JP2013246758A - Dual ic card and method for manufacturing dual ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a dual IC card for, even when using a conductive adhesive having a large influence when it protrudes in connecting an antenna to a dual IC module, preventing the conductive adhesive from protruding to any terminal other than a target contact terminal, and for easily and reliably preventing the protrusion of the conductive adhesive, and a highly reliable dual IC card.SOLUTION: In a dual IC card having a dual IC module with external terminal electrically connected to an antenna, an antenna connection hole for electrically connecting the antenna to the IC module is shaped such that an angle made by the bottom part of a first recess and the side wall of the antenna connection hole is 90° or less, and that the side wall is inclined.

Description

  The present invention relates to a dual IC card in which a conductive adhesive is not protruded and is produced in a process of mounting and thermocompression bonding of an IC module of a dual IC card and a method of manufacturing a dual IC card in which no occurrence occurs.

  Conventionally, recessed processing for contact type IC module embedding is performed by cutting using a cutting tool such as an end mill, and by devising the cutting shape, stress distribution to the mounted IC chip and improvement of IC chip mounting accuracy are improved. In addition, ingenuity and ingenuity have been made with the aim of improving production efficiency.

  In order to prevent the adhesive between the IC module and the card base from protruding from the end of the recessed portion by devising the cutting shape, a proposal has been made to provide a relief groove on a part or the entire periphery of the lower end of the peripheral wall of the recessed portion. The dual IC card is not an object, and thus there is no requirement for an electrical connection between the antenna and the IC module, and only an adhesive that is not a conductive adhesive is an object. Regarding the electrical connection between the antenna and the dual IC module, The invention about the protrusion of the conductive adhesive from the concave end has not been made (Patent Document 1).

  Unlike bonding the IC module to the card base, the conductive adhesive that is electrically connected while fixing the IC module and the antenna is not only a matter of appearance, but if it protrudes, Except for the purpose, it may come into contact with the contact terminal, which may cause a short circuit, etc., and the influence when it protrudes is extremely large, such as a decrease in reliability during use.

Japanese Patent Laid-Open No. 10-203063

  The present invention has been made in view of the above-described problems, and even when a conductive adhesive having a large influence when protruding is used in connection between an antenna and a dual IC module, it protrudes to terminals other than the target contact terminal. It is an object of the present invention to provide a method for manufacturing a dual IC card that is simple, reliable and can prevent protrusion, and a dual IC card with high reliability.

As means for solving the above problems, the invention according to claim 1 is a card substrate including an antenna sheet in which an antenna is laminated on a substrate;
A first recess having an opening, a side wall, and a bottom formed in the card base;
A second recess having an opening, a side wall, and a bottom formed at the bottom of the first recess;
An antenna connection hole penetrating to the antenna in the first recess;
A dual IC card comprising a first IC and a dual IC module with external terminals that are fixedly disposed in the first recess and electrically connected to the antenna by a conductive adhesive filled in the antenna connection hole. There,
The shape of the antenna connection hole for electrically connecting the antenna and the IC module is such that the angle formed between the bottom of the first recess and the side wall of the antenna connection hole is less than 90 °, and the side wall is inclined. It is a dual IC card characterized by the above.

The invention according to claim 2 is the dual IC card according to claim 1, wherein the conductive adhesive filled in the antenna connection hole is a two-component curable silver paste.

The invention according to claim 3 includes a step of laminating an antenna sheet, a core sheet, and an exterior sheet in which an antenna is laminated on an exterior sheet, a core sheet, and a substrate to form a card substrate, and the card base Forming a first recess having an opening, a side wall, and a bottom in the material;
Forming a second recess having an opening, a side wall, and a bottom at the bottom of the first recess;
A step of providing an antenna connection hole penetrating to the antenna in the first recess to electrically connect the antenna and the dual IC module with external terminal to the antenna, and a back surface of the dual IC module with external terminal. Providing a hot melt adhesive;
Filling the antenna connection hole with a conductive adhesive and electrically connecting the antenna and the dual IC module with external terminals;
A method of manufacturing a dual IC card comprising a step of bonding by hot pressing,
A method of manufacturing a dual IC card, characterized in that the antenna connection hole is made to penetrate by using an end mill having a distal end portion widened and a tip portion spread angle of 10 ° to 30 ° with respect to the center line, thereby forming an inversely tapered shape. It is.

  According to a fourth aspect of the present invention, a hot melt sheet is temporarily attached to the back surface of the dual IC module with external terminals, and a portion of the dual IC module with external terminals is pressed into a first recess by hot pressing. 4. The method of manufacturing a dual IC card according to claim 3, wherein the dual IC module with external terminals is permanently bonded to the card base material by hot pressing in a second recess. .

  According to the present invention, the antenna connection hole of the recess for embedding the dual IC module has an inverse taper process in which the angle formed between the bottom of the first recess and the side wall of the antenna connection hole is less than 90 °. When connecting the card base to the card base, the conductive adhesive escapes to the corner of the reverse-tapered connection hole, preventing the conductive adhesive from protruding to contact terminals other than the intended purpose. The highly reliable dual IC card and the method of manufacturing the dual IC card can be provided, and a card having excellent appearance quality can be manufactured with a high yield.

