JP2018513465A5 - - Google Patents

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Publication number
JP2018513465A5
JP2018513465A5 JP2017547488A JP2017547488A JP2018513465A5 JP 2018513465 A5 JP2018513465 A5 JP 2018513465A5 JP 2017547488 A JP2017547488 A JP 2017547488A JP 2017547488 A JP2017547488 A JP 2017547488A JP 2018513465 A5 JP2018513465 A5 JP 2018513465A5
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Japan
Prior art keywords
surface temperature
components
power limit
power
determining
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JP2017547488A
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Japanese (ja)
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JP2018513465A (ja
JP6595614B2 (ja
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Priority claimed from US14/641,510 external-priority patent/US9958921B2/en
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JP2017547488A 2015-03-09 2016-03-09 デバイスの表面温度に基づいて電力限界を変化させる電力管理 Active JP6595614B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/641,510 2015-03-09
US14/641,510 US9958921B2 (en) 2015-03-09 2015-03-09 Power management to change power limits based on device skin temperature
PCT/US2016/021495 WO2016145035A1 (en) 2015-03-09 2016-03-09 Power management to change power limits based on device skin temperature

Publications (3)

Publication Number Publication Date
JP2018513465A JP2018513465A (ja) 2018-05-24
JP2018513465A5 true JP2018513465A5 (cg-RX-API-DMAC7.html) 2019-04-18
JP6595614B2 JP6595614B2 (ja) 2019-10-23

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JP2017547488A Active JP6595614B2 (ja) 2015-03-09 2016-03-09 デバイスの表面温度に基づいて電力限界を変化させる電力管理

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Country Link
US (1) US9958921B2 (cg-RX-API-DMAC7.html)
EP (1) EP3268843B1 (cg-RX-API-DMAC7.html)
JP (1) JP6595614B2 (cg-RX-API-DMAC7.html)
KR (1) KR102648732B1 (cg-RX-API-DMAC7.html)
CN (1) CN107430037B (cg-RX-API-DMAC7.html)
WO (1) WO2016145035A1 (cg-RX-API-DMAC7.html)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106407143B (zh) * 2015-07-29 2020-07-31 南京中兴新软件有限责任公司 控制移动终端中cpu的热插拔操作的方法和装置
US10268262B2 (en) * 2015-08-02 2019-04-23 Dell Products, L.P. Dynamic peak power limiting to processing nodes in an information handling system
US20170160707A1 (en) * 2015-12-03 2017-06-08 Intel Corporation Method and apparatus for adjusting thermal thresholds
US10281975B2 (en) * 2016-06-23 2019-05-07 Intel Corporation Processor having accelerated user responsiveness in constrained environment
US10305292B2 (en) 2016-09-30 2019-05-28 Intel Corporation Methods, apparatus, systems and articles of manufacture to charge a battery based on an electronic device skin temperature
US10397733B2 (en) 2016-10-01 2019-08-27 Intel Corporation Sharing of environmental data for client device usage
US10649518B2 (en) * 2017-01-26 2020-05-12 Ati Technologies Ulc Adaptive power control loop
KR102325564B1 (ko) * 2017-03-08 2021-11-12 삼성전자주식회사 전자 장치의 동적 열 관리 방법
KR102474460B1 (ko) * 2017-08-23 2022-12-07 삼성전자 주식회사 전자 장치 및 전자 장치의 동작 제어 방법
CN110007745A (zh) * 2018-01-02 2019-07-12 合肥杰发科技有限公司 一种处理器的性能调节方法、存储装置及终端
WO2020145943A1 (en) * 2019-01-08 2020-07-16 Hewlett-Packard Development Company, L.P. Stabilizing performance of processing devices
US20220187885A1 (en) * 2019-09-06 2022-06-16 Hewlett-Packard Development Company, L.P. Controlling speed of cooling elements
NL2024020B1 (en) 2019-10-15 2021-06-17 Microsoft Technology Licensing Llc Dynamically switching display in use based on temperature
US20210181820A1 (en) * 2019-12-17 2021-06-17 Advanced Micro Devices, Inc. Processor skin temperature power management based on multiple external sensors
CN112476423B (zh) * 2020-11-12 2022-03-08 腾讯科技（深圳）有限公司 机器人的关节电机控制方法、装置、设备及存储介质
US20230400900A1 (en) * 2022-06-14 2023-12-14 Dell Products, L.P. Managing thermal and acoustic characteristics of an information handling system (ihs) based on the use of external peripheral devices
US12271251B2 (en) * 2022-11-22 2025-04-08 Microsoft Technology Licensing, Llc Computing system power burst limiting
US20250004832A1 (en) * 2023-06-29 2025-01-02 Intel Corporation Device, method, and system to provide a limited power states mode for managing processor operation
US20250306568A1 (en) * 2024-03-29 2025-10-02 Intel Corporation Apparatus and Method for Direct and Guaranteed Platform and Skin Temperature Control
JP7690105B1 (ja) * 2024-10-28 2025-06-09 レノボ・シンガポール・プライベート・リミテッド 電子機器および制御方法

