JP2018157232A - Package, light-emitting device, and manufacturing methods therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a package, a light-emitting device, and manufacturing methods therefor in which occurrence of burrs can be suppressed.SOLUTION: A package 90 formed with a recessed part 10a, comprises: a pair of lead electrodes 20 and 30 exposed at a bottom surface part 10c of the recessed part 10a; a plating layer 60 for covering surfaces of the pair of lead electrodes 20 and 30; and a resin molding 10 holding the pair of lead electrodes 20 and 30 and forming a gap portion between the pair of lead electrodes 20 and 30 of the bottom surface part 10c of the recessed part 10a and forming a side surface part 10b of the recessed part 10a. At least one lead electrode of the pair of lead electrodes 20 and 30 has top surface projection parts 4 and 5 along the resin molding 10 of the bottom surface part 10c of the recessed part 10a and along a peripheral edge of the bottom surface part 10c of the recessed part 10a, and also has reverse surface projection parts 6 and 7 formed at a position of the reverse surface opposed to the position of the top surface projection parts 4 and 5, where width of the top surface projection part 4 and 5 is 110 μm or more.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a package, a light emitting device, and a manufacturing method thereof.

  A light emitting diode (hereinafter referred to as LED) is manufactured by a package forming process in the manufacturing process, and undergoing the forming process. In particular, in the LED manufacturing process, a transfer mold, which is a molding method in which a lead frame is sandwiched between molds and a liquid resin is injected, is generally used. However, in the above-described LED manufacturing method, the resin flows into the gap between the lead frame and the mold, and a resin burr is generated. Since these resin burrs cause defective bonding of LED elements and wires, it is necessary to remove them. Therefore, conventionally, in the LED manufacturing method, the deburring process is always performed as the next process of the molding process.

  In such LED manufacturing processes, as measures to prevent resin burrs, for example, optimization of conditions in the molding process, increasing the clamping force of the mold, reducing the number of LEDs molded with one lead frame, viscosity of the resin To make it difficult to flow.

  Further, in Patent Document 1, in a lead frame having a plating layer formed on the surface, the plating itself at the boundary of a portion (LED mounting portion, wire bonding portion) where the metal portion is to be exposed is raised and protruded, or the lead frame It is disclosed that burrs can be reduced by raising a part of the main body and covering the protruding portion with plating.

  The mold described in Patent Document 1 is provided with a convex portion having a shape corresponding to the concave portion of the package. Therefore, when the die is sandwiched between the lead frame, the protruding portion of the die is raised on the boundary of the LED mounting portion or the like, or the protruding portion that covers the raised portion of the lead frame itself with plating. It is configured to prevent inflow of resin that becomes a burr by abutting and pressing.

JP 2014-29995 A

  However, in the manufacturing method described in Patent Document 1, when the plating itself is raised and protruded, when the metal plate is clamped with a mold, the protruded plating may be crushed and the mold may come into contact with the LED mounting portion. . For this reason, there is a problem that a processing mark of the mold remains at the contact portion, the glossiness of the plating is lowered, and the output of the LED is reduced.

  Embodiments according to the present invention provide a package, a light-emitting device, and a method of manufacturing them that can suppress the generation of burrs.

  A package according to an embodiment of the present disclosure includes a pair of lead electrodes formed on a bottom surface of the recess, a plating layer that covers a surface of the pair of lead electrodes, and the pair of lead electrodes. And a resin molded body forming a side surface portion of the concave portion between the pair of lead electrodes of the bottom surface portion of the concave portion, and at least one lead electrode of the pair of lead electrodes is formed on the bottom surface portion of the concave portion. A back surface that has a surface protrusion that is a linearly formed protrusion along the resin molded body and along the periphery of the bottom surface of the recess, and that faces the position of the surface protrusion. A rear surface protruding portion which is a protruding portion formed at a position of at least one of the front surface protruding portion and the rear surface protruding portion is exposed from the plating layer.

  In addition, the package of the embodiment according to the present disclosure includes a pair of lead electrodes formed on the bottom surface of the recess, a plating layer covering the surfaces of the pair of lead electrodes, and the pair of lead electrodes. A resin molded body that forms between the pair of lead electrodes on the bottom surface portion of the concave portion and the side surface portion of the concave portion, and at least one of the pair of lead electrodes has a bottom surface of the concave portion A surface protruding portion that is a linearly formed protruding portion along the resin molded body of the portion and along the periphery of the bottom surface portion of the concave portion, and relative to the position of the surface protruding portion A rear surface protruding portion which is a protruding portion formed at the position of the rear surface, and the width of the front surface protruding portion is 110 μm or more.

  In addition, a light emitting device according to an embodiment of the present disclosure includes the package and a light emitting element housed in the recess of the package and mounted on one lead electrode of the pair of lead electrodes.

  Further, the package manufacturing method according to the embodiment of the present disclosure is for mounting a light emitting element by processing the base material itself of the metal plate on at least one of the pair of lead electrodes made of the metal plate. Formed are a surface protrusion that is a protrusion formed in an annular shape so as to surround the region, and a back protrusion that is a protrusion formed at the position of the back surface of the metal plate opposite to the position of the surface protrusion. Preparing the pair of lead electrodes, forming a plating layer on the surfaces of the pair of lead electrodes so that at least the tips of the front surface protrusion and the back surface protrusion are exposed, and the pair of lead electrodes In order to form the concave portion by the resin molded body, the tip of the exposed surface protruding portion is formed using a mold including an upper die having a convex portion corresponding to the shape of the concave portion and a lower die. To the upper mold A step of sandwiching the pair of lead electrodes so that the tip of the exposed rear surface protruding portion contacts the lower mold, and a step of injecting a resin into the mold sandwiching the pair of lead electrodes And a step of curing the injected resin to form the resin molded body, and a step of removing the upper mold and the lower mold.

  Further, the package manufacturing method according to the embodiment of the present disclosure is for mounting a light emitting element by processing the base material itself of the metal plate on at least one of the pair of lead electrodes made of the metal plate. A surface protrusion that is a linear and annular protrusion that surrounds the region, and a back protrusion that is a protrusion formed at the position of the back surface of the metal plate relative to the position of the surface protrusion. A step of preparing the pair of lead electrodes formed, a step of forming a plating layer on the surface of the pair of lead electrodes, and forming the recess by the pair of lead electrodes and the resin molded body. Using the upper die having a convex portion corresponding to the shape of the upper die and the lower die, the front end of the front surface protrusion is brought into contact with the upper die, and the front end of the rear surface protrusion is To contact the lower mold A step of sandwiching the pair of lead electrodes, a step of injecting a resin into a mold sandwiching the pair of lead electrodes, a step of curing the injected resin to form the resin molded body, and the upper mold And a step of removing the lower mold.

  In addition, a method for manufacturing a light emitting device according to an embodiment of the present disclosure includes a step of manufacturing a package by the package manufacturing method and a step of mounting a light emitting element in the recess formed in the package.

  According to the package and the light emitting device of the embodiment according to the present disclosure, it is possible to suppress the occurrence of burrs without reducing the output of the LED. Moreover, according to the package and the light emitting device manufacturing method according to the present disclosure, it is possible to manufacture the package and the light emitting device in which the generation of burrs is suppressed without reducing the output of the LED.

