JP2018128297A - Inspection data preparation device and inspection data preparation method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make it possible to facilitate a preparation of reasonable individual inspection data.SOLUTION: An inspection data preparation device is configured to: execute determination reference value calculation processing 86 calculating a determination reference value on the basis of a first differential value between a non-defective product actual measurement result obtained by actually conducting an inspection with one inspection content with respect to a circuit network of an inspection object substrate of a non-defective product and a normal-time inspection result obtained by normal-time simulation processing 84 with the inspection content; in an individual inspection data preparation processing 87, compare the determination reference value with a second differential value between the normal-time inspection result by the normal-time simulation processing 84 with the inspection content and a failure-time inspection result obtained by failure-time simulation processing 85 with the inspection content; when the second differential value exceeds the determination reference value, discriminate that the normal-time inspection result and the failure-time inspection result are different; and determine the inspection content as individual inspection data.SELECTED DRAWING: Figure 3

Description

  The present invention relates to an inspection data creation apparatus and an inspection data creation method for creating individual inspection data for inspecting a plurality of circuit elements constituting a circuit network formed on a substrate to be inspected.

  As this type of inspection data creation device, the applicant of the present application has already proposed the inspection data creation device disclosed in Patent Document 1 below. This inspection data creation device creates individual inspection data when a plurality of circuit elements constituting a circuit network formed on a substrate to be inspected are inspected by contacting a probe to an inspection point connected to the circuit network. A processing unit is provided. In this inspection data creation apparatus, the processing unit inspects the circuit network in the normal state with the inspection contents defined in advance based on the normal circuit net list when all the circuit elements are in the normal state. Normal simulation process to obtain normal inspection results by executing simulation, one circuit element of a plurality of circuit elements is set as an inspection target (inspection target part) as a failure state, and all remaining circuit elements are in a normal state Based on the fault circuit netlist, a simulation process for faults is performed by executing a simulation for inspecting a faulty circuit network with the above test contents, and a test result for faults is obtained. The individual inspection data is used as the data for individual inspection when inspecting this inspection object. To perform data creation process (individual test data creation process).

  Therefore, according to this inspection data creation device, individual inspection data of circuit elements (parts to be inspected) for which inspection points are not set at both ends thereof due to reasons such as being built in the inspection target substrate. It is possible to sufficiently increase the automatic creation rate of the individual inspection data. For this reason, it is possible to sufficiently improve the inspection coverage for the inspection target substrate based on the individual inspection data.

  In addition, even if the circuit elements (all circuit elements including the inspection target) of the network formed on the actual inspection target substrate are normal, each parameter value (for example, when the circuit element is a resistance) Values and capacitance values in the case of capacitors) may vary within the tolerances specified in each product specification.

  However, in this inspection data creation device, the normal inspection result to be compared with the inspection result at the time of failure obtained by the simulation is not defined as the normal inspection result obtained by the simulation, but is specified in advance in the normal inspection result. The upper limit value is obtained by adding the calculated values, and the lower limit value is obtained by subtracting the predetermined value, and the range below the obtained upper limit value and above the lower limit value is compared with the inspection result at the time of failure. It is a normal test result. As a result, in this inspection data creation device, the failure inspection result obtained by the simulation differs from the normal inspection result obtained by the simulation by exceeding a predetermined value (that is, the upper limit of the normal inspection result). Only the inspection content (which is larger than the value or smaller than the lower limit value of the normal inspection result) is created as individual inspection data that can detect a failure of the inspection object (circuit element).

  Accordingly, the circuit element to be inspected is broken by using the individual inspection data thus created by the inspection data creating apparatus in the board inspection apparatus for inspecting the actual inspection target board. Sometimes, it is possible to obtain an inspection result indicating that the inspection object is faulty with sufficiently high accuracy.

Japanese Patent Laying-Open No. 2006-173354 (page 11-20, FIG. 1-5)

  However, the inspection data creation apparatus has the following problems to be improved. That is, in this inspection data creation device, an operator who uses the substrate inspection device for the “predetermined values” for obtaining the above upper limit value and lower limit value as determination reference values for whether or not they differ. Is generally determined and used based on an empirical rule. For this reason, it is difficult for an inexperienced operator who uses the substrate inspection apparatus to determine an appropriate value as a “predefined value” for this inspection data creation apparatus. There is a problem to be improved that it is not easy to create data.

