JP2002076614A - Method for manufacturing board for electronic circuit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a board for an electronic circuit capable of simultaneously forming many through holes with a simple means. SOLUTION: A plurality of pins are made of a metal and are heated to the melting point of a prepreg and a prepreg sheet P or the like temporarily press-bonded in an arbitrary thickness or to the melting point of a protective sheet S or the like having a melting point equivalent to or slightly higher than that of the prepreg. The pins 25 are made to penetrate the prepreg or the prepreg sheet to the prepreg sheet contacted with the pins while melting a work material WB made of the prepreg sheet and the protective sheet. The work material WB made of the prepreg sheet and the protective sheet contacted with the pins is cooled at a stage where the pins penetrate through the prepreg or the prepreg sheet or the work material made of the prepreg sheet and the protective sheet. The pins are taken out from the prepreg or the work material, in a state in which the hole H can hold its shape at a room temperature.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an electronic circuit board, and more particularly, to a method of connecting a wiring layer with a through-type conductive wiring portion, and connecting the through-type conductive wiring portion with a conductive paste. The present invention relates to a method for manufacturing a formed electronic circuit substrate.

[0002]

2. Description of the Related Art Conventionally, in a substrate for a double-sided electronic circuit or a substrate for a multilayer electronic circuit, connection between wiring layers provided on both surfaces of an insulating base material is performed by the following method. For example, in the case of a substrate for a double-sided electronic circuit, a through-hole is mechanically drilled at a predetermined position on a double-sided copper-clad substrate using a drill or the like, and the entire surface including the inner wall surface of the through-hole is subjected to chemical plating and electroplating. The connection between the wiring layers is performed by performing copper plating by the processing.

In the case of a multilayer electronic circuit board, a predetermined wiring shape is patterned on a copper foil adhered to both sides of a base material, and an insulating base material such as a prepreg is formed on the patterned surface. After further laminating and arranging the copper foil through the intermediary, it is pressurized in a heated state to be integrated, and a mechanical through hole is formed at a predetermined position using a drill or the like as in the case of the double-sided electronic circuit board. And copper plating is applied to the entire surface including the inner wall surface of the through hole by chemical plating and electroplating to connect the wiring layers.

Further, in the case of a multilayer electronic circuit board in which wiring layers are further stacked, a copper foil adhered to both sides of a substrate is patterned with a predetermined wiring shape, and is manufactured by increasing the number of layers. .

In these conventional methods for manufacturing a substrate for an electronic circuit, in addition to a case where a through hole is mechanically formed by using a drill or the like at a predetermined position, in recent years, a through hole is formed by using a laser. The technology of forming has also been put to practical use, and finer processing has become possible. Regarding the connection between wiring layers, in addition to the method of applying copper plating by chemical plating and electroplating, prepreg sheets without copper foil stuck After forming a through hole using a drill or laser, filling the formed through hole with a conductive paste by a printing method or the like, curing the conductive paste filled in the through hole, and then laminating a copper foil. There is also a method in which the components are integrated by pressing in a heated state.

[0006]

By the way, in recent years, with high performance and miniaturization of electronic equipments, electronic circuit boards have been increased in density, such as finer wiring patterns and smaller diameters of through holes. At the same time as higher multilayers are required, improvements in productivity such as reduction in manufacturing cost and manufacturing period are strongly desired.

However, in the above-described conventional technique, a through hole is mechanically formed using a drill or a through hole is formed using a laser. The through hole is formed using a laser. In any case, there is a limitation on the thickness of the material that can be penetrated, and in any method, there is a recent tendency that the number of through holes per product increases, so that equipment for forming the through holes is required. Not only must this be very expensive, but also the process management becomes complicated, and as a result, these can be reflected in the manufacturing cost and yield of electronic circuit boards, and meet the market demand for low cost and short delivery time. There was a problem that there was not.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems of the prior art, and an object of the present invention is to provide an electronic circuit for an electronic circuit in which a very large number of through holes can be simultaneously formed by simple means. An object of the present invention is to provide a method for manufacturing a substrate.

[0009]

Means for Solving the Problems The inventors of the present invention have made intensive studies to achieve the above-mentioned object, and as a result, have found that the melting point is equal to or slightly higher than that of a prepreg and a prepreg sheet or a prepreg preliminarily press-bonded with an arbitrary thickness. A plurality of metal pins heated to the melting point of a protective sheet or the like having the metal pins are penetrated while melting a prepreg or a prepreg sheet or a work material composed of the prepreg sheet and the protective sheet in contact with the metal pins. Alternatively, at the stage where the work material composed of the prepreg sheet or the prepreg sheet and the protection sheet has been completely penetrated, the metal material and the prepreg or the work material composed of the prepreg sheet or the prepreg sheet and the protection sheet that are in contact with the metal pin are cooled. The prepreg or prepreg in a state where Gushito to the finding can be achieved by pulling the metal pin from the work material made of prepreg sheet and the protective sheet, thereby completing the present invention.

That is, the method for manufacturing an electronic circuit board according to the present invention comprises the steps of: heating a metal pin planted at a predetermined pitch in a through-hole forming upper die to a melting point of a prepreg; A step of heating to a temperature immediately before the melting point of the prepreg, a step of pressing a metal pin of a through-hole forming upper mold heated to a melting point of the prepreg against the prepreg, and penetrating a prepreg in contact with the metal pin, Cooling the metal pin and the prepreg in contact with the metal pin after the pin has passed through the prepreg; and cooling the metal pin and the prepreg in contact with the metal pin from the prepreg after the prepreg is cooled. Forming a through hole in the prepreg, filling the through hole formed in the prepreg with a conductive paste, and curing only the conductive paste. And degree, the conductive paste is characterized by comprising a step of on both sides of the prepreg disposed a metal foil thermocompression bonding after curing.

The method of manufacturing an electronic circuit board according to the present invention includes the steps of temporarily bonding a plurality of B-stage prepregs to an arbitrary thickness to form a prepreg sheet; Heating the metal pins planted at the pitch to the melting point of the prepreg, heating the prepreg sheet to a temperature immediately before the melting point, and forming the through-hole forming die heated to the melting point of the prepreg. A step of penetrating a prepreg sheet in contact with a metal pin by pressing a metal pin against the prepreg sheet, and forming a prepreg sheet in contact with the metal pin and the metal pin after the metal pin penetrates the prepreg sheet. Cooling the metal pins and the metal pins from the prepreg sheet after the prepreg sheet in contact with the metal pins is cooled. Forming a through hole in the drawn prepreg sheet, filling the through hole formed in the prepreg sheet with a conductive paste and curing only the conductive paste, and both surfaces of the prepreg sheet after the conductive paste is cured. And a step of arranging a metal foil thereon and performing thermocompression bonding.

