JP2018137437A - Air-cooled heat radiator and system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an air-cooled heat radiator and an air-cooled heat radiation system executing heat radiation by driving an air flow using an air pump.SOLUTION: An air-cooled heat radiator is provided adjacently to an electronic element and radiates heat. The air-cooled heat radiator includes a flow guide carrier and an air pump. The flow guide carrier has first and second surfaces, a flow guide chamber, an air intake side opening, and a communication groove. The air intake side opening is disposed on the first surface, the flow guide chamber is recessed in the first surface and communicates with the air intake side opening, and the communication groove communicates with the flow guide chamber and corresponds to the electronic element. The air pump is disposed on the first surface, and closes the air intake side opening. By driving the air pump, an air flow is taken into the flow guide chamber via the air intake side opening, and discharged through the communication groove, thus providing a lateral face air flow to the electronic element, and heat is exchanged with the electronic element.SELECTED DRAWING: Figure 2

Description

  The present application relates to an air-cooling heat dissipation device, and more particularly to an air-cooling heat dissipation device and an air-cooling heat dissipation system that perform heat dissipation by driving an air flow using an air pump.

  With the advancement of science and technology, various electronic devices, such as portable PCs, tablet computers, industrial computers, portable communication devices, media players, etc., have already developed in the trend of lighter and thinner, portable and high-functionality. These electronic devices have to be equipped with various highly integrated or high power electronic elements in a limited internal space, and when the operation speed of electronic devices is further increased and the functions are further enhanced, An electronic element inside the electronic device generates a large amount of heat energy during operation and becomes high temperature. In addition, many of these electronic devices are designed to be lightweight, thin, flat and compact, and there is no extra space for heat dissipation and cooling. Affected, it will cause problems such as dysfunction or damage.

  Generally, the heat dissipation method inside an electronic device can be divided into active heat dissipation and passive heat dissipation. In active heat dissipation, an axial fan or sirocco fan is usually placed inside an electronic device, and the air flow is driven by the axial fan or sirocco fan to generate heat generated by the electronic elements inside the electronic fan. Realize heat dissipation by transferring energy. However, the axial flow fan and sirocco fan generate large noise during operation, and their volume is large and it is difficult to reduce the thickness and size, and the service life of the axial flow fan and sirocco fan is short. The axial fan and the sirocco fan are not suitable for realizing heat dissipation in a lightweight, thin and portable electronic device.

  Further, many electronic devices are soldered on a printed circuit board (PCB) using a technique such as surface mount technology (SMT) or selective soldering (Selective Soldering). However, electronic devices soldered by the above-described soldering method can be easily peeled off when placed in a high thermal energy and high temperature environment for a long time, and most electronic devices are at high temperatures. Therefore, if the electronic device is placed in a high thermal energy and high temperature environment for a long time, the performance stability of the electronic device is lowered and the life is shortened.

  FIG. 1 is a schematic structural view of a conventional heat dissipation mechanism. As shown in FIG. 1, the conventional heat dissipation mechanism is a passive heat dissipation mechanism including a heat conductive plate 12, and the heat conductive plate 12 is bonded to a heat-radiated electronic element 11 with a heat conductive adhesive 13. Due to the heat conduction path formed by the heat conductive adhesive 13 and the heat conduction plate 12, the electronic element 11 achieves heat dissipation by heat conduction and natural convection. However, the heat dissipation efficiency of the heat dissipation mechanism is inferior, and the application needs cannot be met.

  In view of this, it is essential to develop an air-cooling heat dissipation device that solves the problems encountered by the prior art.

  The purpose of the present application can be applied to various electronic devices, performing side wind convection heat dissipation to electronic elements inside the electronic device, improving the heat dissipation effect, reducing noise, Providing an air-cooling heat dissipation device and system that stabilizes the performance of electronic elements, extends the service life, and eliminates the need to place a heat sink on the electronic elements, making it possible to achieve a lighter and thinner electronic device. It is where

  Another object of the present application is that the air-cooling heat dissipation device and system of the present application have a temperature control function, and control the operation of the air pump in accordance with the temperature change of the electronic elements inside the electronic equipment, thereby improving the heat dissipation effect. This improves the service life of the air-cooled heat dissipation device.

