JP2016133330A - Electronic component manufacturing method, electronic component, electronic apparatus, and mobile entity - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component manufacturing method, an electronic component, an electronic apparatus, and a mobile entity with which it is possible to join structures together with high strength and electrically connect terminals with each other effectively.SOLUTION: This electronic component manufacturing method manufactures a physical sensor 1 provided with a support substrate 9 having a connection terminal 931 and a package 5 having an S1 connection terminal 801b by joining the connection terminal 931 and the connection terminal 801b. Also, this electronic component manufacturing method is characterized in that while the connection terminal 931 and the connection terminal 801b are disposed facing each other, at least one of the connection terminal 931 and the connection terminal 801b is irradiated with a laser beam L and welded with the other.SELECTED DRAWING: Figure 7

Description

  The present invention relates to an electronic component manufacturing method, an electronic component, an electronic device, and a moving body.

  Conventionally, as an angular velocity sensor for detecting an angular velocity, a sensor as disclosed in Patent Document 1 is known.

  The angular velocity sensor described in Patent Document 1 includes a vibrator having electrodes formed on the outer surface, a substrate that supports the vibrator, and a package that houses these. Further, terminals that are electrically connected to the electrodes of the vibrator are formed on the substrate, and terminals that are connected to the outside are also formed on the package.

  In such an angular velocity sensor, the terminal of the board and the terminal of the package are joined with a conductive adhesive, thereby electrically connecting the terminal of the board and the terminal of the package, and joining the board and the package. Are fixed.

JP 2006-105963 A

  For example, when a metal material such as solder is used as the conductive adhesive, the terminals can be effectively electrically connected to each other, but the bonding strength between the substrate and the package is relatively weak. Moreover, when the resin adhesive which has an electroconductive filler is used, although the adhesive strength of a board | substrate and a package becomes comparatively strong, there exists a possibility that the electrical connection of terminals may become inadequate.

  As described above, it is difficult to effectively electrically connect the terminals to each other while bonding the substrate and the package with high bonding strength.

  An object of the present invention is to provide an electronic component manufacturing method, an electronic component, an electronic device, and a moving body that can join structures with high strength and can effectively electrically connect terminals to each other. There is.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following application examples.

[Application Example 1]
The method of manufacturing an electronic component according to the present invention includes joining the first terminal and the second terminal of an electronic component including a first structure having a first terminal and a second structure having a second terminal. A manufacturing method for manufacturing the electronic component,
In a state where the first terminal and the second terminal are arranged to face each other, at least one of the first terminal and the second terminal is irradiated with a laser to be welded to the other terminal. Features.

  According to the present invention, since the first terminal and the second terminal are bonded by welding, for example, compared to a case where the first terminal and the second terminal are bonded by a conductive adhesive, the bonding strength is increased. Furthermore, compared with the case where the terminals are joined together with the conductive adhesive, there are more portions where the terminals are in contact with each other, so that the terminals can be effectively electrically connected.

[Application Example 2]
In the method of manufacturing an electronic component according to the aspect of the invention, it is preferable that the laser is irradiated in a state where the first terminal and the second terminal are in contact with each other.
Thereby, a 1st terminal and a 2nd terminal can be welded directly.

[Application Example 3]
In the method for manufacturing an electronic component according to the present invention, a conductive bonding material is interposed between the first terminal and the second terminal prior to the laser irradiation, and the first terminal together with the bonding material. And the second terminal are preferably welded.

  Thereby, the part to weld can be increased by the part which welds each terminal with a joining material. Therefore, the bonding strength is further increased.

[Application Example 4]
In the method for manufacturing an electronic component of the present invention, at least one of the first structure and the second structure has a plate-like portion,
The plate-like portion is formed with a hole leading to the one terminal,
The laser is preferably passed through the through hole.

  Thereby, the part which a laser permeate | transmits a 1st structure can be abbreviate | omitted, or can be made small, Therefore, the influence by the laser of a 1st structure can be reduced.

[Application Example 5]
The method of manufacturing an electronic component according to the present invention includes joining the first terminal and the second terminal of an electronic component including a first structure having a first terminal and a second structure having a second terminal. A manufacturing method for manufacturing the electronic component,
In a state where the first terminal and the second terminal are arranged to face each other, a conductive bonding material is interposed between the first terminal and the second terminal. The first terminal and the second terminal are welded through the bonding material while being pressurized and heated.

  According to the present invention, since the first terminal and the second terminal are bonded by welding, for example, compared to a case where the first terminal and the second terminal are bonded by a conductive adhesive, the bonding strength is increased. Furthermore, compared with the case where the terminals are joined together with the conductive adhesive, there are more portions where the terminals are in contact with each other, so that the terminals can be effectively electrically connected.

[Application Example 6]
In the electronic component manufacturing method of the present invention, one of the first structure and the second structure is pressed toward the other structure by a jig having a heating element, and the bonding material It is preferable to pressurize and heat.

  For example, when heating the first structure and the second structure in a heated space, pressurization is difficult, but according to the present invention, heating and pressurization can be easily performed.

[Application Example 7]
The method for manufacturing an electronic component according to the present invention is a method for joining the first terminal and the second terminal of an electronic component comprising a first structure having a first terminal and a second structure having a second terminal. A method,
In a state where the first terminal and the second terminal are arranged to face each other, the first terminal and the second terminal are provided by applying ultrasonic waves to the first terminal and the second terminal. It is characterized by welding.

  According to the present invention, since the first terminal and the second terminal are bonded by welding, for example, compared to a case where the first terminal and the second terminal are bonded by a conductive adhesive, the bonding strength is increased. Furthermore, compared with the case where the terminals are joined together with the conductive adhesive, there are more portions where the terminals are in contact with each other, so that the terminals can be effectively electrically connected.

[Application Example 8]
In the electronic component manufacturing method of the present invention, while applying the ultrasonic wave, pressurizing one structure out of the first structure and the second structure toward the other structure, Preferably, at least one of heating of at least one of the first terminal and the second terminal is performed.

  Thereby, in addition to ultrasonic vibration, it is possible to perform welding more effectively by performing at least one of heating and pressurization.

[Application Example 9]
An electronic component manufacturing method of the present invention is a manufacturing method for manufacturing an electronic component including a first structure having a first terminal and a second structure having a second terminal,
While joining the 1st structure and the 2nd structure via an adhesive agent, a long conductive part is constructed between the 1st terminal and the 2nd terminal, and the 1st terminal And the second terminal are electrically connected.

  According to the present invention, the adhesive is responsible for increasing the bonding strength between the first structure and the second structure, and the conductive portion is responsible for electrical connection between the first terminal and the second terminal. Therefore, both high bonding strength and effective electrical connection can be achieved.

[Application Example 10]
The electronic component of the present invention is manufactured by the electronic component manufacturing method of the present invention.
Thereby, an electronic component with high reliability can be obtained.

[Application Example 11]
The electronic device of the present invention includes the electronic component of the present invention.
Thereby, an electronic device with high reliability can be obtained.

[Application Example 12]
The moving body of the present invention includes the electronic component of the present invention.
Thereby, a mobile body with high reliability can be obtained.

