JP2018164400A - Electric power conversion system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electric power conversion system capable of ensuring the strength of a case while preventing enlargement.SOLUTION: An electric power conversion system 1 includes: a capacitor 12 for smoothing DC power; a current sensor 13 for detecting a current of AC power; and a case 4 for storing the capacitor 12 and the current sensor 13. The capacitor 12 and the current sensor 13 are arranged in different regions to be separated from each other by forming a metallic first partition wall 401 in the case 4.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a power conversion device having a semiconductor laminated unit in which a semiconductor module and a cooling pipe are laminated.

  As a power converter, Patent Document 1 discloses a case in which a semiconductor laminated unit formed by laminating a semiconductor module and a cooling pipe for cooling the semiconductor module is accommodated in a case. In such a configuration, the semiconductor stacked unit is accommodated in the case while being pressurized in the stacking direction. Therefore, high rigidity is required for the wall portion of the case. Therefore, in the invention of Patent Document 1, a thick portion is provided in a part of the wall portion in order to ensure the strength of the wall portion of the case.

JP 2013-21893 A

  However, in the configuration described in Patent Document 1, there is a problem that the size of the case is increased by making a part of the case thick, and as a result, the power converter is increased in size.

  This invention is made | formed in view of this background, and it aims at providing the power converter device which can ensure the intensity | strength of a case, preventing an enlargement.

As a reference invention, a semiconductor laminated unit formed by laminating a semiconductor module and a cooling pipe for cooling the semiconductor module;
A case for housing the semiconductor multilayer unit;
A fixed part that is housed in the case and fixed to the case;
The case includes a partition facing the semiconductor multilayer unit from the stacking direction, and a rib formed to extend from the partition toward the opposite side of the semiconductor stack unit,
The rib is provided in a power conversion device including a component fixing portion for fixing the fixed component.

  In the power converter, the case has a rib formed so as to extend from the partition wall toward the side opposite to the semiconductor multilayer unit. The rib includes a component fixing portion that fixes the component to be fixed. Therefore, the rib can be used as a fixing portion of the component to be fixed while securing the strength of the partition wall by the rib. That is, since the rib plays a role of reinforcing the strength of the partition wall and a role of fixing the part to be fixed, the number of components in the case is reduced, and the power converter can be downsized.

As described above, according to the present invention, it is possible to provide a power conversion device that can ensure the strength of the case while preventing an increase in size.
One aspect of the present invention is a capacitor for smoothing DC power;
A current sensor for detecting the current of AC power;
A case for housing the capacitor and the current sensor;
The capacitor and the current sensor are in a power conversion device that is arranged in different regions across a metal first partition formed in the case.

The top view of the power converter device in Example 1. FIG. II-II arrow sectional drawing of FIG. III-III arrow sectional drawing of FIG. The top view of the power converter device in Example 2. FIG.

The power conversion device of the present invention can be used for, for example, an electric vehicle and a hybrid vehicle.
In this specification, the stacking direction of the semiconductor module and the cooling pipe is simply referred to as “stacking direction”. Further, the longitudinal direction of the cooling pipe is appropriately referred to as “lateral direction”, and the direction perpendicular to the stacking direction and the horizontal direction is appropriately referred to as “height direction”.

Example 1
Examples of the power conversion device will be described with reference to FIGS.
As shown in FIG. 1, the power conversion device 1 of this example includes a semiconductor stacked unit 10 formed by stacking a semiconductor module 2 and a cooling pipe 31 that cools the semiconductor module 2, and a case 4 that houses the semiconductor stacked unit 10. The fixed component 100 is housed in the case 4 and fixed to the case 4. The case 4 includes a partition wall 5 that faces the semiconductor multilayer unit 10 from the stacking direction X, and a rib 6 that extends from the partition wall 5 toward the opposite side of the semiconductor multilayer unit 10. The rib 6 includes a component fixing portion 7 that fixes the component 100 to be fixed. In this example, the rib 6 includes a plurality of component fixing portions 7.

