JP2018120823A - Method for manufacturing display panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a display panel capable of suppressing a sharp rise in manufacturing cost or to provide a method for manufacturing a display panel capable of suppressing a longer manufacturing time.SOLUTION: A method for manufacturing a display panel comprises: a preparing step of preparing a display mother board including a display region and a pad region MT; a first sticking step of sticking a first resin substrate to the display region; a first resin applying step of applying a first curable resin RE1 to a first non-sticking region Ab1; a curing step of curing the first curable resin; a transporting step of transporting the display mother board after the curing step; a peeling step of peeling the first curable resin after the transporting step; and a cutting step of cutting the display mother board into a plurality of display panels after the transporting step.SELECTED DRAWING: Figure 11

Description

  Embodiments described herein relate generally to a method for manufacturing a display panel.

In recent years, commercialization of sheet-like display devices using flexible substrates has been promoted. Sheet-like display devices are attracting attention as lightweight and thin display devices. A display panel of a sheet-like display device has a flexible insulating layer. For the insulating layer, for example, a PI film (polyimide precursor solution film made of a coating film of a polyimide precursor-containing solution) is used.
In the manufacturing process of the display panel, the insulating layer and the like are formed on a glass substrate as a base material to prepare a display mother substrate. In a subsequent manufacturing process, the insulating layer is peeled off from the glass substrate by applying laser light to the insulating layer.

  By the way, the display mother substrate in a state where the glass substrate is separated has low strength and is difficult to handle. Therefore, it becomes difficult to implement the manufacturing process after separating the glass substrate on the display mother substrate. However, it is difficult to attach a sheet member such as a polarizing plate attached to the display mother board of the final product to the display mother board immediately after separating the glass. The reason is that the sheet member is provided with a plurality of openings as shown in FIGS. 9 and 12, which will be described later, and this opening makes it difficult to handle the display mother board during the manufacturing process. .

In addition, a technique of attaching a resin sheet having no opening to a display mother substrate as a temporary indirect material after separating the glass substrate is also considered. It is conceivable to reinforce the display mother substrate with the glass substrate separated therefrom.
However, this indirect material is not used as part of the final product because it is peeled off and discarded when the above-described sheet member is applied. For this reason, the use of the indirect material as described above causes an increase in manufacturing cost.
Moreover, the process of attaching an indirect material to a display mother board | substrate at the time of manufacture, and the process of removing an indirect material from a display mother board | substrate after that are needed. For this reason, the use of the indirect material as described above leads to an increase in manufacturing time.

US Patent Application Publication No. 2015/044442

  The present embodiment provides a display panel manufacturing method capable of suppressing an increase in manufacturing cost. Alternatively, a method for manufacturing a display panel capable of suppressing an increase in manufacturing time is provided.

A method of manufacturing a display panel according to an embodiment is as follows:
A preparation step of preparing a display mother substrate having a display region and a pad region; a first pasting step of attaching a first resin substrate to the display region; and a region including the pad region, wherein the first resin substrate is A first resin application step of applying a first curable resin to a first non-attached region that is not attached, a hardening step of hardening the first curable resin, and the display mother board after the hardening step A transport step for transporting the substrate, a stripping step for stripping the first curable resin from the first non-sticking region after the transport step, and cutting the display mother board into a plurality of display panels after the transport step. A cutting step.

FIG. 1 is a perspective view illustrating a configuration of a display device according to an embodiment. FIG. 2 is a cross-sectional view showing a display area of the display device shown in FIG. FIG. 3 is another cross-sectional view showing the display device shown in FIG. 1, and shows a non-display area and the like. FIG. 4 is a cross-sectional view showing the display device, and is a view showing a state in which a bending region of the display panel is bent. FIG. 5 is a flowchart for explaining the manufacturing method of the display device according to the embodiment. FIG. 6 is a view for explaining the method of manufacturing the display device according to the embodiment, and is a cross-sectional view showing a state in which the first insulating substrate, the first pattern layer, and the sealing layer are formed on the substrate. is there. FIG. 7 is a perspective view showing the substrate and the display mother substrate shown in FIG. FIG. 8 is a cross-sectional view showing the substrate and the display mother substrate taken along line VIII-VIII in FIG. FIG. 9 is a perspective view showing the polarizing plate for explaining the manufacturing method. FIG. 10 is a view for explaining the manufacturing method subsequent to FIGS. 6 to 9, and is a cross-sectional view showing a state where a polarizing plate is attached to a display mother substrate. FIG. 11 is a view for explaining the manufacturing method following FIG. 10, and is a cross-sectional view showing a state in which the first curable resin is applied to the first non-sticking region. FIG. 12 is a perspective view showing a resin substrate for explaining the manufacturing method. FIG. 13 is a diagram for explaining the manufacturing method subsequent to FIGS. 11 and 12, in which a resin substrate is attached to a display mother substrate, and a second curable resin is applied to a second non-attached region. It is sectional drawing which shows a state and the state which has cut | disconnected the display mother board | substrate etc. in order to isolate | separate into a single display panel. FIG. 14 is a view for explaining the manufacturing method after FIG. 13, and is a cross-sectional view for explaining the step of pressure-bonding the wiring board to the display panel and the step of forming the protective layer. FIG. 15 is a diagram for explaining the manufacturing method after FIG. 14 and is a cross-sectional view showing a state in which the display panel is cut off in order to adjust the outer shape of the display panel. FIG. 16 is a diagram for explaining a method of manufacturing a display device according to the first modification of the embodiment, in which the first curable resin is applied to both the first pasting region and the first non-sticking region. It is sectional drawing which shows a state. FIG. 17 is a diagram for explaining a method of manufacturing the display device according to the second modification of the embodiment, in which the second curable resin is applied to both the second pasting region and the second non-sticking region. It is sectional drawing which shows a state. FIG. 18 is a view for explaining the manufacturing method of the display device according to the modification 4 of the embodiment, and is a perspective view showing a polarizing plate. FIG. 19 is a perspective view illustrating a polarizing plate for explaining a method for manufacturing a display device according to the sixth modification of the embodiment. FIG. 20 is a cross-sectional view showing a display device according to Modification 8 of the above-described embodiment, and shows a non-display area and the like. FIG. 21 is a view for explaining the method for manufacturing the display device according to the modified example 8, and is a perspective view showing a resin substrate.

  Embodiments and modifications of the present invention will be described below with reference to the drawings. It should be noted that the disclosure is merely an example, and those skilled in the art can easily conceive of appropriate modifications while maintaining the gist of the invention are naturally included in the scope of the present invention. In addition, for the sake of clarity, the drawings may be schematically represented with respect to the width, thickness, shape, etc. of each part as compared to the actual embodiment, but are merely examples, and the interpretation of the present invention is not limited. It is not limited. In addition, in the present specification and each drawing, elements similar to those described above with reference to the previous drawings are denoted by the same reference numerals, and detailed description may be omitted as appropriate.

  Further, in this specification, “α includes A, B or C”, “α includes any of A, B and C”, “α is one selected from the group consisting of A, B and C” The expression “including” does not exclude the case where α includes a plurality of combinations of A to C unless otherwise specified. Furthermore, these expressions do not exclude the case where α includes other elements.

(One embodiment)
A method for manufacturing a display device according to an embodiment will be described. First, the structure of the display device manufactured by the above manufacturing method will be described. FIG. 1 is a perspective view illustrating a configuration of a display device DSP according to an embodiment.

  As shown in FIG. 1, the first direction X and the second direction Y are orthogonal to each other. The third direction Z is orthogonal to the first direction X and the second direction Y, respectively. Unlike the present embodiment, the first direction X and the second direction Y may intersect at an angle other than 90 °. Hereinafter, in this embodiment, the case where the display device is an organic electroluminescence (EL) display device will be described.

