JP2018134601A - Surface treatment apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To be able to perform reforming treatment on almost entire surfaces of treatment target surfaces 12, 14, 15, 16, 17, 18, and 19 without relatively moving an ejection port 10 and those treatment target surfaces in a remote-type surface reforming apparatus.SOLUTION: Plasma generated in a case C is ejected from the ejection port 10. Then, an ejection force of a plasma flow F ejected from the ejection port 10 along with a suction force of suction means V draw in the plasma flow F along the treatment target surfaces 12, 14, 15, 16, 17, 18, and 19.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a so-called plasma torch type surface treatment apparatus that ejects plasma generated in a case as a plasma flow together with a compressed gas from the case toward a workpiece.

As this type, a surface treatment apparatus described in Patent Document 1 has been conventionally known.
In this conventional surface treatment apparatus, a supply source for supplying a treatment gas which is a compressed gas is connected to a case provided with a pair of electrodes. And the plasma produced | generated between the said electrodes is ejected with process gas from the jet nozzle provided in the case, and is sprayed on the process target surface of a workpiece | work.
Furthermore, an exhaust passage is provided at a position substantially adjacent to the jet port so that nitrogen oxides and ozone generated in the process of generating plasma can be exhausted.

JP 2004-115896 A

  In the conventional surface treatment apparatus as described above, an exhaust passage for exhausting nitrogen oxide and ozone generated in the process of generating plasma is provided at a position adjacent to the jet outlet for jetting the plasma flow. I can hardly expect the spread of plasma flow. For this reason, when the processing area is large and the end of the processing area protrudes from the exhaust flow path, there is a problem that the surface treatment cannot be performed up to the end of the processing area.

  In addition, since the processing area is limited to the periphery of the plasma flow jet port, when the area of the processing target surface is large, all of the processing target surfaces must be moved unless either the jet port side or the processing target surface side is moved. There is also a problem that the reforming treatment cannot be performed.

  On the other hand, as shown in FIG. 8, an apparatus for reforming only the inner surface 1 of a pipe W, which is a workpiece, has been conventionally known. In this conventional apparatus, a nozzle 2 is provided on the opening side of the pipe W to eject plasma together with a processing gas which is a compressed gas, and the plasma flow ejected from the nozzle 2 is guided to the inner surface 1 of the pipe W. The inner surface 1 is reformed by the plasma thus introduced into the pipe W.

However, in this conventional apparatus, there is a case where all of the inner surface 1 of the pipe W cannot be reformed. The reason is as follows.
That is, since a part of the plasma flow ejected from the nozzle 2 is rebounded around the opening of the pipe W as indicated by an arrow A, the amount of plasma guided to the inner surface 1 is reduced accordingly.

If the amount of plasma guided to the inner surface 1 of the pipe W decreases, the plasma activity decreases as it goes downstream of the plasma flow.
For this reason, when the pipe W is long, an area in which the reforming process cannot be performed with the virtual line X shown in FIG.

  In addition, if the length of the pipe W is long, it takes time for the plasma flow to reach the end of the pipe W. However, since the plasma activity decays with time, if the plasma flow takes too much time in the process from the tip to the end of the pipe W, the plasma activity on the downstream side of the plasma flow becomes low, Thus, an area where the reforming process cannot be performed with the virtual line X as a boundary is formed.

  Therefore, when the length of the pipe is long, two steps are required for the reforming process of the inner surface 1. That is, first, the plasma flow is guided to the inner surface 1 by positioning one opening of the pipe W on the nozzle 2 side. Next, the pipe W is turned over and the other opening is positioned on the nozzle 2 side to induce the plasma flow to the inner surface 1. Therefore, in the case of the reforming treatment of the inner surface 1 of the long pipe W, there is a problem that two steps are required.