  The present invention has been made in order to improve such a problem, and it is a main object of the present invention to provide an inspection data creation apparatus and an inspection data creation method capable of easily creating appropriate individual inspection data.

  In order to achieve the above object, an inspection data creation apparatus according to claim 1 is configured to include one circuit element among a plurality of circuit elements electrically connected to each other constituting a circuit network formed on a substrate to be inspected. A processing unit for creating individual inspection data for the circuit network when inspecting by inspecting a probe at a test point disposed on the surface of the substrate to be inspected and connected to the circuit network; However, based on a normal circuit net list when all of the plurality of circuit elements are in a normal state, a simulation is performed to inspect the circuit network in a normal state with inspection contents defined in advance. Normal simulation process for obtaining inspection results, one circuit element of the plurality of circuit elements is set as a failure state, and all remaining circuit elements are set as normal states Based on the fault circuit net list of the fault, a simulation process at the time of obtaining a fault test result by executing a simulation to test the circuit network in the fault state with the test content, and the normal test result and the An inspection data creation device that executes an individual inspection data creation process with the inspection content when the inspection result at the time of failure is different from the individual inspection data when the inspection object is inspected, The processing unit is configured to obtain a result of a non-defective product actual measurement result obtained by actually inspecting the circuit network of the non-defective inspection target substrate with the inspection content and a normal inspection result obtained by the normal simulation process. A determination reference value calculation process for calculating a determination reference value based on one difference value is executed, and in the individual inspection data creation process, the normal simulation The second difference value between the normal inspection result obtained in the process and the failure inspection result obtained in the failure simulation process is compared with the determination reference value, and the second difference value determines the determination reference value. When it exceeds, it is determined that the normal inspection result and the failure inspection result are different, and the inspection content at this time is used as the individual inspection data.

  According to a second aspect of the present invention, there is provided an inspection data creation method in which one circuit element of a plurality of circuit elements electrically connected to each other constituting a circuit network formed on an inspection target substrate is provided on a surface of the inspection target substrate. All of the plurality of circuit elements are in a normal state when creating the individual inspection data for the circuit network when inspecting by inspecting the inspection point that is disposed and connected to the circuit network. A normal simulation process for obtaining a normal inspection result by executing a simulation for inspecting the circuit network in a normal state with a predetermined inspection content based on the normal circuit netlist Based on the fault circuit netlist when one circuit element of the elements is to be inspected and is in a fault state and all the remaining circuit elements are in a normal state, A fault simulation process for obtaining a faulty inspection result by executing a simulation for inspecting the circuit network in a faulty state with the inspection content, and when the normal inspection result and the failure inspection result are different A test data creation method for executing an individual test data creation process in which the test content is used as the individual test data when testing the test target. On the other hand, a determination reference value calculation for calculating a determination reference value based on a first difference value between a non-defective product actual measurement result actually inspected with the inspection content and the normal inspection result obtained by the normal simulation process In the individual inspection data creation processing, the normal inspection result and the failure simulation obtained in the normal simulation processing are executed. The second difference value between the failure inspection result obtained in the process is compared with the determination reference value, and the normal inspection result and the failure time when the second difference value exceeds the determination reference value. It is determined that the inspection result is different, and the inspection content at this time is used as the individual inspection data.

  According to the inspection data creation device according to claim 1 and the inspection data creation method according to claim 2, the non-defective product actual measurement result obtained by actually inspecting the circuit network of the non-defective inspection target substrate with one inspection content. And a determination reference value calculation process for calculating a determination reference value based on the first difference value between the normal inspection result obtained by the normal simulation process in the inspection content, and in the individual inspection data creation process, The second difference value between the normal inspection result obtained in the normal simulation process with the inspection content and the fault inspection result obtained in the fault simulation process with the inspection content is compared with the determination reference value to obtain the second When the difference value exceeds the determination reference value, it is determined that the normal inspection result is different from the failure inspection result, and the inspection content is used as individual inspection data.

  Therefore, according to the inspection data creation apparatus and the inspection data creation method, the “preliminary value” used when determining the upper limit value and the lower limit value as the determination reference values as to whether or not the normal inspection result is different from the normal inspection result is determined. Unlike conventional inspection data creation devices and inspection data creation methods that have determined `` specified values' 'based on workers' empirical rules, they are based on non-defective product measurement results that can be obtained without empirical rules. As a result of the determination of the determination reference value, even an inexperienced operator using the substrate inspection apparatus can easily create appropriate individual inspection data.

