JP2018157201A - Resistance device and manufacturing method of resistance device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resistance device which inhibits occurrence of warpage of a heat sink, enables a resistive element to be disposed with high accuracy, and achieves excellent heat radiation characteristics, and to provide a manufacturing method of the resistance device which can manufacture the resistance device with high accuracy in a relatively easy manner.SOLUTION: A resistance device 10 has: a resistive element 30 formed by forming a resistive element 32 on one surface of an insulation layer 31; and a heat sink 20 which is disposed on the other surface side of the insulation layer 31 and on which the resistive element 30 is mounted. A housing recess part 24 is formed on a mounting surface 21 of the heat sink 20 on which the resistive element 30 is mounted. The resistive element 30 is housed in the housing recess part 24, and the resistive element 30 housed in the housing recess part 24 is sealed by a resin 18.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a resistance device having a resistance element in which a resistor is formed on one surface of an insulating layer, and a heat sink disposed on the other surface side of the insulating layer, and a method of manufacturing the resistance device It is about.

In recent years, vehicles equipped with a high-voltage DC power source typified by a hybrid vehicle and a fuel cell vehicle are rapidly spreading.
A vehicle equipped with such a high-voltage DC power supply uses a high-voltage DC power supply having a voltage lower than the motor drive voltage mainly from the viewpoint of safety. A boost converter / inverter circuit system is mainly employed in which the output voltage of the high-voltage DC power source is boosted by a boost converter (up converter) and applied to an inverter for driving a motor.

The above-described boost converter / inverter circuit is configured by connecting a boost converter that boosts the voltage of a high-voltage DC power supply and an inverter that converts the boost DC voltage into an AC voltage and applies the AC voltage to an AC rotating electrical machine ( For example, see Patent Document 1).
In the boost converter / inverter circuit, a discharging resistance device is connected in parallel with the smoothing capacitor for the inverter.

  Here, as a conventional resistance device, for example, as shown in FIGS. 15 and 16, a resistor 332 is formed on one surface of the insulating layer 331 and a buffer layer 333 is formed on the other surface side of the insulating layer 331. The formed resistance element 330 is configured to be mounted on the heat sink 320. The above-described resistance element 330 is sealed with a sealing resin 318, and external terminals 315 and 315 are connected to electrode portions 335 and 335 formed at one end and the other end of the resistor 332, respectively. Protrudes from the sealing resin 318 to the outside. In the resistance device 310, the resistor 332 is energized through the external terminals 315 and 315 and the electrode portions 335 and 335 to discharge. Heat generated by the discharge is dissipated through the heat sink 320.

Conventionally, the resistance device as described above has a resistance element arranged and bonded at a predetermined position on the mounting surface of the heat sink, a mold is arranged so as to surround the resistance element, and a resin is poured into the mold. The resistance element is manufactured by resin sealing.
Note that such a resistance device is used for various purposes by appropriately selecting a resistor in addition to the above-described discharge device.

JP 2005-253276 A

Here, when manufacturing a conventional resistance device, it is necessary to position the resistance element with high accuracy, and therefore, the position of the resistance element was arranged while being measured, so that the work becomes very complicated. was there. Further, when the heat sink and the resistance element are bonded using a brazing material or the like, a liquid phase is generated at the time of bonding, which may cause a positional shift of the resistance element.
Moreover, when resin sealing is performed after the bonding of the resistance elements, there is a possibility that the installed formwork may be misaligned. In addition, the resin may leak from the gap between the mold and the heat sink.
Further, when the resistance element is joined to the heat sink, there is a problem that warpage occurs due to the difference between the thermal expansion coefficient of the heat sink and the thermal expansion coefficient of the resistance element (insulating layer).

  The present invention has been made in view of the above-described circumstances, and the resistance device in which the occurrence of warping of the heat sink is suppressed and the resistance element is accurately arranged, and further has excellent heat dissipation characteristics, and the resistance device are compared. An object of the present invention is to provide a method of manufacturing a resistance device that can be manufactured easily and accurately.

  In order to solve the above-described problems, a resistance device according to the present invention includes a resistance element in which a resistor is formed on one surface of an insulating layer, and the other side of the insulating layer. A resistance device having a heat sink to be mounted, wherein an accommodation recess is formed on a mounting surface of the heat sink on which the resistance element is mounted, and the resistance element is accommodated in the accommodation recess, and the accommodation The resistance element accommodated in the recess is sealed with resin.

According to the resistance device of the present invention, the housing recess is formed in the heat sink, and the resistance element housed in the housing recess is sealed with resin, so that the resistance element is accurately arranged at a predetermined position. It becomes possible.
In addition, the formation of the housing recess increases the bending rigidity of the heat sink, thereby suppressing the occurrence of warpage.
Furthermore, since the accommodation recess is formed, the surface area of the heat sink is increased, and the contact area between the resin encapsulating the resistance element and the heat sink is increased.

Here, in the resistance device of the present invention, it is preferable that a buffer layer made of a material having a deformation resistance smaller than that of the heat sink is formed between the heat sink and the insulating layer.
In this case, the deformation of the buffer layer described above can absorb thermal strain due to the difference in thermal expansion coefficient between the insulating layer and the heat sink, and suppress warpage and cracking of the insulating layer. Can do.