It is a figure which shows the outline of the light-emitting device which concerns on embodiment, and is a perspective view which shows the whole light-emitting device. It is a figure which shows the outline of the light-emitting device which concerns on embodiment, and is sectional drawing which showed the II-II arrow direction of FIG. It is a figure which shows the outline of a part of light-emitting device which concerns on embodiment, and is sectional drawing which shows the state of a plating layer. It is a figure which shows the outline of the light-emitting device which concerns on embodiment, and is a top view of a light-emitting device. It is a figure which shows the outline of the light-emitting device which concerns on embodiment, and is a bottom view of a light-emitting device. It is a figure which shows the outline of the manufacturing process of the light-emitting device which concerns on embodiment, and is sectional drawing which shows typically arrangement | positioning of the lead electrode and metal mold | die in the position corresponding to the II-II line | wire of FIG. It is a figure which shows the outline of the manufacturing process of the package which concerns on embodiment, and is sectional drawing which shows typically the process of clamping a lead electrode with an upper metal mold | die and a lower metal mold | die. It is a figure which shows the outline of the manufacturing process of the package which concerns on embodiment, and is sectional drawing after resin injection | pouring and hardening. It is a figure which shows the outline of the manufacturing process of the package which concerns on embodiment, and is sectional drawing which shows typically the process of demolding an upper metal mold | die. It is a figure which shows the outline of the manufacturing process of the package which concerns on embodiment, and is sectional drawing after resin injection | pouring and hardening in the position corresponding to the XX line of FIG. It is a figure which shows the outline of the surface protrusion part of the light-emitting device which concerns on embodiment, and is sectional drawing at the time of forming a surface protrusion part by an etching. In the package which concerns on embodiment, it is sectional drawing which shows the outline of the state of the surface protrusion part before a clamp and after a clamp. In the light-emitting device which concerns on embodiment, it is sectional drawing which shows the outline of the relationship between the surface protrusion part in which the metal part was formed, and a sealing member. It is a figure which shows the outline of a part of light-emitting device which concerns on the modification 1, and is sectional drawing which shows the state of a plating layer. It is a figure which shows the outline of the lead electrode which concerns on the modification 2, and is sectional drawing of the lead electrode in which the side surface protrusion part was formed. It is a figure which shows the outline of the lead electrode which concerns on the modification 2, and is a top view of the lead electrode in which the side surface protrusion part was formed. It is sectional drawing which shows the outline of the positional relationship of the surface protrusion part of the light-emitting device which concerns on the modification 3, and a resin molding. It is sectional drawing which shows the outline of the positional relationship of the surface protrusion part and resin molding of a light-emitting device which concerns on the modification 3, and a metal mold | die. In the light-emitting device according to Modification 4, it is a cross-sectional view showing an outline of the state of the surface protruding portion in which grooves before and after clamping are formed. It is a figure which shows the outline of the light-emitting device which concerns on the modification 5, and is sectional drawing of the light-emitting device which filled the area | region for mounting a light emitting element with the die-bonding member.

<Embodiment>
Embodiments will be described below with reference to the drawings. However, the form shown below illustrates the light-emitting device for embodying the technical idea of the present invention, and is not limited to the following. In addition, the dimensions, materials, shapes, relative arrangements, and the like of the component parts described in the embodiments are not intended to limit the scope of the present invention only to specific examples unless otherwise specified. Only. It should be noted that the size and positional relationship of the members shown in each drawing may be exaggerated for clarity of explanation.

  FIG. 1 is a diagram schematically illustrating a light emitting device according to an embodiment, and is a perspective view illustrating the entire light emitting device. FIG. 2 is a diagram schematically illustrating the light-emitting device according to the embodiment, and is a cross-sectional view illustrating the direction of arrows II-II in FIG. 1. FIG. 3 is a diagram schematically illustrating a part of the light emitting device according to the embodiment, and is a cross-sectional view illustrating a state of the plating layer. FIG. 4 is a diagram schematically illustrating the light emitting device according to the embodiment, and is a top view of the light emitting device. FIG. 5 is a diagram schematically illustrating the light emitting device according to the embodiment, and is a bottom view of the light emitting device.

The light emitting device 1 includes a package 90, a light emitting element 2, a wire W, and a sealing member 40.
The package 90 includes a pair of lead electrodes 20 and 30 made of a metal plate, a plating layer 60 that covers the surfaces of the pair of lead electrodes 20 and 30, and the resin molded body 10. The package 90 has a recess 10a for accommodating the light emitting element 2, and a pair of lead electrodes 20 and 30 are exposed on the bottom surface portion 10c of the recess 10a.
The package 90 has a substantially rectangular parallelepiped shape, and has a cup-shaped recess (cavity) 10 a for accommodating the light emitting element 2 on the upper surface. The package 90 is integrally held by the resin molded body 10 such that a pair of lead electrodes 20 and 30 made of a metal plate are exposed from the resin molded body 10 at the bottom surface portion 10c of the recess 10a.

  The resin molded body 10 forms a space between the first lead electrode 20 and the second lead electrode 30 of the bottom surface portion 10c of the recess 10a and the side surface portion 10b of the recess 10a, and holds the pair of lead electrodes 20 and 30. . Accordingly, the resin molded body 10 fixes the first lead electrode 20 and the second lead electrode 30. Further, the resin molded body 10 is formed so that one end portions of the first lead electrode 20 and the second lead electrode 30 protrude from two opposite sides of the rectangle in plan view. Further, the resin molded body 10 is formed so that the first lead electrode 20 and the second lead electrode 30 are sandwiched between other two opposite sides of the rectangle in plan view. Thereby, the resin molding 10 fixes the 1st lead electrode 20 and the 2nd lead electrode 30 to the bottom face part 10c of the recessed part 10a spaced apart.

  A gate mark 50 is formed on the outer surface 11 a of the resin molded body 10. The gate mark 50 refers to a protrusion left in the secondary cutting process among resin molded bodies (gates) formed in the injection port portion when the resin is injected from the injection port of the mold. Here, since the cross-sectional shape of the injection port 77 described later is a semicircular shape, the gate mark 50 is assumed to exhibit a columnar body having a semicircular cross section. That is, the shape of the gate mark 50 is formed according to the cross-sectional shape of the injection port.

  The height, length, and width of the resin molded body 10 are not particularly limited, and can be appropriately selected according to the purpose and application. Examples of the material of the resin molded body 10 include a thermoplastic resin and a thermosetting resin. In the case of a thermoplastic resin, for example, polyphthalamide resin, liquid crystal polymer, polybutylene terephthalate (PBT), unsaturated polyester, and the like can be used. In the case of a thermosetting resin, for example, an epoxy resin, a modified epoxy resin, a silicone resin, a modified silicone resin, or the like can be used.

  The recessed part 10a has the side part 10b and the bottom face part 10c, and exhibits the truncated cone shape which becomes narrow toward the bottom face part 10c. The light emitted from the light emitting element 2 is reflected by the side surface portion 10b, and the light can be concentrated or diffused by appropriately changing the angle of the side surface portion 10b. The bottom surface portion 10 c includes a first lead electrode 20, a second lead electrode 30, and a gap portion 10 e that is a part of the resin molded body 10. The gap 10e is provided between the first lead electrode 20 and the second lead electrode 30 so that the first lead electrode 20 and the second lead electrode 30 are not short-circuited.

  In order to efficiently reflect light at the side surface portion 10b of the recess 10a, the resin molded body 10 may contain a light reflecting member. The light reflecting member is a material having a high light reflectance such as a white filler such as titanium oxide, glass filler, silica, alumina, and zinc oxide. The reflectance of visible light is preferably 70% or more, or 80% or more. In particular, the reflectance is preferably 70% or more, or 80% or more in the wavelength region emitted from the light emitting element. The blending amount of titanium oxide or the like may be 5% by weight or more and 50% by weight or less, but is preferably 10% by weight to 30% by weight, but is not limited thereto.

The first lead electrode 20 includes a first inner lead portion 20a and a first outer lead portion 20b.
The 1st inner lead part 20a says the lead part located inside the resin molding 10 and under the resin molding 10 in planar view. The shape of the first inner lead portion 20a is substantially rectangular in a plan view, but the shape is not limited to this, and the first inner lead portion 20a may have a notch, a dent, a convex portion, or the like.
The 1st outer lead part 20b says the lead part located in the outer side of the resin molding 10 in planar view. The shape of the first outer lead portion 20b is rectangular in a plan view, but the shape is not limited to this, and the first outer lead portion 20b may have a notch, a dent, a convex portion, or the like.

The second lead electrode 30 includes a second inner lead portion 30a and a second outer lead portion 30b.
The 2nd inner lead part 30a says the lead part located inside the resin molding 10 and under the resin molding 10 in planar view. The shape of the second inner lead portion 30a is substantially rectangular in a plan view, but the shape is not limited to this, and may be a notch, a dent, a convex portion, or the like provided in part.
The 2nd outer lead part 30b says the lead part located in the outer side of the resin molding 10 in planar view. The shape of the second outer lead portion 30b is rectangular in plan view, but the shape is not limited to this, and a shape in which a notch, a dent, a convex portion, or the like is provided in part may be used.

  The first lead electrode 20 and the second lead electrode 30 are formed on the bottom surface of the package 90 so as to be exposed to the outside of the resin molded body 10. The outer bottom surface of the package 90 is a surface on the side mounted on an external substrate. The first lead electrode 20 and the second lead electrode 30 are arranged apart from each other by the gap 10e of the resin molded body 10, and are used as an anode electrode and a cathode electrode when used as a light emitting device.