1 is a configuration diagram of an inspection data creation device 11. FIG. It is explanatory drawing for demonstrating operation | movement (inspection data creation method) of the test data creation apparatus. It is a flowchart about the test data creation process 80 for demonstrating operation | movement (test data creation method) of the test data creation device 11.

  Hereinafter, embodiments of an inspection data creation apparatus and an inspection data creation method will be described with reference to the accompanying drawings.

  First, the configuration of the inspection data creation apparatus will be described with reference to the drawings.

  An inspection data creation device 11 as an inspection data creation device shown in FIG. 1 includes, as an example, an input unit 12, a processing unit 13, a storage unit 14, and an output unit 15, and includes design data ( Inspection based on design data (Dde) for circuit board to be inspected, specification data Dsp of board inspection apparatus for inspecting this circuit board, and non-defective product actual measurement result REm obtained in advance from non-defective product for inspection target board Individual used in board inspection equipment when individually inspecting circuit elements (for example, individual electronic components such as resistors, capacitors, coils, and ICs) constituting each of the plurality of circuit networks included in the target board The inspection data Dte can be automatically created by simulation.

  The design data Dde indicates information indicating the specifications of all electronic components mounted on the circuit board (inspection target board) to be inspected by the board inspection apparatus, and the shape of the conductor pattern that connects the electronic parts. Information, information indicating mounting positions of all electronic components in the conductor pattern, and inspection points provided in advance at predetermined positions on the conductor pattern located on the surface of the circuit board for each circuit network for inspection of circuit elements It is assumed that information indicating the position is included.

  The board inspection apparatus using the individual inspection data Dte includes a plurality of probes, a probe moving mechanism, a signal generation unit capable of generating various electrical signals, and a measurement unit for measuring electrical signals. The function of outputting an electrical signal (voltage or current) for inspection to the inspection point of the network via this output probe by causing any of these probes to function as an output probe, any other probe of the probes Function as an input probe to input an electrical signal generated at the inspection point of the network due to the output of the electrical signal to the network through the input probe, and through the input probe. Based on the input electrical signal (or both the input electrical signal and the above output electrical signal) It has a function to measure the meter.

  Moreover, this board | substrate inspection apparatus exhibits said each function based on the data Dte for individual test | inspection created with the test data creation apparatus 11, and among the some test | inspection points provided for every circuit network. Using the inspection point indicated by the individual inspection data Dte, a circuit network (included in the circuit network) by the inspection function fc indicated by the individual inspection data Dte out of one or two or more inspection functions fc Circuit elements) can be inspected.

  As an example of these inspection functions fc, this board inspection apparatus measures the impedance or resistance value (impedance as an example in this example) between a pair of inspection points provided in the circuit network, and is included in this circuit network. Impedance inspection function for inspecting circuit elements (inspection object), applying a voltage between a pair of inspection points provided in the network, and a current (current value or current) generated between the pair of inspection points when this voltage is applied Waveform) and the voltage (voltage value or voltage waveform) or current (current value or current waveform) generated between another pair of inspection points provided in the network is included in this circuit network. Voltage inspection (voltage application inspection) function for inspecting circuit elements, and when applying current between a pair of inspection points provided in the network, A voltage (voltage value or voltage waveform) generated between a pair of inspection points, or a voltage (voltage value or voltage waveform) or current (current value or current waveform) generated between another pair of inspection points provided in the network It is assumed that a current inspection (current application inspection) function for inspecting circuit elements included in the circuit network is provided by measurement. Therefore, the specification data Dsp for the board inspection apparatus input by the inspection data creation apparatus 11 includes information indicating such an inspection function fc of the board inspection apparatus, and is used when inspecting circuit elements. It is assumed that information indicating a circuit network (a defined circuit network including this circuit element) is included corresponding to each circuit element.

  Further, the non-defective product measurement result REm is obtained by actually inspecting a non-defective product of a circuit board to be inspected using a substrate inspection apparatus, and more specifically, a plurality of circuit networks (normal circuit networks) existing on the circuit board. Among all of the circuit networks including the circuit element to be inspected, one inspection function fc of the plurality of inspection functions fc and this of the plurality of inspection points existing in the circuit network Changing the inspection function fc to perform measurement by bringing a probe (either an output probe or an input probe) corresponding to the inspection function fc into contact with an inspection point corresponding to one inspection function fc Thus, it is acquired for each inspection content (measurement result) and is acquired in advance. In this case, this inspection content means which inspection function fc of each inspection function fc is used when the circuit board inspection apparatus inspects circuit elements to be inspected constituting a predetermined circuit network. Indicates inspection conditions relating to the inspection such as which of the probes function as an output probe and an input probe corresponding to the inspection function fc, and which inspection point the output probe and the input probe that function in this manner are brought into contact with. .

