JP2015206691A - Method for manufacturing vibration piece, vibration piece, electronic equipment, and mobile body - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a vibration piece, by which chipping of an electrode can be decreased, a vibration piece obtained by the method, electronic equipment, and a mobile body.SOLUTION: The method for manufacturing a vibration piece includes: a metal film formation step of forming a metal film 30 to be an electrode on an inner face of a groove 233 of a detection vibration arm 231; a resist mask formation step of forming a photoresist film 40 on a surface of the metal film 30; and an exposure step of irradiating a part of the photoresist film 40 with light L to expose. The inner face of the groove 233 includes a face 233D where the electrode is formed and an inclined face 233B that reflects the light L if the groove is irradiated with the light L, so as to irradiate the face 233D with the light L. In the exposure step, fixtures 4A, 4B for blocking the light L directing to the inclined face 233B are disposed.

Description

  The present invention relates to a method for manufacturing a vibrating piece, a vibrating piece, an electronic device, and a moving body.

  The vibration piece is used for, for example, vehicle body control in a vehicle, vehicle position detection of a car navigation system, vibration control correction (so-called camera shake correction) of a digital camera, a video camera, etc., and detects physical quantities such as angular velocity and acceleration. Sensors are known. As a sensor, for example, an angular velocity sensor (vibration gyro sensor) is known (see, for example, Patent Document 1).

  For example, a vibration gyro sensor described in Patent Document 1 includes a base (tuning fork base), a drive arm (tuning fork arm) and a detection arm (tuning fork arm) that extend from the base and have grooves, and are piezoelectric substrates. And an electrode formed on the surface of the piezoelectric substrate. When such a vibration gyro sensor receives an angular velocity in a predetermined direction in a state where the drive arm is flexibly vibrated, a Coriolis force acts on the drive arm, and accordingly, the detection arm is flexed and vibrated. The angular velocity can be detected by detecting the bending vibration of such a detection arm with an electrode.

  Such a vibration gyro sensor is manufactured through the following seven steps (1) to (7).

(1) A piezoelectric substrate is formed by etching.
(2) A metal film to be an electrode is formed on the piezoelectric substrate.
(3) A resist mask is formed on the metal film.
(4) A part of the resist mask is irradiated with exposure light.
(5) The resist mask irradiated with the exposure light is removed.
(6) The exposed metal film is removed from the remaining resist mask.
(7) The remaining resist mask is removed.

JP2013-231635A

  By the way, when the piezoelectric substrate is made of quartz, the quartz has anisotropy. Therefore, after the etching in the step (1), the remaining portion remaining unintentionally on the piezoelectric substrate, particularly on the inner surface of the groove. Is formed. In step (4), when the remaining portion is irradiated with exposure light, depending on the shape of the remaining portion, the light reflected by the remaining portion is directed toward the inner surface of the groove. In this case, the resist mask on the inner surface of the groove is unintentionally exposed, and the remaining portion of the resist mask is removed in step (5). For this reason, in process (6), the site | part which should remain | survive (part which should become an electrode) of a metal film is removed. As a result, in the obtained vibration gyro sensor, there is a possibility that problems such as disconnection due to the loss of the electrode may occur.

  An object of the present invention is to provide a method for manufacturing a resonator element capable of preventing or suppressing the loss of an electrode, a resonator element obtained by such a method, an electronic device, and a moving body.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following application examples.

[Application Example 1]
The method for manufacturing a resonator element according to the invention includes a piezoelectric substrate having a base and a vibrating arm extending from the base, wherein a groove extending along a longitudinal direction of the vibrating arm is formed, and the groove A manufacturing method for manufacturing a resonator element including an electrode provided on the inner surface of
A metal film forming step of forming a metal film to be the electrode on the inner surface of the groove;
A resist mask forming step of forming a resist mask on the surface of the metal film;
An exposure step of irradiating and exposing a part of the resist mask with light,
The inner surface of the groove has an electrode forming surface on which the electrode is formed, and a light reflecting surface on which the light is reflected when the light is irradiated and the light is irradiated on the electrode forming surface. And
In the exposure step, a shielding portion that shields the light directed to the light reflecting surface is provided.

  Thereby, it can prevent that light injects into a light reflection surface. Therefore, it is possible to prevent the light reflected by the light reflecting surface from being applied to the resist mask on the electrode forming surface. As a result, it is possible to prevent a defective portion from being formed in the electrode on the electrode formation surface.

[Application Example 2]
In the method for manufacturing a resonator element according to the aspect of the invention, the shielding portion is formed of a plate material having a through-hole penetrating in the thickness direction.
In the exposure step, it is preferable that the light reflecting surface and the through hole do not overlap in a plan view of the shielding portion.

  Thereby, it can prevent reliably that light injects into a light reflection surface. Therefore, it is possible to reliably prevent the light reflected by the light reflecting surface from being applied to the resist mask on the electrode forming surface.

[Application Example 3]
In the method for manufacturing a resonator element according to the aspect of the invention, it is preferable that in the exposure step, the light is irradiated from the thickness direction of the piezoelectric substrate toward the piezoelectric substrate.

  Thereby, light can be effectively irradiated to the resist mask provided on the surface of the outer surface of the piezoelectric substrate that intersects the thickness direction.

[Application Example 4]
In the method of manufacturing a resonator element according to the aspect of the invention, it is preferable that in the exposure step, the light is irradiated from the direction intersecting the thickness direction of the piezoelectric substrate toward the piezoelectric substrate.

  Thereby, light can be effectively irradiated to the resist mask provided on the surface in the thickness direction of the outer surface of the piezoelectric substrate.

[Application Example 5]
In the method for manufacturing a resonator element according to the aspect of the invention, it is preferable that the piezoelectric substrate is formed of a Z-cut quartz plate.
Thereby, the effect of this invention can be show | played reliably.

[Application Example 6]
In the method for manufacturing a resonator element according to the aspect of the invention, the inner surface of the groove has a bottom surface whose normal is the Z axis of the crystal axis of the piezoelectric substrate,
In the exposure step, it is preferable that at least the bottom surface is irradiated with the light.

  Thereby, it can prevent or suppress that an electrode formation surface is irradiated with light effectively.

[Application Example 7]
In the method for manufacturing a resonator element according to the aspect of the invention, the light reflecting surface is an inclined surface that is inclined with respect to the Z axis of the crystal axis of the piezoelectric substrate,
It is preferable that the electrode forming surface is constituted by a plane whose normal is the X axis of the crystal axis of the piezoelectric substrate.
Thereby, the effect of this invention can be show | played effectively.