Further, in the method of manufacturing an electronic circuit board according to the present invention, a B-stage prepreg and a protective sheet having a melting point equivalent to or slightly higher than that of the prepreg are provided on both surfaces of the prepreg, and the prepreg is temporarily formed at an arbitrary thickness. A step of forming a work material by pressure bonding, a step of heating metal pins planted at a predetermined pitch in an upper die for forming through holes to a melting point of the protective sheet, and a step of heating the work material immediately before the melting point of the prepreg. Heating to the temperature of the protective sheet, and pressing the upper metal pin for through-hole formation heated to the melting point of the protective sheet against the work material to penetrate the work material that comes into contact with the metal pin, Cooling the metal pin and the work material in contact with the metal pin after the metal pin has penetrated the work material; and cooling the metal pin and the work material in contact with the metal pin. Extracting a metal pin from the work material after forming the work material, forming a through hole in the work material, filling the through hole formed in the work material with a conductive paste, and curing only the conductive paste; The method comprises the steps of: peeling off the protective sheet temporarily pressed to the work material after the conductive paste is cured; and arranging metal foils on both sides of the prepreg from which the protective sheet has been peeled off and heat-pressing. .

Further, the method of manufacturing an electronic circuit board according to the present invention comprises the steps of: heating a metal pin planted at a predetermined pitch in a through-hole forming upper die to a melting point of the prepreg; Heating to a temperature just before the melting point of the prepreg, pressing the metal pin of the through-hole forming upper die heated to the melting point of the prepreg, and penetrating the prepreg in contact with the metal pin; and Cooling the metal pin and the prepreg in contact with the metal pin after penetrating the prepreg; and extracting the metal pin from the prepreg after the metal pin and the prepreg in contact with the metal pin are cooled. Forming a through hole in the prepreg, masking an unnecessary through hole for each product among the through holes formed in the prepreg, and forming the through hole in the prepreg. A step of filling the conductive paste only in the through holes required for each product that is not masked in the holes and curing only the conductive paste, and disposing metal foil on both surfaces of the prepreg after the conductive paste is cured. Thermocompression bonding.

Further, in the method for manufacturing an electronic circuit board according to the present invention, a plurality of B-stage prepregs are provisionally pressed to an arbitrary thickness to form a prepreg sheet; Heating the metal pins planted at the pitch to the melting point of the prepreg, heating the prepreg sheet to a temperature immediately before the melting point, and forming the through-hole forming die heated to the melting point of the prepreg. Pressing the metal pins to penetrate the prepreg sheet in contact with the metal pins, and cooling the metal pins and the prepreg sheet in contact with the metal pins after the metal pins penetrate the prepreg sheet; After the metal pins and the prepreg sheet in contact with the metal pins are cooled, the metal pins are pulled out of the prepreg sheet. Forming a through hole in the prepreg sheet, masking an unnecessary through hole for each product in the through holes formed in the prepreg sheet, and forming a through hole in the prepreg sheet for each unmasked product in the through holes formed in the prepreg sheet. Filling a conductive paste only in necessary through holes and curing only the conductive paste, and disposing a metal foil on both surfaces of the prepreg sheet after the conductive paste is cured and heating and pressing. It is characterized by.

Further, in the method of manufacturing an electronic circuit board according to the present invention, the B-stage prepreg and a protective sheet having a melting point equal to or slightly higher than that of the prepreg are provided on both surfaces of the prepreg, and the prepreg is temporarily formed at an arbitrary thickness. A step of forming a work material by crimping, a step of heating metal pins planted at a predetermined pitch in the through-hole forming upper die to the melting point of the protective sheet, and a step of heating the work material immediately before the prepreg melting point. Heating to a temperature, pressing the upper metal pin for through-hole formation heated to the melting point of the protective sheet to penetrate a work material that comes into contact with the metal pin, and Cooling the metal pin and the workpiece in contact with the metal pin after penetrating the workpiece, and cooling the workpiece after the metal pin and the workpiece in contact with the metal pin are cooled. Forming a through-hole in the work material by withdrawing a metal pin from the work material, masking an unnecessary through-hole for each product among the through-holes formed in the work material, and removing the through-hole formed in the work material. A step of filling the conductive paste only in through holes required for each product not masked in the inside and curing the conductive paste only, and peeling off the protective sheet temporarily bonded to the work material after the conductive paste is cured And a step of arranging metal foils on both sides of the prepreg from which the protective sheet has been peeled off and heat-pressing.

Further, the method for manufacturing an electronic circuit board according to the present invention comprises the steps of: heating a metal pin planted at a predetermined pitch in a through-hole forming die to a melting point of a prepreg; Heating to a temperature just before the melting point of the prepreg, pressing the metal pin of the through-hole forming upper die heated to the melting point of the prepreg, and penetrating the prepreg in contact with the metal pin; and Cooling the metal pin and the prepreg in contact with the metal pin after penetrating the prepreg; and extracting the metal pin from the prepreg after the metal pin and the prepreg in contact with the metal pin are cooled. Forming a through hole in the prepreg, masking an unnecessary through hole for each product among the through holes formed in the prepreg, and forming the through hole in the prepreg. A step of filling the conductive paste only hole required for each product that is not masked within the hole,
Conduction is performed by using a conductive paste curing device that also includes a conduction test pin and an upper plate in which conduction pins are implanted in accordance with the positions of through holes required for each product filled with the conductive paste and a flat underplate. A step of curing only the conductive paste and conducting an electrical test, and a step of disposing metal foil on both surfaces of the prepreg after the conductive paste is cured and heat-pressing.

