JP2018182224A - Manufacturing method of circuit board, and manufacturing device for circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of a circuit board capable of suppressing abrasion of a die-cutting pin while suppressing defect occurrence in a ceramic green sheet.SOLUTION: The present invention relates to a manufacturing method of a circuit board comprising a ceramic layer and a wiring part that is disposed in the ceramic layer. The manufacturing method of the circuit board includes the steps of: installing a ceramic green sheet between an upper die and a lower die of a punch metal mold; arranging a resin film at a position separated upwards in relative to the ceramic green sheet between the upper die and the lower die; and opening at least one hole on the ceramic green sheet together with the film by means of the punch metal mold. In the step of opening the hole, the ceramic green sheet and the film are separated after the hole is opened.SELECTED DRAWING: Figure 1

Description

  The present disclosure relates to a method of manufacturing a circuit board and an apparatus for manufacturing a circuit board.

  In the process of manufacturing a circuit board including a ceramic substrate, processing is performed to provide a through hole for forming a via hole in a ceramic green sheet. In this processing, punching (that is, punching) of the ceramic green sheet is performed by the pins of the punch die.

  In the punching of the ceramic green sheet, the tip of the pin is abraded along with the punching. When the tip of the pin is worn out, the punched-up scrap is lifted and a defect such as a burr occurs around the hole. Therefore, maintenance such as polishing the tip of the pin is frequently required.

  Then, in order to suppress abrasion of a pin, the method of adhere | attaching resin-made films on the surface of a ceramic green sheet, and pierce | punching a ceramic green sheet from on a film is devised (refer patent document 1).

Unexamined-Japanese-Patent No. 4-286182

  As described above, when the film is bonded to the ceramic green sheet and punched out, it is necessary to peel the film from the ceramic green sheet after punching. The film after punching is peeled off from the ceramic green sheet by, for example, an adhesive tape or the like. In such a peeling operation, defects such as deformation, generation of a flaw, and breakage may occur in the ceramic green sheet. As a result, the yield of the circuit board may be reduced.

  An object of one aspect of the present disclosure is to provide a method for manufacturing a circuit board and an apparatus for manufacturing the same, which can suppress wear of punching pins while suppressing the occurrence of defects in a ceramic green sheet.

  One aspect of the present disclosure is a method of manufacturing a circuit board including a ceramic layer and a wiring portion disposed in the ceramic layer. The method of manufacturing the circuit board comprises the steps of installing a ceramic green sheet between the upper and lower molds of the punch mold, and at a position spaced above the ceramic green sheet between the upper and lower molds. Providing a resin film, and punching at least one hole in the ceramic green sheet together with the film by a punch die. In the step of opening the holes, the ceramic green sheet and the film are separated after opening.

  According to such a configuration, the ceramic green sheet is punched from above the unbonded film, and the film is separated from the ceramic green sheet after punching. Therefore, there is no need to peel off the film from the ceramic green sheet after punching. As a result, it is possible to suppress the wear of the pins for punching while suppressing the occurrence of defects in the ceramic green sheet resulting from the peeling operation of the film.

  Further, in the ceramic green sheet to which the film is bonded, the via conductor is usually formed in the state where the film is bonded. Therefore, the via conductor is formed up to the thickness portion of the film. On the other hand, according to the present disclosure, since the via conductor can be formed only in the thickness portion of the ceramic green sheet, the manufacturing efficiency of the circuit board can be enhanced. That is, it is possible to suppress the occurrence of unevenness and waviness on the surface of the circuit board by the via conductor formed to the thickness portion of the film.

  In one aspect of the present disclosure, the upper mold of the punch mold may have at least one pin for punching a ceramic green sheet, and a knockout plate for pressing the ceramic green sheet and the film. At least one pin may be provided to be accessible from at least one through hole provided in the knockout plate. In addition, in the step of forming the hole, the film may be adhered to the ceramic green sheet by the knockout plate. According to such a configuration, since the film is in close contact with the ceramic green sheet by the knockout plate, abrasion of the pin can be more reliably suppressed without using other members. In addition, the film can be easily adhered to the ceramic green sheet and separated.

