JP6994747B2 - Surface treatment equipment - Google Patents

Description

The present invention relates to a so-called plasma torch type surface treatment apparatus in which plasma generated in a case is ejected from a case toward a work as a plasma flow together with a compressed gas.

As this kind, the surface treatment apparatus described in Patent Document 1 has been conventionally known.
In this conventional surface treatment apparatus, a supply source for supplying a treatment gas, which is a compressed gas, is connected to a case provided with a pair of electrodes. Then, the plasma generated between the electrodes is ejected together with the processing gas from the ejection port provided in the case, and is blown onto the surface to be processed of the work.
Further, an exhaust flow path is provided at a position substantially adjacent to the ejection port so that nitrogen oxides and ozone generated in the process of generating plasma can be exhausted.

Japanese Unexamined Patent Publication No. 2004-115896

In the conventional surface treatment device as described above, an exhaust flow path for exhausting nitrogen oxides and ozone generated in the process of generating plasma is provided at a position adjacent to the ejection port for ejecting the plasma flow. , The spread of plasma flow can hardly be expected. Therefore, when the treated area is large and the end portion protrudes from the exhaust flow path, there is a problem that the surface treatment cannot be performed up to the end portion of the treated area.

Further, since the processing area is limited to the circumference of the plasma flow ejection port, when the area of the processing target surface is large, all of the processing target surfaces must be moved unless either the ejection port side or the processing target surface side is moved. There was also a problem that the reforming treatment could not be performed.

On the other hand, as shown in FIG. 8, a device for reforming only the inner surface 1 of the pipe W, which is a work, has been conventionally known. In this conventional device, a nozzle 2 for ejecting plasma together with a processing gas which is a compressed gas is provided on the opening side of the pipe W, and the plasma flow ejected from the nozzle 2 is guided to the inner surface 1 of the pipe W. The inner surface 1 is reformed by the plasma guided into the pipe W in this way.

However, in this conventional apparatus, there is a case where all the inner surface 1 of the pipe W cannot be reformed, and the reason is as follows.
That is, a part of the plasma flow ejected from the nozzle 2 is bounced around the opening of the pipe W as shown by the arrow A, so that the amount of plasma guided to the inner surface 1 is reduced by that amount.

As the amount of plasma guided to the inner surface 1 of the pipe W decreases, the activity of the plasma decreases as it goes downstream of the plasma flow.
Therefore, when the pipe W is long, there is a region where the reforming process cannot be performed with the virtual line X shown in FIG. 8 as a boundary.

Further, if the length of the pipe W is long, it takes time for the plasma flow to reach the end of the pipe W from the tip end. However, since the activity of the plasma decays with time, if the plasma flow takes too much time in the process from the tip to the end of the pipe W, the activity of the plasma on the downstream side of the plasma flow becomes low. Therefore, a region that cannot be reformed is created at the boundary of the virtual line X.

Therefore, when the length of the pipe is long, two steps are required for the reforming treatment of the inner surface 1. That is, first, one opening of the pipe W is positioned on the nozzle 2 side to guide the plasma flow to the inner surface 1. Next, the pipe W is turned over and the other opening is positioned on the nozzle 2 side to guide the plasma flow to the inner surface 1. Therefore, in the case of the reforming treatment of the inner surface 1 of the long pipe W, there is a problem that two steps are required.

On the other hand, as described by the arrow A, a part of the plasma flow ejected from the nozzle 2 is bounced around the opening of the pipe W, which means that the circumference of the opening is also surface-treated. do. If only the inner surface of the pipe W is to be surface-treated, various inconveniences will occur if the surface other than the inner surface is surface-treated.

An object of the present invention is to provide a surface treatment apparatus capable of efficiently modifying the entire surface of the treatment target surface without moving the plasma flow outlet and the treatment target surface of the work relative to each other.

The present invention is provided with a suction force that sucks the plasma flow ejected from the ejection port provided in the case along the surface to be processed of the work and guides the plasma flow to the end of the surface to be processed. A suction means is provided.