In the resistance device of the present invention, a buffer layer housing recess for housing the buffer layer may be formed on the bottom surface of the housing recess.
In this case, when the buffer layer is accommodated in the buffer layer accommodating recess, the resistance element provided with the buffer layer is positioned, and the resistance element can be arranged at a predetermined position with higher accuracy.

Furthermore, in the resistance device of the present invention, it is preferable that the mounting surface of the heat sink is provided with a projecting portion protruding from the mounting surface, and the housing recess is formed by the projecting portion. .
In this case, by providing a projecting portion on the mounting surface of the heat sink, the bending rigidity of the heat sink can be further improved, and the occurrence of warpage can be reliably suppressed. Is reliably increased, and the heat dissipation characteristics can be further improved.

In the resistance device of the present invention, the wall surface and the bottom surface of the housing recess may be connected via a curved surface portion.
In this case, since the wall surface and the bottom surface of the housing recess are connected via the curved surface, the flow of the resin into the housing recess is promoted, and the resistance element can be reliably sealed with the resin.

Furthermore, in the resistance device of the present invention, the heat sink main body and the frame body portion that forms the side surface of the housing recess are laminated, and the frame body portion is formed with a frame through hole for passing a screw. The heat sink main body and the frame body portion may be fixed by screws through screws through the frame body through holes.
In this case, since the heat sink is divided in the thickness direction, for example, it is possible to achieve both strength and heat dissipation by configuring the upper portion with a hard material and the lower portion with a material with good heat dissipation. Can be obtained. Moreover, since the heat sink main body and the frame body portion are fixed by screws, these positioning can be performed.

In the resistance device of the present invention, a plurality of the frame through holes may be provided.
In this case, it can fix with a some screw | thread, and it becomes possible to make positioning of a heat sink main body and a frame part easy.

Furthermore, in the resistance device of the present invention, the heat sink main body and the frame body portion may be brazed.
In this case, it is possible to reliably prevent resin leakage during resin sealing by brazing the frame body portion and the heat sink body.

In the resistance device of the present invention, the insulating layer is provided with an insulating layer through-hole for allowing a screw to pass therethrough, and the resistance element and the heat sink are screw-fixed by the screw through the insulating layer through-hole. It is good also as composition which has.
In this case, it is possible to position the resistance element by screwing the resistance element and the bottom surface of the accommodating recess.

Furthermore, in the resistance device of the present invention, a plurality of the insulating layer through holes may be provided.
In this case, it can be fixed by a plurality of screws, and the positioning of the resistance element can be facilitated.

In the resistance device of the present invention, the buffer layer is provided with a buffer layer through-hole for allowing a screw to pass therethrough, and the resistance element and the heat sink are fixed by screws through the buffer layer through-hole. It is good also as composition which has.
In this case, it is possible to position the resistance element by screwing the resistance element and the bottom surface of the accommodating recess.

Furthermore, in the resistance device of the present invention, a plurality of the buffer layer through holes may be provided.
In this case, it can be fixed by a plurality of screws, and the positioning of the resistance element can be facilitated.

In the resistance device of the present invention, the resistance element and the heat sink may be brazed.
In this case, the resistance element and the heat sink can be reliably bonded.

  A method of manufacturing a resistance device according to the present invention is a method for manufacturing a resistance device having a resistance element in which a resistor is formed on one surface of an insulating layer, and a heat sink disposed on the other surface side of the insulating layer. A method of forming a housing recess in the heat sink; a resistor forming step of obtaining the resistor by forming the resistor on one surface of the insulating layer; and It is characterized by comprising: a resistance element housing step that is arranged in the housing recess of the heat sink; and a resin sealing step that seals the resistance element housed in the housing recess with a resin.

  According to the manufacturing method of the resistance device having such a configuration, the housing recess forming step for forming the housing recess in the heat sink, and the resin sealing for sealing the resistance element housed in the housing recess with the resin Therefore, the resin poured into the housing recess is not leaked, and the resin sealing can be performed relatively easily. In addition, the resistance element can be manufactured with high accuracy without causing a positional shift of the resistance element.

Here, in the method of manufacturing a resistance device according to the present invention, it is preferable to include a buffer layer forming step of forming a buffer layer made of a material having a deformation resistance smaller than that of the heat sink on the other surface of the insulating layer.
In this case, a buffer layer can be formed between the heat sink and the insulating layer, and the deformation of the buffer layer absorbs the thermal strain caused by the difference in thermal expansion coefficient between the insulating layer and the heat sink, and warps. Generation | occurrence | production and the crack of an insulating layer can be suppressed.

In the method for manufacturing a resistance device of the present invention, a buffer layer housing recess is formed on the bottom surface of the housing recess in the housing recess forming step, and the buffer layer housing recess is formed in the buffer layer housing recess in the resistance element housing step. It is good also as a structure which arrange | positions a layer.
In this case, in the resistive element housing step, the resistive element provided with the buffer layer is positioned by disposing the buffer layer in the buffer layer accommodating recess, and the resistive element is placed at a predetermined position with higher accuracy. It becomes possible to arrange.