  In one aspect of the present disclosure, in the step of disposing the film, the film may be supplied by delivery and winding of a roll of film. According to such a configuration, a film can be easily and reliably supplied between the upper mold of the punch and the ceramic green sheet by a relatively simple mechanism.

  One aspect of the present disclosure uses a conductive paste to form a non-sintered via filled in at least one hole opened in a ceramic green sheet and a non-sintered wiring portion disposed in the ceramic green sheet. And a step of firing the ceramic green sheet, the green via, and the green wiring portion. According to such a configuration, it is possible to obtain a circuit board in which the via conductor and the wiring portion are formed on the ceramic substrate.

  One aspect of the present disclosure further includes the steps of forming a ceramic substrate by firing a ceramic green sheet, filling the conductor in at least one hole of the ceramic substrate, and forming a wiring portion on the ceramic substrate. May be Also with such a configuration, it is possible to obtain a circuit board in which via conductors and wiring portions are formed on a ceramic substrate.

  Another aspect of the present disclosure is an apparatus for manufacturing a circuit board including a ceramic layer and a wiring portion disposed on the ceramic layer. The circuit board manufacturing apparatus includes a punch die having an upper mold and a lower mold, a transfer unit for transferring a ceramic green sheet, and a film supply unit for supplying a resin film. The transfer unit places the ceramic green sheet between the upper and lower molds of the punch die. The film supply unit places the film at a position spaced upward with respect to the ceramic green sheet between the upper mold and the lower mold. The punch mold punches at least one hole in the ceramic green sheet along with the film. In addition, the circuit board manufacturing apparatus is configured such that the ceramic green sheet and the film are separated after opening by the punch die.

  According to such a configuration, the ceramic green sheet is punched from above the unbonded film, and the film is separated from the ceramic green sheet after punching. As a result, it is possible to suppress the wear of the pins for punching while suppressing the occurrence of defects in the ceramic green sheet resulting from the peeling operation of the film.

It is a typical block diagram of the manufacturing apparatus of the circuit board in embodiment. FIG. 7 is a schematic partial enlarged cross-sectional view showing a state in which a ceramic green sheet is punched by a punch die in the circuit board manufacturing apparatus of FIG. 1; It is a flowchart which shows the manufacturing method of the circuit board in embodiment. FIG. 4A is a schematic diagram showing one step of the method for manufacturing the circuit board of FIG. 3, FIG. 4B is a schematic diagram showing the next step of FIG. 4A, and FIG. 4C is a diagram It is a typical block diagram which shows the next process of 4B, FIG. 4D is a typical block diagram which shows the next process of FIG. 4C. It is a flowchart which shows the manufacturing method of the circuit board of embodiment different from FIG. 6A is a graph showing the relationship between the number of times of punching and the diameter of the pin point in Example 1, and FIG. 6B is a graph showing the relationship between the number of times of punching and the diameter of the pin point in Comparative Example 1. 7A is a photograph of the pin tip in Example 1, and FIG. 7B is a photograph of the pin tip in Comparative Example 1.

Hereinafter, embodiments to which the present disclosure is applied will be described using the drawings.
[1. First embodiment]
[1-1. Circuit board manufacturing equipment]
The circuit board manufacturing apparatus 1 shown in FIG. 1 (hereinafter, also simply referred to as “manufacturing apparatus 1”) is an apparatus for manufacturing a circuit board including a ceramic layer and a wiring portion disposed in the ceramic layer. .

  The manufacturing apparatus 1 includes a punch die 2, a transfer unit 3, and a film supply unit 4. The manufacturing apparatus 1 is configured to form a plurality of holes in the ceramic green sheet S to be a ceramic layer of a circuit board.

<Punch mold>
The punch die 2 is a die for forming a plurality of through holes in the ceramic green sheet S by punching. The punch die 2 has an upper die 5 and a lower die 6.

  Examples of the ceramic constituting the ceramic green sheet S include alumina, beryllia, aluminum nitride, boron nitride, silicon nitride, glass and the like. These ceramics can be used alone or in combination of two or more. The average thickness of the ceramic green sheet S is, for example, 0.1 mm or more and 1 mm or less.

(Upper type)
As shown in FIG. 1, the upper mold 5 has a support plate 5A, a plurality of pins 5B, and a knockout plate 5C.