Therefore, for example, when the work is a pipe and the inner surface thereof is the surface to be processed, one opening of the pipe is directed to the spout side and the other opening is directed to the suction means side. Then, when the suction means is operated, the suction force is large, so that the outside air around one opening of the pipe is also drawn into the pipe. Since the flow that draws in the outside air becomes an accompanying flow with respect to the plasma flow ejected from the ejection port, most of the plasma flow is guided into the pipe without hitting the periphery of the opening of the pipe.

Further, since the suction means is provided with a suction force that guides the plasma flow ejected from the ejection port to the end of the surface to be processed, for example, even with a long pipe, the entire length is maintained while maintaining the plasma activity. It can be reformed over.

Further , since the inner surface of the cylinder, which is the surface to be processed, is made to function as the guide along the surface to be processed, the plasma flow ejected from the ejection port can be guided to the suction means without providing a special guide. Can be done.

The work is provided with a small diameter portion and a large diameter portion, and the inner surface of the small diameter portion is the surface to be processed, and a transport jig that contacts the inner surface of the large diameter portion and closes the large diameter portion is provided. The transport jig is formed with a flow hole penetrating in the axial direction, one end of the flow hole is connected to the small diameter portion, and the other end is connected to the suction means.
As a work having such a small diameter portion and a large diameter portion, for example, a cylinder of a syringe can be considered. The cylinder of the syringe has a small diameter portion where the needle is connected and a large diameter portion where the liquid is stored.
And since the diameter of the small diameter part of the syringe is quite small, even if the plasma flow is blown from the outside of the small diameter part, the plasma does not enter the small diameter part, but if it is sucked from the large diameter part as in the present invention, The plasma flow also flows into the inner surface of the small diameter portion.

Further, the transfer jig can be used to surface-treat the inner surface of the small-diameter portion while continuously transporting the work.

According to the present invention, it is possible to efficiently modify the entire surface of the work to be processed without moving the work and the outlet for ejecting the plasma flow relative to each other.

It is a schematic diagram of 1st Embodiment. It is a schematic diagram of the 2nd Embodiment. It is a schematic diagram of the 3rd Embodiment. It is a schematic diagram of the 4th Embodiment. It is a schematic diagram of the 5th Embodiment. It is a schematic diagram of the sixth embodiment. It is a schematic diagram of the 7th Embodiment. It is a schematic diagram of a conventional device.

Hereinafter, the sixth embodiment of the present invention and the first, second, third, fourth, fifth , and seventh embodiments as reference examples of the present invention will be described.
In the first embodiment shown in FIG. 1, a pair of electrodes (not shown) is provided in the case C so that plasma is generated between these electrodes. A compressed gas supply source P for supplying a processing gas, which is a compressed gas, to the case C is connected to the case C.
Further, the case C is provided with an ejection port 10 for ejecting plasma together with the processing gas supplied to the case C.

The ejection port 10 may have a hole directly in the case C, or a nozzle which is a separate component from the case C may be attached. In short, the configuration does not matter as long as it has a function of ejecting the plasma and the processing gas in the case C.

The ejection port 10 as described above is provided with a guide 11 that prevents the plasma flow ejected from the ejection port 10 from scattering and guides the plasma flow in a target direction. A guide piece 11a for guiding the plasma flow to the processing target surface 12 of the work W, which will be described later, is provided around the guide 11.

On the other hand, the suction means V is provided at a position where the distance from the ejection port 10 is maintained, and the suction means V is mainly composed of an air pump, an electric fan, or the like (not shown). Further, the suction means V is provided with a suction port 13 so that the plasma flow ejected from the ejection port 10, nitrogen oxides, ozone and the like can be focused and sucked.

A space for setting the work W made of a pipe is provided between the guide 11 and the suction port 13 as described above, and the movable area E having a size that allows the work W to cross this space. It is supposed to be. Therefore, the work W can be set by holding the work by a work holding means such as a robot (not shown).

Next, a case where the processing target surface 12 which is the inner surface of the work W made of a pipe is reformed will be described.
When the work W is made of a pipe as described above, a movable area E corresponding to at least the entire length of the pipe is secured.

Then, a work holding means such as a robot (not shown) is introduced into the movable region E so that one opening 12a of the work W is directed to the ejection port 10 side and the other opening 12b is directed to the suction means V side. , Make the robot stand still.
At this time, the center of the suction port 13 is positioned on the axis of the work W.
While maintaining the work W in the above state, plasma is ejected from the ejection port 10 together with the processing gas, and at the same time, the suction means V is driven to exert the suction force.