[Application Example 8]
In the method for manufacturing a resonator element according to the aspect of the invention, it is preferable to include a detection step of detecting the position of the light reflecting surface prior to the exposure step.
Thereby, before performing an exposure process, the position of a light reflection surface can be grasped | ascertained reliably.

[Application Example 9]
The resonator element according to the invention is manufactured by the method for manufacturing a resonator element according to the invention.

  As a result, it is possible to eliminate the occurrence of defects in the electrode and to obtain a highly reliable resonator element.

[Application Example 10]
An electronic apparatus according to the present invention includes the resonator element according to the present invention.
Thereby, an electronic device with high reliability can be obtained.

[Application Example 11]
The moving body of the present invention includes the resonator element of the present invention.
Thereby, a mobile body with high reliability can be obtained.

FIG. 1 is a plan view showing a resonator element manufactured by the method for manufacturing a resonator element of the present invention. FIG. 2 is a transmission diagram of the resonator element illustrated in FIG. 1. FIG. 3 is a cross-sectional view taken along line AA in FIG. 4A to 4C are diagrams for explaining the method of manufacturing the resonator element according to the invention. 5A to 5C are diagrams for explaining the method of manufacturing the resonator element according to the invention. FIG. 6 is a cross-sectional view showing a resonator element manufactured according to the second embodiment of the method of manufacturing a resonator element of the present invention. FIG. 7 is a cross-sectional view showing a resonator element manufactured according to the third embodiment of the method of manufacturing a resonator element of the present invention. FIG. 8 is a cross-sectional view showing a resonator element manufactured according to the fourth embodiment of the method of manufacturing a resonator element of the invention. FIG. 9 is a cross-sectional view showing a resonator element manufactured according to the fifth embodiment of the method of manufacturing a resonator element of the invention. FIG. 10 is a cross-sectional view illustrating a preferred embodiment of a physical quantity detection device including the resonator element illustrated in FIG. FIG. 11 is a plan view illustrating a preferred embodiment of a physical quantity detection device including the resonator element illustrated in FIG. 1. FIG. 12 is a perspective view illustrating a configuration of a mobile (or notebook) personal computer to which an electronic device including the resonator element illustrated in FIG. 1 is applied. FIG. 13 is a perspective view illustrating a configuration of a mobile phone (including PHS) to which the electronic device including the resonator element illustrated in FIG. 1 is applied. FIG. 14 is a perspective view illustrating a configuration of a digital still camera to which an electronic device including the resonator element illustrated in FIG. 1 is applied. FIG. 15 is a perspective view illustrating a configuration of an automobile to which a moving body including the resonator element illustrated in FIG. 1 is applied.

  Hereinafter, a method for manufacturing a resonator element, a resonator element, an electronic device, and a moving body according to the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.

1. Vibrating piece <First embodiment>
FIG. 1 is a plan view showing a resonator element manufactured by the method for manufacturing a resonator element of the present invention. FIG. 2 is a transmission diagram of the resonator element illustrated in FIG. 1. FIG. 3 is a cross-sectional view taken along line AA in FIG. 4A to 4C are diagrams for explaining the method of manufacturing the resonator element according to the invention. 5A to 5C are diagrams for explaining the method of manufacturing the resonator element according to the invention.

  In the following, for convenience of explanation, in each drawing, the X axis, the Y axis, and the Z axis are illustrated as three axes orthogonal to each other, and the direction parallel to the X axis is referred to as the “X axis direction” and the Y axis. The direction parallel to is called the “Y-axis direction” and the direction parallel to the Z-axis is called the “Z-axis direction”. The + Z-axis side is also referred to as “upper” and the −Z-axis side is also referred to as “lower”. 3 to 5 representatively illustrate one detection vibrating arm of the piezoelectric substrate.

First, the resonator element 2 manufactured by the method for manufacturing a resonator element of the present invention will be described.
1 and 2 includes a piezoelectric substrate 20 and an electrode formed on the piezoelectric substrate 20.

-Vibration substrate-
Examples of the constituent material of the piezoelectric substrate 20 include piezoelectric materials such as quartz, lithium tantalate, and lithium niobate. Among these, it is preferable to use quartz as a constituent material of the piezoelectric substrate 20. By using quartz, the resonator element 2 having excellent frequency temperature characteristics as compared with other materials can be obtained. Hereinafter, a case where the piezoelectric substrate 20 is made of quartz will be described.

  As shown in FIG. 1, the piezoelectric substrate 20 has a spread in an XY plane defined by a Y axis (mechanical axis) and an X axis (electric axis) that are crystal axes of the quartz substrate, and a Z axis (optical axis). It has a plate shape with a thickness in the direction. That is, the piezoelectric substrate 20 is composed of a Z-cut quartz plate. The Z-axis preferably coincides with the thickness direction of the piezoelectric substrate 20, but it is slightly (for example, less than about 5 °) with respect to the thickness direction from the viewpoint of reducing the frequency temperature change near normal temperature. You may tilt.

Note that the thickness of the piezoelectric substrate 20 is not particularly limited, and is about 40 to 300 μm.
Such a piezoelectric substrate 20 includes a base 21, a driving vibration arm 221 and a driving vibration arm 222, a detection vibration arm 231 and a detection vibration arm 232, a support portion (frame body) 25, and four connections. Parts 261, 262, 263, and 264.

  The driving vibrating arm 221 and the driving vibrating arm 222 extend in the −Y axis direction from different positions of the base portion 21. The driving vibrating arm 221 and the driving vibrating arm 222 are arranged in this order from the −X axis direction to the + X axis direction. Further, a weight portion 2211 is provided at the distal end portion of the driving vibration arm 221, and a weight portion 2221 is provided at the distal end portion of the driving vibration arm 222. The drive vibrating arms 221 and 222 are provided symmetrically with respect to the YZ plane that intersects the center of gravity of the vibrating piece 2.

  Further, since the drive vibrating arm 221 and the drive vibrating arm 222 have the same configuration, the drive vibrating arm 221 will be representatively described below.

