JP2018200528A - Ic module, ic card, and manufacturing method of them - Google Patents

Abstract

To provide an IC card which has high reliability, high productivity, high cost superiority, and excellent appearance by using solder capable of connecting an IC module and an antenna with higher strength.SOLUTION: An IC module comprises a substrate (11) having a conductive foil (13) on only one face. The conductive foil forms an external connection terminal (2) used for contact type communication, and a bridge circuit (3) which electrically connects the IC chip and an antenna for contactless communication. The substrate has a through hole (4). A first construction (15) is formed at the through hole from the rear face of the bridge circuit. A second construction (16) different from the first construction is formed at a face of the first construction opposite to the bridge circuit. A melting point of the second construction is lower than the melting point of the first construction.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an IC module, an IC card, and a manufacturing method thereof. More specifically, the present invention relates to a dual IC card having both a contact communication function and a non-contact communication function, an IC module for the dual IC card, and a manufacturing method thereof.

  The dual IC card is a card that satisfies both the contact communication function and the non-contact communication function with a single IC chip, and can be used for various applications depending on the user's application. (See, for example, Patent Documents 1 and 2).

  In a dual IC card, for example, contact communication is used in applications that require certainty and safety, such as exchange of a large amount of data such as credits and communication of settlement work. On the other hand, authentication is the main communication content such as entrance / exit gate management, and contactless communication is used in applications where the amount of communication data is small.

  The dual IC card is advantageous in terms of cost compared to a hybrid card equipped with a dedicated IC chip for contact communication and non-contact communication. Further, only dual IC cards can provide a common service such as a point service for contact use and non-contact use.

  In a dual IC card, an IC module having an IC chip having a contact communication function and a non-contact communication function, and an antenna (coil) built in the card body for non-contact communication are made of conductive connection members such as solder. Generally, a physical connection method is used.

  Unlike this method, there is an electromagnetic coupling method in which the IC module and the card body are electrically connected by electromagnetic coupling. An IC module equipped with an IC chip having a contact communication function and a non-contact communication function is attached to a card body capable of power supply and communication with the IC module by electromagnetic coupling (electromagnetic coupling, transformer coupling, etc.). Used as a dual IC card.

  By electrically connecting the IC module and the card body by electromagnetic coupling, it is possible to suppress the unstable electrical connection between the IC module and the card body. This is because when the IC module and the card body are directly connected by a conductive connecting member such as solder, the connecting member may be damaged when the dual IC card is bent.

  As such a dual IC card in which the IC module and the card body are electrically connected by electromagnetic coupling as described above, for example, the one described in Patent Document 3 is known. An IC module for a dual IC card has a contact communication terminal (external connection terminal) with a contact-type external device formed on the front surface, and a contact coil for non-contact communication formed on the back surface.

  The card body is formed with a coupling coil for electromagnetic coupling with a connection coil for non-contact communication provided in the IC module. The change in magnetic flux induced by the coupling coil of the card body is converted into a current by the contact coil for non-contact communication on the back surface of the IC module, and the IC chip of the IC module is driven by the generated current to perform communication.

  Patent Document 4 discloses an IC module in which a substrate has a through hole, and an external connection terminal and an antenna are connected by metal (solder) through the through hole.

  Further, Patent Documents 5 and 6 are processes for integrating the external connection terminal board into the card body, and at the same time as the integration by thermal pressure, the connection portion and the solder bump provided on the back surface of the external connection terminal board are connected via the connection member. By connecting them electrically, it is disclosed that they can be securely connected and a dual IC card with stable quality can be provided.

JP 2000-182017 A Japanese Unexamined Patent Publication No. 2000-227954 International Publication No. 99/26195 JP2015-114754A JP 2009-182212 A JP 2011-107865 A

  A dual IC card is usually composed of an IC module and an antenna on the card side. In an IC module used for a dual IC card, a resin-based bonding material such as a silver pace bag is generally used as a conductive bonding material for connecting the IC module and the card-side antenna. In order to increase the strength of the joint between the IC module and the card-side antenna, the joint material is soldered.

