JP2018160555A - Component mounting machine, component recognition method, and component recognition program - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make it possible to efficiently take images of a plurality of components P held by a mounting head 4 under lighting conditions C corresponding to the respective components P.SOLUTION: Imaging processes I1-I3 include taking images of components P in different object regions R with an imaging unit 55 while a light emitting unit 51 is emitting light to the components P under different lighting conditions C1-C3. The plurality of components P are associated with the respective imaging processes I1-I3 of emitting light under the lighting conditions C1-C3 suitable for them, and in each of the imaging processes I1-I3, an object region R is set for each of the components P associated with the respective imaging processes I1-I3. This allows images of the components P suitable for the respective lighting conditions C1-C3 of the imaging processes I1-I3 at each of the imaging processes I1-I3 to be obtained. Thus, regardless of difference or sameness of the lighting conditions C1-C3 suitable for the respective components P held by the mounting head 4, an image of each component P can be taken under the suitable condition C1-C3.SELECTED DRAWING: Figure 9

Description

  The present invention relates to a technique for imaging a plurality of components held by a mounting head for mounting components on a substrate.

  In the component mounting machine of Patent Document 1, the mounting head has a plurality of suction nozzles, and each suction nozzle sucks components from the component supply device and mounts them on the substrate. At this time, imaging of a plurality of components held by the mounting head is executed as appropriate. Specifically, the component is imaged by acquiring an image of the component with a CMOS image sensor while irradiating the component with light. In particular, in Patent Document 1, control is performed such that the exposure time of the CMOS image sensor is changed according to the part.

JP 2010-212449 A

  By the way, in recent years when the characteristics of parts such as shape and material have diversified, there is a limit to realizing acquisition of a good part image by adjusting parameters of an imaging unit (COMS image sensor) such as exposure time. There are cases where it is required to irradiate light under different lighting conditions. However, in order to irradiate light with illumination conditions corresponding to all of the plurality of components held by the mounting head, it is inefficient to select and hold a plurality of components with the same illumination conditions on the mounting head.

  The present invention has been made in view of the above-described problems, and enables a technology to image each component under appropriate illumination conditions regardless of differences in illumination conditions suitable for each of the plurality of components held by the mounting head. The purpose is to provide.

  A component mounter according to the present invention includes a mounting head that holds a plurality of components, a light irradiation unit that irradiates light to the components, an imaging unit that selectively images components in a predetermined target region of the visual field, Acquire captured images of multiple components by sequentially executing multiple imaging processes in which the imaging unit images components in different target areas while irradiating light from the light irradiation unit under different illumination conditions. An imaging control unit and a storage unit that stores illumination conditions suitable for each of the plurality of components, and the imaging control unit associates the plurality of components with imaging processing that irradiates light with illumination conditions suitable for each of the components. In each of the plurality of imaging processes, a target region is set for a part associated with the imaging process among the plurality of parts.

  In the component recognition method according to the present invention, a component holding step of holding a plurality of components by the mounting head, and an imaging step of imaging the component by an imaging unit that selectively images a component in a predetermined target area in the field of view. In the imaging process, a plurality of components are sequentially executed by performing a plurality of imaging processes in which the imaging unit images the components in different target regions while irradiating the components from the light irradiation unit under different illumination conditions. Each captured image is acquired, and a plurality of components are associated with an imaging process that irradiates light under illumination conditions suitable for each, and each of the plurality of imaging processes is associated with the imaging process among a plurality of components. A target area is set for the selected part.

  In the component recognition program according to the present invention, the component holding step of holding a plurality of components by the mounting head, and the imaging step of imaging the component by the imaging unit that selectively images the component in the predetermined target area in the visual field. In the imaging process, in the imaging process, by sequentially executing a plurality of imaging processes in which the imaging unit images the components in the different target areas while irradiating the components from the light irradiation unit under different illumination conditions, Captured images of each of the plurality of components are acquired, and the plurality of components are associated with an imaging process that irradiates light under an illumination condition suitable for each of the plurality of components. A target area is set for the component associated with the.

  The present invention (component mounter, component recognition method, component recognition program) configured as described above performs a plurality of imaging processes using an imaging unit that selectively images components in a predetermined target area in the field of view. Run in order. Specifically, in the plurality of imaging processes, components in different target areas are imaged by the imaging unit while irradiating the components from the light irradiation unit under different illumination conditions. On the other hand, a plurality of components are associated with an imaging process that irradiates light under an illumination condition suitable for each, and each of the plurality of imaging processes is associated with the imaging process among the plurality of components. The target area is set for the selected part. Thereby, in each of the plurality of imaging processes, an image of a part suitable for the illumination condition in the imaging process is acquired. In other words, the plurality of parts are captured under the illumination condition suitable for each. In this way, each component can be imaged under an appropriate illumination condition regardless of the difference in illumination conditions suitable for each of the plurality of components held by the mounting head.

  In addition, a component supply unit that supplies components, a substrate holding unit that holds a substrate on which a plurality of components picked up from the component supply unit by the mounting head are mounted, and a position where the mounting head mounts the component on the substrate are The mounting head further includes a head control unit that adjusts based on the captured image. When the mounting head picks up a plurality of components from the component supply unit, the plurality of components are passed through the field of view of the imaging unit and then mounted on the substrate. Then, the imaging control unit may configure the component mounter so as to acquire a captured image of each of the plurality of components by executing a plurality of imaging processes while the plurality of components are moving within the field of view. In such a configuration, it is possible to efficiently execute a plurality of imaging processes while a plurality of components are moving from the component supply unit to the substrate.