  In the present embodiment, the side from the first insulating substrate 10 toward the electro-optic element (the direction toward the tip of the arrow in the third direction Z) is defined as up or upward, and the direction toward the tip of the arrow in the third direction Z The direction opposite to is defined as down or down.

  In the following description (excluding claims), the following terms are used for convenience and defined. In the case of “the second member above the first member” and “the second member below the first member”, the second member may be in contact with the first member, or located away from the first member. You may do it. In the latter case, a third member may be interposed between the first member and the second member. On the other hand, in the case of “second member above the first member” and “second member below the first member”, the second member is in contact with the first member.

  The display device DSP includes a display panel PNL, a wiring board 1, and a wiring board 2. The display panel PNL includes a flat plate-like first substrate SUB1, a flat plate-like polarizing plate POL disposed to face the first substrate SUB1, and a resin substrate 5. In the present embodiment, the display panel PNL is an organic EL display panel having an organic EL element OLED as an electro-optic layer.

  The display panel PNL includes a display area DA that displays an image and a non-display area NDA other than the display area DA. The display panel PNL includes a plurality of pixels PX in the display area DA. The plurality of pixels PX are arranged in the first direction X and the second direction Y and are provided in a matrix.

  The first substrate SUB1 has a pad region MT located outside the region overlapping with the polarizing plate POL. More specifically, the three side edges of the first substrate SUB1 are aligned with the three side edges of the polarizing plate POL in the third direction Z. The length of the side edge parallel to the first direction X of the first substrate SUB1 is substantially equal to the length of the side edge parallel to the first direction X of the polarizing plate POL. Further, the length of the side edge parallel to the second direction Y of the first substrate SUB1 is larger than the length of the side edge parallel to the second direction Y of the polarizing plate POL. That is, the area parallel to the XY plane of the first substrate SUB1 is larger than the area parallel to the XY plane of the polarizing plate POL. Here, the XY plane is a plane defined by the first direction X and the second direction Y.

In the illustrated example, the wiring board 1 is mounted above the pad area MT in the non-display area NDA. In the illustrated example, the length of the side edge parallel to the first direction X of the wiring board 1 is smaller than the length of the side edge parallel to the first direction X of the first substrate SUB1 and the polarizing plate POL. It may be equivalent. The display panel PNL and the wiring board 1 are electrically connected to each other. The wiring board 2 is disposed below the wiring board 1.
The wiring boards 1 and 2 are flexible boards having flexibility, for example. In addition, the flexible substrate applicable in this embodiment should just be provided with the flexible part formed with the material which can be bent in at least one part.

Here, in the present embodiment, the display device DSP has a bent area BA that is an area that is bent when the display apparatus DSP is accommodated in a housing of an electronic device or the like. In the figure, the bent area BA is hatched. That is, the folding area BA is bent so that the wiring board 1 and the wiring board 2 are arranged below the display area DA. The bending area BA is located in the non-display area NDA.
The resin substrate 5 is located below the display panel PNL and is attached to the first substrate SUB1. The resin substrate 5 is not disposed at a position facing the bending area BA in the third direction Z.

FIG. 2 is a cross-sectional view showing the display area DA of the display device DSP shown in FIG.
As shown in FIG. 2, the first substrate SUB1 includes a first insulating substrate 10, a plurality of switching elements SW, a plurality of light reflecting layers 4, a plurality of organic EL elements OLED, a sealing layer 41, a resin substrate 5, and the like. ing. The pixel PX has a plurality of sub-pixels SPX. In the present embodiment, the pixel PX has three subpixels SPX. Each subpixel SPX includes a single switching element SW, a single organic EL element OLED, and the like. In the description of FIG. 2, the configuration of a single subpixel SPX will be described, but the configurations of other subpixels SPX are the same. The first insulating substrate 10 is formed using an organic insulating material, for example, using polyimide. For this reason, it may be appropriate to refer to the first insulating substrate 10 as an organic insulating substrate (resin substrate). Or it may be appropriate to refer to the first insulating substrate 10 as an insulating layer, an organic insulating layer, or a resin layer. The first insulating substrate 10 has a first surface 10A and a second surface 10B opposite to the first surface 10A. The first insulating substrate 10 is covered with a first insulating film 11.

  The switching element SW is formed above the first insulating film 11. In the illustrated example, the switching element SW is composed of a top gate type thin film transistor, but may be composed of a bottom gate type thin film transistor. The switching element SW includes a semiconductor layer SC formed on the first insulating film 11. The semiconductor layer SC is covered with the second insulating film 12. The second insulating film 12 is also disposed on the first insulating film 11.

The gate electrode WG of the switching element SW is formed on the second insulating film 12 and is located immediately above the semiconductor layer SC. The gate electrode WG is covered with the third insulating film 13. The third insulating film 13 is also disposed on the second insulating film 12.
The first insulating film 11, the second insulating film 12, and the third insulating film 13 are formed of an inorganic material such as silicon oxide or silicon nitride, for example.

  The source electrode WS and the drain electrode WD of the switching element SW are formed on the third insulating film 13. The source electrode WS and the drain electrode WD are electrically connected to the semiconductor layer SC through contact holes that penetrate the second insulating film 12 and the third insulating film 13, respectively. The switching element SW is covered with the fourth insulating film 14. The fourth insulating film 14 is also disposed on the third insulating film 13. Such a fourth insulating film 14 is formed of, for example, an organic material such as a transparent resin.

  The light reflecting layer 4 is disposed on the fourth insulating film 14. The light reflecting layer 4 is formed of a metal material having a high light reflectance such as aluminum or silver. The surface of the light reflection layer 4 (that is, the surface on the polarizing plate POL side) may be a flat surface or an uneven surface for imparting light scattering properties.

The organic EL element OLED is formed on the fourth insulating film 14. In the illustrated example, the organic EL element OLED is electrically connected to the switching element SW. For example, the pixel PX includes an organic EL element OLED that emits red light, an organic EL element OLED that emits green light, and an organic EL element OLED that emits blue light. However, the color of the light emitted from the organic EL element OLED is not limited to this embodiment, and can be variously modified.
Unlike the present embodiment, the organic EL element OLED may be configured to emit white light. In this case, the display panel PNL only needs to include a color filter.

  The organic EL element OLED includes a pixel electrode PE formed on the light reflecting layer 4. The pixel electrode PE is made of, for example, a metal material such as aluminum or silver, or a transparent conductive material such as indium tin oxide (ITO) or indium zinc oxide (IZO).

  A partition insulating layer 15 is provided on the fourth insulating film 14 and the pixel electrode PE. In the partition insulating layer 15, a through hole is provided at a position corresponding to the pixel electrode PE, or a slit is provided at a position corresponding to a column or row formed by the pixel electrode PE. Here, as an example, the partition insulating layer 15 has a through hole at a position corresponding to the pixel electrode PE.

  The organic EL element OLED further includes an organic light emitting layer ORG and a common electrode CE. One of the pixel electrode PE and the common electrode CE is an anode, and the other is a cathode. The organic light emitting layer ORG is located on the pixel electrode PE.

The common electrode CE is located on the organic light emitting layer ORG and the partition insulating layer 15. The common electrode CE is made of, for example, a transparent conductive material such as ITO or IZO. In the illustrated example, each organic EL element OLED is partitioned by a partition insulating layer 15. Although not shown, the organic EL element OLED is desirably sealed with a transparent sealing film.
Unlike the present embodiment, the organic EL element may be configured as a so-called bottom emission type that emits light toward the first insulating substrate 10 side. In this case, various adjustments such as the position of the light reflecting layer 4 are made.

  The sealing layer 41 covers the organic EL element OLED in order to suppress intrusion of oxygen and moisture, and prevents the element from deteriorating. The sealing layer 41 may be composed of a laminate of an inorganic film and an organic film. The polarizing plate POL is disposed above the sealing layer 41 through the adhesive layer AD5.

