JP2018165632A - Sensor, electronic apparatus, and movable body - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a sensor that can stabilize detection sensitivity, and to provide an electronic apparatus and a movable body including such a sensor.SOLUTION: A sensor comprises: a basal part; a pair of detection arms that extend from the basal part in opposite directions to each other; a pair of coupling arms that extend from the basal part in directions intersecting with the extension directions of the detection arms and opposite directions to each other; a pair of drive arms that extend respectively from the pair of coupling arms in directions intersecting with the extension directions of the coupling arms and opposite directions to each other; a base; and a supporting member that is connected to a plurality of connection parts provided on the basal part and supports the basal part with respect to the base. When the length of the basal part along the extension directions of the coupling arms is Bx, and the total length of the plurality of connection parts along the extension directions of the coupling arms is B1, the relationship B1/Bx≤0.43 is satisfied.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a sensor, an electronic device, and a moving object.

  As a sensor, for example, a gyro sensor as described in Patent Document 1 is known. The gyro sensor described in Patent Document 1 includes a base, a pair of detection arms that extend linearly from the base to both sides, and a pair of connections that extend from the base to both sides in a direction perpendicular to the detection arms. An arm, and a pair of drive arms extending from the front end of each connecting arm to both sides orthogonal to the arm. Further, in this gyro sensor, the base is supported by a lead plate fixed to a support substrate disposed at the bottom of the container.

JP 2006-201118 A

  However, in the gyro sensor described in Patent Document 1, since the distance between the connection portion between the base lead and the detection arm is short, the base is easily affected by a force such as stress from the lead plate. For this reason, in the gyro sensor described in Patent Document 1, when the state of force such as stress applied from the lead plate to the base changes due to a temperature change or the like, the detection frequency fluctuates due to the change, and detuning occurs accordingly. The frequency (difference between the drive frequency and the detection frequency) also fluctuates, and as a result, there is a problem that the detection sensitivity changes. Such a problem becomes conspicuous particularly when the gyro sensor is downsized because the distance between the connection portion of the base lead and the detection arm is shortened.

  The objective of this invention is providing the sensor which can aim at stabilization of detection sensitivity, and providing an electronic device and a moving body provided with this sensor.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

The sensor of this application example has a base,
A pair of detection arms extending in opposite directions from the base;
A pair of connecting arms extending from the base in the opposite direction so as to cross the extending direction of the detection arm;
A pair of drive arms extending from each of the pair of connecting arms in opposite directions across the extending direction of the connecting arms;
A plurality of connecting portions disposed on the base;
Base and
A support member connected to the plurality of connection portions and supporting the base portion with respect to the base,
When the length of the base portion along the extending direction of the connecting arm is Bx, and the total length of the plurality of connecting portions along the extending direction of the connecting arm is B1,
The relationship of B1 / Bx ≦ 0.43 is satisfied.

  According to such a sensor, since the lengths Bx and B1 satisfy the relationship described above, the distance between the connection portion and the detection arm is increased. Therefore, in the detection mode in which the detection arm vibrates in conjunction with the connecting arm, the vibration frequency (detection frequency) of the detection arm is reduced from being affected by the change in the support state (restraint state) of the base by the support member. As a result, it is possible to stabilize the detection sensitivity.

In the sensor of this application example, it is preferable that the relationship of 0.25 ≦ B1 / Bx ≦ 0.43 is satisfied.
As a result, it is possible to stabilize the detection sensitivity while reducing the size of the sensor.

In the sensor of this application example, the length of the base portion along the extending direction of the detection arm is By, and the total length of the plurality of connection portions along the extending direction of the detection arm is B2. When
It is preferable that the relationship of B2 / By ≧ 0.5 is satisfied.
Thereby, the detection sensitivity can be made excellent.

In the sensor of this application example, it is preferable that the plurality of connection portions are arranged in a matrix.
Thereby, a connection part can be arrange | positioned efficiently, aiming at size reduction of a sensor.

In the sensor of this application example, the plurality of connection portions are arranged in a matrix with a predetermined interval in the extending direction of the connecting arm and a predetermined interval in a direction intersecting the extending direction of the connecting arm. It is preferable.
Thereby, a connection part can be arrange | positioned efficiently, aiming at size reduction of a sensor.

  In the sensor of this application example, it is preferable that the support member includes a plurality of wires connected to the plurality of connection portions.

  Thereby, a supporting member can be comprised using a flexible wiring board, and TAB (Tape Automated Bonding) mounting can be performed. In such TAB mounting, in general, the influence of the support member being distorted due to a temperature change or the like is likely to affect the base. Therefore, when such a support member is used, satisfying the relationship between B1 and Bx as described above is particularly useful for stabilizing detection sensitivity.

In the sensor according to this application example, the driving arm includes a driving arm portion extending from the coupling arm, and a driving weight portion that is provided on a distal end side with respect to the driving arm portion and is wider than the driving arm portion. And having
When the length of the driving weight portion along the extending direction of the driving arm is DHL and the width of the driving weight portion along the direction orthogonal to the extending direction of the driving arm in plan view is DHW,
It is preferable that the relationship of 1.5 ≦ DHL / DHW is satisfied.
Thereby, detection sensitivity can be raised.

  In the sensor of this application example, it is preferable that the relationship of 1.5 ≦ DHL / DHW ≦ 4.0 is satisfied.

  Thereby, it is possible to increase the detection sensitivity while reducing the power consumption by reducing the CI (crystal impedance) value.

In the sensor of this application example, when the length of the drive arm portion along the extending direction of the drive arm is DAL,
It is preferable that the relationship of 1.5 <DHL / DAL is satisfied.
Thereby, detection sensitivity can be raised.

In the sensor of this application example, when the width in the direction orthogonal to the extending direction of the driving arm portion in plan view is DAW,
It is preferable that the relationship of 1.2 ≦ DHW / DAW is satisfied.
As a result, the detection sensitivity can be increased while downsizing.