  The support plate 5A is a plate that supports the plurality of pins 5B. Specifically, the support plate 5A is provided with a plurality of pins 5B so as to project to the lower side of the support plate 5A.

  The plurality of pins 5B are punched with the resin film F to punch a plurality of holes by punching the ceramic green sheet S. The diameter of each pin 5B is designed in accordance with the size of the through hole formed in the ceramic green sheet S. In addition, the plurality of pins 5B are arranged in alignment with the positions of the plurality of through holes formed in the ceramic green sheet S.

  The knockout plate 5C is disposed below the plurality of pins 5B, and has a plurality of through holes 5D through which the plurality of pins 5B can freely move. As shown in FIG. 2, when punching out the ceramic green sheet S, the knockout plate 5C comes into contact with the film F earlier than the plurality of pins 5B and presses the film F and the ceramic green sheet S downward. Have. That is, the knockout plate 5C brings the film F into close contact with the ceramic green sheet S before the plurality of pins 5B make holes.

  The knockout plate 5C and the support plate 5A are connected, for example, by an elastic body such as a spring. Therefore, when the upper die 5 is lowered, the knockout plate 5C first abuts on the film F disposed between the upper die 5 and the ceramic green sheet S, and the film F is formed on the ceramic green sheet S by the knockout plate 5C. I can hold it down. Thereafter, as the distance between the knockout plate 5C and the support plate 5A is reduced, the plurality of pins 5B pass through the plurality of through holes 5D of the knockout plate 5C to punch out the film F and the ceramic green sheet S.

(Bottom type)
The lower die 6 has a main body 6A and a plurality of extraction holes 6B formed in the main body 6A, as shown in FIG.

  The main body 6A has a placement surface 6C on which the ceramic green sheet S held by the frame P is placed. The mounting surface 6C of the main body 6A is an upper surface of the main body 6A, that is, a surface facing the upper die 5.

  The plurality of extraction holes 6B are provided to open in the mounting surface 6C. Also, the plurality of extraction holes 6B penetrate to the lower side of the main body 6A. The plurality of extraction holes 6B can respectively insert corresponding pins 5B.

  That is, the plurality of through holes 6B are formed such that the central axis is parallel to the vertical direction. Further, at the time of punching out the ceramic green sheet S, the pin 5B protrudes to the lower side of the extraction hole 6B. The diameter of the removal hole 6B is formed slightly larger than the diameter of the corresponding pin 5B.

<Transport unit>
The transfer unit 3 is a device for transferring the ceramic green sheet S. As shown in FIG. 1, the transfer unit 3 is a ceramic green held by the frame P between the upper die 5 and the lower die 6 of the punch die 2, specifically between the film F and the lower die 6. Install the sheet S.

  As the transfer unit 3, for example, a transfer robot capable of gripping and transferring the ceramic green sheet S can be used. Moreover, you may use conveyance apparatuses other than conveyance robots, such as a belt conveyor.

  The transfer unit 3 transfers the perforated ceramic green sheet S to the next process, that is, discharges the ceramic green sheet S from between the upper mold 5 and the lower mold 6 of the punch die 2. Also used.

<Film supply unit>
The film supply unit 4 is an apparatus for supplying a film F made of resin. As shown in FIG. 1, the film supply unit 4 arranges the film F at a position spaced upward with respect to the ceramic green sheet S between the upper mold 5 and the lower mold 6.

  The material of the film F is not particularly limited, and for example, polyethylene terephthalate (PET) can be used. The average thickness of the film F is, for example, 0.02 mm or more and 0.05 mm or less. The width of the film F (the length in the direction perpendicular to the feed direction) is larger than the width of the ceramic green sheet S.

  In the present embodiment, the film supply unit 4 is configured of a plurality of rolls. The film supply unit 4 includes a delivery roll 4A, a take-up roll 4B, a first auxiliary roll 4C, and a second auxiliary roll 4D.

  The delivery roll 4A is a roll for delivering the film F wound in the form of a roll toward the punching die 2. The take-up roll 4B is a roll that is fed from the feed roll 4A and takes up the film F, which has been perforated by the punch die 2, in a roll shape. The delivery roll 4A and the take-up roll 4B are configured such that at least one of these rolls is rotationally driven.

