JP2022149981A - Manufacturing method and manufacturing device of substrate device - Google Patents

Abstract

To provide a manufacturing method of a substrate device that can suppress the characteristics difference of adjacently mounted elements on a substrate compared to a case not taking into account the distance on the wafer between a first element mounted on the substrate and an element mounted on the substrate adjacent to the first element.SOLUTION: A manufacturing method of a substrate device includes a first step of holding a first element cut out from a wafer and mounting the first element on a substrate, and a second step of gripping a third element that is cut out from the wafer and in which a distance between the first element and the third element is within a predetermined range on the wafer, and mounting the third element on the substrate adjacent to the first element when the distance between the second element cut out from the wafer and the first element is outside the predetermined range on the wafer.SELECTED DRAWING: Figure 11

Description

The present invention relates to a substrate device manufacturing method and manufacturing apparatus.

Patent Document 1 describes a first step of placing a plurality of elements cut out from a wafer and having a functional portion formed at one end thereof on a plurality of placing portions while maintaining the direction of the functional portion on the wafer, and the functional portion being different from each other. After one mounting portion is rotated relative to the other mounting portion so as to be oriented, the elements of the one mounting portion and the other mounting portion are mounted on the substrate while maintaining the orientation of the functional portion on the mounting portion. and a second step of placing.

Japanese Patent No. 6555100

If the elements whose distance on the wafer is out of the predetermined range are mounted adjacent to each other on the substrate, the characteristic difference between the elements may exceed the acceptance criteria.

The present invention provides an advantage over substrate-mounted first devices and substrate-mounted devices adjacent to substrate-mounted devices that do not take into account wafer distances. It is an object of the present invention to provide a manufacturing method and a manufacturing apparatus for a substrate device capable of suppressing the characteristic difference between the elements.

A method for manufacturing a substrate device according to a first aspect includes a first step of holding a first element cut out from a wafer and mounting the first element on a substrate, a second element cut out from the wafer and the second element cut out from the wafer. When the distance from the first element is outside the predetermined range on the wafer, the distance between the third element cut out from the wafer and the first element is within the predetermined range on the wafer. and a second step of holding the device and mounting the third device to the substrate adjacent to the first device.

In the substrate device manufacturing method according to the second aspect, the order of gripping the plurality of elements cut out from the wafer is predetermined, and the second step comprises: is outside a predetermined range, gripping the second element and discarding the second element.

In the method for manufacturing a substrate device according to the third aspect, the order of gripping the plurality of elements cut out from the wafer is predetermined, and the second step comprises holding the first element and the second element on the wafer. is outside a predetermined range, the third element is gripped without gripping the second element.

In the method for manufacturing a substrate device according to the fourth aspect, the distance is the distance between the center of gravity of the wafer and the center of gravity of one element on the wafer, and the distance between the center of gravity of the wafer and the center of gravity of another element on the wafer. Defined by distance and difference.

In the substrate device manufacturing method according to the fifth aspect, the distance is defined by the distance between the center of gravity of one element on the wafer and the center of gravity of another element on the wafer.

A manufacturing apparatus according to a sixth aspect uses a supply section that supplies elements to be mounted on a substrate from a plurality of elements cut out from a wafer, and a gripper for gripping the elements in the supply section, a transfer device for transferring the element, the supply unit having a movement mechanism for moving the element for gripping by the gripper, the transfer device being the first element among the plurality of elements; to be mounted on the substrate, a distance between a second element of the plurality of elements and the first element is outside a predetermined range on the wafer and a distance between the first element of the plurality of elements is When the distance between the three elements and the first element is within the predetermined range on the wafer, the moving mechanism moves the third element to a position for the gripper to grip the third element. .

A manufacturing apparatus according to a seventh aspect comprises an element positioning device that positions the element transferred by the transfer device, a substrate positioning device that positions the substrate, and a substrate positioning device that positions the element in the substrate positioning device. and another transfer device for transferring to a substrate and mounting the element on the substrate.

According to the method for manufacturing a substrate device according to the first aspect, compared to the case where the distance on the wafer between the first element and the element mounted adjacent to the first element is not considered, It is possible to suppress the difference in characteristics of the elements used.

According to the method for manufacturing a substrate device according to the second aspect, unused elements can be discarded when the order of holding the elements is predetermined.

According to the method for manufacturing a substrate device according to the third aspect, when the order of holding the elements is predetermined, the third element is mounted on the substrate in a short time compared to discarding unused elements. can do.

According to the method for manufacturing a substrate device according to the fourth aspect, compared to the case where the relative distance on the wafer between the elements mounted adjacent to each other on the substrate is used as the distance, It is possible to suppress the difference in characteristics of the elements.

According to the manufacturing method of the substrate device according to the fifth aspect, compared with the case of using the difference in the distance from the center of gravity of the wafer between the elements mounted adjacent to each other on the substrate as the distance, it is possible to easily manage the element information. can.

According to the manufacturing apparatus according to the sixth aspect, compared to the case where the distance on the wafer between the first element and the element mounted adjacent to the first element is not considered, the element mounted adjacent to the substrate characteristic difference can be suppressed.

According to the manufacturing apparatus according to the seventh aspect, compared with the case where the distance on the wafer between the first element and the element mounted adjacent to the first element is not taken into consideration, the element with suppressed characteristic difference is formed on the substrate. Can be mounted next to each other.

1 is a plan view showing a light-emitting substrate device according to an embodiment of the invention; FIG. 1 is a side cross-sectional view showing a light-emitting substrate device according to an embodiment of the present invention; FIG. BRIEF DESCRIPTION OF THE DRAWINGS It is a perspective view which shows some manufacturing apparatuses which concern on one embodiment of this invention. BRIEF DESCRIPTION OF THE DRAWINGS It is a perspective view which shows some manufacturing apparatuses which concern on one embodiment of this invention. It is drawing which shows the push-up mechanism which concerns on one embodiment of this invention. FIG. 4 is a side cross-sectional view showing a grip portion according to one embodiment of the present invention; It is a figure which shows the process of manufacturing the light emitting element which concerns on one embodiment of this invention. 1 is a perspective view showing an arrangement of light emitting elements cut out from a wafer according to one embodiment of the present invention; FIG. FIG. 4 is a side cross-sectional view showing a state in which the light-emitting element according to the embodiment of the invention is pushed up by a needle; 1 is a perspective view showing an arrangement of light emitting elements cut out from a wafer according to one embodiment of the present invention; FIG. FIG. 4 is a plan view showing a state in which one tray is relatively rotated with respect to another tray; FIG. 4 is a plan view showing the distance between light emitting elements in the partition for light emitting elements on the wafer; FIG. 4 is a plan view showing the order in which consumed light-emitting elements are picked up in one tray and the order in which consumed light-emitting elements are picked up from another tray in the example. It is a perspective view showing a part of the manufacturing apparatus according to another embodiment of the present invention.

An example of an embodiment according to the present invention will be described with reference to the drawings. First, the light-emitting substrate device 100 as an example of the substrate device will be described below. Next, the manufacturing apparatus 10 for manufacturing the light-emitting substrate device 100, the manufacturing method for manufacturing the light-emitting substrate device 100, and the effects of the present embodiment will be described.

The X direction, −X direction, Y direction, −Y direction, Z direction (upward) and −Z direction (downward) used in the subsequent description are the directions of the arrows shown in the drawings. In addition, the X (-X) direction (horizontal direction), Y (-Y) direction (horizontal direction), and Z (-Z) direction (vertical direction) are directions that intersect each other (specifically, orthogonal directions). is.

In addition, the symbol in which the cross mark "x" is described in the "o" in the figure means an arrow pointing from the front side to the back side of the paper surface. In addition, the symbol in which a dot mark "·" is described in the "o" in the figure means an arrow pointing from the back to the front of the paper surface. Also, the dimensional ratios in the X direction, Y direction, and Z direction between parts of each member shown in each drawing, and the dimensional ratios in the X direction, Y direction, and Z direction between each member may differ from the actual dimensional ratios. There is

(First embodiment)
[Light emitting substrate device 100]
First, the configuration of a light-emitting substrate device 100 (an example of a substrate device) will be described. 1 and 2 show the configuration of a light-emitting substrate device 100. FIG. Specifically, FIG. 1 shows a part (one end side) of the light emitting substrate device 100 . 2 also shows a part of a side cross-sectional view of the light emitting substrate device 100. As shown in FIG.