In the sensor of this application example, the detection arm includes a detection arm portion extending from the base portion, a detection weight portion that is provided on a distal end side with respect to the detection arm portion, and is wider than the detection arm portion. Have
The length of the drive arm along the extension direction of the drive arm is DAL, the length of the detection arm along the extension direction of the detection arm is PAL, and the detection arm extends in the extension direction. When the length of the detection weight portion along the line is PHL,
It is preferable that the relationship of DHL / DAL> PHL / PAL is satisfied.
Thereby, detection sensitivity can be raised.

The electronic device of this application example includes the sensor of this application example.
According to such an electronic device, since the detection sensitivity of the sensor is stable, the characteristics (for example, reliability) of the electronic device can be improved.

The moving body of this application example includes the sensor of this application example.
According to such a moving body, since the detection sensitivity of the sensor is stable, the characteristics (for example, reliability) of the moving body can be improved.

It is a top view which shows schematic structure of the sensor which concerns on embodiment of this invention. It is the sectional view on the AA line in FIG. It is a top view of the vibration element piece with which the sensor shown in FIG. 1 is provided. It is a top view (back view) of the supporting member with which the sensor shown in FIG. 1 is provided. It is a graph which shows the relationship between ratio B1 / Bx of length Bx of a base part, and length B1 of the whole connection part, and a detection frequency fluctuation ratio. It is a graph which shows the relationship between ratio B2 / By of base length By and length B2 of the whole connection part, and a sensitivity ratio. It is a graph which shows the relationship between ratio B2 / By of base length By and length B2 of the whole connection part, and a detection frequency fluctuation ratio. It is a graph which shows the relationship between ratio DHL / DHW of the length DHL and width | variety DHW of a drive weight part, and a sensitivity ratio. It is a graph which shows the relationship between length DHL / width DHW ratio DHL / DHW of a drive weight part, and CI value. It is a graph which shows the relationship between ratio DHL / DAL of the length DHL of a drive weight part, and length DAL of a drive arm part, and a sensitivity ratio. It is a graph which shows the relationship between the ratio DHL / DAL of the length DHL of a drive weight part, and the length DAL of a drive arm part, and CI value. 1 is a perspective view illustrating a configuration of a mobile (or notebook) personal computer that is an example of an electronic apparatus of the present invention. It is a perspective view which shows the structure of the smart phone which is an example of the electronic device of this invention. 1 is a perspective view illustrating a configuration of a digital still camera that is an example of an electronic apparatus of the present invention. It is a perspective view which shows an example of the mobile body (automobile) of this invention.

  Hereinafter, a sensor, an electronic device, and a moving object of the present invention will be described in detail based on embodiments shown in the accompanying drawings.

1. Sensor FIG. 1 is a plan view showing a schematic configuration of a sensor according to an embodiment of the present invention. 2 is a cross-sectional view taken along line AA in FIG. FIG. 3 is a plan view of a vibrating element piece included in the sensor shown in FIG. FIG. 4 is a plan view (back view) of a support member provided in the sensor shown in FIG.

  In the following description, for convenience of explanation, the three axes that are orthogonal to each other, the x axis, the y axis, and the z axis, are used as appropriate. Hereinafter, a direction parallel to the x-axis is referred to as an “x-axis direction”, a direction parallel to the y-axis is referred to as a “y-axis direction”, and a direction parallel to the z-axis is referred to as a “z-axis direction”. In the following, in the figure, the tip side of an arrow indicating each of the x-axis, y-axis, and z-axis is “+”, and the base end side is “−”. Further, the upper side (+ z-axis direction side) in FIG. 2 is referred to as “upper”, and the lower side (−z-axis direction side) is referred to as “lower”. In FIG. 1, the lid 92 described later is omitted for convenience of explanation.

  A sensor 1 shown in FIGS. 1 and 2 is a vibration gyro sensor that detects an angular velocity around the z-axis. This sensor 1 includes a vibration element 2 (sensor element) including a vibration element piece 20 (sensor element piece) and a support member 4, an IC chip 3 (integrated circuit chip), and a package 9 for housing them. ing.

Hereinafter, each part which comprises the sensor 1 is demonstrated sequentially.
(Vibration element)
The vibration element 2 is an “out-of-plane detection type” sensor element that detects an angular velocity around the z-axis. As shown in FIGS. 1 and 2, the vibration element 2 includes a vibration element piece 20 and a support member 4 that supports the vibration element piece 20.

  As shown in FIG. 3, the vibration element piece 20 has a so-called double T-type structure. More specifically, the vibration element piece 20 includes a base 21, a pair of detection arms 23 and 24 (first and second detection arms) extending from the base 21, and a pair of connection arms 221 and 222 (first 1, a second connecting arm), a pair of driving arms 25 and 26 (first driving arm) extending from the connecting arm 221, and a pair of driving arms 27 and 28 (second driving) extending from the connecting arm 222. Drive arm).

  Here, the detection arms 23 and 24 extend from the base 21 to opposite sides along the y-axis direction. The drive arms 25 and 26 extend from the distal end portion of the connecting arm 221 to opposite sides along the y-axis direction. Similarly, the drive arms 27 and 28 extend in the opposite directions along the y-axis direction from the distal end portion of the connecting arm 222.