Furthermore, in the manufacturing method of the resistance device of the present invention, the housing recess forming step may have a configuration in which a wall surface and a bottom surface of the housing recess are connected via a curved surface portion.
In this case, in the resin sealing step, the flow of the resin into the housing recess is promoted, and the resistance element can be reliably sealed with the resin.

Moreover, in the manufacturing method of the resistance device of the present invention, the heat sink and the housing recess are formed by laminating and joining the heat sink body and the frame body portion that forms the side surface of the housing recess. Also good.
In this case, it is possible to form a heat sink having a housing recess by laminating and joining the heat sink body and the frame body portion that forms the side surface of the housing recess.

Here, in the manufacturing method of the resistance device according to the present invention, the heat sink body and the frame body portion may be screw-fixed.
In this case, the heat sink main body and the frame body portion can be laminated and joined relatively easily, and a heat sink having an accommodation recess can be formed. Moreover, thermal conductivity can be ensured by forming the fixing screw with aluminum or the like.

Moreover, in the manufacturing method of the resistance device of this invention, it is good also as a structure which fixes the said resistance element to the bottom part of the said accommodation recessed part in the said resistance element accommodation process.
In this case, since the resistance element is screwed to the bottom of the accommodation recess in the resistance element accommodation step, the position accuracy of the resistance measure can be further improved.

Furthermore, in the method for manufacturing a resistance device according to the present invention, a plurality of receiving recesses may be formed in the heat sink, the resistance element may be stored in each receiving recess, and the heat sink may be divided.
In this case, a plurality of resistance devices can be efficiently manufactured.

The heat sink may be divided after the resistance element is sealed with resin.
In this case, a plurality of resistance devices can be efficiently manufactured.

  According to the present invention, it is possible to suppress the occurrence of warping of the heat sink and to accurately arrange the resistance element, to further improve the heat dissipation characteristics, and to produce the resistance device relatively easily and accurately. A method for manufacturing a simple resistance device can be provided.

It is a perspective explanatory view of the resistance device which is the first embodiment of the present invention. It is a cross-sectional explanatory view of the resistance device shown in FIG. It is a flowchart which shows the manufacturing method of the resistance apparatus which is 1st embodiment of this invention. It is sectional explanatory drawing of the resistance apparatus which is 2nd embodiment of this invention. FIG. 5 is a cross-sectional explanatory view of a resistance element and a heat sink of the resistance device shown in FIG. 4. It is a perspective explanatory view of a resistance device which is another embodiment of the present invention. FIG. 7 is a cross-sectional explanatory view of the resistance device shown in FIG. 6. It is a perspective explanatory view of a resistance device which is another embodiment of the present invention. It is a perspective explanatory view of a resistance device which is another embodiment of the present invention. It is a perspective explanatory view of a resistance device which is another embodiment of the present invention. It is explanatory drawing which shows the manufacturing method of the resistance apparatus which is other embodiment of this invention. It is explanatory drawing which shows the manufacturing method of the resistance apparatus which is other embodiment of this invention. It is explanatory drawing which shows the manufacturing method of the resistance apparatus which is other embodiment of this invention. It is explanatory drawing which shows the manufacturing method of the resistance apparatus which is other embodiment of this invention. It is a perspective explanatory view of a conventional resistance device. FIG. 16 is a cross-sectional explanatory view of the resistance device shown in FIG. 15.

  Embodiments of the present invention will be described below with reference to the accompanying drawings.

<First embodiment>
First, a first embodiment of the present invention will be described.
The resistance device 10 according to the present embodiment is used for a discharge application. As illustrated in FIGS. 1 and 2, the heat sink 20, the resistance element 30 mounted on the heat sink 20, and the resistance element 30 are used. Connected external terminals 15 and 15.

The heat sink 20 is made of a material having excellent thermal conductivity such as aluminum or aluminum alloy, copper or copper alloy, and is made of an aluminum alloy such as A3003 in this embodiment.
One surface (the upper surface in FIGS. 1 and 2) of the heat sink 20 is a mounting surface 21 for the resistance element 30. Further, a cooler (not shown) can be stacked on the other surface (the lower surface in FIGS. 1 and 2) of the heat sink 20, and a fixing screw for fixing to the cooler is inserted into the heat sink 20. Fixing holes 22 and 22 are formed.

The mounting surface 21 of the heat sink 20 is formed with an accommodation recess 24 in which the resistance element 30 is accommodated. Here, the depth of the accommodation recess 24 is, for example, in the range of 2 mm or more and 10 mm or less, and is 4 mm in the present embodiment.
In the present embodiment, the housing recess 24 is configured to have a rectangular shape when viewed from above, as shown in FIG.

  Further, in the present embodiment, as shown in FIGS. 1 and 2, the housing recess 24 is formed by the protruding portion 25 provided so as to protrude upward from the mounting surface 21 of the heat sink 20. . That is, the protrusion 25 described above constitutes the side wall of the housing recess 24. The thickness of the protruding portion 25 is in the range of 1 mm to 10 mm. In the present embodiment, the height of the protrusion 25 is the same as the depth of the housing recess 24.