The resin substrate 5 is disposed below the first substrate SUB1. The resin substrate 5 is bonded to the second surface 10B of the first insulating substrate 10 with an adhesive layer AD2. As a material of the resin substrate 5, for example, a material that is excellent in heat resistance, gas barrier property, moisture proof property, strength, and is inexpensive is preferable. The resin substrate 5 has heat resistance to such an extent that it does not change or deform at the process temperature in the process of manufacturing the display device DSP, for example. The resin substrate 5 has, for example, greater strength than the first insulating substrate 10 and functions as a support layer. By adding the resin substrate 5, the display panel PNL is difficult to bend in a state where no external stress is applied. Further, the resin substrate 5 has, for example, moisture resistance that suppresses intrusion of moisture or the like into the first insulating substrate 10 and gas barrier property that suppresses intrusion of gas, and functions as a barrier layer. In the present embodiment, the resin substrate 5 is a film formed using, for example, polyethylene terephthalate.
Note that the pixel PX illustrated in FIG. 1 is, for example, the smallest unit that forms a color image, and includes the organic EL element OLED.

FIG. 3 is another cross-sectional view showing the display device DSP shown in FIG. 1, and shows a non-display area NDA and the like.
As shown in FIG. 3, the resin substrate 5 includes a first portion 5 a and a second portion 5 b that is disposed at an interval from the first portion 5 a. The display panel PNL includes a first area AR1, a second area AR2 adjacent to the first area AR1, and a third area AR3 adjacent to the second area AR2. The second area AR2 is located between the first area AR1 and the third area AR3.

  Here, in the present embodiment, viewing the first substrate SUB1 from the polarizing plate POL is defined as a plan view. The first area AR1 corresponds to an area overlapping the first portion 5a in plan view. The second area AR2 corresponds to an area where the resin substrate 5 is not disposed in plan view. The third area AR3 corresponds to an area overlapping the second portion 5b in plan view. The first portion 5a is bonded to the first region AR1 by the adhesive layer AD2, and the second portion 5b is bonded to the third region AR3 by the adhesive layer AD2.

  The signal wiring 6 is continuously arranged from the first area AR1 to the third area AR3. The signal wiring 6 corresponds to a power supply line or various control wirings. The pad PD is arranged in the third area AR3. The pad PD is electrically connected to the signal wiring 6 through the contact hole CH formed in the fourth insulating film 14.

  The wiring board 1 is mounted in the third region AR3 via an anisotropic conductive film 8 that is a conductive material. The wiring substrate 1 includes a core substrate 200, a connection wiring 100 disposed on the lower surface side of the core substrate 200, and a drive IC chip 3 disposed on the lower surface side of the core substrate 200. The driving IC chip 3 functions as a signal supply source that supplies signals necessary for driving the display panel PNL.

The protective layer PR is disposed on the signal wiring 6. In the illustrated example, the protective layer PR covers the end of the partition insulating layer 15, the end of the sealing layer 41, and the end of the wiring substrate 1.
Here, the bending area BA also shown in FIG. 1 is included in the second area AR2. Alternatively, the bent area BA is an area equivalent to the second area AR2. The pad PD is disposed on the back side of the display panel PNL by folding the folding area BA.

FIG. 4 is a cross-sectional view showing the display device DSP, and shows a state where the folding area BA of the display panel PNL is bent.
As shown in FIG. 4, the bent area BA is bent so that the first area AR1 of the display panel PNL and the wiring board 1 face each other. The display panel PNL has a second area AR2 where the resin substrate 5 is not disposed. For this reason, it is possible to make the curvature radius of the bending area BA small (for example, 1.0 mm or less). The pedestal portion 7 is disposed between the first area AR1 and the wiring board 1. Since the pedestal portion 7 is arranged, even when an impact is applied from the outside, stress from the pedestal portion 7 is generated in the display panel PNL or the wiring board 1 with respect to the impact. It becomes difficult to damage. Moreover, the adhesiveness between 1st area | region AR1 and the wiring board 1 improves by arrange | positioning the base part 7. FIG.

The adhesive layer A1 is disposed between the first region AR1 and the pedestal portion 7 and adheres both. The adhesive layer A2 is disposed between the wiring board 1 and the pedestal portion 7 and adheres both. The adhesive layers A1 and A2 may be connected to each other as illustrated, or may be formed separately. The adhesive layers A1 and A2 are, for example, double-sided tape.
The display device DSP is configured as described above.

  As described above, by bending the bent portion BA of the display panel PNL, an electronic device or the like that accommodates the display panel PNL can be narrowed or downsized. Further, the accommodation volume can be reduced without reducing the width of the non-display area NDA. As described above, from the viewpoint of bending the display panel PNL, the display panel PNL requires the second region AR2 in which the resin substrate 5 is not disposed.

Next, a method for manufacturing the display device DSP will be described. In particular, a method for manufacturing the display panel PNL will be described. FIG. 5 is a flowchart for explaining the manufacturing method of the display device DSP according to the present embodiment. However, FIG. 5 does not show the entire manufacturing process of the display device DSP.
As shown in FIG. 5, when the manufacturing process of the display device DSP starts, in step ST1, a substrate, a display mother substrate, and a polarizing plate are prepared, and in step ST2, the polarizing plate is pasted on the display mother substrate. wear. Next, the process proceeds to step ST3, where the first curable resin is applied to the display mother board on which the polarizing plate is attached, and the first curable resin is cured. Thereafter, in step ST4, a bonded body including a substrate, a display mother substrate, a polarizing plate, and the like is transported.
6 to 9 are used for step ST1, FIG. 10 is used for step ST2, and FIG. 11 is used for step ST3, which will be described later.

Subsequently, in step ST5, the substrate is peeled from the display mother substrate, and in step ST6, the resin substrate is attached to the display mother substrate. Thereafter, the process proceeds to step ST7, where the second curable resin is applied to the display mother substrate to which the resin substrate is attached, and the second curable resin is cured. Next, the joined body is cut into a plurality of display panels in step ST8, and the first curable resin is peeled from the display panel in step ST9.
Steps ST6, ST7, and ST8 will be described later using FIG. 13, and step ST9 will be described later using FIG.

Thereafter, a wiring board is mounted on the display panel in step ST10, and the outer shape of the display panel is adjusted in step ST11. Then, it transfers to step ST12 and peels 2nd curable resin from a display panel. Next, by bending the display panel in step ST13, the manufacturing process of the display device DSP is completed, and the display device DSP is obtained.
Step ST10 will be described later with reference to FIG. 14, and step ST11 will be described later with reference to FIG.

  Next, a method for manufacturing the display device DSP will be described in detail. FIG. 6 is a view for explaining the method for manufacturing the display device DSP according to the present embodiment, in which the first insulating substrate 10, the first pattern layer PT1, and the sealing layer 41 are formed on the substrate GL. FIG.

  As shown in FIG. 6, first, a substrate GL is prepared. For example, the substrate GL is made of glass. On the substrate GL, the first insulating substrate 10, the first pattern layer PT1, and the sealing layer 41 are sequentially formed. Thereby, the display mother substrate DI having the first insulating substrate 10, the first pattern layer PT1, and the sealing layer 41 is formed on the substrate GL. Here, the first pattern layer PT1 includes a plurality of members positioned between the first insulating substrate 10 and the sealing layer 41 shown in FIG. For this reason, the first pattern layer PT1 includes a plurality of members from the first insulating film 11 to the common electrode CE, such as an organic EL element OLED. The sealing layer 41 formed above the substrate GL is not a continuous layer but partially exposes the first pattern layer PT1.