  The detection arm 23 includes an arm portion 231 (detection arm portion) extending from the base portion 21 and a weight portion 232 (detection weight) that is provided on the distal end side with respect to the arm portion 231 and is wider than the arm portion 231. Part). Similarly, the detection arm 24 includes an arm part 241 (detection arm part) and a weight part 242 (detection weight part). The driving arm 25 includes an arm portion 251 (driving arm portion) extending from the connecting arm 221 and a weight portion 252 (driving) which is provided on the distal end side with respect to the arm portion 251 and is wider than the arm portion 251. A weight portion). Similarly, the drive arm 26 includes an arm part 261 (drive arm part) and a weight part 262 (drive weight part). The drive arm 27 includes an arm portion 271 (drive arm portion) extending from the connecting arm 222 and a weight portion 272 (drive) which is provided on the distal end side with respect to the arm portion 271 and has a width wider than the arm portion 271. A weight portion). Similarly, the drive arm 28 has an arm portion 281 (drive arm portion) and a weight portion 282 (drive weight portion). A groove or a hole along the extending direction may be formed on the upper surface and the lower surface of each arm.

  Here, as will be described later, the base portion 21 is provided with a plurality of terminals 67 (connection portions), and the plurality of terminals 67 are joined (connected) to the support member 4. The plurality of terminals 67 are arranged in a matrix with a predetermined interval in the extending direction of the connecting arms 221 and 222 and a predetermined interval in a direction intersecting the extending direction of the connecting arms 221 and 222. Thereby, the several terminal 67 can be efficiently arrange | positioned, aiming at size reduction of the sensor 1. FIG. The base 21 has a length Bx along the extending direction (x-axis direction) of the connecting arms 221 and 222, and a plurality of the base 21 along the extending direction (x-axis direction) of the connecting arms 221 and 222. When the total length of the terminal 67 is B1, the relationship of B1 / Bx ≦ 0.43 is satisfied. Thereby, the detection sensitivity can be stabilized. This point will be described later together with matters related to this point.

  Moreover, it is preferable that the detection arms 23 and 24 and the drive arms 25 to 28 are optimized so that the length and width of each part will be described later.

  In the present embodiment, the vibration element piece 20 is made of a piezoelectric material. Examples of the piezoelectric material include crystal, lithium tantalate, lithium niobate, lithium borate, and barium titanate. In particular, the piezoelectric material constituting the vibration element piece 20 is preferably quartz (Z cut plate). When the vibration element piece 20 is made of quartz, the vibration characteristics (particularly frequency temperature characteristics) of the vibration element piece 20 can be made excellent. Further, the vibration element piece 20 can be formed with high dimensional accuracy by etching.

  Although not shown, each of the drive arms 25, 26, 27, and 28 of the vibration element piece 20 configured in this way is a pair that causes the drive arms 25, 26, 27, and 28 to bend and vibrate in the x-axis direction when energized. Drive electrodes (drive signal electrode and drive ground electrode) are provided.

  Further, although not shown in the drawings, the detection arms 23 and 24 of the vibration element piece 20 each have a pair of detection electrodes (detection signals) for detecting charges generated by bending vibration of the detection arms 23 and 24 in the x-axis direction. Electrode and detection ground electrode).

  In addition, the base 21 is provided with a plurality of terminals 67. The plurality of terminals 67 are electrically connected to the detection electrodes provided on the detection arms 23 and 24 and the drive electrodes provided on the drive arms 25 to 28 through a wiring (not shown).

  The constituent materials of the drive electrode, the detection electrode, and the terminal 67 are not particularly limited. For example, gold (Au), gold alloy, platinum (Pt), aluminum (Al), aluminum alloy, silver (Ag) ), Silver alloy, chromium (Cr), chromium alloy, copper (Cu), molybdenum (Mo), niobium (Nb), tungsten (W), iron (Fe), titanium (Ti), cobalt (Co), zinc ( A metal material such as Zn) or zirconium (Zr) or a transparent electrode material such as ITO or ZnO can be used. Among them, it is preferable to use a metal (gold, gold alloy) containing gold as a main material or platinum.

  In addition, even if a layer such as Ti or Cr is provided between the drive electrode and the vibration element piece 20 as a base layer having a function of preventing the drive electrode and the like from peeling from the vibration element piece 20. Good. Further, these drive electrodes and the like can be collectively formed by the same film forming process.

  Such a vibration element piece 20 is supported by the package 9 via a support member 4 for mounting TAB (Tape Automated Bonding) at the base 21.

  As illustrated in FIG. 2, the support member 4 includes an insulating film 41 and a plurality of wirings 42 a to 42 f that are joined to one surface (the lower side in FIG. 2) of the film 41.

  The film 41 has a function of supporting these while preventing a short circuit between the wirings 42a to 42f. The constituent material of the film 41 may be any material having insulating properties, but it is preferable to use a resin material such as polyimide. Thereby, the film 41 can be made insulative, and conductor patterns such as the wirings 42 a to 42 f can be formed on the film 41. Further, the support member 4 can be realized relatively easily and inexpensively using the flexible wiring board.

  As shown in FIG. 4, a device hole 411 is formed at the center of the film 41, and the wirings 42 a to 42 f extend from the film 41 toward the device hole 411, and the extended portion is the film 41. It is bent to the side (upper side).

  The plurality of wirings 42a to 42f are provided corresponding to the plurality of terminals 67 (see FIG. 3) provided in the vibration element piece 20 described above, and the leading ends of the wirings 42a to 42f are made of metal bumps or the like (not shown). It is connected and fixed to a corresponding terminal 67 through a bonding material. Accordingly, the drive electrode and the detection electrode are electrically connected to the terminal 67 and the vibration element piece 20 is supported by the support member 4. In addition, connection terminals 421a to 421f are provided at the base ends of the wirings 42a to 42f, respectively.

  The vibration element 2 configured as described above detects the angular velocity ω around the z-axis as follows.

  First, by applying a voltage (drive signal) between a pair of drive electrodes, bending vibration (drive) so that the drive arm 25 and the drive arm 27 approach and separate from each other in the direction indicated by arrow a in FIG. The driving arm 26 and the driving arm 28 are caused to vibrate (drive vibration) so as to approach and separate from each other in the same direction as the bending vibration. The frequency of this drive vibration is called “drive frequency”, and the drive frequency is a frequency corresponding to the resonance frequency of the drive arms 25 to 28.

