JP2018198233A - Gripping device, manufacturing method for element, and manufacturing method for substrate device - Google Patents

Abstract

To suppress a decrease in an operation rate of an apparatus as compared to a case in which a worker stops the apparatus and changes a push-up height of a push-up portion.SOLUTION: A gripping device includes an imaging unit that images an element moved to an imaging position among a plurality of elements on an adhesive surface, a push-up portion that pushes up the lower surface of the element together with the adhesive surface when the imaging unit can recognize the element and pushes up the lower surface of the element moved to the imaging position together with the adhesive surface after a push-up height is lowered when the imaging unit cannot recognize the element, and a gripping portion that grips the element pushed up by the push-up portion.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a gripping device, an element manufacturing method, and a substrate device manufacturing method.

  Patent Document 1 discloses a configuration in which a chip is peeled from a wafer sheet by pushing up the chip on the wafer sheet with a push-up pin.

JP 2011-018734 A

  Here, in an apparatus in which a plurality of elements on the adhesive surface are pushed up together with the adhesive surface at the upper part and the element is gripped by the gripping unit, the operator stops the apparatus and changes the protrusion height of the upper part In some cases, the operating rate of the apparatus decreases.

  An object of the present invention is to make it possible to suppress a reduction in the operating rate of an apparatus as compared with a case where an operator stops the apparatus and changes the protruding height of the protruding portion.

  According to the first aspect of the present invention, an image pickup unit that picks up an element moved to an image pickup position among a plurality of elements on the adhesive surface, and when the image pickup unit can recognize the element, the lower surface of the element is connected to the adhesive surface. If the image pickup unit cannot recognize the element, the lower surface of the element moved to the image pickup position after the next time, the protrusion upper part that protrudes together with the adhesive surface with a lower protrusion height, and the protrusion A gripping portion for gripping the element with the upper part protruding.

  In the invention of claim 2, when the imaging unit cannot recognize the element, the protrusion is sequentially moved to the imaging position after the next until the condition for increasing the protrusion height of the protrusion is satisfied. The lower surface of the element is pushed up together with the adhesive surface in a state where the protruding height is lowered.

  The invention of claim 3 is provided with a detection unit that detects whether or not the gripping unit grips the element, and the projecting upper part is the following when the detection unit does not detect gripping of the element. The lower surface of the element that has been moved to the imaging position is pushed up together with the adhesive surface by increasing the protrusion height.

  According to a fourth aspect of the present invention, when the protrusion does not detect gripping of the element, the protrusion is at the imaging position until the condition for reducing the protrusion height of the protrusion is satisfied. The lower surface of the sequentially moved element is pushed up together with the adhesive surface in a state where the protruding height is increased.

  According to a fifth aspect of the present invention, the element is long in one direction, a height in a cross section intersecting with the one direction is larger than a length in the width direction, and the grip portion is formed on the adhesive surface along the width direction. The plurality of elements disposed on the adhesive surface are individually gripped in order in the width direction from the end of the adhesive surface, and the protruding portion is another element adjacent to the element with respect to the center in the width direction of the element. The lower surface of the element is pushed up together with the adhesive surface on the side opposite to the element.

  The invention according to claim 6 is an imaging step of imaging an element moved to an imaging position among a plurality of elements on the adhesive surface, and when the element can be recognized in the imaging step, the protrusion is a lower surface of the element. If the device cannot be recognized in the imaging step, the lower surface of the device whose upper part has been moved to the imaging position is lowered, and the height of the protrusion is lowered for each of the adhesive surfaces. A pushing-up process, and a peeling process of gripping the element pushed up in the pushing-up process and peeling the element from the adhesive surface.

  According to the seventh aspect of the present invention, if the element cannot be recognized in the imaging step, the first and subsequent steps are sequentially moved to the imaging position until the condition for increasing the protrusion height of the upper portion is satisfied. The lower surface of the element is pushed up together with the adhesive surface in a state where the protruding height is lowered.

  The invention according to claim 8 has a detection step of detecting whether or not the element is gripped in the peeling step, and in the protrusion step, the gripping of the element is not detected in the detection step. Thereafter, the lower surface of the element that has been moved to the imaging position is raised together with the adhesive surface by increasing the protrusion height.

  In the thrusting process according to the ninth aspect of the present invention, when the gripping of the element is not detected in the detection process, until the condition for lowering the thrusting height of the top of the projecting area is satisfied, the imaging position is set to the next and subsequent positions. The lower surface of the sequentially moved element is pushed up together with the adhesive surface in a state where the protruding height is increased.

  In the invention of claim 10, the element that is long in one direction and whose height in a cross section intersecting with the one direction is larger than the length in the width direction is used. In the peeling step, the adhesive is along the width direction. The plurality of elements arranged on the surface are individually gripped in order in the width direction from the end of the adhesive surface, and in the protrusion process, adjacent to the elements with respect to the center in the width direction of the elements The lower surface of the element is pushed up together with the adhesive surface on the side opposite to the other elements.

  Invention of Claim 11 has the process of putting the said element manufactured by the manufacturing method of the element of any one of Claims 6-10 on a board | substrate.

  According to the structure of Claim 1 of this invention, the fall of the operating rate of an apparatus can be suppressed compared with the case where an operator stops an apparatus and changes the protrusion height of a protrusion top.

  According to the configuration of the second aspect of the present invention, the success rate of grasping the element is increased as compared with the case where only the next element is pushed up by lowering the protrusion height of the protrusion.

  According to the structure of Claim 3 of this invention, the fall of the operating rate of an apparatus can be suppressed compared with the case where an operator stops an apparatus and changes the protrusion height of a protrusion top.

  According to the configuration of the fourth aspect of the present invention, the success rate of grasping the element is increased as compared with the case where the object to be raised by raising the protrusion height of the protrusion is only the next element.

  According to the structure of Claim 5 of this invention, compared with the structure which pushes up the center of an element by a protrusion upper part, the fall of the element adjacent to the element of gripping object can be suppressed.

  According to the manufacturing method of the sixth aspect of the present invention, it is possible to suppress a reduction in the operating rate of the apparatus as compared with the case where the worker stops the apparatus and changes the protruding height of the protruding portion.

  According to the manufacturing method of claim 7 of the present invention, compared with the case where only the next element is the object to be raised by lowering the protrusion height of the protrusion, the element holding success rate (peeling success rate) is higher. Go up.

  According to the manufacturing method of the eighth aspect of the present invention, it is possible to suppress a reduction in the operating rate of the apparatus as compared with the case where the worker stops the apparatus and changes the protruding height of the protruding portion.

  According to the manufacturing method of claim 9 of the present invention, compared with the case where only the next element is the object to be pushed up by raising the protrusion height of the protrusion, the element holding success rate (peeling success rate) is higher. Go up.

  According to the manufacturing method of the tenth aspect of the present invention, it is possible to suppress the falling of the element adjacent to the element to be grasped, as compared with the configuration in which the center of the element is pushed up by the protrusion.

  According to the manufacturing method of the eleventh aspect of the present invention, it is possible to suppress a decrease in the manufacturing efficiency of the substrate device as compared with the case where the operator stops the device and changes the protruding height of the protruding portion.

It is a top view of the light emitting substrate which concerns on this embodiment. It is a sectional side view of the light emitting substrate which concerns on this embodiment. It is a perspective view which shows a part of manufacturing apparatus which concerns on this embodiment. It is a perspective view which shows a part of manufacturing apparatus which concerns on this embodiment. It is a top view which shows a part of thrust mechanism which concerns on this embodiment. It is a sectional side view which shows the thrust mechanism which concerns on this embodiment. It is the schematic which shows the imaging range (field-of-view) of the camera which images the light emitting element of a pick-up position based on this embodiment. It is the schematic which shows the camera which images the holding part which moves from a pick-up position to a pick-off position based on this embodiment. It is a sectional side view which shows the holding part which concerns on this embodiment. It is a figure which shows the process of manufacturing the light emitting element which concerns on this embodiment. It is a perspective view which shows the wafer which concerns on this embodiment. It is a sectional side view which shows the state which pushed up the light emitting element of the pick-up position with the needle. FIG. 5 is a side sectional view showing a state where the next light emitting element is moved to the pickup position without pushing up the light emitting element when the light emitting element at the pickup position cannot be recognized. It is a sectional side view which shows the state which pushed up the next light emitting element moved to the pick-up position with the needle. It is a top view which shows the wafer which concerns on this embodiment. It is a top view which shows the state which mounted the light emitting element on two trays. It is a top view which shows the state which mounted the light emitting element on two trays. It is a top view which shows the state which rotated the one tray relatively with respect to the other tray. In a comparative example, it is a sectional side view which shows the state which pushed up the light emitting element with the needle. In a comparative example, it is a sectional side view which shows the state which pushed up the light emitting element with the needle.