  The first auxiliary roll 4 </ b> C is disposed between the feed roll 4 </ b> A and the punch die 2. The second auxiliary roll 4D is disposed between the punch die 2 and the take-up roll 4B. The film F is laid on the lower side of the first auxiliary roll 4C and the second auxiliary roll 4D, and are each driven to rotate as the film F is supplied to and discharged from the punch die 2.

  The first auxiliary roll 4C and the second auxiliary roll 4D are configured to be movable in the vertical direction. Specifically, when the upper mold 5 of the punch die 2 is lowered and the film F is pressed downward, the first auxiliary roll 4C and the second auxiliary roll 4D are in a state before the upper mold 5 is lowered. From the position (hereinafter, also referred to as “first position”), the film descends due to the tension of the film F, and reaches a predetermined position (hereinafter, also referred to as “second position”). On the other hand, when the upper die 5 of the punch die 2 is lifted and the pressure on the film F is released, the first auxiliary roll 4C and the second auxiliary roll 4D are at the first position before being lowered from the second position. Rise up.

  That is, the first auxiliary roll 4C and the second auxiliary roll 4D function as a separation mechanism for separating the ceramic green sheet S and the film F after the ceramic green sheet S is opened.

  The first auxiliary roll 4C and the second auxiliary roll 4D, for example, were continuously applied with an elastic force directed downward from below, moved to the second position when a downward force was applied, and the force was lost. The above-described function can be exhibited by restoring to the first position by an elastic force at the time. Also, the first auxiliary roll 4C and the second auxiliary roll 4D may be forcibly moved up and down using a mechanical device other than this.

[1-2. Method of manufacturing circuit board]
Next, a method of manufacturing a circuit board using the manufacturing apparatus 1 will be described.
The present embodiment is a method of manufacturing a circuit board including a ceramic layer and a wiring portion disposed in the ceramic layer, and includes a first manufacturing method and a second manufacturing method.

<First manufacturing method>
In the first manufacturing method, as shown in FIG. 3, a forming step S10, a film disposing step S20, an installation step S30, a boring step S40, a non-sintered conductor forming step S50, and a firing step S60. Prepare.

(Molding process)
In this step, the green ceramic is formed into a ceramic substrate. Specifically, first, additives such as ceramic powder, an organic binder, a solvent, and a plasticizer are mixed to obtain a slurry. Next, the slurry is formed into a sheet by a known method to obtain a ceramic green sheet which is a substrate-like green ceramic.

(Film placement process)
In this step, the resin film F is disposed between the upper mold 5 and the lower mold 6 at a position spaced upward with respect to the ceramic green sheet S disposed in the subsequent installation step S30 by the film supply unit 4. Do.

  Specifically, by rotating the delivery roll 4A and the take-up roll 4B, the roll-shaped film F is delivered and taken up. Thus, the film F is fed to the space sandwiched between the upper mold 5 and the lower mold 6 so as not to abut on the upper mold 5 and the lower mold 6.

(Installation process)
In this step, as shown in FIG. 4A, the transfer unit 3 places the ceramic green sheet S held by the frame P between the upper die 5 and the lower die 6 of the punch die 2. Specifically, the ceramic green sheet S is disposed on the mounting surface 6C of the lower mold 6 so as to be separated from the film F.

  The frame P is a plate-like member having an opening at its center. The frame P is made of metal, and is made of, for example, stainless steel. The ceramic green sheets S are fixed to the frame P, for example, by fastening the four sides with a tape.

(Piercing process)
In this step, as shown in FIG. 4B, a plurality of holes are made in the ceramic green sheet S together with the film F by the punch die 2. Thereby, the several hole which penetrates the surface and back surface of ceramic green sheet S in the thickness direction is formed.

  In the present step, prior to the opening, the knockout plate 5C presses the film F downward. At this time, the first auxiliary roll 4C and the second auxiliary roll 4D are pushed downward and moved from the first position to the second position. As a result, the film F adheres to the ceramic green sheet S. In this state, the plurality of pins 5B penetrate the film F and the ceramic green sheet S.