  For example, the input unit 12 includes an external interface circuit, and receives the design data Dde, the specification data Dsp, and the non-defective product actual measurement result REm transmitted from the external device, and outputs them to the processing unit 13.

  As an example, the processing unit 13 is configured by a computer, and reads out and executes an operation program stored in the storage unit 14 to execute design data Dde, specification data Dsp, and non-defective product measurement results output from the input unit 12. Storage processing for inputting REm and storing it in the storage unit 14, inspection data for creating individual inspection data Dte by simulation based on the design data Dde, specification data Dsp and non-defective product actual measurement result REm stored in the storage unit 14 A creation process 80 (see FIG. 3) and an output process for outputting the created individual inspection data Dte to the output unit 15 are executed.

  The storage unit 14 includes, for example, a hard disk drive (HDD), a semiconductor memory such as a RAM, and the like. In addition, the storage unit 14 stores in advance an operation program of the processing unit 13 (including a program for causing the processing unit 13 to execute the inspection data creation processing 80), as well as design data Dde, specification data Dsp, and non-defective products. The actual measurement result REm and the individual inspection data Dte are stored. For example, the output unit 15 includes an external interface circuit, inputs the individual test data Dte output from the processing unit 13, and supplies the individual test data to an external device connected to the external interface circuit. Data Dte is output. The individual inspection data Dte defines (identifies) the above-described inspection contents when the substrate inspection apparatus inspects the circuit elements to be inspected constituting the circuit network.

  Next, an inspection data creation method will be described with reference to the drawings along with the operation of the inspection data creation apparatus 11.

  In the inspection data creation device 11, the processing unit 13 executes the inspection data creation processing 80 shown in FIG. 3, so that a circuit element (specification) to be inspected among circuit elements mounted on the inspection target board is specified. The individual inspection data Dte for inspecting a circuit element) by a substrate inspection apparatus is automatically created. First, the basic principle of this inspection data creation processing 80 (inspection data creation method) will be described. To do.

  In this inspection data creation method, a simulation (inspection simulation) with one inspection content is performed when all circuit elements constituting one circuit network (also referred to as a specific circuit network) including a specific circuit element are normal (circuit element Execute using this normal network netlist (normal circuit netlist) for this network (also called normal network) in which the parameter value is the nominal value described in specifications such as catalogs) Then, the simulation result (normal inspection result) is obtained. In addition, a simulation with the same inspection content is performed on the circuit network (also referred to as a failure circuit network) in which only one of the circuit elements constituting the specific circuit network is in a failure state. Execute using the netlist (failure circuit netlist) (execution of failure simulation processing) for all fault circuit networks while changing the circuit element to be in the failure state (simulation processing at failure) ) To obtain simulation results (failure inspection results) for all of the fault networks.

  And when there is an inspection content in which there is only one different from the normal inspection result with the same inspection content among the inspection results at the time of each inspection content obtained in this way, By executing the inspection specified by the one inspection content in the board inspection apparatus for the specific circuit network, one circuit element (in the failure circuit network in which this one-time inspection result is obtained) It is possible to check whether the specific circuit element is normal or has failed. From this, it is based on the logic that this one inspection content can be used as the individual inspection data Dte when inspecting this one specific circuit element of this specific circuit network by the substrate inspection apparatus.

  In the inspection data creation process 80, the processing unit 13 first executes a component selection process (step 81). In this component selection process, the processing unit 13 is based on the design data Dde stored in the storage unit 14 and is a specific circuit element (hereinafter referred to as an inspection target) to be inspected among circuit elements mounted on the inspection target board. One (also referred to as part ob) is selected. In this example, in order to facilitate understanding, it is assumed that the circuit element A in the circuit network (specific circuit network) including only the circuit elements A, B, and C is selected as the inspection object part ob. .