As shown in FIGS. 1 and 2, the light-emitting board device 100 includes a printed board 102 (an example of a board) and a light-emitting element 200 (an example of an element) placed (mounted) on the printed board 102. have. As shown in FIG. 1, the printed circuit board 102 extends (extends) in the X direction, for example, and is formed in a plate shape. In this embodiment, placing the light emitting element 200 on the printed circuit board 102 may be referred to as "mounting".

As each of the light emitting elements 200, as shown in FIG. 1, for example, a light emitting element (for example, an LED chip) elongated in the X direction is used. As shown in FIG. 2, the light-emitting element 200 has a T-shaped cross section (cross-sectional shape) that intersects the longitudinal direction (X direction). The light emitting element 200 has a head portion 210 forming a T-shaped horizontal bar portion and a leg portion 250 forming a T-shaped vertical bar portion.

The head 210 has protruding portions 213 and 214 that protrude from the leg portion 250 in the left and right directions (Y, -Y directions) in a side sectional view (viewed in the -X direction). Therefore, in a side sectional view, the lateral width (Y-direction length) of the leg portion 250 is narrower than the lateral width of the head portion 210 . Due to this difference in width, the area of the lower surface 259 of the leg portion 250 is smaller than the area of the surface (upper surface) 219 of the head portion 210 .

A surface 219 of the head 210 is provided with a light emitting point 218 and a circuit pattern (not shown). The light-emitting element 200 includes a plurality of light-emitting points 218, and these light-emitting points 218 extend in the X direction (longitudinal direction) at one end of the surface 219 of the head 210 (specifically, the surface of the overhanging portion 213). are placed along. Note that in each figure, a plurality of light emitting points 218 may be indicated by solid lines (218 shown in FIG. 1).

The light-emitting element 200 has a height (Z-direction length) in a cross section intersecting the longitudinal direction (X-direction) that is larger than a width-direction length (Y-direction length). Specifically, the dimensions of the light emitting element 200 are, for example, 6 mm in length (length in the X direction), 300 μm in height (length in the Z direction), 130 μm in width (length in the Y direction) of the head 210, and 130 μm in the length of the leg. 250 has a width (length in the Y direction) of 100 μm. Note that the dimensions of the light emitting element 200 are not limited to the above dimensions.

Also, as shown in FIG. 2, the plurality of light emitting elements 200 are arranged such that the edges of the longitudinal ends of the overhanging portions 213 formed with the plurality of light emitting points 218 face each other in a side sectional view. It is mounted on the printed circuit board 102 . Furthermore, the plurality of light emitting elements 200 are staggered along the longitudinal direction (X direction) of the printed circuit board 102 from one end of the printed circuit board 102 shown in FIG. staggered).

Specifically, as shown in FIG. 1, the light emitting elements 200 are arranged on the printed circuit board 100 in a first row 208 and a second row 209 in which a plurality of light emitting elements 200 are mounted at intervals along the X direction. forming A first row 208 and a second row 209 each correspond to a plurality of light emitting elements 200 mounted at odd-numbered mounting positions counted in the -X direction from one longitudinal end 102A of the printed circuit board 102 (see FIG. 11). , and the light-emitting elements 200 mounted at even-numbered mounting positions. Counting from one end 102A in the longitudinal direction of the printed circuit board 102 in the -X direction, the longitudinal end (-X direction end) of the n-th (n is a natural number, excluding the last) light emitting element 200; The longitudinal direction end (X direction end) of the n+1th light emitting element 200 is mounted so as to face in the Y direction.

[Modification of Light Emitting Element 200]
The light emitting element 200 is formed to have a T-shaped cross section, but is not limited thereto. For example, the light emitting element 200 may have an L-shaped cross section, or may have a configuration in which the projecting portion 214 is not provided. Also, the cross section of the light emitting element 200 may be square (for example, rectangular or parallelogram).

[Manufacturing device 10]
Next, the configuration of the manufacturing apparatus 10 for manufacturing the light-emitting substrate device 100 will be described. 3 and 4 each show a part of the configuration of the manufacturing apparatus 10. FIG.

Specifically, as shown in FIG. 3, the manufacturing apparatus 10 includes an element manufacturing apparatus 300 that manufactures the light emitting element 200. As shown in FIG. Further, as shown in FIG. 4, the manufacturing apparatus 10 includes a supply unit 13 that supplies the light emitting elements 200, an element positioning device 20 that positions the light emitting elements 200, a board positioning device 40 that positions the printed board 102, It has

The manufacturing apparatus 10 also includes a transfer device 50 and a transfer device 60 . The transfer device 50 transfers the light emitting element 200 from the supply section 13 to the element positioning device 20 . The transfer device 60 transfers the light emitting element 200 positioned by the element positioning device 20 to the printed circuit board 102 positioned by the substrate positioning device 40 . Although the light emitting element 200 has a T-shaped cross section as described above, the shape of the light emitting element 200 is shown in a simplified manner in FIGS.

[Element manufacturing apparatus 300]
As shown in FIG. 3, the device manufacturing apparatus 300 includes a gripping device 302 that grips the light emitting device 200, a table 304 on which the trays 401 and 402 are placed, and a moving mechanism 306 that moves the table 304 in the X and Y directions. and have.

A plurality of light emitting elements 200 cut out from the wafer 14 are placed on these trays 401 and 402 . The trays 401 and 402 have, for example, a plurality of recesses 406 on which the plurality of light emitting elements 200 are placed. In other words, one light emitting element 200 is housed in one recess 406 . Each of the trays 401 and 402 has a plate shape (flat shape) having a thickness in the vertical direction, and has a rectangular shape in plan view. Note that the trays 401 and 402 may be box-shaped cases or the like.

The moving mechanism 306 moves the table 304 in the X and Y directions to align the concave portion 406 on which the light emitting element 200 is to be placed among the plurality of concave portions 406 of the trays 401 and 402 to a predetermined pickoff position. (Positioning).

The gripping device 302 grips the plurality of light emitting elements 200 cut out from the wafer 14 and transports them to the recesses 406 located at the pickoff positions in the trays 401 and 402 .

Specifically, the gripping device 302 includes a gripping mechanism 310 that grips the light emitting element 200, a push-up mechanism 320 that pushes up the light emitting element 200, a holding portion 342 that holds the wafer 14, and the holding portion 342 in the X and Y directions. and a moving mechanism 344 for moving in the direction.

The moving mechanism 344 aligns the light emitting element 200 to be gripped with a predetermined pick-up position (thrust-up position) by moving the holding part 342 in the X direction and the Y direction. It should be noted that the push-up position is set on the opposite side of the other light-emitting element 200 adjacent to the push-up target light emitting element 200 with respect to the center line in the width direction of the push-up target light emitting element 200. It is set at a position away from the element 200 .

The push-up mechanism 320 will be described with reference to FIGS. 5(A) and 5(B). As shown in FIG. 5B, the push-up mechanism 320 has a cylindrical portion 330, a needle 322, a suction portion 324, and a driving portion 326 (see FIG. 3).

The upper wall of the cylindrical portion 330 has a through hole 332 through which the needle 322 protrudes. As shown in FIGS. 5A and 5B, suction grooves 334 are formed on the upper surface of the upper wall of the cylindrical portion 330, and the suction grooves 334 serve as an adhesive to which the wafer 14 is attached. It is provided for sucking the sheet 290 . A hollow portion 336 communicating with the through hole 332 is formed inside the cylindrical portion 330 . The hollow portion 336 and the suction groove 334 are connected to the suction portion 324 via passages 338 formed in the side wall of the cylindrical portion 330 .

The needle 322 pushes up the light-emitting element 200 positioned at the pick-up position (push-up position) together with the adhesive sheet 290 when the gripping mechanism 310 grips the light-emitting element 200 . The needle 322 has a tapered cylindrical upper end. Also, the diameter D of the needle 322 is, for example, several tens of μm. For example, a plurality of needles 322 are arranged along the longitudinal direction (X direction) of the light emitting element 200 positioned at the pick up position (up position).

