JP2018133221A - Lighting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lighting device which achieves thickness reduction.SOLUTION: A lighting device 100 includes: a device body 106; a substrate 11 placed on the device body 106; and multiple surface mounting type light emitting elements 20 which are disposed on a first major surface 11a on the substrate 11 which is opposite to the device body 106 side. At least one of the light emitting elements 20 is a light emitting element 20a for a night light.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a lighting fixture having a light emitting element such as an LED (Light Emitting Diode).

  2. Description of the Related Art Conventionally, for example, a ceiling light that is a lighting fixture disposed on a ceiling is known. For example, a conventional ceiling light described in Patent Document 1 includes an instrument main body, an instrument attachment portion for attaching the instrument main body to a construction material, and a light source substrate and a circuit board supported by the instrument main body. A plurality of light emitting diodes (LEDs) are mounted on the light source substrate. On the circuit board, a plurality of circuit components constituting a lighting circuit for lighting each of the plurality of LEDs are mounted.

  The light source substrate is arranged in a ring shape on the instrument body so as to surround the periphery of the instrument mounting portion. The circuit board is disposed around the light source board.

  Such a ceiling light is provided with a nightlight comprising a so-called bullet-type LED on a circuit board, and this nightlight is covered with a protective cover.

JP 2016-21369 A

  When assembling the above-described conventional ceiling light, first, after positioning work for positioning the light source board and the circuit board with respect to the instrument body, wiring work for connecting the light source board and the circuit board with lead wires is performed. There is a need. Therefore, for example, it is difficult to improve the assembly efficiency of the ceiling light.

  Therefore, it is conceivable to realize the light source board and the circuit board with a single board. In this case, however, elements such as circuit components, circuit component lead wires, or solder exist on the back surface of the board. These storage spaces are necessary. On the other hand, it is necessary to provide a nightlight and a protective cover on the front side of the substrate. These can be factors that increase the thickness of the lighting fixture.

  An object of this invention is to provide the lighting fixture which can implement | achieve thickness reduction.

  In order to achieve the above object, one aspect of a lighting fixture according to the present invention is arranged on a fixture main body, a substrate placed on the fixture main body, and a first main surface of the substrate opposite to the fixture main body side. In addition, a plurality of light emitting elements of surface mount type, and at least one of the light emitting elements is a light emitting element for night light.

  According to the present invention, an object of the present invention is to provide a lighting fixture that can be thinned.

It is a disassembled perspective view of the lighting fixture which concerns on embodiment. It is a fragmentary sectional view which shows the instrument main body which concerns on embodiment, a light emitting module, a circuit cover, and a light source cover. It is the top view which looked at the light emitting module which concerns on embodiment from the instrument main body side. It is the top view which looked at the light emitting module which concerns on embodiment from the floor side. It is a side view of the light emitting module which concerns on embodiment. It is a disassembled perspective view which shows the light emitting module which concerns on embodiment, a circuit cover, and a light source cover. It is a fragmentary sectional view which shows the instrument main body which concerns on embodiment, a light emitting module, a circuit cover, and a light source cover. It is an enlarged view which shows schematic structure of the board | substrate which concerns on a modification.

  Hereinafter, embodiments will be described with reference to the drawings. The embodiment described below shows a specific example of the present invention. Therefore, numerical values, shapes, materials, components, arrangement positions of components, connection forms, and the like shown in the following embodiments are merely examples, and are not intended to limit the present invention. Therefore, among the constituent elements in the following embodiments, constituent elements that are not described in the independent claims showing the highest concept of the present invention are described as optional constituent elements.

  Each figure is a schematic diagram and is not necessarily shown strictly. Moreover, in each figure, the same code | symbol is attached | subjected to the substantially same structure, and the overlapping description may be abbreviate | omitted or simplified.

(Embodiment)
Hereinafter, the lighting fixture 100 which concerns on embodiment is demonstrated.