  When soldering a bonding material at the joint between the IC module and the antenna on the card side, the card on the back surface of the IC module is heated via the glass epoxy constituting the IC module by heating the front side of the IC module. Heat is transferred to the joint (connecting terminal) with the antenna on the side. Therefore, it is difficult to easily melt the solder.

  If the heating temperature is increased or the heating time is lengthened in order to completely melt the solder, a card made of a plastic base material is deformed, causing a problem in appearance. Also, depending on the type of adhesive that bonds the IC module and card to be used, the adhesive may deteriorate due to heat and cause the IC module to drop off.

  Solder can also be easily melted by the configuration of the IC module shown in Patent Document 4, but in this configuration, a double-sided board having a conductive foil on both sides of a glass epoxy board (glass epoxy board) is used. Each conductor foil is connected by vias such as through holes. Therefore, there is a demerit that the substrate itself is expensive, and in the process of connecting the IC module to the antenna, it is necessary to apply cream solder, and there is a problem that productivity is lowered.

  Further, cream solder is generally used as the solder for connecting the IC module and the card-side antenna, and an application process using a dispenser or the like is required. Accordingly, it is necessary to use a facility having a dedicated dispenser to manufacture with the solder amount accurately controlled in order to eliminate the protrusion of solder while stably connecting. Although it is possible to use equipment of a type that does not use cream solder and does not use a dispenser, special equipment is also required in this case.

  The structure of the IC module shown in Patent Document 3 can also be manufactured by the same manufacturing process as that of the contact IC card. In this structure, both sides of the glass epoxy substrate having conductor foil are used as the IC module substrate. Since a substrate is used and each conductor foil is connected by vias such as through holes, there is a demerit that the substrate itself is expensive.

  The present invention has been made in view of the above circumstances, uses a solder that can connect an IC module and an antenna with high strength, has high reliability, has high productivity and cost advantage, and has an excellent appearance. The purpose is to provide.

  In order to solve the above problems, an IC module according to one embodiment of the present invention is an IC module including a substrate having a conductive foil only on one side, and the conductive foil is an external device used for contact communication. A connection terminal and a bridge circuit for performing electrical connection between the IC chip and the antenna for non-contact communication are formed, the substrate has a through-hole, and the through-hole is formed from the back surface of the bridge circuit. A first structure is formed, and a second structure different from the first structure is formed on a surface of the first structure opposite to the bridge circuit, and the second structure The melting point of the structure is lower than the melting point of the first structure.

  The first structure and the second structure may be solders having different melting points.

  The first structure may protrude from the back surface of the substrate.

  In the first structure or the second structure, a surface opposite to the bridge circuit may be flat.

  An IC card according to one embodiment of the present invention includes an IC chip having both a contact communication function and a non-contact communication function, an antenna that is electrically connected to the IC chip and performs non-contact communication, and only on one side. An IC module comprising a substrate having conductor foil and mounting the IC chip, wherein the conductor foil is an external connection terminal used for contact communication, and electrical connection between the IC chip and the antenna. The substrate has a through-hole, and a first structure is formed in the through-hole from the back surface of the bridge circuit, and the first structure and the antenna Are connected by a second structure different from the first structure, and the melting point of the second structure is lower than the melting point of the first structure.

  An IC module manufacturing method according to an aspect of the present invention is a method of manufacturing an IC module from a substrate having a conductive foil only on one side, and the external connection terminal used for contact communication in the conductive foil; Forming a bridge circuit for performing electrical connection between the IC chip and the antenna for non-contact communication, providing a through hole in the substrate, and in the through hole, from the back surface of the bridge circuit; Forming a first structure, and forming a second structure different from the first structure on a surface of the first structure opposite to the bridge circuit, the first structure The melting point of the two structures is lower than the melting point of the first structure.