Further, in the method for manufacturing an electronic circuit board according to the present invention, a plurality of B-stage prepregs are temporarily pressure-bonded to an arbitrary thickness to form a prepreg sheet; Heating the metal pins planted at the pitch to the melting point of the prepreg, heating the prepreg sheet to a temperature immediately before the melting point, and forming the through-hole forming die heated to the melting point of the prepreg. Pressing the metal pins to penetrate the prepreg sheet in contact with the metal pins, and cooling the metal pins and the prepreg sheet in contact with the metal pins after the metal pins penetrate the prepreg sheet; After the metal pins and the prepreg sheet in contact with the metal pins are cooled, the metal pins are pulled out of the prepreg sheet. Forming a through hole in the prepreg sheet, masking an unnecessary through hole for each product in the through holes formed in the prepreg sheet, and forming a through hole in the prepreg sheet for each unmasked product in the through holes formed in the prepreg sheet. A step of filling only the necessary through holes with conductive paste, and an upper plate and a flat under plate in which energizing pins are implanted in accordance with the positions of the necessary through holes for each product filled with the conductive paste. A step of hardening only the conductive paste by energization and conducting an electrical inspection using a conductive paste curing device that also serves as a conductive test consisting of: and disposing metal foil on both surfaces of the prepreg sheet after the conductive paste is cured. Thermocompression bonding.

Further, in the method of manufacturing an electronic circuit board according to the present invention, the B-stage prepreg and a protective sheet having a melting point equal to or slightly higher than that of the prepreg are provided on both surfaces of the prepreg, and the prepreg is temporarily provided with an arbitrary thickness. Crimping to form a work material, heating the metal pins planted at a predetermined pitch in the through-hole forming upper die to the melting point of the protective sheet, and heating the work material to a temperature immediately before the prepreg melting point. A step of heating, and a step of pressing a metal pin of the upper die for through-hole heated to the melting point of the protective sheet to penetrate a work material that comes into contact with the metal pin, and the metal pin cuts the work material. Cooling the metal pin and the work material in contact with the metal pin after penetrating; and cooling the metal material from the work material after the metal pin and the work material in contact with the metal pin are cooled. A step of extracting a pin to form a through-hole in the work material, a step of masking an unnecessary through-hole for each product in the through-hole formed in the work material, and a step of masking in the through-hole formed in the work material Filling the conductive paste only into the through-holes required for each product that is not performed, and an upper plate and a flat plate in which current-carrying pins are implanted in accordance with the positions of the through-holes required for each product filled with the conductive paste. A step of hardening only the conductive paste by energization using an energization inspection combined conductive paste curing device consisting of an underplate and an energization inspection, and temporarily pressing the work piece after the conductive paste is cured. And a step of disposing a metal foil on both sides of the prepreg from which the protective sheet has been peeled off and heat-pressing it.

In the above structure, when the metal pin of the upper die for forming a through hole is pressed into contact with the prepreg or the prepreg sheet or the work material in contact with the metal pin while melting, the upper metal pin for forming the through hole is formed. It is desirable to vibrate the mold or the lower mold for forming the through hole or both.

Further, in the above structure, when the prepreg, the prepreg sheet, or the work material which comes into contact with the metal pin is pressed while pressing the upper metal pin for forming the through hole, and the work material is melted and penetrated, XY in plan view. In the axial direction, the upper die for forming a through hole or the lower die for forming a through hole moves by a distance of half the planting pitch of the metal pins planted at a predetermined pitch in the upper die for forming a through hole. It is desirable to repeat.

Further, in the above configuration, it is preferable that the tip of the metal pin implanted at a predetermined pitch in the upper die for forming a through hole has a conical shape such as a cone or a pyramid.

[0022]

According to the method of manufacturing an electronic circuit board according to the present invention, a prepreg and temporary compression bonding are performed at an arbitrary thickness by using a simple and inexpensive apparatus called a through hole forming die in which pins are implanted at a predetermined pitch. A pin heated to the melting point of a prepreg sheet or a protective sheet having a melting point equal to or slightly higher than that of the prepreg is penetrated while melting the prepreg or the prepreg sheet or a work material composed of the prepreg sheet and the protection sheet in contact with the pin. When the pins have completely penetrated the prepreg or the prepreg sheet or the work material formed of the prepreg sheet and the protection sheet, the prepreg or the prepreg sheet or the work material formed of the prepreg sheet and the protection sheet in contact with the pins is cooled, Pre-preg or prepreg with the through hole capable of maintaining its shape at room temperature Or sheet by pulling the pin from the work material made of prepreg sheet and the protective sheet can be formed by simple means a very large number of through holes simultaneously, the time required for forming the through hole is greatly reduced,
A low-cost electronic circuit board can be obtained.

[0023]

Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 is an explanatory view showing a process outline of a method for manufacturing an electronic circuit board according to the present invention, FIGS. 2 to 4 are explanatory views of a through hole forming die, and FIGS. .

First, in FIG. 1, a prepreg sheet P, in which a plurality of B-stage prepregs are wound in a roll shape, is wound in a roll shape on both upper and lower surfaces in the same manner as the prepreg sheet P while being pulled out. By arranging the protective sheet S having a slightly higher melting point while pulling it out and passing it through the heat roller 1, a continuous sheet-like work material W temporarily compressed and formed with an arbitrary thickness is formed. The prepreg may be any material conventionally used in the manufacture of electronic circuit boards, such as a glass woven fabric or a glass nonwoven fabric impregnated with an epoxy resin, a BT resin, or a PPE resin.

At this time, the temperature at which the continuous sheet-like workpiece W is preheated by the heat roller 1 is 80 ° C. to 120 ° C.
Thus, the prepreg sheet P and the protection sheet S are provisionally pressure-bonded to form a continuous sheet-shaped work material W.

Then, the continuous sheet-shaped work material W is cut into a predetermined size (for example, 500 mm × 600 mm) by a cutting device 50 such as a shearing machine, and a work board WB is formed. The through hole H is formed on the upper surface of the lower front die 30 of the through hole forming die 2.

Before explaining the formation of the through hole H, FIG.
The configuration of the through-hole forming die 2 will be described with reference to FIGS. The through-hole forming die 2 is roughly composed of an upper die 20, a lower front die 30, and a lower rear die 40. The upper die 20 has a thickness of 20 mm.
mm, an aluminum die holder 21 having a thickness of about 0.5 mm, a heater 22 incorporated in the aluminum die holder 21, and a thickness of 0.5 mm.
A brass plate punch pad 23, a brass plate punch holder 24 also having a thickness of about 0.5 mm,
A group of metal pins 25 sandwiched and fixed between the punch pad 23 and the punch holder 24, and approximately 2 m from the punch holder 24.
A stripper plate 26 made of a brass plate having a thickness of about 0.5 mm, which is loosely supported with a gap of about m, and a cleaner sheet 27 made of silicon rubber adhered to the lower surface of the stripper plate 26. I have. The group of metal pins 25 has a diameter of 0.05 mm to 0.3 mm,
The tip having a length of about 0.5 mm to 2 mm has a conical pointed shape, and is 2.54 m in both XY directions in plan view.
It is in a state of being planted at m pitches.