Since the suction means V has a suction force for sucking the plasma flow containing the processing gas from at least one opening 12a to the other opening 12b, the plasma flow ejected from the ejection port 10 has the suction force of the opening 12a. It spreads between 12b. The other opening 12b is the end portion n of the surface to be processed according to the present invention.
Further, the jet output of the ejection port 10 and the suction force of the suction means V can be combined to increase the flow velocity of the plasma flow F containing the processing gas on the one opening 12a side, so that the outside air is also sucked into the one opening 12a. Is done. Since this outside air becomes an accompanying flow B with respect to the plasma flow, the plasma does not hit the periphery of the opening 12a as in the conventional case.

Moreover, since the guide 11 is provided with the guide piece 11a that guides the plasma flow to the processing target surface 12 of the work W, the guide piece 11a can also function to prevent the plasma from scattering.
Ideally, the opening diameter of the suction port 13 of the suction means V is equal to or slightly larger than the inner diameter of the inner surface 12. This is because if the opening diameter is too large, the suction force of the suction means V is consumed to suck the outside air, and the suction force for the plasma flow becomes weak.

In any case, since the plasma flow ejected from the ejection port 10 spreads between the openings 12a and 12b, the entire surface of the processing target surface 12 which is the inner surface of the pipe is reformed.
Nitrogen oxides and ozone generated in the plasma generation process are also ejected from the ejection port 10, and they are attracted by the suction means V. However, since nitrogen oxides and ozone have a large specific gravity, they eventually sink to the suction port 13 side and are sucked by the suction means V even if the suction force of the suction means V is not increased. However, in this embodiment, nitrogen oxides and ozone are positively sucked by the suction force of the suction means V.

Therefore, in the above-mentioned first embodiment, the plasma flow ejected from the ejection port 10 is sucked along the surface to be processed 12, and the suction force for guiding the plasma flow from one opening 12a to the other opening 12b is applied. By providing the suction means V provided, the entire surface of the surface to be treated 12 is reformed at once, and at the same time, nitrogen oxides and ozone are positively sucked.
Another feature is that surface treatment is not performed on unnecessary parts other than the surface to be treated 12. In other words, it is characterized in that the plasma flow can be controlled with respect to the surface to be processed 12.

The processing target surface 12 of the work W in the first embodiment also functions as a guide for inducing the plasma flow. In other words, it is also characterized in that the processing target surface 12 of the work W functions as a guide.

In the second embodiment shown in FIG. 2, the pair of plates are the works W1 and W2, and the works W1 and W2 are opposed to each other in the same movable region E as the first embodiment at intervals. The surface is different from the first embodiment in that the surfaces are the surfaces 14 and 15 to be processed, and other than that, it is the same as the first embodiment.

That is, also in this second embodiment, the compressed gas supply source P is connected to the case C provided with the pair of electrodes, and the guide 11 provided with the guide piece 11a is provided around the ejection port 10 provided in the case C. It is provided. Further, a suction means V having a suction port 13 opened is provided at a position facing the ejection port 10, and a movable region E is provided between the ejection port 10 and the suction means V.

Therefore, a plasma flow containing the processing gas can be supplied to the facing intervals of the works W1 and W2 to reform the entire surfaces 14 and 15 to be processed at once, and nitrogen oxides and ozone can be sucked at the same time.
Also in this second embodiment, the processing target surfaces 14 and 15 of the pair of work Ws function as guides, and the lower ends of the processing target surfaces 14 and 15 are the end portions n1 of the processing target surfaces of the present invention. It is set to n2.

The third embodiment shown in FIG. 3 is an embodiment in which a plate having a large area of the processing target surface 16 is used as the work W and the side surface of the work W is also used as the processing target surface 16. Therefore, the end portion n of the processing target surface 16 in the third embodiment is located on the side surface of the work W and is located at the lower end portion shown in FIG.
The third embodiment is the same as the first and second embodiments in that the opening areas of the guide 11 and the suction port 13 are made to correspond to the area of the plane of the surface to be processed 16. ..