  As shown in FIGS. 1 and 2, a bottomed groove 223 that is open to the upper surface and the lower surface is formed in a portion excluding the weight portion 2211 of the driving vibrating arm 221. For this reason, the cross-sectional shape of the drive vibrating arm 221 has an “H” shape over the entire length in the longitudinal direction of the portion excluding the weight portion 2211. As a result, an interval in the X-axis direction between a drive signal electrode 331 and a drive ground electrode 341 described later is reduced. Therefore, the electric field efficiency between the drive signal electrode 331 and the drive ground electrode 341 is improved. As a result, the drive vibrating arm 221 can generate a relatively large amount of charge with a relatively small amount of distortion. Therefore, the resonator element 2 having excellent sensitivity can be obtained.

  The detection vibrating arm 231 and the detection vibrating arm 232 are opposite to the extending direction of the driving vibrating arm 221 and the driving vibrating arm 222 from a position different from the driving vibrating arm 221 and the driving vibrating arm 222 of the base 21. That is, it extends in the + Y axis direction. The detection vibrating arm 231 and the detection vibrating arm 232 are arranged in this order from the −X axis direction to the + X axis direction. Further, a weight portion 2311 is provided at the distal end portion of the detection vibrating arm 231, and a weight portion 2321 is provided at the distal end portion of the detection vibrating arm 232. The detection vibrating arms 231 and 232 are provided symmetrically with respect to the YZ plane that intersects the center of gravity of the vibrating piece 2.

  Further, since the detection vibrating arms 231 and 232 have the same configuration, the detection vibrating arm 231 will be representatively described below.

  As shown in FIG. 3, a bottomed groove 233 that opens to the upper surface 234 and the lower surface 235 is formed in a portion excluding the weight portion 2311 of the vibrating arm 231 for detection. For this reason, the cross-sectional shape of the drive vibrating arm 221 has an “H” shape over the entire length in the longitudinal direction of the portion excluding the weight portion 2211. As a result, an interval in the X-axis direction between a drive signal electrode 331 and a drive ground electrode 341 described later is reduced. Therefore, the electric field efficiency between the drive signal electrode 331 and the drive ground electrode 341 is improved. As a result, the detection vibrating arm 231 can generate a relatively large amount of charge with a relatively small amount of distortion. Therefore, the resonator element 2 having excellent sensitivity can be obtained.

  As shown in FIG. 3, in the detection vibrating arms 231 and 232, the inner surfaces of the grooves 233 on the upper surface side of the detection vibrating arms 231 are inclined surfaces 233A inclined with respect to the YZ plane (Z axis), respectively. 233B, 233C, and surface 233D (the same applies to the vibrating arm 232 for detection).

  In the vibrating arm for detection 231, the inclined surfaces 233A to 233C are formed because the piezoelectric substrate 20 is formed of a Z-cut quartz plate. Since quartz has anisotropy, inclined surfaces 233A to 233C are inevitably formed when the detection vibrating arms 231 and 232 are formed by etching.

  Similarly, inclined surfaces 233A to 233C and a surface 233D are formed on the inner surface of the groove 233 on the lower surface side of the detection vibrating arm 231, but the inner surface of the groove 233 on the upper surface side and the inner surface of the groove 233 on the lower surface side are also formed. Since they have substantially the same shape, hereinafter, the inclined surfaces 233A to 233C and the surface 233D of the groove 233 on the upper surface side will be representatively described.

  The inclined surface 233A is located closest to the −X axis side of the inner surface of the groove 233. Further, the angle θ1 formed between the inclined surface 233A and the YZ plane is about 20 to 25 °.

  The inclined surface (light reflecting surface) 233B is located on the + X axis side of the inclined surface 233A. Further, the angle θ2 formed by the inclined surface 233B and the YZ plane is about 55 to 65 °.

  The inclined surface 233C is located on the + X axis side of the inclined surface 233B. Further, an angle θ3 formed by the inclined surface 233C and the YZ plane is about 65 to 75 °.

  The surface (electrode formation surface) 233D is located closest to the + X-axis side of the inner surface of the groove 233. Further, the surface 233D is configured by a plane whose normal is the Z axis.

  Among these inclined surfaces 233A to 233C, if the inclined surface 233C is irradiated with the light L from the + Z-axis side, the light L reflected by the inclined surface 233C does not hit the inner surface of the groove 233 but above the groove 233. Head over. On the other hand, if the inclined surface 233B is irradiated with light L from the + Z-axis side, the light L reflected by the inclined surface 233B is irradiated onto the surface 233D.

  The width W1 of the detection vibrating arm 231 is not particularly limited, and is preferably about 60 to 200 μm.

  The width W2 of the groove 233 is not particularly limited, and is preferably about 30 to 180 μm. And the depth (depth of the deepest part) D of the groove | channel 233 is not specifically limited, It is preferable that it is about 20-120 micrometers.

  The support portion 25 supports the base portion 21 via the connecting portions 261, 262, 263, and 264. The support portion 25 can be divided into a long portion 251, a portion 252 and a portion 253. The portion 251 is provided along the X-axis direction. The portion 252 extends in the + Y-axis direction from the end portion of the portion 251 in the −X-axis direction. The portion 253 extends in the + Y-axis direction from the end portion of the portion 251 in the + X-axis direction. Thus, the support part 25 has a shape that opens in the + Y-axis direction when viewed from the Z-axis direction. The base portion 21 is provided in the + Y axis direction of the support portion 25.

  The connecting portion 261 has an elongated shape, and connects the end portion of the portion 252 in the + Y-axis direction and the end portion of the base portion 21 in the −X-axis direction. The connecting portion 261 has a bent shape in the middle in the longitudinal direction.

  The connecting portion 262 has an elongated shape, and connects the end portion of the portion 253 in the + Y-axis direction and the end portion of the base portion 21 in the + X-axis direction. The connecting portion 262 has a bent shape in the middle in the longitudinal direction.

  The connecting portion 263 has a long shape and connects the portion 251 and the base portion 21. The connecting portion 263 is located between the portion 252 and the driving vibrating arm 221. Further, the connecting portion 263 has a shape that is bent halfway in the longitudinal direction.

  The connecting portion 264 has a long shape and connects the portion 251 and the base portion 21. The connecting portion 264 is located between the portion 253 and the driving vibrating arm 222. Further, the connecting portion 264 has a shape that is bent in the middle in the longitudinal direction.

  In such a piezoelectric substrate 20, the base portion 21, the drive vibration arms 221 and 222, the detection vibration arms 231 and 232, the support portion (frame body) 25, and the four connection portions 261, 262, 263, and 264. Are preferably formed integrally.