  In addition, a reference mark is attached to the mounting head, the imaging control unit images the reference mark by the imaging unit in each of a plurality of imaging processes, and the head control unit mounts each of the plurality of components on the substrate. The component mounter may be configured to adjust the position based on the captured image of the component and the result of capturing the reference mark in the imaging process of capturing the component. In such a configuration, it is possible to adjust the position where the component is mounted on the substrate with high accuracy based on the result of imaging the reference mark attached to the mounting head in each imaging process.

  In addition, a speed detection unit that detects the moving speed of the mounting head is further provided, and in each of the plurality of imaging processes, the position of the target region with respect to the component associated with the imaging process is detected by the speed detection unit. The component mounter may be configured to be determined based on the above. In such a configuration, it is possible to appropriately acquire the captured image of the component by appropriately setting the target area according to the movement of the mounting head.

  Specifically, the speed detection unit outputs the detected moving speed to the imaging control unit, and in each of the plurality of imaging processes, the position of the target region with respect to the component associated with the imaging process is determined by the imaging control unit. The component mounter may be configured to be calculated from the moving speed. Alternatively, the speed detection unit outputs the detected moving speed to the imaging control unit, and the imaging control unit outputs the moving speed received from the speed detection unit to the imaging unit. The component mounter may be configured such that the position of the target region with respect to the component associated with is calculated from the moving speed by the imaging unit.

  The head control unit further includes a speed detection unit that detects the movement speed of the mounting head, and the head control unit determines a position at which each of the plurality of components is mounted on the substrate, a captured image of the component, and a movement speed detected by the speed detection unit. In each of the plurality of imaging processes, the component mounter is adjusted so that the position of the target area with respect to the component associated with the imaging process is determined based on the moving speed detected by the speed detecting unit. It may be configured. In such a configuration, the position where the component is mounted on the substrate can be adjusted with high accuracy based on the moving speed of the mounting head detected by the speed detector. In addition, the target area can be appropriately set according to the movement of the mounting head, and an image of the component can be accurately acquired.

  Various specific details of the illumination conditions are conceivable. For example, the component mounter may be configured so that the illumination condition includes the illuminance of light irradiated to the component from the light irradiation unit. The light irradiator has a plurality of illuminations that irradiate the component from different angles, and the illumination condition configures the component mounter so as to include a combination of illuminances of light emitted by each of the plurality of illuminations. Also good. Or you may comprise a component mounting machine so that illumination conditions may include the wavelength of the light irradiated to components from a light irradiation part.

  In addition, conditions different from the illumination conditions can be changed by the imaging process. For example, the focus of the imaging unit is variable, and the plurality of imaging processes are performed by imaging the components in the target area by the imaging unit with the focus of the imaging unit adjusted to the focus determined for each of the imaging units. An imaging processing unit that stores the focal point of the imaging unit suitable for each of the components, and the imaging control unit irradiates the plurality of components with light under illumination conditions suitable for each of the components, and also captures an image with the imaging unit with a focus suitable for each of the components. The component mounter may be configured so as to be associated with.

  According to the present invention, it is possible to image each component under an appropriate illumination condition regardless of the difference in illumination condition suitable for each of the plurality of components held by the mounting head.

The partial top view which shows typically the component mounting machine which concerns on this invention. The block diagram which shows the electrical constitution with which the component mounting machine of FIG. 1 is provided. The figure which shows typically an example of a structure of the component recognition camera with which the component mounting machine of FIG. 1 is provided. The figure which shows typically an example of the condition data which defined the illumination conditions according to the kind of components. The flowchart which shows an example of the component mounting which the component mounting machine of FIG. 1 performs. The flowchart which shows an example of the component recognition performed by the component mounting of FIG. The figure which shows typically an example of the adsorption | suction group used as the object of the component recognition of FIG. The figure which shows an example of the imaging process with respect to the adsorption | suction group shown in FIG. The figure which shows an example of the setting aspect of the object area | region with respect to the adsorption | suction group shown in FIG. The figure which shows the 1st modification of the setting aspect of the object area | region with respect to the adsorption | suction group shown in FIG. The figure which shows the 2nd modification of the setting aspect of the object area | region with respect to the adsorption | suction group shown in FIG. The figure which shows typically an example of the condition data which determined the illumination condition according to the kind of components, and the focus. The figure which shows the modification of the imaging process with respect to the adsorption | suction group shown in FIG.

  FIG. 1 is a partial plan view schematically showing a component mounter according to the present invention. FIG. 2 is a block diagram showing an electrical configuration of the component mounter of FIG. In FIG. 1 and the following figures, XYZ orthogonal coordinates with the Z direction as the vertical direction are shown as appropriate. As shown in FIG. 2, the component mounter 1 includes a controller 100 that comprehensively controls the entire apparatus. The controller 100 is a computer having an arithmetic processing unit 110 which is a processor configured by a CPU (Central Processing Unit) and a RAM (Random Access Memory) and a storage unit 120 configured by an HDD (Hard Disk Drive). Further, the controller 100 includes a drive control unit 130 that controls the drive system of the component mounter 1 and an imaging control unit 140 that controls the imaging system of the component mounter 1.

  Then, the arithmetic processing unit 110 controls the drive control unit 130 and the imaging control unit 140 according to the program S stored in the storage unit 120, thereby executing component mounting specified by the program S. At this time, the arithmetic processing unit 110 controls component mounting based on the image captured by the imaging control unit 140 by the component recognition camera 5. Further, the component mounter 1 is provided with a display / operation unit 150, and the arithmetic processing unit 110 displays the status of the component mounter 1 on the display / operation unit 150, or inputs it to the display / operation unit 150. Or accepting instructions from a designated worker.

  As shown in FIG. 1, the component mounter 1 includes a pair of conveyors 12 and 12 provided on a base 11. And the component mounting machine 1 mounts components on the board | substrate B carried in to the mounting process position (position of the board | substrate B of FIG. 1) from the upstream of the X direction (board | substrate conveyance direction) with the conveyor 12, and mounts components. The completed board B is carried out from the mounting processing position to the downstream side in the X direction by the conveyor 12.

