JP2018529001A5 - - Google Patents
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- Publication number
- JP2018529001A5 JP2018529001A5 JP2018507542A JP2018507542A JP2018529001A5 JP 2018529001 A5 JP2018529001 A5 JP 2018529001A5 JP 2018507542 A JP2018507542 A JP 2018507542A JP 2018507542 A JP2018507542 A JP 2018507542A JP 2018529001 A5 JP2018529001 A5 JP 2018529001A5
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- polymer thick
- conductor composition
- copper conductor
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 17
- 239000000203 mixture Substances 0.000 claims description 16
- 229920000642 polymer Polymers 0.000 claims description 14
- 229910052802 copper Inorganic materials 0.000 claims description 13
- 239000010949 copper Substances 0.000 claims description 13
- 239000003381 stabilizer Substances 0.000 claims description 7
- 239000002245 particle Substances 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- 239000009719 polyimide resin Substances 0.000 claims description 4
- 239000003960 organic solvent Substances 0.000 claims description 3
- 239000003638 chemical reducing agent Substances 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims 1
- 238000000034 method Methods 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 5
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 3
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 3
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 3
- 239000005642 Oleic acid Substances 0.000 description 3
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 3
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 3
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid group Chemical group C(CCCCCCC\C=C/CCCCCCCC)(=O)O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 3
- 235000021355 Stearic acid Nutrition 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 125000005313 fatty acid group Chemical group 0.000 description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 2
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 2
- 239000008117 stearic acid Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201562204583P | 2015-08-13 | 2015-08-13 | |
| US62/204,583 | 2015-08-13 | ||
| US14/862,259 US9637648B2 (en) | 2015-08-13 | 2015-09-23 | Photonic sintering of a solderable polymer thick film copper conductor composition |
| US14/862,259 | 2015-09-23 | ||
| PCT/US2016/046121 WO2017027496A2 (en) | 2015-08-13 | 2016-08-09 | Photonic sintering of a solderable polymer thick film copper conductor composition |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018529001A JP2018529001A (ja) | 2018-10-04 |
| JP2018529001A5 true JP2018529001A5 (cg-RX-API-DMAC10.html) | 2019-07-25 |
| JP6737871B2 JP6737871B2 (ja) | 2020-08-12 |
Family
ID=56740499
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018507542A Expired - Fee Related JP6737871B2 (ja) | 2015-08-13 | 2016-08-09 | はんだ付け可能ポリマー厚膜銅導体組成物の光焼結 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9637648B2 (cg-RX-API-DMAC10.html) |
| EP (1) | EP3335226B1 (cg-RX-API-DMAC10.html) |
| JP (1) | JP6737871B2 (cg-RX-API-DMAC10.html) |
| CN (1) | CN108140445B (cg-RX-API-DMAC10.html) |
| WO (1) | WO2017027496A2 (cg-RX-API-DMAC10.html) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019018613A1 (en) * | 2017-07-20 | 2019-01-24 | Molex, Llc | DRY PROCESS FOR METALLIZING POLYMER THICK LAYER SURFACES |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3564636D1 (en) | 1984-07-31 | 1988-09-29 | Mitsubishi Petrochemical Co | Copper-type conductive coating composition |