  An example of an embodiment according to the present invention will be described with reference to the drawings. Hereinafter, first, a light emitting substrate 100 as an example of a substrate device will be described. Next, the manufacturing apparatus 10 for manufacturing the light emitting substrate 100, the manufacturing method for manufacturing the light emitting substrate 100, and the operation of this embodiment will be described.

  Note that the X direction, -X direction, Y direction, -Y direction, Z direction (upward), and -Z direction (downward) used in the following description are the arrow directions shown in the figure. Further, the X (-X) direction, the Y (-Y) direction, and the Z (-Z) direction are directions intersecting each other (specifically, orthogonal directions).

  In addition, a symbol in which “x” is written in “◯” in the figure means an arrow heading from the front of the page to the back. In addition, a symbol in which “•” is written in “◯” in the figure means an arrow heading from the back of the page to the front. Also, when the dimensional ratio of each part in the X direction, Y direction, and Z direction of each member shown in each figure, and the dimensional ratio of each member in the X direction, Y direction, and Z direction are different from the actual dimensional ratio There is.

<< Light Emitting Substrate 100 >>
First, the configuration of the light emitting substrate 100 will be described. 1 and 2 show the configuration of the light emitting substrate 100. FIG.

  As shown in FIGS. 1 and 2, the light emitting substrate 100 includes a printed circuit board 102 (an example of a substrate) and a light emitting element 200 (an example of an element) placed (mounted) on the printed circuit board 102. doing. As shown in FIG. 1, the printed board 102 is formed in a plate shape elongated in the X direction, for example. In the present embodiment, placing the light emitting element 200 on the printed board 102 may be referred to as “mounting”.

  As the light emitting element 200, as shown in FIG. 1, for example, a light emitting element (for example, an LED chip) formed long in the X direction (an example of one direction) is used. As shown in FIG. 2, the light emitting element 200 has a T-shaped shape (cross-sectional shape) in a cross section intersecting the longitudinal direction (X direction). The light emitting element 200 has a head portion 210 constituting a T-shaped horizontal bar portion and leg portions 250 constituting a T-shaped vertical bar portion.

  The head 210 has projecting portions 213 and 214 that project from the leg portion 250 in the left-right direction (Y, -Y direction) in a side sectional view (-X direction view). Therefore, the width in the left-right direction (Y-direction length) of the leg portion 250 is narrower than the width in the left-right direction of the head 210 in a side sectional view. Thereby, the area of the lower surface 259 of the leg part 250 is made smaller than the area of the surface (upper surface) 219 of the head 210.

  A light emitting point 218 and a circuit pattern (not shown) are provided on the surface 219 of the head 210. A plurality of light emitting points 218 are arranged along one end of the surface 219 of the head 210 (specifically, the surface of the overhang 213) along the X direction (longitudinal direction). In each drawing, a plurality of light emitting points 218 may be illustrated in a line.

  Furthermore, positioning marks 270 and pads 280 are provided on the surface 219 of the head 210 at both ends in the longitudinal direction (X direction) of the light emitting element 200 (see FIG. 5C). The positioning mark 270 is a mark for positioning the light emitting element 200. The pad 280 is a connection part to which wiring is connected. Note that the pad 280 may also be used for positioning the light emitting element 200. Specifically, as will be described later, the light emitting element 200 is moved based on the positions of the positioning marks 270 and the pads 280 with respect to a predetermined reference position (for example, the position indicated by the symbol TA in FIG. 5C) to emit light. The element 200 is positioned at a predetermined position.

  In the light emitting element 200, the height (Z direction length) in a cross section intersecting the longitudinal direction (X direction) is larger than the width direction length (Y direction length). Specifically, the dimensions of the light emitting element 200 are, for example, a length (length in the X direction) of 6 mm, a height (length in the Z direction) of 300 μm, a width of the head 210 (length in the Y direction) of 130 μm, and a leg portion. The width of 250 (the length in the Y direction) is 100 μm. Note that the dimensions of the light emitting element 200 are not limited to the above dimensions.

  As shown in FIG. 2, the light emitting element 200 has a longitudinal direction (X direction) of the printed circuit board 102 so that the projecting portion 213 side on which the plurality of light emitting points 218 are formed faces each other in a side sectional view. As shown in FIG. 1, a plurality of zigzag patterns are arranged.

  Specifically, the plurality of light emitting elements 200 form two rows arranged at intervals along the X direction. Each of the two columns is composed of an odd-numbered light-emitting element 200 and an even-numbered light-emitting element 200 counted in the −X direction from the longitudinal end (X-direction end) of the printed circuit board 102. . Then, the longitudinal end portion (−X direction end portion) of the nth (excluding the final) light emitting element 200, counting from the longitudinal end portion (X direction end portion) of the printed circuit board 102 in the −X direction, An end portion in the longitudinal direction (end portion in the X direction) of the (n + 1) th light emitting element 200 is arranged so as to overlap in the Y direction.

<< Modification of Light-Emitting Element 200 >>
The light emitting element 200 has a T-shaped cross section, but is not limited thereto. For example, the light emitting element 200 may have an L-shaped cross section. Therefore, the light emitting element 200 may have a configuration in which the overhanging portion 214 is not provided, for example. The light emitting element 200 may have a quadrangular cross section (eg, a rectangular shape or a parallelogram shape) having a length in the vertical direction.

<< Production apparatus 10 >>
Next, the configuration of the manufacturing apparatus 10 that manufactures the light emitting substrate 100 will be described. 3 and 4 each show a part of the configuration of the manufacturing apparatus 10.

  As shown in FIG. 3, the manufacturing apparatus 10 includes an element manufacturing apparatus 300 that manufactures the light emitting element 200. In addition, as shown in FIG. 4, the manufacturing apparatus 10 includes a supply unit 13 that supplies the light emitting elements 200, an element positioning device 20 that positions the light emitting elements 200, a substrate positioning apparatus 40 that positions the printed circuit board 102, It has.

  Further, the manufacturing apparatus 10 includes a transfer device 50 that transfers the light emitting element 200 from the supply unit 13 to the element positioning device 20, and a printed circuit board 102 in which the light emitting element 200 positioned by the element positioning device 20 is positioned by the substrate positioning device 40. And a transfer device 60 for transferring to. Note that the light-emitting element 200 has a T-shaped cross section as described above, but the shape of the light-emitting element 200 is simplified in FIGS. 3 and 4.

[Element manufacturing apparatus 300]
As shown in FIG. 3, the element manufacturing apparatus 300 includes a gripping device 302 that grips the light emitting element 200, a table 304 on which trays 401 and 402 are placed, and a moving mechanism 306 that moves the table 304 in the X direction and the Y direction. And.

  The trays 401 and 402 have a plate shape (flat shape) whose vertical direction is the thickness direction, and have a substantially rectangular shape in plan view. The trays 401 and 402 function as a mounting portion on which a plurality of light emitting elements 200 cut out from the wafer 14 are placed. The trays 401 and 402 are formed with a plurality of recesses 406 on which the plurality of light emitting elements 200 are placed. In addition, as a mounting part, it is not restricted to tray 401,402, A box-shaped case etc. may be sufficient.

  The moving mechanism 306 moves the table 304 in the X direction and the Y direction, so that the concave portion 406 on which the light emitting element 200 is placed among the plurality of concave portions 406 of the trays 401 and 402 is set to a predetermined pick-off position. Position.