-Electrode-
As shown in FIGS. 1 and 2, the electrodes include a first detection signal electrode 311, a first detection signal terminal 312, a second detection signal electrode 313, a second detection signal terminal 314, and a drive signal electrode 331. , A drive signal terminal 332, a drive ground electrode 341, and a drive ground terminal 342. In FIG. 2, for convenience of explanation, the first detection signal electrode 311 and the first detection signal terminal 312, the second detection signal electrode 313 and the second detection signal terminal 314, the drive signal electrode 331 and the drive signal terminal 332, drive ground The electrode 341 and the drive ground terminal 342 are illustrated with different hatchings. In addition, electrodes, wirings, and terminals formed on the side surface of the piezoelectric substrate 20 are shown by bold lines.

  The first detection signal electrode 311 is provided on the upper surface of the weight portion 2311, the lower surface of the weight portion 2321, the detection vibrating arm 231, and the detection vibrating arm 232. The first detection signal electrode 311 is an electrode for detecting charges generated by the vibration when the detection vibration of the detection vibration arm 231 and the detection vibration arm 232 is excited.

  The first detection signal terminal 312 is formed at the end of the portion 252 in the + Y axis direction. The first detection signal terminal 312 is electrically connected to the first detection signal electrode 311 through a detection signal wiring formed on the upper surface of the connecting portion 261.

  The second detection signal electrode 313 is provided on the lower surface of the weight portion 2311, the upper surface of the weight portion 2321, the detection vibrating arm 231, and the detection vibrating arm 232. The second detection signal electrode 313 has a potential that serves as a ground with respect to the first detection signal electrode 311.

  The second detection signal terminal 314 is formed at the end of the portion 253 in the + Y axis direction. The second detection signal terminal 314 is electrically connected to the second detection signal electrode 313 via a detection signal wiring formed on the upper surface of the connecting portion 262.

  When the detection vibrating arm 231 is viewed from the + Z-axis side, the second detection signal electrode 313 and the first detection signal electrode 311 are arranged in this order from the −X-axis direction, and the detection vibrating arm 231 is viewed from the −Z side. The first detection signal electrode 311 and the second detection signal electrode 313 are arranged in this order from the −X axis direction.

  When the detection vibrating arm 232 is viewed from the + Z-axis side, the second detection signal electrode 313 and the first detection signal electrode 311 are arranged in this order from the −X-axis direction, and the detection vibrating arm 231 is viewed from the −Z side. The first detection signal electrode 311 and the second detection signal electrode 313 are arranged in this order from the −X axis direction.

  By arranging the first detection signal electrode 311 and the second detection signal electrode 313 in this way, the detection vibration generated in the detection vibrating arm 231 is caused between the first detection signal electrode 311 and the second detection signal electrode 313. It appears as a charge between them, and can be taken out as a signal from the first detection signal terminal 312 and the second detection signal terminal 314. In addition, the detection vibration generated in the detection vibrating arm 232 also appears as a charge between the first detection signal electrode 311 and the second detection signal electrode 313, and is generated from the first detection signal terminal 312 and the second detection signal terminal 314. It can be taken out as a signal.

  As shown in FIGS. 1 and 2, the drive signal electrode 331 is formed on both side surfaces of the drive vibrating arm 221, the outer surface of the weight portion 2221, and the upper and lower surfaces of the drive vibrating arm 222. The drive signal electrode 331 is an electrode for exciting the drive vibration of the drive vibrating arms 221 and 222.

  Further, the drive signal terminal 332 is formed slightly on the −X axis side with respect to the central portion of the portion 251. The drive signal terminal 332 is electrically connected to the drive signal electrode 331 via a drive signal wiring formed on the lower surface of the connecting portion 263.

  The driving ground electrode 341 is formed on the upper and lower surfaces of the driving vibrating arm 221, both side surfaces of the driving vibrating arm 222, and the outer surface of the weight portion 2211. The drive ground electrode 341 has a potential that serves as a ground with respect to the drive signal electrode 331.

  Further, the drive ground terminal 342 is formed slightly on the + X axis side with respect to the central portion of the portion 251. The drive ground terminal 342 is electrically connected to the drive ground electrode 341 via a drive signal line formed in the connecting portion 264.

  By arranging the drive signal electrode 331, the drive signal terminal 332, the drive ground electrode 341, and the drive ground terminal 342 in this manner, the drive signal is applied between the drive signal terminal 332 and the drive ground terminal 342, thereby driving the drive signal. An electric field is generated between the signal electrode 331 and the drive ground electrode 341, and the drive vibrating arms 221 and 222 can be driven to vibrate.

The configuration of the electrode as described above is not particularly limited as long as it has conductivity. For example, Ni (nickel), Au (metal) layer such as Cr (chromium), W (tungsten), etc. (Gold), Ag (silver), Cu (copper), etc. can be comprised by the metal film which laminated | stacked each film.
The configuration of the resonator element 2 has been described above.

Next, the operation of the resonator element 2 will be described with reference to FIG.
An electric field is generated between the drive signal electrode 331 and the drive ground electrode 341 by applying a voltage (alternating voltage) between the drive signal terminal 332 and the drive ground terminal 342 in a state where no angular velocity is applied to the resonator element 2. The driving vibration arm 221 performs bending vibration in the direction indicated by the arrow A in FIG. 1, and the driving vibration arm 222 performs bending vibration in the direction indicated by the arrow B in FIG.

  When an angular velocity around the Y axis is applied to the resonator element 2 in a state where this driving vibration is being performed, Coriolis force acts on the driving vibrating arms 221 and 222 to excite a new vibration. This new vibration is a vibration in the circumferential direction with respect to the Y-axis. At the same time, the detection vibration in the direction of arrow C is excited in the detection vibration arm 231 in response to the new vibration, and the detection vibration in the direction of arrow D is excited in the detection vibration arm 232. Due to this detection vibration, charges generated in the detection vibrating arms 231 and 232 are taken out as signals from the first detection signal electrode 311 and the second detection signal electrode 313, and the angular velocity is obtained based on this signal.

Next, a method for manufacturing the resonator element according to the invention will be described.
The manufacturing method of the resonator element according to the invention includes a preparation step, a metal film formation step, a resist mask formation step, a detection step, an arrangement step, an exposure step, a development step, and a removal step. .

[1] Preparation Step First, the piezoelectric substrate 20, the jig 4A, and the jig 4B are prepared.