  Next, the processing unit 13 executes a normal net list creation process (step 82). In the normal net list creation process, the processing unit 13 creates a normal circuit net list for the specific circuit network including the inspection target component ob selected in step 81 as the normal circuit net list NEno, and also checks the inspection target component ob. And stored in the storage unit 14. In this case, the normal circuit network means a circuit network when all circuit elements (in this example, circuit elements A, B, and C) included in the circuit network including the inspection target part ob are normal. In addition, it is assumed that the created normal circuit netlist NEno includes information (for example, number names) of inspection points used when inspecting the inspection target component ob.

  Subsequently, the processing unit 13 executes a failure net list creation process (step 83). In this fault net list creation process, the processing unit 13 sets each of the circuit elements A, B, and C included in the specific circuit network as a fault state independently based on the normal circuit net list NEno created in step 82. The fault circuit network is created as a fault circuit network, and a net list of the fault circuit network is created as a fault circuit net list NEab, and stored in the storage unit 14 in correspondence with the inspection object part ob.

  Thereby, in this example, the processing unit 13 has a fault circuit netlist NEabA, a circuit that is a netlist of a fault circuit network when only the circuit element A is in a fault state (that is, the remaining circuit elements B and C are normal). A fault circuit netlist NEabB which is a net list of a fault circuit network when only the element B is in a fault state, and a fault circuit netlist NEabC which is a net list of the fault circuit network when only the circuit element C is in a fault state It is created (see FIG. 2) and stored in the storage unit 14 in association with the inspection object part ob. In this case, the fault circuit netlists NEabA, NEabB, and NEabC (hereinafter also referred to as the fault circuit netlist NEab when not particularly distinguished) also include information on the inspection points used when inspecting the inspection target part ob. . In addition, for example, the above-described failure states of circuit elements may be various failure states such as disconnection, short circuit, and constant error.

  Next, the processing unit 13 executes a normal simulation process (step 84). In the normal simulation process, the processing unit 13 uses the normal circuit netlist NEno of the normal circuit network created in step 82 to check each inspection indicated by the inspection contents 1, 2, and 3 for this normal circuit network. Are sequentially executed by simulation, and the normal inspection result REno1 when inspected with inspection content 1, the normal inspection result REno2 when inspected with inspection content 2, and the normal inspection when inspected with inspection content 3 The results REno3 (hereinafter referred to as normal test results REno when the normal test results REno1, REno2, and REno3 are not particularly distinguished) are obtained (see FIG. 2) and stored in the storage unit 14.

  Subsequently, the processing unit 13 executes a failure simulation process (step 85). In this failure simulation process, the processing unit 13 indicates the inspection contents 1, 2, and 3 using the failure circuit netlist NEab corresponding to the failure circuit network for all the failure circuit networks created in step 83. By executing each inspection sequentially by simulation, a failure inspection result REab for each inspection content 1, 2 and 3 for each fault network is obtained and stored in the storage unit 14.

  Accordingly, in this example, the processing unit 13 has a failure inspection result REabA1 when the failure circuit network in which only the circuit element A is in a failure state (circuit network indicated by the failure circuit netlist NEabA) is inspected by the inspection content 1. Failure test result REabA2 when the same fault network is tested with test content 2, and failure test result REabA3 when the same fault network is tested with test content 3 (hereinafter referred to as failure test results REabA1, REabA2) , REabA3 are also referred to as failure inspection results REabA) (see FIG. 2) and stored in the storage unit 14. In addition, the processing unit 13 has a failure inspection result REabB1 when the failure circuit network in which only the circuit element B is in a failure state (circuit network indicated by the failure circuit netlist NEabB) is inspected by the inspection content 1, this same failure circuit. Failure inspection result REabB2 when the network is inspected with inspection content 2, and failure inspection result REabB3 when the same fault network is inspected with inspection content 3 (hereinafter, failure inspection results REabB1, REabB2, and REabB3 are When they are not distinguished from each other, they are also obtained (referred to as failure inspection results REabB) (see FIG. 2) and stored in the storage unit 14. Further, the processing unit 13 has a failure inspection result REabC1 when the failure circuit network in which only the circuit element C is in a failure state (a circuit network indicated by the failure circuit netlist NEabC) is inspected by the inspection content 1, this same failure circuit. Failure inspection result REabC2 when the network is inspected with inspection content 2, and failure inspection result REabC3 when the same fault network is inspected with inspection content 3 (hereinafter referred to as failure inspection results REabC1, REabC2, and REabC3) When they are not distinguished from each other, they are also obtained (referred to as a failure inspection result REabC) (see FIG. 2) and stored in the storage unit 14.