  The gripping device 302 grips the plurality of light emitting elements 200 cut out from the wafer 14 one by one, and conveys them to the concave portion 406 located at the pick-off position in the trays 401 and 402. Note that the plurality of light emitting elements 200 are attached to the adhesive surface 290A of the adhesive sheet 290 (see FIG. 5B) in a state of being cut out from the wafer 14, as will be described later. Further, as will be described later, positioning marks 270 and pads 280 are formed at both ends in the longitudinal direction (X direction) of each light emitting element 200 in a state of being cut out from the wafer 14 (see FIG. 5C). 5C shows a positioning mark 270 and a pad 280 on one end side of the light emitting element 200 in the longitudinal direction (X direction).

  Specifically, as shown in FIG. 3, the gripping device 302 includes a gripping mechanism 310 that grips the light emitting element 200, a thrusting mechanism 320 that pushes up the light emitting element 200, and a holding unit 342 that holds the wafer 14. , A moving mechanism 344 that moves the holding unit 342 in the X direction and the Y direction, and a control unit 359 that controls the operation of each unit of the gripping device 302.

  The moving mechanism 344 moves the holding unit 342 in the X direction and the Y direction, thereby positioning the light emitting element 200 to be grasped at a predetermined pickup position (an example of an imaging position). The pickup position is a gripping position where the light emitting element 200 to be gripped is gripped by the gripping mechanism 310. The pickup position is also an imaging position where the light emitting element 200 to be grasped is captured by a camera 350 described later. Positioning of the light emitting element 200 to the pickup position is performed using a camera 350 as described later. In FIG. 5B, the position indicated by the symbol PT is the pickup position, and the light emitting element indicated by the symbol 200P is the light emitting element positioned at the pickup position.

  As shown in FIG. 5B, the thrusting mechanism 320 includes a cylindrical portion 330, a needle 322 (an example of a protruding upper portion), a suction portion 324, and a driving portion 326 (see FIG. 3).

  A through hole 332 through which the needle 322 protrudes is formed on the upper wall of the cylindrical portion 330. As shown in FIGS. 5A and 5B, an adsorption groove 334 for adsorbing the adhesive sheet 290 to which the wafer 14 is attached is formed on the upper surface of the upper wall of the cylindrical portion 330. A hollow portion 336 communicating with the through hole 332 is formed inside the cylindrical portion 330. The cavity portion 336 and the suction groove 334 are connected to the suction portion 324 via a passage 338 formed in the side wall of the cylindrical portion 330.

  The needle 322 is an example of a protruding portion that pushes up the light emitting element 200 moved to the pickup position (imaging position) together with the adhesive surface 290 </ b> A of the adhesive sheet 290 when the gripping mechanism 310 grips the light emitting element 200. The needle 322 is formed in a cylindrical shape whose upper end is tapered. The diameter D of the needle 322 is, for example, several hundred μm, and the diameter of the upper end portion of the needle 322 is several tens of μm. A plurality of needles 322 are arranged along the longitudinal direction (X direction) of the light emitting element 200 located at the pickup position.

  The drive unit 326 moves the needle 322 between a protruding position that protrudes upward from the cylindrical part 330 through the through-hole 332 and a storage position that is stored in the hollow part 336 of the cylindrical part 330.

  As shown in FIG. 3, the gripping mechanism 310 includes a housing 311, an arm 312, a gripping part 370, a driving part 360, and a suction part 318. The housing 311 is formed in a box shape having an opening 313 on the side surface on the −Y direction side of the upper portion. The arm 312 protrudes from the opening 313 of the housing 311 toward the −Y direction.

  The base end portion of the arm 312 is supported by the drive unit 360 so as to be movable in the horizontal direction (X direction). A gripping portion 370 is attached to the distal end portion of the arm 312 via an expansion / contraction portion 315 that expands and contracts in the vertical direction.

  The gripping part 370 is a gripping part that grips the light emitting element 200 pushed up by the needle 322. Specifically, as shown in FIG. 6, the gripping portion 370 is provided with a main body 372 having a length along the longitudinal direction (X direction) of the light emitting element 200 and both ends of the main body 372 in the longitudinal direction. And an abutting portion 374 that abuts against the ridge line 285 on the X direction side of the element 200.

  The abutting portion 374 has an abutting surface 375 that abuts against the ridge line 285 of the light emitting element 200 with a gap between the lower surface 373 of the main body 372 and the upper surface of the light emitting element 200.

  A cavity 377 is formed inside the main body 372, and a plurality of through holes 378 communicating with the cavity 377 are formed on the lower surface 373 of the main body 372. The upper part of the main body 372 is connected to a suction part 318 (see FIG. 3) via a hose 399.

  In the gripping mechanism 310, the light emitting element 200 is sucked by the suction part 318 through the plurality of through holes 378 in a state where the ridge line 285 of the light emitting element 200 pushed up by the needle 322 is abutted against the abutting surface 375 of each abutting part 374. As a result, the grip portion 370 grips one light emitting element 200. In a state where the grip portion 370 grips the light emitting element 200, the light emitting element 200 is peeled from the adhesive sheet 290 by contracting the stretchable portion 315. Then, by moving the arm 312 in the X direction and extending the expansion / contraction part 315, the light emitting element 200 is placed on the recess 406 located at the pick-off position in the trays 401 and 402.

  Here, since the adhesive strength of the pressure-sensitive adhesive sheet 290 is not uniform over the entire surface of the sheet, the peelability (easy to peel) of the light emitting element 200 from the pressure-sensitive adhesive sheet 290 is partially different. For example, in the portion where the adhesive strength is low in the adhesive sheet 290, the light emitting element 200 is easily peeled off from the adhesive surface 290A of the adhesive sheet 290, and is liable to fall (tilt) on the adhesive surface 290A. Moreover, in the part with low adhesive force in the adhesive sheet 290, the some light emitting element 200 may peel from the adhesive surface 290A, and may be conveyed by the holding part 370 at once. On the other hand, the light emitting element 200 tends to remain in the adhesive sheet 290 without being gripped by the grip portion 370 at a portion where the adhesive strength of the adhesive sheet 290 is high. In addition, it has been empirically found that the low adhesive portion and the high adhesive portion of the adhesive sheet 290 are distributed within a certain range. For example, the adhesive sheet 290 is a portion having a low adhesive strength or a high portion in a range where a plurality of light emitting elements 200 arranged continuously in the Y direction are attached. That is, the adhesive sheet 290 has a small difference in adhesive strength in a range where a plurality of light emitting elements 200 arranged in succession in the Y direction are attached.

  Therefore, the gripping device 302 is configured to automatically adjust the protrusion height at which the needle 322 pushes up the light emitting element 200 according to the adhesive strength of the adhesive sheet 290 (peelability of the light emitting element 200 from the adhesive sheet 290). ing. Specifically, the protruding height of the needle 322 is increased in a portion where the adhesive strength of the adhesive sheet 290 is high, and the protruding height of the needle 322 is decreased in a portion where the adhesive strength of the adhesive sheet 290 is low.

  When the protruding height of the needle 322 is increased, the pressure-sensitive adhesive surface 290A of the pressure-sensitive adhesive sheet 290 is deformed upward so that the light-emitting element 200 is easily peeled off from the pressure-sensitive adhesive sheet 290, but adjacent to the light-emitting element 200 that is pushed up. The light emitting element 200 to be tilted easily. When the protruding height of the needle 322 is lowered, the adhesive surface 290A of the adhesive sheet 290 is not easily deformed, and the light emitting element 200 adjacent to the light emitting element 200 that is pushed up is difficult to tilt.

  Hereinafter, a specific configuration for automatically adjusting the protrusion height of the needle 322 according to the adhesive strength of the adhesive sheet 290 will be described.

  As shown in FIG. 3, the gripping device 302 further detects whether the camera 350 as an example of an imaging unit that images the light emitting element 200 and whether the gripping unit 370 of the gripping mechanism 310 grips the light emitting element 200. And a camera 353 as an example of a detection unit.