The lower front mold 30 includes an aluminum die plate 31 having a thickness of about 20 mm, a heater 32 incorporated in the aluminum die plate 31, and an ultrasonic vibration attached to the center of the lower surface of the die plate 31. It comprises a unit 33 and a silicon rubber plate 34 as an elastic body attached to the upper surface of the die plate 31.

The lower rear mold 40 includes an aluminum die plate 41 having a thickness of about 20 mm and a large number of suction ports 45 formed in the vertical direction, and the suction die attached to the lower surface of the aluminum die plate 41. The cover 4 covers the entire opening 45 and is connected to a suction blower (not shown) via a suction pipe 43.
4 and a sponge sheet 42 having air permeability attached to the upper surface of the die plate 41.

The formation of the through hole H will now be described with reference to FIGS. 5 to 7. First, the work board WB is moved to the upper surface of the lower front die 30 of the through hole forming die 2, and at that stage, the work board WB is roughly moved. Perform positioning.

The through-hole forming die 2 includes an upper die 20 and a lower front die 30.
And the lower rear mold 40 does not engage precisely like a normal die,
Since the metal pins 25 implanted in the upper mold 20 are in contact with appropriate positions of the silicon rubber plate 34 of the lower front mold 30 and the sponge sheet 42 of the lower rear mold 40, there is no need to perform highly accurate positioning here. It is only necessary to roughly position the area required for the product of the work board WB and the upper die 20.

Next, the upper die 20 of the through hole forming die 2 starts to descend. At this time, the group of metal pins 25 implanted in the upper die 20 of the through hole forming die 2 Protective sheet S by heater 22 built in aluminum die holder 21
Is heated to the melting point.

Then, the upper die 20 of the through hole forming die 2 is gradually lowered, and the metal pins 25 are firstly moved to the work board WB.
, And then melts the prepreg sheet P almost simultaneously with the melting of the protection sheet S on the upper surface of the work board WB.
Ultrasonic vibration unit 3 attached to die plate 31
By actuating 3, the work board WB vibrates delicately, and this vibration causes the tips of the group of metal pins 25 to pass through a small gap of the glass woven fabric of the prepreg sheet P and penetrate the prepreg sheet P while melting.

Next, the group of metal pins 25 penetrates through the protective sheet S on the lower surface of the work board WB, and
The upper mold 20 stops when the tip of the group of metal pins 25 reaches the silicon rubber plate 34 attached to the upper surface of the lower front mold 30 of the through hole forming mold 2 by completely penetrating. At the stage when the upper mold 20 stops, the upper mold 20 once rises, and accordingly, the work board WB also moves to the metal pin 2.
It rises while attached to group 5.

Thereafter, when the upper mold 20 is moved to the upper position of the lower rear mold 40 shown in the imaginary line in FIG. 2 and the work board WB is attached to the group of metal pins 25 and then lowered, the metal pins 25 Sponge sheet 4
2 and the entire lower rear mold 40 is cooled by suction from the lower surface of the die plate 41 with a suction blower (not shown).
At this stage, the group of metal pins 25 with the conical pointed tip infiltrated is also instantaneously cooled at this stage.

That is, once the die holder 21 of the upper mold 20 is
The group of metal pins 25 heated to the melting temperature of the prepreg by the heater 22 built in the prepreg sheet P
In the stage in which the portion in contact with the metal pins 25 of the work board WB is melted and penetrated while the penetration is completed,
The upper mold 20 moves upward to the upper part of the lower rear mold 40 while the work board is attached to the metal pins 25, and instantaneously when the tip of the metal pins 25 contacts the sponge sheet 42 of the lower rear mold 40. At the same time, the work board WB including the prepreg sheet P in contact with the group of metal pins 25 is quickly cooled.

The upper die 20 is moved upward only while the work board is attached to the metal pins 25 and is not moved to the upper part of the lower rear die 40, but is moved to the lower part of the upper die 20. The same steps are performed.

At this stage, when the upper mold 20 is raised, the work board WB including the prepreg sheet that has been melted by the group of metal pins 25 and cooled is formed in a space shape from which the group of metal pins 25 escaped. And a through hole group H is formed.

In forming the through hole group H, similarly,
It is also preferable to form a through hole (not shown) for positioning, having a diameter of about 1 mm to 2 mm, which is required in a later step.
Upper die 20 or lower front die 30 and lower rear die 4 for through hole forming die 2
0 is configured to be movable in the X and Y axis directions in a plan view at a distance of half the planting pitch of the metal pins 25, that is, a distance of 1.27 mm, so that a larger number of through holes are the same. It can be formed by a device.

In the next step, a conductive paste, specifically 9
Filling with copper paste mixed with 0% or more of copper and binder components such as epoxy resin and hot melt resin, but as a pre-process, work to prevent copper paste from entering unnecessary through holes for each product. A masking sheet M is attached to the upper surface of the board WB, and a moisture absorbing filter paper R is attached to the lower surface of the work board WB to prevent the copper paste from flowing out and to absorb unnecessary solvent in the copper paste.

Next, the copper paste is filled into the through holes H using an automatic printing machine 60 or the like having a structure in which the squeegee 61 reciprocates. At this time, the copper paste is sucked from the lower surface of the work board WB by the vacuum device 62. Thus, the filling of the copper paste can be performed quickly and efficiently at high density.

After the copper paste is filled in the through holes H which are not covered with the masking sheet M, in other words, the through holes H required for each product, the masking sheet M and the moisture absorbing filter paper R are peeled off, and the copper paste is heated. When the protective sheet S is peeled off after curing, the cured copper paste protrudes from the front and back surfaces of the prepreg sheet P by the thickness of the protective sheet S.

When the copper paste is hardened, the copper paste is constituted by an upper plate 71 in which current-carrying pins are planted in accordance with the positions of the through holes H filled with the copper paste, and a flat underplate 72. In this case, it is preferable to use a curing device 70 which is also used as an electric current inspection device, which can perform temperature rise hardening and also perform an electric current inspection after cooling.

After the protective sheet S is peeled off, copper foils 51 are provided on both sides of the prepreg sheet P in the same manner as in the conventional manufacturing method of an electronic circuit board, and heat and pressure are applied using a heating and pressing press. By crimping, it is possible to obtain an electronic circuit board in which the conductor wiring portion is formed of a conductive paste.

