JP2018200990A - Electronic apparatus - Google Patents

Abstract

To provide an electronic apparatus in which a ceramic substrate can be mounted such that constraints on mounting positions of components are alleviated.SOLUTION: An electronic apparatus 1 includes a ceramic substrate 20 having a first surface 11 and a housing 40 for housing the ceramic substrate 20. The ceramic substrate 20 has a recess 20 having a bottom surface 21 at a predetermined depth when viewed from the first surface 11. A component 30 having a height equal to or less than a predetermined depth is mounted on the bottom surface 21 of the recess 20. The ceramic substrate 20 is bonded to the housing 40 at least on a part of the first surface 11.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an electronic device.

  Conventionally, a configuration is known in which a ceramic substrate that is easily damaged by an external force is screwed to a housing via a mounting bracket, or is joined to the housing by an adhesive (for example, see Patent Documents 1 and 2). .

Japanese Patent Laid-Open No. 61-234098 JP-A-11-98034

  When the ceramic substrate is screwed to the casing via the mounting bracket, the mounting position of the components in the casing can be limited by the presence of the mounting bracket. When the ceramic substrate is bonded to the housing with an adhesive, the mounting position of the circuit components on the ceramic substrate can be limited in order to secure the bonding area.

  An object of the present invention made in view of such circumstances is to provide an electronic device on which a ceramic substrate can be mounted so that restrictions on mounting positions of components are relaxed.

  An electronic apparatus according to an embodiment of the present disclosure includes a ceramic substrate having a first surface and a housing that houses the ceramic substrate. The ceramic substrate includes a recess having a bottom surface at a predetermined depth when viewed from the first surface. A component having a height less than or equal to the predetermined depth is mounted on the bottom surface of the recess. The ceramic substrate is bonded to the housing at at least a part of the first surface.

  An electronic device according to an embodiment of the present disclosure can mount a ceramic substrate so that restrictions on the mounting position of components are relaxed.

It is sectional drawing which shows an example of a structure of the electronic device which concerns on one Embodiment. It is the top view seen from the (A) 1st surface side which shows an example of a structure of a board | substrate, and (B) AA sectional drawing. It is sectional drawing of the electronic device which concerns on a comparative example. It is sectional drawing which shows an example of a structure by which a heat-transfer member is provided between components and a housing | casing. They are (A) the top view seen from the 1st surface side which shows an example of the board | substrate which has a some recessed part, and (B) BB sectional drawing. It is the top view in which the housing | casing was abbreviate | omitted and seen from the (A) 1st surface side which shows the structural example of the electrostatic shield of a recessed part, and (C) CC sectional drawing including a housing | casing.

  As shown in FIG. 1, the electronic device 1 according to an embodiment includes a substrate 10, a component 30, and a housing 40. The substrate 10 has a first surface 11 and a second surface 12 located on the opposite side of the first surface 11. The substrate 10 has a recess 20 on the first surface 11 side. The component 30 is mounted in the recess 20 of the substrate 10. One component 30 may be mounted in one recess 20, or two or more components 30 may be mounted. The housing 40 accommodates the substrate 10. The housing 40 has a bonding surface 41 on the side facing the substrate 10. The substrate 10 and the housing 40 are bonded to each other by at least a part of the first surface 11 and a bonding surface 41 facing the first surface 11. In other words, the substrate 10 is bonded to the housing 40 at at least a part of the first surface 11.

  The first surface 11 and the bonding surface 41 may be bonded with an adhesive such as a photocurable resin or a thermosetting resin. In other words, the substrate 10 may be bonded to the housing 40 via an adhesive.

  An electronic circuit that realizes at least a part of the operation of the electronic device 1 is mounted on the substrate 10. The substrate 10 may include electronic circuit wiring. The wiring may be made of various metals such as tungsten, copper or silver. The wiring may be formed by a metallization process. The component 30 may constitute at least a part of an electronic circuit. The component 30 may be an IC (Integrated Circuit) or the like, or may be various electronic components such as a transistor, a diode, a capacitor, or a resistor.

  The substrate 10 may be a ceramic substrate configured to include a ceramic material. Ceramic materials can be easily damaged by external forces. The substrate 10 is not limited to a ceramic material, and may include a material that is easily damaged by an external force. Ceramic materials can have a relatively high thermal conductivity. The substrate 10 is not limited to a ceramic material, and may include a material having a relatively high thermal conductivity. The electronic device 1 according to the present embodiment includes a ceramic substrate as the substrate 10.