  As shown in FIG. 5B, the camera 350 is disposed above the pickup position, and includes an annular light source (not shown) around it. The camera 350 faces downward so that the light emitting element 200 located at the pickup position falls within the imaging range of the camera 350. And the camera 350 images the light emitting element 200 moved to the pick-up position (an example of an imaging position) among the plurality of light emitting elements 200 on the adhesive surface 290A of the adhesive sheet 290. Note that the movement of the light emitting element 200 to the pickup position is determined from the driving amount of the moving mechanism 344.

  When the adhesive strength of the adhesive sheet 290 is weak and the light emitting element 200 is tilted (falls down) on the adhesive surface 290A of the adhesive sheet 290, the light emitted from the annular light source of the camera 350 is reflected by the light emitting element 200. Since the reflected light does not enter the camera 350, the image is darkened (darkened), and the light emitting element 200 cannot be recognized (imaged). In other words, the camera 350 cannot recognize the light emitting element 200 even though the light emitting element 200 is located (exists) at the pickup position.

  The camera 350 is connected to the control unit 359, and information on whether or not the light emitting element 200 at the pickup position has been recognized is sent from the camera 350 to the control unit 359. Specifically, when the camera 350 can recognize the light emitting element 200, a captured image (information) obtained by capturing the light emitting element 200 is sent to the control unit 359. When the camera 350 cannot recognize the light emitting element 200, a dark captured image (information) that cannot be recognized by the light emitting element 200 is sent to the control unit 359.

  And the control part 359 controls the drive of the raising mechanism 320, when the picked-up image imaged by the light emitting element 200 is acquired, and operates the raising mechanism 320 as follows. That is, when the camera 350 can recognize the light emitting element 200, the needle 322 pushes up the lower surface of the light emitting element 200 together with the adhesive surface 290 </ b> A of the adhesive sheet 290 with a preset protrusion height.

  When the control unit 359 acquires a darkened captured image that cannot be recognized by the light emitting element 200, the control unit 359 maintains the driving unit 326 in a stopped state and lowers the preset height setting value. change.

  As a result, the needle 322 does not push up the light emitting element 200 when the camera 350 cannot recognize the light emitting element 200, and the setting value (reference value) of the preset protrusion height of the needle 322 is low. Changed to

  Then, when the camera 350 can recognize the light emitting element 200 that has been moved to the pickup position next, the needle 322 moves the lower surface of the light emitting element 200 on the adhesive sheet 290 with the protruding height changed to a low value. The adhesive surface 290A is pushed up.

  On the other hand, when the camera 350 cannot recognize the light emitting element 200 that has been moved to the pickup position next time, the needle 322 is not pushed up, and the set value of the protruding height is changed to a lower value. .

  It should be noted that the setting value of the height that has been changed to a low value is maintained in the changed state until the condition for changing the setting value to a high value is satisfied. That is, after changing the setting value of the protrusion height to a low value, the lower surface of the light emitting element 200 that has been sequentially moved to the pickup position is changed to the protrusion height until a later-described condition for changing the setting value to a high value is satisfied. Raise it with a low value (with a raised height changed to a lower value). The condition for changing the set value to a high value is a case where the grip portion 370 could not grip the light emitting element 200 pushed up at the pickup position, as will be described later.

  The camera 350 also has a function for positioning the light emitting element 200 to the pickup position. Specifically, the camera 350 is configured to image a positioning mark 270 and a pad 280 on one end side of the light emitting element 200 in the longitudinal direction (X direction). That is, as shown in FIG. 5C, the positioning mark 270 and the pad 280 on one end side in the longitudinal direction (X direction) of the light emitting element 200 fall within the imaging range of the camera 350. In FIG. 5C, the imaging range (field of view) of the camera 350 is indicated by a square indicated by reference numeral 350A.

  Therefore, in this embodiment, when the light emitting element 200 can be recognized, specifically, a captured image obtained by capturing the positioning mark 270 and the pad 280 is sent to the control unit 359. The control unit 359 positions the light emitting element 200 based on the positions of the positioning marks 270 and the pads 280 with respect to a predetermined reference position (for example, a position indicated by the symbol TA). That is, when the positions of the positioning mark 270 and the pad 280 are deviated from the reference position, the control unit 359 controls the movement mechanism 344 to drive the light emitting element 200 to be grasped in the X direction by the deviation amount. And move in the Y direction.

  As shown in FIG. 5D, the camera 353 is disposed in the movement path of the grip portion 370 that conveys the light emitting element 200 from the pickup position to the pick-off position. The camera 353 faces upward so that the grip portion 370 that grips the light emitting element 200 falls within the imaging range of the camera 353. The camera 353 images the grip portion 370 that moves from the pickup position to the pick-off position.

  The camera 353 is connected to the control unit 359, and information indicating whether or not the grip unit 370 has gripped the light emitting element 200 pushed up at the pickup position is sent to the control unit 359. Specifically, when the grip unit 370 grips the light emitting element 200 at the pickup position, an image obtained by capturing the grip unit 370 and the light emitting element 200 is sent to the control unit 359. When the adhesive strength of the adhesive sheet 290 is strong and the gripper 370 cannot grip the light emitting element 200 at the pickup position, a captured image obtained by capturing only the gripper 370 is sent to the controller 359.

  And when the control part 359 acquires the picked-up image by which the holding part 370 and the light emitting element 200 were imaged, the movement to the pick-off position of the holding part 370 is continued, and the said light emitting element 200 is located in a pick-off position. It is placed in the recess 406.

  When the control unit 359 acquires a captured image in which only the grip unit 370 is captured, the control unit 359 returns the grip unit 370 to the pickup position and moves the next light emitting element 200 to the pickup position. At this time, the setting value of the protrusion height of the needle 322 is changed to a high value. Note that whether the captured image is the captured image obtained by capturing the grip portion 370 and the light emitting element 200 or only the captured portion 370 is determined by performing image processing in the control unit 359, for example.

  When the camera 350 can recognize the light emitting element 200 that has been moved to the pickup position next time, the needle 322 moves the lower surface of the light emitting element 200 on the pressure-sensitive adhesive sheet 290 with the protruding height changed to a high value. The adhesive surface 290A is pushed up.

  It should be noted that the setting value for the height of the jump that has been changed to a high value is maintained in the changed state until the condition for changing the setting value to a low value is satisfied. That is, after changing the setting value of the protruding height to a high value, the lower surface of the light emitting element 200 sequentially moved to the pickup position is increased until the condition for changing the setting value to a lower value is satisfied. In the state (with the rising height changed to a high value), push up. The condition for changing the set value to a low value is a case where the camera 350 cannot recognize the light emitting element 200 as described above.

[Supply unit 13]
As shown in FIG. 4, the supply unit 13 includes a table 15 on which the trays 401 and 402 are placed, and a moving mechanism 17 that moves the table 15 in the X direction and the Y direction. In the supply unit 13, the moving mechanism 17 moves the table 15 in the X direction and the Y direction, so that the light emitting element 200 to be mounted on the trays 401 and 402 is positioned at a predetermined pickup position by the transfer device 50. It is supposed to let you.

[Transfer device 50]
As shown in FIG. 4, the transfer device 50 includes a collet 57 as a holder for holding the light emitting element 200, and an aspirator that is attached with the collet 57 and generates a suction force for the collet 57 to hold the light emitting element 200. 52 and a moving mechanism 53 that moves the aspirator 52.

  Specifically, a collet 57 is attached to the suction nozzle 54 of the suction device 52. The collet 57 has a suction port (not shown) that communicates with the suction nozzle 54.

  In the transfer device 50, the suction device 52 sucks the light emitting element 200 with the suction device 52 in a state where the upper surface of the light emitting element 200 positioned at the pickup position in the supply unit 13 is abutted against the collet 57. The light emitting element 200 is held.

  In the transfer device 50, the suction device 52 is moved in the Y direction by the moving mechanism 53 while the light emitting element 200 is held by the collet 57 (see the arrow in the chain line), and the plate 34 of the positioning table 30 to be described later. The light emitting element 200 is transported upward. As the moving mechanism 53 of the transfer device 50, for example, a three-axis robot provided with a mechanism that moves in the X direction, the Y direction, and the Z direction is used.