FIG. 7 is a perspective view showing the substrate GL and the display mother substrate DI shown in FIG.
As shown in FIG. 7, the display mother board DI has a plurality of effective areas Ca. The plurality of effective areas Ca are arranged in the first direction X and the second direction Y, and are provided in a matrix. In the plurality of effective areas Ca arranged in the first direction X, the short sides of the plurality of effective areas Ca are aligned in the first direction X. In the plurality of effective areas Ca arranged in the second direction Y, the long sides of the plurality of effective areas Ca are aligned in the second direction Y. The display mother board DI has a non-effective area Cb which is an area other than the effective area Ca.

  Each effective area Ca corresponds to the first substrate SUB1. In the present embodiment, twelve first substrates SUB1 are formed on one display mother substrate DI. Although not shown in all effective areas Ca, each effective area Ca includes a display area DA, a bent area BA, and the like. In the figure, the bent area BA is hatched. For example, in the plurality of effective areas Ca arranged in the first direction X, the plurality of bent areas BA are aligned in the first direction X.

  A plurality of first alignment marks M1 and a plurality of second alignment marks M2 are formed on the display mother board DI. The first pattern layer PT1 has a first alignment mark M1 and a second alignment mark M2. The first alignment mark M1 is used for alignment of the entire display mother board DI, and is located at, for example, the four corners of the display mother board DI. The second alignment mark M2 is used for alignment of the effective areas Ca, and is formed around each effective area Ca, for example.

  When dividing one display mother board DI into a plurality of first substrates SUB1, the display mother board DI is divided along the first dividing line e1 and the second dividing line e2. The first parting line e1 is parallel to the first direction X, and the second parting line e2 is parallel to the second direction Y. In the present embodiment, the first dividing line e1 passes through one side (short side) of the plurality of effective regions Ca arranged in the first direction X.

FIG. 8 is a cross-sectional view showing the substrate GL and the display mother substrate DI along the line VIII-VIII in FIG.
As shown in FIG. 8, the effective area Ca has a display area DA, a bent area BA, and a pad area MT.

The surface of the display mother board DI opposite to the side facing the substrate GL has a first pasting area Aa1 and a first non-sticking area Ab1. The display area DA is located in the first pasting area Aa1, and the folding area BA and the pad area MT are located in the first non-pasting area Ab1.
The first pasting area Aa1 is an area where the polarizing plate POL as the first resin substrate is pasted, and the first non-sticking area Ab1 is an area where the polarizing plate POL is not pasted. In the present embodiment, the first non-stick area Ab1 is set in a one-to-one relationship with the effective area Ca. The plurality of first non-sticking areas Ab1 of the display mother board DI are provided at intervals.

The surface of the display mother board DI facing the substrate GL has a second pasting area Aa2 and a second non-sticking area Ab2. The display area DA and the pad area MT are located in the second pasting area Aa2, and the bending area BA is located in the second non-pasting area Ab2.
The second pasting region Aa2 is a region where the resin substrate 5 as the second resin substrate is pasted, and the second non-pasting region Ab2 is a region where the resin substrate 5 is not pasted. In the present embodiment, the second non-stick region Ab2 is set in a one-to-one relationship with the effective region Ca. The plurality of second non-sticking areas Ab2 of the display mother board DI are provided at intervals.

The first dividing line e1 passes through the boundary between the effective area Ca and the ineffective area Cb. In the present embodiment, the first dividing line e1 passes through the first non-stick area Ab1.
However, unlike the present embodiment, the first dividing line e1 may pass through the boundary between the first pasting area Aa1 and the first non-pasting area Ab1 (pad area MT). In this case, the first pasting area Aa1 is in contact with the pad area MT in the second direction Y.

The third dividing line e3 passes through another boundary between the effective area Ca and the ineffective area Cb.
Although FIG. 8 shows the substrate GL, as will be described later, after the substrate GL is peeled from the display mother substrate DI, the display mother substrate DI is divided along the planned dividing lines (e1, e3). .
As described above, the manufacturing process of the display device DSP includes a preparation process for preparing the display mother board DI having the display area DA, the pad area MT, and the like.

  FIG. 9 is a perspective view showing the polarizing plate POL for explaining the manufacturing method. As shown in FIG. 9, the polarizing plate POL has a shape that is attached to the first pasting area Aa1 and cannot be pasted to the plurality of first non-sticking areas Ab1. In the present embodiment, the polarizing plate POL has a plurality of first openings OP1. The first opening OP1 has a one-to-one correspondence with the first non-sticking region Ab1. In plan view, the first opening OP1 has the same size as the first non-stick area Ab1, and is provided so as to completely overlap the first non-stick area Ab1.

  Furthermore, the polarizing plate POL of the present embodiment has a plurality of second openings OP2 and a plurality of third openings OP3. The second opening OP2 has a one-to-one correspondence with the first alignment mark M1. In plan view, the second opening OP2 is provided so as to overlap the first alignment mark M1. The third opening OP3 has a one-to-one correspondence with the second alignment mark M2. In plan view, the third opening OP3 is provided so as to overlap the second alignment mark M2. By providing the second opening OP2 and the third opening OP3, it is possible to ensure good visibility of the alignment marks (M1, M2).

However, unlike the present embodiment, when the alignment marks (M1, M2) can be visually recognized through the polarizing plate POL, the polarizing plate POL may not have the second opening OP2 and the third opening OP3. Good.
As described above, the manufacturing process of the display device DSP includes a preparation process for preparing the polarizing plate POL.

FIG. 10 is a view for explaining the manufacturing method subsequent to FIGS. 6 to 9, and is a cross-sectional view showing a state in which the polarizing plate POL is attached to the display mother substrate DI.
As shown in FIG. 10, subsequently, in the first pasting step, a polarizing plate POL as a first resin substrate is pasted on at least the display area DA of the display mother substrate DI. In the display mother substrate DI, the front surface Sf is located on the sealing layer 41 side, and the back surface Sb is located on the first insulating substrate 10 side. The polarizing plate POL is attached to the surface Sf side of the display mother substrate DI, and is attached to at least the sealing layer 41.

The display mother board DI has a first pasting area Aa1 and a first non-pasting area Ab1. For this reason, the polarizing plate POL is pasted on the first pasting area Aa1, and is not pasted on the first non-sticking area Ab1.
In the present embodiment, the display mother board DI has a first alignment mark M1 and a second alignment mark M2. Therefore, the second opening OP2 and the third opening OP3 are used, and the polarizing plate POL is not attached to the region facing the first alignment mark M1, and is also attached to the region facing the second alignment mark M2. Not attached.

Regarding the first pasting step, specifically, with the adhesive layer AD5 disposed between the surface Sf and the polarizing plate POL, the display mother substrate DI and the display mother substrate DI are utilized using the first alignment mark M1 and the second opening OP2. Alignment with the polarizing plate POL is performed, followed by pasting. Thereby, generation | occurrence | production of the relative position shift of display mother board | substrate DI and polarizing plate POL can be suppressed.
As described above, the manufacturing process of the display device DSP includes the first pasting step of pasting the polarizing plate POL.

FIG. 11 is a view for explaining the manufacturing method subsequent to FIG. 10, and is a cross-sectional view showing a state in which the first curable resin RE1 is applied to the first non-bonding region Ab1.
As shown in FIG. 11, the first curable resin RE1 is applied to the first non-sticking area Ab1 that includes the pad area MT and is not attached with the polarizing plate POL. In the present embodiment, the first curable resin RE1 is applied independently for each first non-stick region Ab1. The layers of the first curable resin RE1 are provided at a distance from each other.

  The first curable resin RE1 is applied to such an extent that it fills the first opening OP1 and overflows outside the first opening OP1. In other words, the first curable resin RE1 is applied on the first pattern layer PT1 in the first non-sticking area Ab1 and on the area surrounding the first non-sticking area Ab1 in the polarizing plate POL. . The side surface S1 of the layer of the first curable resin RE1 is exposed outside the first opening OP1. This is because the side surface S1 exposed to the outside of the first opening OP1 makes it easier to peel the first curable resin RE1 from the first pattern layer PT1 and the like in the subsequent manufacturing process.