FIG. 1 is an exploded perspective view of an electronic component of the present invention. 2 is a cross-sectional view taken along line AA in FIG. FIG. 3 is a plan view of the gyro element shown in FIG. FIG. 4 is a plan view (top view) showing the electrode arrangement of the gyro element shown in FIG. FIG. 5 is a plan view (transmission view seen from above) showing the electrode arrangement of the gyro element shown in FIG. 6A and 6B are diagrams for explaining the operation of the gyro element shown in FIG. FIGS. 7A and 7B are enlarged cross-sectional views for explaining the first embodiment of the method for manufacturing an electronic component of the present invention, wherein FIG. 7A is a diagram showing an arrangement process, and FIG. 7B is a diagram showing a joining process. . FIG. 8 is an enlarged cross-sectional view for explaining a joining step of the second embodiment of the method for manufacturing an electronic component of the present invention. FIG. 9 is an enlarged cross-sectional view for explaining a joining step of the third embodiment of the method for manufacturing an electronic component of the present invention. FIG. 10 is an enlarged cross-sectional view for explaining the joining step of the fourth embodiment of the electronic component manufacturing method of the present invention. FIG. 11 is an enlarged cross-sectional view for explaining a joining step of the fifth embodiment of the method for manufacturing an electronic component of the present invention. FIG. 12 is a perspective view for explaining the joining step of the sixth embodiment of the method for manufacturing an electronic component of the present invention. FIG. 13: is an expanded sectional view for demonstrating the joining process of 6th Embodiment of the manufacturing method of the electronic component of this invention. FIG. 14 is a perspective view for explaining a joining step of the seventh embodiment of the method for manufacturing an electronic component of the present invention. FIG. 15 is an enlarged cross-sectional view for explaining the joining step of the eighth embodiment of the method for manufacturing an electronic component of the present invention. FIG. 16 is a perspective view for explaining a support substrate in the ninth embodiment of the electronic component manufacturing method of the present invention. FIG. 17 is a perspective view for explaining a support substrate in the tenth embodiment of the electronic component manufacturing method of the invention. FIG. 18 is a perspective view showing a configuration of a mobile (or notebook) personal computer to which an electronic device including the electronic component of the present invention is applied. FIG. 19 is a perspective view showing a configuration of a mobile phone (including PHS) to which an electronic device including the electronic component of the present invention is applied. FIG. 20 is a perspective view illustrating a configuration of a digital still camera to which an electronic device including the electronic component of the present invention is applied. FIG. 21 is a perspective view showing a configuration of an automobile to which a moving body including an electronic component of the present invention is applied.

  Hereinafter, a method for manufacturing an electronic component, an electronic component, an electronic device, and a moving body of the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.

1. Electronic component <First embodiment>
FIG. 1 is an exploded perspective view of an electronic component of the present invention. 2 is a cross-sectional view taken along line AA in FIG. FIG. 3 is a plan view of the gyro element shown in FIG. FIG. 4 is a plan view (top view) showing the electrode arrangement of the gyro element shown in FIG. FIG. 5 is a plan view (transmission view seen from above) showing the electrode arrangement of the gyro element shown in FIG. 6A and 6B are diagrams for explaining the operation of the gyro element shown in FIG. FIGS. 7A and 7B are enlarged cross-sectional views for explaining the first embodiment of the method for manufacturing an electronic component of the present invention, wherein FIG. 7A is a diagram showing an arrangement process, and FIG. .

  In the following, for convenience of explanation, in each drawing, the X axis, the Y axis, and the Z axis are illustrated as three axes orthogonal to each other, and the direction parallel to the X axis is referred to as the “X axis direction” and the Y axis. The direction parallel to is called the “Y-axis direction” and the direction parallel to the Z-axis is called the “Z-axis direction”. The + Z-axis side is also referred to as “upper” and the −Z-axis side is also referred to as “lower”.

  A physical quantity sensor (electronic component) 1 shown in FIGS. 1 and 2 is a gyro sensor, and includes a gyro element 2, a support substrate (first structure) 9 that supports the gyro element 2, and the gyro element 2 and the support substrate. And a package (second structure) 5 for collectively storing 9.

Hereinafter, each of these components will be described sequentially.
≪Gyro element≫
As shown in FIGS. 3 to 5, the gyro element 2 includes a vibrating piece 3 and an electrode formed on the vibrating piece 3.

-Vibrating piece-
Examples of the constituent material of the resonator element 3 include piezoelectric materials such as quartz, lithium tantalate, and lithium niobate. Among these, it is preferable to use quartz as a constituent material of the resonator element 3. By using quartz, the gyro element 2 having excellent frequency temperature characteristics as compared with other materials can be obtained. Hereinafter, a case where the resonator element 3 is made of quartz will be described.

  The resonator element 3 has a plate shape having a spread in the XY plane defined by the Y axis (mechanical axis) and the X axis (electric axis), which are crystal axes of the quartz substrate, and having a thickness in the Z axis (optical axis) direction. I am doing. That is, the vibrating piece 3 is composed of a Z-cut quartz plate. Note that the Z-axis preferably coincides with the thickness direction of the resonator element 3, but slightly (for example, −5 ° ≦ θ ≦ 15 °) may be inclined.

  Such a resonator element 3 includes a base 31 located at the center, first and second detection arms 321 and 322 extending from the base 31 to both sides in the Y-axis direction, and extending from the base 31 to both sides in the X-axis direction. The first and second connecting arms 331 and 332, the first and second driving arms 341 and 342 extending from the tip of the first connecting arm 331 to both sides in the Y-axis direction, and the second connecting arm And third and fourth drive arms 343 and 344 extending from the front end of 332 to both sides in the Y-axis direction.

  The first detection arm 321 extends in the + Y-axis direction from the base portion 31, and a wide hammer head 3211 is provided at the distal end portion thereof. On the other hand, the second detection arm 322 extends in the −Y-axis direction from the base portion 31, and a wide hammer head 3221 is provided at the distal end portion thereof. These first and second detection arms 321 and 322 are arranged symmetrically with respect to the XZ plane passing through the center of gravity G of the gyro element 2. The hammer heads 3211 and 3221 may be provided as necessary and may be omitted. Moreover, you may form the bottomed groove | channel extended in the length direction in the upper surface and lower surface of the 1st, 2nd detection arms 321 and 322 as needed.

  The first connecting arm 331 extends from the base 31 in the + X axis direction. On the other hand, the second connecting arm 332 extends from the base 31 in the −X axis direction. These first and second connecting arms 331 and 332 are arranged symmetrically with respect to the YZ plane passing through the center of gravity G.

  The first drive arm 341 extends in the + Y-axis direction from the distal end portion of the first connecting arm 331, and a wide hammer head 3411 is provided at the distal end portion. The second drive arm 342 extends in the −Y-axis direction from the distal end portion of the first connecting arm 331, and a wide hammer head 3421 is provided at the distal end portion. The third driving arm 343 extends in the + Y-axis direction from the distal end portion of the second coupling arm 332, and a wide hammer head 3431 is provided at the distal end portion. The fourth drive arm 344 extends in the −Y-axis direction from the distal end portion of the second connecting arm 332, and a wide hammer head 3441 is provided at the distal end portion. These four drive arms 341, 342, 343, and 344 are arranged point-symmetrically with respect to the center of gravity G. The hammer heads 3411, 3421, 3431, and 3441 may be provided as necessary and may be omitted.

  Also, bottomed grooves 351 extending in the length direction are formed on the upper and lower surfaces of the detection arms 321 and 322 and the driving arms 341, 342, 343, and 344, respectively. Therefore, the detection arms 321 and 322 and the drive arms 341, 342, 343, and 344 have an “H” cross-sectional shape over the entire length in the longitudinal direction of the portion excluding the weight portion. Thereby, the space | interval of the X-axis direction of the electrodes formed in each arm becomes narrow. Therefore, the electric field efficiency between the electrodes is improved. As a result, the detection arms 321 and 322 and the drive arms 341, 342, 343, and 344 can generate a relatively large amount of charge with a relatively small amount of distortion. Therefore, the gyro element 2 having excellent sensitivity can be obtained.