  The power converter 1 of this example is an inverter that converts power between DC power and AC power. The power conversion device 1 includes a smoothing capacitor 12 that smoothes DC power and a current sensor 13 that detects a current of AC power as a fixed component 100. The rib 6 includes a capacitor fixing portion 71 that fixes the smoothing capacitor 12 and a sensor fixing portion 72 that fixes the current sensor 13 as the component fixing portion 7.

  As shown in FIGS. 1 and 3, the semiconductor module 2 of the semiconductor stacked unit 10 is sandwiched by cooling pipes 31 from both sides in the stacking direction X. The semiconductor module 2 includes a switching element such as IGBT (Insulated Gate Bipolar Transistor) and a diode such as FWD (Free Wheel Diode). In addition, as shown in FIG. 3, the semiconductor module 2 includes a power terminal 21 and a control terminal 22 that protrude in opposite directions in the height direction Z.

  As shown in FIG. 1, the plurality of cooling pipes 31 are long in the lateral direction Y perpendicular to the stacking direction X, and are connected by connecting pipes 32 that can deform adjacent cooling pipes 31 at both ends in the longitudinal direction. One cooler 3 is configured. The cooler 3 is made of a metal having excellent thermal conductivity such as aluminum. The cooler 3 includes a refrigerant introduction pipe 33 that introduces a cooling medium into the cooler 3 and a refrigerant discharge that discharges the cooling medium from the cooler 3 on both ends of the cooling pipe 31 disposed at the end in the stacking direction X. The tube 34 is connected. The refrigerant introduction pipe 33 and the refrigerant discharge pipe 34 are formed so as to project in the stacking direction X and project outside the case 4.

  As shown in FIGS. 1 to 3, the case 4 includes a substantially rectangular bottom wall 41 and a side wall 42 erected vertically from the edge of the bottom wall 41 to the bottom wall 41. The case 4 is open at the end opposite to the bottom wall 41. As shown in FIG. 1, the side wall 42 includes a pair of side wall parts 423 and 424 that connect the front wall part 421 and the rear wall part 422 facing each other, and the front wall part 421 and the rear wall part 422 at both ends. It consists of. The pair of side wall portions 423 and 424 face each other and are orthogonal to the front wall portion 421 and the rear wall portion 422.

  A partition wall 5 extends in the lateral direction Y from one side wall portion 423 toward the other side wall portion 424 side. The partition wall 5 is opposed to the rear end cooling pipe 311 which is the cooling pipe 31 disposed at the end opposite to the refrigerant introduction pipe 33 and the refrigerant discharge pipe 34 in the cooler 3 of the semiconductor lamination unit 10 in the stacking direction X. doing. A pressurizing member 11 that pressurizes the semiconductor multilayer unit 10 in the stacking direction X is disposed between the partition wall 5 and the rear end cooling pipe 311.

  As shown in FIG. 3, the partition wall 5 is erected upward from the bottom wall 41. That is, the partition wall 5 is connected to the side wall portion 423 and the bottom wall 41. The partition wall 5 may be formed integrally with the side wall portion 423 and the bottom wall 41. The partition wall 5 is made of a metal such as aluminum.

  As shown in FIG. 1, the connecting partition 14 extends from the end of the partition wall 5 on the side wall 424 side in the lateral direction Y toward the front wall 421. The connecting partition wall 14 is connected to the front wall portion 421. The semiconductor multilayer unit 10 is disposed in the unit housing portion 101 surrounded by the bottom wall 41, the front wall portion 421, the side wall portion 423, the partition wall 5, and the connecting partition wall 14.

  A pressure member 11 is disposed between the semiconductor stacked unit 10 and the partition wall 5 in a state of being compressed and elastically deformed in the stacking direction X. The semiconductor stacked unit 10 is pressed in the stacking direction X by the urging force of the pressing member 11. The pressurizing member 11 can be constituted by an elastic member such as a leaf spring, a coil spring, or rubber, for example.