  In order to achieve the above object, in one broad embodiment of the present application, an air-cooling heat dissipation device provided adjacent to an electronic element so as to be used for heat dissipation of the electronic element is provided. Has a first surface, a second surface, a flow guide chamber, an air intake side opening, and a communication groove, and the first surface and the second surface are provided corresponding to each other. The air intake side opening is disposed on the first surface, the flow introduction chamber is recessed in the first surface and communicates with the air intake side opening, and the communication groove is formed on the flow guide side. A flow guide carrier communicating with the chamber and corresponding to the electronic element; and an air pump disposed on the first surface of the flow guide carrier and closing the air intake side opening, The air pump has a resonance plate having a hollow hole, A piezoelectric actuator disposed corresponding to the resonance plate; an air pump; a side wall; a lower plate; and an opening. The side wall surrounds the periphery of the lower plate and A housing space is formed by the lower plate, and the resonance plate and the piezoelectric actuator are disposed in the housing space, and the opening is formed on the side wall. A cover plate, a first chamber being formed between the lower plate of the cover plate and the resonance plate, wherein the resonance plate and the cover plate The side wall jointly defines a confluence chamber, and by driving the air pump, the air flow is taken into the diversion chamber through the air intake side opening, so that the air flow passes through the communication groove. Discharged, Along with providing a side stream in the serial electronic device exchanges heat with the electronic device.

  In order to achieve the above object, another broad embodiment of the present application provides an air cooling heat dissipation system used for heat dissipation of an electronic element, and the air cooling heat dissipation system is adjacent to each of the electronic elements. A plurality of air cooling heat dissipating devices provided, and each of the air cooling heat dissipating devices includes a first surface, a second surface, a diversion chamber, an air intake side opening, and a communication groove. The first surface and the second surface are provided corresponding to each other, the air intake side opening is disposed on the first surface, and the flow introduction chamber is provided on the air intake side. Communicating with the opening, the communication groove communicating with the flow guide chamber and corresponding to the electronic element, and being disposed on the first surface of the flow guide carrier, Close the air intake side opening The air pump has a resonance plate having a hollow hole and a piezoelectric actuator disposed corresponding to the resonance plate, and has an air pump, a side wall, a lower plate, and an opening. The side wall surrounds the periphery of the lower plate so as to abut against the lower plate and forms a receiving space with the lower plate, and the resonance plate and the piezoelectric actuator are A cover plate disposed in the housing space, the opening being disposed on the side wall, wherein the cover plate is provided between the lower plate and the resonance plate. A first chamber is formed, and the resonance plate and the side wall of the cover plate jointly define a merge chamber, and by driving the air pump of each of the air-cooling heat dissipation devices, The air intake By taking into each of the corresponding diversion chambers through each of the openings, an air flow is discharged through each of the communication grooves to provide a plurality of side airflows to the electronic element, and heat is generated by the electronic element. Exchange.

It is the structure schematic of the conventional heat radiating mechanism. 1 is a schematic cross-sectional view of an air-cooling heat dissipation device according to a preferred embodiment of the present application. It is the structure schematic seen from the different angle of the flow guide carrier shown in FIG. It is the structure schematic seen from the different angle of the flow guide carrier shown in FIG. It is sectional structure schematic of the air-cooling heat radiation system of the other preferable Example of this application. It is the decomposition | disassembly structure schematic seen from the different angle of the air pump of the preferable Example of this application. It is the decomposition | disassembly structure schematic seen from the different angle of the air pump of the preferable Example of this application. 1 is a schematic front view of a piezoelectric actuator according to a preferred embodiment of the present application. It is the back surface structure schematic of the piezoelectric actuator of the preferable Example of this application. 1 is a schematic sectional view of a piezoelectric actuator according to a preferred embodiment of the present application. It is the schematic of the operation | movement process of the air pump of the preferable Example of this application. It is the schematic of the operation | movement process of the air pump of the preferable Example of this application. It is the schematic of the operation | movement process of the air pump of the preferable Example of this application. It is the schematic of the operation | movement process of the air pump of the preferable Example of this application. It is the structure schematic of the control system of the air-cooling heat radiating device of the preferable Example of this application.

  Some exemplary embodiments that implement the features and advantages of the present application are described in detail in the following specification. And this application can be variously changed on different aspects, all of which do not depart from the scope of this application, and that the description and drawings therein are essentially for explanation and do not constitute this application. You should understand that.

