JP2018190927A - Electronic circuit module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic circuit module for suppressing diffusion of scattered material during soldering.SOLUTION: An electronic circuit module 1 includes, as shown in Figs. 1 (a) and 1 (b), for example, a shield 7 disposed on a substrate 2, located around an electronic component 4 to be soldered, so as to suppress diffusion of scattered material generated at a time of soldering. With this configuration of the electronic circuit module 1, it is possible to suppress diffusion of scattered material during soldering.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an electronic circuit module.

  As a conventional technique, there is known a solder bonding method in which an electrode of an electronic component and an electrode of a wiring board are arranged so as to face each other through solder, and the solder is heated until the solder reaches a melting temperature or higher (for example, (See Patent Document 1).

  The wiring board on which the electronic components are arranged is heated in a reflow furnace as a reflow process. In this reflow process, the solder melts and the electrode and the electrode of the wiring board are electrically connected.

JP, 2006-51844, A

  In the reflow process as described above, due to the boiling of the solder due to heating, scattered matter such as solder and flux may spread over a wide range and cause a problem in the electronic circuit.

  Accordingly, an object of the present invention is to provide an electronic circuit module that suppresses the diffusion of scattered matter during soldering.

  One aspect of the present invention provides an electronic circuit module including a shielding object that is located around a electronic component to be soldered and that is disposed on a substrate so as to suppress diffusion of scattered matters generated during soldering. To do.

  ADVANTAGE OF THE INVENTION According to this invention, the spreading | diffusion of the scattered material in the case of soldering can be suppressed.

FIG. 1A is a schematic diagram illustrating an example of an electronic circuit module according to the embodiment, and FIG. 1B is a top view of an example of the electronic circuit module. Fig.2 (a) is the schematic which shows an example of the process of arrange | positioning an electronic component on the cream solder applied in the manufacturing process of the electronic circuit module which concerns on embodiment, FIG.2 (b) is shown by heating It is the schematic which shows an example of the process of melting cream solder. FIG. 3A and FIG. 3B are schematic views illustrating an example of an electronic circuit module according to a modification.

(Summary of embodiment)
An electronic circuit module according to an embodiment is generally configured to include a shielding object that is located around an electronic component to be soldered and is disposed on a substrate so as to suppress diffusion of scattered matter generated during soldering. Has been.

  The board of this electronic circuit module is designed to prevent scattered objects such as solder and flux from being diffused over a wide area by the shielding object, so that compared with the case where no shielding object is provided, Scattering of scattered objects can be suppressed.

[Embodiment]
(Configuration of electronic circuit module 1)
FIG. 1A is a schematic diagram illustrating an example of an electronic circuit module according to the embodiment, and FIG. 1B is a top view of an example of the electronic circuit module. Fig.2 (a) is the schematic which shows an example of the process of arrange | positioning an electronic component on the cream solder applied in the manufacturing process of the electronic circuit module which concerns on embodiment, FIG.2 (b) is shown by heating It is the schematic which shows an example of the process of melting cream solder. Note that, in each drawing according to the embodiment described below, the ratio between figures may be different from the actual ratio.

  The electronic circuit module 1 has functions such as physical quantity measurement and processing formed on the substrate 2 as an electronic circuit 6.

  The electronic circuit module 1 is located around the electronic component 4 to be soldered, for example, as shown in FIGS. 1 (a) and 1 (b), and disperses scattered matter generated during soldering. In order to suppress, it is roughly configured with a shield 7 arranged on the substrate 2.

  The electronic component 4 is a chip-type surface mount component such as a capacitor or a resistor that constitutes the electronic circuit 6 described above. The electronic component 4 has electrodes 40 and 41 at both ends, and is soldered through a reflow process.

  The substrate 2 is, for example, a printed wiring board. For example, as shown in FIG. 1B, the wiring pattern 3 of the electronic circuit 6 is formed on the surface 20 of the substrate 2. The wiring pattern 3 is formed using, for example, a metal material such as copper.

  On the substrate 2, a pair of pads 30 and 31 that are electrically connected to the electrodes 40 and 41 of the electronic component 4 to be soldered via the solder 5 are formed. The shield 7 is disposed so as to face each other so as to sandwich the pair of pads 30 and pads 31.

  For example, as shown in FIG. 1B, the pair of pads 30 and pads 31 have a rectangular shape wider than the electronic component 4 and constitute a part of the wiring pattern 3. The pad 30 and the pad 31 are electrically connected to other electronic components of the electronic circuit 6 through the wiring 35 and the wiring 36.

  For example, as shown in FIGS. 2A and 2B, the solder 5 is obtained by melting and hardening the cream solder 50 applied on the pads 30 and 31. The cream solder 50 is, for example, a paste formed by mixing solder powder and flux.