  The piezoelectric substrate 20 is obtained by patterning a Z-cut quartz substrate by wet etching.

  Each of the jig 4A and the jig 4B is made of a plate material that shields the light L. In the jig 4A and the jig 4B, through holes 41 and 42 penetrating in the thickness direction are formed. The through holes 41 and 42 are arranged in this order from the −Z axis side (see FIG. 4C).

[2] Metal Film Forming Step Next, as shown in FIG. 4A, a metal film 30 serving as an electrode is formed on the entire surface of the piezoelectric substrate 20 by, for example, vapor deposition or sputtering.

[3] Resist Mask Formation Step Next, as shown in FIG. 4B, a positive type photoresist film 40 is formed on the entire surface of the metal film 30. As this film formation method, for example, a vapor phase film formation method such as plasma CVD can be used.

[4] Detection Step Next, the method for detecting the position of the inclined surface 233B for detecting the position of the inclined surface 233B is not particularly limited. For example, the inclination is determined based on the grayscale image captured from the Z-axis direction by the imaging unit. For example, a method for detecting the position of the surface 233B may be used.

[5] Arrangement Step Next, as shown in FIG. 4C, the jig 4A is arranged on the + Z-axis side of the piezoelectric substrate 20, and the jig 4B is arranged on the −Z-axis side (hereinafter, this state is referred to as this state). Say “Arranged”). At this time, the jig 4A is arranged so that the inclined surface 233B and the through holes 41 and 42 are not aligned in a plan view of the jig 4A, that is, the inclined surface 233B and the through holes 41 and 42 are not overlapped. In addition, the jig 4B is arranged so that the inclined surface 233B and the through holes 41 and 42 do not overlap in a plan view of the jig 4B.

  In addition, the through hole 41 of the jig 4A overlaps the upper surface 234A on the −X axis side of the groove 233 in the upper surface 234 of the detection vibrating arm 231 in a plan view of the jig 4A. Further, a pair of through holes 42 of the jig 4A are provided, and in the arrangement state, the upper surface 234B and the inclined surface 233C on the + X axis side of the groove 233 in the upper surface 234 of the detection vibrating arm 231 overlap. .

On the other hand, the through hole 41 of the jig 4B overlaps the lower surface 235B on the −X axis side of the groove 233 in the lower surface 235 of the vibration arm 231 for detection in a plan view of the jig 4A. Further, a pair of through holes 42 of the jig 4A are provided, and in the arranged state, overlap with the lower surface 235B and the inclined surface 233C on the + X axis side of the groove 233 in the upper surface 234 of the detection vibrating arm 231. .
In the arrangement state, the jigs 4A and 4B cover the surface 233D and the surface 234D.

[6] Exposure Step Then, light (exposure light) L is irradiated from the + Z axis direction and the −Z axis direction toward the piezoelectric substrate 20 in the arrangement state. The light L irradiated from the + Z-axis side is irradiated to the upper surface 234A through the through hole 41 of the jig 4A, and is irradiated to the upper surface 234B and the inclined surface 233C through the through holes 42 of the jig 4B.

  On the other hand, the light L irradiated from the −Z-axis side is irradiated to the lower surface 235A through the through hole 41 of the jig 4B, and is irradiated to the lower surface 235B and the inclined surface 233C through the through holes 42 of the jig 4B. The

  Here, as described above, if the light L is irradiated from the Z-axis side to the inclined surface 233B of each groove 233, the light L reflected by the inclined surface 233B is applied to the surface 233D. Therefore, in the present invention, the jigs 4A and 4B are arranged so as to block the light L to the inclined surface 233B of each groove 233 in the exposure process. Accordingly, it is possible to prevent the light L from being reflected by the inclined surfaces 233B and irradiating the photoresist film 40 on the surface 233D with the light L. Therefore, it is possible to prevent the removal of the photoresist film 40 that would otherwise remain in the development process. As a result, it is possible to prevent unintentional loss of the electrode in the vibrating arm 231 for detection, and it is possible to prevent a decrease in vibration characteristics and disconnection due to the loss.

  Note that light L is irradiated near the center of each side surface of the detection vibrating arm 231 from the direction intersecting the Z axis, that is, oblique exposure is performed. Thereby, the light L can be irradiated also to the surface having the X axis as a normal line.

  Further, as described above, in the arrangement state, the jigs 4A and 4B cover the surface 233D and the surface 234D. Thereby, it is possible to prevent the photoresist film 30 on the surface 233D and the surface 234D from being removed when the direct light L is pardoned.

[7] Developing Step Next, the developer is supplied to the piezoelectric substrate 20 and developed. As a result, the exposed portion of the photoresist film 40 is removed as shown in FIG.

[8] Removal Step Then, as shown in FIG. 5B, the exposed portion is removed by wet etching, for example, using the remaining photoresist film as a mask. Finally, as shown in FIG. 5C, the remaining photoresist film 40 is removed.

  As described above, according to the present invention, it is possible to prevent undesired electrode defects from occurring in the electrode of the resonator element 2, and it is possible to prevent a decrease in vibration characteristics and disconnection resulting therefrom.

Second Embodiment
FIG. 6 is a cross-sectional view showing a resonator element manufactured according to the second embodiment of the method of manufacturing a resonator element of the present invention.

  Hereinafter, the second embodiment of the method of manufacturing the resonator element according to the invention will be described with reference to the drawings. However, the difference from the above-described embodiment will be mainly described, and the description of the same matters will be omitted.

  The present embodiment is the same as the first embodiment except that the shape of the jig and the shape of the electrodes are mainly different.

  As shown in FIG. 6, in the resonator element 2A, the width W3 of the detection vibrating arm 231 is wider than the width W1 of the detection vibrating arm 231 in the first embodiment. Therefore, a bottom surface 233E is formed on the inner surface of the groove 233 between the inclined surface 233B and the inclined surface 233C. The bottom surface 233E is configured by a plane having the Z axis as a normal line.

  In the present embodiment, the light L is applied to the bottom surface 233E in the exposure process. Thereby, the light L reflected by the bottom surface 233E is directed to the + Z axis side. Therefore, the light L reflected by the bottom surface 233E can be more reliably prevented from irradiating the inner surface of the groove 233.

<Third Embodiment>
FIG. 7 is a cross-sectional view showing a resonator element manufactured according to the third embodiment of the method of manufacturing a resonator element of the present invention.