The shape of the metal pin 25 used for the through hole forming die 2 is not particularly limited as long as it has a length equal to or greater than the thickness of the work board WB to be processed. However, if the shape is a cone or a pyramid, it is more effective when penetrating the glass woven fabric.

[0046]

As described above, in the method of manufacturing an electronic circuit board according to the present invention, a step of heating a metal pin planted at a predetermined pitch in a through-hole forming upper die to a melting point of a prepreg. Heating the prepreg to a temperature just before its melting point, and pressing the upper metal pin for through hole formation heated to the melting point of the prepreg against the prepreg to penetrate the prepreg in contact with the metal pin. And cooling the prepreg in contact with the metal pin and the metal pin after the metal pin has penetrated the prepreg, and after cooling the prepreg in contact with the metal pin and the metal pin. A step of extracting a metal pin from the prepreg to form a through hole in the prepreg, and filling the through hole formed in the prepreg with a conductive paste, and Curing and, after the conductive paste is cured, arranging a metal foil on both surfaces of the prepreg and heating and pressing, so that a very large number of through holes can be simultaneously formed by simple means. ,
The time required for forming the through holes is greatly reduced, and a low-cost electronic circuit substrate can be obtained.

Further, in the method of manufacturing an electronic circuit board according to the present invention, a plurality of B-stage prepregs are temporarily pressure-bonded to an arbitrary thickness to form a prepreg sheet; Heating the metal pins planted at the pitch to the melting point of the prepreg, heating the prepreg sheet to a temperature immediately before the melting point, and forming the through-hole forming die heated to the melting point of the prepreg. Pressing the metal pin against the prepreg sheet to penetrate the prepreg sheet that contacts the metal pin, and cooling the metal pin and the prepreg sheet that is in contact with the metal pin after the metal pin passes through the prepreg sheet. And, after the metal pins and the prepreg sheet in contact with the metal pins are cooled, pulling the metal pins from the prepreg sheet. Forming a through hole in the punched prepreg sheet, filling the through hole formed in the prepreg sheet with a conductive paste and curing only the conductive paste, and both sides of the prepreg sheet after the conductive paste is cured. A process of arranging metal foil on the prepreg sheet and heat-pressing it. Thus, the time required for forming the through holes is greatly reduced, and a low-cost electronic circuit substrate can be obtained.

Further, in the method of manufacturing an electronic circuit board according to the present invention, the prepreg of the B stage and the protective sheet having a melting point equal to or slightly higher than that of the prepreg are provided on both surfaces of the prepreg, and the prepreg is temporarily formed at an arbitrary thickness. A step of forming a work material by pressure bonding, a step of heating metal pins planted at a predetermined pitch in an upper die for forming through holes to a melting point of the protective sheet, and a step of heating the work material immediately before the melting point of the prepreg. Step of heating to the temperature of the protective sheet, the step of pressing the upper metal pin for through-hole formation heated to the melting point of the protective sheet to the work material to penetrate the work material that comes into contact with the metal pin,
A step of cooling the metal pin and the work material in contact with the metal pin after the metal pin penetrates the work material, and after the work material in contact with the metal pin and the metal pin is cooled A step of extracting a metal pin from the work material to form a through hole in the work material; a step of filling the through hole formed in the work material with a conductive paste and curing only the conductive paste; Since the step of peeling off the protective sheet that has been temporarily pressed to the work material after being cured, and the step of arranging metal foil on both surfaces of the prepreg from which the protective sheet has been peeled off and heating and pressing, it is characterized in that at the same time An extremely large number of through-holes can be formed by simple means, the time required for forming the through-holes is greatly reduced, a low-cost electronic circuit board is obtained, and the prepreg during the process is produced. It is covered by a protective sheet, thereby making it possible to improve the efficiency of the production line becomes easy operator handling.

Further, the method for manufacturing an electronic circuit board according to the present invention comprises the steps of: heating a metal pin planted at a predetermined pitch in a through-hole forming upper die to a melting point of the prepreg; Heating to a temperature just before the melting point of the prepreg, pressing the metal pin of the through-hole forming upper die heated to the melting point of the prepreg, and penetrating the prepreg in contact with the metal pin; and Cooling the metal pin and the prepreg in contact with the metal pin after penetrating the prepreg; and extracting the metal pin from the prepreg after the metal pin and the prepreg in contact with the metal pin are cooled. Forming a through hole in the prepreg, masking an unnecessary through hole for each product among the through holes formed in the prepreg, and forming the through hole in the prepreg. A step of filling the conductive paste only in the through holes required for each product that is not masked in the holes and curing only the conductive paste, and disposing metal foil on both surfaces of the prepreg after the conductive paste is cured. Since it is characterized by the step of thermocompression bonding, an extremely large number of through-holes and an interlayer conductive portion required for each product can be simultaneously formed by simple means, and formation of an interlayer conductive portion required for each through-hole and product can be formed. The time required for the electronic circuit is greatly reduced, and a low-cost electronic circuit substrate can be obtained.

Further, in the method of manufacturing an electronic circuit board according to the present invention, a plurality of B-stage prepregs are temporarily pressure-bonded to an arbitrary thickness to form a prepreg sheet; Heating the metal pins planted at the pitch to the melting point of the prepreg, heating the prepreg sheet to a temperature immediately before the melting point, and forming the through-hole forming die heated to the melting point of the prepreg. Pressing the metal pins to penetrate the prepreg sheet in contact with the metal pins, and cooling the metal pins and the prepreg sheet in contact with the metal pins after the metal pins penetrate the prepreg sheet; After the metal pins and the prepreg sheet in contact with the metal pins are cooled, the metal pins are pulled out of the prepreg sheet. Forming a through hole in the prepreg sheet, masking an unnecessary through hole for each product in the through holes formed in the prepreg sheet, and forming a through hole in the prepreg sheet for each unmasked product in the through holes formed in the prepreg sheet. Filling a conductive paste only in necessary through holes and curing only the conductive paste, and disposing a metal foil on both surfaces of the prepreg sheet after the conductive paste is cured and heating and pressing. Therefore, for prepreg sheets of any thickness from ultra-thin to extremely thick, it is possible to simultaneously form an extremely large number of through holes and interlayer conductive parts necessary for each product by simple means. The time required to form the interlayer conductive portion required for each time is greatly reduced, and a low-cost electronic circuit substrate can be obtained.