  A smoothing capacitor 12 and a current sensor 13 are arranged in a space other than the unit housing portion 101 in the case 4. The smoothing capacitor 12 and the current sensor 13 are arranged side by side in the horizontal direction Y. Ribs 6 are formed between the smoothing capacitor 12 and the current sensor 13.

  As shown in FIGS. 2 and 3, the component fixing portion 7 is formed so as to protrude in the height direction Z from the bottom wall 41. That is, the site | part in which the component fixing | fixed part 7 in the bottom wall 41 was provided has a thickness larger than the site | part in which the component fixing | fixed part 7 in the bottom wall 41 is not provided. As shown in FIG. 1, the component fixing portion 7 extends in the stacking direction X from the partition wall 5 toward the rear wall portion 422. The component fixing portion 7 is continuously formed from the partition wall 5 to the rear wall portion 422, and connects the partition wall 5 and the rear wall portion 422.

  The component fixing portion 7 on the side wall 424 in the lateral direction Y of the rib 6 is a capacitor fixing portion 71, and the component fixing portion 7 on the side wall 423 side is a sensor fixing portion 72. That is, the capacitor fixing part 71 and the sensor fixing part 72 are arranged in the horizontal direction Y.

The smoothing capacitor 12 has a capacitor fastening portion 121 that protrudes outward, and the capacitor fastening portion 121 is fastened and fixed to the capacitor fixing portion 71 by a bolt 120. Thereby, the smoothing capacitor 12 is fixed to the case 4. The capacitor fastening portion 121 may be, for example, a part of a capacitor case or a terminal electrically connected to the capacitor element.
The current sensor 13 has a sensor fastening portion 131 that protrudes outward, and the sensor fastening portion 131 is fastened and fixed to the sensor fixing portion 72 by a bolt 130. Thereby, the current sensor 13 is fixed to the case 4.

  The rib 6 is formed by erecting a partition plate 8 that partitions between adjacent component fixing portions 7 (capacitor fixing portion 71 and sensor fixing portion 72). That is, the rib 6 includes the component fixing portion 7 (capacitor fixing portion 71 and sensor fixing portion 72) and the partition plate 8.

  The partition plate 8 is erected in the height direction Z from between the capacitor fixing portion 71 and the sensor fixing portion 72 in the bottom wall 41. As shown in FIGS. 2 and 3, the partition plate 8 is formed so as to rise in the height direction Z from the bottom wall 41. The partition plate 8 has the same height as the partition wall 5. As shown in FIG. 1, the partition plate 8 is continuously formed from the partition wall 5 to the rear wall portion 422, and connects the partition wall 5 and the rear wall portion 422. In this example, the partition plate 8 is formed straight in the stacking direction X.

  In addition, the semiconductor module 2 comprises an inverter circuit, converts direct-current power into three-phase alternating current power, and supplies it to a three-phase alternating current motor. The smoothing capacitor 12 is connected to a pair of electrodes in the DC power source and the semiconductor module 2 constituting the inverter circuit. The current sensor 13 is connected to the power terminal 21 on the output side of the semiconductor module 2 constituting the inverter circuit.

Next, the function and effect of this example will be described.
In the power conversion device 1, the case 4 has a rib 6 formed so as to extend from the partition wall 5 toward the side opposite to the semiconductor multilayer unit 10. The rib 6 includes a component fixing portion 7 that fixes the component 100 to be fixed. Therefore, the rib 6 can be used as a fixing portion of the component 100 to be fixed while ensuring the strength of the partition wall 5 by the rib 6. That is, the rib 6 plays a role of reinforcing the strength of the partition wall 5 and a role of fixing the fixed component 100, so that the number of components in the case 4 is reduced, and the power conversion device 1 is reduced in size. be able to.

  The rib 6 includes a plurality of component fixing portions 7. Therefore, since the plurality of parts to be fixed 100 can be fixed by the plurality of part fixing parts 7 of one rib 6, the power converter 1 can be further downsized.