  An IC card manufacturing method according to an aspect of the present invention is a method of manufacturing an IC card from a substrate having a conductive foil only on one side, and the external connection terminal used for contact communication in the conductive foil; Forming a bridge circuit for performing electrical connection between the IC chip and the antenna for non-contact communication, providing a through hole in the substrate, and in the through hole, from the back surface of the bridge circuit; Forming a first structure, and connecting the first structure and the antenna with a second structure different from the first structure, wherein the melting point of the second structure is The melting point of the first structure is lower.

  According to each aspect of the present invention, by using solder that can connect an IC module and an antenna with high strength, a dual IC card having high reliability, high productivity, high cost advantage, and excellent appearance is provided. can do.

  Moreover, according to each aspect of the present invention, it is not necessary to use a double-sided board and a double-sided board having vias in a dual IC card, and a general contact IC card is not used without using a normal dual IC card dedicated facility. Since it can be manufactured by equipment, the productivity of the dual IC card can be improved and the cost of the dual IC card can be reduced.

It is a bottom view of the IC module for dual IC cards based on one Embodiment of this invention. It is a bottom view which shows the antenna joining state of the IC module for dual IC cards based on one Embodiment of this invention. It is sectional drawing of the IC module for dual IC cards based on one Embodiment of this invention. It is sectional drawing which shows the various forms of the solder structure of the IC module for dual IC cards based on one Embodiment of this invention.

  Hereinafter, a dual IC card according to an embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 is a bottom view of an IC module for a dual IC card (dual interface IC module) according to an embodiment of the present invention. FIG. 2 is a bottom view showing an antenna joined state of the IC module of FIG. FIG. 3 is a cross-sectional view of the IC module of FIG.

  A dual IC card according to an embodiment of the present invention includes a dual interface having an antenna circuit embedded between a plurality of card bases and a dual interface IC module having both a contact communication function and a non-contact communication function. IC card. Here, as the card base material, a material having general insulation and durability as the card base material such as polyvinyl chloride (PVC) and polyethylene terephthalate copolymer (PET-G) is used.

  The dual interface IC module is equipped with an IC chip 1 having both a contact communication function and a non-contact communication function. On the surface of the IC module, there are an external connection terminal 2 used for contact communication and a bridge circuit pattern 3 (non-contact function bridge portion) for electrical connection from the IC chip to the antenna for non-contact communication. And are arranged. On the back surface of the IC module, an antenna connecting solder structure (first structure) 15 used for non-contact communication and connected to the antenna on the card body side via a bridge circuit on the front surface is disposed.

  The external connection terminal 2 and the bridge circuit 3 on the surface of the IC module are etched after laminating a copper foil having a thickness of 10 to 50 μm on one surface of an insulating base material such as glass epoxy or PET having a thickness of 50 to 200 μm. Is formed by dividing into a plurality of copper foil patterns.

  The exposed portion of the copper foil pattern on the surface of the IC module is plated with nickel of 0.5 to 3 μm, and further plated with gold of 0.01 to 0.3 μm. In addition, the structure of plating is not limited to this.

  Holes 4 and 5 having a diameter of 0.5 to 1.5 mm connected from the external connection terminal 2 and the bridge circuit pattern 3 to the back surface of the IC module are formed in the insulating card base. In addition, although the shape of the hole in a figure is a round shape seeing from the top, the shape of a hole is not limited to a round shape. There are two or more holes for one bridge circuit 3. One of the holes becomes a bonding hole 5 used for connection from the IC chip 1 to the bridge circuit 3 by wire bonding. A bonding wire 6 connected from the IC chip 1 to the bridge circuit 3 is passed through the bonding hole 5.

  In the holes 4 other than the bonding holes 5, an antenna connecting solder structure 15 used for non-contact communication and connected to the antenna on the card body side via the bridge circuit 3 on the surface is formed. The antenna connection solder structure 15 is formed by filling the hole 4 connected to the back surface of the bridge circuit pattern 3 with cream solder by a method such as screen printing and then reflowing.

  The solder used for the solder structure 15 is one that does not melt with heat (generally about 150 to 200 ° C.) when the IC module is mounted. For example, a general Sn-based alloy with a melting point of about 200 ° C. or higher is used.