Drive portion 326 moves needle 322 between a projecting position where needle 322 projects upward from cylindrical portion 330 through through hole 332 and a housed position where needle 322 is housed in hollow portion 336 of cylindrical portion 330 .

The grasping mechanism 310 includes a housing 311, an arm 312, a grasping portion 370, a driving portion 360, and a suction portion 318, as shown in FIG. The housing 311 is formed in a box shape, for example, and has an opening 313 at the top of the shape.

Arm 312 protrudes from opening 313 of housing 311 . A base end of the arm 312 is supported by a driving section 360 so as to be movable in the horizontal direction (X direction). A gripping portion 370 is attached to the distal end portion of the arm 312 via an expandable portion 315 that expands and contracts in the vertical direction.

As shown in FIG. 6, the grip portion 370 includes a main body 372 having a length along the longitudinal direction (X direction) of the light emitting element 200, and a main body 372 provided at both ends in the longitudinal direction of the main body 372 and extending along the X direction of the light emitting element 200. and an abutting portion 374 abutting against the ridge line 285 on the side.

The abutment portion 374 has an abutment surface 375 formed so that the lower surface 373 of the main body 372 does not abut against the upper surface of the light emitting element 200 when it abuts against the ridge line 285 of the light emitting element 200 .

Body 372 has a cavity 377 therein. A plurality of through holes 378 leading to cavities 377 are formed in lower surface 373 of body 372 . An upper portion of the main body 372 is connected to the suction portion 318 via a hose 399 .

In the gripping mechanism 310 , the ridgeline 285 of the light emitting element 200 is abutted against the abutment surface 375 of each abutting portion 374 , and the light emitting element 200 is sucked by the suction portion 318 through the plurality of through holes 378 , thereby holding the gripping portion. 370 holds the light emitting element 200 . The light emitting element 200 is peeled off from the adhesive sheet 290 by contracting the expandable part 315 while the grip part 370 is gripping the light emitting element 200 . Then, by moving the arm 312 in the X direction and extending the telescoping portion 315 , the light emitting element 200 is placed on the recess 406 located at the pickoff position in the trays 401 , 402 .

The gripping device may have a gripping function of gripping the light emitting element 200 as a minimum function, and may have a transporting function if necessary.

[Supply unit 13]
As shown in FIG. 4, the supply unit 13 includes a table 15 on which the trays 401 and 402 are placed, and a moving mechanism 17 for moving the table 15 in the X direction and the Y direction. In the supply unit 13 , the moving mechanism 17 moves the table 15 in the X direction and the Y direction, thereby positioning the light emitting elements 200 to be mounted on the trays 401 and 402 at predetermined pick-up positions by the transfer device 50 . do.

[Transfer device 50]
The transfer device 50 includes a collet 57, a suction device 52, and a moving mechanism 53, as shown in FIG. The collet 57 works as a gripping tool that grips the light emitting element 200 . The suction device 52 is attached to the collet 57 and generates a suction force for the collet 57 to hold the light emitting element 200 . The moving mechanism 53 moves the aspirator 52 .

Specifically, a collet 57 is attached to the suction nozzle 54 of the suction device 52 . The collet 57 has a suction port (not shown) communicating with the suction nozzle 54 .

In the transfer device 50 , the light emitting element 200 is sucked by the sucker 52 while the collet 57 abuts against, for example, the upper surface of the light emitting element 200 positioned at the pickup position in the supply section 13 . The collet 57 holds the light emitting element 200 by this suction.

Next, while the light-emitting element 200 is held in the collet 57, the transfer device 50 moves the suction device 52 in the Y direction (along the dashed-dotted line E1 with an arrow) by the moving mechanism 53, thereby moving the positioning table 30, which will be described later. The light emitting device 200 is transferred onto the plate 34 of . As the moving mechanism 53 of the transfer device 50, for example, a three-axis robot having a mechanism for moving in the X, Y and Z directions is used.

[Element positioning device 20]
As shown in FIG. 4, the element positioning device 20 includes a positioning table 30, a positioning member 22, and a moving mechanism 29. As shown in FIG. The light emitting element 200 is placed (mounted) on the positioning table 30 . The positioning member 22 positions the light emitting element 200 placed on the positioning table 30 at a predetermined position. The moving mechanism 29 moves the positioning member 22 in the X direction and the Y direction.

The positioning table 30 includes a cylindrical portion 32 having an opening 33 at the top, a plate 34 provided in the opening 33 of the cylindrical portion 32, and a negative pressure in the internal space by sucking the air in the internal space of the cylindrical portion 32. and a suction device 36 for Plate 34 has a plurality of suction holes 38 . These plurality of suction holes 38 extend through the plate 34 and communicate with the inner space of the cylindrical portion 32 .

As shown in FIG. 4, the positioning member 22 includes a main body 22A and a pair of claw portions 22B extending in the X direction from the main body 22A, and is configured in a plate shape, for example. The pair of claw portions 22B are separated in the Y direction so that the light emitting element 200 can be arranged between the pair of claw portions 22B. The positioning member 22 moves while maintaining a non-contact state with respect to the plate 34 so as not to be attracted to the plate 34 and receive movement resistance.

The positioning member 22 abuts the claw portion 22B against one of the side surfaces 252 (see FIG. 2) of the leg portion 250 of the light emitting element 200 to move the light emitting element 200 to a predetermined position. to locate (align).

Further, in the present embodiment, one of the pair of claw portions 22B is selected to position the light emitting element 200. FIG. Therefore, the positioning member 22 may be configured without one of the pair of claw portions 22B.

[Substrate positioning device 40]
As shown in FIG. 4, the board positioning device 40 includes a pair of transport members 42 (for example, conveyors) that transport the printed board 102 in the X direction. The pair of conveying members 42 are spaced apart in the Y direction so that the printed circuit board 102 can be introduced between the pair of conveying members 42 .

The board positioning device 40 is configured such that the printed board 102 introduced between the pair of transport members 42 is positioned with respect to the pair of transport members 42 in the X direction, the Y direction, and the Z direction. The pair of conveying members 42 conveys the printed circuit board 102 in the X direction, so that the printed circuit board 102 moves relatively in the X direction while being positioned in the Y direction with respect to a collet 70 to be described later. .

The board positioning device 40 is a coating device (not shown) such as a dispenser for coating an adhesive such as an epoxy containing silver (Ag) at a mounting position on the printed circuit board 102 where the light emitting element 200 is mounted. have.

[Transfer device 60]
The transfer device 60 includes a collet 70, a suction device 62, and a moving mechanism 63, as shown in FIG. The collet 70 works as a gripping tool that grips the light emitting element 200 . The suction device 62 is attached to the collet 70 and generates a suction force for the collet 70 to hold the light emitting element 200 . The moving mechanism 63 moves the aspirator 62 .

Specifically, the collet 70 is attached to the suction nozzle 64 of the suction device 62 . Collet 70 has a suction port (not shown) leading to suction nozzle 64 .

The transfer device 60 sucks the light emitting element 200 with the sucker 62 while the ridge line 271 (see FIG. 2) of the light emitting element 200 abuts against the collet 70 . This suction holds the light emitting element 200 in the collet 70 . Further, the transfer device 60 releases the holding state of the light emitting element 200 by the collet 70 by stopping the suction by the suction device 62 .

The moving mechanism 63 moves the collet 70 in the Y direction relative to the printed circuit board 102 by moving the suction device 62 in the Y direction (along the dashed-dotted line E2 with an arrow). That is, in this embodiment, the moving mechanism 63 moves the collet 70 in the Y direction, and the transport member 42 of the substrate positioning device 40 moves the printed circuit board 102 in the X direction. These movements cause the collet 70 to move relative to the printed circuit board 102 in the X and Y directions.