-Electrode-
As shown in FIGS. 4 and 5, the electrodes include a first detection signal electrode 411, a first detection signal terminal 412, a first detection ground electrode (detection ground electrode) 421, a first detection ground terminal 422, Second detection signal electrode 431, second detection signal terminal 432, second detection ground electrode (detection ground electrode) 441, second detection ground terminal 442, drive signal electrode 451, drive signal terminal 452, and drive A ground electrode 461 and a drive ground terminal 462 are provided. 3 and 4, for convenience of explanation, the first and second detection signal electrodes 411 and 431 and the first and second detection signal terminals 412 and 432, the first and second detection ground electrodes 421 and 441, and the first 1, the second detection ground terminals 422 and 442, the drive signal electrode 451 and the drive signal terminal 452, the drive ground electrode 461 and the drive ground terminal 462 are illustrated by different hatchings. In addition, the electrodes formed on the side surface of the resonator element 3 are illustrated by thick lines.

  The first detection signal electrode 411 is formed on the upper surface and the lower surface of the first detection arm 321 (portion excluding the hammer head 3211), and the second detection signal electrode 431 is formed on the upper surface and the lower surface of the second detection arm 322 (hammer head 3221). Is formed on the part excluding). The first and second detection signal electrodes 411 and 431 are electrodes for detecting charges generated by the vibrations when the detection vibrations of the first and second detection arms 321 and 322 are excited. .

  The first detection signal terminal 412 is provided on the + Y axis side of the column on the + X axis side of the base portion 31 and is electrically connected to the first detection signal electrode 411 formed on the first detection arm 321 via a wiring (not shown). It is connected to the. The second detection signal terminal 432 is provided on the −Y axis side of the + X axis side column of the base portion 31, and the second detection signal electrode 431 formed on the second detection arm 322 via a wiring (not shown). And are electrically connected.

  The first detection ground electrodes 421 are formed on both side surfaces of the first detection arm 321 and are electrically connected to each other via the hammer head 3211. Similarly, the second detection ground electrodes 441 are formed on both side surfaces of the second detection arm 322, and are electrically connected to each other via the hammer head 3221. Such first and second detection ground electrodes 421 and 441 have a potential to be ground with respect to the first and second detection signal electrodes 411 and 431.

  The first detection ground terminal 422 is provided on the + Y axis side of the column on the −X axis side of the base portion 31 and is electrically connected to the first detection ground electrode 421 formed on the first detection arm 321 via a wiring (not shown). Connected. The second detection ground terminal 442 is provided on the −Y axis side of the column on the −X axis side of the base portion 31, and is a second detection signal electrode formed on the second detection arm 322 via a wiring (not shown). 431 is electrically connected.

  Thus, the first and second detection signal electrodes 411 and 431, the first and second detection signal terminals 412 and 432, the first and second detection ground electrodes 421 and 441, and the first and second detection ground terminals. 422 and 442 are arranged, the detection vibration generated in the first detection arm 321 appears as a charge between the first detection signal electrode 411 and the first detection ground electrode 421, and the first detection signal terminal 412. And a first detection ground terminal 422 as a signal (detection signal). Further, the detection vibration generated in the second detection arm 322 appears as an electric charge between the second detection signal electrode 431 and the second detection ground electrode 441, and is generated from the second detection signal terminal 432 and the second detection ground terminal 442. It can be taken out as a signal (detection signal).

  The drive signal electrode 451 is formed on the upper and lower surfaces (portions excluding the hammer heads 3411 and 3421) of the first and second drive arms 341 and 342. Further, the drive signal electrodes 451 are formed on both side surfaces of the third and fourth drive arms 343 and 344 and are electrically connected to each other via the hammer heads 3431 and 3441. Such a drive signal electrode 451 is an electrode for exciting drive vibrations of the first, second, third, and fourth drive arms 341, 342, 343, and 344.

  The drive signal terminal 452 is provided at the center of the column on the −X axis side of the base portion 31 (that is, between the first detection ground terminal 422 and the second detection ground terminal 442), and via a wiring (not shown). The drive signal electrodes 451 formed on the first, second, third, and fourth drive arms 341, 342, 343, and 344 are electrically connected.

  The drive ground electrode 461 is formed on the upper and lower surfaces (portions excluding the hammer heads 3431 and 3441) of the third and fourth drive arms 343 and 344. Further, the drive ground electrode 461 is formed on both side surfaces of the first and second drive arms 341 and 342, and is electrically connected to each other via the hammer heads 3411 and 3421. Such a drive ground electrode 461 has a potential to be ground with respect to the drive signal electrode 451.

  The drive ground terminal 462 is provided at the center of the column on the + X axis side of the base 31 (that is, between the first detection signal terminal 412 and the second detection signal terminal 432), and is connected to the first via a wiring (not shown). The drive ground electrode 461 formed on the first, second, third, and fourth drive arms 341, 342, 343, and 344 is electrically connected.

  By arranging the drive signal electrode 451, the drive signal terminal 452, the drive ground electrode 461, and the drive ground terminal 462 in this way, by applying a drive signal between the drive signal terminal 452 and the drive ground terminal 462, An electric field is generated between the drive signal electrode 451 and the drive ground electrode 461 formed on the first, second, third, and fourth drive arms 341, 342, 343, 344, and the drive arms 341, 342, 343, 344 can be driven to vibrate.

  The configuration of the electrode as described above is not particularly limited as long as it has conductivity. For example, Ni (nickel), Au (metal) layer such as Cr (chromium), W (tungsten), etc. (Gold), Ag (silver), Cu (copper), etc. can be comprised by the metal film which laminated | stacked each film.

  The metal film formed on the hammer heads 3211 and 3221 functions as an adjustment film for adjusting the frequency of the detection vibration mode. For example, a part of the metal film is removed by laser irradiation or the like, and the first film is removed. By adjusting the mass of the second detection arms 321, 322, the frequency of the detection mode can be adjusted. On the other hand, the metal film formed on the hammer heads 3411, 3421, 3431, 3441 functions as an adjustment film for adjusting the frequency of the drive vibration mode, and for example, a part of the metal film is removed by laser irradiation or the like. Then, the frequency of the drive mode can be adjusted by adjusting the mass of the drive arms 341, 342, 343, and 344.

  The configuration of the gyro element 2 has been briefly described above. Next, driving of the gyro element 2 will be briefly described.

  When a voltage (alternating voltage) is applied between the drive signal terminal 452 and the drive ground terminal 462 in a state where no angular velocity is applied to the gyro element 2, an electric field is generated between the drive signal electrode 451 and the drive ground electrode 461, As shown in FIG. 6A, the drive arms 341, 342, 343, and 344 perform bending vibration in the direction indicated by the arrow A. At this time, since the first and second driving arms 341 and 342 and the third and fourth driving arms 343 and 344 perform plane-symmetric vibration with respect to the YZ plane passing through the center of gravity G of the gyro element 2, the base 31, The first and second detection arms 321 and 322 and the first and second connection arms 331 and 332 hardly vibrate.