  The component mounter 1 includes a pair of Y-axis rails 21 and 21 extending in the Y direction, a Y-axis ball screw 22 extending in the Y direction, and a Y-axis motor My (servo motor) that rotationally drives the Y-axis ball screw 22. The X-axis rail 23 is fixed to the nut of the Y-axis ball screw 22 while being supported by the pair of Y-axis rails 21 and 21 so as to be movable in the Y direction. An X-axis ball screw 24 extending in the X direction and an X-axis motor Mx (servo motor) that rotationally drives the X-axis ball screw 24 are attached to the X-axis rail 23, and the head unit 20 is attached to the X-axis rail 23. The nut is fixed to the nut of the X-axis ball screw 24 while being supported so as to be movable in the direction. Therefore, the drive control unit 130 rotates the Y-axis ball screw 22 by the Y-axis motor My to move the head unit 20 in the Y direction, or rotates the X-axis ball screw 24 by the X-axis motor Mx to move the head unit 20 to X. Can be moved in the direction.

  Two component supply units 3 are arranged in the X direction on both sides of the pair of conveyors 12 and 12 in the Y direction. A plurality of tape feeders 31 are detachably mounted side by side in the X direction on each component supply unit 3. The tape feeder 31 extends in the Y direction, and has a component supply location 32 at the tip on the head unit 20 side in the Y direction. Then, a tape containing small piece parts such as an integrated circuit, a transistor, and a capacitor at predetermined intervals is loaded in the tape feeder 31. Each tape feeder 31 intermittently feeds the tape toward the head unit 20 in the Y direction. As a result, the components in the tape are sent out in the Y direction (feed direction), and are sequentially supplied to the component supply locations 32 of each tape feeder 31.

  The head unit 20 includes a so-called rotary type mounting head 4. That is, the mounting head 4 has a plurality of (eight) nozzles 41 that are circumferentially arranged at equiangular intervals, and the mounting head 4 sucks and mounts components by the nozzles 41. Specifically, the mounting head 4 moves above the tape feeder 31 and sucks (picks up) the components supplied to the component supply location 32 by the tape feeder 31 by the nozzles 41. The mounting head 4 holds a plurality of components in this manner and moves above the substrate B at the mounting processing position to mount each component on the substrate B.

  Furthermore, the component mounting machine 1 includes a component recognition camera 5 attached to the base 11 facing upward, between two component supply units 3 arranged in the X direction. The component recognition camera 5 captures an image of the component adsorbed by the nozzle 41 of the mounting head 4 positioned above from below while keeping it in its field of view F. Then, the arithmetic processing unit 110 can determine the suction state of the component by the nozzle 41 based on the imaging result of the component recognition camera 5 acquired via the imaging control unit 140.

  FIG. 3 is a diagram schematically showing an example of the configuration of a component recognition camera provided in the component mounter of FIG. The component recognition camera 5 includes a light irradiation unit 51 that irradiates light to components held by the mounting head 4, an imaging unit 55 that images the component irradiated with light from the light irradiation unit 51 from below, and a light irradiation unit. 51 and a housing 59 that supports the imaging unit 55. A concave portion 591 is formed in the upper portion of the housing 59, and a slit 592 that opens in the Z direction is provided in the bottom portion of the concave portion 591. An internal space 593 is provided below the slit 592 in the housing 59.

  The light irradiation unit 51 includes a main illumination 511, a side illumination 512, and a coaxial illumination 513. Each of the main illumination 511, the side illumination 512, and the coaxial illumination 513 has a configuration in which a plurality of LEDs (Light Emitting Diodes) are two-dimensionally arranged. The main illumination 511 is disposed on the lower side of the inner wall of the recess 591 to irradiate light to the component from obliquely below, and the side illumination 512 is disposed on the upper side of the main illumination 511 on the inner wall of the recess 591, The part is irradiated with light. The coaxial illumination 513 is disposed on the inner wall of the internal space 593 and irradiates the component with light from below through the beam splitter 57. That is, the beam splitter 57 is arranged in the internal space 593 of the housing 59, and the light emitted from the coaxial illumination 513 is reflected by the beam splitter 57 and then passes through the slit 592 and is irradiated to the component.

  The imaging unit 55 is disposed in the internal space 593 of the housing 59 and faces the slit 592 from below. A beam splitter 57 is disposed between the slit 592 and the imaging unit 55, and the imaging unit 55 is reflected by the component illuminated by the light irradiation unit 51 and then passes through the slit 592 and the beam splitter 57. Image. The imaging unit 55 forms an image on the area sensor 551 and an area sensor 551 configured by a solid-state imaging device such as a complementary MOS (COMS) image sensor or a charge-coupled device (CCD) image sensor, and light reflected by the components. Lens 552. Furthermore, the imaging unit 55 includes a sensor controller 553 that controls the area sensor 551, and the sensor controller 553 selectively captures a target region (ROI: Region of Interest) in the field of view F of the imaging unit 55. Have

  The component recognition camera 5 captures an image of the component by the imaging unit 55 while properly using the main illumination 511, the side illumination 512, and the coaxial illumination 513 according to the characteristics of the component to be imaged. For example, when imaging a QFP (Quad Flat Package) component, the main illumination 511 and the coaxial illumination 513 are turned on, and when imaging a BGA (Ball grid array) or CSP (Chip size package) component, It can be used properly such as turning on the illumination 512.