  FIG. 2 is a schematic cross-sectional view of the air-cooling heat dissipating device of the preferred embodiment of the present application, and FIGS. 3A and 3B are schematic views of the structure of the diversion carrier shown in FIG. As shown in FIGS. 2, 3A, and 3B, the air-cooling heat dissipation device 2 of the present application includes, for example, a portable PC, a tablet computer, an industrial computer, a portable communication device, a media player, and a heat-radiated electronic device in an electronic device. Although it can apply to the heat dissipation to electronic devices, such as element 3, it is not limited to this. The air-cooling heat dissipation device 2 of the present application includes a diversion carrier 20 and an air pump 21. The diversion carrier 20 includes a first surface 20a, a second surface 20b, a diversion chamber 200, an air intake side opening 201, and a communication groove 202, and the first surface 20a of the diversion carrier 20 and The second surface 20b is provided corresponding to each other, and the air intake side opening 201 is disposed on the first surface 20a, and the diversion chamber 200 is also recessed on the first surface 20a and the air intake side. The communication groove 202 communicates with the flow guide chamber 200 and corresponds to the electronic element 3. The air pump 21 is assembled and positioned on the first surface 20 a of the flow guide carrier 20 and closes the air intake side opening 201. Among these, by driving the air pump 21, the air flow is taken into the flow guide chamber 200 of the flow guide carrier 20 through the air intake side opening 201, and the air rapidly flows out through the communication groove 202, and the electronic element 3. The heat radiation of the electronic element 3 is realized by providing a side airflow to perform heat exchange.

  In this embodiment, the electronic element 3 is disposed on the carrier substrate 4, and the carrier substrate 4 can be a printed circuit board, but is not limited thereto. A part of the carrier substrate 4 is coupled to the current carrier 20 and closes the communication groove 202, that is, the current carrier 20 is coupled to the carrier substrate 4 and adjacent to the electronic element 3. In this embodiment, the electronic element 3 corresponds to the plurality of communication portion exhaust ports 204 b of the communication groove 202 of the flow guide carrier 20.

  Please refer to FIG. 2 and FIG. 3A. As shown in the figure, the airflow guide 20 of the present embodiment is further provided with an air intake groove 205, and the air intake groove 205 is also recessed on the first surface 20a of the airflow carrier 20, and By communicating with one side of the flow chamber 200, air is circulated and sent into the air pump 21, thereby avoiding that the gap between the flow guide chamber 200 and the air pump 21 is too small and the intake effect is inferior. To do. In addition, the intake groove 205 may be for accommodating a conductive means (not shown), and the conductive means is an electric wire, but is not limited thereto, and is electrically connected to the air pump 21 to supply power. It is used to provide to the air pump 21 and the installation of the conductive means does not increase the overall structure of the air-cooling heat radiating device 2, and the air-cooling heat radiating device can be reduced in weight and thickness. Realize.

  Please refer to FIG. 2 and FIG. 3B simultaneously. As shown in the drawing, the communication groove 202 of the flow guide carrier 20 of the present embodiment further includes a merging portion 203 and a plurality of communicating portions 204, of which the merging portion 203 has a merging portion opening 203a. The merging portion opening 203 a communicates between the convection chamber 200 and the merging portion 203 so that the merging portion 203 and the convection chamber 200 communicate with each other. The plurality of communication portions 204 have a plurality of communication portion openings 204a and communication portion exhaust ports 204b, and the communication portion openings 204a communicate with the merging portion 203, whereby the plurality of communication portions 204 and the merging portion are connected. Communicate. In addition, in the present embodiment, the merging portion 203 further has a slope 203c, and the slope 203c is disposed corresponding to the plurality of communication portions 205b, and as can be seen from FIGS. 3A and 3B, By arranging the slope 203c of the merging portion 203, the area of the merging portion opening 203a of the merging portion 203 can be made larger than the area of the merging portion lower portion 203b. Therefore, after the air pump 21 takes air into the diversion chamber 200 through the air intake side opening 201, the airflow flows from the diversion chamber 200 into the merging portion 203 of the communication groove 202 via the merging portion opening 203a. The airflow is concentrated by the slope 203c, and at the same time, the airflow velocity is improved, and then the airflow flows into the plurality of communication portions 204 through the communication portion openings 204a and is discharged from the plurality of communication portion exhaust ports 204b. Thus, heat exchange is performed with the electronic element 3 adjacent to the current-carrying carrier 20.

  As shown in FIG. 2, in this embodiment, the air pump 21 is a piezoelectrically operated air pump for driving air flow. The air pump 21 is assembled and positioned on the first surface 20 a of the diversion carrier 20 and closes the air intake side opening 201. The second surface 20 b of the diversion carrier 20 is a portion provided by being bonded to the carrier substrate 4. In other words, the assembly of the diversion carrier 20 and the air pump 21 is bonded over the carrier substrate 4. In addition, the plurality of communication portions 204 of the communication groove 202 are disposed adjacent to the electronic element 3 and correspond to the electronic element 3. By closing the air intake side opening 201 and the diversion chamber 200 with the air pump 21 and the carrier substrate 4, the air intake side opening 201, the diversion chamber 200 and the communication groove 202 are defined to form a closed flow path. As a result, the electronic element 3 is dissipated to improve the heat dissipation effect. It should be emphasized that the present application is not limited to forming a closed flow path, and other flow path types can also be adjusted and varied according to actual application needs.