Further, the moving mechanism 63 is configured to move the collet 70 relative to the printed circuit board 102 in the Z direction (for example, the vertical direction) by moving the sucker 62 in the Z direction (for example, the vertical direction). ing. In this embodiment, the collet 70 is relatively moved in the X direction and the Y direction with respect to the printed circuit board 102 while the light emitting element 200 is held by the collet 70 . After that, the collet 70 is lowered in the -Z direction (for example, downward) to mount the light emitting element 200 on the printed circuit board 102 . As the moving mechanism 63, for example, a biaxial robot that can move in the Y direction and the Z direction is used.

[Manufacturing method of light-emitting substrate device 100]
A method for manufacturing the light-emitting substrate device 100 will be described. The method for manufacturing the light-emitting substrate device 100 according to the present embodiment includes an element manufacturing process for manufacturing the light-emitting elements 200 from a wafer and a mounting process for mounting the light-emitting elements 200 manufactured in the element manufacturing process on the printed circuit board 102. have.

[Element manufacturing process]
An element manufacturing process will be described. The element manufacturing process includes a forming process of cutting out the light emitting element 200 from the wafer 14 (semiconductor substrate) to form the light emitting element 200, a pushing up process of pushing up the light emitting element 200 with the needle 322, and a holding of the pushed up light emitting element 200. and a transporting step of transporting the light emitting element 200 .

(Formation process)
A formation process is demonstrated. In the forming process, as shown in FIG. 7, first, a plurality of light emitting points 218 are formed on the wafer 14 made of GaAs or the like. Each section for the light emitting element 200 formed on the wafer 14 is energized, and based on the amount of light detected by the light emitting point 218, it is determined whether or not the section is non-defective. Specifically, each light-emitting point 218 is caused to emit light, and a section in which the light intensity of all the light-emitting points 218 is equal to or higher than the reference value is defined as a non-defective section, and a section including at least one light-emitting point 218 in which the light amount is equal to or less than the reference value is regarded as an unacceptable section. It is assumed that this is a non-defective section. The inspection result may be recorded in the storage device as data in which the quality of the section is associated with the section position.

The inspected wafer 14 has a first groove 14A formed in its surface, for example by etching. A dicing adhesive sheet 295 is attached to the surface of the wafer 14 having the first grooves 14A. After that, the second groove 14B is formed in the back surface of the wafer 14 by cutting using a cutting member 11 such as a dicing blade. In this embodiment, the second groove 14B reaches the first groove 14A.

Next, an adhesive sheet 290 is attached to the back surface of all the light emitting elements 200 cut out from the wafer 14 . After that, the adhesive sheet 295 for dicing is peeled off from the surface of the light emitting elements 200 to obtain an intermediate product 297 including the adhesive sheet 290 and the arrangement of the light emitting elements 200 on the adhesive sheet 290, as shown in FIG. .

The plurality of light emitting elements 200 in the intermediate product 297 are attached on the adhesive sheet 290 along the width direction (Y direction, width direction) and longitudinal direction (X direction) of the light emitting elements 200 . Each light-emitting element 200 has a plurality of light-emitting points 218 formed along the X-direction on the Y-direction side end, specifically, on the projecting portion 213 (see FIG. 7).

(Push-up process)
The push-up process will be described with reference to FIG. In the push-up process, the light emitting elements 200 arranged in order in the width direction (−Y, Y direction) of the wafer 14 (adhesive sheet 290) from one end to the other end of the outer shape of the wafer 14 (adhesive sheet 290) are arranged in a predetermined order. , the needle 322 pushes up. As the predetermined order, as indicated by the arrow in FIG. 10, the two-dimensional arrangement of the light emitting elements 200 on the adhesive sheet 290 starts from the row closest to the X direction, and within this row, the order is from the -Y direction to the Y direction. proceed in the direction of Next, the push-up by the needle 322 moves to the adjacent row on the −X direction side, and within this row proceeds from the Y direction to the −Y direction. That is, in odd-numbered rows counted from the X-direction side of the wafer 14 (hereinafter simply referred to as "odd-numbered rows"), the wafer 14 is pushed up in order from the -Y-direction end in the Y-direction, and counted from the X-direction side of the wafer 14. In the even-numbered rows (hereinafter simply referred to as "even-numbered rows"), the wafer 14 is pushed up in order from the Y-direction end to the -Y-direction. Note that the light emitting elements 200 from the sections that were not determined (identified) as non-defective products in the forming process and the elements 199 formed in an imperfect shape at the outer peripheral portion of the wafer 14 are not used as light emitting elements in subsequent processes. Excluded from the order (target) of push-up.

Specifically, in the push-up process, first, the moving mechanism 344 moves the holding part 342 holding the wafer 14 in the X direction and the Y direction, and the light emitting element 200 to be pushed up is pushed up to a predetermined position. Position in the up position (see Figures 3 and 5). Since the needle 322 pushes up the row of the light emitting elements 200 on the adhesive sheet 290 in order from one end to the other end, another light emitting element 200 adjacent to the light emitting element 200 to be pushed up is the light emitting element to be pushed up. 200 on one side (Y direction or −Y direction).

Next, as shown in FIG. 5 , the suction part 324 of the push-up mechanism 320 sucks the adhesive sheet 290 through the through hole 332 and the suction groove 334 formed in the upper wall of the cylindrical part 330 . Then, the adhesive sheet 290 is adhered to the upper wall of the cylindrical portion 330 .

After the adhesive sheet 290 is adsorbed, the needle 322 is driven by the drive section 326 to raise the needle 322 . As a result, the needle 322 pushes up the lower surface of the light emitting element 200 together with the adhesive sheet 290 at the push-up position, as shown in FIG. Specifically, the back surface of the light emitting element 200 to be pushed up is divided into a half back surface close to another light emitting element 200 adjacent to this light emitting element 200 and another light emitting element 200 with reference to the center line in the width direction of the back surface. It is divided into a half back surface far from the element 200 . The raised position is located in the far half back (half back). 5 and 9 illustrate the case where even-numbered columns of light emitting elements 200 on the wafer 14 are pushed up.

(Conveyance process)
In the transfer step, the light emitting elements 200 pushed up by the needles 322 are sequentially moved from one end to the other end of the wafer 14 as shown in FIG. Then, it is placed on the recess 406 of the trays 401 and 402 . Specifically, in the transporting step, the light emitting element 200 is placed on the concave portions 406 of the trays 401 and 402 with the light emitting point 218 positioned on the Y direction side of the light emitting element 200 without rotating the light emitting element 200 during transport.

Also, in the transporting step, only the light emitting elements 200 determined to be non-defective based on the inspection result in the forming step are alternately placed on the concave portions 406 of the trays 401 and 402 in the predetermined order. The light emitting elements 200 are also placed in a predetermined order on trays 401 and 402 . Therefore, it is possible to know from which section of the wafer 14 all the light emitting elements 200 placed on the trays 401 and 402 are cut out. In other words, all recesses 406 on trays 401 and 402 are associated with compartments on wafer 14 .

Specifically, in the transporting step, the light emitting element 200 is placed on the trays 401 and 402 by gripping and transporting the light emitting element 200 with a gripper as follows. In the transfer step, first, the light emitting elements 200 pushed up by the needles 322 in a predetermined order from one end to the other end of the wafer 14 are individually (one by one) held by the holding part 370 of the holding device 302 (FIG. 3). In the arrangement of the light emitting elements 200 on the adhesive sheet 290 reflecting the arrangement of the sections of the wafer 14, the gripping part 370 sequentially moves the light emitting elements 200 in the Y direction from the -Y direction end of the adhesive sheet 290 in the odd-numbered rows of the arrangement. The light emitting elements 200 are individually gripped, and in the even-numbered rows of the array, the light emitting elements 200 are individually gripped in order from the end of the adhesive sheet 290 in the Y direction to the −Y direction.

Specifically, in a state in which the ridge line 285 of the light emitting element 200 pushed up by the needle 322 is abutted against the abutment surface 375 of each abutment portion 374 in the grip portion 370 , the light emitting element 200 is pulled through the plurality of through holes 378 by the suction portion 318 . By sucking 200, gripper 370 grips light emitting element 200 (see FIGS. 6 and 3).

