JP2018163922A - Wiring pattern sheet and manufacturing method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent failure or disconnection of a conductive portion in which a top surface in a layer is exposed in connection with a wiring pattern sheet, in which a wiring pattern of a conductive region is formed, and a manufacturing method thereof.SOLUTION: In a wiring pattern sheet 11, a pattern layer 13 is provided on a surface of a base material 12, the pattern layer 13 comprises a first conductive region 21 which has a conductive characteristic in a sinter state of conductive metal particles sintered by light irradiation, and in which a top surface is exposed, and an insulation region 22 which has an insulating characteristic as a whole using a member including the conductive metal particles in a non-sintered state to surround the conductive region 21, and height of the top surface of the insulation region 22 is almost same as the conductive region 21.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a wiring pattern sheet on which a wiring pattern of a conductive region is formed and a manufacturing method thereof.

  In recent years, when a wiring pattern of a printed board used in an electronic device or the like is formed, it is also formed by printing using a conductive paste instead of etching. In a wiring pattern formed using such a conductive paste, it is necessary to expose the conductive part, but it is necessary to prevent breakage or disconnection of the conductive part due to external impact or friction. There is.

  Conventionally, along with miniaturization of electronic devices, finer and narrower pitches are required for wiring patterns formed using conductive paste, but screen printing causes pattern blurring and edge distortion. Occurs, resulting in a pattern short. In addition, the specifications of the screen plate that can be used are limited by the printing of fine wiring, and in the plate that can be used, the coating amount decreases, the pattern film thickness decreases, and the conductivity of the conductive portion decreases. .

  Therefore, a binder mainly composed of metal powder and ultraviolet curable resin is formed on the substrate, a mask film is stacked on the substrate side, and the binder is cured by irradiating ultraviolet rays from above to uncured portions. A technique is known in which a conductive pattern is formed by removing (Patent Document 1).

  In addition, a photo-baked ink is formed on the substrate in the shape of a conductive pattern, and the photo-fired ink is cured by irradiating ultraviolet rays to form a conductive film, and a rust inhibitor is applied on the conductive film. This technique is also known (Patent Document 2).

JP 63-053993 A JP 2006-062732 A

  However, in the technique of the above-mentioned patent document 1, it is possible to control the bleeding of the wiring pattern and the edge portion disturbance and to control the film thickness of the wiring pattern. However, since only the wiring pattern remains on the substrate, the substrate There is a problem in that there is a pattern step, and the pattern break may occur due to an external impact, friction or the like with this portion as a base point. Further, the techniques of Patent Documents 1 and 2 have a problem in that operability is poor because a process of removing an unnecessary part that becomes an uncured part at the time of pattern formation and a process of applying a rust preventive are necessary.

  Therefore, the present invention has been made in view of the above problems, and an object of the present invention is to provide a wiring pattern sheet and a method for manufacturing the same, which prevent damage and disconnection of a conductive portion whose upper surface is exposed in one layer.

  In order to solve the above problems, in the invention of claim 1, at least one surface of the base material is provided with one pattern layer, and the pattern layer is in a sintered state of conductive metal particles that are sintered by light irradiation. A conductive region having an electrically conductive property and an upper surface exposed; and a member including the conductive metal particles in a non-sintered state and having an insulating property as a whole, the height of the upper surface of the insulating region. Is an insulating region substantially equivalent to the conductive region.

  The invention according to claim 2 is a method of manufacturing a wiring pattern sheet in which the one pattern layer provided on at least one surface of the base material is a conductive region and an insulating region whose upper surface is exposed, A first step of forming a pattern forming layer by applying a member having insulating properties as a whole containing conductive metal particles sintered by light irradiation, and the conductive region on the formed pattern forming layer A second step of positioning an exposure mask having an opening formed therein, light irradiation from the exposure mask side, and sintering the conductive metal particles in the light irradiated region to form the conductive region having conductive properties; And a third step of using the pattern forming layer as a pattern layer as an insulating region having an insulating property including the conductive metal particles in a non-sintered state. .

In invention of Claims 3 and 4, it is set as the composition "including the process of drying the formation layer after the 1st process",
“After the second step, at least the step of pressing the conductive region with a predetermined pressure is included”.