  The substrate 10 may be configured as an integrated multilayer substrate by firing the laminated ceramic layers. The substrate 10 may be configured as an integrated multilayer wiring board by including a ceramic layer on which wiring is formed. The substrate 10 may be configured as a hollow substrate integral with the cavity by including a ceramic layer having holes.

  The housing 40 may be made of metal or resin.

  As shown in FIGS. 2A and 2B, the recess 20 has a bottom surface 21 and side surfaces 22. The recess 20 is surrounded by the edge 23. The edge 23 may include the first surface 11 and the side surface 22. The edge portion 23 may have a predetermined width when viewed from the first surface 11 side. The recess 20 can correspond to a cavity.

  The recess 20 has a bottom surface 21 at a predetermined depth when viewed from the first surface 11. The predetermined depth is represented by d. In other words, the first surface 11 and the bottom surface 21 are separated by a predetermined distance represented by d. The predetermined depth is also referred to as the depth of the recess 20. The component 30 is assumed to have a height represented by h. The height of the component 30 can be specified by the distance from the surface on the side mounted on the substrate 10 to the surface on the opposite side.

  The height (h) of the component 30 may be lower than the depth (d) of the recess 20 in which the component 30 is mounted. In other words, the depth (d) of the recess 20 may be deeper than the height (h) of the component 30 mounted in the recess 20. With this configuration, a predetermined clearance can be provided between the component 30 and the housing 40.

  The height (h) of the component 30 may be equal to the depth (d) of the recess 20 in which the component 30 is mounted. In other words, the depth (d) of the recess 20 may be equal to the height (h) of the component 30 mounted in the recess 20. By being configured in this way, the component 30 can contact the housing 40 without applying stress to the housing 40.

  As shown in FIG. 3, the electronic device 9 according to the comparative example includes a substrate 90, a component 91 mounted on the substrate 90, and a housing 92. The housing 92 has ribs 93. Unlike the substrate 10 of the present embodiment, the substrate 90 does not have a configuration corresponding to the recess 20. The height of the rib 93 is made higher than the height of the component 91 so that the component 91 does not hit the housing 92 and apply stress to the housing 92. The substrate 90 is joined to the housing 92 via the rib 93.

  The electronic device 9 according to the comparative example is bonded to the rib 93 on the surface of the substrate 90 where the component 91 is mounted. When the substrate 90 and the rib 93 are joined with an adhesive, the adhesive may be applied to the surface on which the component 91 is mounted and spread to the position of the component 91. In order to suppress the spread of the adhesive, the width of the rib 93 is widened, or a groove portion serving as an adhesive reservoir is provided in the vicinity of the rib 93. In this case, the area where the component 91 can be mounted on the substrate 90 is reduced.

  On the other hand, in the electronic device 1 according to this embodiment, even when the substrate 10 is bonded to the housing 40 with an adhesive, the adhesive is applied to the first surface 11 instead of the bottom surface 21 on which the component 30 is mounted. . In this case, the possibility that the adhesive spreads to the position of the component 30 is low. Therefore, the component 30 can be mounted to a position very close to the side surface 22. In the electronic device 1 according to the present embodiment, the region where the component 30 can be mounted can be made wider than that in the electronic device 9 according to the comparative example. As a result, the restriction on the position where the component 30 is mounted can be relaxed.

  In the electronic device 9 according to the comparative example, when the rib 93 is made of resin, the thermal resistance from the substrate 90 to the housing 92 via the rib 93 may increase. On the other hand, in the electronic device 1 according to the present embodiment, the thermal resistance from the substrate 10 to the housing 40 can be reduced by the direct contact between the substrate 10 including the edge 23 and the housing 40. In the substrate 10, even when the width of the edge 23 viewed from the first surface 11 side is narrow, the edge 23 is made of a material such as ceramic having a relatively high thermal conductivity like the substrate 10. The thermal resistance at the edge 23 can be reduced.

  In the electronic device 1 according to the present embodiment, when the height (h) of the component 30 is equal to the depth (d) of the recess 20 in which the component 30 is mounted, the component 30 is directly attached to the housing 40. Can touch. In this case, the heat generated in the component 30 can be dissipated through the substrate 10 and directly to the housing 40. As a result, heat is easily dissipated from the substrate 10.