  In the present embodiment, the air pump 21 drives the air flow to take air from the outside of the air-cooling heat radiating device 2 into the diversion chamber 200 through the intake groove 205 and the air intake side opening 201 and to communicate the air flow. Used to quickly drain from the groove 202. When the air pump 21 takes air into the diversion chamber 200 and causes the air flow to rapidly flow out through the plurality of communication portions 204 of the communication groove 202, the provided side airflow passes through the electronic element 3 on the carrier substrate 4. At the same time, convection is formed with the surrounding air, heat exchange is performed with the electronic element 3, and the airflow after the heat exchange carries away heat energy from the electronic element 3. The air pump 21 operates continuously to send out air, so that the electronic element 3 exchanges heat with the continuously sent air, and at the same time, the air after the heat exchange continuously and rapidly convects. It moves away from the electronic element 3, thereby realizing heat dissipation of the electronic element 3, and further improving the heat dissipation effect, reducing the overall weight and thickness of the device, and thus improving the performance stability and life of the electronic element 3.

  FIG. 4 is a schematic cross-sectional view of an air-cooling heat dissipation system according to another preferred embodiment of the present application. As shown in FIG. 4, the air-cooling heat dissipation system 5 includes a plurality of sets of air-cooling heat dissipation devices 2 ′, 2 ″ for radiating heat from the electronic elements 3 simultaneously. And the structure of each air-cooling heat radiating device 2 ', 2' 'in the air-cooling heat radiating system 5 of the present embodiment is the same as that of the air-cooling heat radiating device 2 shown in FIG. 2, and has the same structure, elements and functions. This is not described separately here. In this embodiment, the air-cooling heat dissipation system 5 includes two sets of air-cooling heat dissipation devices 2 ′ and 2 ″, both of which are arranged on the carrier substrate 4. In addition, the electronic elements 3 are disposed adjacent to each other, and the air-cooling heat dissipating devices 2 ′, 2 ″ and the conduction carriers 20 ′, 20 ″ of the communication grooves 202 ′, 202 ″ are both electronic elements. 3 is supported. In some embodiments, the two sets of air cooling heat dissipation devices 2 ′, 2 ″ are provided adjacent to two opposing side edges of the electronic element 3, and the two sets of air cooling heat dissipation devices 2 ′, 2 ′. The respective communication grooves 202 ′, 202 ″ of each of the flow-conducting carriers 20 ′, 20 ″ in the “corresponding to the two opposite side edges of the electronic element 3, respectively. When the air pumps 21 'and 21' 'of the two air cooling heat dissipating devices 2' and 2 "drive the air flow, the two air cooling heat dissipating devices 2 'and 2" simultaneously receive air from the outside. The air is taken into the corresponding diversion chambers 200 ′ and 200 ″ through the air intake side openings 201 ′ and 201 ″, and an airflow is generated to join the communication grooves 202 ′ and 202 ″. It flows into the corresponding plurality of communication portions 204 ′, 204 ″ via the portions 203 ′, 203 ″, and is rapidly discharged from the respective communication portion exhaust ports 204b ′, 204b ″, and the electronic element 3 By providing side airflow to different sides of the carrier substrate 4 and accelerating the convection of air around the electronic element 3 of the carrier substrate 4 to promote heat exchange with the electronic element 3, the heat dissipation effect is further increased in the electronic element 3. Improve and eventually electronic Improving the performance stability and lifetime of the child 3. It should be emphasized that the number and arrangement of the air-cooling heat dissipation devices of the air-cooling heat dissipation system 5 are not limited to the above embodiment, and the number and arrangement can be arbitrarily changed according to actual application needs.