[Overall configuration of lighting equipment]
First, the whole structure of the lighting fixture 100 which concerns on embodiment is demonstrated, referring FIG. FIG. 1 is an exploded perspective view of a lighting apparatus 100 according to an embodiment.

  As shown in FIG. 1, the lighting fixture 100 of this Embodiment is a ceiling light attached to a ceiling, for example. Note that the upper direction in FIG. 1 (the positive direction of the Z axis) corresponds to the direction of the floor surface (not shown) facing the ceiling. That is, the lighting fixture 100 in FIG. 1 is illustrated in a posture that is upside down from that during normal use.

  The lighting fixture 100 according to the present embodiment includes a fixture main body 106, a light emitting module 10, a circuit cover 150, a light source cover 160, a lighting cover 140, and a fixture mounting portion 8. Hereinafter, these will be described in detail.

[Equipment body]
FIG. 2 is a partial cross-sectional view showing the instrument body 106, the light emitting module 10, the circuit cover 150, and the light source cover 160 according to the embodiment. Specifically, FIG. 2 is a cross-sectional view of a cut surface parallel to the YZ plane at a position where a second cover 152 (described later) in the circuit cover 150 is cut.

  As shown in FIGS. 1 and 2, the instrument main body 106 is formed in a disk shape, and is a member manufactured using, for example, a sheet metal such as an aluminum plate or a steel plate. For example, a white paint having a high light reflectance is applied or a reflective metal material is deposited on the surface of the instrument body 106 on the side where the light emitting module 10 or the like is disposed.

  In addition, a circular opening is formed at the center of the instrument body 106, and a substantially cylindrical support 126 extending from the periphery of the opening toward the light emitting module 10 is formed. The support portion 126 is a member formed of, for example, resin, and has a structure that can be fitted to the instrument mounting portion 8. The support portion 126 is formed with a slit-like insertion portion 1261 extending from the tip end portion of the support portion 126 along the axial direction. A power cable 199 (see FIG. 7 and the like) for electrically connecting the fixture mounting portion 8 and the light emitting module 10 is inserted through the insertion portion 1261.

  The instrument main body 106 includes an outermost peripheral portion 1061, an innermost peripheral portion 1062, and an intermediate portion 1063 between the outermost peripheral portion 1061 and the innermost peripheral portion 1062. The outermost peripheral part 1061, the innermost peripheral part 1062, and the intermediate part 1063 are formed in a triple ring shape as a whole.

  The outermost peripheral portion 1061 is provided with a flat first mounting surface portion 1064 and a standing portion 1065 erected on the outer peripheral edge of the first mounting surface portion 1064, and these are formed over the entire circumference. The illumination cover 140 is attached to the first attachment surface portion 1064, and the standing portion 1065 covers the boundary between the first attachment surface portion 1064 and the illumination cover 140 from the side to suppress leakage light.

  The intermediate portion 1063 is formed with a flat second mounting surface portion 1066 and a curved plate portion 1067 continuous from the first mounting surface portion 1064 to the second mounting surface portion 1066 over the entire circumference. The second mounting surface portion 1066 is parallel to the first mounting surface portion 1064 and is disposed on the ceiling side (the negative direction of the Z axis) with respect to the first mounting surface portion 1064. The light emitting module 10 is attached to the second attachment surface portion 1066.

  The innermost peripheral part 1062 is a part adjacent to the support part 126. The innermost peripheral portion 1062 is formed with an accommodation concave portion 1068 that is concave with respect to the second mounting surface portion 1066. The bottom surface of the housing recess 1068 is disposed between the first mounting surface portion 1064 and the second mounting surface portion 1066 in the Z-axis direction. The housing recess 1068 houses the circuit component 80 of the light emitting module 10. That is, since the circuit component 80 is housed in the housing recess 1068 that fits between the first mounting surface portion 1064 and the second mounting surface portion 1066, the entire instrument body 106 can be made compact.