  FIG. 4 is a diagram schematically showing an example of condition data that defines illumination conditions according to the type of component. In the example of the figure, the illuminance of light emitted from the main illumination 511, the side illumination 512, and the coaxial illumination 513 is switched in eight stages. And the combination of the illumination intensity of the light which each of the main illumination 511, the side illumination 512, and the coaxial illumination 513 irradiates, that is, the illumination condition C is determined according to the component type Pk. For example, for the components of the component types Pk1, Pk2, Pk4, and Pk9, an illumination condition C1 for turning on the main illumination 511 and the coaxial illumination 513 with an illuminance of 5/8 and turning off the side illumination 512 is defined. The condition data Dl is obtained based on the result of testing in advance for each component type Pk and stored in the storage unit 120 or the like.

  FIG. 5 is a flowchart showing an example of component mounting executed by the component mounting machine of FIG. The flowchart in the figure is executed by the control of the arithmetic processing unit 110 according to the program S. When component mounting is started, the mounting head 4 moves above the component supply unit 3 (step S101), and a plurality of components are simultaneously held by sucking components from the component supply unit 3 in order by the nozzles 41. (Step S102). Here, a group composed of a plurality of components held by the mounting head 4 at a time is referred to as a suction group.

  Then, the mounting head 4 moves above the closest component recognition camera 5 of the two component recognition cameras 5 (step S103), and the imaging control unit 140 recognizes the component held by the mounting head 4 as a component. This is executed by the recognition camera 5 (step S104). Specifically, the component recognition camera 5 captures images of a plurality of components moving within the field of view F, acquires images of the plurality of components, and outputs them to the imaging control unit 140. The imaging control unit 140 recognizes the positional relationship between the nozzle 41 and the component based on the image of each component. Details of component recognition will be described later.

  Subsequently, the mounting head 4 moves above the substrate B (step S105), and the components of the suction group are sequentially mounted on the substrate B (step S106). At this time, the drive control unit 130 controls the drive system such as the X-axis motor Mx and the Y-axis motor My based on the result of component recognition by the imaging control unit 140, thereby determining the position where each component is mounted on the board B. adjust. Then, until mounting of all the components is completed (“YES” in step S107), steps S101 to S107 are repeated, and then the component mounting in FIG.

  FIG. 6 is a flowchart showing an example of component recognition executed in the component mounting of FIG. The flowchart in the figure is executed by the control of the arithmetic processing unit 110 according to the program S. 7 is a diagram schematically showing an example of a suction group that is a target of component recognition in FIG. 6, FIG. 8 is a diagram showing an example of an imaging process for the suction group shown in FIG. 7, and FIG. It is a figure which shows an example of the setting aspect of the object area | region with respect to the adsorption | suction group shown in FIG.

  In step S <b> 201, the imaging control unit 140 generates an imaging process I to be executed for a plurality of components P belonging to the suction group according to the illumination condition C suitable for each component P. According to the condition data Dl shown in FIG. 4, in the example of FIG. 7, the illumination condition C of the three parts P of the part type Pk1 among the eight parts P constituting the suction group is the illumination condition C1. The illumination condition C of one part P of the type Pk3 and two parts P of the part type Pk7 is the illumination condition C2, and the illumination of one part P of the part type Pk5 and one part P of the part type Pk6 Condition C is illumination condition C3. Therefore, the imaging control unit 140 classifies the parts P on the basis of the illumination condition C, and performs the imaging process I1 for each illumination condition C so that the parts P having the same illumination condition C are simultaneously imaged by one imaging process I. ~ I3 is generated. That is, as shown in FIG. 8, an imaging process I1 for imaging the part P of the part type Pk1 under the illumination condition C1, an imaging process I2 for imaging the part P of the part type Pk3 and the part type Pk7 under the illumination condition C2, and the illumination The imaging process I3 for imaging the component P of the component type Pk5 and the component type Pk6 is generated under the condition C3. Accordingly, the plurality of components P are associated with the imaging processes I1 to I3 that irradiate light under the illumination conditions C1 to C3 suitable for each.

  When the imaging process I is generated, the count value N of the number of executions of the imaging process I is reset to zero (step S202), and then the count value N is incremented (step S203). In step S <b> 204, the imaging control unit 140 sets the illumination condition C <b> 1 in the imaging process I <b> 1 corresponding to the current count value N (= 1) in the light irradiation unit 51 of the component recognition camera 5. Further, in step S205, the imaging control unit 140 instructs the sensor controller 553 to set the target region R for the component P of the component type Pk1 that is the imaging target in the imaging process I1. As a result, as shown in the column “Imaging process I1” in FIG. 9, a rectangular target region R that selectively includes the component P of the component type Pk1 in the field of view F of the imaging unit 55 is set.

  Then, with the light irradiation unit 51 irradiating the component P with light according to the illumination condition C1 (step S206), the imaging unit 55 exposes the area sensor 551 to perform imaging (step S207). Subsequently, the sensor controller 553 of the imaging unit 55 outputs the pixel data corresponding to the target region R in the visual field F from the area sensor 551 to the imaging control unit 140 (step S208). In this way, the imaging control unit 140 acquires the captured image of each component P that is the target of the imaging process I1.

  Further, the imaging processes I2 and I3 are executed by repeating steps S203 to S208 until the count value N reaches Nmax (= 3). That is, in the imaging process I2, the imaging unit 55 is set to include the components P of the component types Pk3 and Pk7 in the field of view F in a state where the light irradiation unit 51 irradiates the component P according to the illumination condition C2. The acquired image in the target area R is acquired (in the column “Imaging process I2” in FIG. 9). In the imaging process I3, the imaging unit 55 is set to include the components P of the component types Pk5 and Pk6 in the field of view F in a state where the light irradiation unit 51 irradiates the component P according to the illumination condition C3. The acquired image in the target region R is acquired (in the column “Imaging process I3” in FIG. 9).

  Thus, when the captured images of each of the eight components P belonging to the suction group are acquired, the component recognition in FIG. 6 is finished and the processing returns to the component mounting in FIG. Then, in the manner described above, each step after step S105 is executed.