  Please refer to FIG. 5A and FIG. 5B. 5A and 5B are schematic exploded views of the air pump according to a preferred embodiment of the present invention viewed from different angles. In this embodiment, the air pump 21 is a piezoelectrically operated air pump for driving the air flow. As illustrated, the air pump 21 of the present application includes elements such as a resonance plate 212, a piezoelectric actuator 213, a cover plate 216, and the like. The resonance plate 212 is disposed corresponding to the piezoelectric actuator 213 and has a hollow hole 2120 that is disposed in the central region of the resonance plate 212 but is not limited thereto. The piezoelectric actuator 213 has a floating plate 2131, an outer frame 2132, and a piezoelectric ceramic plate 2133. Among these, the floating plate 2131 has a center portion 2131 c and an outer peripheral portion 2131 d, and the piezoelectric ceramic plate 2133. Is driven by voltage, the floating plate 2131 can bend and vibrate from the central portion 2131c to the outer peripheral portion 2131d, the outer frame 2132 is disposed on the outside so as to surround the floating plate 2131, and at least one bracket 2132a. However, the bracket 2132a is disposed between the floating plate 2131 and the outer frame 2132, and both ends of each bracket 2132a are connected to the floating plate 2131 and the outer frame 2132, respectively. To provide elastic support and to the conductive pin 213 b is provided so as to contact the outer frame 2132 outwardly for electrical connection, and the piezoelectric ceramic plate 2133 is deformed by receiving an external voltage to drive the bending vibration of the floating plate 2131. The second surface 2131b of the floating plate 2131 is attached. The cover plate 216 has a side wall 2161, a lower plate 2162, and an opening 2163. The side wall 2161 surrounds the periphery of the lower plate 2162 and is provided to abut on the lower plate 2162, and the resonance plate 212. In order to dispose the piezoelectric actuator 213 therein, the housing space 216a is formed jointly with the lower plate 2162, and the opening 2163 has the opening 2163b facing the conductive pin 2132b of the outer frame 2132 outward. Although it is disposed on the side wall 2161 so as to be penetrated and abutted outside the cover plate 216 and connected to an external power source, it is not limited thereto.

  In this embodiment, the air pump 21 of the present application further includes two insulating sheets 2141 and 2142 and a conductive sheet 215. However, the present invention is not limited to this, and the two insulating sheets 2141 and 2142 are the conductive sheets 215. The outer shape generally corresponds to the outer frame 2132 of the piezoelectric actuator 213, and is made of an insulating material such as plastic and used for insulation, but is not limited thereto. The conductive sheet 215 is made of a conductive material, for example, metal, and is used for electrical conduction, and the outer shape of the conductive sheet 215 generally corresponds to the outer frame 2132 of the piezoelectric actuator 213, but is not limited thereto. . Further, in this embodiment, conductive pins 2151 used for electrical conduction can also be disposed on the conductive sheet 215, and the conductive pins 2151 also cover outwardly like the conductive pins 2132 b of the outer frame 2132. It penetrates the opening 2163 of the plate 216 and is abutted outside the cover plate 216 and connected to an external power source.

  See FIGS. 6A, 6B, and 6C. 6A is a schematic diagram of the front structure of the piezoelectric actuator of the preferred embodiment of the present application, FIG. 6B is a schematic diagram of the back surface structure of the piezoelectric actuator of the preferred embodiment of the present application, and FIG. 6C is a schematic diagram of the piezoelectric actuator of the preferred embodiment of the present application. It is sectional structure schematic. As shown in the drawing, in this embodiment, the floating plate 2131 of the present application has a stepped surface structure, that is, further includes a butting portion 2131e on the center portion 2131c of the first surface 2131a of the floating plate 2131. In addition, the abutting portion 2131e has a circular protruding structure, but the invention is not limited to this, and in some embodiments, the floating plate 2131 can be a plate-like square with both sides flat. As shown in FIG. 6C, the abutting portion 2131e of the floating plate 2131 is flush with the first surface 2131c of the outer frame 2132, and the first surface 2131a of the floating plate 2131 and the first surface 2132a of the bracket 2132a. 'Is also flush, and between the abutting portion 2131e of the floating plate 2131 and the first surface 2132c of the outer frame 2132 and the first surface 2131a of the floating plate 2131 and the first surface 2132a of the bracket 2132a'. Has a certain depth. As shown in FIGS. 6B and 6C, the second surface 2131b of the floating plate 2131 has a flat flush structure with the second surface 2132d of the outer frame 2132 and the second surface 2132a '' of the bracket 2132a. The piezoelectric ceramic plate 2133 is attached to the second surface 2131b of the flat floating plate 2131. In another embodiment, the floating plate 2131 may have a flat plate-like square structure with both sides being flat, but is not limited to this, and can be arbitrarily changed according to actual implementation conditions. In some embodiments, the floating plate 2131, the outer frame 2132, and the bracket 2132a may be integrally formed, and may be formed of a metal plate such as stainless steel, but is not limited thereto. Further, in the present embodiment, the air pump 21 of the present application further includes at least one gap 2134 for ventilating between the floating plate 2131, the outer frame 2132, and the bracket 2132a.