  Here, the second lead electrode 30 is formed longer than the first lead electrode 20, but the length, width, and thickness of the first lead electrode 20 and the second lead electrode 30 are not particularly limited. Depending on the purpose and application, it can be appropriately selected. The 1st lead electrode 20 and the 2nd lead electrode 30 are formed using electrical good conductors, such as iron, copper, phosphor bronze, copper alloy, for example. Further, in order to increase the reflectance of light from the light emitting element 2, the first lead electrode 20 and the second lead electrode 30 are subjected to metal plating such as gold, silver, copper, or aluminum.

The first lead electrode 20 has a surface protruding portion 4 that is a linearly formed protruding portion along the resin molded body 10 of the bottom surface portion 10c of the recessed portion 10a and along the periphery of the bottom surface portion 10c of the recessed portion 10a. have. That is, the first lead electrode 20 is provided with the surface protrusion 4 at the boundary between the wire-bonded portion and the resin molded body 10.
Specifically, a part of the surface protruding portion 4 is formed along the side surface of the resin molded body 10 constituting the side surface portion 10b of the concave portion 10a, and a part thereof is the first lead electrode 20 and the second lead electrode 30. Are formed along the gap 10e.
Further, the side surface portion 10 b of the concave portion 10 a is continuously connected to the outer corner portion of the surface protruding portion 4. That is, in a cross-sectional view, the lower portion of the side surface portion 10b of the concave portion 10a is in contact with the position of the outer corner portion of the surface protruding portion 4 so that the upper surface of the surface protruding portion 4 and the side surface portion 10b of the concave portion 10a are continuous. It is configured. Moreover, the lowermost surface connected with the side surface part 10b of the recessed part 10a and the upper surface of the surface protrusion parts 4 and 5 may be the same plane. Even when the upper mold 70 and the pair of lead electrodes 20 and 30 are misaligned, the bottom surface portion 10c of the recess 10a can be easily formed.

  Further, the first lead electrode 20 has a back surface protruding portion 6 that is a protruding portion formed at the position of the back surface opposite to the position of the front surface protruding portion 4. That is, the back surface protruding portion 6 is formed on the back surface of the first lead electrode 20 along the position where the front surface protruding portion 4 is formed.

The second lead electrode 30 has a surface protrusion 5 which is a protrusion formed in a linear shape along the resin molded body 10 of the bottom surface 10c of the recess 10a and along the periphery of the bottom surface 10c of the recess 10a. have. That is, the second lead electrode 30 is provided with the surface protrusion 5 at the boundary between the portion where the light emitting element 2 is die-bonded and the resin molded body 10.
Specifically, a part of the surface protruding portion 5 is formed along the side surface of the resin molded body 10 constituting the side surface portion 10b of the concave portion 10a, and a part thereof is the first lead electrode 20 and the second lead electrode 30. Are formed along the gap 10e.
Further, the side surface portion 10 b of the concave portion 10 a is continuously connected to the outer corner portion of the surface protruding portion 5. That is, in a cross-sectional view, the lower portion of the side surface portion 10b of the concave portion 10a is in contact with the position of the outer corner portion of the surface protruding portion 5 so that the upper surface of the surface protruding portion 5 and the side surface portion 10b of the concave portion 10a are continuous. It is configured.

  Further, the second lead electrode 30 has a back surface protruding portion 7 that is a protruding portion formed at the position of the back surface opposite to the position of the front surface protruding portion 5. That is, the back surface protruding portion 7 is formed on the back surface of the second lead electrode 30 along the position where the front surface protruding portion 5 is formed.

  Here, the surface protrusion 5 is formed in an annular shape so as to surround a region for mounting the light emitting element 2. Specifically, the region for mounting the light emitting element 2 is a region exposed to the bottom surface portion 10c of the recess 10a in the second inner lead portion 30a (hereinafter referred to as a light emitting element mounting region).

The front surface protrusions 4 and 5 and the back surface protrusions 6 and 7 can be formed by processing the base material itself of the metal plate. In the present embodiment, the material of the pair of lead electrodes 20 and 30 is the same as the material of the front surface protruding portions 4 and 5 and the back surface protruding portions 6 and 7, and the front surface protruding portions 4 and 5 and the back surface protruding portions 6 and 7 are the same. 7 is formed integrally with the pair of lead electrodes 20 and 30.
The surfaces of the pair of lead electrodes 20 and 30 are covered with a plating layer 60. In addition, the surface of a pair of lead electrodes 20 and 30 here means the upper surface and back surface of a pair of lead electrodes 20 and 30. However, in the present embodiment, it is assumed that the plating layer 60 is also formed on the side surface on the side where the first lead electrode 20 and the second lead electrode 30 face each other. And the front-end | tips of the surface protrusion parts 4 and 5 and the back surface protrusion parts 6 and 7 are exposed from the plating layer 60. FIG. That is, the plating layer 60 is not provided on the upper surfaces of the front surface protruding portions 4 and 5 and the lower surfaces of the back surface protruding portions 6 and 7, and the metal plate is exposed. As described above, in the present embodiment, the pair of lead electrodes 20, 30 includes the outer side surface of the first lead electrode 20 and the outer side surface of the second lead electrode 30, the upper surface of the surface protrusions 4, 5, and the rear surface protrusion. In addition to the lower surfaces of 6 and 7, a plating layer 60 is provided.

The width A1 of the surface protrusions 4 and 5 is preferably 110 μm or more. The surface protrusions 4 and 5 can be easily formed by setting the width A1 of the surface protrusions 4 and 5 to 110 μm or more. If the width A1 of the surface protrusions 4 and 5 is 110 μm or more, when the resin is injected into the mold in the manufacture of the light emitting device 1, the resin temporarily enters the upper surfaces of the surface protrusions 4 and 5. However, the resin is likely to stop in the middle of the upper surfaces of the surface protrusions 4 and 5. Therefore, it becomes difficult for the resin to flow into the exposed metal portions on the first lead electrode 20 and the second lead electrode 30, and the effect of suppressing the generation of resin burrs is enhanced. The width A1 of the surface protrusions 4 and 5 is more preferably 130 μm or more, and even more preferably 150 μm or more, in order to make it easier to obtain the above effects.
The metal exposed portion on the first lead electrode 20 is a portion of the bottom surface portion 10c of the concave portion 10a on the first lead electrode 20 excluding the surface protruding portion 4, and the metal exposed portion on the second lead electrode 30 is exposed. The portion is a portion excluding the surface protrusion 5 on the second lead electrode 30 of the bottom surface portion 10c of the recess 10a.

  Moreover, it is preferable that width A1 of the surface protrusion parts 4 and 5 is 200 micrometers or less. If the width A1 of the surface protrusions 4 and 5 is 200 μm or less, when the pair of lead electrodes 20 and 30 are clamped with a mold in the manufacture of the light emitting device 1, the surface protrusions 4 and 5 have more clamping force. It becomes easy to concentrate. The width A1 of the surface protrusions 4 and 5 is more preferably 180 μm or less, and still more preferably 150 μm or less, in order to make it easier to obtain the above effect.

  The width A1 of the surface protrusions 4 and 5 is the width excluding the thickness of the plating layer 60, and as will be described later, the thickness of the metal part 14 formed by the surface protrusions 4 and 5 being crushed. Is not included. The same applies to the width A2 of the rear surface protruding portions 6 and 7.

  The thickness B1 of the surface protrusions 4 and 5 is preferably 5 μm or more and 50 μm or less. If the thickness B1 of the surface protrusions 4 and 5 is 5 μm or more, as will be described later, when the pair of lead electrodes 20 and 30 are clamped with the mold in the manufacture of the light emitting device 1, the upper mold is the first mold. The risk of contacting the exposed metal parts on the lead electrode 20 and the second lead electrode 30 is further reduced. On the other hand, if the thickness B1 of the surface protrusions 4 and 5 is 50 μm or less, the entire thickness of the pair of lead electrodes 20 and 30 can be reduced. The thickness B1 of the surface protrusions 4 and 5 is more preferably 10 μm or more, and even more preferably 15 μm or more, in order to make it easier to obtain the above effect. Further, the thickness B1 of the surface protrusions 4 and 5 is more preferably 45 μm or less, and further preferably 40 μm or less, in order to make it easier to obtain the above effect.