  After the holes are formed by the plurality of pins 5B, as shown in FIG. 4C, the plurality of pins 5B and the knockout plate 5C are separated from the film F and the ceramic green sheet S as the upper mold 5 rises. At the same time, the first auxiliary roll 4C and the second auxiliary roll 4D also rise and return to the first position. Thereby, the film F and the ceramic green sheet S after opening by the punch die 2 are separated.

  After separation of the film F and the ceramic green sheet S, as shown in FIG. 4D, the ceramic green sheet S is discharged from the punch 2 separately from the film F. The discharged ceramic green sheets S are subjected to a post process, for example, by a belt conveyor or the like.

  In addition, after the separation of the film F and the ceramic green sheet S, the film disposing step S20 for the next ceramic green sheet S is performed. That is, the delivery roll 4A and the take-up roll 4B are rotated, the perforated portion of the film F is ejected, and the unperforated film F is newly supplied between the upper mold 5 and the lower mold 6. Ru.

(Unsintered conductor formation process)
In this process, a conductive paste is used to form unsintered vias filled in the plurality of holes opened in the ceramic green sheet S and unsintered wiring portions disposed in the ceramic green sheet S.

  The unsintered vias constitute via conductors by sintering. The via conductor is a conductive member penetrating the circuit board in the thickness direction. The via conductor contains metal as a main component. Examples of this metal include tungsten (W), molybdenum (Mo), manganese (Mn), copper (Cu), silver (Ag), alloys of these, and the like.

  The unsintered via is a paste obtained by adding a solvent or the like to the constituent material of the via conductor described above. A well-known paste printing method can be used as a method of filling the plurality of holes of the unsintered via.

  After the filling of the unsintered vias, unsintered wiring portions to be wiring portions are arranged on both sides of the ceramic green sheet S so as to overlap with the plurality of holes while sandwiching the ceramic green sheets S. As a specific procedure, for example, the paste used in the filling of the green vias is printed on both sides of the ceramic green sheet S by screen printing to form a green wiring portion.

(Firing process)
After forming the unsintered conductor, the ceramic green sheet S, the unsintered via, and the unsintered wiring portion are fired. This firing is performed by heating to a temperature at which the ceramic green sheets S sinter. Thereby, the ceramic green sheet S is sintered to form a ceramic substrate. Further, the non-sintered via and the non-sintered wiring portion are sintered to form a via conductor and a wiring portion electrically connected to each other.

<Second manufacturing method>
In the second manufacturing method, as shown in FIG. 5, a forming step S10, a film disposing step S20, an installation step S30, a boring step S40, a firing step S70, a conductor filling step S80, and a wiring portion formation And step S90. Among these steps, the forming step S10, the film disposing step S20, the installing step S30, and the punching step S40 are the same as in the first manufacturing method, and thus the same reference numerals are given and the description thereof is omitted.

(Firing process)
In this step, the ceramic green sheet S is fired to form a ceramic substrate. This step is different from the firing step S60 of the first manufacturing method, and only the perforated ceramic green sheets S are fired. That is, in this process, the unsintered conductor is not fired. Thereby, a ceramic substrate having a plurality of holes can be obtained.

(Conductor filling process)
In this process, a via conductor is formed by filling a plurality of holes in a ceramic substrate with a conductor. As a method of forming the via conductor, for example, plating may be mentioned.

(Wiring part formation process)
In this process, wiring portions are formed on both sides of the ceramic substrate. As a method of forming the wiring portion, for example, a semi-additive method or a subtractive method can be used. The conductor filling step S80 and the wiring portion forming step S90 may be performed simultaneously.

  Furthermore, in the second manufacturing method, a non-sintered conductor is formed using the conductive paste used in the first manufacturing method in the conductor filling step S80 and the wiring portion forming step S90, and the non-sintered conductor is fired By performing this, the via conductor and the wiring portion may be formed.

[1-3. effect]
According to the embodiment described above, the following effects can be obtained.
(1a) The film F is spaced apart from the ceramic green sheet S, and after opening, the ceramic green sheet S is separated from the film F so that the ceramic green sheet S is punched from above the unbonded film F. After punching, the film F is separated from the ceramic green sheet S. Therefore, there is no need to peel off the film F from the ceramic green sheet S after punching. As a result, it is possible to suppress the wear of the punching pin 5B while suppressing the occurrence of defects in the ceramic green sheet S resulting from the peeling operation of the film F.