  Below, the operation | movement process of the air pump 21 of this application is further demonstrated. Please refer to FIGS. 7A to 7D at the same time. 7A-7D are schematic diagrams of the operation process of the air pump of the preferred embodiment of the present application. First, as shown in FIG. 7A, the air pump 21 has a structure in which the cover plate 216, the other insulating sheet 2142, the conductive sheet 215, the insulating sheet 2141, the piezoelectric actuator 213, and the resonance plate 212 are sequentially stacked as described above. The adhesive body 218 is formed by applying an adhesive around the piezoelectric actuator 213, the insulating sheet 2141, the conductive sheet 215, and the other insulating sheet 2142 after being assembled and laminated. The periphery of the accommodation space 216a of the plate 216 is filled to complete the sealing. A gap g0 is provided between the resonance plate 212 and the piezoelectric actuator 213, and the side walls of the resonance plate 212 and the cover plate 216 jointly define the merging chamber 217a. A first chamber 217 b is provided between the actuator 213. When the air pump 21 is not driven by voltage, the position of each element is as shown in FIG. 7A.

  Subsequently, as shown in FIG. 7B, when the piezoelectric actuator 213 of the air pump 21 is actuated by voltage and vibrates upward, the air is fed into the air pump 21 from the opening 2163 of the cover plate 216 and into the merging chamber 217a. At the same time, the resonance plate 212 flows into the first chamber 217b upward through the hollow hole 2120 on the resonance plate 212, and at the same time, the resonance plate 212 is affected by the resonance of the floating plate 2131 of the piezoelectric actuator 213. Along with this, the reciprocating vibration, that is, the resonance plate 212 is deformed upward along with this, that is, the resonance plate 212 is slightly pushed upward at the hollow hole 2120 locations.

  Thereafter, as shown in FIG. 7C, at this time, the piezoelectric actuator 213 vibrates downward and returns to the initial position. At this time, the abutting portion 2131e on the floating plate 2131 of the piezoelectric actuator 213 is moved into the hollow hole of the resonance plate 212. In the vicinity of the portion slightly pushed upward at 2120, the air in the air pump 21 is temporarily stored toward the first chamber 217b in the upper half layer.

  Further, as shown in FIG. 7D, the piezoelectric actuator 213 again vibrates downward, and the resonance plate 212 is subjected to a resonance action in which the piezoelectric actuator 213 vibrates, so that the resonance plate 212 also vibrates downward accordingly. As a result, the volume of the first chamber 217b is compressed by the downward deformation of the resonance plate 212. As a result, the air in the first chamber 217b of the upper half layer is pushed out to flow on both sides, and through the gap 2134 of the piezoelectric actuator 213. Compressed air that flows downward and flows into the hollow holes 2120 of the resonance plate 212 and is compressed and discharged toward the first diversion chamber 202 of the carrier 20 through the air intake side opening 201. Form. As can be seen from this embodiment, when the resonance plate 212 reciprocally vibrates vertically, the maximum distance of the vertical movement can be increased by the gap g0 between the resonance plate 212 and the piezoelectric actuator 213. In other words, the gap g0 provided between the resonance plate 212 and the piezoelectric actuator 213 can cause a larger vertical movement when the resonance plate 212 resonates.

  Finally, the resonance plate 212 returns to the initial position, that is, as shown in FIG. 7A, the air is continuously repeated in the order of FIGS. The airflow flows into the air intake side opening 201 so that it flows into the merge chamber 217a from the opening 2163, and further flows into the first chamber 217b and then flows into the merge chamber 217a from the first chamber 217b. Can be transported to. In other words, when the air pump 21 of the present application is operated, the air flows sequentially through the opening 2163 of the cover plate 216, the merge chamber 217a, the first chamber 217b, the merge chamber 217a, and the air intake side opening 201. The air pump 21 has the effect of reducing the number of parts of the air pump 21 and simplifying the overall manufacturing process by using a single component, that is, the cover plate 216 and the structural design of the opening 2163 of the cover plate 216. Can be achieved.

  As described above, through the operation of the air pump 21, air is taken into the diversion chamber 200 through the air intake side opening 201 of the diversion carrier 20, and the airflow is communicated through the merging portion 203 of the communication groove 202. The air is rapidly taken into the unit 204, and further, the airflow is rapidly sent from the plurality of communication part exhaust ports 204b to the three electronic elements, so that the air that has been taken in exchanges heat with the electronic element 3, thereby The efficiency is improved, and consequently the performance stability and life of the electronic element 3 are improved.

