JP2018506455A5 - - Google Patents
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- Publication number
- JP2018506455A5 JP2018506455A5 JP2017545574A JP2017545574A JP2018506455A5 JP 2018506455 A5 JP2018506455 A5 JP 2018506455A5 JP 2017545574 A JP2017545574 A JP 2017545574A JP 2017545574 A JP2017545574 A JP 2017545574A JP 2018506455 A5 JP2018506455 A5 JP 2018506455A5
- Authority
- JP
- Japan
- Prior art keywords
- fluid
- fluid supply
- manifold
- supply holes
- row
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/US2015/017998 WO2016137490A1 (en) | 2015-02-27 | 2015-02-27 | Fluid ejection device with fluid feed holes |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019133241A Division JP6853309B2 (ja) | 2019-07-19 | 2019-07-19 | 流体供給孔を有する流体噴射装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2018506455A JP2018506455A (ja) | 2018-03-08 |
| JP2018506455A5 true JP2018506455A5 (enExample) | 2019-01-24 |
Family
ID=56789617
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017545574A Pending JP2018506455A (ja) | 2015-02-27 | 2015-02-27 | 流体供給孔を有する流体噴射装置 |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US10112408B2 (enExample) |
| EP (1) | EP3233500B1 (enExample) |
| JP (1) | JP2018506455A (enExample) |
| KR (2) | KR102193259B1 (enExample) |
| CN (2) | CN109080265B (enExample) |
| BR (1) | BR112017018055B1 (enExample) |
| ES (1) | ES2902251T3 (enExample) |
| PL (1) | PL3233500T3 (enExample) |
| TW (1) | TWI603855B (enExample) |
| WO (1) | WO2016137490A1 (enExample) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109080265B (zh) * | 2015-02-27 | 2020-10-27 | 惠普发展公司，有限责任合伙企业 | 具有流体喷射孔的流体喷射装置 |
| CN109476078B (zh) * | 2016-10-07 | 2021-02-26 | 惠普发展公司，有限责任合伙企业 | 增材制造系统流体喷射器 |
| EP3463902A4 (en) * | 2016-11-01 | 2020-06-03 | Hewlett-Packard Development Company, L.P. | Fluid ejection device |
| EP3538370B1 (en) * | 2017-03-15 | 2021-09-15 | Hewlett-Packard Development Company, L.P. | Fluid ejection dies |
| US11110453B2 (en) * | 2017-04-07 | 2021-09-07 | Hewlett-Packard Development Company, L.P. | Microfluidic devices |
| WO2018199896A1 (en) * | 2017-04-24 | 2018-11-01 | Hewlett-Packard Development Company, L.P. | Fluid ejection die |
| CN110461575B (zh) | 2017-05-01 | 2021-10-01 | 惠普发展公司，有限责任合伙企业 | 用于形成模制板的方法和流体喷射装置 |
| EP3609711B1 (en) | 2017-07-31 | 2024-06-12 | Hewlett-Packard Development Company, L.P. | Fluidic ejection dies with enclosed cross-channels |
| JP6971377B2 (ja) | 2017-07-31 | 2021-11-24 | ヒューレット−パッカード デベロップメント カンパニー エル.ピー.Hewlett‐Packard Development Company, L.P. | 内蔵された横断流路を備えた流体吐出デバイス |
| US11390075B2 (en) | 2017-09-20 | 2022-07-19 | Hewlett-Packard Development Company, L.P. | Fluidic dies |
| US11325385B2 (en) | 2017-10-19 | 2022-05-10 | Hewlett-Packard Development Company, L.P. | Fluidic dies |
| CN111556810B (zh) * | 2018-03-12 | 2021-12-03 | 惠普发展公司，有限责任合伙企业 | 流体喷射片 |
| CN111819082B (zh) | 2018-03-12 | 2022-01-07 | 惠普发展公司，有限责任合伙企业 | 喷嘴布置结构和供给孔 |
| WO2019177576A1 (en) | 2018-03-12 | 2019-09-19 | Hewlett-Packard Development Company, L.P. | Nozzle arrangements and supply channels |
| JP6992191B2 (ja) | 2018-03-12 | 2022-01-13 | ヒューレット－パッカード デベロップメント カンパニー エル．ピー． | 流体吐出ダイ |
| US11358390B2 (en) * | 2018-09-27 | 2022-06-14 | Hewlett-Packard Development Company, L.P. | Carriers including fluid ejection dies |
| CN113272146B (zh) * | 2019-01-09 | 2022-08-05 | 惠普发展公司，有限责任合伙企业 | 流体供给孔端口尺寸 |
| CN113710494B (zh) * | 2019-04-29 | 2023-05-30 | 惠普发展公司，有限责任合伙企业 | 具有导电构件的流体管芯 |
| WO2021054931A1 (en) | 2019-09-16 | 2021-03-25 | Hewlett-Packard Development Company, L.P. | Circulation paths for fluid dispensing devices |
| GB2593770B (en) * | 2020-04-02 | 2022-10-05 | Ttp Plc | Micro-nozzle |
| US11577513B2 (en) | 2020-10-06 | 2023-02-14 | Funai Electric Co., Ltd. | Photoimageable nozzle member for reduced fluid cross-contamination and method therefor |