Further, in the method of manufacturing an electronic circuit board according to the present invention, a B-stage prepreg and a protective sheet having a melting point equal to or slightly higher than that of the prepreg are provided on both surfaces of the prepreg, and the prepreg is temporarily formed at an arbitrary thickness. A step of forming a work material by crimping, a step of heating metal pins planted at a predetermined pitch in the through-hole forming upper die to the melting point of the protective sheet, and a step of heating the work material immediately before the prepreg melting point. Heating to a temperature, pressing the upper metal pin for through-hole formation heated to the melting point of the protective sheet to penetrate a work material that comes into contact with the metal pin, and Cooling the metal pin and the workpiece in contact with the metal pin after penetrating the workpiece, and cooling the workpiece after the metal pin and the workpiece in contact with the metal pin are cooled. Forming a through-hole in the work material by withdrawing a metal pin from the work material, masking an unnecessary through-hole for each product among the through-holes formed in the work material, and removing the through-hole formed in the work material. A step of filling the conductive paste only in through holes required for each product not masked in the inside and curing the conductive paste only, and peeling off the protective sheet temporarily bonded to the work material after the conductive paste is cured And a step of arranging a metal foil on both surfaces of the prepreg from which the protective sheet has been peeled off and heat-pressing, so that a work material of any thickness from ultra-thin to extra-thick is obtained. At the same time, an extremely large number of through-holes and interlayer conductive portions required for each product can be formed by simple means, the time required for forming the through-holes and interlayer conductive portions required for each product can be greatly reduced, and a low-cost electronic circuit can be formed. With use substrate is obtained, the prepreg during the process is covered by a protective sheet, thereby making it possible to improve the efficiency of the production line becomes easy operator handling.

Further, in the method for manufacturing an electronic circuit board according to the present invention, a step of heating metal pins planted at a predetermined pitch in a through-hole forming upper die to a melting point of the prepreg, Heating to a temperature just before the melting point of the prepreg, pressing the metal pin of the through-hole forming upper die heated to the melting point of the prepreg, and penetrating the prepreg in contact with the metal pin; and Cooling the metal pin and the prepreg in contact with the metal pin after penetrating the prepreg; and extracting the metal pin from the prepreg after the metal pin and the prepreg in contact with the metal pin are cooled. Forming a through hole in the prepreg, masking an unnecessary through hole for each product among the through holes formed in the prepreg, and forming the through hole in the prepreg. A step of filling the conductive paste only hole required for each product that is not masked within the hole,
Conduction is performed by using a conductive paste curing device that also includes a conduction test pin and an upper plate in which conduction pins are implanted in accordance with the positions of through holes required for each product filled with the conductive paste and a flat underplate. It is characterized by comprising a step of curing only the conductive paste and conducting an electric current test and a step of arranging metal foils on both surfaces of the prepreg after the conductive paste is cured and heat-pressing, A large number of holes and interlayer conductive parts required for each product can be formed and inspected simultaneously with simple means, and the time required to form the interlayer conductive parts required for each hole and product can be greatly reduced, resulting in low-cost electronic components. A circuit board is obtained.

Further, in the method of manufacturing an electronic circuit board according to the present invention, a plurality of B-stage prepregs are temporarily pressure-bonded to an arbitrary thickness to form a prepreg sheet; Heating the metal pins planted at the pitch to the melting point of the prepreg, heating the prepreg sheet to a temperature immediately before the melting point, and forming the through-hole forming die heated to the melting point of the prepreg. Pressing the metal pins to penetrate the prepreg sheet in contact with the metal pins, and cooling the metal pins and the prepreg sheet in contact with the metal pins after the metal pins penetrate the prepreg sheet; After the metal pins and the prepreg sheet in contact with the metal pins are cooled, the metal pins are pulled out of the prepreg sheet. Forming a through hole in the prepreg sheet, masking an unnecessary through hole for each product in the through holes formed in the prepreg sheet, and forming a through hole in the prepreg sheet for each unmasked product in the through holes formed in the prepreg sheet. A step of filling only the necessary through holes with conductive paste, and an upper plate and a flat under plate in which energizing pins are implanted in accordance with the positions of the necessary through holes for each product filled with the conductive paste. A step of hardening only the conductive paste by energization and conducting an electrical inspection using a conductive paste curing device that also serves as a conductive test consisting of: and disposing metal foil on both surfaces of the prepreg sheet after the conductive paste is cured. Heat and pressure bonding process, so that a very large number of prepreg sheets can be It is possible to simultaneously form and inspect the necessary interlayer conductive parts for each hole and product by simple means, greatly reducing the time required for forming the through holes and the required interlayer conductive part for each product, and reducing the cost of electronic circuit boards. Is obtained.

Further, in the method of manufacturing an electronic circuit board according to the present invention, the prepreg of the B stage and the protective sheet having a melting point equal to or slightly higher than that of the prepreg are provided on both surfaces of the prepreg, and the prepreg is temporarily formed at an arbitrary thickness. Crimping to form a work material, heating the metal pins planted at a predetermined pitch in the through-hole forming upper die to the melting point of the protective sheet, and heating the work material to a temperature immediately before the prepreg melting point. A step of heating, and a step of pressing a metal pin of the upper die for through-hole heated to the melting point of the protective sheet to penetrate a work material that comes into contact with the metal pin, and the metal pin cuts the work material. Cooling the metal pin and the work material in contact with the metal pin after penetrating; and cooling the metal material from the work material after the metal pin and the work material in contact with the metal pin are cooled. A step of extracting a pin to form a through-hole in the work material, a step of masking an unnecessary through-hole for each product in the through-hole formed in the work material, and a step of masking in the through-hole formed in the work material Filling the conductive paste only into the through-holes required for each product that is not performed, and an upper plate and a flat plate in which current-carrying pins are implanted in accordance with the positions of the through-holes required for each product filled with the conductive paste. A step of hardening only the conductive paste by energization using an energization inspection combined conductive paste curing device consisting of an underplate and an energization inspection, and temporarily pressing the work piece after the conductive paste is cured. Separating the protective sheet, and arranging metal foil on both sides of the prepreg from which the protective sheet has been peeled off and heat-pressing it. An extremely large number of through-holes and interlayer conductive parts required for each product can be simultaneously formed and inspected by simple means for a work material of any thickness from ultra-thin to extremely thick. The time required for forming the interlayer conductive part is greatly reduced, and a low-cost electronic circuit board is obtained. In addition, the prepreg in the process is covered with a protective sheet, which makes it easier for operators to handle and manufacture. Line efficiency can be improved.