[Element positioning device 20]
As shown in FIG. 4, the element positioning device 20 is a positioning base 30 on which the light emitting element 200 is placed (mounted), and a positioning that positions the light emitting element 200 placed on the positioning base 30 at a predetermined positioning position. A member 22 and a moving mechanism 29 that moves the positioning member 22 in the X direction and the Y direction are provided.

  The positioning table 30 sucks the air in the internal space of the cylindrical portion 32 by sucking the internal space of the cylindrical portion 32 having the opening portion 33 in the upper portion, the plate 34 provided in the opening portion 33 of the cylindrical portion 32, and negative pressure in the internal space. A suction device 36. A plurality of suction holes 38 are formed in the plate 34. The plurality of suction holes 38 pass through the plate 34 and communicate with the internal space of the cylindrical portion 32.

  As shown in FIG. 4, the positioning member 22 has a plate shape and includes a main body 22A and a pair of claw portions 22B extending from the main body 22A in the X direction. The pair of claw portions 22B are provided apart in the Y direction so that the light emitting element 200 can be disposed therebetween. The positioning member 22 is moved while maintaining a non-contact state with respect to the plate 34 so that the positioning member 22 is not attracted to the plate 34 and receives movement resistance.

  In the positioning member 22, the claw portion 22B is abutted against one of the side surfaces 252 (see FIG. 2) of the leg portion 250 of the light emitting element 200 to move the light emitting element 200, and the light emitting element 200 is moved to a predetermined position. Is positioned (positioned).

  In the present embodiment, the light emitting element 200 is positioned by selecting one of the pair of claw portions 22B. Therefore, the positioning member 22 may have a configuration without one of the pair of claw portions 22B.

[Substrate positioning device 40]
As shown in FIG. 4, the board positioning device 40 includes a pair of transport members (for example, conveyors) 42 that transport the printed circuit board 102 in the X direction. The pair of conveying members 42 are arranged apart in the Y direction so that the printed circuit board 102 can be introduced therebetween.

  In the substrate positioning device 40, the printed circuit board 102 introduced between the pair of transport members 42 is positioned in the X direction, the Y direction, and the Z direction with respect to the pair of transport members 42. The pair of conveying members 42 conveys the printed circuit board 102 in the X direction, so that the printed circuit board 102 is relatively moved in the X direction while being positioned in the Y direction with respect to the collet 70 described later. ing.

  The substrate positioning device 40 includes a coating device (not shown) such as a dispenser for applying an epoxy-based adhesive containing silver (Ag) at a mounting position on which the light emitting element 200 is mounted on the printed circuit board 102. Have.

[Transfer device 60]
As shown in FIG. 4, the transfer device 60 includes a collet 70 as a holder for holding the light emitting element 200, and an aspirator that is attached to the collet 70 and generates a suction force for the collet 70 to hold the light emitting element 200. 62 and a moving mechanism 63 that moves the suction device 62.

  Specifically, the collet 70 is attached to the suction nozzle 64 of the suction device 62. The collet 70 is formed with a suction port (not shown) that communicates with the suction nozzle 64.

  In the transfer device 60, the light emitting element 200 is held by the collet 70 by sucking the light emitting element 200 by the suction device 62 in a state where the ridges 271 and 272 (see FIG. 2) of the light emitting element 200 are abutted against the collet 70. To do. Moreover, in the transfer apparatus 60, the holding | maintenance state of the light emitting element 200 by the collet 70 is cancelled | released by stopping the suction by the suction device 62. FIG.

  The moving mechanism 63 moves the collet 70 relative to the printed circuit board 102 in the Y direction by moving the suction device 62 in the Y direction. That is, in this embodiment, the collet 70 is moved in the Y direction by the moving mechanism 63, and the printed board 102 is moved in the X direction by the transport member 42 of the board positioning device 40, so that the collet 70 is moved with respect to the printed board 102. Relative movement is made in the X and Y directions.

  The moving mechanism 63 moves the collet 70 in the vertical direction (Z direction) relative to the printed circuit board 102 by moving the suction device 62 in the vertical direction (Z direction). In this embodiment, the collet 70 is moved relative to the printed circuit board 102 in the X direction and the Y direction while the light emitting element 200 is held by the collet 70, and then the collet 70 is lowered downward (−Z direction). By doing so (see the dashed line arrow), the light emitting element 200 is mounted on the printed circuit board 102.

  As the moving mechanism 63, for example, a biaxial robot that can move in the Y direction and the Z direction is used.

<< Method for Manufacturing Light-Emitting Substrate 100 >>
The method for manufacturing the light emitting substrate 100 according to the present embodiment includes an element manufacturing process for manufacturing the light emitting element 200 and a mounting process for mounting the manufactured light emitting element 200 on the printed board 102.

[Element manufacturing process]
The element manufacturing process includes a forming process, an imaging process, a bumping process, a peeling process, and a detecting process.

<Formation process>
The forming step is a step of forming the light emitting element 200 by cutting the light emitting element 200 from the wafer 14 (semiconductor substrate). In this forming step, as shown in FIG. 7, first, a plurality of light emitting points 218 are formed on the surface of the wafer 14 formed of GaAs or the like. Next, power is supplied to the portion of the wafer 14 that is formed as the light emitting element 200, the amount of light at the light emitting point 218 is detected, and it is determined whether or not the portion is a non-defective product. Although not shown in FIG. 7, positioning marks 270 and pads 280 (see FIG. 5D) are also formed on the surface of the wafer 14.

  Next, the first groove 14A is formed on the surface of the wafer 14 by, for example, etching. Next, after adhering the dicing adhesive sheet 295 to the surface of the wafer 14, the second groove 14 </ b> B is formed on the back surface of the wafer 14 by cutting with a cutting member 11 such as a dicing blade.

  Next, as shown in FIG. 8, the adhesive sheet 290 is attached to the back surface of the wafer 14, and then the dicing adhesive sheet 295 is peeled from the front surface of the wafer 14.

  Thus, the light emitting element 200 having a T-shaped cross section is cut out (formed). Note that a plurality of the light emitting elements 200 are attached to the adhesive sheet 290 along the width direction (Y direction) and the longitudinal direction (X direction). Moreover, the light emission point 218 is formed in the Y direction side edge part in each light emitting element 200, specifically, the overhang | projection part 213 (refer FIG. 7).

<Imaging process>
The imaging process is a process in which the camera 350 images the light emitting element 200. In the imaging process, first, the moving mechanism 344 moves the holding unit 342 holding the wafer 14 in the X direction and the Y direction, thereby moving the light emitting element 200 to be gripped to a predetermined pickup position (FIG. 3). And FIG. 5B).

  Next, the camera 350 images the light emitting element 200 that has been moved to the pickup position (an example of the imaging position) among the plurality of light emitting elements 200 on the adhesive surface 290 </ b> A of the adhesive sheet 290.

  Then, information indicating whether or not the light emitting element 200 at the pickup position has been recognized is sent from the camera 350 to the control unit 359. Specifically, when the camera 350 can recognize the light emitting element 200, a captured image (information) obtained by capturing the light emitting element 200 is sent to the control unit 359. When the camera 350 cannot recognize the light emitting element 200, a dark captured image (information) that cannot be recognized by the light emitting element 200 is sent to the control unit 359.

<Uplift process>
The push-up process is a process of pushing up the light emitting element 200 with the needle 322. The protruding position where the needle 322 pushes up the light emitting element 200 is opposite to the other light emitting element 200 adjacent to the light emitting element 200 to be grasped with respect to the center in the width direction of the light emitting element 200 positioned at the pickup position. The position is set.