  Further, in the step of forming the via conductor, the via conductor can be formed only on the ceramic green sheet S or the thickness portion of the ceramic substrate after firing, so that the manufacturing efficiency of the circuit board can be enhanced. That is, it is possible to suppress the occurrence of unevenness and waviness on the surface of the circuit board by the via conductor formed to the thickness portion of the film.

  (1b) Since the film F is in close contact with the ceramic green sheet S by the knockout plate 5C, the wear of the pin can be more reliably suppressed without using any other member. In addition, the film F can be easily adhered to the ceramic green sheet S and separated.

  (1c) Since the film F is supplied by the delivery and winding of the roll-like film F, the film between the upper mold 5 of the punch die 2 and the ceramic green sheet S can be easily and reliably by a relatively simple mechanism. F can be supplied.

[2. Other embodiments]
As mentioned above, although embodiment of this indication was described, it can not be overemphasized that this indication can take various forms, without being limited to the above-mentioned embodiment.

  (2a) In the manufacturing apparatus 1 and the circuit board manufacturing method of the above embodiment, the film F is supplied between the ceramic green sheet S and the upper mold 5 after the ceramic green sheet S is installed on the punch mold 2. May be That is, you may perform installation process S30 prior to film arrangement process S20. Also, these steps may be performed simultaneously.

  (2b) In the manufacturing apparatus 1 and the circuit board manufacturing method of the above embodiment, the film F may be pressed against the ceramic green sheet S with a member other than the knockout plate 5C. Moreover, the member for pressing the film F against the ceramic green sheet S may not necessarily be provided.

  (2c) In the manufacturing apparatus 1 and the circuit board manufacturing method of the above-described embodiment, the film F may not be in the form of a roll. For example, a plurality of sheet-like films F may be prepared and supplied one by one.

  (2d) In the manufacturing apparatus 1 and the circuit board manufacturing method of the above embodiment, the first auxiliary roll 4C and the second auxiliary roll 4D that constitute the film supply unit 4 may not necessarily be configured to be vertically movable. . In addition, the first auxiliary roll 4C and the second auxiliary roll 4D are not essential components.

  Therefore, the ceramic green sheet S and the film F may be separated after the opening of the ceramic green sheet S by a mechanism other than the first auxiliary roll 4C and the second auxiliary roll 4D. Furthermore, if the ceramic green sheet S and the film F are automatically separated with the rise of the upper mold 5 after the opening, it is not necessary to provide a mechanism for separating these.

  (2e) In the manufacturing apparatus 1 and the circuit board manufacturing method of the above-described embodiment, a ceramic green sheet S wound in a roll may be used. In this case, a device for pitch-feeding the ceramic green sheets S to the punch die 2 is used as the transfer unit 3.

  (2f) In the method of manufacturing a circuit board of the above embodiment, the first manufacturing method and the second manufacturing method each include a step of laminating a plurality of circuit boards or ceramic sheets on which a via conductor and a wiring portion are formed. You may have. A multilayer circuit board is obtained by this process.

  (2g) In the method of manufacturing the circuit board of the above embodiment, the via conductors need not necessarily be formed in the holes provided in the ceramic green sheet S. Also, the ceramic green sheet S may be provided with one hole instead of a plurality of holes.

  (2h) The function of one component in the above embodiment may be distributed as a plurality of components, or the function of a plurality of components may be integrated into one component. In addition, part of the configuration of the above embodiment may be omitted. In addition, at least a part of the configuration of the above-described embodiment may be added to or replaced with the configuration of the other above-described embodiment. In addition, all the aspects contained in the technical thought specified from the wording as described in a claim are an embodiment of this indication.

[3. Example]
Hereinafter, the contents of the test performed to confirm the effects of the present disclosure and the evaluation thereof will be described.

Example 1
Punching of the ceramic green sheet S is performed while supplying the film F to the upper side of the ceramic green sheet S using the manufacturing apparatus 1 of FIG. 1, and 10,000 times, 20,000 times, 30,000 times, 40,000 The diameter of the pin point after the first and 50,000 times of punching was measured.