Next, the light emitting element 200 is peeled off from the adhesive sheet 290 by contracting the expandable part 315 while the grip part 370 is gripping the light emitting element 200 . Then, by moving the arm 312 in the X direction and extending the telescoping portion 315 , the light emitting element 200 is placed on the recess 406 located at the pickoff position in the trays 401 , 402 .

In the present embodiment, the pushing-up process and the transporting process are alternately repeated for each light-emitting element 200, and a plurality of light-emitting elements 200 cut out from the wafer 14 are placed on trays 401 and 402 one by one. By alternately repeating the carrying process and the pushing process, the plurality of light emitting elements 200 are placed on the trays 401 and 402 in a predetermined order as follows. When the light-emitting elements 200 are divided into the trays 401 and 402 in this way, the light-emitting elements 200 that are close to each other in the arrangement of the light-emitting elements 200 in each of the trays 401 and 402 are the light-emitting elements 200 from the sections that are close to each other on the wafer 14 as well. There will be The positional data and arrangement data on the wafer 14 relating to the light emitting elements 200 in the trays 401 and 402 may be recorded in a storage device. In other words, the arrangement data of all recesses 406 in the trays 401 and 402 are stored in the storage device in association with the position data of the partitions in the wafer 14 .

The light emitting elements 200 arranged in order in the width direction (−Y, Y direction) of the light emitting elements 200 from one end to the other end of the wafer 14 (adhesive sheet 290) are held by a holding tool in a predetermined order, They are alternately placed on the recesses 406 of the trays 401 and 402 . The predetermined order of gripping is, as indicated by the arrows in FIG. It ends at the corner of the other end. Specifically, in the odd-numbered rows of the wafer 14, the light-emitting elements 200 held in the Y direction from the −Y-direction end of the wafer 14 are alternately placed on the trays 401 and 402, and in the even-numbered rows of the wafer 14 , the light emitting elements 200 held in the −Y direction from the Y direction end of the wafer 14 are placed alternately on the trays 401 and 402 .

Specifically, for example, as shown in FIG. 10, among the plurality of light emitting elements 200, light emitting elements 200A, 200B, 200C, and 200D arranged in the Y direction in odd-numbered rows emit light through the pushing-up process and the transporting process. The device 200A is placed on one concave portion 206 of the tray 401. FIG. Next, the light emitting element 200B is placed on one of the concave portions 206 of the tray 402 by a lifting process and a transporting process. Furthermore, next, the light emitting element 200C is placed on another recess 206 of the tray 401 (the other recess 206 adjacent to the one recess 206 of the tray 401) by a lifting step and a transporting step, and then a lifting step and a transporting step. The light emitting element 200D is placed on the other recess 206 of the tray 402 (the other recess 206 adjacent to the one recess 206 of the tray 402). In this manner, a plurality of light emitting elements 200 are alternately placed on trays 401 and 402 in a predetermined order by the lifting process and the transporting process. Note that the light emitting elements 200 are also placed in the predetermined order when they are placed on the concave portions of the trays 401 and 402 .

According to this loading order, the arrangement of the light emitting elements 200 on the trays 401 and 402 reflects the proximity of the elements in the arrangement of the wafer 14 compartments. In other words, each light emitting element 200 is associated with the position of the recess 406 in the trays 401 and 402 and the position (partition) in the wafer 14 . Specifically, the light emitting elements 200 on both sides adjacent to one light emitting element 200 in each row of the array of the light emitting elements 200 on the tray 401 are the same as the divisions of the one light emitting element in the array of divisions on the wafer 14 as well. get closer to each other. Similarly, the adjacent light emitting elements 200 adjacent to one light emitting element 200 in each row of the array of light emitting elements 200 on the tray 402 are also close to the one light emitting element section in the array of partitions on the wafer 14 . position.

As a result, the light emitting element 200 is ready for mounting on the printed circuit board 102 . As described above, the light emitting device 200 is manufactured by the device manufacturing process. Note that the element manufacturing process is an example of a manufacturing method for manufacturing the light emitting element 200 . In this embodiment, as shown in FIGS. 3 and 11, trays 401 and 402 are arranged side by side along the Y direction. However, the arrangement of the trays 401 and 402 is not limited to this.

[Arrangement process]
In the arrangement step, first, the tray 402 is rotated relative to the tray 401 so that the light emitting points 218 are oriented in different directions. Specifically, as shown in FIG. 11, the light emitting point 218 of the light emitting element 200 on the tray 401 faces the Y direction, whereas the light emitting point 218 of the light emitting element 200 on the tray 402 faces the -Y direction. Rotate to face the direction. This is accomplished, for example, by rotating tray 402 relative to tray 401 at an angle of 180 degrees. Either one of the trays 402 and 401 or both of the trays 401 and 402 may be actually rotated, whereby the tray 402 may be rotated relative to the tray 401. . When rotating both the tray 401 and the tray 402, for example, each of the tray 401 and the tray 402 may be rotated by 90 degrees.

In the present embodiment, as shown in FIG. 4, the trays 401 and 402 are arranged with the light emitting point 218 of the light emitting element 200 on the tray 401 facing in a different direction from the light emitting point 218 of the light emitting element 200 on the tray 402. is placed on the base 15 of the supply unit 13 . Although the trays 401 and 402 are arranged along the X direction in FIG. 4 in this embodiment, they may be arranged along the Y direction.

Next, the light emitting elements 200 of the trays 401 and 402 are placed on the printed circuit board 102 while keeping the direction of the light emitting points 218 on the trays 401 and 402 . Also, the light emitting elements 200 of the trays 401 and 402 are placed on the printed board 102 so that the light emitting elements 200 are arranged along the longitudinal direction of the printed board 102 in the order shown in FIG.

Specifically, the light emitting elements 200 of the trays 401 and 402 are placed (mounted) on the printed circuit board 102 as follows.

As shown in FIG. 4, first, in the supply unit 13, the moving mechanism 17 moves the table 15 in the X and Y directions to position the light emitting element 200 to be mounted at a predetermined pickup position.

Next, the transfer device 50 grips the light-emitting element 200 positioned at the pickup position of the supply section 13 using the collet 57 as a gripper, and moves the light-emitting element 200 from the supply section 13 onto the plate 34 of the positioning table 30 . , and place the light emitting element 200 on the plate 34 .

(Element positioning process)
In the device positioning device 20 , the positioning member 22 moves and positions (positions) the light emitting device 200 placed on the plate 34 to a predetermined positioning position on the plate 34 .

In the board positioning device 40 , a pair of conveying members 42 position the printed board 102 . The positioning of the printed circuit board 102 need not be performed after the positioning of the light emitting element 200, and may be performed before or in parallel with the positioning of the light emitting element 200. FIG.

(Coating process)
An adhesive is applied to the mounting position of the light emitting element 200 on the printed circuit board 102 by a coating device (not shown). The coating process may be performed before the printed circuit board 102 is positioned by the pair of conveying members 42 .

(Mounting process)
The transporting device 60 grips the light emitting element 200 positioned in the element positioning process using the collet 70 as a gripper, and transports the light emitting element 200 to the mounting position of the printed circuit board 102 . The light emitting element 200 transferred by the collet 70 is mounted on the mounting position of the printed circuit board 102 .