[Brief description of the drawings]

FIG. 1 is a schematic diagram illustrating the steps of a method for manufacturing an electronic circuit board according to the present invention.

FIG. 2 is a schematic explanatory view of a through hole forming die.

FIG. 3 is a schematic explanatory view of an upper die and a lower front die of a through hole forming die.

FIG. 4 is a schematic explanatory view of an upper die and a lower rear die of a through hole forming die.

FIG. 5 is an explanatory diagram of a state in which a work board is located on an upper surface of a lower front die.

FIG. 6 is an explanatory diagram of a state where a group of metal pins penetrates a work board.

FIG. 7 is an explanatory diagram of a state where a group of metal pins is detached from a work board.

[Explanation of symbols]

 P Pre-preg sheet S Protective sheet WB Work board H Through hole M Masking sheet R Moisture absorbing filter paper 1 Heat roller 2 Through hole forming die 20 Upper die 21 Die holder 22 Heater 23 Punch pad 24 Punch holder 25 Metal pin 26 Stripper plate 27 Cleaner sheet Reference Signs List 30 lower front mold 31 die plate 32 heater 33 ultrasonic vibration unit 34 silicon rubber plate 40 lower front mold 41 die plate 42 sponge sheet 43 suction pipe 44 cover 45 suction port

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI theme coat ゛ (Reference) H05K 3/46 H05K 3/46 NY X F term (Reference) 3C060 AA11 CF01 CF11 5E317 AA24 BB01 BB11 CC25 CD21 CD27 CD29 CD32 GG16 5E346 AA02 AA04 AA12 AA15 AA29 AA32 AA42 AA43 CC04 CC05 CC32 DD13 EE02 EE09 EE13 EE14 FF01 FF02 FF07 FF18 FF27 GG01 GG14 GG15 GG19 GG28 HH11 HH33

Claims (12)