[Equipment mounting part]
The instrument attachment portion 8 is attached to the support portion 126 by being inserted into the support portion 126 of the instrument main body 106. Moreover, the fixture attachment part 8 is detachably attached to a ceiling side attachment member (not shown) installed on the ceiling. As described above, the fixture body 8 is detachably attached to the ceiling side attachment member, so that the fixture body 106 is detachably attached to the ceiling. In addition, the fixture mounting portion 8 also serves as an electrical connection between the ceiling side mounting member and the lighting fixture 100. Specifically, the ceiling side attachment member is electrically connected to a commercial power source (not shown) disposed on the back side of the ceiling via an electric wire (not shown). When the lighting fixture 100 is installed on the ceiling, AC power from a commercial power supply is supplied to the fixture mounting portion 8 via the ceiling-side mounting member. That is, the appliance mounting portion 8 is an electrical connection portion that receives power from an external power source (commercial power source).

[Light emitting module]
FIG. 3 is a plan view of the light emitting module 10 according to the embodiment as viewed from the instrument body 10 side. FIG. 4 is a plan view of the light emitting module 10 according to the embodiment as viewed from the floor side. FIG. 5 is a side view of the light emitting module 10 according to the embodiment.

  As shown in FIGS. 3 to 5, the light emitting module 10 includes a substrate 11, a plurality of light emitting elements 20 arranged on the substrate 11, and one or more (a plurality in the present embodiment) circuits arranged on the substrate 11. And a component 80. Here, let the main surface on the opposite side to the instrument main body 106 side in the board | substrate 11 be the 1st main surface 11a, and let the main surface by the side of the instrument main body 106 be the 2nd main surface 11b. That is, the first main surface 11a faces the floor side, and the second main surface 11b faces the ceiling side. A plurality of light emitting elements 20 are arranged on the first main surface 11a, and a circuit component 80 is arranged on the second main surface 11b.

  The substrate 11 has a rectangular shape with a corner cut off in a plan view (when the substrate 11 is viewed from the thickness direction of the substrate 11), and a circular opening 12 is formed at the center. That is, the substrate 11 has an annular shape. Around the opening 12, a notch-shaped through-hole 121 through which the power cable 199 penetrates the substrate 11 is formed. The shape of the through hole may be any shape as long as the power cable 199 penetrates. Examples of other shapes of the through hole include a hole shape. Moreover, the installation location of the through hole may not be around the opening 12.

  As the substrate 11, for example, a glass composite substrate such as a CEM3 (Composite epoxy material-3) substrate, a resin substrate, a ceramic substrate, a paper phenol substrate, or the like is employed.

  Each of the plurality of light emitting elements 20 of the present embodiment is a surface mount type light emitting element in which an LED chip is packaged, for example. That is, the mounting structure of the light emitting module 10 is an SMD (Surface Mount Device) structure in which an LED element in which an LED chip is packaged is mounted on a substrate 11. The plurality of light emitting elements 20 are connected to a conductor pattern (metal wiring) provided on the first main surface 11a by reflow soldering. That is, the plurality of light emitting elements 20 are surface-mounted on the second region 13 b in the first main surface 11 a of the substrate 11. Specifically, paste-like solder (for example, also referred to as “cream solder”) is applied to a plurality of mounting positions (positions where the light emitting elements 20 are to be disposed) on the first main surface 11a of the substrate 11 to contact each solder. A plurality of light emitting elements 20 are arranged as described above. Then, each light emitting element 20 and the metal wiring provided in the 1st main surface 11a are connected by passing through the process (heating process) etc. which add heat. In this way, the plurality of light emitting elements 20 are soldered to the substrate 11 by the reflow method.

  Of the plurality of light emitting elements 20 included in the light emitting module 10, at least one (one in the present embodiment) is a night light emitting element 20a, and the other plurality of light emitting elements 20b are for illumination. The light emitting element 20b. The night-light light-emitting element 20a is, for example, an LED element that can reduce at least one of brightness and color temperature lower than the light-emitting element 20b for illumination. In other words, the light emitting element 20a for nightlights may be a light emitting element having characteristics that at least one of brightness and color temperature is lower than that of the light emitting element 20b for illumination. It may be a light emitting element in which at least one of brightness and color temperature is lower than the light emitting element 20b for use.