  In the embodiment configured as described above, a plurality of imaging processes I1 to I3 are sequentially performed using the imaging unit 55 that selectively images the component P in the predetermined target region R in the field of view F. Specifically, in the plurality of imaging processes I1 to I3, the imaging unit 55 captures the components P in the different target regions R while irradiating the components P with light from the light irradiation unit 51 under different illumination conditions C1 to C3. To do. On the other hand, the plurality of parts P are associated with imaging processes I1 to I3 that irradiate light under illumination conditions C1 to C3 suitable for the respective parts (FIG. 8), and each of the plurality of imaging processes I1 to I3. Then, the target area | region R is set with respect to the components P matched with the said imaging processes I1-I3 among the some components P (FIG. 9). Thereby, in each of the plurality of imaging processes I1 to I3, images of the parts P suitable for the illumination conditions C1 to C3 in the imaging processes I1 to I3 are acquired. In other words, the plurality of parts P are suitable for each. Images are taken under illumination conditions C1 to C3. In this way, it is possible to image each component P under appropriate illumination conditions C1 to C3 regardless of the difference in illumination conditions C1 to C3 suitable for each of the plurality of components P held by the mounting head 4.

  In particular, there is no need to cause the mounting head 4 to attract the component P so that all the illumination conditions C of the plurality of components P belonging to the adsorption group are equal, in other words, the illumination condition C of the component P is not particularly considered, The component P can be adsorbed to the mounting head 4 by an efficient procedure. In this way, it is possible to perform imaging under illumination conditions C1 to C3 corresponding to each component P while holding the component P by the mounting head 4 in an efficient procedure.

  Further, as described with reference to FIG. 5, when the mounting head 4 picks up the plurality of components P from the component supply unit 3, the mounting head 4 passes the plurality of components P through the visual field F (upward) of the imaging unit 55, A plurality of components P are mounted on the substrate B. And the imaging control part 140 acquires the captured image of each of several components P by performing several imaging process I1-I3, while the several components P are moving in the visual field F of the imaging part 55. FIG. In such a configuration, the plurality of imaging processes I1 to I3 can be efficiently executed while the plurality of components P are moving from the component supply unit 3 to the substrate B.

  Subsequently, each modification of the above embodiment will be described. In the following, the description will be focused on differences from the above-described embodiment, and common points will be denoted by corresponding reference numerals, and description thereof will be omitted as appropriate. However, it is needless to say that the same effect can be achieved by providing the configuration common to the above embodiment.

  FIG. 10 is a diagram showing a first modification of the target area setting mode for the suction group shown in FIG. In the first modification, component recognition is executed based on the reference mark 42 attached to the bottom surface of the mounting head 4. The reference mark 42 is provided at the center of the arrangement of the plurality of nozzles 41 arranged in a circumferential shape. In each of the imaging processes I <b> 1 to I <b> 3, the target region R is set so as to selectively include each of the imaging target component P and the reference mark 42 in the visual field F.

  Specifically, in the imaging process I1, a rectangular target region R that selectively includes both the component P of the component type Pk1 and the reference mark 42 in the field of view F of the imaging unit 55 is set (step S205). . Then, each captured image of the component P of the component type Pk1 is acquired together with a mark image obtained by capturing the reference mark 42 (steps S206 to S208). In the imaging process I2, the rectangular target region R is set so as to include the parts P of the component types Pk3 and Pk7 in the field of view F of the imaging unit 55, and the rectangular target region so as to include the reference mark 42. R is set (step S205). Then, captured images of the components P of the component types Pk3 and Pk7 are acquired together with the mark image of the reference mark 42 (steps S206 to S208). In the imaging process I3, the rectangular target region R is set so as to include the component P of the component types Pk5 and Pk6 in the field of view F of the imaging unit 55, and the rectangular target region so as to include the reference mark 42. R is set (step S205). Then, captured images of the components P of the component types Pk5 and Pk6 are acquired together with the mark image of the reference mark 42 (steps S206 to S208).

  When the captured images of each of the plurality of components P are acquired together with the mark image of the reference mark 42 in this way, the component recognition is finished and the process returns to the component mounting in FIG. In step S106, based on the result of the imaging control unit 140 calculating the position of each component P based on the positional relationship between the captured image of the component P and the mark image of the reference mark 42, the drive control unit 130 controls the X-axis motor Mx. And the position where each component P is mounted in the board | substrate B is adjusted by controlling drive systems, such as Y-axis motor My.

  That is, the relative positional relationship between each nozzle 41 and the reference mark 42 is uniquely determined. Therefore, even if the mounting head 4 is moving, the position of the component P relative to the nozzle 41 can be accurately recognized by comparing the captured image of the component P with the mark image of the reference mark 42. And based on this recognition result, it is possible to adjust the position where each component P is mounted with high precision.

  Thus, in the first modification, the reference mark 42 is attached to the mounting head 4, and the imaging control unit 140 images the reference mark 42 by the imaging unit 55 in each of the plurality of imaging processes I1 to I3. And the drive control part 130 imaged the reference mark 42 by the imaging process I1-I3 which imaged the captured image of the said component P, and the said component P in the position which mounts each of several components P in the board | substrate B (mark). And the position where the component P is mounted on the board B is adjusted. Therefore, the position where the component P is mounted on the board B can be adjusted with high accuracy based on the result of imaging the reference mark 42 attached to the mounting head 4 in each of the imaging processes I1 to I3.