  After the solder structure 15 is formed, the surface of the solder structure 15 is flattened by a method such as polishing the upper surface of the solder structure 15, and the solder structure 15 that cannot be accurately controlled by screen printing is used. To accurately control the height. The solder structure 15 has a height that fills 50% of the holes 4 forming the solder structure 15 (this is a height that does not protrude from the back surface of the glass epoxy substrate 11), and is 50 μm from the back surface of the glass epoxy substrate 11 at the maximum. What is necessary is just the height which protrudes. Preferably, the solder structure 15 may slightly protrude from the back surface of the glass epoxy substrate 11. However, it is not always necessary to make the surface of the solder structure 15 flat.

  Further, an additional solder layer 16 (second structure) is formed on the antenna connecting solder structure 15. The additional solder layer 16 is formed on the antenna connecting solder structure 15 by applying cream solder having a melting point lower than that of the solder constituting the solder structure 15 by a method such as screen printing. It is formed by reflowing at a temperature at which the solder to be melted does not melt.

  The solder used for the additional solder layer 16 is a solder having a low melting point that melts at a lower temperature or with a smaller amount of heat in order to reduce damage to the card substrate 10 and the like by heat. Specifically, a solder alloy such as Sn—Bi system or Sn—In system (melting point lower than 150 ° C., melting point of about 110 to 140 ° C.) is used.

  After the additional solder layer 16 is formed on the solder structure 15, the upper surface of the additional solder layer 16 is polished to make it flat with respect to the antenna surface to be connected later, and accurately controlled by screen printing. The height of the solder layer 16 that cannot be completely controlled is controlled accurately. However, it is not always necessary to make the upper surface of the additional solder layer 16 flat.

  The IC chip 1 is bonded to glass epoxy, PET, or lead frame with a die attach adhesive. Thereafter, the external connection terminal 2 and the bridge circuit 3 are wire-bonded with a wire 6 such as gold or copper having a diameter of 10 to 40 μm and sealed with a resin 14 for protection.

  The antenna circuit has a coil for communicating with the reader / writer by non-contact communication. Lands for connecting to the antenna connecting solder structure on the IC module side are formed at the start and end of the coil, respectively.

  Here, the antenna circuit is formed of a wire 7 such as copper having a diameter of 50 to 150 μm on the card substrate. Alternatively, on the front and back of an insulating base substrate such as polyethylene terephthalate (PET) or polyethylene naphthalate (PEN) having a thickness of 15 to 50 μm, a pattern is formed by etching using a copper foil having a thickness of 5 to 50 μm as a material. Also good.

  In the case of an antenna using a wire, the land is formed by arranging the wire at the antenna end in a zigzag manner or by connecting a copper foil to the antenna end by a processing method such as welding. In the case of an etching antenna, the land is formed by etching.

  Thereafter, the antenna is sandwiched between card base materials, and integrated by performing processing such as lamination or adhesion by hot pressure. Thereafter, the card body is formed by punching into a card piece shape.

  Further, a recess (cavity) for embedding the IC module is formed in the card body by milling. At the same time, a land portion for connecting to the antenna connecting solder structure on the IC module side is cut out.

  Heat and pressure are applied from the surface of the IC module, and the IC module is mounted in a recess (cavity) of the card body with an adhesive such as a hot melt sheet. At the same time, the additional solder layer 16 having a lower melting point than the solder structure 15 formed on the solder structure 15 is melted to connect the antenna connecting solder structure 15 and the antenna 7 on the back surface of the IC module. A dual IC card is obtained through the above steps.

  FIG. 1 is a bottom view of the IC module formed as described above, and the IC module is viewed from the back side. On the surface of the IC module, the external connection terminal 2 and the non-contact function bridge portion 3 are formed by dividing the surface copper foil into a plurality of copper foil patterns. An IC chip 1 is disposed at the center of the back surface of the IC module. The card base is provided with a hole 4 in which a solder structure 15 is formed and a bonding hole 5. A bonding wire 6 connected from the IC chip 1 on the back surface to the bridge circuit 3 on the front surface is passed through the bonding hole 5.