This mounting process is repeated according to the number of light emitting elements 200 to be mounted on the printed circuit board 102 . In this embodiment, for example, the plurality of light emitting elements 200 on the tray 401 are mounted in a line at intervals in the longitudinal direction (X direction) of the printed circuit board 102 . Next, the plurality of light emitting elements 200 on the tray 402 are mounted in a line at intervals in the longitudinal direction (X direction) of the printed circuit board 102 . In this embodiment, as shown in FIG. 11, with one end 102A in the longitudinal direction of the printed circuit board 102 as a reference, for example, the plurality of light emitting elements 200 on the tray 401 are mounted at odd-numbered mounting positions T1, T3, T5, and so on. Install in order of . After all the odd-numbered light-emitting elements 200 are mounted, the plurality of light-emitting elements 200 on the tray 402 are mounted in order of even-numbered mounting positions T2, T4, . At this time, when the light emitting elements 200 are mounted at odd-numbered mounting positions, absolute coordinates indicating the mounting positions of the respective light emitting elements 200 can be used with reference to the one longitudinal end 102A, for example. When the light-emitting elements 200 are mounted at even-numbered mounting positions, for example, relative coordinates based on adjacent light-emitting elements 200 (light-emitting elements 200 mounted at odd-numbered mounting positions) are used instead of the absolute coordinates described above. can be used. According to the mounting of the light-emitting elements 200 using this relative coordinate, the light-emitting elements 200 mounted at the even-numbered mounting positions are positioned with respect to the light-emitting elements 200 mounted at the adjacent odd-numbered mounting positions. The distance between the light emitting elements 200 adjacent to each other in the lateral direction (Y direction) of 102 is less likely to vary greatly. By mounting the light emitting elements 200 on odd-numbered and even-numbered mounting positions, the light emitting substrate device 100 on which the light emitting elements 200 are mounted in a zigzag pattern is provided. 10, light emitting elements 200A and 200C are mounted at mounting positions T1 and T3, respectively, and light emitting elements 200B and 200D are mounted at mounting positions T2 and T4, respectively.

The light-emitting substrate device 100 is manufactured through the above steps.

As already explained, by alternately repeating the lifting process and the transporting process, the light emitting elements 200 that are close to each other in the arrangement of the light emitting elements 200 in each of the trays 401 and 402 are arranged from the same sections in the wafer 14 as well. is. In other words, the light-emitting elements 200 cut out from the wafer 14 alternately repeat the pushing-up process and the transporting process in a predetermined order (the order indicated by the arrows in FIG. 10), and are placed alternately in the concave portions 406 of the trays 401 and 402 . placed in Therefore, it can be said that the two light-emitting elements 200 having recesses 406 close to each other on the tray 401 have partitions close to each other on the wafer 14 . In addition, it can be said that two light emitting elements 200 whose recesses 406 are close to each other on the tray 402 have partitions close to each other on the wafer 14 . Further, one light emitting element 200 housed in one recess 406 of the tray 401 and another light emitting element 200 housed in the other recess 406 of the tray 402 corresponding to the one recess 406 of the tray 401 are separated from each other by the wafer. It can also be said that the positions of the partitions in 14 are close. However, in the actual manufacturing process of the light-emitting substrate device 100, the light-emitting element 200 may fail to be gripped by grippers such as the collets 57 and 70, for example. Such a failure in gripping the light emitting element 200 by the gripping tool occurs because the light emitting element 200 is not in a normal posture (for example, the light emitting element 200 is lying down in the tray). Therefore, when a failure occurs in gripping one light emitting element 200, the gripping tool can be used to hold another light emitting element adjacent to the one light emitting element 200 in the tray without mounting the one light emitting element 200 on the printed circuit board 102. The light emitting element 200 is held and mounted on the printed circuit board 102 . That is, the one light emitting element 200 becomes a loss. The number of failures in gripping the light emitting elements 200 is very rarely the same in gripping the plurality of light emitting elements 200 from the tray 401 and gripping the plurality of light emitting elements 200 from the tray 402 . In other words, the loss numbers of the light emitting elements 200 are very unlikely to be equal in the trays 401 and 402 .

In other words, the difference between the number of light emitting elements 200 lost in the tray 401 and the number of light emitting elements 200 lost in the tray 402 may become large in the actual manufacturing process of the light emitting substrate device 100 . This difference may lead to defects in the characteristics of the manufactured light-emitting substrate device 100 . Specifically, one light emitting element 200 in a certain section (one section) on the wafer 14 and another light emission in a section (another section) outside a predetermined distance from the section (one section) If the elements 200 are mounted on the same printed circuit board 102 , the light emission characteristics of the light emitting board device 100 may be defective. Here, the problem related to the light emission characteristics of the light emitting substrate device 100 is, for example, a large difference in the width (range) of the light amount adjustment of the plurality of light emitting elements 200 mounted on the printed circuit board 102, or the like. Specifically, in the light-emitting substrate device 100 in which 20 light-emitting elements 200 are mounted on one printed circuit board 102, the light intensity of 19 of them is adjusted within the range of 80 to 90% of the reference light intensity. In contrast, the other one is a case where the light amount can be adjusted only within a range of 60 to 70% of the reference light amount. Such a light-emitting substrate device 100 cannot adjust the light amount of all the light-emitting elements 200 substantially uniformly, so it becomes a defective product.

In the present embodiment, the following configuration is adopted in order to avoid the occurrence of the above-described problems in the light-emitting substrate device 100. As shown in FIG. That is, first, one light emitting element 200 (an example of the first element) is held and mounted on the printed circuit board 102 (an example of the first step). After that, when the distance between the light emitting element 200 (an example of the second element) and the light emitting element 200 (an example of the first element) in the next gripping order is outside the predetermined range on the wafer 14, the next gripping is performed. One light emitting element 200 (an example of the first element) and the light emitting element 200 (an example of the third element) in the grip queue are connected without mounting the successive light emitting elements 200 (an example of the second element) on the printed board 102. ) within a predetermined range on the wafer 14 (an example of a third element) is mounted on the printed circuit board 102 (an example of the second step). Note that the specific value of the distance within the predetermined range is (can be) set to a different value depending on the structure of the light emitting element 200, the manufacturing process, and the like. For example, position data and arrangement data relating to the light emitting elements 200 on the wafer 14 and the trays 401 and 402 are stored in the storage device. At least one of the position data and the arrangement data may be used to determine the predetermined range.

Specifically, the light-emitting elements 200 are arranged in one of the odd-numbered and even-numbered mountings (for example, the odd-numbered mounting) according to the arrangement order of the light-emitting elements 200 in one of the trays 401 and 402 (for example, the tray 401). First, mounting on the printed circuit board 102 is completed (an example of the first step). After that, the following conditions are imposed when starting the mounting of the light emitting elements 200 in the other of the odd-numbered and even-numbered mountings (for example, the even-numbered mounting). The condition is that the light emitting element 200 to be mounted next on the printed circuit board 102 (the first even-numbered light emitting element 200) and the first light emitting element 200 already mounted in the odd-numbered mounting are predetermined on the wafer 14. within the specified distance. To satisfy this condition, the light-emitting element 200 to be mounted next is selected from the other of the even-numbered trays 401 and 402 (for example, the tray 402) and mounted on the printed circuit board 102 (the first An example of 2 processes). A light-emitting element 200 that does not satisfy the condition is not used from the other (for example, tray 402). At least one of position data and arrangement data of the light emitting elements 200 on at least one of the wafer 14 and the trays 401 and 402 is stored in the storage device. Stored data may be used in determining the condition.

According to this embodiment, the distance on the wafer 14 between the light emitting element 200 (an example of the first element) and the light emitting element 200 mounted adjacent to the light emitting element 200 (an example of the first element) is not considered. Compared to the above, it is possible to provide a method of manufacturing a light-emitting substrate device in which the difference in characteristics between the light-emitting elements 200 mounted adjacent to the printed circuit board 102 is suppressed.

In this embodiment, each of the trays 401 and 402 holds the light emitting elements 200 on the tray (tray 401 or tray 402) according to the order in which the plurality of light emitting elements 200 are arranged. is predetermined. The next light emitting element 200 (an example of a second element) may be grasped and then discarded if not used for mounting.

In gripping the light emitting element 200 using a gripping tool (for example, the collet 57) (see FIG. 4), a sensor is used to detect whether the posture of the light emitting element 200 is normal immediately before gripping. If the signal from the sensor does not detect that the posture is normal, the light emitting element 200 is gripped by a gripper and discarded at a disposal site. On the other hand, when holding the light emitting element 200 that should be discarded because it is outside the predetermined distance range on the wafer 14, the light emitting element 200 is held by the holding tool regardless of the value of the signal from the sensor. Discarded at a disposal site.

According to this embodiment, even if the order of gripping the light emitting elements 200 in each of the trays 401 and 402 is predetermined, by processing the signal from the sensor, the unused light emitting elements are gripped by the gripper and discarded. do.