  Further, in the present embodiment, as shown in FIG. 4, the first region 13 a, which is the central portion (peripheral portion of the opening 12) in the plan view, of the second main surface 11 b of the substrate 11 is used for the night light. The light emitting element 20a is arranged.

  The light emitting element 20b for illumination is an LED element used for normal illumination. The plurality of light emitting elements 20b for illumination may include, for example, a plurality of types of light emitting elements 20 having different color temperatures.

  For example, the plurality of light emitting elements 20b for illumination may be configured by a group (first group) of light emitting elements 20b having a high color temperature and a group (second group) of light emitting elements 20b having a low color temperature. In this case, the brightness of each of the first group of light emitting elements 20b and the second group of light emitting elements 20b is adjusted, that is, the dimming control is performed, thereby adjusting the color of the illumination light emitted by the light emitting module 10, that is, adjusting the light. Color control may be performed.

  Moreover, in this Embodiment, as shown in FIG. 4, the several light emitting element 20b for illumination is arrange | positioned in the 2nd area | region 13b which is the area | region of the outer periphery of the 1st area | region 13a in the 1st main surface 11a of the board | substrate 11. Has been.

  For example, as shown in FIG. 4, the plurality of light emitting elements 20 b are arranged in a ring so as to surround the first region 13 a of the substrate 11. In addition, if the aspect of the electrical connection of the several light emitting element 20b is independent from the light emitting element 20a for nightlights, there will be no limitation in particular. For example, a plurality of groups (light emitting element groups) of n (n is an integer of 2 or more) light emitting elements 20b connected in series may be formed, and the plurality of light emitting element groups may be connected in parallel. Moreover, all the light emitting elements 20b arranged on the substrate 11 may be connected in series. Further, in the present embodiment, the light emitting unit 25 in the light emitting module 10 is configured by the plurality of light emitting elements 20.

  As shown in FIG. 3, the first region 13 a of the second main surface 11 b of the substrate 11 is a region where one or more circuit components 80 are arranged. The one or more circuit components 80 are components constituting at least a part of an electric circuit used for the operation of the light emitting unit 25 (turning on, turning off, changing the dimming rate). The one or more circuit components 80 are higher than the light emitting element 20. Here, the “height” is a height (length in the Z-axis direction) from the substrate 11 when installed on the substrate 11. Note that all of the circuit components 80 installed on the second main surface 11 b may not be higher than the light emitting element 20.

  In the present embodiment, a plurality of circuit components 80 are arranged in the first region 13a of the second major surface 11b, and a power source that supplies power for light emission to the light emitting unit 25 by the plurality of circuit components 80. A circuit 90 is configured. The power circuit 90 is connected to the instrument mounting portion 8 by a power cable 199. This “connection” includes electrical connection and mechanical connection. As a result, AC power from the commercial power supply is supplied to the power supply circuit 90 via the appliance mounting portion 8 and the power supply cable 199. The power supply circuit 90 converts alternating current power into direct current power suitable for light emission of the light emitting unit 25 and supplies it, so the light emitting unit 25 emits light.

  Specifically, the power cable 199 is disposed in the through hole 121 of the substrate 11 and in the insertion portion 1261 of the support portion 126, one end is connected to the power circuit 90, and the other end is attached to the instrument. Connected to the unit 8. The other end of the power cable 199 is provided with a connector (not shown) that can be attached to and detached from the instrument mounting portion 8. And as shown in FIG. 5, the one end part of the power cable 199 is arrange | positioned at the 2nd main surface 11b side, and the other end part is arrange | positioned at the 1st main surface 11a side. Thereby, a part of the power cable 199 overlaps the substrate 11 in a side view, and the installation space in the height direction (Z-axis direction) of the power cable 199 can be reduced by the thickness of the substrate 11.