  Please refer to FIG. FIG. 8 is a schematic configuration diagram of the control system of the air-cooling heat dissipation device of the present application. As shown in the figure, the air-cooling heat dissipating device 2 of the preferred embodiment of the present application has a temperature control function and further includes a control system 6, of which the control system 6 includes a control unit 61 and a temperature sensor 62. In addition, the control unit 61 is electrically connected to the air pump 21 in order to control the operation of the air pump 21. The temperature sensor 62 is provided adjacent to the periphery of the electronic element 3 so as to detect the temperature of the electronic element 3. In the present embodiment, the temperature sensor 62 is electrically connected to the control unit 61 and detects the temperature in the vicinity of the electronic element 3 or is directly attached on the electronic element 3 to detect the temperature of the electronic element 3. The detection signal is transmitted to the control unit 61. Based on the detection signal of the temperature sensor 62, the control unit 61 determines whether or not the temperature of the electronic element 3 exceeds the temperature threshold value, and the control unit 61 determines that the temperature of the electronic element 3 is equal to the temperature threshold value. When it is determined that the air pump 21 is exceeded, a control signal is sent to the air pump 21 to start the operation of the air pump 21, whereby the air pump 21 drives the air flow and performs heat radiation cooling on the electronic element 3. Then, the electronic element 3 is radiated and cooled to lower the temperature. When the control unit 61 determines that the temperature of the electronic element 3 is lower than the temperature threshold value, it sends a control signal to the air pump 21 to stop the operation of the air pump 21, thereby the air pump 21. Can be continuously operated to shorten the lifetime, and loss of excess energy can be reduced. Therefore, by installing the control system 6, the air pump 21 of the air-cooling heat dissipating device 2 performs heat-radiating cooling when the temperature of the electronic element 3 rises excessively and stops operation after the temperature of the electronic element 3 drops. By doing so, it is possible to avoid the continuous operation of the air pump 21 and shorten the life, to reduce the loss of excess energy, and to operate the electronic element 3 in a suitable temperature environment. The stability of the electronic element 3 can be improved.

  To summarize the above, in this application, it can be applied to various electronic devices, perform side wind convection heat dissipation to the electronic elements inside the electronic device, improve the heat dissipation effect, reduce noise, An air-cooling heat dissipation device that stabilizes the performance of the electronic elements inside the equipment, extends the service life, and eliminates the need for a heat sink on the electronic elements, and can achieve a light weight and a thin thickness in the entire thickness of the electronic equipment, and Provide a system. In addition, the air-cooling heat dissipation device and system of the present application has a temperature control function, and controls the operation of the air pump according to the temperature change of the electronic elements inside the electronic equipment to improve the heat dissipation effect. The service life of the heat dissipation device can be extended.

DESCRIPTION OF SYMBOLS 11 Electronic element 12 Thermal conductive board 13 Thermal conductive adhesive 2, 2 ', 2''Air-cooling heat dissipation device 20, 20', 20 '' Conductive carrier 20a First surface 20b Second surface 200, 200 ', 200''Conducting chambers 201, 201', 201 '' Conveying end openings 202, 202 ', 202''communicating grooves 203, 203', 203 '' confluent part 203a confluent part opening 203b confluent part lower part 203c slopes 204, 204 ' 204 ″ communicating portion 204a communicating portion openings 204b, 204b ′, 204b ″ communicating portion exhaust port 205 intake groove 21 air pump 212 resonance plate 2120 hollow hole 213 piezoelectric actuator 2131 floating plate 2131a first surface 2131b second surface 2131c center Portion 2131d outer peripheral portion 2131e abutting portion 2132 outer frame 2132a bracket 2132a ′ first surface 2132a ″ second surface 21 2b Conductive pin 2132c First surface 2132d Second surface 2133 Piezoelectric ceramic plate 2134 Gap 2141, 2142 Insulation sheet 215 Conductive sheet 2151 Conductive pin 216 Cover plate 216a Housing space 2161 Side wall 2162 Lower plate 2163 Opening 217b First chamber 217a Merge chamber 218 Adhesive body 3 Electronic element 4 Carrier substrate 5 Air cooling heat radiation system 6 Control system 61 Control unit 62 Temperature sensor g0 Gap

Claims (10)