  As shown in FIG. 2, the resistance element 30 includes an insulating layer 31, a resistor 32 formed on one surface (the upper surface in FIG. 2) of the insulating layer 31, and the other surface of the insulating layer 31 (FIG. 2). And a buffer layer 33 formed on the lower surface.

The insulating layer 31 is made of ceramics such as silicon nitride (Si ₃ N ₄ ), aluminum nitride (AlN), alumina (Al ₂ O ₃ ), which has excellent insulating properties and heat dissipation characteristics, for example. The insulating layer 31 is made of alumina.
The thickness of the insulating layer 31 is set, for example, within a range of 0.1 mm or more and 2 mm or less, and is set to 0.64 mm in the present embodiment.

The resistor 32 is formed with electrode portions 35 and 35 at both ends thereof, and acts as an electric resistance when a voltage is applied to the electrode portions 35 and 35 at both ends. Here, as the resistor 32, for example, a Ta—Si-based thin film resistor or a RuO ₂ thick film resistor can be used. In the present embodiment, the resistor 32 is composed of a RuO ₂ thick film resistor, and the thickness thereof is set within a range of 3 μm or more and 30 μm or less, for example, and is 8 μm in the present embodiment. Yes.

The electrode portions 35 and 35 are electrical connection portions for applying a voltage to the resistor 32, and are made of a conductor, for example, copper or copper alloy, aluminum or aluminum alloy, silver or silver alloy, or the like. . In the present embodiment, the electrode portions 35 and 35 are made of a silver-palladium alloy, and the thickness thereof is set within a range of, for example, 3 μm or more and 30 μm or less. In the present embodiment, the thickness is set to 10 μm. Yes.
External terminals 15 and 15 are connected to the electrode portions 35 and 35, respectively. The external terminal 15 is made of a conductor, for example, a wire or a strip of copper or copper alloy, aluminum or aluminum alloy, silver or silver alloy, or the like.

The buffer layer 33 is made of a material having a deformation resistance smaller than that of the heat sink 20, and in this embodiment, the buffer layer 33 is made of aluminum (4N aluminum) having a purity of 99.99% by mass or more.
The thickness of the buffer layer 33 is in the range of 0.5 mm or more and 5 mm or less, and is 2.1 mm in this embodiment.

The resistance element 30 described above is accommodated in the accommodation recess 24 of the heat sink 20, and the buffer layer 33 of the resistance element 30 is joined to the bottom of the accommodation recess 24.
The resistance element 30 housed in the housing recess 24 is sealed with a sealing resin 18, and only the external terminal 15 protrudes from the sealing resin 18 to the outside. Here, as the sealing resin 18, for example, an epoxy resin or a urethane resin can be used.

  In the present embodiment, the amount of grease poured into the housing recess 24 is set so that the upper end of the sealing resin 18 is at the same position as the upper end of the housing recess 24 or lower than the upper end of the housing recess 24. Has been. Here, the difference between the upper end of the sealing resin 18 and the upper end of the housing recess 24 is preferably in the range of 0 mm to 1 mm. By setting the difference between the upper end of the sealing resin 18 and the upper end of the housing recess 24 to be 0 mm or more, the resistance element 30 sealed with the sealing resin 18 during handling can be prevented from being damaged. On the other hand, by setting the difference between the upper end of the sealing resin 18 and the upper end of the housing recess 24 to be 1 mm or less, it is possible to suppress the opening end of the housing recess 24 from being damaged during handling.

Next, the manufacturing method of the resistance device 10 which is this embodiment is demonstrated using the flowchart shown in FIG.
First, the housing recess 24 is formed on the mounting surface 21 of the heat sink 20 (housing recess forming step S11). In the present embodiment, by pressing the mounting surface 21 of the heat sink 20, the projecting portion 25 is provided to form the housing recess 24.

Further, the resistor 32 is formed on one surface of the insulating layer 31 made of ceramics (resistor forming step S21). In the present embodiment, the resistor 32 is formed by printing and baking.
Next, electrode portions 35, 35 are formed on both ends of the resistor 32. (Electrode part formation process S22). In the present embodiment, the electrode portions 35 are formed by printing and baking.
Next, the buffer layer 33 is formed on the other surface of the insulating layer 31 (buffer layer forming step S23). In the present embodiment, the buffer layer 33 is formed by bonding an aluminum plate to the other surface of the insulating layer 31. In the present embodiment, the aluminum plates are joined using an Al—Si brazing material.
Thus, the resistance element 30 in which the resistor 32 is formed on one surface of the insulating layer 31 and the buffer layer 33 is formed on the other surface is obtained.

Next, the resistance element 30 is accommodated in the accommodation recess 24 provided in the heat sink 20 (resistance element accommodation step S01). At this time, the bottom of the accommodation recess 24 and the buffer layer 33 are joined. In the present embodiment, since both the buffer layer 33 and the heat sink 20 are made of aluminum or an aluminum alloy, the bottom of the housing recess 24 and the buffer layer 33 are joined using an Al—Si brazing material.
Next, the external terminals 15 and 15 are connected to the electrode portions 35 and 35 of the resistance element 30 accommodated in the accommodating recess 24 (external terminal connection step S02). In this embodiment, the electrode parts 35 and 35 and the external terminals 15 and 15 are connected by soldering.
And by pouring resin in the accommodation recessed part 24, the resistance element 30 accommodated in the accommodation recessed part 24 is resin-sealed (resin sealing process S03).
Through such steps, the resistance device 10 according to the present embodiment is manufactured.