  Next, the processing unit 13 executes a determination reference value calculation process (step 86). In this determination reference value calculation process, the processing unit 13 uses the individual inspection data REabA, REabB, and REabC for each normal inspection result REno for each inspection content in the individual inspection data creation process (step 87) described later. The determination reference value ST for determining whether or not are different is calculated and stored in the storage unit 14.

  In this example, for the inspection content 1, the processing unit 13 actually performs the inspection with the same inspection content 1 on the specific circuit network from the non-defective product actual measurement result REm stored in the storage unit 14. The non-defective product actual measurement result REm1 actually measured in the inspection is read, and the determination reference value ST1 is calculated based on the first difference value X1 (= | REno1-REm1 |) between the good product actual measurement result REm1 and the normal inspection result REno1. . In addition, the processing unit 13 also applies to the specific circuit network from the non-defective product actual measurement results REm stored in the storage unit 14 in the same manner as the above-described inspection content 1 for the inspection contents 2 and 3. The non-defective product actual measurement results REm2 and 3 actually measured in the inspection actually performed by the board inspection apparatus with the inspection contents 2 and 3 are read, and the first difference value X2 (= |) between the non-defective product actual measurement result REm2 and the normal inspection result REno2 is read. The determination reference value ST2 is calculated based on REno2-REm2 |), and the determination reference value ST3 based on the first difference value X3 (= | REno3-REm3 |) between the non-defective product actual measurement result REm3 and the normal inspection result REno3. Is calculated. In addition, the processing unit 13 stores the calculated determination reference values ST1, ST2, ST3 (hereinafter, also referred to as the determination reference value ST unless otherwise distinguished) in the storage unit 14. In this example, as an example, the processing unit 13 calculates the first difference values X1, X2, and X3 (hereinafter, also referred to as the first difference value X when not particularly distinguished) as the determination reference values ST1, ST2, and ST3, respectively. Shall.

  Next, the processing unit 13 executes individual inspection data creation processing (step 87). In this individual inspection data creation process, the processing unit 13 determines whether or not each failure inspection result REabA, REabB, REabC is different from the normal inspection result REno for each of the inspection contents 1, 2, and 3. The determination is made using the determination reference values ST1, 2, and 3.

  Specifically, for the inspection content 1, the processing unit 13 sets the second difference value XA1 (= | REno1-REabA1 |) between the normal inspection result REno1 and the failure inspection result REabA1, the normal inspection result REno1 and the failure. The second difference value XB1 (= | REno1-REabB1 |) between the normal inspection result REabB1 and the second differential value XC1 (= | REno1-REabC1 |) between the normal inspection result REno1 and the failure inspection result REabC1 are calculated. . Next, each second difference value XA1, XB1, XC1 is compared with the determination reference value ST1 (in this example, the first difference value X1), and the second difference value exceeding the determination reference value ST1 is calculated. The inspection result REab is determined to be different from the normal inspection result REno1, while the failure inspection result REab for which the second difference value equal to or less than the determination reference value ST1 is calculated is the normal inspection result REno1. It is determined that there is no difference.

  Similarly, for the inspection content 2, the processing unit 13 also applies the second difference value XA2 (= | REno2−REabA2 |) between the normal inspection result REno2 and the failure inspection result REabA2, the normal inspection result REno2 and the failure time. A second difference value XB2 (= | REno2-REabB2 |) between the inspection result REabB2 and a second difference value XC2 (= | REno2-REabC2 |) between the normal inspection result REno2 and the failure inspection result REabC2 are calculated. Next, each second difference value XA2, XB2, XC2 is compared with the determination reference value ST2 (in this example, the first difference value X2), and the second difference value exceeding the determination reference value ST2 is calculated. The inspection result REab is determined to be different from the normal inspection result REno2, while the failure inspection result REab for which the second difference value equal to or less than the determination reference value ST2 is calculated is the normal inspection result REno2. It is determined that there is no difference.