  In the present embodiment, a coating apparatus employing an ink jet method is used for coating the first curable resin RE1. However, unlike this embodiment, a slit coater may be used to apply the first curable resin RE1. The first curable resin RE1 may be either a thermosetting resin or an ultraviolet curable resin.

  Examples of the material used for the first curable resin RE1 include acrylic materials and urethane materials. In the case of a urethane-based material, it is easy to obtain a desired rigidity and is suitable for reinforcing the first non-stick area Ab1. However, in the case of a urethane-based material, the higher the rigidity is, the more the first curable resin RE1 tends to become cloudy. In this case, it should be noted that if the first curable resin RE1 is applied to the entire surface, it may be difficult to read the alignment mark.

In the first resin coating step, the first curable mold is formed in a region facing the first alignment mark M1 including the second opening OP2 and a region facing the second alignment mark M2 including the third opening OP3. Resin RE1 is not applied.
As described above, the manufacturing process of the display device DSP includes the first resin application process of applying the first curable resin RE1.

Here, in the first resin application step, the first curable resin RE1 only needs to be applied to at least the first non-stick area Ab1. For this reason, unlike this embodiment, you may apply | coat 1st curable resin only to 1st non-sticking area | region Ab1. In this case, the side surface S1 of the layer of the first curable resin RE1 is formed inside the first opening OP1.
Further, unlike the present embodiment, the first curable resin RE1 may be applied to the second opening OP2 and the third opening OP3. In this case, the first curable resin RE1 only needs to have a degree of transparency that does not hinder the visibility of the alignment marks (M1, M2). Considering the above transparency, for example, the haze of the first curable resin RE1 is desirably 5% or less. In order to improve the peelability, the first curable resin E1 may be applied to the entire display mother board DI.

  Next, the process proceeds to a curing step, and the first curable resin RE1 is cured. For example, this is performed by irradiating the first curable resin RE1 with ultraviolet rays. Thereby, 1st non-sticking area | region Ab1 can be reinforced with 1st curable resin RE1. After the substrate GL is separated from the display mother substrate DI, it is easy to handle the joined body such as the display mother substrate DI and the polarizing plate POL. Therefore, the manufacturing process after separating the substrate GL can be easily performed on the joined body.

  After the curing process, the Young's modulus of the first curable resin RE1 is desirably 0.4 GPa to 4 GPa. The above Young's modulus can be obtained, for example, by using a urethane material. When the Young's modulus is within the above range, the handling is further facilitated.

Further, the display mother board DI can be reinforced with the polarizing plate POL and the first curable resin RE1. In addition, since the first curable resin RE1 fills the openings, the handling property of the display mother board DI is improved. For this reason, it is not necessary to reinforce the display mother board DI using an indirect material in the steps before the first pasting step, the first resin coating step, and the curing step.
The adhesive force between the first curable resin RE1 and the first pattern layer PT1 is lower than the adhesive force between the polarizing plate POL and the sealing layer 41 per unit area.
As described above, the manufacturing process of the display device DSP includes a curing process for curing the first curable resin RE1.

  After the curing process, the process proceeds to a transport process, and a joined body such as the substrate GL, the display mother substrate DI, and the polarizing plate POL is transported.

  Subsequently, the process proceeds to a cleaning process for cleaning the substrate GL. The surface of the substrate GL opposite to the side facing the first insulating substrate 10 is cleaned using a cleaning device. Here, the substrate GL is dry-cleaned using a brush or the like. Thereby, the foreign material which may exist in the back surface of the board | substrate GL can be removed. Thereafter, a joined body such as the substrate GL, the display mother substrate DI, and the polarizing plate POL is transported.

  Next, using a laser, the first insulating substrate 10 is irradiated with laser light from the back side of the substrate GL. By cleaning the substrate GL, the first insulating substrate 10 is favorably irradiated with the laser light. When the laser light reaches the first insulating substrate 10, ablation that absorbs and decomposes the laser light occurs at the interface between the first insulating substrate 10 and the substrate GL. Thereby, a space is generated at the interface between the substrate GL and the first insulating substrate 10, and the substrate GL is peeled from the first insulating substrate 10. Thereafter, a joined body such as the display mother substrate DI and the polarizing plate POL is transported.

  FIG. 12 is a perspective view showing the resin substrate 5 for explaining the manufacturing method. As shown in FIG. 12, a resin substrate 5 as a second resin substrate is prepared. The resin substrate 5 has a shape that is pasted on the second pasting area Aa2 and cannot be pasted on the plurality of second non-pasting areas Ab2. In the present embodiment, the resin substrate 5 has a plurality of fourth openings OP4. The fourth opening OP4 has a one-to-one correspondence with the second non-sticking region Ab2. In plan view, the fourth opening OP4 has the same size as the second non-stick area Ab2, and is provided so as to completely overlap the second non-stick area Ab2.

In the present embodiment, the resin substrate 5 does not have an opening in a region facing the alignment marks (M1, M2).
As described above, the manufacturing process of the display device DSP includes a preparation process for preparing the resin substrate 5.

FIG. 14 is a view for explaining the manufacturing method subsequent to FIGS. 12 and 13, in which the resin substrate 5 is attached to the display mother board DI, and the second curable resin RE2 is provided in the second non-attached area Ab2. It is sectional drawing which shows the state which is apply | coated, and the state which cuts off display mother board DI etc. in order to isolate | separate into a single display panel.
As shown in FIG. 13, subsequently, in the second pasting step, the resin substrate 5 as the second resin substrate is pasted on at least the display area DA of the display mother board DI. The resin substrate 5 is attached to the first insulating substrate 10 on the back surface Sb side of the display mother substrate DI.

  The display mother board DI has a second pasting area Aa2 and a second non-sticking area Ab2. For this reason, the resin substrate 5 is affixed on 2nd sticking area | region Aa2, and is not stuck on 2nd non-sticking area | region Ab2. In a plan view, the second non-stick area Ab2 is surrounded by the resin substrate 5. In the present embodiment, the resin substrate 5 is attached to a region facing the first alignment mark M1 and a region facing the second alignment mark M2.

Regarding the second pasting step, specifically, after the alignment between the display mother substrate DI and the resin substrate 5 is performed in a state where the adhesive layer AD2 is disposed between the first insulating substrate 10 and the resin substrate 5. The resin substrate 5 is attached to the display mother substrate DI.
As described above, the manufacturing process of the display device DSP includes the second pasting step for pasting the resin substrate 5.

  Next, the process proceeds to the second resin application step, and the second curable resin RE2 is applied to the second non-adhesion region Ab2 that is opposite to the first non-adhesion region Ab1 and to which the resin substrate 5 is not attached. . In the present embodiment, the second curable resin RE2 is applied independently for each second non-stick region Ab2. The layers of the second curable resin RE2 are provided at a distance from each other.

  The second curable resin RE2 is applied to such an extent that it fills the fourth opening OP4 and overflows outside the fourth opening OP4. In other words, the second curable resin RE2 is applied to the first insulating substrate 10 side in the second non-sticking region Ab2 and the region surrounding the second non-sticking region Ab2 on the resin substrate 5 side. The side surface S2 of the layer of the second curable resin RE2 is exposed outside the fourth opening OP4. This is because the side surface S2 exposed to the outside of the fourth opening OP4 is easy to peel the second curable resin RE2 from the resin substrate 5 or the like in the subsequent manufacturing process.

  In the second resin coating process, the coating device used in the first resin coating process can be used. The material used for the second curable resin RE2 is the same as the material used for the first curable resin RE1. For example, a urethane-based material can be used for the second curable resin RE2.

