JP2018506455A5 - - Google Patents
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- Publication number
- JP2018506455A5 JP2018506455A5 JP2017545574A JP2017545574A JP2018506455A5 JP 2018506455 A5 JP2018506455 A5 JP 2018506455A5 JP 2017545574 A JP2017545574 A JP 2017545574A JP 2017545574 A JP2017545574 A JP 2017545574A JP 2018506455 A5 JP2018506455 A5 JP 2018506455A5
- Authority
- JP
- Japan
- Prior art keywords
- fluid
- fluid supply
- manifold
- supply holes
- row
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/US2015/017998 WO2016137490A1 (en) | 2015-02-27 | 2015-02-27 | Fluid ejection device with fluid feed holes |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019133241A Division JP6853309B2 (ja) | 2019-07-19 | 2019-07-19 | 流体供給孔を有する流体噴射装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2018506455A JP2018506455A (ja) | 2018-03-08 |
| JP2018506455A5 true JP2018506455A5 (enExample) | 2019-01-24 |
Family
ID=56789617
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017545574A Pending JP2018506455A (ja) | 2015-02-27 | 2015-02-27 | 流体供給孔を有する流体噴射装置 |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US10112408B2 (enExample) |
| EP (1) | EP3233500B1 (enExample) |
| JP (1) | JP2018506455A (enExample) |
| KR (2) | KR102193259B1 (enExample) |
| CN (2) | CN107206791B (enExample) |
| BR (1) | BR112017018055B1 (enExample) |
| ES (1) | ES2902251T3 (enExample) |
| PL (1) | PL3233500T3 (enExample) |
| TW (1) | TWI603855B (enExample) |
| WO (1) | WO2016137490A1 (enExample) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016137490A1 (en) * | 2015-02-27 | 2016-09-01 | Hewlett-Packard Development Company, L.P. | Fluid ejection device with fluid feed holes |
| EP3463810B1 (en) * | 2016-10-07 | 2021-12-01 | Hewlett-Packard Development Company, L.P. | Additive manufacturing system fluid ejector |
| CN109641462B (zh) * | 2016-11-01 | 2021-06-15 | 惠普发展公司，有限责任合伙企业 | 流体喷射装置 |
| US10780697B2 (en) | 2017-03-15 | 2020-09-22 | Hewlett-Packard Development Company, L.P. | Fluid ejection dies |
| WO2018186880A1 (en) * | 2017-04-07 | 2018-10-11 | Hewlett-Packard Development Company, L.P. | Microfluidic devices |
| US11155082B2 (en) | 2017-04-24 | 2021-10-26 | Hewlett-Packard Development Company, L.P. | Fluid ejection die |
| EP3573812B1 (en) * | 2017-05-01 | 2023-01-04 | Hewlett-Packard Development Company, L.P. | Molded panels |
| CN110891793B (zh) | 2017-07-31 | 2021-04-09 | 惠普发展公司，有限责任合伙企业 | 具有封闭式横向通道的流体喷射管芯 |
| WO2019027432A1 (en) * | 2017-07-31 | 2019-02-07 | Hewlett-Packard Development Company, L.P. | FLUIDIC EJECTION DEVICES WITH ENCLOSED TRANSVERSAL CHANNELS |
| CN111032359B (zh) * | 2017-09-20 | 2021-03-26 | 惠普发展公司，有限责任合伙企业 | 射流片、用于循环射流片内的流体的系统和流体流动结构 |
| EP3697616B1 (en) * | 2017-10-19 | 2023-03-15 | Hewlett-Packard Development Company, L.P. | Fluidic dies |
| JP6992191B2 (ja) | 2018-03-12 | 2022-01-13 | ヒューレット－パッカード デベロップメント カンパニー エル．ピー． | 流体吐出ダイ |
| EP3707003B1 (en) | 2018-03-12 | 2023-07-19 | Hewlett-Packard Development Company, L.P. | Nozzle arrangements and feed holes |
| EP3703953B1 (en) | 2018-03-12 | 2024-10-23 | Hewlett-Packard Development Company, L.P. | Nozzle arrangements |
| EP3703951B1 (en) | 2018-03-12 | 2024-02-14 | Hewlett-Packard Development Company, L.P. | Nozzle arrangements and supply channels |
| EP3781405B1 (en) * | 2018-09-27 | 2024-08-28 | Hewlett-Packard Development Company, L.P. | Carriers including fluid ejection dies |
| EP4610051A3 (en) * | 2019-01-09 | 2025-11-19 | Hewlett-Packard Development Company, L.P. | Fluid feed hole port dimensions |
| US11279130B2 (en) | 2019-04-29 | 2022-03-22 | Hewlett-Packard Development Company, L.P. | Fluidic dies with conductive members |
| WO2021054931A1 (en) | 2019-09-16 | 2021-03-25 | Hewlett-Packard Development Company, L.P. | Circulation paths for fluid dispensing devices |
| GB2593770B (en) * | 2020-04-02 | 2022-10-05 | Ttp Plc | Micro-nozzle |