  On the other hand, when a part of the plasma flow ejected from the nozzle 2 as described above is rebounded around the opening of the pipe W as indicated by the arrow A, it means that the surface around the opening is also surface-treated. To do. If only the inner surface of the pipe W is desired to be surface treated, various inconveniences will occur if the surface treatment is performed on portions other than the inner surface.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a surface treatment apparatus that can efficiently modify the entire surface of a processing target surface without relatively moving the plasma flow jet port and the processing target surface of the workpiece.

  The first aspect of the invention includes a suction force for sucking a plasma flow ejected from a jet port provided in the case along the processing target surface of the workpiece and guiding the plasma flow to the end of the processing target surface. Provided suction means.

  Therefore, for example, when the workpiece is a pipe and its inner surface is a processing target surface, one opening of the pipe is directed to the ejection port side, and the other opening is directed to the suction means side. If the suction means is operated, the suction force is large, so that the outside air around one opening of the pipe is also drawn into the pipe. Since the flow that draws outside air in this way becomes an accompanying flow with respect to the plasma flow ejected from the ejection port, most of the plasma flow is guided into the pipe without hitting the periphery of the opening of the pipe.

  Further, since the suction means is provided with a suction force for guiding the plasma flow ejected from the ejection port to the end of the surface to be processed, for example, even with a long pipe, the entire length is maintained while maintaining the plasma activity. The reforming process can be performed over a wide range.

Further, when the workpiece is a plate and the processing target surface is one surface of the plate, for example, a jet port is provided on the side substantially orthogonal to the processing target surface of the plate, and suction means is provided on the end side of the processing target surface. Provide.
As a result, the plasma flow ejected from the jet outlet collides with the surface to be processed, and is redirected from the collision position by the suction force of the suction means to be guided to the end side of the processing target surface. Is sucked into the suction means.

  If the area of the workpiece surface to be processed is large, the suction means may surround the edge of the workpiece surface. In this way, the plasma flow ejected from the ejection port diffuses in the range of 360 degrees after colliding with the processing target surface and reaches the end of the processing target surface.

  In the second aspect of the invention, since the movable area of the work holding means such as a robot is secured to make the work face the jet port, the work is automatically set using the robot or the like. Can do.

In the third invention, a guide for guiding the plasma flow ejected from the ejection port in a direction along the surface to be processed of the workpiece is provided. Therefore, the guide and the suction force of the suction means combine to guide the plasma flow to the end of the surface to be processed, and the surface to be processed can be reliably surface treated.
In addition, since the suction port of the suction means corresponds to the end of the processing target surface, only the processing target surface can be surface-treated, and the surface treatment is not performed up to unnecessary portions.

  In the fourth invention, the processing target surface is the inner surface of the cylinder or the opposing surfaces of the pair of plates, and the inner surface of the cylinder or the opposing surface of the plate functions as the guide along the processing target surface. The plasma flow ejected from the ejection port can be guided to the suction means without providing a special guide.

In a fifth aspect of the present invention, the workpiece is provided with a small diameter portion and a large diameter portion, the inner surface of the small diameter portion is the surface to be treated, and the large diameter portion is communicated with the suction means.
For example, a cylinder of a syringe is conceivable as the workpiece having the small diameter portion and the large diameter portion. As for the cylinder of a syringe, the part which connects a needle | hook becomes a small diameter part, and the part which accommodates a liquid becomes a large diameter part.
And, since the diameter of the small diameter part of the syringe is quite small, even if the plasma flow is blown from the outside of the small diameter part, the plasma does not enter the small diameter part, but like this invention, if sucked from the large diameter part side, A plasma flow also flows into the inner surface of the small diameter portion.

According to a sixth aspect of the present invention, a conveying jig is provided, and the conveying jig covers the large-diameter portion, while the conveying jig has a flow hole, and one end of the flowing hole is connected to the small-diameter portion. The other end communicates with the suction means.
Therefore, the inner surface of the small diameter portion can be surface-treated while the workpiece is continuously conveyed.