  For example, as shown in FIG. 2B, the shield 7 is positioned around the electronic component 4 to be soldered, and is placed on the substrate 2 so as to suppress the diffusion of the scattered matter 9 generated during soldering. Has been placed. The shield 7 is arranged on the substrate 2 so as to sandwich both electrodes (electrode 40 and electrode 41) of the electronic component 4 to be soldered.

  The shield 7 is formed into a plate shape by, for example, resin or metal and is bonded to the surface 20 of the substrate 2. For example, as shown in FIG. 1A and FIG. 1B, the shield 7 is arranged as far away from the pads 30 and 31 as the electronic component 4 can be arranged.

  For example, as shown in FIG. 1A, the shield 7 has a height from the surface 20 of the substrate 2 after the cream solder 50 is cured to the top of the electronic component 4 in order to suppress the diffusion of the scattered matter 9. It is preferable to have a height H that is greater than or equal to h.

  Further, for example, as shown in FIG. 1B, the shield 7 preferably has a width D that is equal to or greater than the width d of the pad 30 and the pad 31 in order to suppress the diffusion of the scattered matter 9. This scattered matter 9 is generated in the following steps.

  In the manufacturing process of the electronic circuit module 1, for example, as shown in FIG. 2A, the cream solder 50 is applied on the pad 30 and the pad 31, and the electronic component 4 is disposed thereon.

  Next, as shown in FIG. 2B, the substrate 2 is transferred to a reflow furnace and heated. When the cream solder 50 is melted by this heating, the flux and the like boils violently and the scattered matter 9 such as solder and flux is scattered. The scattered matter 9 collides with the opposite side surfaces 70 of the two shielding objects 7, and diffusion over a wide range is suppressed.

(Modification)
FIG. 3A and FIG. 3B are schematic views illustrating an example of an electronic circuit module according to a modification.

  As a modified example, as illustrated in FIG. 3A, the shielding object 7 may be disposed so as to surround the electronic component 4, for example. Moreover, the shielding object 7 may be arrange | positioned only in the direction where scattering of the scattered material 9 is not accept | permitted. For example, when it is desired to suppress the scattering of the leftward scattered object 9 in FIG. 3A, the shielding object 7 may be disposed only on the left side of the electronic component 4.

  As another modification, as shown in FIG. 3B, the shielding object 7 may be an electronic component 60 different from the electronic component 4 to which at least one is soldered. As an example, the electronic component 60 is a component in which scattering of the scattered matter 9 is allowed, that is, a diode having a case in which a problem does not occur due to adhesion of the scattered matter 9 or the like.

  As another modification, when the substrate 2 is formed by MID (Molded Interconnect Device), the shielding object 7 may be formed integrally with the substrate 2 together with the substrate 2.

(Effect of embodiment)
The electronic circuit module 1 according to the present embodiment can suppress the diffusion of scattered matter during soldering. Specifically, the electronic circuit module 1 is configured such that the scattered matter 9 generated during soldering in the reflow process is not diffused over a wide range by the shielding object 7, so that compared with the case where no shielding object is provided. Thus, the diffusion of the scattered matter 9 during soldering can be suppressed.

  In the electronic circuit module 1, since the diffusion of the scattered matter 9 is suppressed, defects caused by the scattered matter 9 are suppressed and the yield is improved as compared with the case where this configuration is not adopted.

  When the electronic circuit module 1 is formed as a three-dimensional structure such as a custom package or MID, since the shielding object 7 can be formed at the time of molding, the manufacturing cost is suppressed compared to the case where the shielding object is bonded. .

  As mentioned above, although some embodiment and modification of this invention were demonstrated, these embodiment and modification are only examples, and do not limit the invention based on a claim. These novel embodiments and modifications can be implemented in various other forms, and various omissions, replacements, changes, and the like can be made without departing from the scope of the present invention. In addition, not all combinations of features described in these embodiments and modifications are necessarily essential to the means for solving the problems of the invention. Further, these embodiments and modifications are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

DESCRIPTION OF SYMBOLS 1 ... Electronic circuit module, 2 ... Board | substrate, 3 ... Wiring pattern, 4 ... Electronic component, 6 ... Electronic circuit, 7 ... Shielding thing, 9 ... Scattering thing, 20 ... Surface, 30 ... Pad, 31 ... Pad, 35 ... Wiring , 36 ... wiring, 40 ... electrode, 41 ... electrode, 60 ... electronic component, 70 ... side surface

Claims (4)

  An electronic circuit module provided with a shield disposed on a substrate so as to suppress diffusion of scattered matter that is located around an electronic component to be soldered and is generated during soldering. The shield is disposed on the substrate so as to sandwich both electrodes of the electronic component to be soldered.
The electronic circuit module according to claim 1. The substrate is formed with a pair of pads that are electrically connected to the electrodes of the electronic components to be soldered via solder,
The shield is disposed to face the pair of pads.
The electronic circuit module according to claim 1 or 2. The shield is an electronic component at least one of which is different from the electronic component to be soldered.
The electronic circuit module of any one of Claims 1 thru | or 3.

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