| US11577513B2 (en) | 2020-10-06 | 2023-02-14 | Funai Electric Co., Ltd. | Photoimageable nozzle member for reduced fluid cross-contamination and method therefor |
| US12257837B2 (en) | 2020-10-23 | 2025-03-25 | Hewlett-Packard Development Company, L.P. | Interspersed fluidic elements and circuit elements in a fluidic die |
| GB202104736D0 (en) * | 2021-04-01 | 2021-05-19 | Ttp Plc | Micro-nozzle |
| CN113488423A (zh) * | 2021-07-01 | 2021-10-08 | 杭州中为光电技术有限公司 | 硅片周转机构 |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5463413A (en) | 1993-06-03 | 1995-10-31 | Hewlett-Packard Company | Internal support for top-shooter thermal ink-jet printhead |
| US5666143A (en) | 1994-07-29 | 1997-09-09 | Hewlett-Packard Company | Inkjet printhead with tuned firing chambers and multiple inlets |
| US5912685A (en) | 1994-07-29 | 1999-06-15 | Hewlett-Packard Company | Reduced crosstalk inkjet printer printhead |
| US5734399A (en) | 1995-07-11 | 1998-03-31 | Hewlett-Packard Company | Particle tolerant inkjet printhead architecture |
| US6007188A (en) | 1997-07-31 | 1999-12-28 | Hewlett-Packard Company | Particle tolerant printhead |
| JP2006281780A (ja) * | 2005-03-31 | 2006-10-19 | Oce Technologies Bv | インクジェットプリンタ |
| US8096643B2 (en) * | 2007-10-12 | 2012-01-17 | Hewlett-Packard Development Company, L.P. | Fluid ejection device |
| US8109607B2 (en) * | 2008-03-10 | 2012-02-07 | Hewlett-Packard Development Company, L.P. | Fluid ejector structure and fabrication method |
| JP2009220528A (ja) * | 2008-03-18 | 2009-10-01 | Toshiba Tec Corp | インクジェットヘッド |
| CN102015315B (zh) * | 2008-05-06 | 2014-04-30 | 惠普开发有限公司 | 打印头送给槽肋条 |
| JP5430167B2 (ja) | 2009-02-06 | 2014-02-26 | キヤノン株式会社 | 液体吐出ヘッド |
| JP5388615B2 (ja) | 2009-02-06 | 2014-01-15 | キヤノン株式会社 | インクジェット記録ヘッド |
| US8496317B2 (en) * | 2009-08-11 | 2013-07-30 | Eastman Kodak Company | Metalized printhead substrate overmolded with plastic |
| US8205965B2 (en) * | 2010-07-20 | 2012-06-26 | Hewlett-Packard Development Company, L.P. | Print bar structure |
| JP5826008B2 (ja) * | 2011-12-02 | 2015-12-02 | キヤノン株式会社 | インクジェット記録ヘッド、並びに該インクジェット記録ヘッドを用いた記録方法および吸引方法 |
| CN104470724B (zh) * | 2012-07-24 | 2016-04-27 | 惠普发展公司，有限责任合伙企业 | 具有颗粒容忍薄膜延伸部的流体喷射装置 |
| JP6066638B2 (ja) * | 2012-09-12 | 2017-01-25 | キヤノン株式会社 | 液体吐出ヘッド |
| CN105377560B (zh) * | 2013-02-28 | 2018-01-19 | 惠普发展公司，有限责任合伙企业 | 模制的流体流动结构 |
| EP3296113B1 (en) * | 2013-02-28 | 2019-08-28 | Hewlett-Packard Development Company, L.P. | Molded print bar |
| US9446587B2 (en) * | 2013-02-28 | 2016-09-20 | Hewlett-Packard Development Company, L.P. | Molded printhead |
| JP6202869B2 (ja) * | 2013-04-17 | 2017-09-27 | キヤノン株式会社 | 液体吐出ヘッド |
| DE112013006899T5 (de) * | 2013-04-30 | 2015-12-17 | Hewlett-Packard Development Company, L.P. | Fluidausstossvorrichtung mit Tintenzuführloch-Brücke |
| WO2016137490A1 (en) * | 2015-02-27 | 2016-09-01 | Hewlett-Packard Development Company, L.P. | Fluid ejection device with fluid feed holes |
-
2015
- 2015-02-27 WO PCT/US2015/017998 patent/WO2016137490A1/en not_active Ceased
- 2015-02-27 CN CN201580075034.XA patent/CN107206791B/zh active Active
- 2015-02-27 KR KR1020197012538A patent/KR102193259B1/ko not_active Expired - Fee Related
- 2015-02-27 BR BR112017018055-3A patent/BR112017018055B1/pt active IP Right Grant
- 2015-02-27 PL PL15883583T patent/PL3233500T3/pl unknown
- 2015-02-27 CN CN201810938923.XA patent/CN109080265B/zh not_active Expired - Fee Related
- 2015-02-27 KR KR1020177023603A patent/KR20170105108A/ko not_active Ceased
- 2015-02-27 JP JP2017545574A patent/JP2018506455A/ja active Pending
- 2015-02-27 ES ES15883583T patent/ES2902251T3/es active Active
- 2015-02-27 US US15/545,013 patent/US10112408B2/en active Active
- 2015-02-27 EP EP15883583.5A patent/EP3233500B1/en active Active
-
2016
- 2016-01-25 TW TW105102211A patent/TWI603855B/zh not_active IP Right Cessation
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