  According to the present invention, the entire surface of the workpiece surface to be processed can be efficiently reformed without the relative movement of the jet outlet for jetting the plasma flow and the workpiece.

It is the schematic of 1st Embodiment. It is the schematic of 2nd Embodiment. It is the schematic of 3rd Embodiment. It is the schematic of 4th Embodiment. It is the schematic of 5th Embodiment. It is the schematic of 6th Embodiment. It is the schematic of 7th Embodiment. It is the schematic of the conventional apparatus.

In the first embodiment shown in FIG. 1, a pair of electrodes (not shown) are provided in the case C, and plasma is generated between these electrodes. The case C is connected to a compressed gas supply source P that supplies a processing gas, which is a compressed gas, to the case C.
Further, the case C is provided with an ejection port 10 through which plasma is ejected together with the processing gas supplied to the case C.

  The spout 10 may be formed by directly opening a hole in the case C, or may be provided with a nozzle that is a separate component from the case C. In short, as long as it has a function of ejecting the plasma and processing gas in the case C, the configuration is not limited.

  The jet port 10 configured as described above is provided with a guide 11 that prevents the plasma flow ejected from the jet port 10 from being scattered and guides the plasma flow in a target direction. A guide piece 11a for guiding the plasma flow to the processing target surface 12 of the workpiece W, which will be described later, is provided around the guide 11.

  On the other hand, suction means V is provided at a position facing the jet port 10 at an interval, but this suction means V is mainly composed of an air pump or an electric fan not shown. Further, the suction means V is provided with a suction port 13 so that the plasma flow, nitrogen oxide, ozone and the like ejected from the ejection port 10 can be focused and sucked.

  A space for setting a workpiece W made of a pipe is provided between the guide 11 and the suction port 13 as described above. A movable region E having a size that allows the workpiece W to cross the space. It is said. Therefore, the workpiece W can be set by holding the workpiece on a workpiece holding means such as a robot (not shown).

Next, the case where the process target surface 12 which is the inner surface of the workpiece W made of a pipe is reformed will be described.
In addition, when the workpiece | work W consists of a pipe as mentioned above, the movable area | region E equivalent to the full length of a pipe is ensured at least.

Then, a work holding means such as a robot (not shown) is introduced into the movable region E, and one opening 12a of the work W is directed toward the jet port 10 and the other opening 12b is directed toward the suction means V. , Stop the robot.
While maintaining the workpiece W in the above state, plasma is ejected from the ejection port 10 together with the processing gas, and at the same time, the suction means V is driven to exert the suction force.

Since the suction means V has a suction force for sucking the plasma flow containing the processing gas from at least one opening 12a to the other opening 12b, the plasma flow ejected from the jet outlet 10 Go around between 12b. The other opening 12b is the end n of the surface to be processed according to the present invention.
Further, the jet power of the jet port 10 and the suction force of the suction means V can be combined to increase the flow velocity of the plasma flow F containing the processing gas on the one opening 12a side, so that outside air is also sucked into the one opening 12a. It is. Since this outside air becomes an accompanying flow B with respect to the plasma flow, the plasma does not hit the periphery of the opening 12a as in the prior art.

In addition, since the guide 11 is provided with the guide piece 11a for guiding the plasma flow to the processing target surface 12 of the workpiece W, the guide piece 11a also functions to prevent the plasma from being scattered.
The opening diameter of the suction port 13 of the suction means V is ideally equal to or slightly larger than the inner diameter of the inner surface 12. This is because if the opening diameter is too large, the suction force of the suction means V is consumed for sucking outside air, and the suction force for the plasma flow becomes weak.

In any case, since the plasma flow ejected from the ejection port 10 reaches between the openings 12a and 12b, the entire surface 12 to be treated which is the inner surface of the pipe is reformed.
Further, nitrogen oxides and ozone generated in the plasma generation process are also ejected from the ejection port 10, but they are sucked by the suction means V. However, since nitrogen oxide and ozone have a large specific gravity, they are finally sunk to the suction port 13 side and sucked into the suction means V even if the suction force of the suction means V is not increased. However, in this embodiment, nitrogen oxide and ozone are actively sucked by the suction force of the suction means V.