  Further, in the element manufacturing process, the imaging process, the bumping process, the peeling process, and the detection process are repeated after the forming process, so that the width direction of the light emitting element 200 extends from one end to the other end of the wafer 14 (adhesive sheet 290). The light emitting elements 200 arranged in order in the (−Y, Y direction) are pushed up in this order. As shown by the arrows in FIG. 10, the order is such that the wafer 14 proceeds in a zigzag manner from the X direction end side and the −Y direction side end side of the wafer 14. That is, in an odd number row (hereinafter, simply referred to as “odd number row”) counted from the X direction side of the wafer 14, the wafer 14 is pushed up in the order from the −Y direction end portion of the wafer 14 in the Y direction, and from the X direction side of the wafer 14. In an even-numbered row (hereinafter, simply referred to as “even-numbered row”), the wafer 14 is pushed up in the order from the Y-direction end of the wafer 14 in the −Y direction. Note that the element 199 formed in an incomplete shape on the outer peripheral portion of the wafer 14 is not used as the light emitting element 200 and thus is not a gripping target.

  Thus, in the element manufacturing process, since the light emitting element 200 is peeled in order from one end of the wafer 14 to the other end, the light emitting element 200 to be grasped is one side of the light emitting element 200 positioned at the pickup position. Exists only in the Y direction or the -Y direction.

  In the uplift process, the control unit 359 controls the drive of the uplift mechanism 320 when the captured image obtained by imaging the light emitting element 200 is acquired, and operates the uplift mechanism 320 as follows.

  That is, as shown in FIG. 5B, the suction portion 324 of the raising mechanism 320 sucks the adhesive sheet 290 through the through-hole 332 and the suction groove 334 formed in the upper wall of the cylindrical portion 330, so that the cylindrical portion The adhesive sheet 290 is adsorbed on the upper wall of 330.

  Next, the needle 322 is driven by the drive unit 326 to raise the needle 322 to a preset protrusion height. As a result, as shown in FIG. 9A, the lower surface of the light emitting element 200 is set in advance on the opposite side of the light emitting element 200 adjacent to the gripped light emitting element 200 with respect to the center in the width direction. The needle 322 protrudes together with the adhesive surface 290A of the adhesive sheet 290 at the projected height. 5B and 9A illustrate a case where the even-numbered light emitting elements 200 on the wafer 14 are pushed up.

  As described above, in the push-up process, when the camera 350 can recognize the light-emitting element 200, the needle 322 causes the lower surface of the light-emitting element 200 to adhere to the preset height (reference value) of the pressure-sensitive adhesive sheet. The adhesive surface 290A of 290 is pushed up.

  On the other hand, when the control unit 359 acquires a darkened captured image that cannot be recognized by the light emitting element 200, the control unit 359 maintains the state where the driving of the thrusting mechanism 320 is stopped, and sets a preset thrust height. Change the value lower. That is, when the camera 350 cannot recognize the light emitting element 200, the needle 322 does not push up the light emitting element 200, and the set value of the preset protrusion height of the needle 322 is changed to a low value.

  Next, as in the above-described imaging step, the moving unit 342 is moved in the X direction and the Y direction by the moving mechanism 344, so that the light emitting element 200 (200X) that has not been pushed up as illustrated in FIG. 9B. The adjacent light-emitting element 200 (hereinafter referred to as the next light-emitting element 200Y) that is the next object to be gripped is moved to the pickup position (movement process).

  Next, as in the above-described imaging step, the camera 350 images the next light emitting element 200Y, and information on whether or not the next light emitting element 200 has been recognized is sent from the camera 350 to the control unit 359 (recognition step). .

  As a result, when the next light emitting element 200Y can be recognized by the camera 350, as shown in FIG. 9C, the needle 322 moves the lower surface of the next light emitting element 200Y at the protruding height changed to a low value. The adhesive surface 290A of the adhesive sheet 290 is pushed up together.

  If the next light emitting element 200Y cannot be recognized by the camera 350, the needle 322 is not pushed up, and the set value of the protruding height is changed to a lower value (changing step). The moving process, the recognition process, and the changing process are repeated until the camera 350 recognizes the light emitting element 200 and pushes up the light emitting element 200.

  It should be noted that the setting value of the height that has been changed to a low value is maintained in the changed state until the condition for changing the setting value to a high value is satisfied. That is, when the thrusting process is executed after changing the setting value of the thrust height to a low value, the thrust height is lowered until the condition for changing the setting value to a high value is satisfied ( The needle 322 pushes up the light emitting element 200 at a raised height that has been changed to a lower value.

<Peeling process>
The peeling process is a process of gripping the light emitting element 200 pushed up in the thrusting process and peeling the light emitting element 200 from the adhesive surface 290 </ b> A of the adhesive sheet 290. In this peeling step, the suction portion is passed through the plurality of through holes 378 in a state where the ridge line 285 of the light emitting element 200 pushed up in the pushing-up step is abutted against the abutting surface 375 of each abutting portion 374 in the grip portion 370. By grasping the light emitting element 200 by 318, the gripping portion 370 grips the light emitting element 200 (see FIGS. 6 and 3).

  Next, the light emitting element 200 is peeled from the pressure-sensitive adhesive sheet 290 by contracting the stretchable part 315 in a state where the gripping part 370 maintains the suction to the light emitting element 200.

<Detection process>
The detection step is a step of detecting whether or not the light emitting element 200 is gripped in the peeling step. In the detection step, the light emitting element 200 peeled from the pressure-sensitive adhesive surface 290A of the pressure-sensitive adhesive sheet 290 in the peeling step is conveyed. Specifically, in the detection step, the light emitting element 200 is transported from the pick-up position to the pick-off position by moving the arm 312 of the grip portion 370 that grips the light emitting element 200 peeled in the peeling step in the X direction. To do.

  Next, the camera 353 images the grip portion 370 in the movement path of the grip portion 370 that moves from the pickup position to the pick-off position.

  Next, information indicating whether or not the gripper 370 grips the light emitting element 200 at the pickup position is sent to the controller 359. Specifically, when the grip unit 370 grips the light emitting element 200 at the pickup position, an image (information) obtained by capturing the grip unit 370 and the light emitting element 200 is sent to the control unit 359. When the gripper 370 cannot grip the light emitting element 200 at the pickup position, a captured image (information) obtained by capturing only the gripper 370 is sent to the controller 359.

  When the captured image obtained by capturing the grip portion 370 and the light emitting element 200 is acquired, the control unit 359 continues to move the grip portion 370 to the pick-off position, and extends the expansion / contraction portion 315, thereby extending the light emitting element 200. The tray 401, 402 is placed in the recess 406 located at the pick-off position. And it transfers to the above-mentioned imaging process, and an imaging process, a protrusion process, a peeling process, and a detection process are repeated.

  When the control unit 359 acquires a captured image in which only the grip unit 370 is captured, the control unit 359 returns the grip unit 370 to the pickup position. Furthermore, the set value of the protrusion height of the needle 322 is changed to a high value. And it transfers to the above-mentioned imaging process, and an imaging process, a protrusion process, a peeling process, and a detection process are repeated.

  It should be noted that the setting value for the height of the jump that has been changed to a high value is maintained in the changed state until the condition for changing the setting value to a low value is satisfied. That is, when the thrusting process is executed after changing the setting value of the thrust height to a high value, the thrust height is increased until the condition for changing the setting value to a low value is satisfied ( The needle 322 pushes up the light emitting element 200 at a protruding height changed to a high value.

<Supplementary element manufacturing process>
In the element manufacturing process, the light emitting elements 200 pushed up in a zigzag order from the X-direction end side and the −Y-direction end side of the wafer 14 are placed in the recesses 406 of the trays 401 and 402 alternately in this order. .

  Specifically, for example, as shown in FIG. 10, among the plurality of light emitting elements 200, the light emitting elements 200 </ b> A, 200 </ b> B, 200 </ b> C, and 200 </ b> D arranged in the odd-numbered Y direction are mounted on the tray 401. Next, the light emitting element 200B is placed on the tray 402, then the light emitting element 200C is placed on the tray 401, and then the light emitting element 200D is placed on the tray 402. In this way, the plurality of light emitting elements 200 are mounted in order and alternately.

  Further, in the element manufacturing process, the light emitting element 200 pushed up by the needle 322 in order from one end of the wafer 14 to the other end is kept in the direction of the light emitting point 218 on the wafer 14 (see FIG. 10) in FIG. As shown, the trays 401 and 402 are placed in the recesses 406. That is, in the transporting process, the light emitting point 218 is placed on the concave portions 406 of the trays 401 and 402 in a state where the light emitting point 218 is located on the Y direction side of the light emitting element 200 without rotating the light emitting element 200.