  The thickness B1 of the surface protrusions 4 and 5 in the light emitting device 1 is the thickness of the surface protrusions 4 and 5 after the package 90 is manufactured, and is the thickness excluding the thickness of the plating layer 60. The same applies to the thickness B2 of the rear surface protruding portions 6 and 7.

  The width A2 of the back protrusions 6 and 7 is preferably 110 μm or more. By setting the width A2 of the back surface protruding portions 6 and 7 to 110 μm or more, the back surface protruding portions 6 and 7 can be easily formed. In addition, by setting the width A2 of the back surface protruding portions 6 and 7 to 110 μm or more, when the light emitting device 1 is mounted on an external substrate, the back surface protruding portions 6 and 7 are in wide contact with the mounting surface of the substrate, Heat drawing is good. Furthermore, when the light emitting device 1 is mounted, the bonding member is less likely to enter between the first lead electrode 20 and the second lead electrode 30. The width A2 of the back protrusions 6 and 7 is more preferably 130 μm or more, and even more preferably 150 μm or more, in order to make the above effects easier to obtain.

  Further, the width A2 of the rear surface protruding portions 6 and 7 is preferably 200 μm or less. If the width A2 of the back protrusions 6 and 7 is 200 μm or less, when the pair of lead electrodes 20 and 30 are clamped with a mold in the manufacture of the light emitting device 1, the back protrusions 6 and 7 are more clamped. It becomes easy to concentrate. The width A2 of the back protrusions 6 and 7 is more preferably 180 μm or less, and even more preferably 150 μm or less, in order to make it easier to obtain the above effect.

The thickness B2 of the back protrusions 6 and 7 is preferably 5 μm or more and 50 μm or less. If the thickness B2 of the rear surface protruding portions 6 and 7 is 5 μm or more, as will be described later, when the pair of lead electrodes 20 and 30 are clamped with a mold in the manufacture of the light emitting device 1, the lower mold is a pair of The risk of contact with the lead electrodes 20 and 30 is further reduced. Further, when the light emitting device 1 is mounted, the bonding member is less likely to enter between the first lead electrode 20 and the second lead electrode 30. On the other hand, if the thickness B2 of the rear surface protruding portions 6 and 7 is 50 μm or less, the entire thickness of the pair of lead electrodes 20 and 30 can be reduced. The thickness B2 of the back protrusions 6 and 7 is more preferably 10 μm or more, and even more preferably 15 μm or more in order to make it easier to obtain the above effect. Further, the thickness B2 of the rear surface protruding portions 6 and 7 is more preferably 45 μm or less, and still more preferably 40 μm or less, in order to make it easier to obtain the above effect.
Note that the width and thickness of the front protrusions 4 and 5 and the rear protrusions 6 and 7 are appropriately changed depending on the material of the first lead electrode 20 and the second lead electrode 30 and the size of the resin formed body.

The light emitting element 2 is mounted on the second lead electrode 30 of the package 90. The light emitting element 2 used here is not particularly limited in shape or size. As the luminescent color of the light emitting element 2, the thing of arbitrary wavelengths can be selected according to a use. For example, a GaN-based or InGaN-based light-emitting element can be used as a blue light-emitting element (light having a wavelength of 430 to 490 nm). As the InGaN system, In _X Al _Y Ga _1-XY N (0 ≦ X ≦ 1, 0 ≦ Y ≦ 1, X + Y <1) or the like can be used.

  The wire W is a conductive wiring for electrically connecting electronic components such as the light emitting element 2 and the protection element to the first lead electrode 20 and the second lead electrode 30. Examples of the material of the wire W include metals using metals such as Au, Ag (silver), Cu (copper), Pt (platinum), and Al (aluminum), and alloys thereof. It is preferable to use Au that is excellent in rate and the like. In addition, the thickness of the wire W is not specifically limited, It can select suitably according to the objective and a use.

  The sealing member 40 is provided in the recess 10 a of the package 90 so as to cover the light emitting element 2 and the like. The sealing member 40 is provided to protect the light emitting element 2 and the like from external force, dust, moisture, and the like, and to improve the heat resistance, weather resistance, and light resistance of the light emitting element 2 and the like. Examples of the material of the sealing member 40 include a thermosetting resin, for example, a transparent material such as a silicone resin, an epoxy resin, and a urea resin. In addition to such a material, a filler such as a phosphor or a substance having a high light reflectance can also be included in order to have a predetermined function.

The sealing member 40 can facilitate the color tone adjustment of the light emitting device 1 by mixing phosphors, for example. In addition, as a fluorescent substance, what has larger specific gravity than the sealing member 40, absorbs the light from the light emitting element 2, and converts wavelength can be used. If the specific gravity of the phosphor is larger than that of the sealing member 40, it is preferable because the phosphor settles to the first lead electrode 20 and the second lead electrode 30 side. Specifically, for example, yellow phosphors such as YAG (Y ₃ Al ₅ O ₁₂ : Ce) and silicate, red phosphors such as CASN (CaAlSiN ₃ : Eu) and KSF (K ₂ SiF ₆ : Mn), or And green phosphors such as chlorosilicate and BaSiO ₄ : Eu ²⁺ .

As the filler to be contained in the sealing member 40, for example, a material having a high light reflectance such as SiO ₂ , TiO ₂ , Al ₂ O ₃ , ZrO ₂ , MgO can be suitably used. For the purpose of cutting undesired wavelengths, for example, organic or inorganic coloring dyes or coloring pigments can be used.

<Method for manufacturing light emitting device>
Next, a method for manufacturing the light emitting device according to this embodiment will be described. FIG. 6 is a diagram illustrating an outline of the manufacturing process of the light emitting device according to the embodiment, and is a cross-sectional view schematically illustrating the arrangement of the lead electrode and the mold at a position corresponding to the line II-II in FIG. FIG. 7 is a diagram schematically illustrating a manufacturing process of the package according to the embodiment, and is a cross-sectional view schematically illustrating a process of sandwiching the lead electrode between the upper mold and the lower mold. FIG. 8 is a diagram showing an outline of the manufacturing process of the package according to the embodiment, and is a cross-sectional view after resin injection and curing. FIG. 9 is a diagram schematically illustrating a manufacturing process of the package according to the embodiment, and is a cross-sectional view schematically illustrating a process of removing the upper mold. FIG. 10 is a diagram illustrating an outline of a manufacturing process of the package according to the embodiment, and is a cross-sectional view after resin injection and curing at a position corresponding to the line XX in FIG. 1. FIG. 11 is a diagram schematically illustrating the surface protrusion of the light emitting device according to the embodiment, and is a cross-sectional view when the surface protrusion is formed by etching. FIG. 12 is a cross-sectional view schematically showing the state of the surface protrusion before and after clamping in the package according to the embodiment. FIG. 13 is a cross-sectional view schematically illustrating the relationship between the surface protrusion portion on which the metal portion is formed and the sealing member in the light emitting device according to the embodiment.

  Here, although not shown, a lead frame in which a plurality of sets of metal plates to be a pair of the first lead electrode 20 and the second lead electrode 30 are connected by suspension leads is used. The set of the metal plates on the lead frame is referred to as a first lead electrode 20 and a second lead electrode 30.

The method for manufacturing the light emitting device 1 of the present embodiment includes the following first to eleventh steps as an example.
The first step is a step of preparing the first lead electrode 20 and the second lead electrode 30.
The configurations of the first lead electrode 20 and the second lead electrode 30 are as described above, and the front surface protrusions 4 and 5 and the back surface protrusions 6 and 7 are formed in advance.

The front surface protrusions 4 and 5 and the back surface protrusions 6 and 7 can be formed, for example, by processing the metal plate base material itself by etching or pressing.
When the front surface protrusions 4 and 5 and the rear surface protrusions 6 and 7 are formed by etching, the pair of lead electrodes 20 and 30 are covered with a mask having a predetermined shape and immersed in an etching solution. The side surfaces of the protrusions 6 and 7 are slightly rounded (see FIG. 11). On the other hand, when the front surface protrusions 4 and 5 and the rear surface protrusions 6 and 7 are formed by pressing, the side surfaces of the front surface protrusions 4 and 5 and the rear surface protrusions 6 and 7 are vertical and may have corners. Yes (see FIG. 3).

  Moreover, the front surface protrusions 4 and 5 and the back surface protrusions 6 and 7 are crushed when clamped by a mold depending on the clamping pressure. Therefore, the thicknesses of the front surface protrusions 4 and 5 and the rear surface protrusions 6 and 7 are determined in consideration of the clamping pressure, and the thicknesses B1 and B2 of the front surface protrusions 4 and 5 and the rear surface protrusions 6 and 7 are clamped. Is preferably designed to be 5 μm or more and 50 μm or less.