  Further, the rib 6 is formed by standing a partition plate 8 that partitions between adjacent component fixing portions 7. Therefore, since a plurality of fixed components 100 can be fixed to the component fixing portion 7 partitioned by one rib 6, the fixing operation of the fixed components 100 can be facilitated. Further, since the partition plate 8 also serves as the rib 6 that reinforces the partition wall 5, the rigidity of the partition wall 5 can be improved.

  The rib 6 includes a capacitor fixing portion 71 that fixes the smoothing capacitor 12 and a sensor fixing portion 72 that fixes the current sensor 13 as the component fixing portion 7. Therefore, the semiconductor module 2, the smoothing capacitor 12, and the current sensor 13 can be easily arranged at adjacent positions. As a result, the connection / wiring between them can be shortened, and the power converter 1 can be downsized.

  As described above, according to this example, it is possible to provide a power conversion device that can ensure the strength of the case while preventing an increase in size.

(Example 2)
In this example, as shown in FIG. 4, a plurality of component fixing parts 7 (capacitor fixing part 71 and sensor fixing part 72) are arranged in the stacking direction X. In this example, the component fixing portion 7 on the front wall portion 421 side in the stacking direction X in the rib 6 is the capacitor fixing portion 71, and the component fixing portion 7 on the rear wall portion 422 side is the sensor fixing portion 72.

  The partition plate 8 of this example has a crank shape when viewed from the height direction Z. That is, the partition plate 8 is formed in the lateral direction with the first partition portion 81 and the third partition portion 83 formed in the stacking direction X, and the end portions of the first partition portion 81 and the third partition portion 83 are connected to each other. It consists of the 2nd partition part 82 connected.

  Specifically, the first partition portion 81 is formed on the end portion on the side wall portion 423 side in the lateral direction Y of the rib 6. The third partition portion 83 is formed on the end portion on the side wall portion 424 side in the lateral direction Y of the rib 6. The first partition portion 81 and the third partition portion 83 are formed up to the approximate center of the component fixing portion 7 in the stacking direction X. And the 2nd partition part 82 is formed so that the edge part of the mutually close side of the 1st partition part 81 and the 3rd partition part 83 may be connected.

  Others are the same as in the first embodiment. Of the reference numerals used in this example or the drawings relating to this example, the same reference numerals as those used in the first embodiment denote the same components as in the first embodiment unless otherwise specified.

In the case of this example, since the plurality of component fixing portions 7 (capacitor fixing portion 71 and sensor fixing portion 72) are located at positions overlapping in the stacking direction X, the width of the rib 6 in the lateral direction Y can be reduced. Further, the power conversion device 1 can be further reduced in size.
In addition, the same effects as those of the first embodiment are obtained.

  In addition to the capacitor and the current sensor, the fixed component may be other components such as a fuse.

DESCRIPTION OF SYMBOLS 1 Power converter 10 Semiconductor lamination | stacking unit 100 Fixed component 11 Pressurizing member 2 Semiconductor module 31 Cooling pipe 4 Case 5 Partition 6 Rib X Stacking direction

Claims (4)

A capacitor (12) for smoothing DC power;
A current sensor (13) for detecting the current of the AC power;
A case (4) for housing the capacitor and the current sensor;
The said capacitor | condenser and the said current sensor are the power converter devices (1) arrange | positioned in a different area | region through the metal 1st partition (401) formed in the said case.   The semiconductor module further includes a semiconductor module (2) housed in the case, and the semiconductor module and the capacitor are in different regions with a second partition (402) formed in the case connected to the first partition. The semiconductor module and the current sensor are arranged in different regions with a metal third partition wall (403) formed in the case connected to the first partition wall and the second partition wall. The power conversion device according to claim 1.   The capacitor is held by a metal capacitor fixing portion (71) formed in the case so as to be connected to the first partition, and the current sensor is formed in the case so as to be connected to the capacitor fixing portion. The power converter according to claim 1, wherein the power converter is held by a metal sensor fixing portion (72).   There is further provided a refrigerant flow path through which a cooling medium flows, the refrigerant flow path is in contact with the case, and the capacitor fixing portion and the sensor fixing portion are in thermal contact with the refrigerant flow path. The power conversion device according to claim 3.

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