  As shown in FIG. 4, the component 30 may contact the housing 40 via the heat transfer member 50. The heat transfer member 50 may be a member having a relatively high thermal conductivity. The heat transfer member 50 may be a solid heat transfer sheet. The heat transfer member 50 may be a paste. The heat transfer member 50 may be an adhesive such as a photocurable resin or a thermosetting resin. The heat transfer member 50 is not limited to these, and may be members of various modes.

  The heat transfer member 50 may have elasticity in the thickness direction. In this case, the housing 40 may include a claw portion 43 that supports the substrate 10 on the second surface 12 side. The nail | claw part 43 may have elasticity and may be comprised by the leaf | plate spring etc., for example.

  When the component 30 contacts the housing 40 via the heat transfer member 50, the heat generated by the component 30 can be dissipated to the housing 40 via the heat transfer member 50. As a result, heat is easily dissipated from the substrate 10.

  As shown in FIGS. 5A and 5B, the substrate 10 may have recesses 20a, 20b, and 20c. The recesses 20a, 20b, and 20c are collectively referred to as the recesses 20. That is, the substrate 10 may have a plurality of recesses 20. The depths of the recesses 20a, 20b, and 20c are represented by d1, d2, and d3. Each of d1, d2, and d3 may be the same value or may be different from each other. The number of the recesses 20 included in the substrate 10 is not limited to three, and may be two or four or more.

  Components 30a, 30b and 30c may be mounted in the recesses 20a, 20b and 20c, respectively. The parts 30a, 30b, and 30c are collectively referred to as the part 30. The height of each of the components 30a, 30b, and 30c is represented by h1, h2, and h3. h1, h2, and h3 may be smaller than d1, d2, and d3, respectively, or may be equal to d1, d2, and d3. That is, the height of each of the plurality of recesses 20 can be designed according to the height of the component 30 mounted thereon. In each of the plurality of recesses 20, the bottom surface 21 is positioned at a depth corresponding to the height of the component 30 mounted thereon.

  One component 30 may be mounted in each of the recesses 20a, 20b, and 20c, and two or more components may be mounted. There may be a recess 20 in which the component 30 is not mounted.

  Since the substrate 10 has a plurality of recesses 20, the edge 23 can be provided between the recesses 20 and can also be provided near the center of the first surface 11. As a result, the heat of the substrate 10 is easily dissipated to the housing 40 via the edge 23. When there are a plurality of components 30 with a large amount of heat generation, each component 30 is easily dissipated by being mounted in different recesses 20.

  By designing the height of each of the plurality of recesses 20 according to the height of the component 30, the height of each component 30 viewed from the first surface 11 can be made substantially the same. As a result, the component 30 and the housing 40 are easily contacted directly. When the heat transfer member 50 is provided between the component 30 and the housing 40, the thickness of the heat transfer member 50 can be made substantially the same. As a result, the configuration of the heat transfer member 50 can be simplified or shared.

  As shown in FIGS. 6A and 6B, the substrate 10 may include a conducting portion 13 on the edge 23 located around the recess 20. The conducting portion 13 may be configured by laminating wiring provided in the ceramic layer. The conducting portion 13 may be configured by laminating vias provided in the ceramic layer. As shown in FIG. 6 (A), the conducting portion 13 may be located not only continuously around the recess 20 but also discretely around the recess 20.

  In FIG. 6A, the housing 40 is omitted. As shown in FIG. 6B, the housing 40 may include a conduction portion 42 on the joint surface 41 side. The conduction part 42 may be a thin film made of a conductor such as metal. The conduction part 42 may be formed by a method such as metal insert molding. The conduction part 42 may be provided so as to contact the conduction part 13 of the substrate 10.

  By providing the conductive portions 13 and 42, the component 30 mounted in the recess 20 is surrounded by a conductive member. When the conductive member functions as an electrostatic shield, the component 30 is less susceptible to external noise. As a result, a shield case for electrostatically shielding the substrate 10 may not be provided. By providing the conductive portion 42 in the housing 40, heat is easily dissipated to the housing 40.

  A component 30 that generates a relatively large amount of heat may be mounted in the recess 20. On the other hand, the component 30 that generates a relatively small amount of heat may be mounted on the second surface 12 side where there is no recess 20. By doing so, heat is easily dissipated from the substrate 10.

  The substrate 10 may have a recess 20 not only on the first surface 11 side but also on the second surface 12 side. In this case, the component 30 may be mounted in the recess 20 on the second surface 12 side. By doing in this way, the restrictions on the mounting position of the component 30 can be more relaxed. The substrate 10 may be bonded to the housing 40 not only on the first surface 11 side but also on the second surface 12 side. By doing so, heat is easily dissipated from the substrate 10.