  At this time, if the angular velocity is not applied to the vibration element 2, the drive arms 25 and 26 and the drive arms 27 and 28 perform plane-symmetric vibration with respect to the yz plane passing through the center point (center of gravity G). The base 21, the connecting arms 221, 222, and the detecting arms 23, 24 hardly vibrate.

  When the angular velocity ω around the normal line passing through the center of gravity (that is, around the z axis) is applied to the vibration element 2 in a state where the drive arms 25 to 28 are driven and vibrated in this way (drive mode), the drive arms 25 to 28 are applied. Each has Coriolis power. As a result, the connecting arms 221 and 222 bend and vibrate in the direction indicated by the arrow b in the figure, and accordingly, the bending vibrations (in the direction indicated by the arrow c in the figure of the detection arms 23 and 24) so as to cancel the bending vibration ( Detection vibration) is excited. The frequency of this detection vibration is called “detection frequency”, and the detection frequency is a frequency corresponding to the resonance frequency of the detection arms 23 and 24. The difference between the drive frequency and the detection frequency is referred to as “detuning frequency”.

  Such detection vibration (detection mode) of the detection arm 23 generates a charge between the pair of detection electrodes. Based on such charges, the angular velocity ω applied to the vibration element 2 can be obtained.

(IC chip 3)
The IC chip 3 shown in FIGS. 1 and 2 is an electronic component having a function of driving the vibration element 2 described above and a function of detecting an output (sensor output) from the vibration element 2. Although not shown, the IC chip 3 includes a drive circuit that drives the vibration element 2 and a detection circuit that detects an output (charge) from the vibration element 2. The IC chip 3 is provided with a plurality of connection terminals (not shown). The plurality of connection terminals include one connection terminal that outputs a driving signal for driving the vibration element 2 and the vibration element 2. And two connection terminals to which the detection signal is input.

(package)
The package 9 shown in FIGS. 1 and 2 accommodates the vibration element 2 (the vibration element piece 20 and the support member 4) and the IC chip 3 (integrated circuit chip).

  The package 9 includes a base 91 having a recess opened on the upper surface, and a lid 92 (lid) joined to the base 91 via a joining member 93 (seal ring) so as to close the opening of the recess of the base 91. Have.

  The base 91 includes a flat substrate 911, a frame substrate 912 bonded to the upper surface of the substrate 911, a frame substrate 913 bonded to the upper surface of the substrate 912, and a frame bonded to the upper surface of the substrate 913. 914. Thereby, the base 91 is formed with a recess having a step between the substrates 911, 912, 913, and 914. The constituent material of the base 91 (respective constituent materials of the substrates 911 to 914) is not particularly limited, and for example, various ceramics such as aluminum oxide can be used.

  The IC chip 3 is supported on the upper surface of the substrate 911 of the base 91 via a fixing member 82 such as an adhesive configured to include epoxy resin, acrylic resin, or the like so as to fit in the openings of the substrates 912 and 913.・ It is fixed.

  A plurality of internal terminals 72 are provided on the upper surface of the substrate 912. A plurality of internal terminals 71 are provided on the upper surface of the substrate 913.

  The plurality of internal terminals 71 are electrically connected to corresponding internal terminals 72 through wiring (not shown) provided on the base 91. The connection terminals 421 a to 421 f of the support member 4 are joined to the plurality of internal terminals 71 via the fixing member 81. Accordingly, the vibration element piece 20 is supported on the base 91 via the support member 4. The fixing member 81 is made of, for example, solder, silver paste, a conductive adhesive (an adhesive in which a conductive filler such as metal particles is dispersed in a resin material), or the like. Thus, the plurality of internal terminals 71 are electrically connected to the connection terminals 421a to 214f of the support member 4 through the fixing member 81, respectively.

  The plurality of connection terminals 31 of the above-described IC chip 3 are electrically connected to the plurality of internal terminals 72 via, for example, wiring constituted by bonding wires.

  In addition, a plurality of external terminals 74 that are used when mounted on a device (external device) in which the sensor 1 is incorporated are provided on the lower surface (the side opposite to the vibration element 2) of the substrate 911 of the base 91. Each of the plurality of external terminals 74 is electrically connected to a corresponding internal terminal 72 via an internal wiring (not shown). Thereby, each external terminal 74 is electrically connected to the IC chip 3.

  Each of the internal terminals 71, 72, the external terminals 74, etc. is a metal film obtained by laminating a film of nickel (Ni), gold (Au) or the like on a metallized layer of tungsten (W), for example, by plating or the like. Consists of.

  A lid 92 is hermetically joined to such a base 91 via a joining member 93. Thereby, the inside of the package 9 is hermetically sealed. The lid 92 is made of, for example, the same material as the base 91 or a metal such as Kovar, 42 alloy, stainless steel, or the like. Moreover, the joining member 93 is comprised, for example with metals, such as Kovar, 42 alloy, and stainless steel.

  The base 91 and the lid 92 are joined using, for example, seam welding, energy beam welding such as laser.

  As described above, the sensor 1 includes the base 21, the pair of detection arms 23 and 24 extending from the base 21 in opposite directions (± y-axis directions), and the extension of the detection arms 23 and 24 from the base 21. A pair of connecting arms 221 and 222 that intersect the outgoing direction (y-axis direction) and extend in opposite directions (± x-axis direction), and a connecting arm 221 from each of the pair of connecting arms 221 and 222, A pair of drive arms 25, 26 and a pair of drive arms 27, 28 extending in opposite directions (± y-axis directions) across the extending direction (x-axis direction) of 222, a base 91, The support member 4 is connected (joined) to a plurality of terminals 67 (connection portions) provided on the base portion 21 and supports the base portion 21 with respect to the base 91 (see FIGS. 1 and 2). .