The second step is a step of forming the plating layer 60 on the surface of the pair of lead electrodes 20 and 30 so that at least the tips of the front surface protruding portions 4 and 5 and the back surface protruding portions 6 and 7 are exposed. The formation location of the plating layer 60 is as described above.
The plating layer 60 can be formed by electroless plating or electrolytic plating. Moreover, in order to expose the front-end | tip of the surface protrusion parts 4 and 5 and the back surface protrusion parts 6 and 7 from the plating layer 60, for example, after using the mask or forming the plating layer 60, the surface protrusion parts 4 and 5 and the back surface protrusion The plating layer 60 at the tip of the parts 6 and 7 may be removed by etching. The methods of electroless plating and electrolytic plating are not particularly limited, and may be performed by a conventionally known method.

  Before performing the third step, as shown in FIG. 6, the first lead electrode 20 and the second lead electrode 30 are disposed between the upper mold 70 and the lower mold 71. The first lead electrode 20 and the second lead electrode 30 are disposed with a gap 10e (see FIG. 2) therebetween to prevent a short circuit. At this time, the lower mold 71 contacts the tip of the back surface protruding portion 7 of the second lead electrode 30, and the lower mold 71 contacts the tip of the back surface protruding portion 6 of the first lead electrode 20. The upper mold 70 has a convex portion 75 corresponding to the shape of the concave portion 10a in order to form the concave portion 10a for accommodating the light emitting element 2 by the pair of lead electrodes 20 and 30 and the resin molded body 10. ing.

  In the third step, for example, using the package manufacturing mold K, the tips of the exposed surface protrusions 4 and 5 are brought into contact with the upper mold 70, and the tips of the exposed back surface protrusions 6 and 7 are placed in the lower mold. This is a step of sandwiching the pair of lead electrodes 20 and 30 so as to contact the mold 71. Here, as shown in FIG. 7, the first lead electrode 20 and the second lead electrode 30 are sandwiched between the upper mold 70 and the lower mold 71.

Specifically, the second cutout portion 74 b of the upper mold 70 is in contact with a portion corresponding to the second outer lead portion 30 b of the second lead electrode 30 and is formed on the convex portion 75 of the upper mold 70. The second bottom surface portion 75 b contacts the surface protrusion 5 of the second lead electrode 30. In addition, the first cutout portion 74 a of the upper mold 70 is in contact with a portion corresponding to the first outer lead portion 20 b of the first lead electrode 20 and is formed on the convex portion 75 of the upper mold 70. The bottom surface portion 75 a contacts the surface protrusion 4 of the first lead electrode 20. Thereby, the space portions 80 and 81 are formed by the upper mold 70 and the lower mold 71.
The third bottom surface portion 75c formed on the convex portion 75 of the upper mold is formed in a convex shape between the first bottom surface portion 75a and the second bottom surface portion 75b. This is to prevent a gap between the first lead 20 and the second lead 30.
However, the convex portion 75 of the upper mold 70 may be flat, and the first bottom surface portion 75a, the second bottom surface portion 75b, and the third bottom surface portion 75c may be flush with each other. In this case, the surface protrusion 4 of the first lead 20, the surface protrusion 5 of the second lead 30, and the gap 10e are flush with each other. The lower mold 71 also has a flat gap 10e between the back surface protruding portion 6 of the first lead 20 and the back surface protruding portion 7 of the second lead 30, and the upper surface of the lower mold 71 is flush. You can also. In this case, the back surface protruding portion 6 of the first lead 20, the back surface protruding portion 7 of the second lead 30, and the gap portion 10e are flush with each other.

In the third step, the second bottom surface portion 75b formed on the convex portion 75 of the upper mold 70 is not in contact with the exposed metal portion of the second lead electrode 30, and the first bottom surface portion 75a is the first lead electrode. The first lead electrode 20 and the second lead electrode 30 are sandwiched by the clamping force of the mold so as not to contact the exposed metal portion of the metal 20. At this time, the surface protrusions 4 and 5 are crushed when clamped depending on the clamping pressure, but the second bottom surface portion 75b does not contact the exposed metal portion of the second lead electrode 30, so that the space portion 82 is formed. The Similarly, since the first bottom surface portion 75a does not contact the exposed metal portion of the first lead electrode 20, a space portion 83 is formed.
In addition, the back surface protruding portions 6 and 7 are crushed when clamped depending on the clamping pressure, but the lower mold 71 does not contact the metal exposed portion of the second lead electrode 30, so that a space portion 85 is formed. Similarly, in the lower mold 71, the first bottom surface portion 75a does not come into contact with the exposed metal portion of the first lead electrode 20, so that a space portion 84 is formed. The metal exposed portion on the back surface of the pair of lead electrodes 20 and 30 is a portion excluding the back surface protruding portions 6 and 7 on the back surface of the pair of lead electrodes 20 and 30.
In the third step, in the light emitting device 1 after manufacture, it is preferable to clamp the front surface protrusions 4 and 5 and the back surface protrusions 6 and 7 so that the thicknesses B1 and B2 are 5 μm or more and 50 μm or less.

  The fourth step is a step of injecting the resin J into the package manufacturing mold K sandwiching the pair of lead electrodes 20 and 30. Here, as shown in FIGS. 7 and 8, the resin J is injected from the injection port 77 into the spaces 80 and 81 formed by the upper mold 70 and the lower mold 71 by transfer molding. In the fourth step, since the first lead electrode 20 and the second lead electrode 30 are sandwiched between the upper mold 70 and the lower mold 71, the first lead electrode 20 and the second lead electrode 20 are injected when the resin J is injected. The lead electrode 30 does not flutter, and the generation of burrs can be suppressed. Since the pair of lead electrodes 20 and 30 are provided with the front surface protruding portions 4 and 5 and the rear surface protruding portions 6 and 7, the resin J is difficult to enter the space portions 82, 83, 84 and 85.

  The fifth step is a step of generating the resin molded body 10 by curing the resin J injected into the package manufacturing die K. Here, when a thermosetting resin such as an epoxy resin is injected as the resin J, the upper mold 70 and the lower mold 71 are heated and the resin J is heated and cured for a predetermined time. For example, when a thermoplastic resin such as polyphthalamide resin is injected, it can be formed by injection molding. In this case, the thermoplastic resin may be melted at a high temperature, placed in a low temperature mold and solidified by cooling.

  The sixth step is a step of removing the upper mold 70 and the lower mold 71. Here, for example, as shown in FIG. 9, the upper mold 70 is removed. Thereby, a package in which the first lead electrode 20 and the second lead electrode 30 are integrally held by the resin molded body 10 is completed.

  When the resin J is cured in the fifth step, the cross section including the injection port 77 of the upper mold 70, that is, the cross section corresponding to the direction of the arrow XX in FIG. 1, is as shown in FIG. In addition, a gate 86 is formed at the injection port 77 portion. The gate 86 is cut by a known cutting machine along the outer surface 11a of the resin molded body 10 after removing the upper mold 70 (seventh step). Thereby, the gate mark 50 is formed as a cutting mark of the gate 86.

  The eighth step is a step of mounting the light emitting element 2 in the recess 10 a formed in the package 90. In the present embodiment, the light emitting element 2 is an element having a single-sided electrode structure in which a pair of n electrodes and p electrodes are formed on the upper surface. In this case, the back surface of the light emitting element 2 is bonded to the second lead electrode 30 with an insulating die-bonding member, one electrode on the upper surface is connected to the first lead electrode 20 by the wire W, and the other electrode on the upper surface is The wire W is connected to the second lead electrode 30.

  The ninth step is a step of filling the sealing member 40 so as to cover the light emitting element 2 in the recess 10 a of the package 90. Here, as shown in FIG. 2, the sealing member 40 is applied in the recess 10 a surrounded by the resin molded body 10 of the package 90 to seal the light emitting element 2. At this time, the sealing member 40 is dropped onto the upper surface of the recess 10 a of the resin molded body 10. As a method for filling the sealing member 40 in the recess 10a of the resin molded body 10, for example, injection, compression, extrusion, or the like can be used. The sealing member 40 is preferably mixed with a phosphor. Thereby, the color adjustment of the light emitting device can be easily performed.