  FIG. 11 is a diagram illustrating a second modification of the target area setting mode for the suction group illustrated in FIG. 7. In the second modification, the setting position of the target region R is adjusted according to the moving speed V of the mounting head 4 calculated by the drive control unit 130 from the encoders of the motors Mx and My. That is, when the moving speed V of the mounting head 4 is relatively slow, if an appropriate margin is added to the size of the target region R with respect to the range of the target component P, the target in each imaging process I Can be stored in the target region R. However, when the moving speed of the mounting head 4 is fast, there may be a case where such a method has a limit. The second modification can suitably function in such a case.

  In the second modification, the imaging control unit 140 calculates the reference target regions Rr1 to Rr3 (step S201) when generating the imaging processes I1 to I3 (step S201), for example. These reference target regions Rr1 to Rr3 are calculated so as to include the imaging target existence ranges of the respective imaging processes I1 to I3 at the time of executing the imaging (step S207) in the first imaging process I1 (at the first imaging). The That is, the reference target area Rr1 is calculated so as to selectively include the existence range of the target part P (part P of the part type Pk1) of the imaging process I1 at the time of the first imaging, and the reference target area Rr2 is the first imaging. Is calculated so as to selectively include the existence range of the target part P (parts Pk3 and Pk7) of the imaging process I2 at the time, and the reference target region Rr3 is the part P ( It is calculated so as to selectively include the existence range of the component types Pk5, Pk6).

  In step S205 of the imaging process I1, the reference target region Rr1 is set as the target region R as it is. Accordingly, the target region R is set so as to selectively include the component type Pk1 that is the imaging target in the imaging process I1. In step S207, a captured image of the component P of the component type Pk1 in which the target region R is set is acquired.

  In step S205 of the imaging process I2, the target area R is set based on the moving speed V of the mounting head 4. That is, the imaging control unit 140 gives a trigger to the imaging unit 55 at a predetermined exposure interval T, thereby causing the imaging unit 55 to perform imaging (exposure) each time the trigger is performed, and to perform imaging in each of the imaging processes I1 to I3 ( Step S207) is executed. Therefore, the imaging control unit 140 performs the imaging (step S207) in the imaging process I2 from the time of the first imaging (the time indicated in the “imaging process I1” column of FIG. 11) (“ The distance L12 (= V × T) by which the mounting head 4 moves by the time indicated in the column “Imaging process I2” is calculated from the moving speed V and the exposure interval T. Then, the imaging control unit 140 sets a target region R obtained by shifting the reference target region Rr2 by the distance L12 in the moving direction of the mounting head 4. As a result, the target region R is set so as to selectively include the parts P of the parts types Pk3 and Pk7 that are the imaging targets in the imaging process I2. In step S207, captured images of the components P of the component types Pk3 and Pk7 in which the target region R is set are acquired.

  In step S205 of the imaging process I3, the imaging control unit 140 performs the third imaging in which the imaging process I3 performs imaging (step S207) from the time of the first imaging (the time point indicated in the column “imaging process I1” in FIG. 11). The distance L23 (= V × 2 × T) by which the mounting head 4 moves by the time (the time point shown in the column “Imaging process I3” in FIG. 11) is calculated from the moving speed V and the exposure interval T. Then, the imaging control unit 140 sets the target region R obtained by shifting the reference target region Rr3 by the distance L223 in the moving direction of the mounting head 4. As a result, the target region R is set so as to selectively include the parts P of the part types Pk5 and Pk6 that are imaging targets in the imaging process I3. In step S207, captured images of the components P of the component types Pk5 and Pk6 in which the target region R is set are acquired.

  When the captured images of each of the plurality of components P are thus obtained, the component recognition is finished and the process returns to the component mounting in FIG. In step S106, the drive control unit 130 controls the drive system such as the X-axis motor Mx and the Y-axis motor My based on the captured image of the component P and the position of the mounting head 4 when the captured image is acquired. Thus, the position where each component P is mounted on the substrate B is adjusted. Specifically, the position of the mounting head 4 is obtained from the position of the mounting head 4 at the time of the first imaging. Therefore, the position of the mounting head 4 at the first imaging is the starting point, and the position of the mounting head 4 at the second imaging is a position shifted in the moving direction of the mounting head 4 by the distance D12 from the base point. The position of the mounting head 4 at the time of imaging is a shift position in the moving direction of the mounting head 4 by a distance D23 from the base point.

  That is, the relative positional relationship between each nozzle 41 and the mounting head 4 is uniquely determined. Therefore, even if the mounting head 4 is moving, the position of the component P relative to the nozzle 41 can be accurately recognized by referring to the position of the mounting head 4 at the time of each imaging. And based on this recognition result, it is possible to adjust the position where each component P is mounted with high precision.

  Thus, in the second modification, the drive control unit 130 detects the moving speed V of the mounting head 4. In each of the plurality of imaging processes I1 to I3, the imaging control unit 140 determines the position of the target region R with respect to the component P associated with the imaging processes I1 to I3 based on the moving speed V. Therefore, it is possible to appropriately set the target region R according to the movement of the mounting head 4 and accurately acquire the captured image of the component P.

  Further, the drive control unit 130 adjusts the position where each of the plurality of components P is mounted on the substrate B based on the captured image of the component P and the moving speed V of the mounting head 4. Therefore, the position where the component P is mounted on the substrate B can be adjusted with high accuracy without providing the reference mark 42 as shown in the first modification of FIG.