  Each of the plurality of circuit components 80 constituting the power supply circuit 90 includes, for example, a capacitive element such as an electrolytic capacitor or a ceramic capacitor, a resistance element, a coil element, a choke coil (choke transformer), a noise filter, and a diode or an integrated circuit element. And the like.

  In the present embodiment, a patterned metal wiring (not shown) is provided only on the first main surface 11a, and a plurality of circuit components 80 are flow-soldered to the metal wiring. It is connected. Therefore, the plurality of circuit components 80 arranged on the second main surface 11b are lead-through mounting type lead components (radial components or axial components). In each circuit component 80 on the second main surface 11b, the lead wire penetrates the substrate 11 and is connected to the metal wiring on the first main surface 11a by solder. Specifically, by inserting the lead wire of the circuit component 80 into the substrate 11 from the second main surface 11b side and immersing the lead wire protruding from the first main surface 11a in the melted solder, the circuit component 80, The metal wiring provided on the first main surface 11a is connected. When the plurality of lead-through mounting type circuit components 80 are combined on the second main surface 11b in this way, the lead wires of these circuit components 80 and the metal wiring on the first main surface 11a are connected to each other by a flow method. Can be connected together by soldering.

  Although not shown, surface-mounted circuit components are also mounted on the first region 13a of the first main surface 11a.

  Moreover, the boundary of the 1st area | region 13a and the 2nd area | region 13b represented by the dashed-dotted line in FIG.3 and FIG.4 does not need to be displayed visually on the board | substrate 11, and a shape is also the board | substrate 11's. The shape does not need to be in line with the outer shape. For example, the boundary between the first region 13a and the second region 13b may be defined by a virtual line circumscribing the power supply circuit 90 configured by a plurality of circuit components 80 in plan view.

[Circuit cover]
FIG. 6 is an exploded perspective view showing the light emitting module 10, the circuit cover 150, and the light source cover 160 according to the embodiment. FIG. 7 is a partial cross-sectional view showing the instrument body 106, the light emitting module 10, the circuit cover 150, and the light source cover 160 according to the embodiment. FIG. 7 is a cross-sectional view of a cut surface parallel to the YZ plane.

  As shown in FIGS. 6 and 7, the circuit cover 150 is a member that covers the first region 13a of the substrate 11 where the power circuit 90 is installed from the first main surface 11a side. The circuit cover 150 includes a first cover 151 and a second cover 152, which are integrated and attached to the substrate 11.

  The first cover 151 is a member that covers a region other than the vicinity of the light emitting element 20a for nightlights in the first region 13a. Specifically, the first cover 151 is formed in an annular shape in plan view with a part cut away. The second cover 152 is fitted into the notch 1515. An opening 1511 is formed at the center of the first cover 151, and the support portion 126 is fitted into the opening 1511. The cover portion 1512 on the outer periphery of the opening 1511 in the first cover 151 is a portion that is formed hollow, and is a portion that substantially covers the first region 13 a of the substrate 11. Note that the cover portion 1512 is formed in a tapered shape gradually toward the ceiling side (Z-axis direction minus side) from the opening 1511 toward the outer peripheral edge. The cover portion 1512 covers the soldered portion of the circuit component 80, the power cable 199, and the like. The cover portion 1512 faces the housing recess 1068 of the instrument main body 106 with the substrate 11 interposed therebetween. A fixing portion 1513 that is fixed to the substrate 11 by a plurality of screws (not shown) is formed on the outer peripheral side of the cover portion 1512 in the first cover 151. The notch 1515 described above is formed in the fixing portion 1513 and the cover portion 1512.

  In the present embodiment, the first cover 151 is made of metal such as iron or aluminum and has nonflammability. In addition, the portion forming the outer surface of the first cover 151 functions as a reflecting surface that reflects the light emitted from the light emitting unit 25.