  The tenth step is a step of curing the sealing member 40 filled in the recess 10a. Here, when a thermosetting resin such as a silicone resin is injected as the sealing member 40, the resin is heated and cured for a predetermined time.

The eleventh step is a step of separating the package 90 from the lead frame. Here, the resin molded body 10 and the pair of lead electrodes 20 and 30 are cut from the lead frame, and the package 90 is singulated. Here, for example, a lead cutter can be used as a jig for cutting the suspension leads of the lead frame.
The light emitting device 1 can be formed by the above method.

As described above, in the package manufacturing method according to the embodiment, the first lead electrode 20 and the second lead electrode 30 are clamped by the upper mold 70 and the lower mold 71 as shown in FIGS. When J is implanted, the clamping area is reduced as compared with the case where the front surface protrusions 4 and 5 and the back surface protrusions 6 and 7 do not exist in the lead electrode. Therefore, the clamping force is concentrated on the front surface protruding portions 4 and 5 and the back surface protruding portions 6 and 7, and the upper die 70 and the lower die 71, and the first lead electrode 20 and the second lead electrode 30 are in close contact with each other. Moreover, since the front surface protrusions 4 and 5 and the back surface protrusions 6 and 7 are provided at the same position on the front and back of the first lead electrode 20 and the second lead electrode 30, the front surface protrusions 4 and 5 and the back surface protrusions. Clamping force is more likely to concentrate on 6 and 7. Furthermore, since the plating layer 60 is not formed at the tips of the front surface protrusions 4 and 5 and the back surface protrusions 6 and 7, the clamping force is more likely to concentrate on the front surface protrusions 4 and 5 and the back surface protrusions 6 and 7. .
Therefore, the resin J is difficult to flow out to the space portions 82 and 83, that is, the exposed metal portions on the first lead electrode 20 and the second lead electrode 30. Thereby, the package and the light emitting device according to the embodiment can suppress the generation of burrs.

This eliminates the need for the step of removing burrs from the bottom surface portion 10c of the recess 10a, which is conventionally required after the package forming step. Therefore, according to the manufacturing method of the package and the light emitting device according to the embodiment, the package and the light emitting device that can suppress the generation of burrs can be easily manufactured. As a result, the cost is reduced and the lead time is shortened.
Furthermore, it becomes difficult for the resin J to flow out to the spaces 84 and 85. Thereby, the package and light emitting device according to the embodiment can eliminate the step of removing burrs on the back surface of the package.

In addition, in the lead electrode, when the surface protrusions 4 and 5 do not exist as in the conventional case, when the lead frame is sandwiched between the molds, traces of processing by the molds are generated, and due to the clamping pressure and heat of the molds The glossiness of the surface of the plating layer 60 on the first lead electrode 20 and the second lead electrode 30 changes. For this reason, even if the glossiness of the surface of the plating layer 60 on the first lead electrode 20 and the second lead electrode 30 is increased before molding, the glossiness is decreased after molding, and the luminous flux of the LED is decreased. The output will also decrease.
However, since the first lead electrode 20 and the second lead electrode 30 according to the embodiment have the surface protruding portions 4 and 5, the first bottom surface portion 75 a and the second bottom surface portion 75 a formed on the convex portion 75 of the upper mold 70. Contact between the bottom surface portion 75b and the exposed metal portions of the first lead electrode 20 and the second lead electrode 30 is eliminated. Therefore, the first lead electrode 20 and the second lead electrode 30 can be molded without reducing the gloss of plating. Thereby, the problem that the output of the conventional LED falls can be solved.

  Further, since the first lead electrode 20 and the second lead electrode 30 have the front surface protrusions 4 and 5 and the rear surface protrusions 6 and 7, the area clamped by the mold is smaller than the conventional, and the surface protrusions 4 and 4 5 and the back surface protrusions 6 and 7 concentrate the clamping pressure, so that the number of LEDs that can be manufactured from one lead frame can be increased.

  Further, since the clamping pressure is concentrated only on the front surface protruding portions 4 and 5 and the back surface protruding portions 6 and 7, the clamping pressure of the package manufacturing mold K itself is reduced to, for example, about half that of the conventional mold. be able to. As a result, there is an effect that the life of the mold apparatus is extended.

Further, since the first lead electrode 20 and the second lead electrode 30 are formed with the surface protrusions 4 and 5, the contact area with the sealing member 40 is increased, and the adhesion with the sealing member 40 is improved. To do. Moreover, as shown in FIG. 12, the surface protrusion parts 4 and 5 and the back surface protrusion parts 6 and 7 are part of the metal of the surface protrusion parts 4 and 5 and the back surface protrusion parts 6 and 7 by being crushed at the time of clamping. Protrudes laterally to form the metal portion 14. As shown in FIG. 13, when the sealing member 40 enters the lower portion of the metal portion 14, the sealing member 40 is prevented from coming out upward. It should be noted that the fact that the surface protrusions 4 and 5 are annular also contributes to prevention of the sealing member 40 from coming off.
Further, since the package 90 is molded without reducing the glossiness of the surface of the plating layer 60 on the first lead electrode 20 and the second lead electrode 30 exposed in the recess 10a, the light flux of the light emitting device 1 is reduced. It is possible to suppress the output drop.

  Further, since the first lead electrode 20 and the second lead electrode 30 have the surface protrusions 4 and 5, it is possible to suppress the flow (bleed) of the die bond member when the light emitting element 2 is mounted. In particular, when a plurality of light emitting elements 2 are mounted, the flow of the die bond member in the lateral direction becomes a problem. However, if the width A <b> 1 of the surface protrusions 4, 5 is 110 μm or more, the die bond member hardly flows beyond the surface protrusions 4, 5.

  Since the first lead electrode 20 and the second lead electrode 30 have the rear surface protruding portions 6 and 7, when the light emitting device 1 is mounted, a solder paste or the like is applied to the region surrounded by the rear surface protruding portions 6 and 7. The joining member can be injected. Thereby, joint strength can be improved. Further, leakage of the joining member in the lateral direction is prevented, and short-circuiting due to the joining member entering between the first lead electrode 20 and the second lead electrode 30 is prevented. If the width A2 of the rear surface protrusions 6 and 7 is 110 μm or more, the joining member is less likely to flow beyond the rear surface protrusions 6 and 7. Furthermore, by making all the back surface protruding portions 6 and 7 have the same thickness, the stability in mounting the light emitting device 1 is improved.

<Example 1>
Examples of the present invention will be described below. As shown in FIG. 2 and FIG. 3, surface protrusions 4 and 5 are provided at the boundary between the metal exposed portions of the first lead electrode 20 and the second lead electrode 30 and the resin molded body 10, and the positions of the surface protrusions 4 and 5. Molding was performed using a transfer molding machine using the first lead electrode 20 and the second lead electrode 30 provided with the back surface protruding portions 6 and 7 at the position of the back surface opposite to each other.
Confirm the occurrence of burrs by molding under the conventional clamping pressure conditions and injection pressure conditions that generated resin burrs when using conventional lead electrodes without front surface protrusions 4, 5 and back surface protrusions 6, 7. Went.

As a result, in the first lead electrode 20 and the second lead electrode 30 having the front surface protruding portions 4 and 5 and the back surface protruding portions 6 and 7, the metal exposed portions of both the first lead electrode 20 and the second lead electrode 30 are exposed to the metal. It was confirmed that no burrs were generated. Further, it was confirmed that no burrs were generated on the back surfaces of both the first lead electrode 20 and the second lead electrode 30.
Further, it was confirmed that the second bottom surface portion 75b formed on the convex portion 75 of the upper mold 70 did not contact the metal exposed portion of the second lead electrode 30 exposed at the concave portion 10a of the package 90. This exposed metal portion is a central portion of the second inner lead portion 30a excluding the surface protruding portion 5.
Further, it was confirmed that the first bottom surface portion 75 a formed on the convex portion 75 of the upper mold 70 did not contact the metal exposed portion of the first lead electrode 20 exposed in the concave portion 10 a of the package 90. This exposed metal portion is a central portion of the first inner lead portion 20a excluding the surface protrusion 4.