  When an angular velocity ω around the Z axis is applied to the gyro element 2 in such a driving vibration state, a detection vibration as shown in FIG. 6B is excited. Specifically, Coriolis force in the direction of arrow B acts on the drive arms 341, 342, 343, 344 and the first and second connecting arms 331, 332, and new vibrations are excited. This vibration in the direction of arrow B is a vibration in the circumferential direction with respect to the center of gravity G. At the same time, the first and second detection arms 321 and 322 are excited in the direction indicated by the arrow C in response to the vibration indicated by the arrow B. Then, the electric charges generated in the first and second detection arms 321 and 322 by this vibration are extracted as signals from the first and second detection signal electrodes 411 and 431 and the first and second detection ground electrodes 421 and 441, The angular velocity ω is obtained based on this signal.

≪Support substrate≫
The support substrate 9 is a substrate having optical transparency for mounting TAB (Tape Automated Bonding), which is conventionally known, and supports the gyro element 2.

  As shown in FIGS. 1 and 2, the support substrate 9 includes a frame-shaped base portion 91 and six bonding leads (wirings) 92, 93, 94, 95, 96, 97 provided on the base portion 91. Have.

  The base 91 is made of a flexible resin such as polyimide, for example. The base 91 has a substantially rectangular outer shape, and is disposed in the first recess 61 so that its long axis coincides with the long axis of the package 5.

  Each of the six bonding leads 92 to 97 is fixed to the lower surface of the base 91. Further, the bonding leads 92, 93, 94 are arranged on the left side (one side in the long axis direction) of the base portion 91 in FIG. 1, and the tip ends thereof extend into the opening portion 910 of the base portion 91. On the other hand, the bonding leads 95, 96, 97 are arranged on the right side (the other side in the long axis direction) in FIG. 1 of the base portion 91, and their tip ends extend into the opening 910 of the base portion 91.

  The leading ends of the bonding leads 92, 93, and 94 are opposed to the leading ends of the bonding leads 95, 96, and 97 at the center of the opening 910.

  Each of the bonding leads 92 to 97 is inclined in the middle, and the tip portion is located above the base portion 91. Further, the bonding leads 92 to 97 have a narrow width in the middle, and the tip portion is thinner than the base end portion. Further, the tip ends of the bonding leads 92 to 97 are the first detection signal terminal 412, the first detection ground terminal 422, the second detection signal terminal 432, the second detection ground terminal 442, the drive signal terminal 452, which the gyro element 2 has. The driving ground terminal 462 is arranged corresponding to (overlapping).

  The base ends of the bonding leads 92 and 95 are connection terminals (first terminals) 921 and 951, and the bonding leads 92 and 95 extend straight from the connection terminals 921 and 951. On the other hand, the base ends of the bonding leads 93, 94, 96, 97 are connection terminals (first terminals) 931, 941, 961, 971, and the bonding leads 93, 94, 96, 97 are connection terminals 931. , 941, 961, 971, extending at right angles to the bonding leads 92, 95 side.

≪Package≫
As shown in FIG. 1 and FIG. 2, the package 5 includes a box-shaped base (base body) 6 having a recess 61 opened on the upper surface, and a plate-shaped lid (blocking the opening of the recess 61 and joined to the base 6). Lid) 7. The gyro element 2 described above is housed in the internal space S formed by closing the opening of the recess 61 with the lid 7. The atmosphere of the internal space S is not particularly limited, but in the present embodiment, it is in a vacuum state (for example, a reduced pressure state of 10 Pa or less).

  The base 6 has a substantially rectangular (rectangular) outer shape in plan view, and a pair of outer edges extending in the major axis direction and a minor axis direction (a direction intersecting the major axis direction). And a pair of extending outer edges. However, the planar view shape of the base 6 is not limited to a rectangle, and may be, for example, a square, a pentagon or more polygon, or an irregular shape.

  On the upper surface of the base 6, an S1 connection terminal 801b, an S2 connection terminal 802b, a GND connection terminal 803b ′, 803b ″, a DS connection terminal 804b, and a DG connection terminal 805b are provided apart from each other. 801b, S2 connection terminal 802b, GND connection terminals 803b ′, 803b ″, DS connection terminal 804b, and DG connection terminal 805b are connection terminals 921 to 921 of bonding leads 92 to 97 when the support substrate 9 is housed in the package 5, respectively. Corresponding to (overlapping) 971 and joined together.

  Further, the S1 connection terminal 801b, the S2 connection terminal 802b, the GND connection terminals 803b ′ and 803b ″, the DS connection terminal 804b, and the DG connection terminal 805b respectively connect the connection terminals 921 to 971 of the bonding leads 92 to 97 in plan view. Big enough to include.

  The S1 connection terminal 801b is joined to the connection terminal 931, and the S2 connection terminal 802b is joined to the connection terminal 941. The GND connection terminal 803b ′ is joined to the connection terminal 961, the GND connection terminal 803b ″ is joined to the connection terminal 971. The DS connection terminal 804b is joined to the connection terminal 951, and the DG connection terminal 805b is connected to the connection terminal 971b. It is joined to the terminal 921.

  The base 6 is formed with through holes (not shown) in portions corresponding to the connection terminals 801b, 802b, 803b ′, 803b ″, 804b, and 805b, and wirings are arranged in the through holes, respectively. These wirings are connected to an external terminal (not shown) provided on the lower surface of the base 6. Thereby, the electrode of the gyro element 2 is electrically connected to the outside. can do.

  Next, a method for manufacturing the physical quantity sensor 1 (a method for manufacturing an electronic component of the present invention) will be described. The manufacturing method of the physical quantity sensor 1 includes a preparation process, an arrangement process, a bonding process, and a sealing process.

[1] Preparation Step First, the gyro element 2, the support substrate 9, and the package 5 are prepared. The gyro element 2 is supported and fixed to the support substrate 9 via bonding leads 92 to 97.

[2] Arrangement Step Next, as shown in FIG. 7A, the support substrate 9 on which the gyro element 2 is fixed is arranged in the recess 61 of the package 5. At this time, the connection terminal 931 and the S1 connection terminal 801b are opposed (contacted), the connection terminal 941 and the S2 connection terminal 802b are opposed, and the connection terminal 961 and the GND connection terminal 803b ′ are opposed to each other. The connection terminal 971 and the GND connection terminal 803b ″ are in a facing state, the connection terminal 951 and the DS connection terminal 804b are in a facing state, and the connection terminal 921 and the DG connection terminal 805b are in a facing state.

[3] Joining Step Then, the connection terminal 931 and the S1 connection terminal 801b, the connection terminal 941 and the S2 connection terminal 802b, the connection terminal 961 and the GND connection terminal 803b ′, the connection terminal 971 and the GND connection terminal 803b ″, the connection terminal 951 and the DS The connection terminal 804b, the connection terminal 921, and the DG connection terminal 805b are respectively welded, and since these welding methods are the same, the connection terminal 931 and the S1 connection terminal 801b will be described below representatively.

  As shown in FIG. 7B, the laser light L is emitted from above toward the connection terminal 931 in a state where the connection terminal 931 and the S1 connection terminal 801b are in contact with each other. At this time, the laser light L passes through the support substrate 9 and is irradiated to the connection terminal 931. Thereby, the temperature of the connection terminal 931 rises. Furthermore, the temperature of the S1 connection terminal 801b in contact with the connection terminal 931 also rises. When the connection terminal 931 and the S1 connection terminal 801b reach a temperature higher than the melting point, a part of the connection terminal 931 and the S1 connection terminal 801b are mixed. By lowering the temperature of the connection terminal 931 and the S1 connection terminal 801b from the mixed state to, for example, room temperature, the connection terminal 931 and the S1 connection terminal 801b are cured in a partially mixed state. Therefore, the support substrate 9 is fixed to the package 5.