  The second cover 152 is a member that surrounds the night light emitting element 20a. The second cover 152 is formed of a flame retardant resin. Specifically, the first cover 151 includes a base portion 1521 and a wall portion 1522. The base portion 1521 is formed in a flat plate shape and is arranged in parallel to the substrate 11. The base portion 1521 is formed in a shape that fits into the cutout portion 1515 of the first cover 151 in plan view. The base portion 1521 is formed with a circular opening 1523 in plan view for exposing the light emitting element 20a for nightlight.

  The wall portion 1522 is erected from three sides other than the one side on the outer side of the base portion 1521. The wall portion 1522 is erected along the notch portion 1515 of the cover portion 1512 to close the notch portion 1515. That is, the light emitted from the light emitting unit 25 is prevented from entering the first cover 151 from the notch 1515.

  Here, the case where the first cover 151 is made of metal and the second cover 152 is made of resin is illustrated. However, the first cover 151 may be made of resin and the second cover 152 may be made of metal. Further, both the first cover 151 and the second cover 152 may be made of metal, or both may be made of resin.

  Further, for example, a resin insulating sheet may be disposed on the inner surface of the circuit cover 150. Thereby, the inner surface of the circuit cover 150 can be brought close to the circuit component 80 inside the circuit cover 150, and as a result, the circuit cover 150 can be reduced in size.

[Light source cover]
As shown in FIGS. 6 and 2, the light source cover 160 is a member that covers the plurality of light emitting elements 20 of the light emitting module 10, and is formed of a light-transmitting (for example, transparent) resin or the like. The light source cover 160 is formed in a donut shape, and is fixed to the first main surface 11a of the light emitting module 10 so as to surround the circuit cover 150 and cover the plurality of light emitting elements 20 arranged in an annular shape. The Specifically, the light source cover 160 covers the first light-transmitting cover 161 that covers the plurality of light-emitting elements 20b for illumination on the first main surface 11a side, and the light-emitting element 20a for nightlights on the first main surface 11a side. A second translucent cover 162 is integrally provided.

  The first light transmission cover 161 is an annular portion of the light source cover 160 and includes a plurality of lenses 1611. The plurality of lenses 1611 are provided in one-to-one correspondence with the plurality of light emitting elements 20b. For example, the lens 1611 expands the light distribution angle of light from the corresponding light emitting element 20b. That is, the lens 1611 has a function of diverging light. Thus, by disposing the lens 1611 corresponding to each light emitting element 20b, for example, the diffusion of light from each of the plurality of light emitting elements 20b can be precisely controlled.

  The second translucent cover 162 is a portion protruding inward from the inner edge of the first translucent cover 161. The second translucent cover 162 is disposed to face the base portion 1521 of the second cover 152, thereby covering the light emitting element 20a for nightlight. The second translucent cover 162 has a lens 1621 and expands the light distribution angle of the light from the light emitting element 20a for nightlight. That is, the lens 1621 has a function of diverging light.

  Note that the first light-transmitting cover 161 and the second light-transmitting cover 162 may not include the lenses 1611 and 1621. Further, the entire light source cover 160 may be formed of a light diffusing material (for example, milky white resin). In this case, the entire light source cover 160 may be formed of a light diffusing material, or one of the first light transmitting cover 161 and the second light transmitting cover 162 is formed of a light diffusing material and the other is a lens. May be formed. Further, the first translucent cover 161 and the second translucent cover 162 may be separate bodies. Note that the first light-transmitting cover 161 and the second light-transmitting cover 162 can be made thinner if the structure is provided with a lens than the case where the first light-transmitting cover 161 and the second light-transmitting cover 162 are formed of a light diffusing material.

[Lighting cover]
The illumination cover 140 is a member that covers the side of the instrument main body 106 on which the light emitting module 10 or the like is attached, and is formed of a resin having translucency. The illumination cover 140 is made of, for example, milky white resin, and can diffuse the light from each light emitting element 20 to be emitted to the outside. The illumination cover 140 is detachably attached to the instrument main body 106, for example.