  The electronic device 1 according to the present disclosure may be mounted on the imaging unit. The electronic device 1 according to the present disclosure may be mounted on a moving body. The electronic device 1 according to the present disclosure may be mounted on a moving body as an imaging unit. The “mobile body” in the present disclosure includes a vehicle, a ship, and an aircraft. “Vehicle” in the present disclosure includes, but is not limited to, automobiles and industrial vehicles, and may include railway vehicles, domestic vehicles, and fixed-wing aircraft that run on the runway. The automobile includes, but is not limited to, a passenger car, a truck, a bus, a two-wheeled vehicle, a trolley bus, and the like, and may include other vehicles that travel on the road. Industrial vehicles include industrial vehicles for agriculture and construction. Industrial vehicles include but are not limited to forklifts and golf carts. Industrial vehicles for agriculture include, but are not limited to, tractors, tillers, transplanters, binders, combines, and lawn mowers. Industrial vehicles for construction include, but are not limited to, bulldozers, scrapers, excavators, cranes, dump trucks, and road rollers. Vehicles include those that travel by human power. The vehicle classification is not limited to the above. For example, an automobile may include an industrial vehicle capable of traveling on a road, and the same vehicle may be included in a plurality of classifications. Ships in the present disclosure include marine jets, boats, and tankers. The aircraft in the present disclosure includes fixed wing aircraft and rotary wing aircraft.

  The figure explaining embodiment concerning this indication is typical. The dimensional ratios and the like on the drawings do not necessarily match the actual ones.

  Although the embodiments according to the present disclosure have been described based on the drawings and examples, it should be noted that those skilled in the art can easily make various changes or modifications based on the present disclosure. Accordingly, it should be noted that these variations or modifications are included in the scope of the present disclosure. For example, functions included in each component or step can be rearranged so as not to be logically contradictory, and a plurality of components or steps can be combined into one or divided. It is. Although the embodiment according to the present disclosure has been described centering on an apparatus, the embodiment according to the present disclosure can also be realized as a method including steps executed by each component of the apparatus. The embodiment according to the present disclosure can also be realized as a method, a program, or a storage medium storing a program executed by a processor included in the apparatus. It should be understood that these are included within the scope of the present disclosure.

  In the present disclosure, descriptions such as “first” and “second” are identifiers for distinguishing the configuration. The configurations distinguished by the description of “first” and “second” in the present disclosure can exchange numbers in the configurations. For example, the first side can exchange the identifiers “first” and “second” with the second side. The identifier exchange is performed at the same time. The configuration is distinguished even after the identifier is exchanged. The identifier may be deleted. The configuration from which the identifier is deleted is distinguished by a code. Based on only the description of identifiers such as “first” and “second” in the present disclosure, it should not be used as an interpretation of the order of the configuration, or as a basis for the existence of identifiers with smaller numbers.

DESCRIPTION OF SYMBOLS 1 Electronic device 10 Board | substrate 11 1st surface 12 2nd surface 13 Conductive part 20 (20a, 20b, 20c) Recessed part 21 Bottom face 22 Side surface 30 (30a, 30b, 30c) Parts 40 Housing | casing 41 Joining surface 42 Conductive part 43 Claw part 50 Heat transfer member

Claims (6)

A ceramic substrate having a first surface; and a housing for accommodating the ceramic substrate;
The ceramic substrate includes a recess having a bottom surface at a predetermined depth when viewed from the first surface,
A component having a height equal to or less than the predetermined depth is mounted on the bottom surface of the recess,
The ceramic substrate is an electronic device that is joined to the housing at least at a part of the first surface.   The electronic device according to claim 1, wherein the ceramic substrate is bonded to the housing via an adhesive.   The electronic device according to claim 1, wherein the component contacts the housing directly or via a heat transfer member.   The electronic device according to claim 1, wherein the ceramic substrate includes a plurality of the recesses. The component is mounted on the bottom surface of each of the plurality of recesses,
5. The electronic device according to claim 4, wherein the bottom surfaces of the plurality of recesses are located at a depth corresponding to a height of a component to be mounted.   The electronic device according to any one of claims 1 to 5, wherein the casing includes a metal that contacts a conductive portion located around a recess of the ceramic substrate.

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