| JPH064791B2 (ja) | 1985-09-30 | 1994-01-19 | タツタ電線株式会社 | 導電塗料 |
| JPS62230869A (ja) | 1986-03-31 | 1987-10-09 | Tatsuta Electric Wire & Cable Co Ltd | 半田付可能な導電塗料 |
| DE3782522T2 (de) | 1986-03-31 | 1993-06-03 | Tatsuta Densen Kk | Leitfaehige kupferpastenzusammensetzung. |
| JPS6420276A (en) | 1987-07-15 | 1989-01-24 | Mitsubishi Petrochemical Co | Copper-containing electroconductive coating composition |
| US5064469A (en) | 1989-10-03 | 1991-11-12 | Akzo N.V. | Preparation of oxidation resistant metal powder |
| JP2702796B2 (ja) * | 1990-02-23 | 1998-01-26 | 旭化成工業株式会社 | 銀合金導電性ペースト |
| JPH0412595A (ja) | 1990-05-02 | 1992-01-17 | Mitsubishi Petrochem Co Ltd | 導電性ペースト組成物 |
| JPH0565456A (ja) * | 1991-09-09 | 1993-03-19 | Sumitomo Bakelite Co Ltd | 気密封止用樹脂ペースト |
| US6344157B1 (en) * | 1999-02-12 | 2002-02-05 | National Starch And Chemical Investment Holding Corporation | Conductive and resistive materials with electrical stability for use in electronics devices |
| US7348373B2 (en) * | 2004-01-09 | 2008-03-25 | E.I. Du Pont De Nemours And Company | Polyimide compositions having resistance to water sorption, and methods relating thereto |
| US7169330B2 (en) * | 2004-02-25 | 2007-01-30 | E. I. Du Pont De Nemours And Company | Composition of conductive paste |
| JP5408878B2 (ja) | 2004-11-24 | 2014-02-05 | エヌシーシー ナノ， エルエルシー | ナノ材料組成物の電気的使用、めっき的使用および触媒的使用 |
| CN1835129B (zh) * | 2005-03-16 | 2010-04-28 | E.I.内穆尔杜邦公司 | 导电性浆状组合物 |
| US8945686B2 (en) | 2007-05-24 | 2015-02-03 | Ncc | Method for reducing thin films on low temperature substrates |
| US8506849B2 (en) | 2008-03-05 | 2013-08-13 | Applied Nanotech Holdings, Inc. | Additives and modifiers for solvent- and water-based metallic conductive inks |
| US20110180137A1 (en) | 2010-01-25 | 2011-07-28 | Hitachi Chemical Company, Ltd. | Paste composition for electrode and photovoltaic cell |
| CN102812520B (zh) | 2010-03-18 | 2016-10-19 | 古河电气工业株式会社 | 导电性糊料和由该糊料得到的导电连接部件 |
| US8419981B2 (en) | 2010-11-15 | 2013-04-16 | Cheil Industries, Inc. | Conductive paste composition and electrode prepared using the same |
| US9221979B2 (en) * | 2011-05-18 | 2015-12-29 | Toda Kogyo Corporation | Copper particles, copper paste, process for producing conductive coating film, and conductive coating film |
| TW201339279A (zh) * | 2011-11-24 | 2013-10-01 | Showa Denko Kk | 導電圖型形成方法及藉由光照射或微波加熱的導電圖型形成用組成物 |
| WO2013081664A1 (en) | 2011-12-02 | 2013-06-06 | E. I. Du Pont De Nemours And Company | Conductive metal composition |
| US8551367B2 (en) * | 2012-01-19 | 2013-10-08 | E I Du Pont De Nemours And Company | Polymer thick film solder alloy conductor composition |
| US20140018482A1 (en) * | 2012-03-26 | 2014-01-16 | E I Du Pont De Nemours And Company | Polymer thick film solder alloy/metal conductor compositions |
| JP5700864B2 (ja) * | 2013-05-15 | 2015-04-15 | 石原ケミカル株式会社 | 銅微粒子分散液、導電膜形成方法及び回路基板 |
| US9190188B2 (en) * | 2013-06-13 | 2015-11-17 | E I Du Pont De Nemours And Company | Photonic sintering of polymer thick film copper conductor compositions |
| JP2015032493A (ja) * | 2013-08-05 | 2015-02-16 | 富士フイルム株式会社 | 導電膜形成用組成物およびそれを用いる導電膜の製造方法 |
-
2015
- 2015-09-23 US US14/862,259 patent/US9637648B2/en not_active Expired - Fee Related
-
2016
- 2016-08-09 WO PCT/US2016/046121 patent/WO2017027496A2/en not_active Ceased
- 2016-08-09 EP EP16754064.0A patent/EP3335226B1/en active Active
- 2016-08-09 JP JP2018507542A patent/JP6737871B2/ja not_active Expired - Fee Related
- 2016-08-09 CN CN201680058281.3A patent/CN108140445B/zh not_active Expired - Fee Related
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