However, unlike the front surface Sf side of the display mother board DI, the visibility need not be ensured on the rear surface Sb side of the display mother board DI. For this reason, the transparency of the second curable resin RE2 may be low, and the second curable resin RE2 may be clouded.
As described above, the manufacturing process of the display device DSP includes the second resin application process of applying the second curable resin RE2.

  Here, in the second resin application step, the second curable resin RE2 only needs to be applied to at least the second non-stick area Ab2. For this reason, unlike this embodiment, you may apply | coat 2nd curable resin only to 2nd non-sticking area | region Ab2. In this case, the side surface S2 of the layer of the second curable resin RE2 is formed inside the fourth opening OP4.

Next, the process proceeds to a curing step, and the second curable resin RE2 is cured. For example, the second curable resin RE2 is irradiated with ultraviolet rays. Thereby, 2nd non-sticking area | region Ab2 can be reinforced with 2nd curable resin RE2. Handling of the joined body such as the display mother substrate DI, the polarizing plate POL, and the resin substrate 5 becomes easy. Therefore, the manufacturing process after the resin substrate 5 is attached can be easily performed on the joined body.
The curing process includes a curing process for curing the first curable resin RE1 and a curing process for curing the second curable resin RE2. After the curing process, the Young's modulus of the second curable resin RE2 is desirably 0.4 GPa to 4 GPa.

Further, the display mother board DI can be reinforced with the resin substrate 5 and the second curable resin RE2. For this reason, it is not necessary to reinforce the display mother board DI using the indirect material in the steps before the second pasting step, the second resin coating step, and the curing step of the second curable resin RE2.
The adhesive force between the second curable resin RE2 and the first insulating substrate 10 is lower than the adhesive force between the resin substrate 5 and the first insulating substrate 10 per unit area.
As described above, the manufacturing process of the display device DSP includes a curing process for curing the second curable resin RE2.

After the curing process of the second curable resin RE2, the process proceeds to a transporting process, and a bonded body such as the resin substrate 5, the display mother substrate DI, and the polarizing plate POL is transported.
Here, from the viewpoint of handling the joined body, it is desirable to avoid the situation where the second curable resin RE2 is undesirably peeled before the first curable resin RE1 is peeled from the joined body. For this reason, it is desirable that the adhesion of the second curable resin RE2 to the display mother board DI is higher than the adhesion of the first curable resin RE1 to the display mother board DI. Specifically, the adhesive force between the second curable resin RE2 and the first insulating substrate 10 is preferably higher than the adhesive force between the first curable resin RE1 and the first pattern layer PT1.

For example, this can be realized by making the material used for the second curable resin RE2 different from the material used for the first curable resin RE1.
Alternatively, it is realized by making the adhesion area of the second curable resin RE2 to the first insulating substrate 10 and the resin substrate 5 larger than the adhesion area of the first curable resin RE1 to the first pattern layer PT1 and the polarizing plate POL. be able to.

  Thereafter, the cutting process is performed, and the joined body such as the resin substrate 5, the display mother substrate DI, and the polarizing plate POL is divided along the first dividing line e1. Further, in this cutting step, the joined body is divided along a second parting planned line e2 shown in FIG. Thereby, the joined body can be cut into a plurality of display panels PNL.

  In the present embodiment, when the joined body is divided, a scribe line is drawn along the planned dividing line. However, unlike the present embodiment, when the joined body is divided, the joined body may be irradiated with a laser beam along a planned dividing line.

  Then, it transfers to a peeling process and peels 1st curable resin RE1 from 1st non-sticking area | region Ab1. At this time, as described above, since the side surface S1 of the layer of the first curable resin RE1 is exposed, the first curable resin RE1 can be easily peeled off from the polarizing plate POL or the like.

As described above, the manufacturing process of the display device DSP includes a peeling process for peeling the first curable resin RE1.
As described above, in the present embodiment, a peeling process for peeling the first curable resin RE1 after the cutting process is provided. However, unlike the present embodiment, a cutting step may be provided after a peeling step for peeling the first curable resin RE1.

  Then, it shifts to lighting inspection. When the first curable resin RE1 is removed, the pad PD in the pad region MT is exposed. In the lighting inspection, the pad PD is probed to inspect the presence or absence of an organic EL element serving as a bright spot or the presence or absence of an organic EL element serving as a dark spot.

FIG. 14 is a view for explaining the manufacturing method after FIG. 13 and is a cross-sectional view for explaining a step of pressure-bonding the wiring substrate 1 to the display panel PNL and a step of forming the protective layer PR.
As shown in FIG. 14, the display panel PNL that has passed the above-described lighting inspection then mounts the wiring board 1 on the display panel PNL and forms a protective layer PR on the display panel PNL.
An anisotropic conductive film 8 is disposed between the wiring board 1 and the display panel PNL and overlaps the pad PD, and is heated by applying pressure from above the wiring board 1 and below the display panel PNL. Thereby, the anisotropic conductive film 8 is melted, and the wiring substrate 1 and the display panel PNL are electrically and physically connected.

  Next, the protective layer PR is formed on the signal wiring 6. In the illustrated example, the protective layer PR covers the end 15E of the partition insulating layer 15 and the end 41E of the sealing layer 41. Further, the end 1E of the wiring board 1 is covered. The protective layer PR is formed using, for example, an organic insulating material such as an epoxy resin, and is formed by being cured by UV irradiation or heat.

  After the wiring board 1 is mounted on the display panel PNL, the inspection is performed again. This inspection is performed by driving the display panel PNL using the wiring substrate 1, the wiring substrate 2, and the driving IC chip 3.

FIG. 15 is a view for explaining the manufacturing method after FIG. 14 and is a cross-sectional view showing a state in which the display panel PNL is cut off in order to adjust the outer shape of the display panel PNL.
As shown in FIG. 15, the display panel PNL that has passed the inspection after mounting the wiring board 1 or the like proceeds to a cutting process thereafter. In the cutting process, the second alignment mark M2 and the third opening OP3 are used to divide the display panel PNL along the third division planned line e3, the fourth division planned line e4, and the fifth division planned line e5. The position of these planned dividing lines can be adjusted. The third dividing line e3 is parallel to the first direction X, and the fourth dividing line e4 and the fifth dividing line e5 are parallel to the second direction Y.

  In the present embodiment, the third planned dividing line e3 passes through a short side parallel to the first direction X of the effective area Ca. For this reason, in the effective area Ca, the above-described first dividing line e1 passes through one short side, and the third dividing line e3 passes through the other short side. Further, in the effective area Ca, the above-described fourth dividing line e4 passes through one long side, and the fifth dividing line e5 passes through the other long side.

  In the cutting step, first, the display panel PNL is divided along the third scheduled dividing line e3. The second alignment mark M2 still remains on the display panel PNL. Therefore, the display panel PNL is adjusted using the second alignment mark M2 while adjusting the positions of the fourth and fifth planned dividing lines e4 and e5. Divide along e5.

  In the present embodiment, when the display panel PNL is divided, a scribe line is drawn along the planned dividing line on the display panel PNL. However, unlike the present embodiment, when the display panel PNL is divided, the joined body may be irradiated with a laser beam along a planned dividing line.

Thereby, the external shape of the display panel PNL can be made to oppose the effective area | region Ca.
As described above, the manufacturing process of the display device DSP includes a cutting process for dividing the display panel PNL.
As shown in FIG. 3, subsequently, the process proceeds to a peeling step, and the second curable resin RE2 is peeled from the second non-sticking region Ab2. Similar to the layer of the first curable resin RE1, the side surface S2 of the layer of the second curable resin RE2 is also exposed, so that the second curable resin RE2 can be easily peeled from the first insulating substrate 10 or the like. .