It is the conceptual diagram which showed the reverse taper shape of the antenna connection hole for connecting the antenna and dual IC module in a dual IC card of this invention. FIG. 3 is a conceptual cross-sectional view showing a connection state between an antenna and a dual IC module in a dual IC card of the present invention. It is the external view which showed the end mill used for manufacture of the Example of this invention. It is the conceptual diagram which showed the NC processing machine used for manufacture of the Example of this invention, and a comparative example.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the drawings. FIG. 1 shows an antenna connection hole 3 for connecting an antenna and a dual IC module in a dual IC card, and a card substrate 1 including an antenna sheet in which an antenna 2 is laminated on a substrate, In order to set a dual IC module with external terminals, the first recess 8 and the second recess 9 are counterbored, and the antenna connection hole 3 is provided in the first recess 8, and the antenna connection hole 3 indicates that the antenna 2 is exposed and the shape of the antenna connection hole 3 is an inversely tapered shape that becomes wider toward the antenna 2.

FIG. 2 shows a connection state between the antenna 2 and the dual IC module 3 in the dual IC card. The antenna connection land 7 of the dual IC module 3 and the antenna 2 are connected by the conductive adhesive 5. . Further, a sheet-like hot melt adhesive is attached only to the substrate on the back surface of the dual IC module with external terminals, and is fixed to the first recess 8.

  FIG. 3 shows the outer shape of the end mill used to form the antenna connection hole in the example, the tip portion is widened toward the tip, and the spread angle of the tip portion with respect to the center line is 10 ° to Thus, the antenna connection hole 3 can be formed in a reverse tapered shape, that is, an angle formed with the side wall of the antenna connection hole is less than 90 ° and the side wall is inclined. In this embodiment, the cutting tool θ is set to 70 °, and the taper angle of the card after milling is set to 20 °. However, it is set to 60 ° (taper angle 30 °), 80 ° (taper angle 10 °). And can be appropriately selected in consideration of the strength and processing suitability of the card material to be used.

  After laminating copper foil or aluminum foil on the insulating film and patterning the resist by photolithography, PVC, PET, PET-G are used as core sheets on both sides of the antenna sheet formed by the antenna 2 by etching. The card base material 1 is formed by pasting together a plastic material such as an exterior base material.

  An antenna connection for forming a recess for mounting the dual IC module 4 on the manufactured card substrate 1 and electrically connecting the antenna 2 inside the card substrate 1 and the dual IC module 4 Hole 3 is formed.

  The recess for mounting the dual IC module 4 includes a first recess 8 and a second recess 9, and the antenna connection hole 3 is formed in the first recess 8.

  The dual IC module 4 has an IC chip mounted on a module substrate having a wiring pattern, connected by wire bondering or the like, and further molded by resin. Glass-epoxy, polyimide, or the like can be used for the module substrate. The thickness is about 100 to 170 μm, and the vertical and horizontal sizes are about 11.8 × 13 mm. The module substrate is formed with holes for conducting to the external terminals by punching or the like. A pattern is formed on the external terminal through copper lamination and etching, and the external terminal is plated with nickel, gold, or silver. The plating material is not particularly limited, and palladium or the like may be deposited.

  Further, in the case of a dual IC module for both contact and non-contact, a conductive member serving as an external terminal can be provided on one side, and a conductive member for connecting to the antenna coil can be formed on the opposite side.

  As the IC chip, it is possible to use an IC chip formed by forming a circuit on a Si wafer and polishing the Si wafer so that the thickness of the wafer becomes a specified thickness, and is cut and manufactured as one IC chip by a dicing apparatus.

  The IC chip is mounted using an adhesive for mounting the IC chip on the module substrate. Then, after mounting the IC chip, it is electrically connected to an external terminal. Specifically, wire bonding is performed to make each terminal of the IC chip conductive to the external terminal. As this wire, a gold wire is usually used, but other wire materials such as copper and aluminum may be used.

After the wire bonding step, sealing with a resin for protecting the IC chip is performed. As a sealing method, there are a transfer molding method, a potting method, a printing method and the like, but the method is not limited. The sealing material is a thermoplastic resin, a thermosetting resin, an ultraviolet curable resin, or the like. The IC module is manufactured by curing the sealing resin in each method.

  Further, the shape of the IC module is a convex shape because the area of the resin sealing portion that protects the IC chip is smaller than the area of the module substrate in the cross section. The resin sealing portion is usually formed so that the vertical and horizontal sizes of the resin sealing portion surface are smaller than the vertical and horizontal sizes of the side surface of the module substrate in the cross section, that is, the resin sealing portion from the module substrate side. The shape is inclined so as to narrow toward the surface side. The angle 11 formed by the resin sealing portion surface of the IC module and the side wall is about 100 to 110 °. In addition, you may use the thing of the shape where the resin sealing part is not inclined.