  Thus, in the present invention, the connection terminal 931 and the S1 connection terminal 801b are joined by welding. Thereby, a metal bond (interatomic bond) can be formed between the connection terminal 931 and the S1 connection terminal 801b as compared with the case where the connection terminal 931 and the S1 connection terminal 801b are joined via the conductive adhesive. For this reason, the bonding strength is increased.

  Furthermore, when the conductive adhesive is used, the connection terminal 931 and the S1 connection terminal 801b are electrically connected at the portion where the conductive filler of the conductive adhesive is in contact. The connection terminal 931 and the S1 connection terminal 801b are electrically connected to the entire surface of the welded portion of the connection terminal 931 and the S1 connection terminal 801b (in this embodiment, the entire surface of the connection terminal 931 and the S1 connection terminal 801b). Therefore, the connection terminal 931 and the S1 connection terminal 801b can be effectively electrically connected.

  As described above, according to the present invention, the support substrate 9 and the package 5 can be bonded with high strength, and the connection terminal 931 and the S1 connection terminal 801b can be effectively electrically connected.

  Further, as described above, the S1 connection terminal 801b is large enough to include the connection terminal 931 in plan view. Thereby, as long as the connection terminal 931 is irradiated with the laser beam L, the connection terminal 931 and the S1 connection terminal 801b can be welded. That is, it is possible to easily identify a site to be irradiated with the laser beam L.

  In this bonding step, laser marks 14 are formed on the outer surface of the portion of the support substrate 9 through which the laser beam L has passed, and the support substrate 9 is dissolved and deformed by the laser beam L, or is burnt and discolored. It is formed. By visually recognizing the laser mark 14, it can be recognized that the welding of the terminals directly under the laser mark 14 is completed. Therefore, it can be recognized at a glance whether or not the bonding of the physical quantity sensor 1 is completed.

Examples of the laser light L include an Nd—YAG laser, an Ar laser, a CO ₂ laser, and a He—Ne laser.

  The beam diameter of the laser light L is preferably 10 μm or more and 50 μm or less, and more preferably 15 μm or more and 35 μm or less. Accordingly, the connection terminal 931 and the S1 connection terminal 801b can be welded in a relatively short time, and the laser beam L is prevented or suppressed from irradiating the portion of the support substrate 9 that is detached from the connection terminal 931. be able to.

The irradiation amount (irradiation energy) of the laser beam L is preferably 0.001 mJ or more and 3 mJ or less, and more preferably 0.01 mJ or more and 1 mJ or less. When the irradiation amount of the laser beam L is within the above numerical range, the connection terminal 931 and the S1 connection terminal 801b can be welded in a relatively short time, and the melting to the support substrate 9 is prevented or suppressed. be able to.
The laser beam L may be continuous or may be irradiated intermittently.

[4] Sealing Step Next, the lid 7 is joined to the base 6 so as to close the recess 61 (see FIG. 2). Thereby, the physical quantity sensor 1 can be obtained. In addition, it is preferable to perform this sealing process, for example in a reduced pressure state in a vacuum chamber etc. Thereby, the inside of the recessed part 61 can be easily made into a pressure reduction state.

  As described above, according to the present invention, the support substrate 9 and the package 5 can be bonded with high strength, and each connection terminal of the support substrate 9 and each connection terminal of the package 5 are effective. Can be electrically connected. Thereby, the physical quantity sensor 1 with high reliability can be obtained.

Second Embodiment
FIG. 8 is an enlarged cross-sectional view for explaining a joining step of the second embodiment of the method for manufacturing an electronic component of the present invention.

  Hereinafter, the second embodiment of the method of manufacturing an electronic component according to the present invention will be described with reference to the drawings. The second embodiment will be described mainly with respect to differences from the above-described embodiment, and the description of the same matters will be omitted.

  This embodiment is substantially the same as the first embodiment except that the configuration of the support substrate is mainly different.

  As shown in FIG. 8, the support substrate 9 is provided with a through hole (hole) 98 penetrating in the thickness direction in a portion (plate-shaped portion) corresponding to the connection terminal 931. Although not shown, the through holes 98 are also provided in portions where the connection terminals 941 to 971 are located, and the support substrate 9 is provided with six through holes 98.

  The through hole 98 is formed by, for example, etching using an excimer laser. Further, the through hole 98 is formed in advance prior to performing the joining step.

  In the present embodiment, the laser beam L is passed through the through hole 98 in the joining step. The beam diameter of the laser beam L is set so that the laser beam L is not irradiated to the outside of the through hole 98. Thereby, it is possible to prevent the laser light L from being transmitted through the support substrate 9. Therefore, the irradiation amount (irradiation energy) of the laser beam L can be increased. As a result, the terminal 931 and the S1 connection terminal 801b can be welded in a shorter time.

  When viewed from above, the portion outside the through hole 98 of the connection terminal 931 is not directly irradiated with the laser light L, but is welded by heat from the portion irradiated with the laser light L.

  Further, the through hole 98 may be opened on the right side in FIG. Adjacent through holes 98 may communicate with each other.

  In such a second embodiment, the same effect as that of the first embodiment can be obtained.

<Third Embodiment>
FIG. 9 is an enlarged cross-sectional view for explaining a joining step of the third embodiment of the method for manufacturing an electronic component of the present invention.

  Hereinafter, the third embodiment of the method of manufacturing an electronic component according to the present invention will be described with reference to the drawings. However, the difference from the above-described embodiment will be mainly described, and the description of the same matters will be omitted.

  This embodiment is substantially the same as the second embodiment except that a joining member is mainly provided.

  As shown in FIG. 9, prior to the joining step, a joining member (joining material) 10 made of a metal material is interposed between the connection terminal 931 and the S1 connection terminal 801b. In this inserted state, the through hole 98 and the joining member 10 overlap when viewed from above.

  And in a joining process, the laser beam L is irradiated to the joining member 10 through the through-hole 98 in this insertion state. Thereby, the joining member 10 is melted, and the portions of the connection terminal 931 and the S1 connection terminal 801b that are in contact with the joining member 10 are also melted. Thereby, the joining member 10, the connection terminal 931, and the S1 connection terminal 801b are mixed together, and these are joined by returning to normal temperature.

  Thus, in this embodiment, the connection terminal 931 and the S1 connection terminal 801b are welded together with the joining member 10. Thereby, since the joining member 10 is provided, the part welded increases and joining strength becomes high.

  In addition, the constituent material of the joining member 10 may be the same as that of the connection terminal 931 and the S1 connection terminal 801b, and may differ. In the latter case, it is preferable to use a material having high affinity for the constituent materials of the connection terminal 931 and the S1 connection terminal 801b.

  Also according to the third embodiment, the same effects as those of the second embodiment can be obtained.

<Fourth embodiment>
FIG. 10 is an enlarged cross-sectional view for explaining the joining step of the fourth embodiment of the electronic component manufacturing method of the present invention.

  Hereinafter, the fourth embodiment of the method for manufacturing an electronic component according to the present invention will be described with reference to the drawings. However, the difference from the above-described embodiment will be mainly described, and the description of the same matters will be omitted.

  This embodiment is substantially the same as the third embodiment except that the shape of the joining member is mainly different.