  FIG. 2 is a bottom view showing an example in which an antenna circuit using antenna wires 7 is formed on the IC module of FIG. The antenna wire 7 is sandwiched between card base materials and integrated by processing such as lamination or adhesion by hot pressure. Here, the antenna wire 7 is disposed so as to overlap with the hole 4 in which the solder structure 15 is formed as viewed from above.

  3 is a cross-sectional view of the IC module of FIG. 2, and is a cross-sectional view taken along line VV in FIG. However, the IC chip 1 is omitted in FIG. An external connection terminal 2 and a non-contact function bridge portion 3 are formed on the surface copper foil 13. The glass epoxy substrate 11 is perforated. One of the holes is a bonding hole 5, and a solder structure 15 is formed in the other hole 4.

  A bonding wire 6 that passes from the bridge circuit 3 on the front surface copper foil 13 to the IC chip 1 on the back surface is passed through the bonding hole 5. The bonding wire 6 is sealed with a resin 14.

  The solder structure 15 formed in the hole 4 connects the bridge circuit 3 on the surface and the antenna 7 on the card body side, thereby enabling non-contact communication. The solder structure 15 is formed by filling cream solder in the holes 4 connected to the back surface of the bridge circuit pattern 3 and then reflowing.

  The solder used for the solder structure 15 is a high melting point solder, for example, a general Sn-based alloy having a melting point of about 200 ° C. or higher is used. Therefore, the solder used for the solder structure 15 is not melted by the heat (generally about 150 to 200 ° C.) when mounting the IC module.

  FIG. 4 is a cross-sectional view showing various forms of the solder structure 15 and the additional solder layer 16. In the example of FIG. 3, the upper surface of the solder structure 15 is flattened with respect to the surface to which the antenna wire 7 is connected by a method such as polishing. However, as in the example of FIGS. 4A and 4C, the upper surface of the solder structure 15 does not have to be flat.

  The solder structure 15 has a height that fills 50% of the holes 4 forming the solder structure 15 (this is a height that does not protrude from the back surface of the glass epoxy substrate 11), and is 50 μm from the back surface of the glass epoxy substrate 11 at the maximum. What is necessary is just the height which protrudes. Preferably, as shown in the example of FIG. 3, the solder structure 15 may slightly protrude from the back surface of the glass epoxy substrate 11.

  An additional solder layer 16 is formed on the solder structure 15. The solder used for the additional solder layer 16 is a solder having a melting point lower than that of the solder constituting the solder structure 15. Specifically, Sn—Bi-based or Sn—In-based (melting point: about 110 to 140 ° C.) solder alloy or the like is used. The additional solder layer 16 is formed by placing a low melting point cream solder on the solder structure 15 and then reflowing at a temperature at which the solder constituting the solder structure 15 does not melt.

  In the example of FIG. 3, the upper surface of the additional solder layer 16 is flat with respect to the surface to which the antenna wire 7 is connected by a method such as polishing. However, as in the example of FIGS. 4A and 4B, the upper surface of the additional solder layer 16 may not be flat.

  An antenna circuit for communicating with a reader / writer by non-contact communication is formed on the card substrate 10 with a wire 7 such as copper having a diameter of 50 to 150 μm. The antenna wire 7 is disposed so as to be in contact with the additional solder layer 16. The antenna wire 7 is sandwiched between the card base 10 and integrated by processing such as lamination or adhesion by hot pressure. In the example of FIG. 3, the adhesive sheet 12 is integrated between the glass epoxy substrate 11 and the card base 10.