  Thickness of applying adhesive to both sides of antenna sheet where antenna was formed by etching after laminating copper foil with thickness of 30 μm on PEN with thickness of 38 μm as insulating film, patterning resist by photolithography method A core substrate made of 0.6 mm polyvinyl chloride (PVC) and an exterior substrate made of amorphous polyester (PET-G) having a thickness of 0.1 mm on both surfaces of the core substrate at a temperature of 100 to 120 ° C. A bonded card base was prepared by heat lamination, and cut into a small card size to obtain a 0.80 mm thick card.

  Next, using the NC processing machine shown in FIG. 4, the first recess 8, the second recess 9, and the antenna connection hole 3 of the example and the comparative example are formed by milling. The XYZ positioning mechanism fixes the card to the stage (bottom surface reference) 11 and the positioning pin 12 to the reference position. By milling, the opening is 13.25 mm long x 12.05 mm wide and the bottom is vertical. A first recess having a square shape with rounded corners was formed, which was 13.10 mm × 11.90 mm wide, 0.21 mm deep, an angle of 70 °, and the shape of the opening was rounded. Next, a second recess having an opening of 8.5 mm × width of 8.2 mm, a bottom of 8.04 mm × width of 7.74 mm, a depth of 0.63 mm, and an angle of 110 ° is formed by milling. did.

  Furthermore, an antenna connection hole having a depth of 0.15 mm (depth from the bill surface: 0.35 mm) was formed in the first recess to expose the surface of the copper foil having a thickness of 30 μm formed on the surface of the antenna sheet.

  The antenna connection hole has a reverse taper shape, the upper module antenna connection land side is 1.90 mmφ, the lower antenna side is 2.00 mmφ, and the inclination angle of the side surface portion is 80 ° (taper angle 10 °).

<Comparative example>
As a comparative example, a card was created in which the angle of inclination of the side surface portion of the antenna connection hole was vertical and the shapes of the other first and second recesses were the same.

  The antenna connection hole is cut and an IC module is mounted on the card of the example and the comparative example. First, the processed antenna connection hole is filled with a conductive adhesive (two-component curable silver paste), and the IC module is placed in the processed first recess and temporarily bonded. At this time, a hot melt sheet (adhesive) is temporarily attached to the back surface of the IC module with external terminals, and the IC module is fixed to the first recess and the second recess by pressing a part thereof with a hot press. Then, the temporarily bonded IC module with external terminals is bonded by hot press. At this time, the pressing conditions were 250 ° C., 50 N, and 2.5 sec.

For each of the 10 cards of the reverse-tapered example and the comparative example without taper, the presence or absence of protruding conductive adhesive was checked and compared. The results are shown in Table 1 below.

By providing the taper, the protrusion of the conductive adhesive can be eliminated, which is a great difference from the comparative example in which the taper is not provided.

DESCRIPTION OF SYMBOLS 1 ... Card base material 2 ... Antenna 3 ... Antenna connection hole 4 ... Dual IC module 5 ... Conductive adhesive 6 ... Hot-melt adhesive 7 ... Antenna connection land 8 ... First recess 9 ... Second recess 10 ... End mill 11 ... Stage (lower surface reference)
12 ... Positioning pin 13 ... Air cylinder

Claims (4)

A card substrate containing an antenna sheet in which an antenna is laminated on the substrate;
A first recess having an opening, a side wall, and a bottom formed in the card base;
A second recess having an opening, a side wall, and a bottom formed at the bottom of the first recess;
An antenna connection hole penetrating to the antenna in the first recess;
A dual IC card having a first IC and a dual IC module with external terminals that are fixedly disposed in the first recess and electrically connected to the antenna by a conductive adhesive filled in the antenna connection hole Because
The shape of the antenna connection hole for electrically connecting the antenna and the IC module is such that the angle formed between the bottom of the first recess and the side wall of the antenna connection hole is less than 90 °, and the side wall is inclined. Dual IC card characterized by   The dual IC card according to claim 1, wherein the conductive adhesive filled in the antenna connection hole is a two-component curable silver paste. An outer sheet, a core sheet, an antenna sheet in which an antenna is stacked on a substrate, a core sheet, a step of stacking an outer sheet and forming a card substrate;
Forming a first recess having an opening, a side wall, and a bottom on the card base;
Forming a second recess having an opening, a side wall, and a bottom at the bottom of the first recess;
A step of providing an antenna connection hole penetrating to the antenna in the first recess to electrically connect the antenna and the dual IC module with external terminal to the antenna, and a back surface of the dual IC module with external terminal. Providing a hot melt adhesive;
Filling the antenna connection hole with a conductive adhesive and electrically connecting the antenna and the dual IC module with external terminals;
A method of manufacturing a dual IC card comprising a step of bonding by hot pressing,
A method of manufacturing a dual IC card, characterized in that the antenna connection hole is made to penetrate by using an end mill having a distal end portion widened and a tip portion spread angle of 10 ° to 30 ° with respect to the center line, thereby forming an inversely tapered shape. .   A hot melt sheet is temporarily attached to the back surface of the dual IC module with external terminals, and a part of the hot melt sheet is pressed by a heat press to fix the dual IC module with external terminals to the first recess and the second recess, 4. The method of manufacturing a dual IC card according to claim 3, wherein the dual IC module with external terminals is permanently bonded to the card base by hot pressing.