  According to the invention of claim 1, in the wiring pattern sheet, one pattern layer is provided on at least one surface of the substrate, and the pattern layer is sintered by light irradiation. A conductive region having a conductive property and an upper surface exposed, and a member containing non-sintered conductive metal particles and an insulating region having an insulating property as a whole, and the height of the upper surface of the insulating region. By adopting a configuration that is substantially equivalent to the conductive region, the insulating region that is in close contact with the conductive region is positioned at the edge portion of the conductive region, and is damaged due to external impact or friction on the conductive region. It is possible to prevent disconnection.

  According to the invention of claim 2, in the first step, a member having insulating properties as a whole containing conductive metal particles to be sintered by light irradiation is applied on the substrate to form a pattern forming layer. In the second step, an exposure mask in which a portion to be a conductive region is opened is positioned on the formed pattern formation layer, and light is irradiated from the exposure mask side in the third step, and the conductive metal in the light irradiated region The pattern forming layer is configured as a pattern layer as a conductive region having conductive properties by sintering particles and another region as an insulating region having insulating properties including the conductive metal particles in a non-sintered state. Thus, a conductive region and an insulating region can be formed simultaneously with one layer, and an unnecessary portion is not present and a removal step is eliminated, thereby improving operability efficiency.

  According to the invention of claim 3, by adopting a configuration in which the formation layer is dried after the first step of applying the formation layer, the formation layer can be quickly transferred to the second step without waiting for natural drying. It can be done.

  According to the invention of claim 4, the metal particles are sintered in the conductive region by adopting a configuration in which at least the conductive region is pressed at a predetermined pressure after the third step as the pattern layer of the conductive region and the insulating region. In the case where voids are produced, the voids can be crushed to improve conductivity.

It is a lineblock diagram of a wiring pattern sheet concerning the present invention. It is a basic manufacturing process figure concerning 1st Embodiment of the wiring pattern sheet | seat of FIG. It is explanatory drawing of the usage example of the wiring pattern sheet | seat of FIG. It is a manufacturing process figure concerning 2nd Embodiment of the wiring pattern sheet | seat of FIG. It is a manufacturing-process figure concerning 3rd Embodiment of the wiring pattern sheet | seat of FIG.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the present embodiment, dimensions are ignored in the cross-sectional views and the like shown in the drawings for easy understanding.
FIG. 1 shows a configuration diagram of a wiring pattern sheet according to the present invention. 1A is a plan view, and FIG. 1B is a cross-sectional view taken along the line AA in FIG. 1A and 1B, a wiring pattern sheet 11 is provided with a pattern layer 13 on one surface on a substrate 12 such as a resin film.

  The pattern layer 13 is provided with a conductive region 21 having a conductive property in a sintered state of conductive metal particles (for example, copper particles) sintered by light irradiation and having an upper surface exposed. A member (for example, resin) including the conductive metal particles in a non-sintered state has an insulating property as a whole so as to surround the conductive region 21, and the height of the upper surface is substantially equal to that of the conductive region 21. An insulating region 22 is provided. That is, the pattern layer 13 includes only the conductive region 21 and the insulating region 22. The pattern of the conductive region 21 is various conductive patterns such as for various wirings such as an electronic circuit and an RFID antenna.

  In such a wiring pattern sheet 11, the heights of the upper surfaces of the conductive region 21 and the insulating region 22 are substantially equal, so that the insulating region 22 adjacent to the conductive region 21 in close contact with the conductive region 21 It is positioned at the edge portion, and can be prevented from being broken or disconnected by an external impact or friction with respect to the conductive region 21. The pattern layer 13 may also be formed on the back surface of the substrate 12 to form a double-sided pattern wiring pattern sheet.

  FIG. 2 shows a basic manufacturing process diagram according to the first embodiment of the wiring pattern sheet of FIG. First, in FIG. 2A, a pattern is formed by applying a so-called conductive paste as a member having an insulating property containing conductive metal particles sintered by light irradiation on a base material 12 such as a resin film. Layer 31 is formed (first step). The conductive paste used for the pattern forming layer 31 is a member having insulating properties as a whole and containing conductive metal particles that are sintered by light irradiation, for example, improved printing properties such as epoxy resin and polyvinylpyrrolidone resin. The resin for the above contains a solvent (a solvent generally known as one used for a conductive paste) and copper particles as conductive metal particles sintered by light irradiation.

  The coating thickness of the conductive paste is appropriately set as a thickness that can be adapted as a circuit. In addition, for example, a coating method such as screen printing capable of solid surface printing by thick coating, a spin coating method, and an ink jet method can be applied.