That is, also in this third embodiment, the compressed gas supply source P is connected to the case C provided with the pair of electrodes, and the guide 11 provided with the guide piece 11a is provided around the ejection port 10 provided in the case C. It is provided. Further, a suction means V having a suction port 13 opened is provided on the side facing the ejection port 10, and a movable region E is provided between the ejection port 10 and the suction means V.

As shown in the figure, the guide 11 keeps a predetermined distance from the processing target surface 16 of the work W and covers the entire plane of the processing target surface 16. A guide piece 11a for guiding the plasma flow toward the suction port 13 is provided around the guide 11 that covers the entire plane of the surface to be processed 16. The guide piece 11a is located slightly outside the surface 16 to be processed of the work W, and its inner diameter is almost the same as the inner diameter of the suction port 13.

Therefore, when a plasma flow is ejected from the ejection port 10 together with the processing gas while driving the suction means V to exert the suction force, the plasma flow is the suction power of the suction means V and the ejection output from the ejection port 10. Due to the synergistic effect, the guide 11 is guided by the facing distance between the processing target surface 16 of the work W and flows while diffusing in all directions on the processing target surface 16, and the flow hits the guide piece 11a and is converted in the suction means V direction. ..

The plasma flow whose direction is changed by the induction piece 11a is pulled toward the suction port 13 by the suction force of the suction means V, and is sucked by the suction means V together with the nitrogen oxides and ozone generated in the plasma generation process. To.
As is clear from the above, in this third embodiment, the surface to be treated of the work W is surface-modified by the plasma flow passing between the guide 11 and the work W, and nitrogen oxides and ozone are formed. Will be sucked by the suction means V along with the plasma flow.
Further, of the work W, the back surface where the plasma flow does not flow is not surface-treated.

The fourth embodiment shown in FIG. 4 is a case where the work W is made into a plate and the processing target surface 16 is limited to one plane of the work W. The guide 11 maintains a predetermined distance facing the processing target surface 16 of the work W, and the distance formed between the guide 11 and the processing target surface 16 is used as a guide path for the plasma flow.

Further, the suction port 13 of the suction means V has a portion facing the periphery of the work W opened and has a donut shape as a whole so that the plasma flow can be directly sucked from the guide path.
Further, in the fourth embodiment, the lower side facing the guide 11 is the movable region E of the holding means of the present invention.

Therefore, the work W can be set at a predetermined position by raising the work holding means such as a robot (not shown) from below the suction port 13.
The configuration other than the above is the same as that of the third embodiment.
That is, also in this fourth embodiment, the compressed gas supply source P is connected to the case C provided with the pair of electrodes, and the guide 11 provided with the guide piece 11a around the ejection port 10 provided in the case C. Is provided.

In the fourth embodiment as described above, when the suction means V is driven to exert the suction force and the plasma flow is ejected from the ejection port 10 together with the processing gas, the plasma flow is ejected from the ejection port 10. And, due to the synergistic effect of the suction force of the suction means V, the guide 11 is guided by the guide path formed at the facing interval between the processing target surface 16 of the work W, and flows while spreading in all directions on the processing target surface 16. , It will be sucked directly into the suction port 13 from this guide path.

The plasma flow whose direction is changed by the induction piece 11a is pulled toward the suction port 13 by the suction force of the suction means V, and is sucked by the suction means V together with the nitrogen oxides and ozone generated in the plasma generation process. To.
Then, the surface to be processed of the work W is surface-modified by the plasma flow passing through the guide path between the guide 11 and the work W, and nitrogen oxides and ozone are also sucked by the suction means V along with the plasma flow. Will be. Also in this fourth embodiment, the outer peripheral edge of the surface to be processed 16 is the end portion n of the surface to be processed in the present invention.

The fifth embodiment shown in FIG. 5 is a case where the work W is made into a plate and the processing target surface 19 is limited to one plane of the work W, as in the fourth embodiment. Then, the guide 11 maintains a predetermined distance facing almost the entire surface of the processing target surface 19 of the work W, and the distance formed between the guide 11 and the processing target surface 19 is used as a guide path for the plasma flow. There is.

Further, the suction port 13 of the suction means V has a circular shape as a whole and faces the end portion n of the processing target surface 19 of the work W, and directly sucks the plasma flow guided to the guidance path. It is something like that.
Further, in the fifth embodiment, the lower side of the work W becomes the movable region E of the holding means of the present invention, and the work W is automatically set by using the work holding means such as a robot as in the fourth embodiment. can.