Hereinafter, the third embodiment of the method of manufacturing the resonator element according to the invention will be described with reference to the drawings. However, the difference from the above-described embodiment will be mainly described, and the description of the same matters will be omitted.
This embodiment is the same as the first embodiment except that the shape of the electrodes is different.

  As shown in FIG. 7, in the vibrating arm 231 for detection of the resonator element 2B, the first detection signal electrode 311 is provided on the inclined surfaces 233A and 233B of the groove 233 on the upper surface 234 side and the surface 233D of the groove 233 on the lower surface 235 side. It has been. The second detection signal electrode 313 is continuously provided on the side surface on the −X axis side of the vibrating arm 231 for detection, the lower surface 235A, and the inclined surfaces 233A and 233B of the groove 233 on the lower surface side, and the side surface on the + X axis side, The upper surface 234B is provided continuously to the surface 233D of the groove 233 on the lower surface side.

On the other hand, in the detection vibrating arm 232, the first detection signal electrode 311 is continuously provided on the side surface on the −X axis side of the detection vibrating arm 231, the lower surface 235A, and the inclined surfaces 233A and 233B of the groove 233 on the lower surface side. , + X-axis side surface, upper surface 234B, and lower surface side groove 233 surface 233D are provided continuously. The second detection signal electrode 313 is provided on the inclined surfaces 233A and 233B of the groove 233 on the upper surface 234 side and the surface 233D of the groove 233 on the lower surface 235 side.
Such a vibrating piece 2B also has the same function as that of the vibrating piece 2.

<Fourth embodiment>
FIG. 8 is a cross-sectional view showing a resonator element manufactured according to the fourth embodiment of the method of manufacturing a resonator element of the invention.

Hereinafter, the fourth embodiment of the method of manufacturing the resonator element according to the invention will be described with reference to the drawings. However, the difference from the above-described embodiment will be mainly described, and the description of the same matters will be omitted.
This embodiment is the same as the first embodiment except that the shape of the electrodes is different.

  As shown in FIG. 8, in the detection vibrating arm 231 of the resonator element 2C, the first detection signal electrode 311 includes the surface 233D of the groove 233 on the upper surface 234 side and the inclined surfaces 233A and 233B of the groove 233 on the lower surface 235 side. Is provided. The second detection signal electrode 313 is provided on the inclined surfaces 233A and 233B on the upper surface 234 side and the surface 233D of the groove 233 on the lower surface 235 side.

  Detection ground electrodes 315 are provided on both side surfaces of the detection vibrating arm 231. The detection ground electrode 315 has a potential to be ground with respect to the first detection signal electrode 311 and the second detection signal electrode 313.

  On the other hand, in the detection vibrating arm 232, the first detection signal electrode 311 is provided on the inclined surfaces 233A and 233B on the upper surface 234 side and the surface 233D on the lower surface 235 side. The second detection signal electrode 313 is provided on the surface 233D of the groove 233 on the upper surface 234 side and the inclined surfaces 233A and 233B of the groove 233 on the lower surface 235 side.

Detection ground electrodes 315 are provided on both side surfaces of the detection vibrating arm 232.
Such a resonator element 2 </ b> C also has the same function as that of the resonator element 2.

<Fifth Embodiment>
FIG. 9 is a cross-sectional view showing a resonator element manufactured according to the fifth embodiment of the method of manufacturing a resonator element of the invention.

Hereinafter, the fifth embodiment of the method of manufacturing the resonator element according to the invention will be described with reference to the drawings. However, the difference from the above-described embodiment will be mainly described, and the description of the same matters will be omitted.
This embodiment is the same as the first embodiment except that the shape of the electrodes is different.

  As shown in FIG. 9, in the vibrating arm 231 for detection of the vibrating piece 2D, the first detection signal electrode 311 is provided on the surface 233D of the groove 233 on the upper surface 234 side. The second detection signal electrode 313 is provided on the inclined surfaces 233A and 233B on the upper surface 234 side and the surface 233D of the groove 233 on the lower surface 235 side.

  Detection ground electrodes 315 are provided on both side surfaces of the detection vibrating arm 231 and the inclined surfaces 233A and 233B of the groove 233 on the lower surface 235 side. The detection ground electrode 315 has a potential to be ground with respect to the first detection signal electrode 311 and the second detection signal electrode 313.

  On the other hand, in the detection vibrating arm 232, the first detection signal electrode 311 is provided on the inclined surfaces 233A and 233B on the upper surface 234 side and the surface 233D of the groove 233 on the lower surface 235 side. The second detection signal electrode 313 is provided on the surface 233D of the groove 233 on the upper surface 234 side.

Detection ground electrodes 315 are provided on both side surfaces of the detection vibrating arm 232 and the inclined surfaces 233A and 233B of the groove 233 on the lower surface 235 side.
Such a resonator element 2 </ b> D has the same function as that of the resonator element 2.

2. Physical Quantity Detection Device Next, a physical quantity detection device using the resonator element 2 will be described.

  FIG. 10 is a cross-sectional view illustrating a preferred embodiment of the physical quantity detection device including the resonator element illustrated in FIG. 1, and FIG. 11 is a plan view illustrating the preferred embodiment of the physical quantity detection device including the resonator element illustrated in FIG. 1. FIG.

  As shown in FIGS. 10 and 11, the physical quantity detection device 10 includes a vibrating piece 2, a package 8 that houses the vibrating piece 2, and an IC chip 9.

  The package 8 includes a box-shaped base 81 having a concave portion 811 and a plate-shaped lid 82 that blocks the opening of the concave portion 811 and is joined to the base 81. The resonator element 2 is accommodated in an accommodation space formed by closing the recess 811 with the lid 82. The housing space may be in a reduced pressure (vacuum) state or may be filled with an inert gas such as nitrogen, helium, or argon.

  The recess 811 includes a first recess 811a that opens to the top surface of the base 81, a second recess 811b that opens to the center of the bottom surface of the first recess 811a, and a third recess that opens to the center of the bottom surface of the second recess 811b. 811c.

  The constituent material of the base 81 is not particularly limited, and various ceramics such as aluminum oxide and various glass materials can be used. Further, the constituent material of the lid 82 is not particularly limited, but may be a member whose linear expansion coefficient approximates that of the constituent material of the base 81. For example, in the case where the constituent material of the base 81 is ceramic as described above, it is preferable to use an alloy such as Kovar. In addition, the joining method of the base 81 and the lid 82 is not specifically limited, For example, it can join via an adhesive material or a brazing material.