  As illustrated in FIG. 10, the bonding member 10 </ b> A has a protruding portion 101 that protrudes toward the support substrate 9 and is inserted into the through hole 98 in the inserted state. Further, the connection terminal 931 has a portion that is also provided on the inner surface of the through hole 98.

  In the joining step, the laser beam L is irradiated toward the protruding portion 101 (joining member 10A). Thereby, the connection terminal 931 and the S1 connection terminal 801b are welded together with the joining member 10A. Further, after welding, as shown by a two-dot chain line in FIG. 10, the protruding portion 101 is hardened in a state of entering the through hole 98 and is welded to the connection terminal 931 in the through hole 98. . As a result, since the connection terminal 931 and the protrusion 101 in the through hole 98 are welded, the terminal 931 and the S1 connection terminal 801b can be electrically connected more effectively than in the third embodiment. In addition, the bonding strength can be improved.

  Also according to the fourth embodiment, the same effects as those of the third embodiment can be obtained.

<Fifth Embodiment>
FIG. 11 is an enlarged cross-sectional view for explaining a joining step of the fifth embodiment of the method for manufacturing an electronic component of the present invention.

  Hereinafter, the fifth embodiment of the method for manufacturing an electronic component of the present invention will be described with reference to the drawings. However, the difference from the above-described embodiment will be mainly described, and the description of the same matters will be omitted.

  This embodiment is substantially the same as the first embodiment except that the shape of the joining member and the configuration of the connection terminals are mainly different.

  As shown in FIG. 11, in the support substrate 9, the connection terminals 931 are provided on the upper surface of the support substrate 9.

  In the joining process, the support substrate 9 and the base 6 are joined via the joining member 10B. Moreover, this joining member 10B is comprised with the material which does not have electroconductivity, such as a resin material, for example.

  Then, after bonding of the support substrate 9 and the package 5, a bonding wire (conductive portion) 11 is installed between the connection terminal 931 and the S1 connection terminal 801 b. Thereby, the terminal 931 and the S1 connection terminal 801b can be electrically connected.

  Thus, according to the present embodiment, the bonding member 10B is responsible for mechanical joining between the support substrate 9 and the package 5, and the bonding wire 11 is responsible for electrical connection between the connection terminal 931 and the S1 connection terminal 801b. ing.

  Note that the bonding member 10B may have conductivity. In this case, the same joining method as in the third embodiment and the fourth embodiment can be applied. When the joining member 10B has conductivity, the joining member 10B and the bonding wire 11 are responsible for electrical connection between the connection terminal 931 and the S1 connection terminal 801b. Therefore, the physical quantity sensor 1 with higher reliability can be obtained.

  Further, in the present embodiment, the connection terminal 931 is provided on the upper surface side of the support substrate 9, but may be provided on the lower surface side as in the above-described embodiments of the support substrate 9.

  According to the fifth embodiment, the same effect as that of the first embodiment can be obtained.

<Sixth Embodiment>
FIG. 12 is a perspective view for explaining the joining step of the sixth embodiment of the method for manufacturing an electronic component of the present invention. FIG. 13: is an expanded sectional view for demonstrating the joining process of 6th Embodiment of the manufacturing method of the electronic component of this invention.

  Hereinafter, the sixth embodiment of the method for manufacturing an electronic component according to the present invention will be described with reference to the drawings. However, the difference from the above-described embodiment will be mainly described, and the description of the same matters will be omitted.

  The present embodiment is substantially the same as the third embodiment except that the welding method in the joining process is mainly different.

  As shown in FIG. 12, in the joining step, the support substrate 9 is pressed toward the base 6 of the package 5 with two block-shaped jigs 12. At this time, one jig 12 collectively presses portions corresponding to the connection terminals 921, 931, and 941 on the upper surface of the support substrate 9 with pressure P (see FIG. 13), while the other jig 12 supports The portions corresponding to the connection terminals 951, 961, 971 on the upper surface of the substrate 9 are pressed together with the pressure P.

  Each jig 12 has a heating element 121 and heats the connection terminals 921, 931, 941 and the connection terminals 951, 961, 971 through the support substrate 9 while performing the above pressing. be able to. Hereinafter, like the above embodiment, a portion surrounded by a broken line in FIG. 12 will be representatively described.

  Prior to pressing the support substrate 9 with the jig 12, a conductive adhesive (joining material) 13 is inserted between the connection terminal 931 and the S1 connection terminal 801b. Then, as shown in FIG. 13, in this inserted state, the jig 12 presses the connection terminal 931, the conductive adhesive 13, and the S1 connection terminal 801b and heats them to apply heat Q. Thereby, a metal bond (interatomic bond) can be formed between the connection terminal 931 and the S1 connection terminal 801b, and the connection terminal 931 and the S1 connection terminal 801b can be welded (pressure contact).

  The conductive adhesive 13 is not particularly limited as long as it has electrical conductivity. For example, an epoxy or acrylic resin mixed with a conductive filler can be used.

  According to such 6th Embodiment, although the conductive adhesive 13 is used, the effect similar to 1st Embodiment can be acquired. Furthermore, the support substrate 9 and the package 5 can be easily joined via the conductive adhesive 13 by a simple method in which the jig 12 presses the portions corresponding to the terminals together.

  When the support substrate 9 is pressed while being heated by the jig 12, a pressing mark (concave portion) 15 along the outer shape of the jig 12 is formed in the pressed portion. By visually recognizing this pressing mark 15, it can be recognized that the joining of the terminals on the lower side of the pressing mark 15 has been completed.

<Seventh embodiment>
FIG. 14 is a perspective view for explaining a joining step of the seventh embodiment of the method for manufacturing an electronic component of the present invention.

Hereinafter, the seventh embodiment of the method for manufacturing an electronic component according to the present invention will be described with reference to the drawings. However, the difference from the above-described embodiment will be mainly described, and the description of the same matters will be omitted.
This embodiment is substantially the same as the sixth embodiment except that the configuration of the support substrate is different.

  As shown in FIG. 14, in this embodiment, the length of the support substrate 9 in the X-axis direction is shorter than the length in the sixth embodiment. Therefore, the connection terminals 921 to 941 are exposed (projected) on the + X axis side of the support substrate 9, and the connection terminals 951 to 971 are exposed (projected) on the −X axis side of the support substrate 9. .

  Such a support substrate 9 can be obtained by, for example, grinding and removing the support substrate 9 in the sixth embodiment prior to the bonding step.

  Further, in the joining step, the connection terminals 921 to 941 are directly pressed together with one jig 12 and the connection terminals 951 to 971 are pressed together directly with the other jig 12. Thereby, the same effect as that of the sixth embodiment can be obtained. Furthermore, in this embodiment, it is possible to avoid pressing the support substrate 9 directly with each jig 12. Therefore, deformation or the like of the support substrate 9 in the bonding process can be prevented or suppressed.

<Eighth Embodiment>
FIG. 15 is an enlarged cross-sectional view for explaining the joining step of the eighth embodiment of the method for manufacturing an electronic component of the present invention.

Hereinafter, the eighth embodiment of the method of manufacturing an electronic component according to the present invention will be described with reference to the drawings. However, the difference from the above-described embodiment will be mainly described, and the description of the same matters will be omitted.
This embodiment is substantially the same as the seventh embodiment except that the configuration of the support substrate is different.