Family Cites Families (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4634843A (en) 1986-01-16 1987-01-06 General Electric Company Dual mode power control arrangement for cooking appliance
US7324876B2 (en) * 2001-07-10 2008-01-29 Yingco Electronic Inc. System for remotely controlling energy distribution at local sites
DE102005012597A1 (de) 2004-10-07 2006-04-27 Techem Energy Services Gmbh & Co. Kg Verfahren zur Bestimmung eines Heizflächen-Versorgungszustands und Versorgungszustandsregelung
JP2006293814A (ja) * 2005-04-13 2006-10-26 Matsushita Electric Ind Co Ltd 温度制御装置
US7444526B2 (en) * 2005-06-16 2008-10-28 International Business Machines Corporation Performance conserving method for reducing power consumption in a server system
US7562234B2 (en) 2005-08-25 2009-07-14 Apple Inc. Methods and apparatuses for dynamic power control
US7733931B2 (en) * 2007-01-09 2010-06-08 Seiko Epson Corporation Light source device, projector device, monitor device, and lighting device
EP2023682A1 (en) * 2007-06-25 2009-02-11 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Method and system for predicting the power consumption of a mobile terminal
US8315746B2 (en) * 2008-05-30 2012-11-20 Apple Inc. Thermal management techniques in an electronic device
WO2010016440A1 (ja) * 2008-08-08 2010-02-11 シャープ株式会社 バックライトおよびこれを用いた表示装置
US8269734B2 (en) * 2009-03-19 2012-09-18 Microsoft Corporation Non-linguistic interaction with computer systems via surface stimulation
US8190939B2 (en) * 2009-06-26 2012-05-29 Microsoft Corporation Reducing power consumption of computing devices by forecasting computing performance needs
US8700925B2 (en) 2009-09-01 2014-04-15 Nvidia Corporation Regulating power using a fuzzy logic control system
US8826048B2 (en) 2009-09-01 2014-09-02 Nvidia Corporation Regulating power within a shared budget
US8768530B2 (en) 2010-06-04 2014-07-01 Apple Inc. Thermal zone monitoring in an electronic device
US8595517B2 (en) 2010-09-01 2013-11-26 Symbol Technologies, Inc. Thermal management of a mobile device with ventless housing
US9261949B2 (en) * 2010-10-29 2016-02-16 Advanced Micro Devices, Inc. Method for adaptive performance optimization of the soc
US8635044B2 (en) * 2011-04-27 2014-01-21 Advanced Micro Devices, Inc. Transient thermal modeling of multisource power devices
JP5803248B2 (ja) * 2011-05-06 2015-11-04 ソニー株式会社 情報処理装置、情報処理方法、及びプログラム
US9207730B2 (en) 2011-06-02 2015-12-08 Apple Inc. Multi-level thermal management in an electronic device
US9348656B2 (en) * 2011-12-19 2016-05-24 Advanced Micro Devices, Inc. Apparatus and method for managing power among a plurality of processors sharing a thermal platform
CN102591382B (zh) 2012-03-14 2018-02-27 中兴通讯股份有限公司 温度控制装置、方法与电子设备
US8972759B2 (en) 2012-06-29 2015-03-03 Qualcomm Incorporated Adaptive thermal management in a portable computing device including monitoring a temperature signal and holding a performance level during a penalty period
US20140111913A1 (en) 2012-10-20 2014-04-24 Cooler Master Co., Ltd. Protection structure applied to a hand-held electronic device
US9229503B2 (en) 2012-11-27 2016-01-05 Qualcomm Incorporated Thermal power budget allocation for maximum user experience
