JP2018525792A5 - - Google Patents

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Publication number
JP2018525792A5
JP2018525792A5 JP2018509556A JP2018509556A JP2018525792A5 JP 2018525792 A5 JP2018525792 A5 JP 2018525792A5 JP 2018509556 A JP2018509556 A JP 2018509556A JP 2018509556 A JP2018509556 A JP 2018509556A JP 2018525792 A5 JP2018525792 A5 JP 2018525792A5
Authority
JP
Japan
Prior art keywords
windings
dent
carrier board
width
sections
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2018509556A
Other languages
English (en)
Japanese (ja)
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JP2018525792A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/EP2016/069418 external-priority patent/WO2017029286A1/en
Publication of JP2018525792A publication Critical patent/JP2018525792A/ja
Publication of JP2018525792A5 publication Critical patent/JP2018525792A5/ja
Pending legal-status Critical Current

Links

JP2018509556A 2015-08-20 2016-08-16 ボードに設けられるｌｅｄアレイ Pending JP2018525792A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP15181765.7 2015-08-20
EP15181765 2015-08-20
PCT/EP2016/069418 WO2017029286A1 (en) 2015-08-20 2016-08-16 Board mounted led array

Publications (2)

Publication Number Publication Date
JP2018525792A JP2018525792A (ja) 2018-09-06
JP2018525792A5 true JP2018525792A5 (enExample) 2019-09-26

Family

ID=53887008

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018509556A Pending JP2018525792A (ja) 2015-08-20 2016-08-16 ボードに設けられるｌｅｄアレイ

Country Status (5)

Country Link
US (1) US10222010B2 (enExample)
EP (1) EP3338022B1 (enExample)
JP (1) JP2018525792A (enExample)
CN (1) CN107923581A (enExample)
WO (1) WO2017029286A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11304296B2 (en) * 2018-04-28 2022-04-12 Shenzhen Royole Technologies Co., Ltd. Substrate, electronic device, and bonding method
USD900356S1 (en) * 2018-08-06 2020-10-27 Shenzhen Smart & Green Technology Co., Ltd. LED light
US11946615B2 (en) 2020-01-20 2024-04-02 Signify Holding, B.V. Luminaire comprising identical, curved LED Modules and LED Module suitable for said luminaire

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005228486A (ja) * 2004-02-10 2005-08-25 Matsushita Electric Ind Co Ltd Ｌｅｄ照明装置
US7918702B2 (en) * 2006-04-25 2011-04-05 Koninklijke Philips Electronics N.V. Large area LED array and method for its manufacture
KR100980365B1 (ko) * 2008-08-25 2010-09-06 주식회사 웰라이트 바 타입의 엘이디 조명 장치
US7869270B2 (en) * 2008-12-29 2011-01-11 Macronix International Co., Ltd. Set algorithm for phase change memory cell
TWM366267U (en) * 2009-04-16 2009-10-01 Taiwan Oasis Technology Co Ltd LED substrate
CN101834175B (zh) 2010-05-13 2015-07-15 中节能晶和照明有限公司 Led照明cob封装结构以及球泡
JP2012164518A (ja) * 2011-02-07 2012-08-30 Kodenshi Corp 広配向性照明装置とその製造方法
US8307547B1 (en) 2012-01-16 2012-11-13 Indak Manufacturing Corp. Method of manufacturing a circuit board with light emitting diodes
CN202841695U (zh) 2012-10-24 2013-03-27 盱眙凯亿电子材料有限公司 Led灯用螺旋型电路板
CN103016977B (zh) * 2012-11-22 2015-08-26 鹤山健豪灯饰企业有限公司 一种广角照射的led灯
WO2014079220A1 (zh) 2012-11-22 2014-05-30 Huang Kuo-Hao 一种电路板及广角照射的led灯
KR102098590B1 (ko) 2012-12-11 2020-04-09 삼성전자주식회사 발광모듈 및 이를 구비한 면 조명장치
US9482410B2 (en) * 2012-12-11 2016-11-01 Samsung Electronics Co., Ltd. Light emitting module and surface lighting device having the same
KR200471587Y1 (ko) 2013-10-07 2014-03-04 권일봉 평면 나선형 pcb가 구비된 led 등기구
CN203743877U (zh) 2013-12-26 2014-07-30 上海顿格电子贸易有限公司 螺旋状发光二极管灯丝
KR20150084311A (ko) * 2014-01-13 2015-07-22 삼성전자주식회사 발광모듈
CN204062571U (zh) 2014-08-01 2014-12-31 王定锋 一种螺旋状灯丝的led灯泡模组

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