<Modification>
Next, a modification of the light emitting device according to this embodiment will be described.
[Modification 1]
FIG. 14 is a diagram schematically illustrating a part of the light emitting device according to the first modification, and is a cross-sectional view illustrating a state of the plating layer.
In the above-described embodiment, the tips of the front surface protrusions 4 and 5 and the rear surface protrusions 6 and 7 are exposed from the plating layer 60. However, in the first modification, the front surface protrusions 4 and 5 and the rear surface protrusions 6 and 7 are exposed. The tip of is coated with a plating layer 60. Furthermore, in the above-described embodiment, the widths A1 and A2 of the front surface protrusions 4 and 5 and the back surface protrusions 6 and 7 are preferably 110 μm or more. It is an essential configuration that the widths A1 and A2 of the protrusions 6 and 7 are 110 μm or more. Other configurations are the same as those of the above-described embodiment.
According to such a configuration, the front surface protrusions 4, 5 and the rear surface protrusions 6, 7 are not exposed from the plating layer 60 except for the front surface protrusions 4, 5 and the rear surface protrusions 6, 7. The effect which it has and the width A1, A2 of the surface protrusion parts 4 and 5 and the back surface protrusion parts 6 and 7 are 110 micrometers or more can be acquired.
Moreover, in the manufacturing method of the package of the modification 1, the front-end | tips of the surface protrusion parts 4 and 5 and the back surface protrusion parts 6 and 7 are coat | covered with the plating layer 60 in a 2nd process.

[Modification 2]
FIG. 15 is a diagram schematically illustrating a lead electrode according to the second modification, and is a cross-sectional view of the lead electrode in which a side protrusion is formed. FIG. 16 is a diagram showing an outline of the lead electrode according to the second modification, and is a top view of the lead electrode on which the side protrusions are formed.
The first lead electrode 20 and the second lead electrode 30 are side protrusions 8 which are protrusions formed along the width direction of the side surface at the center in the height direction of the side surface on the respective side surfaces facing each other. , 9 may be provided. That is, the first lead electrode 20 and the second lead electrode 30 have side protrusions 8 and 9 that protrude in the horizontal direction, respectively, at a portion where the pair of lead electrodes 20 and 30 are connected by the resin molded body 10. doing.

The side protrusion 8 of the first lead electrode 20 is formed with a predetermined thickness in the center in the height direction in a cross-sectional view. Further, the side protrusion 8 of the first lead electrode 20 has a width direction of the first lead electrode 20, that is, a longitudinal direction of the gap 10 e that connects the first lead electrode 20 and the second lead electrode 30 in a top view. It is formed in all the width directions of the first lead electrode 20 in the parallel direction.
The side protrusion 9 of the second lead electrode is formed with a predetermined thickness in the center in the height direction in a cross-sectional view. Further, the side protrusion 9 of the second lead electrode 30 has a width direction of the second lead electrode 30, that is, a longitudinal direction of the gap 10 e that connects the first lead electrode 20 and the second lead electrode 30 in a top view. It is formed in all the width directions of the second lead electrode 30 in the parallel direction.

The side protrusions 8 and 9 can be formed in the first lead electrode 20 and the second lead electrode 30 by, for example, processing the metal plate base material itself by etching or pressing.
Since the package 90 has the side protrusions 8 and 9, the adhesion between the first lead electrode 20 and the second lead electrode 30 and the resin molded body 10 is improved, and the first lead electrode 20 and the second lead electrode 30 are improved. And are more firmly fixed. In addition, the thickness and length of the side protrusions 8 and 9 are not particularly defined, and may be adjusted as appropriate.

[Modification 3]
FIG. 17 is a cross-sectional view illustrating an outline of the positional relationship between the surface protrusion of the light emitting device according to Modification 3 and the resin molded body. FIG. 18 is a cross-sectional view illustrating an outline of the positional relationship between the surface protrusion of the light emitting device according to Modification 3 and the resin molded body, and the mold.
The side surface portion 10b of the recess 10a is on the surface protrusions 4 and 5, and may be continuously connected to the upper surfaces of the surface protrusions 4 and 5. That is, part of the surface protrusions 4 and 5 of the package 90 is covered with the resin molded body 10, and the lower part of the side surface part 10 b of the recess 10 a is the upper surface of the surface protrusions 4 and 5 in the cross-sectional view. In contact with the position, the upper surfaces of the surface protrusions 4 and 5 and the side surface 10b of the recess 10a are continuously connected.
By setting it as such a structure, the adhesiveness of the resin molding 10 to a pair of lead electrodes 20 and 30 can be improved more.

  In this package manufacturing method, in the step of sandwiching the first lead electrode 20 and the second lead electrode 30 with a mold, the outer periphery of the convex portion 75 of the upper mold 70 is placed at a predetermined position on the upper surface of the surface protrusions 4 and 5. The first lead electrode 20 and the second lead electrode 30 are sandwiched so that the end portions are arranged.

When the first lead electrode 20 and the second lead electrode 30 are sandwiched between molds, due to thermal expansion of the lead electrodes due to the heat of the molds, variation in the dimensions of the lead electrodes, etc., In some cases, the upper mold 70 and the pair of lead electrodes 20 and 30 cannot be accurately set. Therefore, if the width of the surface protrusions 4 and 5 is narrow, the outer peripheral end of the convex portion 75 of the upper mold 70 may not be disposed at a predetermined position on the upper surface of the surface protrusions 4 and 5. However, by setting the width of the surface protrusions 4 and 5 to 110 μm or more, the outer peripheral end of the convex portion 75 of the upper mold 70 can be disposed at a predetermined position on the upper surface of the surface protrusions 4 and 5. The side surface portion 10b of the concave portion 10a can be disposed on the surface protruding portions 4 and 5.
In addition, it is preferable to set so that the width | variety of the surface protrusion parts 4 and 5 exposed from the resin molding 10 may be 110 micrometers or more.

[Modification 4]
FIG. 19 is a cross-sectional view schematically illustrating a state of a surface protrusion portion in which a groove portion before and after clamping is formed in a light emitting device according to Modification 4.
In the light emitting device, at the front ends of the surface protrusions 4 and 5, in the longitudinal direction of the surface protrusions 4 and 5 (the direction perpendicular to the paper surface of FIG. 19 and extending along the periphery of the bottom surface portion 10 c of the recess 10 a). The groove 15 is formed along the longitudinal direction of the rear surface protrusions 6 and 7 (the direction corresponding to the longitudinal direction of the front surface protrusions 4 and 5). It is good also as a structure which has the groove part 15.
In the surface protrusions 4 and 5, a groove 15 having a predetermined depth and shape formed along the longitudinal direction of the surface protrusions 4 and 5 is formed in the center of the upper surface in the width direction. Similarly, the back surface protruding portions 6 and 7 are formed with a groove portion 15 having a predetermined depth and shape formed along the longitudinal direction of the back surface protruding portions 6 and 7 in the center of the bottom surface in the width direction. When the front surface protrusions 4 and 5 and the rear surface protrusions 6 and 7 are clamped by the clamping force such that the front surface protrusions 4 and 5 and the rear surface protrusions 6 and 7 are crushed, Metal that protrudes in the direction is buried.

In such a method for manufacturing a light emitting device, first, in the step of preparing a pair of lead electrodes 20, 30, the groove 15 is formed at the tips of the front surface protruding portions 4, 5 and the back surface protruding portions 6, 7. When the pair of lead electrodes 20 and 30 are clamped, the front surface protrusions 4 and 5 and the rear surface protrusions 6 and 7 are crushed depending on the clamping pressure, and the front surface protrusions 4 and 5 and the rear surface protrusions 6 and 7 are metal. A part of Thus, the protruding metal is embedded in the groove 15, and the metal portion 14 is prevented from being generated outside the front surface protruding portions 4 and 5 and the back surface protruding portions 6 and 7. Therefore, although the groove 15 in which the metal is embedded in the front surface protrusions 4 and 5 and the back surface protrusions 6 and 7 remains in the manufactured package, the front surface protrusions 4 and 5 and the back surface protrusions 6 and 7 are metal parts. It will not have 14.
Therefore, in the light emitting device, when it is desired to keep the shape of the front surface protrusions 4 and 5 and the back surface protrusions 6 and 7, the front surface protrusions 4 and 5 and the back surface protrusions 6 and 7 have a groove 15. It is preferable to do.
The depth, shape, position, and the like of the groove 15 are not limited and may be adjusted as appropriate. Moreover, the groove part 15 may be formed in any one of the surface protrusion parts 4 and 5 and the back surface protrusion parts 6 and 7. FIG.