Therefore, in the first embodiment described above, the plasma flow ejected from the ejection port 10 is sucked along the processing target surface 12, and the suction force for guiding the plasma flow from one opening 12a to the other opening 12b is generated. By including the suction means V provided, the entire surface of the processing target surface 12 is reformed at a time, and at the same time, nitrogen oxide and ozone are positively sucked.
Another feature is that surface treatment is not performed on unnecessary portions other than the processing target surface 12. In other words, the feature is that the plasma flow with respect to the processing target surface 12 can be controlled.

  Note that the processing target surface 12 of the workpiece W in the first embodiment also functions as a guide for inducing a plasma flow. In other words, the processing target surface 12 of the workpiece W functions as a guide.

  In the second embodiment shown in FIG. 2, the pair of plates are workpieces W1 and W2, and the workpieces W1 and W2 are opposed to each other while maintaining a gap in the same movable region E as in the first embodiment. The point which made the surface the process target surfaces 14 and 15 differs from 1st Embodiment, and other than that is the same as 1st Embodiment.

  That is, also in the second embodiment, the compressed gas supply source P is connected to the case C provided with a pair of electrodes, and the guide 11 provided with the guide piece 11a is provided around the jet port 10 provided in the case C. Provided. In addition, a suction means V that opens the suction port 13 is provided at a position facing the jet port 10, and a movable region E is provided between the jet port 10 and the suction means V.

Therefore, the plasma flow containing the processing gas is supplied to the facing interval between the workpieces W1 and W2 to reform the entire processing target surfaces 14 and 15 at the same time, and nitrogen oxides and ozone can be simultaneously sucked.
In the second embodiment, the processing target surfaces 14 and 15 of the pair of workpieces W function as a guide, and the lower ends of the processing target surfaces 14 and 15 are set to the end n1 of the processing target surface of the present invention. n2.

The third embodiment shown in FIG. 3 is an embodiment in which a plate having a large area of the processing target surface 16 is the workpiece W and the side surface of the workpiece W is also the processing target surface 16. Therefore, the end n of the processing target surface 16 in the third embodiment is located on the side surface of the workpiece W and at the lower end shown in FIG.
In the third embodiment, the opening areas of the guide 11 and the suction port 13 are made to correspond to the area of the plane of the processing target surface 16, and the rest is the same as in the first and second embodiments. .

  That is, also in the third embodiment, the compressed gas supply source P is connected to the case C having a pair of electrodes, and the guide 11 having the guide piece 11a is provided around the jet port 10 provided in the case C. Provided. In addition, a suction unit V having a suction port 13 opened is provided on the side facing the jet port 10, and a movable region E is provided between the jet port 10 and the suction unit V.

  The guide 11 keeps a predetermined distance from the processing target surface 16 of the workpiece W as shown in the figure and covers the entire plane of the processing target surface 16. A guide piece 11 a that guides the plasma flow toward the suction port 13 is provided around the guide 11 that covers the entire plane of the processing target surface 16. The guide piece 11 a is located slightly outside the workpiece surface 16 of the workpiece W, and the inner diameter thereof is almost the same as the inner diameter of the suction port 13.

  Therefore, when the plasma flow is ejected from the ejection port 10 together with the processing gas while the suction means V is driven to exert the suction force, the plasma flow is generated by the jet power from the ejection port 10 and the suction force of the suction means V. As a result of the synergistic effect, the guide 11 is guided by the opposing distance between the workpiece W and the processing target surface 16 and flows while diffusing in all directions on the processing target surface 16, and the flow hits the guide piece 11 a and changes to the suction means V direction. .