  As shown in FIG. 15, the jig 12 includes an ultrasonic transducer 122 in addition to the heating element 121. Thereby, ultrasonic vibration can be given to the connection terminal 931 and the S1 connection terminal 801b by making the jig 12 abut on the upper side of the connection terminal 931 of the support substrate 9.

  As shown in FIG. 15, in the joining step, the connection terminal 931 and the S1 connection terminal 801b are pressed and heated from the upper side of the connection terminal 931 of the support substrate 9 toward the package 5, and further heated. Give sonic vibration. Thereby, in particular, atomic diffusion can be promoted at the interface between the connection terminal 931 and the S1 connection terminal 801b by ultrasonic vibration, and a metal bond can be formed. And this and this together with the formation of metal bonds by heating and pressurization, more metal bonds can be formed in a short time between the connection terminal 931 and the S1 connection terminal 801b. Therefore, the connection terminal 931 and the S1 connection terminal 801b can be welded in a shorter time, and the productivity is excellent.

  In the present embodiment, in the joining step, in addition to ultrasonic vibration, pressurization and heating are performed. However, at least the ultrasonic vibration is applied to the connection terminal 931 and the S1 connection terminal 801b, so that the above effect can be achieved. it can. Further, application of ultrasonic vibration and pressurization may be performed, and application of ultrasonic vibration and heating may be performed.

<Ninth Embodiment>
FIG. 16 is a perspective view for explaining a support substrate in the ninth embodiment of the electronic component manufacturing method of the present invention.

Hereinafter, the ninth embodiment of the electronic component manufacturing method of the present invention will be described with reference to the drawings. However, the difference from the above-described embodiment will be mainly described, and the description of the same matters will be omitted.
This embodiment is substantially the same as the sixth embodiment except that the configuration of the support substrate is different.

  As shown in FIG. 16, the base 91 of the support substrate 9 has portions 911 and 912 that extend in the X-axis direction. The portion 911 and the portion 912 are arranged in this order from the + Y axis side. In addition, each of the portions 911 and 912 has a slit 913 formed at a substantially central portion in the longitudinal direction.

  Each slit 913 penetrates in the thickness direction of the support substrate 9 and opens to the opening 910. Thereby, since the slits 913 are formed, the portions 911 and 912 can be expanded and contracted in the direction of the arrow in the figure. Therefore, even if a force is applied in the direction of the arrow in the figure, the portions 911 and 912 can be expanded and contracted, so that it can be prevented or suppressed from being bent and deformed in a side view of the support substrate 9. As a result, the influence on the gyro element 2 due to the bending deformation of the support substrate 9 can be reduced. Thus, the slit 913 functions as a stress relaxation part.

  In particular, in the bonding process, the temperature of the entire support substrate 9 rises, and the base 91 generates thermal stress in the direction of the arrow in the figure due to thermal stress. By forming 913, the thermal stress of the portions 911 and 912 can be released by expanding and contracting in the direction of the arrow. Thereby, it can prevent or suppress that the support substrate 9 deform | transforms at a joining process.

<Tenth Embodiment>
FIG. 17 is a perspective view for explaining a support substrate in the tenth embodiment of the electronic component manufacturing method of the invention.

  Hereinafter, a tenth embodiment of a method for manufacturing an electronic component according to the present invention will be described with reference to the drawings. The tenth embodiment will be described mainly with respect to differences from the above-described embodiment, and the same matters will not be described.

This embodiment is substantially the same as the ninth embodiment except that the shape of the support substrate is different.
As shown in FIG. 17, a plurality of slits 913 (three in the present embodiment) are formed in the portions 911 and 912 of the support substrate 9. Since the portions 911 and 912 have substantially the same configuration, the portion 911 will be representatively described below.

  The three slits 913 are spaced apart at equal intervals in the X-axis direction. The slit 913 located in the middle of the three slits 913 is opened in the −Y axis direction, and the other two slits 913 are opened in the + Y axis direction. As described above, the direction in which the adjacent slits 913 are opened in the Y-axis direction is different, so that the portion 911 has a crank-shaped central portion in the longitudinal direction. For this reason, the portion 911 can be expanded and contracted in the X-axis direction. Therefore, the portion (the central portion in the longitudinal direction) where the slit 913 of the portion 911 is formed can more effectively exhibit the function as the stress relaxation portion than the ninth embodiment.

2. Electronic Device Next, an electronic device to which the physical quantity sensor 1 is applied will be described in detail with reference to FIGS.

  FIG. 18 is a perspective view showing a configuration of a mobile (or notebook) personal computer to which an electronic device including the electronic component of the present invention is applied. In this figure, a personal computer 1100 includes a main body portion 1104 provided with a keyboard 1102 and a display unit 1106 provided with a display portion 1108. The display unit 1106 is rotated with respect to the main body portion 1104 via a hinge structure portion. It is supported movably. Such a personal computer 1100 incorporates a physical quantity sensor 1 that functions as angular velocity detection means.

  FIG. 19 is a perspective view showing a configuration of a mobile phone (including PHS) to which an electronic device including the electronic component of the present invention is applied. In this figure, a cellular phone 1200 includes a plurality of operation buttons 1202, an earpiece 1204, and a mouthpiece 1206, and a display unit 1208 is disposed between the operation buttons 1202 and the earpiece 1204. Such a cellular phone 1200 incorporates a physical quantity sensor 1 that functions as angular velocity detection means.

  FIG. 20 is a perspective view illustrating a configuration of a digital still camera to which an electronic device including the electronic component of the present invention is applied. In this figure, connection with an external device is also simply shown. Here, an ordinary camera sensitizes a silver halide photographic film with a light image of a subject, whereas a digital still camera 1300 photoelectrically converts a light image of a subject with an imaging device such as a CCD (Charge Coupled Device). An imaging signal (image signal) is generated.

  A display unit is provided on the back of a case (body) 1302 in the digital still camera 1300, and is configured to perform display based on an imaging signal from the CCD. The display unit 1310 displays a subject as an electronic image. Function as.

  A light receiving unit 1304 including an optical lens (imaging optical system), a CCD, and the like is provided on the front side (the back side in the drawing) of the case 1302.

  When the photographer confirms the subject image displayed on the display unit and presses the shutter button 1306, the CCD image pickup signal at that time is transferred and stored in the memory 1308.

  In the digital still camera 1300, a video signal output terminal 1312 and an input / output terminal 1314 for data communication are provided on the side surface of the case 1302. As shown in the figure, a television monitor 1430 is connected to the video signal output terminal 1312 and a personal computer 1440 is connected to the input / output terminal 1314 for data communication as necessary. Further, the imaging signal stored in the memory 1308 is output to the television monitor 1430 or the personal computer 1440 by a predetermined operation.

  Such a digital still camera 1300 incorporates a physical quantity sensor 1 that functions as angular velocity detection means.

  In addition to the personal computer of FIG. 18 (mobile personal computer), the mobile phone of FIG. 19, and the digital still camera of FIG. Inkjet printers), laptop personal computers, televisions, video cameras, video tape recorders, car navigation devices, pagers, electronic notebooks (including those with communication functions), electronic dictionaries, calculators, electronic game devices, word processors, workstations, televisions Telephone, crime prevention TV monitor, electronic binoculars, POS terminal, medical equipment (for example, electronic thermometer, blood pressure monitor, blood glucose meter, electrocardiogram measuring device, ultrasonic diagnostic device, electronic endoscope), fish detector, various measuring devices, instruments Class (eg, vehicle, aircraft) Gauges of a ship), can be applied to a flight simulator or the like.