  In the resistance device 10 according to the present embodiment configured as described above, the resistance element 30 is accommodated in the accommodating recess 24 formed in the mounting surface 21 of the heat sink 20, and the resin is poured into the accommodating recess 24. As a result, since the resistance element 30 is resin-sealed, there is no displacement of the resistance element 30 (resistor 32), and the resistance element 30 (resistor 32) can be accurately placed at a predetermined position.

  Further, the formation of the housing recess 24 improves the bending rigidity of the heat sink 20 and can suppress the occurrence of warpage in the resistance device 10. In particular, in the present embodiment, since the projecting portion 25 is provided on the mounting surface 21 of the heat sink 20, the projecting portion 25 acts like a reinforcing rib to reliably improve the bending rigidity and generate warpage. Is suppressed. Specifically, the amount of warping of the resistance device 10 according to the present embodiment is set to 0.004 × L or less when the diagonal length L (mm) of the housing recess 24 is used. The amount of warpage in the present embodiment is measured on the lower surface (back surface) of the heat sink, the measurement range is an area where the accommodation recess 24 is formed, and the difference between the maximum value and the minimum value of the measurement values obtained by the moire interferometry method. It was.

  Further, in the resistance device 10 according to the present embodiment, the surface area is increased by forming the housing recess 24 in the heat sink 20, and the sealing resin 18 that seals the resistance element 30 is formed in the housing recess 24. Since the contact area is increased by contact with the side wall (protruding portion 25), the heat generated by the resistor 32 can be quickly transferred to the heat sink 20 side, and the heat dissipation characteristics are excellent.

  In the present embodiment, the buffer layer 33 made of a material having a deformation resistance smaller than that of the heat sink 20 is formed on the other surface of the insulating layer 31, and the heat sink 20, the insulating layer 31, and the like are interposed via the buffer layer 33. Since the buffer layer 33 is deformed, it is possible to absorb thermal strain due to the difference in thermal expansion coefficient between the insulating layer 31 and the heat sink 20, warp, and the insulating layer 31. Cracking can be suppressed.

According to the manufacturing method of the resistance device 10 according to the present embodiment, the housing recess forming step S11 for forming the housing recess 24 in the heat sink 20 and the resin sealing for sealing the resistance element 30 housed in the housing recess 24 with resin. Therefore, the resin sealing step S03 can be performed relatively easily without leakage of the poured resin.
Moreover, when forming the accommodation recessed part 24, the resistive element 30 can be positioned, and also the positional accuracy of the resistive element 30 improves without the positional shift of the resistive element 30 occurring at the time of joining. Therefore, it is possible to manufacture the resistance device 10 according to the present embodiment relatively easily and with high accuracy.

<Second Embodiment>
Next, a second embodiment of the present invention will be described. In addition, the same code | symbol is attached | subjected to the member equivalent to 1st embodiment, and detailed description is abbreviate | omitted.
The resistance device 110 according to the second embodiment includes a heat sink 120, a resistance element 130 mounted on the heat sink 120, and external terminals 15 and 15 connected to the resistance element 130. Further, the resistance element 130 is sealed with the sealing resin 18.

4 and 5, the resistance element 130 includes an insulating layer 31, a resistor 32 formed on one surface (the upper surface in FIG. 2) of the insulating layer 31, and the other surface of the insulating layer 31. And a buffer layer 133 formed on the lower surface in FIG.
The buffer layer 133 is made of a material having a deformation resistance smaller than that of the heat sink 120. In the present embodiment, the buffer layer 133 is made of aluminum (4N aluminum) having a purity of 99.99% by mass or more. The thickness of the buffer layer 133 is in the range of 0.5 mm or more and 5 mm or less, and is 2.1 mm in this embodiment.
In this embodiment, the width of the buffer layer 133 is smaller than that of the insulating layer 31 as shown in FIG.

The heat sink 120 is made of a material having excellent thermal conductivity such as aluminum or aluminum alloy, copper or copper alloy, and is made of an aluminum alloy such as A3003 in the present embodiment.
On the mounting surface 121 of the heat sink 120, an accommodation recess 124 for accommodating the resistance element 130 is formed.
Here, as shown in FIG. 5, the depth L1 of the accommodating recess 124 is, for example, in the range of 2 mm or more and 10 mm or less, and is 4 mm in the present embodiment. In the present embodiment, the housing recess 124 is configured to have a rectangular shape when viewed from above, as shown in FIGS.

  Further, in the present embodiment, the buffer layer accommodating recess 127 for accommodating the buffer layer 133 described above is formed on the bottom surface of the accommodating recess 124. The buffer layer housing recess 127 has a shape corresponding to the buffer layer 133 described above, and the buffer layer 133 (resistive element 130) is positioned in the housing recess 124 by the buffer layer housing recess 127.

Here, in the present embodiment, as shown in FIG. 5, the side surface 124a and the bottom surface 124b of the housing recess 124 are connected via a curved surface portion.
Further, the side surface 127a and the bottom surface 127b of the buffer layer housing recess 127 are formed to be orthogonal to each other, and the curved surface portion is not formed.