  As described above, the manufacturing process of the display device DSP includes a peeling process for peeling the second curable resin RE2. The peeling step includes a peeling step for peeling the first curable resin RE1 and a peeling step for peeling the second curable resin RE2.

As shown in FIG. 4, subsequently, after positioning the pedestal portion 7, the pedestal portion 7 is bonded to the first portion 5a by the adhesive layer AD. Thereafter, the folding area BA of the display panel PNL is bent so that the pad PD is disposed below the display panel PNL. That is, with the pedestal portion 7 as a base point, the folding area BA is folded so that the wiring substrate 1 is disposed below the pedestal portion 7, and the wiring substrate 1 is attached to the pedestal portion 7 with the adhesive layer A2.
The display device DSP is completed by the above manufacturing process.

According to the method of manufacturing the display device DSP according to the embodiment configured as described above, the display mother substrate DI is reinforced with the polarizing plate POL or the resin without using an indirect material in the manufacturing process. It can be reinforced with the substrate 5. Further, the first opening OP1 formed in the polarizing plate POL can be reinforced with the first curable resin RE1. The amount of the fourth opening OP4 formed in the resin substrate 5 can be reinforced with the second curable resin RE2.
From the above, it is possible to obtain a manufacturing method of the display panel PNL and a manufacturing method of the display device DSP that can suppress an increase in manufacturing cost. Moreover, the manufacturing method of the display panel PNL and the manufacturing method of the display device DSP which can suppress the prolongation of manufacturing time can be obtained.

(Modification 1 of the above embodiment)
Next, the modification 1 of the said embodiment is demonstrated. FIG. 16 is a diagram for explaining a method of manufacturing the display device DSP according to the first modification, in which the first curable resin RE1 is applied to both the first pasting area Aa1 and the first non-sticking area Ab1. It is sectional drawing which shows the state which exists.

As shown in FIG. 16, in the first resin application step, the first curable resin RE1 may be entirely applied to the polarizing plate POL. Since the single layer of the first curable resin RE1 is filled in the plurality of first openings OP1, the plurality of first non-sticking regions Ab1 can be reinforced with the single layer of the first curable resin RE1. In this case, the single layer of the first curable resin RE1 can be filled into the plurality of second openings OP2 and the plurality of third openings OP3. For this reason, it is also possible to reinforce the region facing the plurality of second openings OP2 and the region facing the plurality of third openings OP3 with a single layer of the first curable resin RE1. However, when the first curable resin RE1 is filled in the second opening OP2 and the third opening OP3, it is necessary to pay attention to the transparency of the first curable resin RE1 in order to maintain the visibility of the alignment mark.
When the first curable resin RE1 is entirely applied to the polarizing plate POL, the surface of the single layer of the first curable resin RE1 may not be flat. The surface of the single layer of the first curable resin RE1 is the surface opposite to the side facing the polarizing plate POL of the single layer of the first curable resin RE1.

  In the peeling step of peeling the first curable resin RE1, a single layer of the first curable resin RE1 may be peeled from the polarizing plate POL. Thereby, the 1st curable resin RE1 can be peeled off collectively from several 1st non-sticking area | region Ab1. Also in the first modification, the same effect as in the above embodiment can be obtained.

(Modification 2 of the above embodiment)
Next, Modification 2 of the above embodiment will be described. FIG. 17 is a diagram for explaining a method of manufacturing the display device DSP according to the second modification, in which the second curable resin RE2 is applied to both the second pasting area Aa2 and the second non-sticking area Ab2. It is sectional drawing which shows the state which exists.

As shown in FIG. 17, the second curable resin RE <b> 2 may be entirely applied to the resin substrate 5 in the second resin application step. Since the single layer of the second curable resin RE2 is filled in the plurality of fourth openings OP4, the plurality of second non-sticking regions Ab2 can be reinforced with the single layer of the second curable resin RE2. As described above, the transparency of the second curable resin RE2 may be lower than the transparency of the first curable resin RE1 on the back surface Sb side of the display mother board DI.
When the second curable resin RE2 is applied to the resin substrate 5 as a whole, the surface of the single layer of the second curable resin RE2 is preferably flat. This is because the manufacturing process after providing the second curable resin RE2 can be easily performed on the joined body. The surface of the single layer of the second curable resin RE2 is the surface opposite to the side facing the single layer resin substrate 5 of the second curable resin RE2.

  In the peeling step of peeling the second curable resin RE2, a single layer of the second curable resin RE2 may be peeled from the resin substrate 5. Thereby, the second curable resin RE2 can be peeled off collectively from the plurality of second non-sticking areas Ab2. Also in the second modification, the same effect as in the above embodiment can be obtained. Also, from the viewpoint of avoiding the situation where the second curable resin RE2 is undesirably peeled off, the second curable resin RE2 may be applied as in the second modification.

(Modification 3 of the above embodiment)
Next, Modification 3 of the above embodiment will be described. Although not shown, in the third modification, the first curable resin RE1 is applied as shown in the first modification (FIG. 16), and the second curable resin is used as shown in the second modification (FIG. 17). Resin RE2 may be applied.

(Modification 4 of the above embodiment)
Next, Modification 4 of the above embodiment will be described. FIG. 18 is a diagram for explaining the method for manufacturing the display device DSP according to the fourth modification, and is a perspective view showing the polarizing plate POL.
As shown in FIG. 18, in the preparatory process for preparing the polarizing plate POL, the polarizing plate POL may be attached to the sheet SH and divided into strips. In the polarizing plate POL, a plurality of slits SL extending in the first direction X are formed instead of the first opening OP1 described above.

  In the plurality of effective areas Ca arranged in the first direction X, the first non-stick area Ab1 is aligned in the first direction X. Therefore, the slit SL of the polarizing plate POL can be opposed to the plurality of first non-sticking regions Ab1 and the plurality of second alignment marks M2 arranged in the first direction X in the display mother board DI. When the first curable resin RE1 is applied, it may be applied to at least the first non-stick area Ab1 in the slit SL. Depending on the transparency of the first curable resin RE1, the first curable resin RE1 may be applied to the entire slit SL. In this case, the first curable resin RE1 is also applied to a region facing the second alignment mark M2.

  When the sheet SH as described above is used, the adhesive force between the sheet SH and the polarizing plate POL is set lower than the adhesive force between the display mother substrate DI and the polarizing plate POL. Also in the fourth modification, the same effect as in the above embodiment can be obtained.

(Modification 5 of the above embodiment)
Next, Modification 5 of the above embodiment will be described. Although not shown, in the preparation step for preparing the resin substrate 5, the resin substrate 5 is bonded to a sheet and is divided into strips. In the resin substrate 5, a plurality of slits extending in the first direction X are formed instead of the above-described fourth opening OP4. For this reason, the slit of the resin substrate 5 can be made to oppose the some 2nd non-sticking area | region Ab2 arranged in the 1st direction X among the display mother boards DI. When applying the second curable resin RE2, the second curable resin RE2 can be applied to the entire slit.

(Modification 6 of the above embodiment)
Next, Modification 6 of the above embodiment will be described. FIG. 19 is a view for explaining the method for manufacturing the display device DSP according to the sixth modification, and is a perspective view showing the polarizing plate POL.
As shown in FIG. 19, in the preparatory process for preparing the polarizing plate POL, as in the above-described modification example 4, the polarizing plate POL is attached to the sheet SH and formed into strips. In the sixth modification, the effective areas Ca arranged in the first direction X are in contact with each other. As described above, when the effective areas Ca are in contact with each other, the method of forming the slit SL in the polarizing plate POL is effective.

  Moreover, the long side of the effective area | region Ca can be obtained by parting the display mother board DI etc. along the 2nd parting plan line e2. For this reason, in the modified example 6, unlike the above-described embodiment, it is not necessary to set the fourth dividing planned line e4 and the fifth dividing planned line e5 to divide the display mother board DI and the like. Also in the sixth modification, the same effect as in the above embodiment can be obtained.

