JP2018523820A - 検査ツールへのダイナミックケアエリア生成システムおよび方法 - Google Patents

検査ツールへのダイナミックケアエリア生成システムおよび方法 Download PDF

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Publication number
JP2018523820A
JP2018523820A JP2018504777A JP2018504777A JP2018523820A JP 2018523820 A JP2018523820 A JP 2018523820A JP 2018504777 A JP2018504777 A JP 2018504777A JP 2018504777 A JP2018504777 A JP 2018504777A JP 2018523820 A JP2018523820 A JP 2018523820A
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Japan
Prior art keywords
sample
target
design data
defect inspection
instances
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Pending
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JP2018504777A
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English (en)
Japanese (ja)
Inventor
ヴィジャヤクマル ラマチャンドラン
ヴィジャヤクマル ラマチャンドラン
ラヴィクマル サナパラ
ラヴィクマル サナパラ
ヴィジャサガル アナンタ
ヴィジャサガル アナンタ
フィリップ メアソー
フィリップ メアソー
ラジェシュ マネパッリ
ラジェシュ マネパッリ
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KLA Corp
Original Assignee
KLA Corp
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Filing date
Publication date
Application filed by KLA Corp filed Critical KLA Corp
Priority claimed from US15/166,591 external-priority patent/US10018571B2/en
Publication of JP2018523820A publication Critical patent/JP2018523820A/ja
Priority to JP2021089720A priority Critical patent/JP7169402B2/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/24—Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37224—Inspect wafer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Quality & Reliability (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
JP2018504777A 2015-07-30 2016-05-27 検査ツールへのダイナミックケアエリア生成システムおよび方法 Pending JP2018523820A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2021089720A JP7169402B2 (ja) 2015-07-30 2021-05-28 検査ツールへのダイナミックケアエリア生成システムおよび方法

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201562198911P 2015-07-30 2015-07-30
US62/198,911 2015-07-30
PCT/US2016/034648 WO2017019171A1 (en) 2015-07-30 2016-05-27 System and method for dynamic care area generation on an inspection tool
US15/166,591 2016-05-27
US15/166,591 US10018571B2 (en) 2015-05-28 2016-05-27 System and method for dynamic care area generation on an inspection tool

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2021089720A Division JP7169402B2 (ja) 2015-07-30 2021-05-28 検査ツールへのダイナミックケアエリア生成システムおよび方法

Publications (1)

Publication Number Publication Date
JP2018523820A true JP2018523820A (ja) 2018-08-23

Family

ID=57884844

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2018504777A Pending JP2018523820A (ja) 2015-07-30 2016-05-27 検査ツールへのダイナミックケアエリア生成システムおよび方法
JP2021089720A Active JP7169402B2 (ja) 2015-07-30 2021-05-28 検査ツールへのダイナミックケアエリア生成システムおよび方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2021089720A Active JP7169402B2 (ja) 2015-07-30 2021-05-28 検査ツールへのダイナミックケアエリア生成システムおよび方法

Country Status (3)

Country Link
JP (2) JP2018523820A (ko)
KR (1) KR102330738B1 (ko)
WO (1) WO2017019171A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022516405A (ja) * 2018-12-31 2022-02-28 エーエスエムエル ネザーランズ ビー．ブイ． プロセス制御のためのインダイメトロロジ方法及びシステム

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11806266B2 (en) 2014-03-19 2023-11-07 Purewick Corporation Apparatus and methods for receiving discharged urine
US10376406B2 (en) 2016-07-27 2019-08-13 Purewick Corporation Male urine collection device using wicking material
CA3098571C (en) 2018-05-01 2023-09-26 Purewick Corporation Fluid collection devices, systems, and methods
CA3098570C (en) 2018-05-01 2023-09-26 Purewick Corporation Fluid collection devices, related systems, and related methods
US11668601B2 (en) 2020-02-24 2023-06-06 Kla Corporation Instrumented substrate apparatus
US12048643B2 (en) 2020-05-27 2024-07-30 Purewick Corporation Fluid collection assemblies including at least one inflation device and methods and systems of using the same
US11801186B2 (en) 2020-09-10 2023-10-31 Purewick Corporation Urine storage container handle and lid accessories
US12042423B2 (en) 2020-10-07 2024-07-23 Purewick Corporation Fluid collection systems including at least one tensioning element
US12048644B2 (en) 2020-11-03 2024-07-30 Purewick Corporation Apparatus for receiving discharged urine
US12070432B2 (en) 2020-11-11 2024-08-27 Purewick Corporation Urine collection system including a flow meter and related methods
AU2022211357B2 (en) 2021-01-19 2024-08-01 Purewick Corporation Variable fit fluid collection devices, systems, and methods
JP2023553620A (ja) 2021-02-26 2023-12-25 ピュアウィック コーポレイション 管開口とバリアとの間に排水受けを有する流体収集装置、ならびに関連するシステムおよび方法
US12029677B2 (en) 2021-04-06 2024-07-09 Purewick Corporation Fluid collection devices having a collection bag, and related systems and methods

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140105482A1 (en) * 2012-10-15 2014-04-17 Kla-Tencor Corporation Detecting Defects on a Wafer Using Defect-Specific Information

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8194968B2 (en) * 2007-01-05 2012-06-05 Kla-Tencor Corp. Methods and systems for using electrical information for a device being fabricated on a wafer to perform one or more defect-related functions
US9659670B2 (en) * 2008-07-28 2017-05-23 Kla-Tencor Corp. Computer-implemented methods, computer-readable media, and systems for classifying defects detected in a memory device area on a wafer
US8656323B2 (en) * 2011-02-22 2014-02-18 Kla-Tencor Corporation Based device risk assessment
US9355208B2 (en) 2013-07-08 2016-05-31 Kla-Tencor Corp. Detecting defects on a wafer
US10410338B2 (en) * 2013-11-04 2019-09-10 Kla-Tencor Corporation Method and system for correlating optical images with scanning electron microscopy images

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140105482A1 (en) * 2012-10-15 2014-04-17 Kla-Tencor Corporation Detecting Defects on a Wafer Using Defect-Specific Information

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022516405A (ja) * 2018-12-31 2022-02-28 エーエスエムエル ネザーランズ ビー．ブイ． プロセス制御のためのインダイメトロロジ方法及びシステム
JP7281547B2 (ja) 2018-12-31 2023-05-25 エーエスエムエル ネザーランズ ビー．ブイ． プロセス制御のためのインダイメトロロジ方法及びシステム

Also Published As

Publication number Publication date
JP2021120686A (ja) 2021-08-19
KR20180025321A (ko) 2018-03-08
KR102330738B1 (ko) 2021-11-23
WO2017019171A1 (en) 2017-02-02
JP7169402B2 (ja) 2022-11-10

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