Next, a method for manufacturing the resistance device 110 according to the present embodiment will be described.
First, the accommodation recess 124 and the buffer layer accommodation recess 127 are formed on the mounting surface 121 of the heat sink 120 (accommodation recess formation step).

Further, the resistor 32 is formed on one surface of the insulating layer 31 made of ceramics (resistor forming step). In the present embodiment, the resistor 32 is formed by printing and baking.
Next, electrode portions 35, 35 are formed on both ends of the resistor 32. (Electrode part formation process). In the present embodiment, the electrode portions 35 are formed by printing and baking.
Next, the buffer layer 133 is formed on the other surface of the insulating layer 31 (buffer layer forming step). In the present embodiment, the buffer layer 133 is formed by bonding an aluminum plate to the other surface of the insulating layer 31. In the present embodiment, the aluminum plates are joined using an Al—Si brazing material.
In this manner, the resistance element 130 in which the resistor 32 is formed on one surface of the insulating layer 31 and the buffer layer 133 is formed on the other surface is obtained.

Next, the resistance element 130 is accommodated in the accommodation recess 124 provided in the heat sink 120 (resistance element accommodation step). At this time, the buffer layer 133 (resistive element 130) is positioned in the housing recess 124 by disposing the buffer layer 133 in the buffer layer housing recess 127 formed in the bottom of the housing recess 124.
Then, the buffer layer 133 (resistive element 130) and the heat sink 120 are joined. In this embodiment, since both the buffer layer 133 and the heat sink 120 are made of aluminum or an aluminum alloy, the buffer layer 133 (resistive element 130) and the heat sink 120 are joined using an Al—Si brazing material. .

Next, the external terminals 15 and 15 are connected to the electrode portions 35 and 35 of the resistance element 130 accommodated in the accommodating recess 124 (external terminal connection step). In this embodiment, the electrode parts 35 and 35 and the external terminals 15 and 15 are connected by soldering.
Then, the resistance element 130 accommodated in the accommodating recess 124 is resin-sealed by pouring resin into the accommodating recess 124 (resin sealing step).
By such a process, the resistance device 110 according to the present embodiment is manufactured.

In the resistance device 110 according to the present embodiment configured as described above, the resistance element 130 is accommodated in the accommodation recess 124 formed in the heat sink 120, and the resin is poured into the accommodation recess 124, whereby the resistance element Since 130 is resin-sealed, there is no positional displacement of the resistance element 130 (resistor 32), and the resistance element 130 (resistor 32) can be accurately placed at a predetermined position.
Furthermore, in this embodiment, since the buffer layer accommodating recess 127 for accommodating the buffer layer 133 is formed on the bottom surface of the accommodating recess 124, the buffer layer 133 (resistive element 130) is positioned in the accommodating recess 124. As a result, positioning can be performed with higher accuracy.

In the present embodiment, since the side surface 124a and the bottom surface 124b of the housing recess 124 are connected via the curved surface portion, the flow of the resin into the housing recess 124 is promoted, and the resistance element 130 is securely sealed with the resin. It is possible to stop.
Furthermore, in the present embodiment, the side surface 127a and the bottom surface 127b of the buffer layer housing recess 127 are formed so as to be orthogonal to each other, so that the buffer layer 133 (resistive element 130) can be positioned with higher accuracy.

As mentioned above, although one Embodiment of this invention was described, this invention is not limited to this, It can change suitably in the range which does not deviate from the technical idea of the invention.
For example, although the present embodiment has been described as a resistance device for discharge use, the present invention is not limited to this and may be another resistance device such as a heater.
In this embodiment, the buffer layer is formed on the other surface of the insulating layer. However, the present invention is not limited to this. For example, when the deformation resistance of the heat sink itself is small or the strength of the insulating layer is high. In some cases, it is not necessary to form a buffer layer.

In the present embodiment, the housing recess is formed by providing a protruding portion on the mounting surface of the heat sink. However, the present invention is not limited to this. For example, as shown in FIGS. Alternatively, the resistance device 210 may be configured such that the housing recess 224 is formed by forming the heat sink 220 thick and digging in the thickness direction from the mounting surface 221 of the heat sink 220.
Furthermore, as shown in FIG. 8, a region where the accommodation recess is formed may be formed thick, and the accommodation recess may be formed by digging down in the thickness direction from the mounting surface.

9 and 10, the heat sink may be divided in the thickness direction, and the lower portion and the upper portion may extend in different directions.
In this case, since the heat sink is divided in the thickness direction, for example, it is possible to achieve both strength and heat dissipation by configuring the upper portion with a hard material and the lower portion with a material with good heat dissipation. Can be obtained.

Moreover, as shown in FIG. 11, it is good also as a structure which forms a heat sink and an accommodation recessed part by laminating | stacking and joining the heat sink main body and the frame part which forms the side surface of the said accommodation recessed part.
Note that the resistance device having such a configuration can be configured by simultaneously bonding the frame portion and the heat sink when the heat sink body and the resistance element are bonded. It is also possible to join the resistance element to the heat sink after the frame portion is first joined to the heat sink body to form the heat sink.

