JP2018518848A - GaAsにほぼ合致する格子パラメータを有する基板上に希薄窒化物層を有する光電子検出器 - Google Patents
GaAsにほぼ合致する格子パラメータを有する基板上に希薄窒化物層を有する光電子検出器 Download PDFInfo
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- 239000000758 substrate Substances 0.000 title claims abstract description 158
- 229910001218 Gallium arsenide Inorganic materials 0.000 title claims abstract description 103
- 150000004767 nitrides Chemical class 0.000 title claims abstract description 31
- 239000006096 absorbing agent Substances 0.000 claims abstract description 43
- 239000004065 semiconductor Substances 0.000 claims description 70
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 34
- 229910052710 silicon Inorganic materials 0.000 claims description 34
- 239000010703 silicon Substances 0.000 claims description 34
- 238000000034 method Methods 0.000 claims description 25
- 229910052761 rare earth metal Inorganic materials 0.000 claims description 21
- 150000002910 rare earth metals Chemical class 0.000 claims description 19
- 229910052684 Cerium Inorganic materials 0.000 claims description 4
- 229910052692 Dysprosium Inorganic materials 0.000 claims description 4
- 229910052691 Erbium Inorganic materials 0.000 claims description 4
- 229910052693 Europium Inorganic materials 0.000 claims description 4
- 229910052688 Gadolinium Inorganic materials 0.000 claims description 4
- 229910052689 Holmium Inorganic materials 0.000 claims description 4
- 229910052779 Neodymium Inorganic materials 0.000 claims description 4
- 229910052777 Praseodymium Inorganic materials 0.000 claims description 4
- 229910052772 Samarium Inorganic materials 0.000 claims description 4
- 229910052771 Terbium Inorganic materials 0.000 claims description 4
- 229910052775 Thulium Inorganic materials 0.000 claims description 4
- 229910052769 Ytterbium Inorganic materials 0.000 claims description 4
- 229910052746 lanthanum Inorganic materials 0.000 claims description 4
- 229910052706 scandium Inorganic materials 0.000 claims description 4
- 229910052727 yttrium Inorganic materials 0.000 claims description 4
- 230000005693 optoelectronics Effects 0.000 abstract description 6
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 95
- 239000000463 material Substances 0.000 description 34
- 238000004151 rapid thermal annealing Methods 0.000 description 25
- 230000000694 effects Effects 0.000 description 21
- 230000007547 defect Effects 0.000 description 20
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 description 15
- KXNLCSXBJCPWGL-UHFFFAOYSA-N [Ga].[As].[In] Chemical compound [Ga].[As].[In] KXNLCSXBJCPWGL-UHFFFAOYSA-N 0.000 description 15
- 230000004907 flux Effects 0.000 description 13
- 238000010521 absorption reaction Methods 0.000 description 12
- 239000000203 mixture Substances 0.000 description 12
- 238000005424 photoluminescence Methods 0.000 description 11
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 9
- 229910045601 alloy Inorganic materials 0.000 description 8
- 239000000956 alloy Substances 0.000 description 8
- 239000000969 carrier Substances 0.000 description 8
- 239000002019 doping agent Substances 0.000 description 8
- 230000005355 Hall effect Effects 0.000 description 7
- 238000002441 X-ray diffraction Methods 0.000 description 7
- 230000007423 decrease Effects 0.000 description 4
- 238000001451 molecular beam epitaxy Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 229910052785 arsenic Inorganic materials 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 229910001404 rare earth metal oxide Inorganic materials 0.000 description 3
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 2
- 238000012512 characterization method Methods 0.000 description 2
- 230000008014 freezing Effects 0.000 description 2
- 238000007710 freezing Methods 0.000 description 2
- 230000005525 hole transport Effects 0.000 description 2