  Subsequently, as shown in FIG. 2B, an exposure mask 32 having a portion to be a conductive region opened is positioned on the formed pattern formation layer 31 (second step). The exposure mask 32 is made of, for example, metal and has heat resistance against a temperature of several hundred degrees. Therefore, as shown in FIG. 2C, light is irradiated from the exposure mask side (third step). For the light irradiation, pulse light of 200 to 1000 nm is irradiated by, for example, a xenon lamp. That is, this is a process of irradiating the pattern forming layer 31 with pulsed light for a short time, so that the exposure mask 33 is not excessively heated by using pulsed light.

  Then, as shown in FIG. 2 (D), the conductive metal particles that have absorbed the light are converted into heat in the pattern forming layer 31 by the light irradiation, and the resin or the like included for improving the printability. As a result, the conductive metal particles are fused to each other to be in a sintered state, so that a conductive region 21 having a low conductive property is formed.

  On the other hand, the region that is not irradiated with light by the exposure mask 32 remains insulative even if the non-sintered conductive metal particles are contained, and the region remains as the insulating region 22. As a result, the pattern layer 13 composed only of the conductive region 21 and the insulating region 22 is formed on the substrate 11.

  Unlike the conventional etching process, the process of such a manufacturing process leaves the non-exposed part as the insulating region 22 unlike the conductive process in the non-light-irradiated part and the removal process of the light-irradiated part. Further, it is possible to improve the operability by eliminating the removal process such as the etching process, and it is possible to simultaneously form the conductive region 21 and the insulating region 22 with one pattern formation layer 31 (pattern layer 13). Is.

  The wiring pattern sheet 11 manufactured by the above manufacturing method is as shown in FIG. 1, and as described above, the insulating region 22 can prevent the conductive region 21 from being damaged or disconnected due to external impact or friction. It can be done. In addition, since the conductive region 21 is formed from the same pattern forming layer 31 as the insulating region 22, the height of the upper surface of the conductive region 21, which is a sintered state of the conductive metal particles, is the non-conductive layer of the conductive metal particles. Although it may be slightly lower than the insulating region 22 in the sintered state, it will be treated as substantially equivalent. That is, the height of the upper surface of the conductive region 21 does not become higher than the height of the upper surface of the insulating region 22, and the insulating region 22 can serve to protect the conductive region 21 as described above.

  By the way, although the case where the resin film was used as the said base material 12 was shown, papers may be sufficient. In this case, the moisture contained in the pattern forming layer 31 may be slightly absorbed by the papers and slightly stretched. However, the moisture is evenly absorbed by the entire surface of the substrate, so that the conductive region 21 and the insulating region 22 are not much formed. It doesn't matter. For completeness, a fast-drying solvent may be used as the solvent contained in the conductive paste, and it can be dealt with by a drying treatment step shown in FIG.

  Next, FIG. 3 shows an explanatory diagram of a usage example of the wiring pattern sheet of FIG. 3A is a plan view, and FIG. 3B is a cross-sectional view taken along line BB in FIG. 3A. 3A and 3B, when the conductive pattern 21 is formed as an RFID antenna, for example, the wiring pattern sheet 11 has a lower surface electrically connected to each end between the ends of the conductive area 21. A wiring extension layer 41 having conductive portions 42A and 42B and an insulating portion 43, which are connected and exposed at the upper surface, is provided.

  The wiring extension layer 41 can be formed on the wiring pattern sheet 11 using, for example, a resist material, and the wiring extension layer 41 can also be manufactured by the same manufacturing method as the wiring pattern sheet 11. In these cases, even if the conductive region 21 is slightly lowered, the electrical connection is not affected by the use of a resist material or conductive paste.

  Conductive jumper lines 51A and 51B made of a member such as a conductive metal are formed on the conductive portions 42A and 42B exposed on the upper surface of the wiring extension layer 41, and the chip 51 is formed between the conductive jumper lines 51A and 51B. It becomes RFID by mounting.

  Next, FIG. 4 shows a manufacturing process diagram according to the second embodiment of the wiring pattern sheet of FIG. The manufacturing process shown in FIG. 4 includes a drying process after the first process shown in FIG. That is, in FIG. 4A, after the pattern forming layer 31 is formed on the substrate 12, the applied pattern forming layer 31 is heated at a predetermined temperature as shown in FIG. 4B. And dry. For example, the drying temperature is preferably 40 ° C to 150 ° C. The drying time is preferably 1 to 60 minutes.