Furthermore, as shown in FIG. 12, it is good also as a structure which screws a frame part to a heat sink main body. At this time, the heat conductivity can be improved by configuring the fixing screw with aluminum or the like.
In addition, the resistance device having such a configuration can be configured by bonding the resistance element to the heat sink body, fixing the frame body with screws, and performing resin sealing. In this case, the frame body portion is provided with a frame body through-hole for allowing a screw to pass therethrough, and the screw is passed through the frame body through-hole to fix the frame body portion and the heat sink body with screws. Moreover, after fixing with a screw, you may braze a frame body part and a heat sink main body. In the case of brazing, it is possible to reliably prevent resin leakage during resin sealing. Moreover, you may fix a frame part and a heat sink main body with a some screw | thread. In the case of fixing with a plurality of screws, a plurality of frame body through holes are also required. By fixing with a plurality of screws, it is possible to easily position the frame body portion and the heat sink body.

Further, as shown in FIG. 13, when the resistance element is accommodated in the accommodation recess, the resistance element may be screwed to the bottom surface of the accommodation recess. At this time, the housing recess forming step and the resistance element housing step may be simultaneously performed by screwing the frame body portion.
In this case, an insulating layer through-hole is provided in the insulating layer, a screw is passed through the insulating layer through-hole, and the bottom surface of the resistance element and the housing recess is screwed. When the buffer layer is provided, the buffer layer is provided so as to be larger than the insulating layer, a buffer layer through hole is formed in the buffer layer, a screw is passed through the buffer layer through hole, and the bottom surface of the resistance element and the accommodating recess May be fixed with screws. Also, a brazing material is disposed between the resistance element and the bottom surface of the receiving recess, and after fixing the screw, heating (a load may be applied if necessary) is performed to braze the resistance element and the bottom surface of the receiving recess. Also good.
The screw may be a metal having good thermal conductivity, but may be an insulating screw such as ceramics. By using an insulating screw, it becomes possible to prevent a short circuit with an electrode part or an external terminal.
Alternatively, a plurality of insulating layer through-holes or buffer layer through-holes may be formed, and the resistance element and the bottom surface of the housing recess may be screwed at a plurality of locations. Positioning can be performed easily by screwing the resistance element and the bottom surface of the housing recess at a plurality of locations. In addition, since the screw is fixed at a plurality of locations, the bottom surface of the resistance element and the housing recess can be securely fixed, and the heat dissipation can be improved.

Furthermore, as shown in FIG. 14, a plurality of resistance devices may be manufactured by forming a plurality of housing recesses in the heat sink, housing a resistance element in each housing recess, and cutting the heat sink.
In the case of such a manufacturing method, a plurality of resistance devices can be efficiently manufactured.
Also, a plurality of resistance devices may be manufactured by forming a plurality of housing recesses in the heat sink, housing the resistance elements in the respective housing recesses, sealing the resistance elements with resin, and then dividing the heat sink.

In addition, the structure of the resistance element is not limited to the present embodiment, and as long as the resistor is formed on one surface of the insulating layer, the material of the resistor, the method of forming the resistor, the insulating layer The material and the material and structure of the electrode part may be appropriately changed.
Furthermore, the structure of the heat sink is not limited to the present embodiment, and the material, the structure, and the like may be appropriately changed as long as the structure has a housing recess for housing the resistance element.

Below, the confirmation experiment performed in order to confirm the effectiveness of this invention is demonstrated.
An A6063 alloy plate (80 mm × 30 mm × thickness 3 mm) was prepared as a heat sink of the conventional example.
As a heat sink of Example 1 of the present invention, a protruding portion having a thickness of 3 mm and a height of 4 mm is formed on one surface of an A6063 alloy plate (80 mm × 30 mm × thickness 3 mm), and 40 mm × 24 mm × depth. What formed the accommodation recessed part of 4 mm was prepared.
As the heat sink of Example 2 of the present invention, an A6063 alloy plate (80 mm × 30 mm × thickness 7 mm) was prepared by digging the central portion into one surface to form a housing recess of 40 mm × 24 mm × depth 4 mm. .

As described in the above embodiment, an Ag-Pd electrode (1 mm) is formed on one surface of an insulating layer (38 mm × 22 mm × 0.64 mmt) made of ceramics (Al ₂ O ₃ ) on both ends in the longitudinal direction of the insulating layer. × 21 mm × 10 μmt) was formed by printing and firing, and a RuO ₂ thick film resistor (36 mm × 21 mm × 8 μmt) was formed between the electrodes by printing and firing. A buffer material (4N-Al, 38 mm × 22 mm × 2.1 mmt) and an Al—Si brazing material (Al-7.5 mass% Si: thickness 12 μm) are used on the other surface, a bonding temperature of 649 ° C., a load of 0. Joining was performed at 3 MPa.
The buffer material side of the joined body is placed at the center of one surface of the heat sink of the above-described conventional example and invention examples 1 and 2 with an Al—Si brazing material (Al-10.5 mass% Si: thickness 50 μm). It joined with. The joining conditions at this time were a joining temperature of 614 ° C. and a load of 0.3 MPa.
And resin was poured into the accommodation recessed part, and resin sealing was carried out. The resin used was an epoxy system. In the conventional example, as shown in FIGS. 15 and 16, resin sealing is performed so as to cover the resistor, the electrode, the insulating layer, and the buffer layer.