  In particular, the length (maximum length) of the base 21 along the extending direction (x-axis direction) of the connecting arms 221 and 222 is Bx, and the extending direction (x-axis direction) of the connecting arms 221 and 222 is set. When the total length (maximum length) of the plurality of terminals 67 (connection portions) is B1 (see FIG. 3), the relationship of B1 / Bx ≦ 0.43 is satisfied. Thereby, the distance between the terminal 67 and each detection arm 23 and 24 becomes large. Therefore, in the detection mode in which the detection arms 23 and 24 vibrate in conjunction with the connecting arms 221 and 222, the vibration frequency (detection frequency) of the detection arms 23 and 24 is the support state (restraint state) of the base 21 by the support member 4. It is possible to reduce the influence of changes, and as a result, it is possible to stabilize the detection sensitivity.

  Here, as described above, the support member 4 includes the wirings 42a to 42f that are a plurality of wires joined (connected) to the plurality of terminals 67 (connection portions) (see FIG. 4). Thereby, the supporting member 4 can be comprised using a flexible wiring board, and TAB (Tape Automated Bonding) mounting can be performed. In such TAB mounting, generally, the base 21 is easily affected by the distortion of the support member 4 due to a temperature change or the like. Therefore, when such a support member 4 is used, satisfying the relationship between B1 and Bx as described above is particularly useful for stabilizing the detection sensitivity.

  Further, in the present embodiment, the base 21 is a pair of first sides along the x-axis direction and a pair of along the y-axis direction in a plan view seen from the z-axis direction that is the thickness direction. And a rectangular shape having a second side. The length Bx is a distance between the pair of second sides. Further, a length By described later is a distance between a pair of first sides. In addition, the planar view shape of the base part 21 is not limited to a rectangle, For example, the shape etc. which chamfered the corner | angular part of the rectangle may be sufficient.

  Further, the length B1 is the length in the x-axis direction of the aggregate composed of a plurality of terminals 67 (connection portions), and is the terminal closest to the + x-axis direction among the plurality of terminals 67 (connection portions). 67 is a distance along the x-axis direction between the distal ends of 67 and the terminal 67 closest to the −x-axis direction. Further, the length B2 described later is the length in the y-axis direction of the assembly composed of the plurality of terminals 67 (connection portions), and is the most + y-axis direction side of the plurality of terminals 67 (connection portions). This is the distance along the y-axis direction between the distal ends of a certain terminal 67 and the terminal 67 closest to the −y-axis direction. In the figure, the six terminals 67 are regularly arranged. However, the number and arrangement of the plurality of terminals 67 are not limited to the number and arrangement shown in the figure. Further, when the vibration element 2 is energized using another wiring such as a bonding wire, the terminal 67 may not be energized.

  FIG. 5 is a graph showing the relationship between the ratio B1 / Bx of the base length Bx and the entire length B1 of the connecting portion and the detection frequency fluctuation ratio.

  As shown in FIG. 5, as B1 / Bx increases, the detection frequency fluctuation ratio that is the fluctuation ratio from the reference detection frequency increases. Here, when B1 / Bx is 0.43 or less, the detection frequency fluctuation ratio can be suppressed to about 40%. Note that at least one of B1 and Bx is different from each other in the plurality of points shown in FIG.

  Moreover, it is preferable that the relationship of 0.25 ≦ B1 / Bx ≦ 0.43 is satisfied. Thereby, it is possible to stabilize the detection sensitivity while reducing the size of the sensor 1.

  Further, the length of the base 21 along the extending direction (y-axis direction) of the detection arms 23 and 24 is By, and a plurality of terminals 67 (along the extending direction (y-axis direction) of the detection arms 23 and 24 ( When the entire length of the connection portion is B2 (see FIG. 3), it is preferable that the relationship of 0.5 ≦ B2 / By0.75 is satisfied. Thereby, the detection sensitivity can be made excellent.

  FIG. 6 is a graph showing the relationship between the ratio B2 / By of the base length By and the entire length B2 of the connecting portion, and the sensitivity ratio.

  As shown in FIG. 6, as B2 / By increases, the sensitivity ratio, which is the ratio to the reference sensitivity, increases (sensitivity improves). In other words, the smaller the B2 / By is, the smaller the sensitivity ratio, which is the ratio to the reference sensitivity (the sensitivity becomes worse). From such a viewpoint, it is not preferable to make B2 / By too small, and therefore B2 / By is preferably 0.5 or more. Thereby, the detection sensitivity can be made excellent. Note that the plurality of points shown in FIG. 6 are different from each other in at least one of B2 and By. In order to maintain high sensitivity, B2 / By is more preferably 0.65 or more.

  Although not shown, the smaller the B1 / Bx, the smaller the sensitivity ratio, which is the ratio to the reference sensitivity (the sensitivity becomes worse). However, the reduction ratio of the sensitivity ratio accompanying the decrease in B2 / By described above. In comparison, the rate of decrease in the sensitivity ratio accompanying the decrease in B1 / Bx is small (that is, there is little decrease in sensitivity).

  FIG. 7 is a graph showing the relationship between the ratio B2 / By of the base length By and the entire length B2 of the connecting portion and the detection frequency fluctuation ratio.

  As shown in FIG. 7, as B2 / By increases, the detection frequency fluctuation ratio that is the fluctuation ratio from the reference detection frequency increases. However, the increase rate of the detection frequency fluctuation ratio accompanying the increase of B2 / By is smaller than the increase ratio of the detection frequency fluctuation ratio accompanying the increase of B1 / Bx described above. Here, when B2 / By is 0.75 or less, an effect of reducing the detection frequency fluctuation ratio is recognized. Note that the plurality of points shown in FIG. 7 are different from each other in at least one of B2 and By.