US20140163765A1 (en) * 2012-12-07 2014-06-12 Qualcomm Incorporated System and method for estimating ambient temperaure from a portable computing device
US9436240B2 (en) 2012-12-27 2016-09-06 Intel Corporation Electronic device having an active edge
US20140245028A1 (en) 2013-02-22 2014-08-28 Qualcomm Incorporated System and method for temperature driven selection of voltage modes in a portable computing device
US9037882B2 (en) 2013-02-27 2015-05-19 Qualcomm Incorporated System and method for thermal management in a portable computing device using thermal resistance values to predict optimum power levels
US9529397B2 (en) * 2013-03-01 2016-12-27 Qualcomm Incorporated Thermal management of an electronic device based on sensation model
KR20140128118A (ko) 2013-04-26 2014-11-05 삼성전자주식회사 애플리케이션 프로세서 및 이의 동적 온도 관리 방법
US9158358B2 (en) * 2013-06-04 2015-10-13 Qualcomm Incorporated System and method for intelligent multimedia-based thermal power management in a portable computing device
US20140358318A1 (en) 2013-06-04 2014-12-04 Mediatek Inc. Thermal control method and thermal control module applicable in a portable electronic device
US20140362518A1 (en) 2013-06-10 2014-12-11 Wei Huang Thermal management of a portable computing device
US9430014B2 (en) 2013-07-18 2016-08-30 Qualcomm Incorporated System and method for idle state optimization in a multi-processor system on a chip
US9720467B2 (en) 2013-08-09 2017-08-01 Qualcomm Incorporated Thermal mitigation adaptation for a mobile electronic device
US10025329B2 (en) 2013-08-21 2018-07-17 Google Technology Holdings LLC Method and apparatus for adjusting portable electronic device operation based on ambient temperature
US20150075186A1 (en) * 2013-09-18 2015-03-19 Qualcomm Incorporated Method of and an apparatus for maintaining constant phone skin temperature with a thermoelectric cooler and increasing allowable power/performance limit for die in a mobile segment
US20150095667A1 (en) 2013-09-27 2015-04-02 Gregory A. Nielsen Managing component performance
US9665143B2 (en) * 2014-01-06 2017-05-30 Intel Corporation Contextual platform power management
US20150241944A1 (en) * 2014-02-25 2015-08-27 International Business Machines Corporation Distributed power management with performance and power boundaries
JP6264127B2 (ja) * 2014-03-20 2018-01-24 富士通株式会社 電子機器、温度監視制御方法およびプログラム
US9280188B2 (en) * 2014-06-03 2016-03-08 Mediatek Inc. Thermal control method and thermal control system
US9575537B2 (en) * 2014-07-25 2017-02-21 Intel Corporation Adaptive algorithm for thermal throttling of multi-core processors with non-homogeneous performance states
US9791904B2 (en) * 2014-08-15 2017-10-17 Intel Corporation Balanced control of processor temperature
EP2993451B1 (en) * 2014-09-05 2017-10-11 Nxp B.V. Method of predicting an ambient temperature around a mobile device, computer program product and mobile device
US9690340B2 (en) 2014-09-25 2017-06-27 Intel Corporation System and method for adaptive thermal and performance management in electronic devices
US20160098334A1 (en) * 2014-10-03 2016-04-07 GameBench Limited Benchmarking mobile devices
US9582052B2 (en) * 2014-10-30 2017-02-28 Qualcomm Incorporated Thermal mitigation of multi-core processor

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