- 238000010348 incorporation Methods 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- 238000000103 photoluminescence spectrum Methods 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 229910052720 vanadium Inorganic materials 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 229910052765 Lutetium Inorganic materials 0.000 description 1
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000002800 charge carrier Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000005274 electronic transitions Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910001938 gadolinium oxide Inorganic materials 0.000 description 1
- 229940075613 gadolinium oxide Drugs 0.000 description 1
- CMIHHWBVHJVIGI-UHFFFAOYSA-N gadolinium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[Gd+3].[Gd+3] CMIHHWBVHJVIGI-UHFFFAOYSA-N 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 229910021478 group 5 element Inorganic materials 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000001657 homoepitaxy Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000000927 vapour-phase epitaxy Methods 0.000 description 1
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Abstract
Description
本願は、2015年6月22日に出願された米国仮出願第62/183,060号および2016年6月21日に出願された米国出願第15/188,396号に対する優先権を主張するものであり、これらの各々の全体の内容は、参照により本明細書中に援用される。
Claims (30)
- 半導体であって、
GaAsに合致またはほぼ合致する格子パラメータを伴う基板と、
前記基板を覆う第1のドープされたIII−V層と、
前記第1のドープされたIII−V層を覆う吸収体層であって、前記吸収体層は、
約0.7eV〜0.95eVの間のバンドギャップと、
室温で約1×1016cm−3未満のキャリア濃度と、
を有する、吸収体層と、
前記吸収体層を覆う第2のドープされたIII−V層と、
を備える、半導体。 - 前記吸収体層は、希薄窒化物を備える、請求項1に記載の半導体。
- 前記希薄窒化物は、InxGa1−xNyAs1−y−zSbz(0≦x≦1;0≦y≦1;0≦z≦1)を備える、請求項2に記載の半導体。
- 前記希薄窒化物は、InxGa1−xNyAs1−y−zSbz(0≦x≦0.55;0≦y≦0.1;0≦z≦0.1)を備える、請求項2に記載の半導体。
- 前記吸収体層の前記キャリア濃度は、約5×1015cm−3未満である、請求項1に記載の半導体。
- 前記吸収体層の前記キャリア濃度は、約1×1015cm−3未満である、請求項1に記載の半導体。
- 前記吸収体層の厚さは、約2マイクロメートル〜約10マイクロメートルである、請求項1に記載の半導体。
- 前記吸収体層の厚さは、約3マイクロメートル〜約5マイクロメートルである、請求項1に記載の半導体。
- 前記吸収体層と前記第1および第2のドープされたIII−V層のうちの1つとの間の増倍層をさらに備える、請求項1に記載の半導体。
- 前記基板は、GaAsを備える、請求項1に記載の半導体。
- 前記基板は、
シリコン基板と、
前記シリコン基板を覆う格子工学層であって、前記シリコン基板の反対の前記格子工学層の表面は、GaAsに合致またはほぼ合致した格子パラメータを有する、格子工学層と、
を備える、請求項1に記載の半導体。 - 前記格子工学層は、SixGe1−x層を備え、xは、前記シリコン基板の最近傍の前記SixGe1−x層の表面における1から、前記シリコン基板の反対の前記SixGe1−x層の表面における0まで段階的である、請求項11に記載の半導体。
- 前記格子工学層は、希土類含有層を備え、前記希土類含有層は、Sc、Y、La、Ce、Pr、Nd、Pm、Sm、Eu、Gd、Tb、Dy、Ho、Er、Tm、Yb、および/またはLuのうちの1つもしくはそれを上回るものを備える、請求項11に記載の半導体。
- 前記第1のドープされたIII−V層は、n型であり、前記第2のドープされたIII−V層は、p型である、請求項1に記載の半導体。
- 前記第1のドープされたIII−V層は、p型であり、前記第2のドープされたIII−V層は、n型である、請求項1に記載の半導体。
- 半導体を形成する方法であって、
GaAsに合致またはほぼ合致する格子パラメータを伴う基板を覆って、第1のドープされたIII−V層を形成するステップと、
前記第1のドープされたIII−V層を覆って吸収体層を形成するステップであって、前記吸収体層は、
約0.7eV〜0.95eVの間のバンドギャップと、
室温で約1×1016cm−3未満のキャリア濃度と、
を有する、ステップと、
前記吸収体層を覆って第2のドープされたIII−V層を形成するステップと、
を含む、方法。 - 前記吸収体層は、希薄窒化物を備える、請求項16に記載の半導体。
- 前記希薄窒化物は、InxGa1−xNyAs1−y−zSbz(0≦x≦1;0≦y≦1;0≦z≦1)を備える、請求項17に記載の方法。
- 前記希薄窒化物は、InxGa1−xNyAs1−y−zSbz(0≦x≦0.55;0≦y≦0.1;0≦z≦0.1)を備える、請求項17に記載の方法。
- 前記吸収体層の前記キャリア濃度は、約5×1015cm−3未満である、請求項16に記載の方法。
- 前記吸収体層の前記キャリア濃度は、約1×1015cm−3未満である、請求項16に記載の方法。
- 前記吸収体層の厚さは、約2マイクロメートル〜約10マイクロメートルである、請求項16に記載の方法。
- 前記吸収体層の厚さは、約3マイクロメートル〜約5マイクロメートルである、請求項16に記載の方法。
- 前記吸収体層と前記第1および第2のドープされたIII−V層のうちの1つとの間に増倍層を形成するステップをさらに含む、請求項16に記載の方法。
- 前記基板は、GaAsを備える、請求項16に記載の方法。
- 前記基板は、
シリコン基板と、
前記シリコン基板を覆う格子工学層であって、前記シリコン基板の反対の前記格子工学層の表面は、GaAsに合致またはほぼ合致した格子パラメータを有する、格子工学層と、
を備える、請求項16に記載の方法。 - 前記格子工学層は、SixGe1−x層を備え、xは、前記シリコン基板の最近傍の前記SixGe1−x層の表面における1から、前記シリコン基板の反対の前記SixGe1−x層の表面における0まで段階的である、請求項26に記載の方法。
- 前記格子工学層は、希土類含有層を備え、前記希土類含有層は、Sc、Y、La、Ce、Pr、Nd、Pm、Sm、Eu、Gd、Tb、Dy、Ho、Er、Tm、Yb、および/またはLuのうちの1つもしくはそれを上回るものを備える、請求項26に記載の方法。
- 前記第1のドープされたIII−V層は、n型であり、前記第2のドープされたIII−V層は、p型である、請求項16に記載の方法。
- 前記第1のドープされたIII−V層は、p型であり、前記第2のドープされたIII−V層は、n型である、請求項16に記載の方法。
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EP3807938A1 (en) * | 2018-06-14 | 2021-04-21 | Array Photonics, Inc. | Optoelectronic devices having a dilute nitride layer |
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