  As described above, in the present embodiment, the component mounting machine 1 corresponds to an example of the “component mounting machine” of the present invention, the mounting head 4 corresponds to an example of the “mounting head” of the present invention, and the light irradiation unit 51 is the main part. It corresponds to an example of the “light irradiation unit” of the invention, the illumination conditions C and C1 to C3 correspond to an example of the “illumination condition” of the present invention, and the imaging unit 55 corresponds to an example of the “imaging unit” of the present invention. The field of view F corresponds to an example of the “field of view” of the present invention, the target region R corresponds to an example of the “target region” of the present invention, and the imaging control unit 140 corresponds to an example of the “imaging control unit” of the present invention. The imaging processes I and I1 to I3 correspond to an example of the “imaging process” of the present invention, the storage unit 120 corresponds to an example of the “storage unit” of the present invention, and the program S corresponds to the “component recognition program” of the present invention. And the controller 100 corresponds to an example of the “computer” of the present invention. The supply unit 3 corresponds to an example of the “component supply unit” of the present invention, the conveyor 12 corresponds to an example of the “board holding unit” of the present invention, the substrate B corresponds to an example of the “board” of the present invention, The component P corresponds to an example of the “component” of the present invention, the drive control unit 130 corresponds to an example of each of the “head control unit” and the “speed detection unit” of the present invention, and the moving speed V corresponds to the “movement” of the present invention. The reference mark 42 corresponds to an example of “speed”, and the reference mark 42 corresponds to an example of “reference mark” of the present invention.

  The present invention is not limited to the above-described embodiment, and various modifications can be made to the above-described one without departing from the spirit of the present invention. For example, in the first modification described with reference to FIG. 10, the target region R may be set according to the moving speed V of the mounting head 4 as in the second modification described with reference to FIG. 11. In such a modification, the target region R is appropriately set in each of the imaging processes I1 to I3 according to the moving speed V of the mounting head 4 detected by the imaging control unit 140, and the captured image of the component P is accurately acquired. It becomes possible. Further, it is possible to adjust the position where the component P is mounted on the substrate B with high accuracy based on the result of imaging the reference mark 42 attached to the mounting head 4 in each of the imaging processes I1 to I3.

  In the second modification described with reference to FIG. 11, the imaging control unit 140 executes the setting of the position of the target region R in the imaging processes I2 and I3. However, the setting of the position of the target region R in the imaging processes I2 and I3 may be executed by the sensor controller 553 of the imaging unit 55. In this case, the imaging control unit 140 does not need to perform calculation for setting the target area R every time the imaging processes I1 to I3, and each target area R shown in the column “reference target area” in FIG. There is an advantage that it suffices if it is obtained and transmitted to the sensor controller 553.

  Further, the specific content of the illumination condition C is not limited to the above-described illuminance of light. For example, when the wavelength of light suitable for recognition differs depending on the component P, the wavelength of light may be used as the illumination condition C. An appropriate wavelength of light can be obtained based on a result of testing in advance for each component type Pk.

  Also, a condition different from the illumination condition C can be changed by the imaging process I. For example, as will be described with reference to FIGS. 12 and 13, the focus of the imaging unit 55 can be adjusted according to the thickness of the component P to be imaged in the imaging process I.

  FIG. 12 is a diagram schematically illustrating an example of condition data in which an illumination condition and a focus are determined according to the type of component. In the example of the figure, the illumination condition C and the focus H of the imaging unit 55 are determined according to the component type Pk. Since the illumination condition C is the same as described above, the focal point H of the imaging unit 55 will be described. The focal point H of the component P of the component types Pk1 to Pk5 and Pk7 to Pk9 is the focal point H1, whereas the component type The focal point H of Pk6 is a focal point H2 different from the focal point H1. The focal point H of each part P is determined to a value suitable for the thickness of the part P.

  FIG. 13 is a diagram showing a modification of the imaging process for the suction group shown in FIG. That is, according to the condition data D1 shown in FIG. 12, in the example of FIG. 7, the illumination condition C is the illumination condition C1 for the three parts P of the part type Pk1 among the eight parts P constituting the suction group. And the focus H is the focus H1, and for one component P of the component type Pk3 and two components P of the component type Pk7, the illumination condition C is the illumination condition C2 and the focus H is the focus H1. For one component P of the component type Pk5, the illumination condition C is the illumination condition C3 and the focus H is the focus H1, and for one component P of the component type Pk6, the illumination condition C is the illumination condition C3. And the focal point H is the focal point H2. Therefore, the imaging control unit 140 classifies the parts P on the basis of the illumination condition C and the focal point H, and performs imaging so that the part P having the same illumination condition C and the focal point H is simultaneously imaged by one imaging process I. Processes I1 to I4 are generated.

  12 and 13, the plurality of imaging processes I1 to I4 are performed in the target region R by the imaging unit 55 in a state where the focal point H of the imaging unit 55 is adjusted to the respective focal points H1 and H2. The part P is imaged. On the other hand, the storage unit 120 stores condition data Dl that defines the focus H of the imaging unit 55 suitable for each of the plurality of components P. And the imaging control part 140 irradiates light with the illumination conditions C1-C3 suitable for each of the some components P, and also the imaging processes I1-I4 which image by the imaging part 55 with the focus H1 and H2 suitable for each. Associate with. Thereby, the recognition of each component P can be performed with the appropriate illumination condition C and focus H.

  Further, a deformation different from the deformation shown in FIGS. 12 and 13 can be added. For example, in the above embodiment, the plurality of components P held by the mounting head 4 are recognized while the mounting head 4 is moved. However, the component P held by the mounting head 4 may be recognized with the mounting head 4 stopped.

  In the above example, the component P imaged by the same imaging process I is held by the mounting head 4 so as to be adjacent. However, each component P imaged by the same imaging process I may be held by the mounting head 4 so as to be discrete. In this case, the target region R may be set for each component P individually.

  Further, the shape of the target region R is not limited to the above rectangle, and may be, for example, a circle.

  Moreover, the structure of the light irradiation part 51 can also be changed suitably. Therefore, the arrangement and number of illuminations included in the light irradiation unit 51 can be changed as appropriate, and the number of illuminations may be one.