  As described above, the light emitting element 200 cut out from the wafer 14 is placed on the recesses 406 of the trays 401 and 402, so that the light emitting element 200 can be mounted on the printed board 102, and the light emitting element 200 is manufactured. Note that the element manufacturing process is an example of a manufacturing method for manufacturing the light emitting element 200.

  In this embodiment, as shown in FIGS. 3 and 11, the trays 401 and 402 are arranged side by side along the Y direction. However, as shown in FIG. 12, the trays 401 and 402 are arranged along the X direction. It may be arranged.

[Mounting process]
In the mounting process, first, the tray 402 is rotated relative to the tray 401 so that the light emitting points 218 are in different directions. Specifically, as shown in FIG. 13, the light emitting point 218 of the light emitting element 200 on the tray 401 faces the Y direction, whereas the light emitting point 218 of the light emitting element 200 on the tray 402 is −Y. Rotate it relative to the direction. That is, the tray 402 is rotated 180 degrees relative to the tray 401.

  Note that since the tray 402 may be rotated relative to the tray 401, the tray that is actually rotated may be either the tray 402 or the tray 401, or both the tray 401 and the tray 402. When both the tray 401 and the tray 402 are rotated, for example, each of the tray 401 and the tray 402 may be rotated by 90 degrees.

  In the present embodiment, as shown in FIG. 4, the light emitting point 218 of the light emitting element 200 on the tray 401 and the light emitting point 218 of the light emitting element 200 on the tray 402 are oriented in different directions. , 402 is placed on the table 15 of the supply unit 13. In the present embodiment, as shown in FIG. 4, the trays 401 and 402 are arranged along the X direction, but may be arranged along the Y direction.

  Then, the light emission points 218 of the tray 401 and the tray 402 are placed on the printed circuit board 102 in the direction of the light emission points 218 in the trays 401 and 402. Further, the light emitting elements 200 of the trays 401 and 402 are placed on the printed circuit board 102 so that the light emitting elements 200 are arranged in the order shown in FIG.

  Specifically, the light emitting elements 200 of the trays 401 and 402 are placed on the printed board 102 as follows.

  That is, as shown in FIG. 4, first, in the supply unit 13, the moving mechanism 17 moves the table 15 in the X direction and the Y direction, thereby positioning the light emitting element 200 to be mounted at a predetermined pickup position. Let

  Next, the light emitting element 200 positioned at the pickup position of the supply unit 13 is transferred by the transfer device 50 onto the plate 34 of the positioning table 30, and the light emitting element 200 is placed on the plate 34.

  Next, the light emitting element 200 placed on the plate 34 is moved (positioned) by the positioning member 22 to a predetermined positioning position on the plate 34.

  Next, in the board positioning device 40, the pair of transport members 42 positions the printed board 102. The positioning of the printed circuit board 102 is not necessarily performed after the positioning of the light emitting element 200, and may be performed before or simultaneously with the positioning of the light emitting element 200.

  Next, an adhesive is applied to the mounting position of the light emitting element 200 on the printed circuit board 102 by a coating apparatus (not shown).

  The light emitting element 200 positioned in the element positioning step is transferred by the transfer device 60 to the mounting position of the light emitting element 200 on the printed board 102.

  A plurality of light emitting elements 200 are arranged in a staggered manner with respect to the printed wiring board 44. That is, the mounting process is performed according to the number of light emitting elements 200. In the present embodiment, for example, after the plurality of light emitting elements 200 of the tray 401 are arranged in a line at intervals on one side in the Y direction of the printed board 102 (the lower side in FIG. 13), the plurality of light emitting elements of the tray 402 are arranged. The elements 200 are arranged in a row on the other side in the Y direction of the printed board 102 (upper side in FIG. 13). That is, in the present embodiment, for example, after being arranged at odd-numbered mounting positions T1, T3, T5,... , T4..., Arranged in a staggered manner. Specifically, the light emitting elements 200A and 200C in FIG. 10 are arranged at the mounting positions T1 and T3, and the light emitting elements 200B and 200D in FIG. 10 are arranged at the mounting positions T2 and T4.

  The light emitting substrate 100 is manufactured through the above steps.

<< Operation of this embodiment >>
In the present embodiment, when the camera 350 cannot recognize the light emitting element 200 in the imaging process, the preset height setting value of the needle 322 is changed to a low value. Next, when the light emitting element 200 is pushed up with the needle 322, the needle 322 pushes up with the protruding height changed to a low value.

  Thus, since the protrusion height of the needle 322 is automatically changed (lowered), when the operator stops the apparatus and changes the protrusion height of the needle 322 (when lowering). In comparison, a reduction in the operating rate of the apparatus is suppressed. Thereby, the fall of the manufacturing efficiency of the light emitting substrate 100 is suppressed.

  Further, in the present embodiment, the setting value of the jump height changed to a low value is maintained in the changed state until the condition for changing the setting value to a high value is satisfied. That is, when the thrusting process is executed after changing the setting value of the thrust height to a low value, the thrust height is kept low (with the thrust height changed to a low value). ), The needle 322 pushes up the light emitting element 200.

  Here, it has been empirically known that the portion where the light emitting element 200 is easily peeled off from the pressure-sensitive adhesive sheet 290 (the portion where the pressure-sensitive adhesive force is low in the pressure-sensitive adhesive sheet 290) is distributed in a coherent range. For example, the adhesive sheet 290 is a portion having a low adhesive strength in a range where a plurality of light emitting elements 200 arranged continuously in the Y direction are attached.

  Therefore, the needle 322 pushes up the light emitting element 200 in a state where the thrust height is continuously kept low (with the thrust height changed to a low value), so that the needle 322 has a thrust height. Compared to the case where only the next element is pushed up with a lower height, the success rate of grasping the element (separation success rate) increases.

  In the present embodiment, in the detection step, when the control unit 359 acquires a captured image obtained by capturing only the grip unit 370, the setting value of the protrusion height of the needle 322 is changed to a high value.

  Thus, since the protrusion height of the needle 322 is automatically changed (increased), when the operator stops the apparatus and changes the protrusion height of the needle 322 (when increasing). In comparison, a reduction in the operating rate of the apparatus is suppressed. Thereby, the fall of the manufacturing efficiency of the light emitting substrate 100 is suppressed.

  Further, in the present embodiment, the setting value of the jump height that has been changed to a high value is maintained in the changed state until the condition for changing the setting value to a low value is satisfied. That is, when the thrusting process is executed after changing the setting value of the thrust height to a high value, the thrust height is maintained high (with the thrust height changed to a high value). ), The needle 322 pushes up the light emitting element 200.

  Here, it has been empirically known that portions where the light emitting element 200 is difficult to peel off from the pressure-sensitive adhesive sheet 290 (portions having high adhesive force in the pressure-sensitive adhesive sheet 290) are distributed in a coherent range. For example, the adhesive sheet 290 is a portion having a high adhesive strength in a range in which a plurality of light emitting elements 200 arranged continuously in the Y direction are attached.

  Accordingly, the needle 322 pushes up the light emitting element 200 in a state where the thrust height is continuously maintained high (with the thrust height changed to a high value), so that the needle 322 has a thrust height. Compared to the case where only the next element is pushed up by increasing the height, the element gripping success rate (peeling success rate) is increased.

  In the present embodiment, as shown in FIG. 9, in the bumping process, the light emission is performed on the side opposite to the other light emitting element 200 adjacent to the light emitting element 200 to be grasped with respect to the center in the width direction of the light emitting element 200. The needle 322 pushes up the lower surface of the element 200 together with the adhesive sheet 290.

  Here, as shown in FIG. 14, when the needle 322 pushes up the lower surface of the light emitting element 200 together with the adhesive sheet 290 at the center in the width direction of the light emitting element 200 (comparative example), the adhesive sheet 290 is affected by the lifting. The adjacent light emitting element 200 may fall down.