  Connection terminals 831, 832, 833, and 834 are formed on the bottom surface of the recess 811. The configuration of the connection terminals 831 to 834 is not particularly limited as long as it has conductivity. For example, Ni (nickel) or Au is used as a metallization layer (underlayer) such as Cr (chrome) or W (tungsten). (Gold), Ag (silver), Cu (copper), etc. can be comprised by the metal film which laminated | stacked each film.

  The resonator element 2 is fixed to the bottom surface of the recess 811 with conductive adhesives 861, 862, 863, and 864. Further, the second detection signal terminal 314 and the connection terminal 831 are electrically connected by the conductive adhesive 861, and the drive signal terminal 332 and the connection terminal 832 are electrically connected by the conductive adhesive 862, The drive ground terminal 342 and the connection terminal 833 are electrically connected by the conductive adhesive 863, and the first detection signal terminal 312 and the connection terminal 834 are electrically connected by the conductive adhesive 864.

  The conductive adhesives 861 to 864 are not particularly limited as long as they have electrical conductivity and adhesiveness. For example, silver particles are bonded to adhesives such as silicone, epoxy, acrylic, polyimide, and bismaleimide. What disperse | distributed conductive fillers, such as these, can be used.

  Connection wires 871, 872, 873, and 874 are formed on the bottom of the first recess 811a and the bottom of the second recess 811b.

  The connection wiring 871 extends from the connection terminal 831 toward the center of the bottom of the first recess 811a. The connection wiring 872 extends from the connection terminal 832 toward the center of the bottom of the first recess 811a. The connection wiring 873 extends from the connection terminal 833 toward the center of the bottom of the first recess 811a. The connection wiring 874 extends from the connection terminal 834 toward the center of the bottom of the first recess 811a.

  As shown in FIG. 10, the IC chip 9 is fixed to the bottom surface of the third recess 811c with a brazing material or the like. The IC chip 9 is electrically connected to each connection wiring 871, 872, 873, 874 by a conductive wire. Thus, each of the first detection signal terminal 312, the second detection signal terminal 314, the drive signal terminal 332, and the drive ground terminal 342 is in a state of being electrically connected to the IC chip 9. The IC chip 9 has a drive circuit for driving and vibrating the vibrating piece 2 and a detection circuit for detecting detected vibration generated in the vibrating piece 2 when an angular velocity is applied.

  In the present embodiment, the IC chip 9 is provided inside the package 8, but the IC chip 9 may be provided outside the package 8.

3. Electronic Device Next, an electronic device to which the resonator element 2 is applied will be described in detail with reference to FIGS.

  FIG. 12 is a perspective view illustrating a configuration of a mobile (or notebook) personal computer to which an electronic device including the resonator element illustrated in FIG. 1 is applied.

  In this figure, a personal computer 1100 includes a main body portion 1104 provided with a keyboard 1102 and a display unit 1106 provided with a display portion 1108. The display unit 1106 is rotated with respect to the main body portion 1104 via a hinge structure portion. It is supported movably. Such a personal computer 1100 has a built-in vibrating piece 2 that functions as angular velocity detection means (gyro sensor).

  FIG. 13 is a perspective view illustrating a configuration of a mobile phone (including PHS) to which the electronic device including the resonator element illustrated in FIG. 1 is applied.

  In this figure, a cellular phone 1200 includes a plurality of operation buttons 1202, an earpiece 1204, and a mouthpiece 1206, and a display unit 1208 is disposed between the operation buttons 1202 and the earpiece 1204. Such a cellular phone 1200 incorporates the resonator element 2 that functions as an angular velocity detection means (gyro sensor).

  FIG. 14 is a perspective view illustrating a configuration of a digital still camera to which an electronic device including the resonator element illustrated in FIG. 1 is applied. In this figure, connection with an external device is also simply shown. Here, an ordinary camera sensitizes a silver halide photographic film with a light image of a subject, whereas a digital still camera 1300 photoelectrically converts a light image of a subject with an imaging device such as a CCD (Charge Coupled Device). An imaging signal (image signal) is generated.

  A display unit is provided on the back of a case (body) 1302 in the digital still camera 1300, and is configured to perform display based on an imaging signal from the CCD. The display unit 1310 displays a subject as an electronic image. Function as.

  A light receiving unit 1304 including an optical lens (imaging optical system), a CCD, and the like is provided on the front side (the back side in the drawing) of the case 1302.

  When the photographer confirms the subject image displayed on the display unit and presses the shutter button 1306, the CCD image pickup signal at that time is transferred and stored in the memory 1308.

  In the digital still camera 1300, a video signal output terminal 1312 and an input / output terminal 1314 for data communication are provided on the side surface of the case 1302. As shown in the figure, a television monitor 1430 is connected to the video signal output terminal 1312 and a personal computer 1440 is connected to the input / output terminal 1314 for data communication as necessary. Further, the imaging signal stored in the memory 1308 is output to the television monitor 1430 or the personal computer 1440 by a predetermined operation.

  Such a digital still camera 1300 incorporates a resonator element 2 that functions as an angular velocity detection means (gyro sensor).

  In addition to the personal computer (mobile personal computer) shown in FIG. 12, the mobile phone shown in FIG. 13, and the digital still camera shown in FIG. For example, inkjet printers), laptop personal computers, televisions, video cameras, video tape recorders, car navigation devices, pagers, electronic notebooks (including those with communication functions), electronic dictionaries, calculators, electronic game devices, word processors, workstations, TV phone, crime prevention TV monitor, electronic binoculars, POS terminal, medical equipment (eg, electronic thermometer, blood pressure monitor, blood glucose meter, electrocardiogram measuring device, ultrasonic diagnostic device, electronic endoscope), fish detector, various measuring devices, Instruments (eg, vehicles, aircraft Gauges of a ship), can be applied to a flight simulator or the like.

4). Next, a moving body to which the resonator element shown in FIG. 1 is applied will be described in detail with reference to FIG.

  FIG. 15 is a perspective view illustrating a configuration of an automobile to which a moving body including the resonator element illustrated in FIG. 1 is applied.

  The automobile 1500 has a built-in vibrating piece 2 that functions as an angular velocity detection means (gyro sensor), and the posture of the vehicle body 1501 can be detected by the vibrating piece 2. The detection signal of the vibration piece 2 is supplied to the vehicle body posture control device 1502, and the vehicle body posture control device 1502 detects the posture of the vehicle body 1501 based on the signal, and controls the stiffness of the suspension according to the detection result. The brakes of the individual wheels 1503 can be controlled. In addition, such posture control can be used by a biped robot or a radio control helicopter. As described above, the vibrator element 2 is incorporated in realizing the posture control of various moving bodies.