[Effects, etc.]
As described above, according to the present embodiment, the lighting fixture 100 includes the fixture main body 106, the substrate 11 placed on the fixture main body 106, and the first main main body 106 on the side opposite to the fixture main body 106 side. And a plurality of light emitting elements 20 of surface mount type disposed on the surface 11a, and at least one of the light emitting elements 20 is a light emitting element 20a for a nightlight.

  According to this configuration, the night light emitting element 20a is a surface-mounted light emitting element, so that the night light emitting element 20a can be made thinner than a so-called shell-type light emitting element. Although the light-emitting element 20a for nightlights is also a factor in determining the thickness of the lighting fixture 100, the light-emitting element 20a itself for nightlights can be made thin so that the thickness of the lighting fixture 100 itself can be reduced. It is.

  In the case of a shell-type light emitting element, the light emitting element may fall down and adversely affect the appearance. However, in this embodiment, the night light emitting element 20a is a surface-mounted light emitting element. The light-emitting element 20a for nightlight does not fall down. That is, an adverse effect on appearance can be suppressed.

  Further, among the plurality of light emitting elements 20, the other light emitting elements 20b different from the light emitting element 20a for the nightlight are arranged outside the light emitting element 20a for the nightlight in plan view.

  According to this configuration, since the other light emitting elements 20b are arranged outside the light emitting element 20a for nightlights in plan view on the substrate 11, the other light emitting elements 20b and the light emitting elements 20a for nightlights are arranged. The interval can be increased. The voltage difference between the other light emitting elements 20b and the night light emitting element 20a may be increased from the viewpoint of safety. For this reason, if the distance between the other light emitting element 20b and the light emitting element 20a for nightlight is small, a short circuit may occur due to the voltage difference. However, as described above, if the distance between the other light emitting element 20b and the light emitting element 20a for the nightlight can be increased, the occurrence of a short circuit can be suppressed.

  The lighting fixture 100 further includes a first light-transmitting cover 161 that covers the other light-emitting elements 20b on the first main surface 11a side, and a second light-transmitting cover that covers the light-emitting elements 20a for nightlights on the first main surface 11a side. A cover 162.

  According to this structure, when the light emitting element 20a for nightlights becomes thin, the 2nd translucent cover 162 which covers this can also be made thin. The second translucent cover 162 is also a factor for determining the thickness of the lighting fixture 100, but the thickness of the lighting fixture 100 itself can be made thinner by making the second translucent cover 162 thinner. It is.

  The first translucent cover 161 includes a lens 1611 that diffuses light.

  According to this configuration, light can be diffused by the lens 1611 provided in the first translucent cover 161. Therefore, the first light-transmitting cover 161 can be made thinner than the case where the first light-transmitting cover 161 is formed of a material having light diffusibility, and the lighting fixture 100 itself can be made thinner.

  The second light transmission cover 162 includes a lens 1621 that diffuses light.

  According to this configuration, light can be diffused by the lens 1621 provided in the second translucent cover 162. Therefore, the second translucent cover 162 can be made thinner than when the second translucent cover 162 is formed of a light diffusing material, and the lighting fixture 100 itself can be made thinner.

  Moreover, the 1st translucent cover 161 and the 2nd translucent cover 162 are integrated.

  According to this structure, since the 1st translucent cover 161 and the 2nd translucent cover 162 are integrated, the number of parts can be reduced. Moreover, the weight of the whole lighting fixture 100 can also be suppressed.

(Other embodiments)
While the present invention has been described based on the embodiments, the present invention is not limited to the above embodiments. In the following description, the same parts as those in the above embodiment may be denoted by the same reference numerals and the description thereof may be omitted.

  For example, in the above-described embodiment, the case where the light emitting element 20a for nightlight is arranged in the first region 13a and the other light emitting element 20b is arranged in the second region 13b is exemplified. And other light emitting elements 20b may be arranged in the second region 13b.