  Further, B2 / By can be set to 0.5 or more and 0.75 or less. In this case, it is possible to stabilize the detection sensitivity while improving the detection sensitivity. Furthermore, B2 / By can be set to 0.7 or more and 0.75 or less. In this case, it is possible to stabilize the detection sensitivity while maintaining high detection sensitivity.

  Further, as described above, the drive arm 25 is provided on the distal end side with respect to the arm portion 251 that is a drive arm portion extending from the connecting arm 221 and the arm portion 251, and is wider than the arm portion 251. And a weight portion 252 which is a drive weight portion. Similarly, the drive arms 26, 27, and 28 have arm portions 261, 271, and 281 that are drive arm portions and weight portions 262, 272, and 282 that are drive weight portions. Here, each length (maximum length) of the weight portions 252, 262, 272, and 282 along the extending direction (y-axis direction) of the drive arms 25 to 28 is DHL, and the thickness direction of the base portion 21 ( The width (maximum length) of the weights 252, 262, 272, and 282 along the direction (x-axis direction) orthogonal to the extending direction (y-axis direction) of the drive arms 25 to 28 when viewed from the z-axis direction) ) Is DHW, it is preferable that the relationship of 1.5 ≦ DHL / DHW is satisfied. Thereby, detection sensitivity can be raised. In the figure, the weights 252, 262, 272, and 282 have a rectangular shape in plan view, but the shape in plan view is not limited to this, and for example, has a shape having portions with different widths. Also good.

  FIG. 8 is a graph showing the relationship between the ratio DHL / DHW of the length DHL and width DHW of the drive weight portion and the sensitivity ratio.

  As shown in FIG. 8, as DHL / DHW increases, the sensitivity ratio, which is the ratio to the reference sensitivity, increases. Here, when DHL / DHW is 1.5 or more, the detection sensitivity tends to increase rapidly. Therefore, it is preferable that the relationship of 1.5 ≦ DHL / DHW is satisfied. Note that the plurality of points shown in FIG. 8 are different from each other in at least one value of DHL and DHW.

  Moreover, it is preferable that the relationship of 1.5 ≦ DHL / DHW ≦ 4.0 is satisfied. Thereby, it is possible to increase the detection sensitivity while reducing the power consumption by reducing the CI (crystal impedance) value.

  FIG. 9 is a graph showing the relationship between the ratio DHL / DHW of the length DHL and width DHW of the drive weight portion and the CI value.

  As shown in FIG. 9, the CI value increases as DHL / DHW increases. Here, the CI value is preferably 100 kΩ or less in order to obtain an appropriate amplitude of the driving arms 25 to 28, and further, the power saving of the sensor 1 (when the operating voltage is about 1 V or more and 5 V or less). From the viewpoint of chemical conversion, it is preferably 40 kΩ or less. Therefore, it is preferable that the relationship of 1.5 ≦ DHL / DHW ≦ 4.0 is satisfied. Note that at least one of DHL and DHW is different from each other in the plurality of points shown in FIG.

  When the lengths of the arm portions 251, 261, 271, 281 (drive arm portions) along the extending direction (y-axis direction) of the drive arms 25 to 28 are DAL, 1.5 <DHL / DAL. It is preferable that the relationship is satisfied. Thereby, detection sensitivity can be raised.

  FIG. 10 is a graph showing the relationship between the ratio DHL / DAL of the length DHL of the drive weight and the length DAL of the drive arm and the sensitivity ratio.

  As shown in FIG. 10, the greater the DHL / DAL, the greater the sensitivity ratio, which is the ratio to the reference sensitivity. Here, when DHL / DAL is 1.5 or more, the detection sensitivity tends to increase rapidly. Therefore, it is preferable that the relationship of 1.5 ≦ DHL / DAL is satisfied. Note that the plurality of points shown in FIG. 10 are different from each other in at least one of the values of DHL and DAL.

  Moreover, it is preferable that the relationship of 1.5 ≦ DHL / DAL ≦ 4.0 is satisfied. Thereby, it is possible to increase the detection sensitivity while reducing the power consumption by reducing the CI (crystal impedance) value.

  FIG. 11 is a graph showing the relationship between the ratio DHL / DAL between the length DHL of the driving weight portion and the length DAL of the driving arm portion and the CI value.

  As shown in FIG. 11, the CI value increases as DHL / DAL increases. Here, as described above, the CI value is preferably 100 kΩ or less in order to obtain an appropriate amplitude of the drive arms 25 to 28, and sensor 1 (the operating voltage is about 1 V or more and 5 V or less). From the viewpoint of power saving in the case), it is preferably 40 kΩ or less. Therefore, it is preferable that the relationship of 1.5 ≦ DHL / DAL ≦ 4.0 is satisfied. Note that the plurality of points shown in FIG. 11 are different from each other in at least one value of DHL / DAL.

  Also, the width in the direction (x-axis direction) perpendicular to the extending direction (y-axis direction) of the arm portions 251, 261, 271, 281 (drive arm portion) when viewed from the thickness direction of the base portion 21 is DAW. In this case, it is preferable that the relationship of 1.2 ≦ DHW / DAW is satisfied, and it is more preferable that the relationship of 1.3 ≦ DHW / DAW ≦ 4.0 is satisfied. As a result, the detection sensitivity can be increased while downsizing.

  Further, as described above, the detection arms 23 and 24 are provided on the distal end side with respect to the arm portions 231 and 241 that are detection arm portions extending from the base portion 21 and the arm portions 231 and 241, and the arm portion 231. , 241, and weight portions 232 and 242 which are wider than the detection weight portion. Here, the length of each of the arm portions 231 and 241 (detection arm portions) along the extending direction (y-axis direction) of the detection arms 23 and 24 is defined as PAL, and the extending direction of the detection arms 23 and 24 (y When the lengths of the weight portions 232 and 242 (detection weight portions) along the axial direction are PHL, it is preferable that the relationship of DHL / DAL> PHL / PAL is satisfied, and DHL / DAL> 1 It is more preferable that the relationship of 1PHL / DAL is satisfied. Thereby, detection sensitivity can be raised. In the drawing, the weights 232 and 242 have a rectangular shape in plan view. However, the shape in plan view is not limited to this, and may be a shape having portions with different widths, for example.