  Various forms of the solder structure 15 and the additional solder layer 16 shown in FIG. 4 will be described. In the example of FIG. 4A, neither the solder structure 15 nor the additional solder layer 16 is processed to make the surface flat, and only the reflow process is performed. In the example of FIG. 4B, the surface of the solder structure 15 is in a flat state, and the additional solder layer 16 is in a state of only reflow processing without being processed to make the surface flat. In the example of FIG. 4C, the solder structure 15 is not subjected to the process of flattening the surface and is in a state of only reflow processing, and the surface of the additional solder layer 16 is in a flat state. In the example of FIG. 4D, the surfaces of both the solder structure 15 and the additional solder layer 16 are flat.

  4A to 4D, it is preferable that the solder structure 15 has a height that slightly protrudes from the back surface of the glass epoxy substrate 11.

  As described above, in one embodiment of the present application, a single-sided substrate having a conductive foil only on one side of a glass epoxy substrate is used as the IC module substrate. The conductor foil forms an external connection terminal used for contact communication and a bridge circuit for electrical connection from the IC chip to the antenna for non-contact communication. Also, a through hole is provided in the glass epoxy substrate, a solder structure is formed from the through hole to the back surface of the bridge with solder (or a material that can be connected with solder), and the solder structure and the antenna are connected to the solder structure. Connect with another solder.

  With this configuration, the conductive foil on the front surface of the IC module and the solder structure for antenna connection on the back surface are directly connected by metal without using a glass epoxy substrate, so that the thermal conductivity is increased and the IC module and the antenna are connected. Therefore, the solder for melting can be easily melted. Therefore, the damage (deformation, etc.) that the heat at the time of mounting the IC module gives to the plastic card is eliminated, and a dual IC card having an excellent appearance can be obtained.

  In addition, as described above, in one embodiment of the present application, since a single-sided board can be used, a conductive foil is provided on both sides of a glass epoxy board as used in an ordinary dual IC card module. It is not necessary to use a double-sided substrate that normally requires gold plating. Therefore, a dual IC card can be realized at low cost.

  Further, as described above, in one embodiment of the present application, a solder having a melting point that does not melt by heat when mounting an IC module (or a material that can be connected by solder) is used as the solder constituting the solder structure. . By doing so, since the solder structure does not melt with the heat when mounting the IC module, the phenomenon that the solder structure melts and disconnects from the back of the bridge due to gravity, etc. can be avoided, Solder connection can be performed stably.

  In addition, as described above, in one embodiment of the present application, a solder that is melted by heat at the time of IC module mounting processing is laminated and disposed on the solder structure. By doing in this way, it is not necessary to apply cream solder in the process of connecting the IC module to the antenna. Therefore, it is not necessary to use a dedicated facility, and a dual IC card can be manufactured with the same manufacturing facility and process as the contact IC card. In addition, since it is not necessary to use cream solder when processing the IC module to be connected to the antenna, components other than solder, such as flux, that are often contained in cream solder in order to maintain the paste state, It is possible to eliminate the dirt on the card face caused by the evaporation of heat.

  Further, as described above, in one embodiment of the present application, the solder structure is flattened with respect to the antenna surface to be connected, and solder is stacked after height control is performed. By doing so, it is possible to control with high accuracy the amount of solder of the solder layer that is melted by heat when mounting the IC module, and stable connection can be achieved. In addition, since there is no variation in the height of the solder structure, it is possible to reduce and equalize the force with which the solder structure pushes up the conductor foil of the external connection terminal by the pressure applied when mounting the IC module. Accordingly, it is possible to maintain a beautiful appearance with few push-up marks due to the solder structure appearing on the external connection terminal surface of the IC module.

  Further, as described above, in one embodiment of the present application, the formed solder layer is made flat with respect to the antenna surface and the height is controlled. By doing so, it is possible to control the amount of solder of the solder layer that is melted by the heat when mounting the IC module with higher accuracy, and thus stable connection can be achieved. Also, since there is no variation in the height of the combined structure of the solder structure and the additional solder layer, the force by which the solder structure pushes up the conductor foil of the external connection terminal by the pressure applied when mounting the IC module is reduced. Can be even with. Therefore, it is possible to further maintain a beautiful appearance with few push-up marks due to the solder structure appearing on the surface of the external connection terminal of the IC module.