An air-cooled heat dissipation device provided adjacent to an electronic element so as to be used for heat dissipation of the electronic element,
A first surface, a second surface, a diversion chamber, an air intake side opening, and a communication groove, wherein the first surface and the second surface are provided corresponding to each other, The air intake side opening is disposed on the first surface, the flow introduction chamber is recessed in the first surface and communicates with the air intake side opening, and the communication groove is formed in the flow introduction chamber. A flow carrier that communicates and corresponds to the electronic element;
An air pump disposed on the first surface of the flow guide carrier and closing the air intake side opening,
A resonant plate having a hollow hole;
An air pump having a piezoelectric actuator disposed corresponding to the resonance plate;
The side plate has a side plate, a lower plate, and an opening. The side wall surrounds the periphery of the lower plate and is provided to abut on the lower plate, and forms a receiving space with the lower plate. And the resonance plate and the piezoelectric actuator are disposed in the housing space, and the opening is disposed on the side wall, and a cover plate is provided. A first chamber is formed between the lower plate and the resonance plate, and the resonance plate and the side wall of the cover plate jointly define a merge chamber,
By driving the air pump, airflow is taken into the diversion chamber through the air intake side opening, and the airflow is discharged through the communication groove to provide a side airflow to the electronic element, and An air-cooling heat radiating device characterized by exchanging heat with an electronic element.   A carrier substrate partially coupled to the second surface of the flow-conducting carrier and closing the communication groove, wherein the electronic device is disposed on the carrier substrate; The air-cooling heat dissipation device according to claim 1.   The carrier is recessed in the first surface and communicates with one side of the flow guide chamber, and further includes an intake groove for circulating air and feeding the air pump. The air-cooling heat radiating device according to claim 1.   The communication groove has a merging portion communicating with the convection chamber and a plurality of communicating portions communicating with the merging portion, and the merging portion corresponds to the plurality of communicating portions. The air-cooling heat radiating device according to claim 1, further comprising an inclined surface disposed in a row.   The air-cooling heat dissipation according to claim 4, wherein the merging portion has a merging portion opening that communicates between the convection chamber and the merging portion and has an area larger than an area of the lower portion of the merging portion. apparatus.   In the air pump, the cover plate, the piezoelectric actuator, and the resonance plate are correspondingly stacked, and when the piezoelectric actuator is driven to perform an intake operation, air is first drawn from the hollow hole of the resonance plate. When flowing into the first chamber and temporarily stored and the piezoelectric actuator is driven to perform an exhaust operation, air first flows from the first chamber through the hollow hole of the resonance plate and into the air intake side opening. The air-cooling heat radiating device according to claim 1. The piezoelectric actuator is
A floating plate having a first surface and a second surface;
An outer frame having at least one bracket, the at least one bracket coupled to the floating plate and the outer frame, and disposed between the floating plate and the outer frame;
The air-cooling heat dissipation according to claim 1, further comprising: a piezoelectric ceramic plate affixed to the first surface of the floating plate for applying a voltage to drive the bending vibration of the floating plate. apparatus.   The air pump further includes at least one insulating sheet and a conductive sheet, and the at least one insulating sheet and the conductive sheet are sequentially disposed below the piezoelectric actuator, and the piezoelectric The outer frame of the actuator has a conductive sheet having conductive pins, and the opening of the cover plate of the air pump has the conductive pins of the outer frame and the conductive pins of the conductive sheet facing outward. The air-cooling heat dissipation device according to claim 7, wherein the air-cooling heat dissipation device is disposed on a side wall so as to connect to an external power source by penetrating the opening and projecting out of the cover plate. A control unit electrically connected to the air pump for controlling the operation of the air pump;
A temperature sensor electrically connected to the control unit and provided adjacent to the electronic element to detect the temperature of the electronic element and output a detection signal to the control unit; With
When the control unit receives the detection signal and determines that the temperature of the electronic element is greater than a temperature threshold, the control unit activates the air pump to drive airflow and the control The control unit stops operating the air pump when the unit receives the detection signal and determines that the temperature of the electronic element is below the temperature threshold. The air-cooling heat dissipation device according to 1. An air cooling heat dissipation system used for heat dissipation of electronic elements,
A plurality of air cooling heat dissipating devices provided adjacent to each of the electronic elements, and each of the air cooling heat dissipating devices includes:
A first surface, a second surface, a diversion chamber, an air intake side opening, and a communication groove, wherein the first surface and the second surface are provided corresponding to each other, An air intake side opening is disposed on the first surface, the flow introduction chamber communicates with the air intake side opening, and the communication groove communicates with the flow introduction chamber and corresponds to the electronic element. With a diversion carrier,
An air pump disposed on the first surface of the flow guide carrier and closing the air intake side opening, the air pump being arranged corresponding to the resonance plate having a hollow hole and the resonance plate. An air pump having a piezoelectric actuator provided;
The side plate has a side plate, a lower plate, and an opening. The side wall surrounds the periphery of the lower plate and is provided to abut on the lower plate, and forms a receiving space with the lower plate. And the resonance plate and the piezoelectric actuator are disposed in the housing space, and the opening is disposed on the side wall, and a cover plate is provided. A first chamber is formed between the lower plate and the resonance plate, and the resonance plate and the side wall of the cover plate jointly define a merge chamber,
By driving the air pump of each of the air-cooling heat dissipating devices, the air flow is taken into each of the corresponding diversion chambers through each of the air intake side openings, so that the air flow is discharged through each of the communication grooves. An air-cooling heat dissipation system, wherein a plurality of side airflows are provided to the electronic element and heat exchange is performed with the electronic element.