The plasma flow redirected by the induction piece 11a is pulled by the suction force of the suction means V toward the suction port 13, and is sucked by the suction means V together with nitrogen oxides and ozone generated in the plasma generation process. The
As is apparent from the above, in the third embodiment, the surface to be treated 16 of the workpiece W is surface-modified by the plasma flow passing between the guide 11 and the workpiece W, and nitrogen oxide or ozone Is also sucked by the suction means V along with the plasma flow.
Further, the back surface of the workpiece W where the plasma flow does not flow is not subjected to surface treatment.

  The fourth embodiment shown in FIG. 4 is a case where the workpiece W is a plate and the processing target surface 16 is limited to one plane of the workpiece W. The guide 11 is opposed to the processing target surface 16 of the workpiece W and maintains a predetermined interval, and the interval formed between the guide 11 and the processing target surface 16 is used as a plasma flow guide path.

Further, the suction port 13 of the suction means V opens a portion facing the periphery of the workpiece W and is formed in a donut shape as a whole so that the plasma flow can be directly sucked from the guide path.
Moreover, in this 4th Embodiment, the downward side which opposes the guide 11 becomes the movable area | region E of the holding means of this invention.

Accordingly, the workpiece holding means such as a robot (not shown) can be lifted from below the suction port 13 to set the workpiece W at a predetermined position.
The configuration other than the above is the same as that of the third embodiment.
That is, also in the fourth embodiment, the compressed gas supply source P is connected to the case C provided with a pair of electrodes, and the guide 11 provided with the guide piece 11a around the spout 10 provided in the case C. Is provided.

  In the fourth embodiment as described above, when the plasma flow is ejected from the ejection port 10 together with the processing gas while the suction means V is driven to exert the suction force, the plasma flow is ejected from the ejection port 10. As a result of the synergistic effect of the suction force of the suction means V, the guide 11 and the workpiece W are guided by a guide path formed at a facing distance between the processing target surface 16 and flow while diffusing in all directions on the processing target surface 16. Then, the air is directly sucked into the suction port 13 from this guide path.

The plasma flow redirected by the induction piece 11a is pulled by the suction force of the suction means V toward the suction port 13, and is sucked by the suction means V together with nitrogen oxides and ozone generated in the plasma generation process. The
Then, the processing target surface 16 of the workpiece W is surface-modified by the plasma flow passing through the guide path between the guide 11 and the workpiece W, and nitrogen oxide and ozone are also sucked by the suction means V along with the plasma flow. Will be. In the fourth embodiment as well, the outer peripheral edge of the processing target surface 16 is the end n of the processing target surface in the present invention.

  The fifth embodiment shown in FIG. 5 is a case where the workpiece W is a plate and the processing target surface 19 is limited to one plane of the workpiece W, as in the fourth embodiment. The guide 11 is opposed to substantially the entire surface of the workpiece 19 of the workpiece W and maintains a predetermined distance, and the gap formed between the guide 11 and the surface of treatment 19 is used as a plasma flow guide path. Yes.

Furthermore, the suction port 13 of the suction means V is generally circular and is opposed to the end n of the processing target surface 19 of the workpiece W, and directly sucks up the plasma flow induced in the guide path. It is what I did.
In the fifth embodiment, the lower side of the work W is the movable area E of the holding means of the present invention, and the work W is automatically set using the work holding means such as a robot as in the fourth embodiment. it can.

  Therefore, when the plasma flow is ejected from the ejection port 10 together with the processing gas while the suction means V is driven to exert the suction force, the plasma flow is generated by the jet power from the ejection port 10 and the suction force of the suction means V. As a result of the synergistic effect, the guide 11 is guided by a guide path formed at a distance between the guide 11 and the processing target surface 19 of the workpiece W and flows while diffusing in four directions on the processing target surface 19, and the flow hits the guide piece 11 a and is sucked. It changes in the direction of the mouth 13 and is sucked into the suction means V together with nitrogen oxides and ozone generated in the plasma generation process.