  Further, as described above, in one embodiment of the present application, the solder layer is melt-formed by reflowing at a temperature at which the solder structure does not melt. By doing so, the solder layer can be melted by heat at the time of IC module mounting processing as designed without being mixed with the solder structure, so that stable connection is possible.

  As mentioned above, although preferable embodiment of this invention was described, this invention is not limited to these embodiment and its modification. Additions, omissions, substitutions, and other modifications can be made without departing from the spirit of the present invention.

  In this specification, words indicating directions such as “front, back, top, bottom, right, left, vertical, horizontal, vertical, horizontal, front, back, rows and columns” refer to these directions in the configuration of the present invention. Used to explain. Accordingly, these terms used to describe the specification of the present invention should be interpreted relatively in the configuration of the present invention.

  DESCRIPTION OF SYMBOLS 1 ... IC chip, 2 ... External connection terminal, 3 ... Non-contact function bridge part (bridge circuit pattern), 4 ... Hole, 5 ... Bonding hole, 6 ... Bonding wire, 7 ... Antenna wire, 10 ... Card base material, 11 DESCRIPTION OF SYMBOLS ... Glass epoxy substrate, 12 ... Adhesive sheet, 13 ... Surface copper foil, 14 ... Sealing resin, 15 ... Solder structure (first structure), 16 ... Additional solder layer (second structure)

Claims (7)

An IC module that includes an IC chip having both a contact-type communication function and a non-contact-type communication function, and includes a substrate having a conductor foil only on one side,
The conductor foil forms an external connection terminal used for contact communication and a bridge circuit for performing electrical connection between the IC chip and the antenna for non-contact communication,
The substrate has a through hole;
In the through hole, a first structure is formed from the back surface of the bridge circuit,
A second structure different from the first structure is formed on the surface of the first structure opposite to the bridge circuit,
The IC module according to claim 1, wherein the melting point of the second structure is lower than the melting point of the first structure.   2. The IC module according to claim 1, wherein the first structure and the second structure are solders having different melting points.   3. The IC module according to claim 1, wherein the first structure protrudes from a surface of the substrate without a conductive foil. 4.   4. The IC module according to claim 1, wherein a surface of the first structure body or the second structure body on a side opposite to the bridge circuit is flat. 5. An IC chip having both a contact communication function and a non-contact communication function;
An antenna that is electrically connected to the IC chip and performs non-contact communication;
An IC module comprising a substrate having a conductive foil only on one side, and mounting the IC chip;
With
The conductor foil forms an external connection terminal used for contact-type communication, and a bridge circuit for electrical connection between the IC chip and the antenna,
The substrate has a through hole;
In the through hole, a first structure is formed from the back surface of the bridge circuit,
The first structure and the antenna are connected by a second structure different from the first structure,
The IC card according to claim 1, wherein the melting point of the second structure is lower than the melting point of the first structure. A method of mounting an IC chip having both a contact communication function and a non-contact communication function, and manufacturing an IC module from a substrate having a conductive foil only on one side,
In the conductor foil, forming an external connection terminal used for contact communication and a bridge circuit for performing electrical connection between the IC chip and the antenna for non-contact communication;
Providing a through hole in the substrate;
Forming a first structure from the back surface of the bridge circuit in the through hole;
Forming a second structure different from the first structure on a surface of the first structure opposite to the bridge circuit;
Including
The method for manufacturing an IC module, wherein the melting point of the second structure is lower than the melting point of the first structure. A method of manufacturing an IC card from a substrate having a conductive foil only on one side, mounted with an IC chip having both a contact communication function and a non-contact communication function,
In the conductor foil, forming an external connection terminal used for contact communication and a bridge circuit for performing electrical connection between the IC chip and the antenna for non-contact communication;
Providing a through hole in the substrate;
Forming a first structure from the back surface of the bridge circuit in the through hole;
Connecting the first structure and the antenna with a second structure different from the first structure;
Including
The method of manufacturing an IC card, wherein the melting point of the second structure is lower than the melting point of the first structure.

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