  Further, for the inspection content 3, the processing unit 13 also sets the second difference value XA3 (= | REno3-REabA3 |) between the normal inspection result REno3 and the failure inspection result REabA3, the normal inspection result REno3, and the failure inspection result. A second difference value XB3 (= | REno3-REabB3 |) from REabB3 and a second difference value XC3 (= | REno3-REabC3 |) between the normal inspection result REno3 and the failure inspection result REabC3 are calculated. Next, each second difference value XA3, XB3, XC3 is compared with the determination reference value ST3 (in this example, the first difference value X3), and the second difference value exceeding the determination reference value ST3 is calculated. The inspection result REab is determined to be different from the normal inspection result REno3. On the other hand, the failure inspection result REab for which the second difference value equal to or less than the determination reference value ST3 is calculated is the normal inspection result REno3. It is determined that there is no difference. Hereinafter, when the second difference values XA1, XA2, and XA3 are not particularly distinguished, they are also referred to as second difference values XA. When the second difference values XB1, XB2, and XB3 are not particularly distinguished, they are also referred to as second difference values XB. When the two difference values XC1, XC2, and XC3 are not particularly distinguished, they are also referred to as second difference values XC.

  As a result of the above determination, as shown in FIG. 2, in the simulation result with the inspection content 1, only the failure inspection result REabA1 with a □ mark is different from the normal inspection result REno1, and the simulation result with the inspection content 2 Therefore, none of the inspection results REabA2, REabB2, and REabC2 at the time of failure is different from the inspection result REno2 at the time of normality. Assume that the state is different from the normal test result REno3.

  In this case, the inspection content 1 can detect by simulation whether or not only the circuit element A selected as the inspection target component ob has failed. From this, the processing unit 13 selects the inspection content 1 as the individual inspection data Dte when inspecting whether the circuit element A is normal or defective by the substrate inspection apparatus, and stores it in the storage unit 14. Let On the other hand, since it is impossible to detect any failure state of the circuit elements A, B, and C in the simulation with the inspection content 2, the processing unit 13 does not use the inspection content 2 as the individual inspection data Dte. Shall. Further, in the simulation with the inspection content 3, it is possible to detect a state in which one of the circuit elements A and B is faulty, but it is not possible to specify which one of the circuit elements A and B is faulty. Therefore, the processing unit 13 does not use the inspection content 3 as the individual inspection data Dte.

  Accordingly, in this example, the inspection content 1 is stored in the storage unit 14 as the individual inspection data Dte of the circuit element A selected as the inspection target component ob by executing the individual inspection data creation processing in step 87. . In the above example, if there is no failure-time inspection result REab that is different from the normal-time inspection result REno1 even in the inspection content 1, the processing unit 13 selects the circuit element A selected as the inspection target component ob. The storage unit 14 stores that the individual inspection data Dte cannot be created.

  Subsequently, based on the design data Dde stored in the storage unit 14, the processing unit 13 relates to all circuit elements (inspection target parts ob) to be inspected among circuit elements mounted on the inspection target board. Then, it is determined whether or not each process of Step 82 to Step 87 has been executed (Step 88), and when the execution of these processes for all the inspection target parts ob is not completed, the process returns to Step 81 described above, Steps 81 to 87 are repeated. Thereby, the test data creation device 11 creates individual test data Dte for many test target parts ob among all test target parts ob existing on the test target board by simulation. Further, the processing unit 13 completes the inspection data creation processing 80 when the execution of each processing of Step 82 to Step 87 is completed for all the inspection target parts ob. Finally, the processing unit 13 executes output processing, reads out individual inspection data Dte for each inspection target part ob created in the inspection data creation processing 80 and stored in the storage unit 14, and outputs the output unit 15 is output.

  As described above, in the inspection data creation apparatus 11 and the inspection data creation method, in the individual inspection data creation processing in step 87, each of the inspection contents 1, 2, and 3 is subjected to each normal inspection result REno. When determining whether or not the inspection results REabA, REabB, and REabC at the time of failure are different, calculation is performed in the determination reference value calculation process in step 86 based on the non-defective product actual measurement result REm obtained in advance from the non-defective product for the inspection target substrate. The determination is made using the determined reference value ST.

  Therefore, according to the inspection data creation device 11 and the inspection data creation method, the “predetermined value” for obtaining the upper limit value and the lower limit value as the determination reference values as to whether or not they are different is set by the operator. Unlike conventional inspection data creation apparatuses and inspection data creation methods that are determined based on empirical rules, the determination reference value ST is determined based on non-defective product actual measurement results REm that can be determined without empirical rules. As a result, even an inexperienced operator using the substrate inspection apparatus can easily create appropriate individual inspection data Dte.