  The ceramic green sheet S had an outer diameter of 200 mm × 180 mm, a thickness of 0.18 mm, a frame P had an outer diameter of 200 mm × 200 mm, an opening of 140 mm × 170 mm, a thickness of 0.5 mm, and the film F had a thickness of 0.04 mm. Further, the diameter of the pin 5B was about 0.08 mm. Moreover, "the diameter of the pin point" means the diameter of the lowermost end of the pin 5B. The results are shown in FIG. 6A. Moreover, the photograph of the pin point after 50,000 times punching is shown to FIG. 7A.

(Comparative example 1)
Punching of the ceramic green sheet S was performed without supplying the film F using the manufacturing apparatus 1 of FIG. 1, and the diameter of the pin tip was measured in the same manner as in Example 1. The same ceramic green sheet S and film F as in Example 1 were used, but the diameter of the pin 5B was about 0.06 mm. The results are shown in FIG. 6B. Moreover, the photograph of the pin point after 50,000 times punching is shown to FIG. 7B.

(Discussion)
As shown in FIGS. 6A and 6B and FIGS. 7A and 7B, Example 1 has a smaller reduction in the diameter of the pin tip than Comparative Example 1. That is, it was shown that reduction in the diameter of the pin point can be remarkably suppressed by performing punching while feeding the film without adhering to the ceramic green sheet.

  Further, in Example 1, since the film F was not bonded to the ceramic sheet S, no flaws or deformation were confirmed on the ceramic sheet S after the film F was separated after punching.

DESCRIPTION OF SYMBOLS 1 ... Manufacturing apparatus, 2 ... Punch die, 3 ... Transfer part, 4 ... Film supply part,
4A: Delivery roll, 4B: Take-up roll, 4C: first auxiliary roll,
4D second auxiliary roll, 5 upper mold, 5A support plate 5B pin
5C: knockout plate, 5D: through hole, 6: lower mold, 6A: main body, 6B: extraction hole,
6C ... mounting surface.

Claims (6)

A method of manufacturing a circuit board, comprising: a ceramic layer; and a wiring portion disposed in the ceramic layer,
Placing a ceramic green sheet between the upper and lower molds of the punch mold;
Placing a resin film at a position spaced upward with respect to the ceramic green sheet between the upper mold and the lower mold;
Drilling at least one hole in the ceramic green sheet together with the film by the punch die;
Equipped with
The method for manufacturing a circuit board, wherein the ceramic green sheet and the film are separated after opening in the step of opening the holes. The upper mold of the punch mold is
At least one pin for punching out the ceramic green sheet;
A knockout plate for pressing the ceramic green sheet and the film;
Have
The at least one pin is provided so as to be freely accessible from at least one through hole provided in the knockout plate,
The method for manufacturing a circuit board according to claim 1, wherein the film is adhered to the ceramic green sheet by the knockout plate in the step of forming the hole.   The method for manufacturing a circuit board according to claim 1, wherein in the step of disposing the film, the film is supplied by delivering and winding the roll-shaped film. Forming a non-sintered via filled in the at least one hole opened in the ceramic green sheet and a non-sintered wiring portion disposed in the ceramic green sheet using a conductive paste;
Firing the ceramic green sheet, the green via, and the green wiring portion;
The method for manufacturing a circuit board according to any one of claims 1 to 3, further comprising: Forming a ceramic substrate by firing the ceramic green sheet;
Filling the at least one hole of the ceramic substrate with a conductor;
Forming the wiring portion on the ceramic substrate;
The method for manufacturing a circuit board according to any one of claims 1 to 3, further comprising: What is claimed is: 1. A manufacturing apparatus of a circuit board, comprising: a ceramic layer; and a wiring portion disposed in the ceramic layer,
A punch mold having an upper mold and a lower mold,
A transfer unit for transferring the ceramic green sheet,
A film supply unit for supplying a resin film;
Equipped with
The transfer unit places the ceramic green sheet between the upper mold and the lower mold of the punch mold,
The film supply unit arranges the film at a position spaced upward with respect to the ceramic green sheet between the upper mold and the lower mold.
The punch mold punches at least one hole in the ceramic green sheet together with the film;
The manufacturing apparatus of the circuit board comprised so that the said ceramic green sheet and the said film may be spaced apart after the opening by the said punch die.