  Moreover, the structure regarding the mounting head 4 can also be changed as appropriate. For example, as disclosed in JP 2012-054384 A, a plurality of mounting heads 4 may be provided. Alternatively, the arrangement of the nozzles 41 in the mounting head 4 is not limited to a circumferential shape, and may be a linear shape.

DESCRIPTION OF SYMBOLS 1 ... Component mounting machine (component mounting machine), 12 ... Conveyor (board holding part), 3 ... Component supply part, 4 ... Mounting head, 42 ... Reference mark, 51 ... Light irradiation part, 55 ... Imaging part, 100 ... Controller , 120 ... storage unit, 130 ... drive control unit (head control unit, speed detection unit), 140 ... imaging control unit, B ... substrate, C, C1 to C3 ... illumination conditions, F ... field of view, I, I1 to I3 ... Imaging processing, P ... part, R ... target area, S ... program (part recognition program), V ... moving speed

Claims (13)

A mounting head for holding a plurality of components;
A light irradiation unit for irradiating the component with light;
An imaging unit that selectively images the part in a predetermined target area of the field of view;
The plurality of components are sequentially executed by performing a plurality of imaging processes in which the imaging unit captures the components in the different target regions while irradiating the components from the light irradiation unit under different illumination conditions. An imaging control unit for acquiring each captured image;
A storage unit that stores the illumination conditions suitable for each of the plurality of components;
The imaging control unit associates the plurality of components with the imaging process of irradiating light under the illumination conditions suitable for each of the components,
In each of the plurality of imaging processes, a component mounter in which the target area is set for the part associated with the imaging process among the plurality of parts. A component supply unit for supplying the component;
A substrate holding unit for holding a substrate on which the plurality of components picked up from the component supply unit by the mounting head are mounted;
A head control unit that adjusts a position at which the mounting head mounts the component on the substrate based on a captured image of the component;
The mounting head picks up the plurality of components from the component supply unit, and then causes the plurality of components to pass through the field of view of the imaging unit, and then mounts the plurality of components on the substrate.
2. The component mounter according to claim 1, wherein the imaging control unit acquires the captured image of each of the plurality of components by executing the plurality of imaging processes while the plurality of components are moving within the visual field. . A reference mark is attached to the mounting head,
The imaging control unit images the reference mark by the imaging unit in each of the plurality of imaging processes,
The head control unit adjusts a position where each of the plurality of components is mounted on the substrate based on the captured image of the component and a result of imaging the reference mark in the imaging process of imaging the component. The component mounting machine according to 1. A speed detecting unit for detecting a moving speed of the mounting head;
4. The method according to claim 2, wherein in each of the plurality of imaging processes, a position of the target region with respect to the component associated with the imaging process is determined based on the moving speed detected by the speed detection unit. Component mounting machine. The speed detection unit outputs the detected moving speed to the imaging control unit,
5. The component mounter according to claim 4, wherein in each of the plurality of imaging processes, the position of the target region with respect to the component associated with the imaging process is calculated from the moving speed by the imaging control unit. The speed detection unit outputs the detected moving speed to the imaging control unit,
The imaging control unit outputs the moving speed received from the speed detection unit to the imaging unit,
5. The component mounter according to claim 4, wherein in each of the plurality of imaging processes, the position of the target region with respect to the component associated with the imaging process is calculated from the moving speed by the imaging unit. A speed detecting unit for detecting a moving speed of the mounting head;
The head control unit adjusts the position where each of the plurality of components is mounted on the substrate based on the captured image of the component and the moving speed detected by the speed detection unit,
3. The component according to claim 2, wherein in each of the plurality of imaging processes, the position of the target region with respect to the component associated with the imaging process is determined based on the moving speed detected by the speed detection unit. Mounting machine.   The component mounting machine according to any one of claims 1 to 7, wherein the illumination condition includes an illuminance of light applied to the component from the light irradiation unit. The light irradiation unit includes a plurality of lights that irradiate the component with light from different angles,
The component mounting machine according to claim 8, wherein the illumination condition includes a combination of illuminances of light emitted by each of the plurality of illuminations.   The component mounting machine according to any one of claims 1 to 9, wherein the illumination condition includes a wavelength of light applied to the component from the light irradiation unit. The focus of the imaging unit is variable,
In the plurality of imaging processes, the components in the target area are imaged by the imaging unit in a state where the focus of the imaging unit is adjusted to a focus determined for each of the imaging processes,
The storage unit stores a focus of the imaging unit suitable for each of the plurality of components,
11. The imaging control unit according to any one of claims 1 to 10, wherein the imaging control unit associates the plurality of components with the imaging process in which light is emitted under the illumination condition suitable for each of the components and the imaging unit captures an image with a focus suitable for each of the components. The component mounting machine according to claim 1. A component holding step for holding a plurality of components by the mounting head;
An imaging step of imaging the component by an imaging unit that selectively images the component in a predetermined target region of the visual field;
In the imaging step, the plurality of imaging processes are performed in order by imaging a plurality of components in different target regions with the imaging unit while irradiating the components with light from different light conditions. Captured images of each of the parts are acquired,
The plurality of components are associated with the imaging processing that irradiates light under the illumination conditions suitable for each of the components,
In each of the plurality of imaging processes, a part recognition method in which the target region is set for the part associated with the imaging process among the plurality of parts. A component holding step for holding a plurality of components by the mounting head;
Causing the computer to execute an imaging step of imaging the component by an imaging unit that selectively images the component in a predetermined target region of the visual field;
In the imaging step, the plurality of imaging processes are performed in order by imaging a plurality of components in different target regions with the imaging unit while irradiating the components with light from different light conditions. Captured images of each of the parts are acquired,
The plurality of components are associated with the imaging processing that irradiates light under the illumination conditions suitable for each of the components,
In each of the plurality of imaging processes, a component recognition program in which the target region is set for the part associated with the imaging process among the plurality of parts.

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