Further, when the next light emitting element 200 (an example of the second element) on the tray (tray 401 or tray 402) is out of the range of the predetermined distance on the wafer 14, the next light emitting element 200 (the second element example) is not held by the holding tool, a further (further next) light emitting element 200 (an example of the third element) may be held by the holding tool. That is, the next light emitting element 200 (an example of the second element) remains unused on the tray (tray 401 or tray 402). Not gripping the next light-emitting element 200 (an example of the second element) can also be done, for example, by temporarily disabling the operation of the suction device 52 attached to the collet 57 .

In gripping the light emitting element 200 using the collet 57 (see FIG. 4), the light emitting element 200 is gripped using the suction force applied from the suction device 52 to the collet 57 . If the suction device 52 does not apply a suction force to the collet 57, the light emitting element 200 will not be gripped as a result. In this way, it is also possible to control the suction device 52 so as not to apply a suction force to the collet 57 when holding the light emitting element 200 that should not be mounted.

According to this embodiment, even if the order of gripping the light emitting elements 200 on each of the trays 401 and 402 is predetermined, by controlling the sucker 52, unused light emitting elements can be left on the tray.

Furthermore, when the distance on the wafer between the light emitting element 200 (an example of the first element) and the next light emitting element 200 (an example of the second element) in the gripping order is not within a predetermined range, the tray (the tray 401 or the tray 402 ), a further light emitting element 200 (an example of a third element) may be directly gripped without moving to the gripping position of the next light emitting element 200 (an example of a second element).

The distance between the light emitting elements 200 is the center of gravity of one section on the wafer 14 (for example, the center of gravity DCG1 shown in FIG. 12) and the center of gravity of another section on the wafer 14 (for example, the center of gravity DCG2 shown in FIG. 12). can be defined by the distance ED from

The distance ED according to this definition is known as the Euclidean distance. The centroid of the compartment or light emitting element 200 in FIG. 12 is defined, for example, as the intersection of two dashed diagonal lines in the rectangle illustrated in FIG. In other words, the center of gravity of the light emitting element 200 can be the intersection of two diagonal lines of the outline of the light emitting element 200 when the wafer 14 is viewed from above.

Moreover, the distance between the light emitting elements 200 is the center of gravity of the wafer 14 (for example, “CG” shown in FIG. 12) and the center of gravity of one light emitting element 200 existing in one section of the wafer 14 (for example, shown in FIG. 12). and the distance R2 between the center of gravity CG of the wafer 14 and the center of gravity of another light-emitting element 200 in another section of the wafer 14 (for example, "DCG4" shown in FIG. 12). can be defined by the absolute value of the difference between

Specifically, the distance between the center of gravity CG of the wafer 14 and the centers of gravity DCG3 and DCG4 of the light emitting elements 200 existing in the partitions on the wafer 14 is defined in the direction of the radius centered on the center of gravity CG. The distance of the light emitting element 200 between two sections on different radial radii is defined as the absolute value of the difference (R2-R1) of the different radial radii. According to this definition, light-emitting elements 200 located in a section whose centroid is located on the same radial radius are treated as having a distance of zero. The advantage of this definition of distance is based on the fact that semiconductor crystals grow from the center outward as wafers 14 are fabricated. According to this crystal growth feature, the number of sections on large radial radii increases compared to sections on small radial radii.

Referring to FIG. 13, when the order of gripping the light emitting elements 200 on each of the trays 401 and 402 is determined in advance, the light emitting substrate device is controlled using at least one of the position data and the arrangement data stored in the storage device. An example of a method for manufacturing 100 is described. In the tray 401, gripping by the gripper starts from the light emitting element 200 indicated by reference numeral S401. The light-emitting elements 200 are used for manufacturing the light-emitting substrate device 100 in the order indicated by the dashed arrow A401, and the mounting of the light-emitting elements 200 from the tray 401 is completed by gripping the light-emitting elements 200 indicated by reference sign E401. . In the tray 402, gripping by the gripper starts from the light emitting element 200 indicated by reference numeral S402. This light emitting element 200 is within a predetermined range on the wafer 14 with respect to the light emitting element 200 indicated by reference numeral S401. For example, the light-emitting element 200 indicated by reference sign S402 and the light-emitting element 200 indicated by reference sign S401 are adjacent to each other in the lateral direction of the light-emitting element 200 on the wafer 14 when cut out from the wafer 14 ( located in adjacent compartments). In the tray 402, the light-emitting elements 200 are used for manufacturing the light-emitting substrate device 100 in the order indicated by the dashed arrow A402, and the manufacturing of the light-emitting substrate device 100 proceeds. Suppose that during the manufacture of the light-emitting board device 100, the light-emitting element 200 for the m-th mounting candidate (the light-emitting element 200 indicated by reference symbol M402) is the light-emitting element 200 ( Suppose that the light emitting element 200 indicated by reference numeral S401, the m-1th light emitting element 200, or the m+1th light emitting element 200) is found to be outside the predetermined range on the wafer . In this case, the light-emitting element 200 indicated by reference numeral M402 is not used for manufacturing the light-emitting substrate device 100. FIG. The next light emitting element 200 to be gripped is the light emitting element 200 indicated by reference numeral J402 found within the predetermined range on the wafer 14 . Manufacture of the light-emitting substrate device 100 proceeds from the light-emitting element 200 .

(Action)
The operation of the substrate device manufacturing method according to the first embodiment will be described. Compared to the case where the distance on the wafer 14 between the two adjacently mounted light emitting elements 200 on the printed circuit board 102 is not considered, the characteristic difference between the two adjacently mounted light emitting elements 200 on the printed circuit board 102 is A suppressed light-emitting substrate device 100 can be manufactured. Further, according to this manufacturing method, instead of the next light emitting element 200, another light emitting element 200 (another light emitting element 200 whose distance on the wafer 14 is within a predetermined range) is arranged adjacent to one light emitting element 200. By mounting the light-emitting substrate device 100 in the same manner, it is possible to avoid manufacturing a defective light-emitting substrate device 100 or interrupting the manufacturing of the light-emitting substrate device 100 .

(Second embodiment)
An example of another embodiment according to the present invention will be described with reference to FIG. The manufacturing apparatus 10 is a manufacturing apparatus that manufactures a light-emitting substrate device 100 as an example of a substrate device. Specifically, as shown in FIG. 14, the manufacturing apparatus 10 includes a supply unit 13 that supplies a light emitting element 200 (an example of an element), an element positioning device 20 that positions the light emitting element 200, and a printed circuit board 102 ( and a substrate positioning device 40 for positioning the substrate (an example of the substrate). The manufacturing apparatus 10 also includes a transfer device 50 that transfers the light emitting elements 200 from the supply unit 13 to the element positioning device 20, and a printed circuit board 102 that positions the light emitting elements 200 positioned by the element positioning device 20 by the substrate positioning device 40. and a transfer device 60 for transferring to.

In the manufacturing apparatus 10 , the mounting device 103 that mounts the light emitting element 200 on the printed circuit board 102 has the element positioning device 20 , the substrate positioning device 40 and the transfer device 60 .

(supply unit 13)
As shown in FIG. 14, the supply section 13 includes a holding section 15 and a moving mechanism 17 that moves the holding section 15 in the X direction and the Y direction. In this embodiment, the holding section 15 holds an intermediate product 297 including an adhesive sheet 290 and an arrangement of the light emitting elements 200 on the adhesive sheet 290, as shown in FIG. In the intermediate product 297, the light-emitting elements 200 cut out from sections that were not determined as non-defective products and the light-emitting elements 199 (see FIG. 10) formed in an imperfect shape at the outer peripheral portion of the wafer 14 are removed. . In the supply unit 13 , the plurality of light emitting elements 200 may be cut out from the wafer 14 by cutting the wafer 14 held by the holding unit 15 . In the supply unit 13 , the moving mechanism 17 moves the holding unit 15 in the X direction and the Y direction, thereby positioning the light emitting element 200 to be mounted at a predetermined pick-up position by the transfer device 50 .