  That is, since the exposure mask is superimposed on the pattern formation layer 31 during the light irradiation in the second step, the surface needs to be dried, and the solvent remaining in the pattern formation layer 31 is removed by the drying process. The As a result, the generation of minute cracks and voids due to the vaporization and expansion of the solvent contained in the conductive paste can be reduced. The necessity or necessity of the drying treatment depends on the material components of the conductive metal particles in the conductive paste.

  Then, as shown in FIG. 4C, an exposure mask 32 in which a portion to be a conductive region is opened is positioned on the formed pattern formation layer 31, and exposure is performed as shown in FIG. By irradiating light from the mask side, as shown in FIG. 4E, the pattern layer 13 of the conductive region 21 and the insulating region 22 as shown in FIG. 2D is formed.

  Next, FIG. 5 shows a manufacturing process diagram according to the third embodiment of the wiring pattern sheet of FIG. The manufacturing process shown in FIG. 5 includes a pressing process after the third process shown in FIG. That is, in FIG. 5A, the pattern forming layer 31 is formed on the base material 12, and as shown in FIG. 5B, a portion to be a conductive region is formed on the formed pattern forming layer 31. The exposed exposure mask 32 is positioned and irradiated with light from the exposure mask side as shown in FIG. 5C, thereby pattern layers of the conductive region 21 and the insulating region 22 as shown in FIG. 13 is once formed.

  Subsequently, as shown in FIG. 5D, the pattern layer 13 on the substrate 12 is pressed by, for example, two press rollers 35A and 35B. The pressurizing pressure is preferably 100 to 2000 N / mm. The roll temperature is preferably 60 to 200 ° C. In addition, although the processing process of the said press was shown as the case where line pressurization was carried out with two press rollers 35A and 35B, you may surface-press using a flat plate. Then, as shown in FIG. 5E, the pattern layer 13 of the conductive region 21 and the insulating region 22 as shown in FIG. 2D is formed.

  That is, the inside of the conductive region 21 obtained in the light irradiation process by the above-described press treatment process has a void in the resin portion that has been sublimated due to rapid heat generation, and thus the void existing in the inside is crushed by the press process. Thus, the conductivity can be further improved.

  The necessity of the pressing step depends on the material component of the conductive metal particles in the conductive paste to be used, and there is no need to dare if high conductivity is not particularly required for the low-resistance conductive region 21. It is processing.

  By the way, it is good also as a processing process which included both 2nd Embodiment of the above-mentioned FIG. 4 and 3rd Embodiment of FIG.

  The wiring pattern sheet and the manufacturing method thereof of the present invention can be used in industrial fields such as manufacturing, use, and sales related to a wiring board.

DESCRIPTION OF SYMBOLS 11 Wiring pattern sheet 12 Base material 13 Pattern layer 21 Conductive area 22 Insulating area 31 Pattern formation layer 32 Exposure mask 33 Irradiation light 34 Irradiation light for drying 35A, 35B Press roller 41 Wiring extension layer 42A, 42B Conductive part 43 Insulating part 51 Chip 51A, 51B Conductive jumper wire

Claims (4)

A pattern layer is provided on at least one surface of the substrate;
The pattern layer includes a conductive region having conductive properties in a sintered state of conductive metal particles sintered by light irradiation, and an upper surface exposed, and a member including the conductive metal particles in a non-sintered state. And consisting of an insulating region having insulating properties as a whole,
A wiring pattern sheet, wherein the upper surface of the insulating region is substantially equal to the conductive region. One pattern layer provided on at least one surface of the substrate is a method for producing a wiring pattern sheet in which the upper surface is a conductive region and an insulating region,
A first step of forming a pattern forming layer by applying a member having insulating properties as a whole containing conductive metal particles sintered by light irradiation on a substrate;
A second step of positioning an exposure mask in which a portion to be the conductive region is opened on the formed pattern forming layer;
Irradiating light from the exposure mask side, the conductive metal particles in the irradiated region are sintered to form the conductive region having conductive properties, and the other region includes the conductive metal particles in a non-sintered state. A third step of using the pattern forming layer as a pattern layer as an insulating region having insulating properties;
A method for producing a wiring pattern sheet, comprising:   The method for manufacturing a wiring pattern sheet according to claim 2, further comprising a step of drying the formation layer after the first step.   4. The method for manufacturing a wiring pattern sheet according to claim 2, further comprising a step of pressing at least the conductive region with a predetermined pressure after the third step.

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