2. Electronic Device FIG. 12 is a perspective view showing a configuration of a mobile (or notebook) personal computer which is an example of the electronic device of the present invention.

  In this figure, a personal computer 1100 includes a main body portion 1104 provided with a keyboard 1102 and a display unit 1106 provided with a display portion 1108. The display unit 1106 is rotated with respect to the main body portion 1104 via a hinge structure portion. It is supported movably.

  Such a personal computer 1100 incorporates the aforementioned sensor 1 that functions as a gyro sensor.

FIG. 13 is a perspective view illustrating a configuration of a smartphone that is an example of the electronic apparatus of the invention.
In this figure, the smartphone 1200 includes a plurality of operation buttons 1202, an earpiece 1204, and a mouthpiece 1206, and the display unit 100 is disposed between the operation buttons 1202 and the earpiece 1204.

  Such a smartphone 1200 incorporates the aforementioned sensor 1 that functions as a gyro sensor.

  FIG. 14 is a perspective view showing a configuration of a digital still camera which is an example of the electronic apparatus of the present invention. In this figure, connection with an external device is also simply shown.

  Here, an ordinary camera sensitizes a silver halide photographic film with a light image of a subject, whereas a digital still camera 1300 photoelectrically converts a light image of a subject with an imaging device such as a CCD (Charge Coupled Device). An imaging signal (image signal) is generated.

  A display unit 1310 is provided on the back of a case (body) 1302 in the digital still camera 1300, and is configured to perform display based on an imaging signal from the CCD. The display unit 1310 displays a subject as an electronic image. Functions as a finder.

  A light receiving unit 1304 including an optical lens (imaging optical system), a CCD, and the like is provided on the front side (the back side in the drawing) of the case 1302.

  When the photographer confirms the subject image displayed on the display unit and presses the shutter button 1306, the CCD image pickup signal at that time is transferred and stored in the memory 1308.

  In the digital still camera 1300, a video signal output terminal 1312 and an input / output terminal 1314 for data communication are provided on the side surface of the case 1302. As shown in the figure, a television monitor 1430 is connected to the video signal output terminal 1312 and a personal computer 1440 is connected to the input / output terminal 1314 for data communication as necessary. Further, the imaging signal stored in the memory 1308 is output to the television monitor 1430 or the personal computer 1440 by a predetermined operation.

  Such a digital still camera 1300 incorporates the above-described sensor 1 that functions as a gyro sensor.

  The electronic apparatus as described above includes the sensor 1. According to such an electronic device, since the detection sensitivity of the sensor 1 is stable, the characteristics (for example, reliability) of the electronic device can be improved.

  In addition to the personal computer (mobile personal computer) shown in FIG. 12, the smartphone (mobile phone) shown in FIG. 13, and the digital still camera shown in FIG. Tablet terminal, watch, body posture detection device, pointing device, head mounted display, ink jet discharge device (for example, ink jet printer), laptop personal computer, TV, video camera, video tape recorder, navigation device, pager, electronic notebook ( (Including communication functions), electronic dictionaries, calculators, electronic game machines, game controllers, word processors, workstations, video phones, TV monitors for crime prevention, electronic binoculars, POS terminals, medical devices (for example, Electronic thermometer, sphygmomanometer, blood glucose meter, electrocardiogram measuring device, ultrasonic diagnostic device, electronic endoscope), fish detector, various measuring instruments, instruments (eg, vehicle, aircraft, ship instruments), flight simulator, etc. Can be applied to.

3. Mobile Object FIG. 15 is a perspective view showing an example of a mobile object (automobile) of the present invention. In this figure, a moving body 1500 has a vehicle body 1501 and four wheels 1502, and is configured to rotate the wheels 1502 by a power source (engine) (not shown) provided in the vehicle body 1501. In such a moving body 1500, the sensor 1 is built.

  As described above, the moving object 1500 includes the sensor 1. According to such a moving body 1500, since the detection sensitivity of the sensor 1 is stable, the characteristics (for example, reliability) of the moving body 1500 can be improved.

  As described above, the sensor, the electronic device, and the moving body of the present invention have been described based on the illustrated embodiments. However, the present invention is not limited thereto, and the configuration of each unit is an arbitrary configuration having the same function. Can be substituted. Moreover, other arbitrary components may be added.

  In the above-described embodiment, the case where the vibration element piece is made of a piezoelectric material has been described as an example. However, the vibration element piece may be made of a non-piezoelectric material such as silicon or quartz. In this case, for example, a piezoelectric element may be provided on a base made of a non-piezoelectric material. In this case, if the vibration element piece is made of silicon, a vibration element piece having excellent vibration characteristics can be realized at a relatively low cost. Further, the vibration element piece can be formed with high dimensional accuracy by etching using a known fine processing technique. Therefore, the size of the vibration element piece can be reduced.

  Further, in the above-described embodiment, the case where the piezoelectric driving method using the reverse piezoelectric effect is used as the driving method of the vibration element piece has been described as an example. However, the present invention is not limited to this, for example, electrostatic attraction An electrostatic drive system using, an electromagnetic drive system using electromagnetic force, or the like can be used. Similarly, in the above-described embodiment, the case where the piezoelectric detection method using the piezoelectric effect is used as the detection method of the vibration element piece has been described as an example. However, the present invention is not limited to this, for example, the capacitance An electrostatic capacity detection system that detects the piezoresistance, a piezoresistance detection system that detects the resistance value of the piezoresistor, an electromagnetic detection system that detects the induced electromotive force, an optical detection system, and the like can be used. In addition, as the driving method and the detection method, the above-described methods can be used in any combination.