  The amount of warpage of the heat sink after resin sealing was evaluated. The difference between the maximum value and the minimum value of the measured value obtained by the moire interferometry in the region where the resistance is disposed on the lower surface (back surface) of the heat sink was defined as the amount of warpage.

In the conventional example, the amount of warpage was 162 μm.
In Invention Example 1, the warpage amount was 101 μm, and the warpage amount was reduced by 38% compared to the conventional example.
In Invention Example 2, the warpage amount was 122 μm, and the warpage amount was reduced by 25% compared to the conventional example.
From the above, it was confirmed that the warpage of the heat sink during bonding can be reduced by forming the housing recess.

10, 110, 210 Resistance device 18 Sealing resin (resin)
20, 120, 220 Heat sink 24, 124, 224 receiving recess 25 Protruding portion 30, 130, 230 Resistance element 31 Insulating layer 32 Resistor 33, 133 Buffer layer 127 Buffer layer receiving recess

Claims (22)

A resistance device having a resistance element in which a resistor is formed on one surface of an insulating layer, and a heat sink disposed on the other surface side of the insulating layer and mounting the resistance element,
An accommodation recess is formed on a mounting surface of the heat sink on which the resistance element is mounted. The resistance element is accommodated in the accommodation recess, and the resistance element accommodated in the accommodation recess is sealed with resin. A resistance device characterized by being stopped.   The resistance device according to claim 1, wherein a buffer layer made of a material having a deformation resistance smaller than that of the heat sink is formed between the heat sink and the insulating layer.   The resistance device according to claim 2, wherein a buffer layer housing recess for housing the buffer layer is formed on a bottom surface of the housing recess.   4. The mounting surface of the heat sink is provided with a projecting portion protruding from the mounting surface, and the housing recess is formed by the projecting portion. The resistance device according to any one of the above.   The resistance device according to any one of claims 1 to 4, wherein a wall surface and a bottom surface of the housing recess are connected via a curved surface portion.   A heat sink main body and a frame body portion that forms a side surface of the housing recess are laminated, and a frame body through hole for passing a screw is formed in the frame body portion, and the frame body through hole is passed through. The resistance device according to any one of claims 1 to 5, wherein the heat sink main body and the frame body portion are fixed by screws.   The resistance device according to claim 6, wherein a plurality of the frame through holes are provided.   The resistance device according to claim 6 or 7, wherein the heat sink main body and the frame body portion are brazed.   2. The insulating layer is provided with an insulating layer through-hole for allowing a screw to pass therethrough, and the resistance element and the heat sink are screw-fixed by a screw passing through the insulating layer through-hole. The resistance device according to claim 8.   The resistance device according to claim 9, wherein a plurality of the insulating layer through holes are provided.   3. The buffer layer is provided with a buffer layer through hole for allowing a screw to pass therethrough, and the resistance element and the heat sink are screwed to each other by a screw passing through the buffer layer through hole. The resistance device according to claim 10.   The resistance device according to claim 11, wherein a plurality of the buffer layer through holes are provided.   The resistance device according to claim 11, wherein the resistance element and the heat sink are brazed. A resistance device manufacturing method comprising: a resistance element having a resistor formed on one surface of an insulating layer; and a heat sink disposed on the other surface side of the insulating layer,
A housing recess forming step for forming a housing recess in the heat sink;
Forming a resistor on one surface of the insulating layer to obtain the resistor element;
A resistance element accommodation step of disposing the resistance element in the accommodation recess of the heat sink;
A resin sealing step of sealing the resistance element housed in the housing recess with a resin;
A method of manufacturing a resistance device.   15. The method of manufacturing a resistance device according to claim 14, further comprising a buffer layer forming step of forming a buffer layer made of a material having a deformation resistance smaller than that of the heat sink on the other surface of the insulating layer. In the housing recess forming step, a buffer layer housing recess is formed on the bottom surface of the housing recess,
16. The method of manufacturing a resistance device according to claim 15, wherein in the resistance element accommodation step, the buffer layer is disposed in the buffer layer accommodation recess.   The resistance according to any one of claims 14 to 16, wherein, in the housing recess forming step, the wall surface and the bottom surface of the housing recess are connected via a curved surface portion. Device manufacturing method.   18. The heat sink and the housing recess are formed by stacking and joining a heat sink body and a frame body portion that forms a side surface of the housing recess. A method for manufacturing a resistance device according to one item.   The method of manufacturing a resistance device according to claim 18, wherein the heat sink main body and the frame body portion are fixed with screws.   20. The method of manufacturing a resistance device according to claim 14, wherein, in the resistance element accommodation step, the resistance element is screwed to a bottom portion of the accommodation recess.   The resistance device according to any one of claims 14 to 20, wherein a plurality of housing recesses are formed in the heat sink, the resistance element is housed in each housing recess, and the heat sink is divided. Manufacturing method.   The method for manufacturing a resistance device according to claim 21, wherein the heat sink is divided after the resistance element is sealed with resin.

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