In the sixth embodiment shown in FIG. 6, the workpiece W includes a small diameter portion 20 and a large diameter portion 21 like a cylinder of a syringe, and the inner surface of the small diameter portion 20 is used as a processing target surface 22.
A rod-shaped transfer jig 23 is inserted into the large-diameter portion 21 so that the workpiece W is transferred together with the transfer jig 23 in the surface treatment process.

  The conveying jig 23 configured as described above forms a flow hole 24 along the axial center thereof, one end of the flow hole 24 is connected into the small diameter portion 20, and the other end is sucked in the same manner as in each embodiment. It is connected to the mouth 13.

  Accordingly, the workpiece W is moved together with the conveying jig 23 so that the small diameter portion 20 and the jet port 10 provided in the case C correspond to each other, and the flow hole 24 of the conveying jig 23 corresponds to the suction port 13 for suction. If the means V is driven, the plasma flow ejected from the ejection port 10 is guided into the small-diameter portion 20 by the synergistic effect of the ejection power from the ejection port 10 and the suction force of the suction means V, and the processing target surface 22 is It will be surface treated.

When the surface treatment of the processing target surface 22 in the small diameter portion 20 is completed as described above, the workpiece W is moved to the next step together with the conveying jig 23.
In FIG. 6, reference numeral P denotes a compressed gas supply source for supplying a processing gas, which is a compressed gas, to the case C as in the embodiments.

  In the seventh embodiment shown in FIG. 7, the conveying jig 25 is different from the sixth embodiment. That is, the conveying jig 25 of the seventh embodiment is a cap, and the large-diameter portion 21 is fitted in the concave portion 25a so as to close the opening of the large-diameter portion 21. A flow hole 26 formed in the conveying jig 25 is communicated with the suction port 13.

  It is suitable for a plasma torch type surface treatment apparatus for modifying the surface to be treated while fixing the jet nozzle.

  C: Case, 10: Jet port, P: Compressed gas supply source, 11: Guide, 11a: Guide piece, W, W1, W2 ... Workpiece, 12, 14-19, 22 ... Surface to be processed, V ... Suction means, E ... movable region, F ... plasma flow, n ... end, 20 ... small diameter portion, 21 ... large diameter portion, 23, 25 ... conveying jig, 24, 26 ... flow hole

Claims (6)

A case for generating plasma,
A jet outlet that is provided in the case and jets the plasma generated in the case;
A compressed gas supply source for supplying compressed gas to the case,
In the surface treatment apparatus, the plasma generated in the case is jetted together with the compressed gas as a plasma flow from the jet port toward the workpiece surface to be treated, and the treated plasma surface is modified by the jetted plasma flow. And
Surface treatment provided with suction means provided with suction force for sucking the plasma flow ejected from the jet outlet along the surface to be treated and guiding the plasma flow to the end of the surface to be treated. apparatus.   The surface treatment apparatus according to claim 1, wherein a movable region of a work holding means such as a robot is secured to make the work face the jet port.   A guide for guiding the plasma flow ejected from the ejection port in a direction along the processing target surface of the workpiece is provided, and a suction port of the suction means is provided at a position corresponding to an end of the processing target surface. The surface treatment apparatus according to claim 1 or 2.   The processing target surface is an inner surface of a cylinder or an opposing surface of a pair of plates, and the inner surface of the plate or the opposing surface of the plate functions as the guide along the processing target surface. Surface treatment equipment.   The surface treatment apparatus according to claim 4, wherein the workpiece is provided with a small diameter portion and a large diameter portion, an inner surface of the small diameter portion is the surface to be treated, and the large diameter portion is connected to a suction unit. A transport jig is provided,
While closing the large diameter part with this conveying jig,
The surface treatment apparatus according to claim 5, wherein a flow hole is formed in the conveying jig, one end of the flow hole is connected to the small diameter portion, and the other end is connected to the suction means.

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