  In the above-described embodiment, the case where the support member is a flexible wiring board for TAB mounting has been described as an example. However, the form of the support member is not limited to this, and the base and the support member are configured integrally. May be. For example, the support member may be in the form of a beam portion integrally formed with the base portion as disclosed in JP-A-2006-85179. In this case, the connection portion between the beam portion and the base portion is What is necessary is just to catch as a "connection part" provided in the base.

DESCRIPTION OF SYMBOLS 1 ... Sensor, 2 ... Vibration element, 3 ... IC chip, 4 ... Support member, 9 ... Package, 20 ... Vibration element piece, 21 ... Base part, 23 ... Detection arm, 24 ... Detection arm, 25 ... Drive arm, 26 ... Drive arm 27 ... Drive arm 28 ... Drive arm 41 ... Film 42a ... Wiring (wire) 42b ... Wiring (wire) 42c ... Wiring (wire) 42d ... Wiring (wire) 42e ... Wiring (wire) ), 42f ... wiring (wire), 67 ... terminal (connection portion), 71 ... internal terminal, 72 ... internal terminal, 74 ... external terminal, 81 ... fixing member, 82 ... fixing member, 91 ... base, 92 ... lid, 93 ... Joining member, 100 ... Display part, 221 ... Connecting arm, 222 ... Connecting arm, 231 ... Arm part (detection arm part), 232 ... Weight part (detection weight part), 241 ... Arm part (detection arm part), 242 ... Weight part (detection weight part), 251 ... Part (drive arm part), 252 ... weight part (drive weight part), 261 ... arm part (drive arm part), 262 ... weight part (drive weight part), 271 ... arm part (drive arm part), 272 ... weight Part (drive weight part), 281 ... arm part (drive arm part), 282 ... weight part (drive weight part), 411 ... device hole, 421a ... connection terminal, 421b ... connection terminal, 421c ... connection terminal, 421d ... connection Terminal, 421e ... Connection terminal, 421f ... Connection terminal, 911 ... Substrate, 912 ... Substrate, 913 ... Substrate, 914 ... Substrate, 1100 ... Personal computer, 1102 ... Keyboard, 1104 ... Main part, 1106 ... Display unit, 1108 ... Display , 1200 ... smartphone, 1202 ... operation button, 1204 ... earpiece, 1206 ... mouthpiece, 1300 ... digital still camera, 1302 ... case, 1304 ... reception Unit 1306 ... Shutter button 1308 ... Memory 1310 ... Display unit 1312 ... Video signal output terminal 1314 ... Input / output terminal 1430 ... TV monitor 1440 ... Personal computer 1500 ... Mobile body 1501 ... Car body 1502 ... Wheel, G ... center of gravity, a ... arrow, b ... arrow, c ... arrow, ω ... angular velocity

Claims (13)

The base,
A pair of detection arms extending in opposite directions from the base;
A pair of connecting arms extending from the base in the opposite direction so as to cross the extending direction of the detection arm;
A pair of drive arms extending from each of the pair of connecting arms in opposite directions across the extending direction of the connecting arms;
A plurality of connecting portions disposed on the base;
Base and
A support member connected to the plurality of connection portions and supporting the base portion with respect to the base,
When the length of the base portion along the extending direction of the connecting arm is Bx, and the total length of the plurality of connecting portions along the extending direction of the connecting arm is B1,
A sensor satisfying the relationship of B1 / Bx ≦ 0.43.   The sensor according to claim 1, wherein a relationship of 0.25 ≦ B1 / Bx ≦ 0.43 is satisfied. When the length of the base portion along the extending direction of the detection arm is By, and the total length of the plurality of connection portions along the extending direction of the detection arm is B2,
The sensor according to claim 1 or 2, satisfying a relationship of B2 / By≥0.5.   The sensor according to any one of claims 1 to 3, wherein the plurality of connecting portions are arranged in a matrix.   The plurality of connecting portions are arranged in a matrix with a predetermined interval in the extending direction of the connecting arm and a predetermined interval in a direction intersecting the extending direction of the connecting arm. The sensor according to any one of claims 1 to 3.   The sensor according to claim 1, wherein the support member has a plurality of wires connected to the plurality of connection portions. The drive arm includes a drive arm portion extending from the connection arm, and a drive weight portion provided on a distal end side with respect to the drive arm portion and wider than the drive arm portion,
When the length of the driving weight portion along the extending direction of the driving arm is DHL and the width of the driving weight portion along the direction orthogonal to the extending direction of the driving arm in plan view is DHW,
The sensor according to claim 1, wherein a relationship of 1.5 ≦ DHL / DHW is satisfied.   The sensor according to claim 7, wherein a relationship of 1.5 ≦ DHL / DHW ≦ 4.0 is satisfied. When the length of the drive arm portion along the extending direction of the drive arm is DAL,
The sensor according to claim 7 or 8, wherein a relationship of 1.5 <DHL / DAL is satisfied. When the width in the direction orthogonal to the extending direction of the drive arm portion in plan view is DAW,
The sensor according to any one of claims 7 to 9, wherein a relation of 1.2 ≦ DHW / DAW is satisfied. The detection arm includes a detection arm portion extending from the base portion, and a detection weight portion provided on a distal end side with respect to the detection arm portion and wider than the detection arm portion,
The length of the drive arm along the extension direction of the drive arm is DAL, the length of the detection arm along the extension direction of the detection arm is PAL, and the detection arm extends in the extension direction. When the length of the detection weight portion along the line is PHL,
The sensor according to any one of claims 7 to 10, wherein a relationship of DHL / DAL> PHL / PAL is satisfied.   An electronic apparatus comprising the sensor according to claim 1.   A moving body comprising the sensor according to claim 1.

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