3. Next, a moving body to which the physical quantity sensor shown in FIG. 1 is applied will be described in detail with reference to FIG.

  FIG. 21 is a perspective view showing a configuration of an automobile to which a moving body including an electronic component of the present invention is applied. The automobile 1500 has a built-in physical quantity sensor 1 that functions as an angular velocity detection means, and the physical quantity sensor 1 can detect the posture of the vehicle body 1501. A signal from the physical quantity sensor 1 is supplied to the vehicle body posture control device 1502, and the vehicle body posture control device 1502 detects the posture of the vehicle body 1501 based on the signal, and controls the stiffness of the suspension according to the detection result. The brakes of the individual wheels 1503 can be controlled. In addition, such posture control can be used by a biped robot or a radio control helicopter. As described above, the physical quantity sensor 1 is incorporated in realizing the posture control of various moving objects.

  The electronic component manufacturing method, the electronic component, the electronic device, and the moving body of the present invention have been described based on the illustrated embodiment. However, the present invention is not limited to this, and the configuration of each part is the same. Any structure having a function can be substituted. In addition, any other component may be added to the present invention. Further, the present invention may be a combination of any two or more configurations (processes) of the above embodiments.

  In addition, although the support substrate (1st structure) is comprised by the TAB board | substrate, it is not limited to this in this invention, For example, a quartz may be sufficient. In this case, the vibration piece and a frame-shaped support substrate provided so as to surround the vibration piece can be integrally configured.

  In each of the above embodiments, the laser beam is irradiated from a substantially vertical direction with respect to the support substrate. However, the present invention is not limited to this, and the laser beam is irradiated with being inclined with respect to the normal direction of the support substrate. Also good. Thereby, the light source of the laser beam L is fixed, for example, above the center portion of the support substrate (the center of gravity of the gyro element), and welding is performed by irradiating each connection terminal while changing the direction of the laser beam. It can be carried out. That is, welding can be omitted while relatively shifting the laser light source and the support substrate.

In the present embodiment, since the package (second structure) does not have optical transparency, laser light is irradiated from the support substrate side, but when the package has optical transparency, The laser beam L may be irradiated from either side of the support substrate and the package. In this case, it is preferable to irradiate the laser beam from the side of the structure body having the smaller thickness between the support substrate and the package. Thereby, welding can be performed rapidly.
Further, the laser beam may be irradiated from both sides of the support substrate and the package.

  In each of the above embodiments, the jig has a heating element and an ultrasonic vibrator. However, the present invention is not limited to this, and the jig is simply connected to the heating element and the ultrasonic vibrator. Good.

1 …… Physical quantity sensor (electronic parts)
2 …… Gyro element 3 …… Vibration piece 31 …… Base 321 …… First detection arm 322 …… Second detection arm 331 …… First connecting arm 332 …… Second connecting arm 341 …… First driving arm 342 2nd drive arm 343 3rd drive arm 344 4th drive arm 351 ... groove 411 1st detection signal electrode 412 1st detection signal terminal 421 1st detection ground electrode 422 ... first detection ground terminal 431 ... second detection signal electrode 432 ... second detection signal terminal 441 ... second detection ground electrode 442 ... second detection ground terminal 451 ... drive signal electrode 452 ... drive signal terminal 461... Drive ground electrode 462... Drive ground terminal 5... Package 6... Base 61 .. Recess 7... Lid 801b... S1 connection terminal 802b ... S2 connection terminal 803b '. ... GND connection terminal 8 04b DS connection terminal 805b DG connection terminal 9 support substrate 91 base 910 opening 911 part 912 part 913 slit 92 bonding lead 921 connection terminal 93 ... Bonding lead 931 ... Connection terminal 94 ... Bonding lead 941 ... Connection terminal 95 ... Bonding lead 951 ... Connection terminal 96 ... Bonding lead 961 ... Connection terminal 97 ... Bonding lead 971 ... Connection terminal 98 ... ... Through hole 10 ... Joining member 10A ... Joining member 10B ... Joining member 11 ... Bonding wire 12 ... Jig 13 ... Conductive adhesive 14 ... Laser mark 15 ... Pressing mark 101 ... Projection 121 .... Heat 122 ... Ultrasonic vibrator 1100 ... Personal computer 1102 ... Keyboard 1104... Main unit 1106... Display unit 1108... Display unit 1200... Mobile phone 1202 .. Operation button 1204 .. Earpiece 1206. Case 1304 ... Light receiving unit 1306 ... Shutter button 1308 ... Memory 1310 ... Display unit 1312 ... Video signal output terminal 1314 ... Input / output terminal 1430 ... TV monitor 1440 ... Personal computer 1500 ... Car 1501 ... Car body 1502 ... Car body attitude control device 1503 ... Wheel 3211 ... Hammer head 3221 ... Hammer head 3411 ... Hammer head 3421 ... Hammer head 3441 ... Hammer head G ... Center of gravity L ... Za light P ...... pressure Q ...... heat S ...... interior space ω ...... angular velocity

Claims (12)

A manufacturing method for manufacturing the electronic component by joining the first terminal and the second terminal of an electronic component including a first structure having a first terminal and a second structure having a second terminal. And
In a state where the first terminal and the second terminal are arranged to face each other, at least one of the first terminal and the second terminal is irradiated with a laser to be welded to the other terminal. A method for manufacturing an electronic component.   The method of manufacturing an electronic component according to claim 1, wherein the laser is irradiated in a state where the first terminal and the second terminal are in contact with each other.   Prior to irradiating the laser, a conductive bonding material is interposed between the first terminal and the second terminal, and the first terminal and the second terminal are welded together with the bonding material. Item 3. A method for manufacturing an electronic component according to Item 1 or 2. At least one of the first structure and the second structure has a plate-like portion,
The plate-like portion is formed with a hole leading to the one terminal,
The method of manufacturing an electronic component according to claim 1, wherein the laser is passed through the hole. A manufacturing method for manufacturing the electronic component by joining the first terminal and the second terminal of an electronic component including a first structure having a first terminal and a second structure having a second terminal. And
In a state where the first terminal and the second terminal are arranged to face each other, a conductive bonding material is interposed between the first terminal and the second terminal. A method for manufacturing an electronic component, wherein the first terminal and the second terminal are welded through the bonding material while being pressurized and heated.   6. The jig having a heating element presses one of the first structure and the second structure toward the other structure to pressurize and heat the bonding material. The manufacturing method of the electronic component of description. A manufacturing method for joining the first terminal and the second terminal of an electronic component comprising a first structure having a first terminal and a second structure having a second terminal,
In a state where the first terminal and the second terminal face each other, by applying ultrasonic waves to the first terminal and the second terminal, the first terminal and the second terminal are An electronic component manufacturing method comprising welding.   While applying the ultrasonic wave, pressurizing one structure out of the first structure and the second structure toward the other structure, and the first terminal and the second terminal The method for manufacturing an electronic component according to claim 7, wherein at least one of the heating of at least one of the terminals is performed. A manufacturing method for manufacturing an electronic component comprising a first structure having a first terminal and a second structure having a second terminal,
While joining the 1st structure and the 2nd structure via an adhesive agent, a long conductive part is constructed between the 1st terminal and the 2nd terminal, and the 1st terminal And the second terminal are electrically connected to each other.   An electronic component manufactured by the method for manufacturing an electronic component according to claim 1.   An electronic device comprising the electronic component according to claim 10.   A moving body comprising the electronic component according to claim 10.

Images