  FIG. 8 is an enlarged view showing a schematic configuration of a substrate 11C according to a modification. As shown in FIG. 8, in the substrate 11C according to the modification, the light emitting element 20a for nightlight and the other light emitting elements 20b are arranged in the second region 13b. In the substrate 11C, a pair of slits 111 is formed between the light emitting element 20a for nightlight and the other light emitting elements 20b. The pair of slits 111 secures an insulation distance between the light emitting element 20a for nightlight and the other light emitting elements 20b. Thereby, the short circuit resulting from the voltage difference of the light emitting element 20a for nightlights, and the other light emitting element 20b can be suppressed. Note that the width of the slit 111 may be set such that no discharge occurs due to a voltage difference between the light emitting element 20a for nightlight and the other light emitting elements 20b. And if the space | interval of the light emitting element 20a for nightlights and the other light emitting element 20b is taken enough, the slit 111 does not need to be provided.

  In addition to the glass composite substrate and the resin substrate exemplified in the above embodiment, for example, a metal base substrate made of a metal material whose surface is coated with a resin may be employed as the substrate 11 of the light emitting module 10. In this case, for example, heat from the plurality of light emitting elements 20 and the plurality of circuit components 80 that are surface-mounted on the first main surface 11 a of the substrate 11 is efficiently conducted to the instrument body 106 through the substrate 11.

  Moreover, the external shape of the board | substrate 11 is not limited to the external shape shown, for example in FIG. For example, the light emitting module 10 may be provided with an annular substrate 11 having an opening at the center.

  Moreover, the external shape of the instrument main body 106 is not limited to the external shape shown in FIG. For example, the instrument body 106 may have a polygonal outer shape such as a rectangle in a plan view, or may have an outer shape composed of straight lines and curves.

  In addition, the one or more circuit components 80 arranged on the substrate 11 may constitute an electric circuit (electronic circuit) of a different type from the power supply circuit 90. For example, a control circuit that performs dimming control or toning control of the plurality of light emitting elements 20 according to a signal transmitted from the outside of the lighting fixture 100 may be configured by the one or more circuit components 80. Further, the power supply circuit 90 may include the control circuit.

  Moreover, in the said embodiment and modification, the LED element by which the LED chip was packaged as the light emitting element 20 was illustrated. However, other types of solid-state light emitting elements such as a semiconductor light emitting element such as a semiconductor laser or an EL element such as an organic EL (Electro Luminescence) or an inorganic EL may be adopted as the light emitting element 20.

  In addition, the form obtained by making various modifications conceived by those skilled in the art to the above-described embodiment and its modifications, and the components and functions in each embodiment and its modifications without departing from the spirit of the present invention Forms realized by arbitrarily combining these are also included in the present invention.

DESCRIPTION OF SYMBOLS 10 Light emitting module 11, 11C Board | substrate 11a 1st main surface 11b 2nd main surface 20 Light emitting element 20a Light emitting element (light emitting element for night lights)
20b Light emitting element (other light emitting elements)
DESCRIPTION OF SYMBOLS 100 Lighting fixture 106 Appliance main body 161 1st translucent cover 162 2nd translucent cover 1611, 1621 Lens

Claims (6)

An instrument body;
A substrate placed on the instrument body;
A plurality of surface-mounted light emitting elements disposed on the first main surface of the substrate opposite to the instrument main body side, and
A lighting fixture in which at least one of the plurality of light emitting elements is a light emitting element for a nightlight. The light emitting element different from the light emitting element for the nightlight among the plurality of light emitting elements is disposed outside the light emitting element for the nightlight as viewed in a plan view on the substrate. lighting equipment. further,
A first translucent cover that covers the other light emitting elements on the first main surface side;
The lighting fixture according to claim 2, further comprising: a second translucent cover that covers the light emitting element for the nightlight on the first main surface side. The lighting apparatus according to claim 3, wherein the first light-transmitting cover includes a lens that diffuses light. The lighting apparatus according to claim 3, wherein the second light-transmitting cover includes a lens that diffuses light. The lighting fixture according to any one of claims 3 to 5, wherein the first translucent cover and the second translucent cover are integrated.

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