[Modification 5]
FIG. 20 is a diagram schematically illustrating a light emitting device according to Modification 5, and is a cross-sectional view of a light emitting device in which a region for mounting a light emitting element is filled with a die bond member.
In the light emitting device, the sealing member 40 contains the first phosphor, and the mounting region of the light emitting element 2 is filled with a resin containing the second phosphor having an emission wavelength different from the emission wavelength of the first phosphor. Also good.
For example, a phosphor that emits green light as the first phosphor is mixed with the sealing member 40, and a phosphor that emits red light as the second phosphor is mixed with the die bond member 45. After the die bonding member 45 containing the second phosphor is filled in the mounting region of the light emitting element 2 (the metal exposed portion of the second lead electrode 30) and the light emitting element 2 is mounted, the sealing containing the first phosphor is performed. The stop member 40 is filled in the recess 10a of the package 90 to obtain a light emitting device. Thereby, the light-emitting device can be a bright white light source. As shown in FIG. 20, the die-bonding member 45 containing phosphor may be filled in the exposed metal portion of the first lead electrode 20.
What is necessary is just to select suitably the kind and combination of a 1st fluorescent substance and a 2nd fluorescent substance as desired.

[Other variations]
Although it has been described that the front surface protrusions 4 and 5 and the rear surface protrusions 6 and 7 are formed on both the first lead electrode 20 and the second lead electrode 30 of the package 90, respectively, only one of the lead electrodes is formed. You may make it provide a surface protrusion part and a back surface protrusion part.
Further, the side surfaces of the surface protrusions 4 and 5 on the metal exposed surface side may be inclined outward from the lower part to the upper part in a cross-sectional view. According to such a configuration, the light extraction efficiency is improved.

The recess 10a of the package 90 may be formed to have a cylindrical shape without providing an inclination.
Further, the side surface portion 10b of the concave portion 10a does not necessarily have to be flat, and is formed so as to improve the adhesion at the interface between the resin molded body 10 and the sealing member 40 by forming the side surface portion 10b to be uneven. May be. Moreover, although the recessed part 10a was shape | molded by planar view circular shape in this embodiment, you may shape | mold so that an ellipse may be exhibited. Moreover, although the resin molding 10 was shape | molded in the rectangle in this embodiment, it is good also as planar view circular shape, an ellipse shape, and another polygonal shape.

The lead electrode only needs to have at least one pair of positive and negative electrodes (first lead electrode 20 and second lead electrode 30) as in the present embodiment, but three or more lead electrodes may be provided.
The light emitting element 2 can be mounted on the first lead electrode 20 instead of the second lead electrode 30. For example, when the light emitting device 1 includes two light emitting elements 2, the light emitting elements 2 can be mounted on the first lead electrode 20 and the second lead electrode 30, respectively. A protective element may be mounted on the inner lead portion where the light emitting element is not mounted. For example, the protection element can be mounted on the surface protrusion 4 or the surface protrusion 5 of the first lead electrode 20 by setting the width of the surface protrusions 4 and 5 to 110 μm or more.

The light emitting element 2 may be, for example, an element having a counter electrode structure (double-sided electrode structure) in which an n electrode (or a p electrode) is formed on the back surface of the element substrate. The light emitting element 2 is not limited to the face-up type, and may be a face-down type. When a face-down light emitting element is used, a wire can be eliminated.
In the manufacturing method of the light emitting device 1, the light emitting element 2 is mounted in advance after being mounted on the package 90. However, the light emitting element 2 may be mounted on the package 90 that is separated.

The position where the wire W is connected may be the upper surface of the surface protrusions 4 and 5. When the wire W is stretched, it is easier to stretch the wire W when the height difference between the upper surface of the light emitting element 2 and the position where the wire W is stretched is smaller, that is, when the position where the wire W is stretched is higher. If the width of the surface protrusions 4 and 5 is 110 μm or more, the wire W can be easily connected when the wire W is connected to the upper surface of the surface protrusions 4 and 5.
When the tips of the front surface protruding portions 4 and 5 and the back surface protruding portions 6 and 7 are exposed from the plating layer 60, the plating layer 60 may be provided only on the upper surfaces of the pair of lead electrodes 20 and 30.

  The light emitting device according to the embodiment of the present invention is used in a backlight light source of a liquid crystal display, various lighting fixtures, a large display, various display devices such as advertisements and destination guides, and further in a digital video camera, a facsimile, a copy machine, a scanner, It can be used for an image reading device, a projector device, and the like.

DESCRIPTION OF SYMBOLS 1 Light-emitting device 2 Light emitting element 4,5 Surface protrusion part 6,7 Back surface protrusion part 8,9 Side surface protrusion part 10 Resin molding 10a Recessed part 10b Side surface part 10c Bottom surface part 10e Gap part 11a Outer side surface 14 Metal part 15 Groove part 20 1st Lead electrode 20a First inner lead portion 20b First outer lead portion 30 Second lead electrode 30a Second inner lead portion 30b Second outer lead portion 40 Sealing member 45 Die bond member 50 Gate trace 60 Plating layer 70 Upper mold 71 Lower Mold 74a First notch 74b Second notch 75 Projection 75a First bottom 75b Second bottom 75c Third bottom 77 Inlet 80, 81, 82, 83, 84, 85 Space 86 Gate 90 Package J Resin K Mold for manufacturing package W Wire

Claims (13)

A pair of lead electrodes formed with a recess and exposed at the bottom surface of the recess;
A plating layer covering the surfaces of the pair of lead electrodes;
A resin molded body that holds the pair of lead electrodes and forms a side surface portion of the concave portion between the pair of lead electrodes of the concave portion;
At least one lead electrode of the pair of lead electrodes is a protruding portion formed linearly along the resin molded body of the bottom surface portion of the recess and along the periphery of the bottom surface portion of the recess. It has a surface protrusion, and has a back surface protrusion that is a protrusion formed at the position of the back surface opposite to the position of the surface protrusion,
A package in which the width of the surface protrusion is 110 μm or more.   The package according to claim 1, wherein the thickness of the surface protrusion is not less than 5 μm and not more than 50 μm.   The package according to claim 1 or 2, wherein a width of the rear surface protruding portion is 110 µm or more.   The said surface protrusion part is a package as described in any one of Claims 1-3 currently formed in the cyclic | annular form so that the area | region for mounting a light emitting element may be enclosed.   2. The pair of lead electrodes includes a side protrusion that is a protrusion formed along the width direction of the side surface at the center in the height direction of the side surface on each side surface facing each other. The package according to claim 4.   The package according to any one of claims 1 to 5, wherein a side surface portion of the recess is on the surface protrusion and is continuously connected to an upper surface of the surface protrusion.   It has a groove part formed along the longitudinal direction of the surface protrusion part at the tip of the surface protrusion part, and has a groove part formed along the longitudinal direction of the back surface protrusion part at the tip of the back surface protrusion part. The package according to any one of claims 1 to 6.   8. A light emitting device comprising: the package according to claim 1; and a light emitting element housed in the recess of the package and mounted on one lead electrode of the pair of lead electrodes. .   The light-emitting device according to claim 8, further comprising a sealing member provided in the recess so as to cover the light-emitting element. Projections formed linearly and annularly so as to surround a region for mounting a light emitting element by processing the base material itself of the metal plate on at least one of the pair of lead electrodes made of a metal plate Preparing the pair of lead electrodes formed with the front surface protruding portion and the back surface protruding portion which is a protruding portion formed at the position of the back surface of the metal plate relative to the position of the front surface protruding portion;
Forming a plating layer on the surfaces of the pair of lead electrodes;
In order to form a concave portion by the pair of lead electrodes and the resin molded body, a mold including an upper die having a convex portion corresponding to the shape of the concave portion and a lower die is used. Sandwiching the pair of lead electrodes so that the front ends abut against the upper mold and the front ends of the back surface protruding portions abut against the lower mold;
Injecting a resin into a mold sandwiching the pair of lead electrodes;
Curing the injected resin to form the resin molded body;
Removing the upper mold and the lower mold;
A method of manufacturing a package having The pair of lead electrodes sandwiched between the upper mold and the lower mold are integrally provided on a lead frame to which a plurality of the pair of lead electrodes are connected,
The package manufacturing method according to claim 10, further comprising a step of separating the package from the lead frame. A step of manufacturing a package by the method for manufacturing a package according to claim 10 or 11,
Mounting a light emitting element in the recess formed in the package.   The method for manufacturing a light emitting device according to claim 12, further comprising: filling a sealing member so as to cover the light emitting element in the recess.

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