[Claims] 1. A step of heating a metal pin implanted at a predetermined pitch in an upper die for forming a through hole to a melting point of a prepreg; a step of heating the prepreg to a temperature immediately before the melting point; A step of pressing a metal pin of the upper mold for through-hole formation heated to the melting point through the prepreg in contact with the metal pin by pressing against the prepreg, and the metal pin after the metal pin passes through the prepreg; Cooling the prepreg in contact with the metal pin, and forming a through-hole in the prepreg by withdrawing the metal pin from the prepreg after the metal pin and the prepreg in contact with the metal pin are cooled, A step of filling a conductive paste into the through holes formed in the prepreg and curing only the conductive paste; and a step of curing the conductive paste after curing the conductive paste. A process of arranging metal foil on both sides of the leg and heat-pressing the same. 2. a step of temporarily bonding a plurality of B-stage prepregs to an arbitrary thickness to form a prepreg sheet;
Heating a metal pin implanted at a predetermined pitch in the through-hole forming upper die to the melting point of the prepreg; heating the prepreg sheet to a temperature immediately before the melting point; and heating the prepreg to the melting point of the prepreg. Pressing the upper metal pin for forming a through hole into the prepreg sheet by pressing against the prepreg sheet, and the metal pin and the metal after the metal pin passes through the prepreg sheet. Cooling the prepreg sheet in contact with the pin, and drawing out the metal pin from the prepreg sheet after the metal pin and the prepreg sheet in contact with the metal pin are cooled to form a hole in the prepreg sheet. Filling a through-hole formed in the prepreg sheet with a conductive paste and curing only the conductive paste. Characterized by comprising a step of on both sides of the prepreg sheet is disposed a metal foil thermocompression bonding after the conductive paste is cured, method of manufacturing a substrate for an electronic circuit. 3. A process of forming a work material by arranging a prepreg of a B stage and a protective sheet having a melting point equal to or slightly higher than that of the prepreg on both surfaces of the prepreg and temporarily press-bonding the prepreg at an arbitrary thickness. A step of heating metal pins planted at a predetermined pitch in the hole forming upper die to the melting point of the protective sheet, a step of heating the work material to a temperature immediately before the melting point of the prepreg, and a step of melting the protective sheet. Pressing the upper metal pin for forming a through-hole heated to a point to the workpiece material to penetrate the workpiece material in contact with the metal pin, and the metal pin after the metal pin has penetrated the workpiece material. And cooling the work material in contact with the metal pin, and extracting the metal pin from the work material after the metal pin and the work material in contact with the metal pin are cooled. Forming a through hole in the work material, filling the through hole formed in the work material with a conductive paste and curing only the conductive paste, and temporarily pressing the work material after the conductive paste is cured. A method for manufacturing an electronic circuit substrate, comprising: a step of removing a protective sheet, and a step of arranging metal foils on both surfaces of a prepreg from which the protective sheet has been removed and heat-pressing. 4. A step of heating metal pins planted at a predetermined pitch in the through-hole forming upper die to a melting point of the prepreg; a step of heating the prepreg to a temperature immediately before the melting point; Pressing the metal pin of the upper die for through-hole formation heated to the melting point to penetrate the prepreg in contact with the metal pin, and the metal pin and the metal pin after the metal pin has passed through the prepreg; A step of cooling the prepreg in contact, a step of drawing out a metal pin from the prepreg after the metal pin and the prepreg in contact with the metal pin are cooled, and forming a through-hole in the prepreg; Masking unnecessary through holes for each product in the through holes;
A step of filling the conductive paste only in the through holes required for each product not masked in the through holes formed in the prepreg and curing only the conductive paste, and on both surfaces of the prepreg after the conductive paste is cured. A method for manufacturing an electronic circuit board, comprising: arranging a metal foil and heat-pressing. 5. A step of temporarily bonding a plurality of B-stage prepregs to an arbitrary thickness to form a prepreg sheet;
Heating a metal pin implanted at a predetermined pitch in the through-hole forming upper die to the melting point of the prepreg; heating the prepreg sheet to a temperature immediately before the melting point; and heating the prepreg to the melting point of the prepreg. Pressing the metal pin of the upper die for forming a through-hole to penetrate the prepreg sheet contacting the metal pin, and contacting the metal pin and the metal pin after the metal pin penetrates the prepreg sheet. The step of cooling the prepreg sheet, and the step of withdrawing the metal pins from the prepreg sheet after the metal pins and the prepreg sheet in contact with the metal pins are cooled to form through holes in the prepreg sheet,
A step of masking unnecessary through-holes for each product among the through-holes formed in the prepreg sheet, and applying a conductive paste only to the through-holes required for each unmasked product among the through-holes formed in the prepreg sheet. A step of filling and curing only the conductive paste, and a step of arranging a metal foil on both surfaces of a prepreg sheet after the conductive paste is cured and heat-pressing, wherein Production method. 6. A process of forming a work material by arranging a prepreg of a B stage and a protective sheet having a melting point equal to or slightly higher than that of the prepreg on both surfaces of the prepreg and temporarily compressing the prepreg to an arbitrary thickness. Heating the metal pins planted at a predetermined pitch in the upper hole forming die to the melting point of the protective sheet; heating the work material to a temperature immediately before the prepreg melting point; Pressing the upper metal pin for through-hole formation heated to until the metal material comes into contact with the metal pin, and the metal pin and the metal pin after the metal pin has penetrated the workpiece material. A step of cooling the contacting work material;
A step of extracting the metal pin from the work material after the metal pin and the work material in contact with the metal pin are cooled to form a through hole in the work material; and a product in the through hole formed in the work material. A step of masking unnecessary through holes for each, and a step of filling only conductive holes necessary for each unmasked product among the through holes formed in the work material with a conductive paste and curing only the conductive paste. A step of peeling off the protective sheet temporarily pressed to the work material after the conductive paste is cured, and a step of arranging metal foils on both surfaces of the prepreg from which the protective sheet has been peeled off and heat-pressing. A method for manufacturing an electronic circuit board, which is characterized by the following. 7. A step of heating metal pins planted at a predetermined pitch in the through-hole forming upper die to a melting point of the prepreg; a step of heating the prepreg to a temperature immediately before the melting point; Pressing the metal pin of the upper die for through-hole formation heated to the melting point to penetrate the prepreg in contact with the metal pin, and the metal pin and the metal pin after the metal pin has passed through the prepreg; A step of cooling the prepreg in contact, a step of drawing out a metal pin from the prepreg after the metal pin and the prepreg in contact with the metal pin are cooled, and forming a through-hole in the prepreg; Masking unnecessary through holes for each product in the through holes;
A step of filling the conductive paste only in the through holes required for each product that is not masked in the through holes formed in the prepreg, and in accordance with the position of the through hole required for each product filled with the conductive paste. A step of curing only the conductive paste by conducting current and conducting a current test using a conductive paste curing device combined with a conduction test comprising an upper plate having a conduction pin implanted therein and a flat underplate; and After the hardening of the prepreg, arranging a metal foil on both surfaces of the prepreg and heat-pressing it. 8. A step of temporarily bonding a plurality of B-stage prepregs to an arbitrary thickness to form a prepreg sheet;
Heating a metal pin implanted at a predetermined pitch in the through-hole forming upper die to the melting point of the prepreg; heating the prepreg sheet to a temperature immediately before the melting point; and heating the prepreg to the melting point of the prepreg. Pressing the metal pin of the upper die for forming a through-hole to penetrate the prepreg sheet contacting the metal pin, and contacting the metal pin and the metal pin after the metal pin penetrates the prepreg sheet. The step of cooling the prepreg sheet, and the step of withdrawing the metal pins from the prepreg sheet after the metal pins and the prepreg sheet in contact with the metal pins are cooled to form through holes in the prepreg sheet,
A step of masking unnecessary through-holes for each product among the through-holes formed in the prepreg sheet, and applying a conductive paste only to the through-holes required for each unmasked product among the through-holes formed in the prepreg sheet. Filling step and curing of the conductive paste also serving as a conduction test, comprising an upper plate having a conduction pin planted in accordance with the position of a through hole required for each product filled with the conductive paste and a flat underplate. It is characterized by comprising a step of curing only the conductive paste by energization using an apparatus and conducting an electric current test, and a step of arranging metal foils on both surfaces of the prepreg sheet after the conductive paste is cured and heat-pressing. A method for manufacturing an electronic circuit substrate. 9. A step of forming a work material by arranging a prepreg of a B stage and a protective sheet having a melting point equal to or slightly higher than that of the prepreg on both surfaces of the prepreg and temporarily compressing the prepreg to an arbitrary thickness to form a work material; Heating the metal pins implanted in the upper mold at a predetermined pitch to the melting point of the protective sheet, heating the work material to a temperature immediately before the prepreg melting point, and heating to the melting point of the protective sheet Pressing a metal pin of the upper die for forming a through hole to penetrate a work material that comes into contact with the metal pin, and contacting the metal pin and the metal pin after the metal pin has penetrated the work material. Cooling the work material, and drawing the metal pin from the work material after the metal pin and the work material in contact with the metal pin are cooled, and forming a through hole in the work material. Masking unnecessary through-holes for each product among the through-holes formed in the work material; and conductive paste only for the through-holes required for each unmasked product among the through-holes formed in the work material. Filling step,
Conduction is performed by using a conductive paste curing device that also includes a conduction test pin and an upper plate in which conduction pins are implanted in accordance with the positions of through holes required for each product filled with the conductive paste and a flat underplate. Curing the conductive paste alone and conducting an electrical test, and peeling off the protective sheet temporarily bonded to the work material after the conductive paste is cured, and on both surfaces of the prepreg from which the protective sheet has been peeled off. A method for manufacturing an electronic circuit board, comprising: arranging a metal foil and heat-pressing. 10. An upper die for forming a through-hole or forming a through-hole when a prepreg, a prepreg sheet or a work material in contact with the metal pin is melted and penetrated by pressing a metal pin of the upper die for forming a through-hole. The method for manufacturing an electronic circuit board according to any one of claims 1 to 9, wherein the lower mold or both of them are slightly vibrated. 11. When a prepreg, a prepreg sheet or a work material that comes into contact with a metal pin is pressed into contact with a metal pin of an upper die for forming a through hole while being melted, the prepreg, the prepreg sheet and the work material are passed through in the XY-axis directions in plan view. It is characterized in that the upper die for forming a through hole or the lower die for forming a through hole moves a distance of half the installation pitch of the metal pins planted at a predetermined pitch in the upper die for forming a hole, and the process is repeated. The method of manufacturing an electronic circuit board according to claim 1. 12. The method according to claim 1, wherein the tip of the metal pin implanted at a predetermined pitch in the upper hole forming die has a cone shape such as a cone or a pyramid. A method for manufacturing the electronic circuit board according to any one of the above.