  As described above, the method for manufacturing a resonator element, the resonator element, the electronic device, and the moving body of the present invention have been described based on the illustrated embodiments, but the present invention is not limited to these.

  Further, in the resonator element according to the invention, the configuration of each part can be replaced with an arbitrary configuration that exhibits the same function, and an arbitrary configuration can be added.

  In the second embodiment, the bottom surface is irradiated with light in the exposure step. However, the present invention is not limited to this, and the bottom surface and its peripheral surface portion (excluding the light reflecting surface) may be irradiated with light. Good.

In the method for manufacturing a resonator element according to the invention, an arbitrary step can be added.
Further, the form of the resonator element is not limited to the so-called H-type tuning fork, and may be various forms such as a double T-type, a bipod tuning fork, a tripod tuning fork, a comb-teeth type, an orthogonal type, and a prismatic type. Good.

  The number of drive vibrating arms and detection vibrating arms may be one or three or more, respectively. The driving vibration arm may also serve as the detection vibration arm.

  Further, the number, position, shape, size, and the like of the electrodes are not limited to the above-described embodiment as long as each vibrating arm can be vibrated by energization.

2 ... Vibrating piece 2A ... Vibrating piece 2B ... Vibrating piece 2C ... Vibrating piece 2D ... Vibrating piece 221 ... Driving vibrating arm 222 ... Driving vibrating arm 223 ... Groove 231 ... Detection vibrating arm 232 ... Detection vibrating arm 232D ... Inclination Surface 233 ... groove 233A ... inclined surface 233B ... inclined surface 233C ... inclined surface 233D ... surface 233E ... bottom surface 234 ... upper surface 234A ... upper surface 234D ... surface 235 ... lower surface 235A ... lower surface 235B ... lower surface 2211 ... Part 2311 ... Weight part 2321 ... Weight part 25 ... Support part 251 ... Part 252 ... Part 253 ... Part 261 ... Connection part 262 ... Connection part 263 ... Connection part 264 ... Connection part 311 ... First detection signal electrode 312 ... First detection Signal terminal 313, second detection signal electrode 314, second detection signal terminal 315, detection ground electrode 331, drive signal electrode 332, drive signal terminal 341, drive Ground electrode 342 ... Drive ground terminal 4A ... Jig 4B ... Jig 41 ... Through hole 42 ... Through hole 8 ... Package 81 ... Base 82 ... Lid 811 ... Recess 811a ... First recess 811b ... Second recess 811c ... Third recess 831 ... Connection terminal 832 ... Connection terminal 833 ... Connection terminal 834 ... Connection terminal 861 ... Conductive adhesive 862 ... Conductive adhesive 863 ... Conductive adhesive 864 ... Conductive adhesive 871 ... Connection wiring 872 ... Connection wiring 873 ... Connection wiring 874 ... Connection wiring 9 ... IC chip 10 ... Physical quantity detection device 20 ... Piezoelectric substrate 21 ... Base 30 ... Metal film 40 ... Photoresist film 1100 ... Personal computer 1102 ... Keyboard 1104 ... Main body 1106 ... Display unit 1108 ... Display unit 1200 ... mobile phone 1202 ... operation button 1204 ... earpiece 1206 ... mouthpiece 12 DESCRIPTION OF SYMBOLS 8 ... Display part 1300 ... Digital still camera 1302 ... Case 1304 ... Light-receiving unit 1306 ... Shutter button 1308 ... Memory 1310 ... Display part 1312 ... Video signal output terminal 1314 ... Input / output terminal 1430 ... Television monitor 1440 ... Personal computer 1500 ... Car 1501 ... body 1502 ... body posture control device 1503 ... wheel L ... light W1 ... width W2 ... width W3 ... width θ1 ... angle θ2 ... angle θ3 ... angle

Claims (11)

A piezoelectric substrate having a base and a vibrating arm extending from the base, and having a groove extending along a longitudinal direction of the vibrating arm; and an electrode provided on an inner surface of the groove A manufacturing method for manufacturing a resonator element,
A metal film forming step of forming a metal film to be the electrode on the inner surface of the groove;
A resist mask forming step of forming a resist mask on the surface of the metal film;
An exposure step of irradiating and exposing a part of the resist mask with light,
The inner surface of the groove has an electrode forming surface on which the electrode is formed, and a light reflecting surface on which the light is reflected when the light is irradiated and the light is irradiated on the electrode forming surface. And
In the exposure step, a vibrating piece manufacturing method is provided, wherein a shielding portion that shields the light toward the light reflecting surface is provided. The shielding part is composed of a plate material having a through-hole penetrating in the thickness direction,
2. The method of manufacturing a resonator element according to claim 1, wherein, in the exposure step, the light reflecting surface and the through hole do not overlap in a plan view of the shielding portion.   The method of manufacturing a resonator element according to claim 1, wherein, in the exposure step, the light is irradiated from a thickness direction of the piezoelectric substrate toward the piezoelectric substrate.   4. The method of manufacturing a resonator element according to claim 1, wherein, in the exposure step, the light is irradiated from a direction intersecting a thickness direction of the piezoelectric substrate toward the piezoelectric substrate. 5.   The method for manufacturing a resonator element according to claim 1, wherein the piezoelectric substrate is formed of a Z-cut quartz plate. The inner surface of the groove has a bottom surface whose normal is the Z axis of the crystal axis of the piezoelectric substrate,
The method of manufacturing a resonator element according to claim 5, wherein at the exposure step, at least the bottom surface is irradiated with the light. The light reflecting surface is composed of an inclined surface inclined with respect to the Z axis of the crystal axis of the piezoelectric substrate,
The method for manufacturing a resonator element according to claim 5, wherein the electrode forming surface is configured by a plane having a normal line to the X axis of the crystal axis of the piezoelectric substrate.   The method of manufacturing a resonator element according to claim 1, further comprising a detection step of detecting a position of the light reflecting surface prior to the exposure step.   A vibrating piece manufactured by the method for manufacturing a vibrating piece according to claim 1.   An electronic device comprising the resonator element according to claim 9.   A moving body comprising the resonator element according to claim 9.

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