| EP4232288B1 (en) * | 2020-10-23 | 2024-12-04 | Hewlett-Packard Development Company, L.P. | Interspersed fluidic elements and circuit elements in a fluidic die |
| GB202104736D0 (en) * | 2021-04-01 | 2021-05-19 | Ttp Plc | Micro-nozzle |
| CN113488426B (zh) * | 2021-07-01 | 2023-08-01 | 杭州中为光电技术有限公司 | 均分机构及脱胶装置 |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5463413A (en) | 1993-06-03 | 1995-10-31 | Hewlett-Packard Company | Internal support for top-shooter thermal ink-jet printhead |
| US5912685A (en) | 1994-07-29 | 1999-06-15 | Hewlett-Packard Company | Reduced crosstalk inkjet printer printhead |
| US5666143A (en) | 1994-07-29 | 1997-09-09 | Hewlett-Packard Company | Inkjet printhead with tuned firing chambers and multiple inlets |
| US5734399A (en) | 1995-07-11 | 1998-03-31 | Hewlett-Packard Company | Particle tolerant inkjet printhead architecture |
| US6007188A (en) | 1997-07-31 | 1999-12-28 | Hewlett-Packard Company | Particle tolerant printhead |
| JP2006281780A (ja) * | 2005-03-31 | 2006-10-19 | Oce Technologies Bv | インクジェットプリンタ |
| US8096643B2 (en) * | 2007-10-12 | 2012-01-17 | Hewlett-Packard Development Company, L.P. | Fluid ejection device |
| US8109607B2 (en) * | 2008-03-10 | 2012-02-07 | Hewlett-Packard Development Company, L.P. | Fluid ejector structure and fabrication method |
| JP2009220528A (ja) * | 2008-03-18 | 2009-10-01 | Toshiba Tec Corp | インクジェットヘッド |
| US8733902B2 (en) | 2008-05-06 | 2014-05-27 | Hewlett-Packard Development Company, L.P. | Printhead feed slot ribs |
| JP5430167B2 (ja) * | 2009-02-06 | 2014-02-26 | キヤノン株式会社 | 液体吐出ヘッド |
| JP5388615B2 (ja) * | 2009-02-06 | 2014-01-15 | キヤノン株式会社 | インクジェット記録ヘッド |
| US8496317B2 (en) * | 2009-08-11 | 2013-07-30 | Eastman Kodak Company | Metalized printhead substrate overmolded with plastic |
| US8205965B2 (en) * | 2010-07-20 | 2012-06-26 | Hewlett-Packard Development Company, L.P. | Print bar structure |
| JP5826008B2 (ja) * | 2011-12-02 | 2015-12-02 | キヤノン株式会社 | インクジェット記録ヘッド、並びに該インクジェット記録ヘッドを用いた記録方法および吸引方法 |
| US9352568B2 (en) * | 2012-07-24 | 2016-05-31 | Hewlett-Packard Development Company, L.P. | Fluid ejection device with particle tolerant thin-film extension |
| JP6066638B2 (ja) * | 2012-09-12 | 2017-01-25 | キヤノン株式会社 | 液体吐出ヘッド |
| PT2825386T (pt) * | 2013-02-28 | 2018-03-27 | Hewlett Packard Development Co | Estrutura de escoamento de fluido moldado |
| EP2961614B1 (en) * | 2013-02-28 | 2020-01-15 | Hewlett-Packard Development Company, L.P. | Molded print bar |
| US9446587B2 (en) * | 2013-02-28 | 2016-09-20 | Hewlett-Packard Development Company, L.P. | Molded printhead |
| JP6202869B2 (ja) * | 2013-04-17 | 2017-09-27 | キヤノン株式会社 | 液体吐出ヘッド |
| GB2527476B (en) * | 2013-04-30 | 2020-11-25 | Hewlett Packard Development Co | Fluid ejection device with ink feedhole bridge |
| CN109080265B (zh) * | 2015-02-27 | 2020-10-27 | 惠普发展公司，有限责任合伙企业 | 具有流体喷射孔的流体喷射装置 |
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2015
- 2015-02-27 CN CN201810938923.XA patent/CN109080265B/zh active Active
- 2015-02-27 US US15/545,013 patent/US10112408B2/en active Active
- 2015-02-27 KR KR1020197012538A patent/KR102193259B1/ko not_active Expired - Fee Related
- 2015-02-27 CN CN201580075034.XA patent/CN107206791B/zh active Active
- 2015-02-27 BR BR112017018055-3A patent/BR112017018055B1/pt active IP Right Grant
- 2015-02-27 PL PL15883583T patent/PL3233500T3/pl unknown
- 2015-02-27 ES ES15883583T patent/ES2902251T3/es active Active
- 2015-02-27 JP JP2017545574A patent/JP2018506455A/ja active Pending
- 2015-02-27 WO PCT/US2015/017998 patent/WO2016137490A1/en not_active Ceased
- 2015-02-27 KR KR1020177023603A patent/KR20170105108A/ko not_active Ceased
- 2015-02-27 EP EP15883583.5A patent/EP3233500B1/en active Active
-
2016
- 2016-01-25 TW TW105102211A patent/TWI603855B/zh not_active IP Right Cessation