(transfer device 50)
As shown in FIG. 14, the transfer device 50 includes a collet 57 as a gripping tool for gripping the light emitting element 200, and a suction device attached to the collet 57 to generate a suction force for the collet 57 to hold the light emitting element 200. A device 52 and a moving mechanism 53 for moving the suction device 52 are provided. Specifically, a collet 57 is attached to the suction nozzle 54 of the suction device 52 . The collet 57 has a suction port (not shown) communicating with the suction nozzle 54 . In the transfer device 50 , while the light emitting element 200 is held by the collet 57 connected to the suction nozzle 54 , the suction device 52 is moved along the dashed arrow E<b>3 by the moving mechanism 53 and placed on the plate 34 of the positioning table 30 . , the light emitting device 200 is transferred to the . As the moving mechanism 53 of the transfer device 50, for example, a three-axis robot that can move in the X, Y and Z directions can be used.

If necessary, the supply section 13 can further comprise a thrusting mechanism 320 (see FIG. 5) combined with the moving mechanism 17 . The push-up mechanism 320 pushes up the light emitting element 200 positioned at the pick-up position. The moving mechanism 53 of the transfer device 50 transfers the light emitting element 200 onto the positioning table 30 while holding the light emitting element 200 pushed up by the pushing mechanism 320 .

Since the element positioning device 20, the substrate positioning device 40, and the transfer device 60 have already been explained in the first embodiment, detailed explanations thereof will be omitted.

(Manufacturing method of light-emitting substrate device 100)
A method for manufacturing the light emitting substrate device 100 according to the second embodiment will be described. In the method for manufacturing the light emitting substrate device 100 according to the present embodiment, the moving mechanism 17 moves the holding portion 15 in the X direction and the Y direction in the supply portion 13 shown in FIG. is positioned at a predetermined pick-up position (position adjustment step).

Next, the transfer device 50 transfers the light emitting element 200 positioned at the pickup position of the supply section 13 onto the plate 34 of the positioning table 30, and temporarily places the light emitting element 200 on the plate 34 (temporary placement step). Subsequently, as described in the first embodiment, an element positioning process using the element positioning device 20, a substrate positioning process using the substrate positioning device 40, and an adhesive is applied to the mounting position of the light emitting element 200 on the printed circuit board 102. A coating step of coating and a mounting step of mounting the light emitting element 200 on the printed circuit board 102 are performed in this order. This mounting process is repeated according to the number of light emitting elements 200 to be mounted on the printed circuit board 102 . Note that the coating process may be performed before the printed board 102 is transported by the board positioning device 40 .

The light-emitting substrate device 100 is manufactured through the above steps.
(action)
The operation of the substrate device manufacturing method according to the second embodiment will be described. Compared to the case where the distance on the wafer 14 between the two light emitting elements 200 mounted adjacently on the printed circuit board 102 is not considered, the characteristic difference between the two light emitting elements 200 mounted adjacently on the printed circuit board 102 is suppressed. Thus, the light-emitting substrate device 100 can be manufactured. Moreover, according to this manufacturing method, interruption of manufacturing can be avoided by mounting a further light emitting element 200 adjacent to one light emitting element 200 instead of the next light emitting element 200 .

A manufacturing apparatus 10 according to first and second embodiments will be described. The manufacturing apparatus 10 includes a supply unit 13 and a transfer device 50 as shown in FIGS. 4 and 14 . The supply unit 13 supplies the light emitting elements 200 to be mounted on the printed circuit board 102 from a plurality of light emitting elements 200 cut out from the wafer 14 . The transport device 50 transports the light emitting element 200 to be mounted (an example of the first element) using a gripper for gripping the light emitting element 200 to be mounted (an example of the first element) in the supply section 13 . The supply unit 13 has a moving mechanism 53 that moves the light emitting element 200 for gripping by the gripper.

The transfer device 50 transfers the light emitting element 200 to be mounted (an example of the first element) among the plurality of light emitting elements 200 in the supply section 13 to mount it on the printed circuit board 102 . After this transfer, the moving mechanism 53 moves the gripping tool to a position where the gripping tool can grip a further light emitting element 200 (an example of the third element) when both of the following two conditions are satisfied, A light emitting element 200 (an example of a third element) is held.

The two conditions are as follows.
The distance between the mounted light-emitting element 200 (an example of the first element) and the light-emitting element 200 (an example of the second element) of the light-emitting elements 200 in the supply unit 13 that is next in the gripping order is predetermined on the wafer 14 be out of range. The distance between a further light emitting element 200 (an example of a third element) among the plurality of light emitting elements 200 of the supply unit 13 and the mounted light emitting element 200 (an example of the first element) is within a predetermined range on the wafer 14 to be in

The manufacturing apparatus 10 may further comprise an element positioning device 20, a substrate positioning device 40, and a transfer device 60. As shown in FIG. The element positioning device 20 positions the light emitting element 200 transferred by the transfer device 50 , and the substrate positioning device 40 positions the printed circuit board 102 . The transfer device 60 transfers the light emitting element 200 in the element positioning device 20 to the printed circuit board 102 in the substrate positioning device 20 and mounts the light emitting element 200 on the printed circuit board 102 .

According to the manufacturing apparatus 10 according to the present embodiment, compared to the case where the light emitting elements 200 are mounted only in a predetermined order, the characteristic difference between the light emitting elements 200 mounted adjacently on the printed circuit board 102 is suppressed. It is possible to manufacture a substrate device, and instead of the next light emitting element 200 (an example of the second element), a further light emitting element 200 (an example of a third element) is adjacent to the light emitting element 200 (an example of the first element). production interruptions can be avoided.

The present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the gist of the present invention. All of them are included in the technical idea of the present invention.

10 manufacturing device 13 supply unit 14 wafer 17 moving mechanism 50 transferring device 53 moving mechanism 57 collet 60 transferring device 70 collet 100 light emitting substrate device 102 printed circuit board 200, 200A, 200B, 200C, 200D light emitting element 300 element manufacturing device 306 moving mechanism 310 Gripping mechanisms 401, 402 Trays CG, DCG1, DCG2, DCG3, DCG4 Center of gravity

Claims (7)

a first step of holding a first element cut out from a wafer and mounting the first element on a substrate;
When the distance between the second element cut out from the wafer and the first element is outside the predetermined range on the wafer, the distance between the third element cut out from the wafer and the first element is the wafer a second step of holding the third element in the predetermined range and mounting the third element on the substrate so as to be adjacent to the first element;
A method of manufacturing a substrate device, comprising: The order of holding the plurality of elements cut out from the wafer is predetermined,
The second step includes holding the second element and discarding the second element when the distance between the first element and the second element on the wafer is outside a predetermined range. ,
A method of manufacturing a substrate device according to claim 1 . The order of holding the plurality of elements cut out from the wafer is predetermined,
The second step includes gripping the third element without gripping the second element when the distance between the first element and the second element on the wafer is outside a predetermined range.
A method of manufacturing a substrate device according to claim 1 . wherein the distance is defined by the difference between the distance between the center of gravity of the wafer and the center of gravity of one element on the wafer and the distance between the center of gravity of the wafer and the center of gravity of another element on the wafer;
4. A method of manufacturing a substrate device according to any one of claims 1 to 3. wherein the distance is defined by the distance between the center of gravity of one element on the wafer and the center of gravity of another element on the wafer;
4. A method of manufacturing a substrate device according to any one of claims 1 to 3. a supply unit for supplying elements to be mounted on a substrate from a plurality of elements cut out from a wafer;
a transfer device that transfers the element using a gripper for gripping the element in the supply unit;
with
The supply unit has a moving mechanism for moving the element for gripping by the gripper,
A distance between a second one of the plurality of devices and the first device is predetermined on the wafer after the transfer device transfers a first device of the plurality of devices for mounting on the substrate. and the distance between the third element of the plurality of elements and the first element is within the predetermined range on the wafer, the moving mechanism moves the gripper to the third element manufacturing apparatus for moving the third element to a position for gripping the an element positioning device for positioning the element transferred by the transfer device;
a substrate positioning device for positioning the substrate;
7. The manufacturing apparatus according to claim 6, further comprising another transfer device for transferring said element in said element positioning apparatus to said substrate in said substrate positioning apparatus and mounting said element on said substrate.

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