンタクトを受ける埋設保護スロット、及び前記コンタクトガイドフレームから延在して挿入プロセス中に前記プラグコンタクトに係合し前記プラグコンタクトを案内するリブ、を有する、請求項1〜13の何れか一項に記載のネットワークインターフェースコネクタ。 - ジャックハウジングとジャックコンタクトアセンブリとを備えたネットワークインターフェースコネクタが、
信号出力部の各々が結合され且つ2次補償を提供するリジッド印刷回路基板と、
前記ジャックハウジングを封止し、前記ジャックコンタクトアセンブリと係合したときに前記リジッド印刷回路基板とプラグコネクタとの間に電気的接地路をさらに提供するジャックシールドと、をさらに備える、請求項1〜14の何れか一項に記載のネットワークインターフェースコネクタ。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201562254023P | 2015-11-11 | 2015-11-11 | |
US62/254,023 | 2015-11-11 | ||
US201662297640P | 2016-02-19 | 2016-02-19 | |
US62/297,640 | 2016-02-19 | ||
PCT/US2016/060963 WO2017083287A1 (en) | 2015-11-11 | 2016-11-08 | Modular jack connector |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2018533822A true JP2018533822A (ja) | 2018-11-15 |
JP2018533822A5 JP2018533822A5 (ja) | 2019-11-28 |
JP6655183B2 JP6655183B2 (ja) | 2020-02-26 |
Family
ID=57346082
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018524271A Active JP6655183B2 (ja) | 2015-11-11 | 2016-11-08 | モジュラーコネクタ |
Country Status (5)
Country | Link |
---|---|
US (1) | US10424874B2 (ja) |
EP (1) | EP3375052A1 (ja) |
JP (1) | JP6655183B2 (ja) |
CN (1) | CN108475886B (ja) |
WO (1) | WO2017083287A1 (ja) |
Families Citing this family (2)
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US11031738B1 (en) * | 2020-01-03 | 2021-06-08 | Jyh Eng Technology Co., Ltd. | Multiple socket panel device with anti-crosstalk shielding structure |
JP6981523B1 (ja) * | 2020-12-18 | 2021-12-15 | Smk株式会社 | 電気コネクタ |
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-
2016
- 2016-11-08 CN CN201680078668.5A patent/CN108475886B/zh not_active Expired - Fee Related
- 2016-11-08 JP JP2018524271A patent/JP6655183B2/ja active Active
- 2016-11-08 WO PCT/US2016/060963 patent/WO2017083287A1/en active Application Filing
- 2016-11-08 EP EP16798059.8A patent/EP3375052A1/en not_active Withdrawn
-
2018
- 2018-04-26 US US15/963,765 patent/US10424874B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US10424874B2 (en) | 2019-09-24 |
JP6655183B2 (ja) | 2020-02-26 |
EP3375052A1 (en) | 2018-09-19 |
CN108475886A (zh) | 2018-08-31 |
WO2017083287A1 (en) | 2017-05-18 |
CN108475886B (zh) | 2021-02-12 |
US20180248318A1 (en) | 2018-08-30 |
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