  Further, in the comparative example, as illustrated in FIG. 15, the adjacent light emitting element 200 may be lifted together under the influence of the pressure sensitive adhesive sheet 290 being lifted.

  On the other hand, in the present embodiment, the lower surface of the light emitting element 200 is opposite to the other light emitting element 200 adjacent to the light emitting element 200 to be grasped with respect to the center in the width direction of the light emitting element 200. Since the needles 322 are pushed up together, the other adjacent light emitting elements 200 are not easily affected by the lifting of the adhesive sheet 290. For this reason, the fall of another adjacent light emitting element 200 and a lift are suppressed.

  Further, in the present embodiment, in the transfer process, the light emitting element 200 is placed on the concave portions 406 of the trays 401 and 402 as shown in FIG. 11 while keeping the direction of the light emitting point 218 on the wafer 14 (see FIG. 10). Thereafter, as shown in FIG. 13, in the mounting process, the tray 402 is rotated relative to the tray 401 so that the light emitting points 218 are oriented in different directions. Then, the light emission points 218 of the tray 401 and the tray 402 are placed (mounted) on the printed circuit board 102 with the direction of the light emission points 218 in the trays 401 and 402 maintained.

  Here, in the case where the light emitting element 200 is directly mounted on the printed circuit board 102 from the wafer 14 (comparative example), when the light emitting elements 200 are arranged at even mounting positions T2, T4,. It is necessary to rotate each time the light emitting element 200 is placed.

  On the other hand, in the present embodiment, the light emitting element 200 may be placed on the printed circuit board 102 while maintaining the orientation in the trays 401 and 402, so that it is not necessary to individually change the orientation of the light emitting element 200, and the orientation of the light emitting element 200 is changed. Change time is shortened.

  In this embodiment, the light emitting elements 200 of the trays 401 and 402 are placed on the printed circuit board 102 so that the light emitting elements 200 are arranged in the order shown in FIG.

  For this reason, the characteristics such as the amount of light are approximated as compared with the case where a plurality of light emitting elements 200 in a single wafer 14 are randomly placed on the printed circuit board 102 or the light emitting elements 200 of different wafers 14 are placed on the printed circuit board 102. The light emitting elements 200 are sequentially arranged on the printed board 102. Thereby, the adjustment time of the light quantity in the light emitting substrate 100 is shortened.

<Modification>
In the present embodiment, the camera 353 is used as an example of the detection unit, but is not limited thereto. As the detection unit, for example, an optical sensor that detects the light emitting element 200 held by the holding unit 370 may be used.

  In the present embodiment, the tray 402 is rotated 180 degrees relative to the tray 401, but the present invention is not limited to this. For example, in the case where a plurality of light emitting elements 200 are mounted on the printed circuit board 102 so that the longitudinal direction of another light emitting element 200 is 90 degrees with respect to the longitudinal direction of one light emitting element 200, the tray 402 is replaced with the tray 401. 90 degrees relative to the angle. That is, the angle at which the tray 402 is rotated relative to the tray 401 is determined by the orientation of the light emitting element 200 mounted on the printed circuit board 102. Note that the arrangement in which the longitudinal direction of another light emitting element 200 is 90 degrees with respect to the longitudinal direction of one light emitting element 200 means that the light emitting element 200 is, for example, in an L shape in a plan view. It may be arranged in

  Moreover, in this embodiment, although the light emitting element 200 was used as an element, it is not restricted to this. The element may be, for example, a light receiving element. In the case of a light receiving element, the functional unit is a light receiving point. In addition, the function part should just be a part which exhibits a specific function.

  In the present embodiment, the light emitting elements 200 arranged in order from one end to the other end of the wafer 14 are placed on the trays 401 and 402 alternately in this order, but this is not restrictive. For example, the light emitting elements 200 may be placed on the trays 401 and 402 in a random order, not in the order. Further, for example, the light emitting element 200 may be continuously placed on one of the trays 401 and 402.

  The present invention is not limited to the above-described embodiment, and various modifications, changes, and improvements can be made without departing from the spirit of the present invention. For example, the modification examples described above may be appropriately combined.

100 Light emitting substrate (an example of a substrate device)
102 Printed circuit board (an example of a circuit board)
200 Light Emitting Element (Example of Element)
290A Adhesive surface 302 Gripping device 322 Needle (an example of a protrusion)
350 camera (an example of an imaging unit)
353 camera (an example of a detection unit)
370 gripping part

Claims (11)

An imaging unit for imaging an element moved to an imaging position among a plurality of elements on the adhesive surface;
When the imaging unit can recognize the element, the lower surface of the element is pushed up together with the adhesive surface, and when the imaging unit cannot recognize the element, the lower surface of the element moved to the imaging position after the next, A protrusion that lowers the protrusion height and protrudes with the adhesive surface; and
A gripping part for gripping the element with the protruding top protruding;
A gripping device comprising: When the imaging unit cannot recognize the element, the protruding part protrudes below the lower surface of the element that has been sequentially moved to the imaging position until the condition for increasing the protruding height of the protruding part is satisfied. The grasping device according to claim 1, wherein the adhesive surface is pushed up together with the height being lowered. A detection unit for detecting whether the gripping unit grips the element;
The protrusion is configured such that when the detection unit does not detect gripping of the element, the lower surface of the element that has been moved to the imaging position after the next is protruded together with the adhesive surface by increasing the protrusion height. The gripping device according to 1 or 2. When the detection unit does not detect gripping of the element, the protrusion is below the lower surface of the element that is sequentially moved to the imaging position until the condition for reducing the protrusion height of the protrusion is satisfied. The grasping device according to claim 3, wherein the gripping device is pushed up together with the adhesive surface in a state where the protruding height is increased. The element is long in one direction, the height in a cross section intersecting with the one direction is larger than the length in the width direction,
The gripping unit grips the plurality of elements arranged on the adhesive surface along the width direction individually in order from the end of the adhesive surface to the width direction,
5. The projecting upper portion projects the lower surface of the element together with the adhesive surface on the side opposite to the other element adjacent to the element with respect to the center in the width direction of the element. The gripping device according to item. An imaging step of imaging an element moved to an imaging position among a plurality of elements on the adhesive surface;
If the element can be recognized in the imaging step, the upper part pushes up the lower surface of the element together with the adhesive surface, and if the element cannot be recognized in the imaging step, the upper part is in the imaging position after the next. A push-up step of pushing down the lower surface of the moved element and lowering the push-up height together with the adhesive surface;
A separation step of grasping the element pushed up in the protrusion step and separating the element from the adhesive surface;
The manufacturing method of the element which has this. In the uplift process,
If the element cannot be recognized in the imaging step, the protrusion height of the lower surface of the element that has been sequentially moved to the imaging position is reduced until the condition for increasing the protrusion height of the protrusion is satisfied. The device manufacturing method according to claim 6, wherein the adhesive surface is pushed up in a state. A detection step of detecting whether or not the element is gripped in the peeling step;
In the bumping step, if the gripping of the element is not detected in the detection step, the lower surface of the element that has been moved to the imaging position after the next is pushed up together with the adhesive surface by increasing the bump height. The manufacturing method of the element of Claim 6 or 7. In the protrusion step, when the gripping of the element is not detected in the detection step, until the condition for reducing the protrusion height of the protrusion upper portion is satisfied, the elements sequentially moved to the imaging position are subsequently processed. The method for manufacturing an element according to claim 8, wherein the lower surface is raised together with the adhesive surface in a state where the protrusion height is increased. The element is used which is long in one direction and whose height in a cross section intersecting with the one direction is larger than the length in the width direction,
In the peeling step, the plurality of elements arranged on the adhesive surface along the width direction are individually gripped in order from the end of the adhesive surface in the width direction,
10. The bumping step of pushing up the lower surface of the element together with the adhesive surface on the side opposite to the other element adjacent to the element with respect to the center in the width direction of the element. 2. A method for producing an element according to item 1.   The manufacturing method of the board | substrate apparatus which has the process of putting the said element manufactured by the manufacturing method of the element of any one of Claims 6-10 on a board | substrate.