(Modification 7 of the above embodiment)
Next, Modification 7 of the above embodiment will be described. Although not shown, in the preparation step for preparing the resin substrate 5, the resin substrate 5 is bonded to a sheet and is divided into strips. In the resin substrate 5, a plurality of slits extending in the first direction X are formed instead of the above-described fourth opening OP4. In the seventh modification, the effective areas Ca arranged in the first direction X are in contact with each other. As described above, when the effective areas Ca are in contact with each other, a method of forming a slit in the resin substrate 5 is effective.

(Modification 8 of the above embodiment)
Next, Modification 8 of the above embodiment will be described. First, the configuration of the display device DSP according to Modification 8 will be described. FIG. 20 is a cross-sectional view showing a display device DSP according to the modification 8 and shows a non-display area NDA and the like.

  As shown in FIG. 20, the display device DSP of the present modification 8 further includes a resin substrate 30 provided between the sealing layer 41 and the polarizing plate POL, unlike the above-described embodiment. In the present modification 8, not the polarizing plate POL but the resin substrate 30 functions as the first resin substrate. The resin substrate 30 is bonded to the sealing layer 41 with an adhesive layer AD6. The polarizing plate POL is bonded to the resin substrate 30 with an adhesive layer AD5.

Next, a method for manufacturing the display device DSP according to Modification 8 will be described. Here, it demonstrates, contrasting with the manufacturing method (FIG. 6 thru | or FIG. 15) of the display apparatus DSP of embodiment mentioned above.
The manufacturing process of the display device DSP according to Modification 8 includes a preparation process for preparing the resin substrate 30. FIG. 21 is a view for explaining the method for manufacturing the display device DSP according to the present modification 8, and is a perspective view showing the resin substrate 30.

As shown in FIG. 21, the resin substrate 30 has a shape that is attached to the first pasting area Aa1 and cannot be pasted to the plurality of first non-sticking areas Ab1. In the present modification 8, the resin substrate 30 has a plurality of first openings OP1, a plurality of second openings OP2, and a plurality of third openings OP3.
However, unlike the present modification 8, the resin substrate 30 may not have the second opening OP2 and the third opening OP3. This is because the resin substrate 30 has high transparency, and the alignment marks (M1, M2) can be easily viewed from the polarizing plate POL.

  In the embodiment described above, as shown in FIG. 10, the polarizing plate POL is bonded to the display mother board DI using the adhesive layer AD5. However, in the present modification 8, unlike the above-described embodiment, the resin substrate 30 is attached to the display mother board DI using the adhesive layer AD6. In the present modification 8, after that, manufacturing is performed in the same manner as in the above-described embodiment, and the process of peeling the first curable resin RE1 and the lighting inspection by probing are performed.

Subsequently, the polarizing plate POL is attached to the resin substrate 30 using the adhesive layer AD5.
Thereafter, the wiring board 1 is mounted on the display panel PNL, and thereafter, manufacturing is performed in the same manner as in the above-described embodiment to complete the display device DSP. Also in this modification 8, the effect similar to the said embodiment can be acquired.

  Although the embodiment of the present invention has been described, the above embodiment is presented as an example, and is not intended to limit the scope of the invention. The above-described novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the spirit of the invention. The above-described embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and equivalents thereof.

  The display panel manufacturing method and the display device manufacturing method described above are not limited to the organic EL display panel manufacturing method and the organic EL display device manufacturing method. For example, the above-described manufacturing method can be applied to a manufacturing method of a liquid crystal display panel having a liquid crystal element as an electro-optical element and a manufacturing method of a liquid crystal display device. In that case, the display panel PNL is a liquid crystal display panel, and includes, for example, a first substrate SUB1, a second substrate, and a liquid crystal layer sandwiched between the first substrate and the second substrate. The electro-optical element may be an inorganic EL element.

  The display panel PNL may be a reflective liquid crystal display panel that displays an image by selectively reflecting light incident from the second substrate side. Alternatively, the display panel PNL may be a transmissive liquid crystal display panel that displays an image by selectively transmitting light incident from the first substrate SUB1 side. When the display area DA and the wiring board 1 overlap in plan view, a reflective type is suitable, but a backlight unit can be disposed between the first board SUB1 and the wiring board 1. If it exists, it may be a transmission type. The main configuration relating to the embodiment of the present invention is substantially the same even when the display device DSP is a liquid crystal display device.

DSP ... display device, PNL ... display panel, POL ... polarizing plate, 1,2 ... wiring board,
GL ... substrate, DI ... display mother substrate, 10 ... first insulating substrate, PT1 ... first pattern layer,
41 ... sealing layer, 5 ... resin substrate, 30 ... resin substrate, Sf ... front surface, Sb ... back surface,
AD2, AD5, AD6 ... adhesive layer, M1, M2 ... alignment mark,
RE1: first curable resin, RE2: second curable resin, S1, S2: side surfaces,
OP1, OP2, OP3, OP4 ... opening, Ca ... effective region, Cb ... non-effective region,
DA ... display area, BA ... bent area, MT ... pad area,
Aa1 ... first pasting area, Ab1 ... first non-pasting area,
Aa2 ... second pasting area, Ab2 ... second non-sticking area,
e1, e2, e3, e4, e5... planned dividing line, X ... first direction, Y ... second direction.

Claims (10)

Preparing a display mother board having a display area and a pad area;
A first attaching step of attaching a first resin substrate to the display area;
A first resin application step of applying a first curable resin to a first non-adhesion region that includes the pad region and is not attached to the first resin substrate;
A curing step of curing the first curable resin;
After the curing step, a transport step for transporting the display mother board;
After the transporting step, a peeling step of peeling the first curable resin from the first non-sticking area;
A cutting process for cutting the display mother substrate into a plurality of display panels after the transporting process.   2. The method for manufacturing a display panel according to claim 1, wherein the first resin application step is a step of applying the first curable resin onto the first non-stick region and the first resin substrate.   The method for manufacturing a display panel according to claim 2, wherein a side surface of the first curable resin layer is exposed during the peeling step.   The method for manufacturing a display panel according to claim 1, wherein the first resin substrate is a polarizing plate. A second attaching step of attaching a second resin substrate to the display area;
A second resin application step of applying a second curable resin to a second non-adhesion region that is opposite to the first non-adhesion region and to which the second resin substrate is not attached;
The curing step includes a step of curing the second curable resin,
The peeling step includes a step of peeling the second curable resin from the second non-sticking region,
The display mother board has a front surface and a back surface,
The display panel manufacturing method according to claim 1, wherein the first resin substrate is attached to the front surface side, and the second resin substrate is attached to the back surface side. . The first resin application step is a step of applying the first curable resin only to the first non-stick area.
The second resin application step is a step of applying the second curable resin on the second non-stick region and the second resin substrate,
In plan view, the second non-stick region is surrounded by the second resin substrate,
The display panel manufacturing method according to claim 5, wherein a side surface of the layer of the first curable resin is exposed during the peeling step.   The method for manufacturing a display panel according to claim 5, wherein an adhesion force of the second curable resin to the display mother substrate is higher than an adhesion force of the first curable resin to the display mother substrate.   The display panel manufacturing method according to claim 1, wherein a Young's modulus of the first curable resin is 0.4 GPa to 4 GPa. The display mother board has an alignment mark,
9. The method of manufacturing a display panel according to claim 1, wherein the first curable resin is not applied to a region facing the alignment mark during the first resin application step. 10. The display mother board has an alignment mark,
The method for manufacturing a display panel according to claim 1, wherein the first resin substrate is not attached to a region facing the alignment mark in the first attaching step.

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