Therefore, when a plasma flow is ejected from the ejection port 10 together with the processing gas while driving the suction means V to exert the suction force, the plasma flow is the suction power of the suction means V and the ejection output from the ejection port 10. Due to the synergistic effect, the guide 11 and the work W are guided by a guide path formed at an opposite distance between the treatment target surface 19 and flow while spreading in all directions on the treatment target surface 19, and the flow hits the guide piece 11a and is sucked. It is converted to the direction of the mouth 13 and is sucked by the suction means V together with the nitrogen oxides and ozone generated in the plasma generation process.

In the sixth embodiment shown in FIG. 6, the work W is provided with a small diameter portion 20 and a large diameter portion 21 like a cylinder of a syringe, and the inner surface of the small diameter portion 20 is a surface to be processed 22.
Then, a rod-shaped transport jig 23 is inserted into the large diameter portion 21 so that the work W is transported together with the transport jig 23 in the surface treatment step.

The transfer jig 23 as described above forms a flow hole 24 along the center of its axis, one end of the flow hole 24 is connected to the small diameter portion 20, and the other end is sucked in the same manner as in each embodiment. It is connected to the mouth 13.

Therefore, the work W is moved together with the transfer jig 23 so that the small diameter portion 20 and the ejection port 10 provided in the case C correspond to each other, and the flow hole 24 of the transfer jig 23 corresponds to the suction port 13 for suction. When the means V is driven, the plasma flow ejected from the ejection port 10 is guided into the small diameter portion 20 by the synergistic effect of the ejection output from the ejection port 10 and the suction force of the suction means V, and the surface to be processed 22 becomes. It will be surface treated.

When the surface treatment of the surface to be treated 22 in the small diameter portion 20 is completed as described above, the work W is moved to the next step together with the transfer jig 23.
In FIG. 6, reference numeral P is a compressed gas supply source, and is for supplying the processing gas, which is a compressed gas, to the case C as in each embodiment.

In the seventh embodiment shown in FIG. 7, the transfer jig 25 is different from the sixth embodiment. That is, the transfer jig 25 of the seventh embodiment has a cap shape, and the large diameter portion 21 is fitted in the recess 25a to close the opening of the large diameter portion 21. Then, the distribution hole 26 formed in the transfer jig 25 is communicated with the suction port 13.

It is suitable for a plasma torch type surface treatment device that modifies the surface to be treated while fixing the ejection port.

C ... Case, 10 ... Spout, P ... Compressed gas supply source, 11 ... Guide, 11a ... Induction piece, W, W1, W2 ... Work, 13 ... Suction port, 12, 14-19, 22 ... Processing target surface, V ... Suction means, E ... Movable area, F ... Plasma flow, n ... End, 20 ... Small diameter, 21 ... Large diameter, 23, 25 ... Transfer jig, 24, 26 ... Flow hole

Claims (1)

A case for generating plasma and
In addition to being provided in this case, the spout that ejects the plasma generated in this case,
The above case is equipped with a compressed gas supply source that supplies compressed gas.
It is a surface treatment device that is ejected from the ejection port to the surface to be processed and the surface to be processed is modified by the ejected plasma flow.
A suction means having a suction force for sucking the plasma flow ejected from the ejection port along the surface to be treated and guiding the plasma flow to the end of the surface to be treated is provided.
The surface to be processed is the inner surface of the cylinder.
The suction port of the suction means is provided at a position corresponding to the end of the cylinder, and the suction port is provided at a position corresponding to the end of the cylinder.
The center of the suction port is provided on the axis of the cylinder,
A surface treatment device that functions as a guide for guiding the plasma flow ejected from the ejection port in a direction along the treatment target surface.
The work is provided with a small diameter portion and a large diameter portion, and the inner surface of the small diameter portion is the surface to be processed.
A transport jig that contacts the inner surface of the large diameter portion and closes the large diameter portion is provided.
A surface treatment apparatus characterized in that a flow hole penetrating in the axial direction is formed in the transfer jig, one end of the flow hole is connected to the small diameter portion, and the other end is connected to the suction means. ..

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