  In the inspection data creation device 11 and the inspection data creation method, the first difference value X itself between the non-defective product actual measurement result REm and the normal inspection result REno is determined in the calculation of the determination reference value ST in Step 86. Calculated as the reference value ST, and in the individual inspection data creation process in step 87, the determination reference value ST and the second difference value XA between the normal inspection result REno and each of the inspection inspection results REabA, REabB, REabC. Although the structure which compares XB and XC is employ | adopted, it is not limited to this. For example, in the calculation of the determination reference value ST in step 86, based on the first difference value X between the non-defective product actual measurement result REm and the normal inspection result REno, specifically, the normal inspection result for the first difference value X. The absolute value of the ratio with respect to REno is calculated as the determination reference value ST, and in the individual inspection data creation process in step 87, based on the second difference values XA, XB, XC, specifically, the second difference value XA, The absolute value of the ratio with respect to the normal test result REno for XB and XC is calculated, and the absolute value of the calculated ratio is compared with the determination reference value ST configured by the absolute value of the ratio calculated as described above. A configuration can also be adopted.

DESCRIPTION OF SYMBOLS 11 Inspection data creation apparatus 80 Inspection data creation processing 81 Parts selection processing 82 Normal net list creation processing 83 Fault net list creation processing 84 Normal time simulation processing 85 Failure time simulation processing 86 Judgment reference value calculation processing 87 Individual inspection data creation processing

Claims (2)

An inspection in which one circuit element among a plurality of circuit elements electrically connected to each other constituting a circuit network formed on the inspection target substrate is disposed on the surface of the inspection target substrate and connected to the circuit network. A processing unit for creating data for individual inspection for the circuit network when inspecting with a probe in contact with a point,
Based on a normal circuit netlist when all the plurality of circuit elements are in a normal state, the processing unit executes a simulation for inspecting the circuit network in a normal state with a predetermined inspection content. A normal simulation process for obtaining a normal inspection result, a failure circuit netlist when one circuit element of the plurality of circuit elements is in a failure state and all the remaining circuit elements are in a normal state. Based on the above, the simulation processing at the time of failure is performed by executing a simulation to inspect the circuit network in the failure state with the inspection content, and the inspection result at the time of failure is different from the inspection result at the time of failure. The data for inspection is used as the data for individual inspection when inspecting the inspection object. A test data creation apparatus for performing the process,
The processing unit is configured to obtain a result of a non-defective product actual measurement result obtained by actually inspecting the circuit network of the non-defective inspection target substrate with the inspection content and a normal inspection result obtained by the normal simulation process. A determination reference value calculation process for calculating a determination reference value based on one difference value is executed,
In the individual inspection data creation process, the second difference value between the normal inspection result obtained in the normal simulation process and the failure inspection result obtained in the failure simulation process is compared with the determination reference value. When the second difference value exceeds the determination reference value, it is determined that the normal inspection result is different from the failure inspection result, and the inspection content at this time is determined as the individual inspection. Inspection data creation device for use as data. An inspection in which one circuit element among a plurality of circuit elements electrically connected to each other constituting a circuit network formed on the inspection target substrate is disposed on the surface of the inspection target substrate and connected to the circuit network. When creating data for individual inspection for the circuit network when inspecting with a probe in contact with a point,
Based on a normal circuit net list when all the plurality of circuit elements are in a normal state, a normal inspection result is executed by executing a simulation for inspecting the circuit network in a normal state with a predetermined inspection content. Normal time simulation processing,
Based on a fault circuit net list when one circuit element of the plurality of circuit elements is in a fault state as a test target and all the remaining circuit elements are in a normal state, the circuit network in the fault state is A simulation process at the time of failure to obtain a result of inspection at the time of failure by executing a simulation to be inspected with the inspection content,
And an inspection for executing an individual inspection data creation process in which the inspection contents when the normal inspection result and the failure inspection result are different are used as the individual inspection data when the inspection object is inspected. Data creation method,
Based on the first difference value between the non-defective product actual measurement result obtained by actually inspecting the circuit network of the non-defective inspection target substrate with the inspection content and the normal inspection result obtained by the normal simulation processing. To execute a determination reference value calculation process for calculating the determination reference value,
In the individual inspection data creation process, the second difference value between the normal inspection result obtained in the normal simulation process and the failure inspection result obtained in the failure simulation process is compared with the determination reference value. When the second difference value exceeds the determination reference value, it is determined that the normal inspection result is different from the failure inspection result, and the inspection content at this time is determined as the individual inspection. Data creation method for inspection.

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