CN108364977B

CN108364977B - Method for manufacturing display panel

Info

Publication number: CN108364977B
Application number: CN201711282842.0A
Authority: CN
Inventors: 新木盛右
Original assignee: Japan Display Inc
Current assignee: Japan Display Inc
Priority date: 2017-01-27
Filing date: 2017-12-07
Publication date: 2022-02-01
Anticipated expiration: 2037-12-07
Also published as: JP2018120823A; CN108364977A

Abstract

The present invention provides a method for manufacturing a display panel, comprising: a preparation step of preparing a display mother substrate having a display region and a pad region (MT); a first bonding step of bonding a first resin substrate to the display region; a first resin application step of applying a first curable resin (RE1) to the first non-attachment region (Ab 1); a curing step of curing the first curable resin; a carrying step of carrying the display mother substrate after the curing step; a peeling step of peeling the first curable resin from the first non-adhesive region after the carrying step; and a cutting step of cutting the display mother substrate into a plurality of display panels after the carrying step.

Description

Method for manufacturing display panel

Citation of related references

The present application is based on and enjoys japanese patent application No.2017-013165 (application date 1/27 of 2017), the entire contents of which are incorporated by reference.

Technical Field

Embodiments relate to a method of manufacturing a display panel.

Background

In recent years, the production of sheet-like display devices using flexible substrates has been advanced. Sheet-like display devices are attracting attention as lightweight and thin display devices. A display panel of a sheet-like display device has a flexible insulating layer. For example, a PI film (a polyimide precursor solution thin film formed of a coating film of a solution containing a polyimide precursor) is used as the insulating layer.

In the manufacturing process of the display panel, the insulating layer and the like are formed on the upper surface of the glass substrate as a base material, and a display mother substrate is prepared. In the subsequent manufacturing process, the insulating layer is irradiated with laser light to peel the insulating layer from the glass substrate.

However, the display mother substrate in a state where the glass substrate is separated is low in strength, and handling (handling) is difficult. Therefore, it is difficult to perform a manufacturing process for the display mother substrate after the glass substrate is formed. However, it is difficult to stick a sheet (シート) member such as a polarizing plate stuck to a display mother substrate of a final product to the display mother substrate immediately after the glass separation. The reason for this is that: as shown in fig. 9 and 12, which will be described later, the thin plate member is provided with a plurality of openings, and the openings make it difficult to handle the display mother substrate in the manufacturing process.

In addition, a technique of bonding a resin sheet having no opening to a display mother substrate as a temporary indirect material after the glass substrate is separated is also conceivable. This strengthens the display mother substrate in the state where the glass substrate is separated.

However, since the indirect material is peeled and discarded when the sheet member is attached, it is not used as a part of the final product. Therefore, the use of the indirect material as described above leads to an increase in manufacturing cost.

In addition, a process of mounting the indirect material on the display mother substrate and a process of removing the indirect material from the display mother substrate after the mounting process are required in the manufacturing process. Therefore, the use of the indirect material as described above leads to a longer production time.

Disclosure of Invention

The present embodiment provides a method for manufacturing a display panel, which can suppress an increase in manufacturing cost. Or a method for manufacturing a display panel capable of suppressing the increase of the manufacturing time.

Drawings

Fig. 1 is a perspective view showing a configuration of a display device according to an embodiment.

Fig. 2 is a sectional view showing a display area of the display device shown in fig. 1.

Fig. 3 is another cross-sectional view of the display device shown in fig. 1, showing a non-display area and the like.

Fig. 4 is a cross-sectional view showing the display device, and shows a state in which a bent region of the display panel is bent.

Fig. 5 is a flowchart for explaining the method of manufacturing the display device according to the above embodiment.

Fig. 6 is a diagram for explaining the method of manufacturing the display device according to the above embodiment, and is a cross-sectional view showing a state in which the first insulating substrate, the first pattern layer, and the sealing layer are formed on the substrate.

Fig. 7 is a perspective view showing the substrate and the display mother substrate shown in fig. 6.

Fig. 8 is a cross-sectional view showing the substrate and the display mother substrate along the line VIII-VIII of fig. 7.

Fig. 9 is a view for explaining the above-described manufacturing method, and is a perspective view showing a polarizing plate.

Fig. 10 is a view for explaining the above-described manufacturing method, which is to be followed by fig. 6 to 9, and is a cross-sectional view showing a state in which a polarizing plate is attached to a display mother substrate.

Fig. 11 is a view for explaining the above-described manufacturing method, which is described below with reference to fig. 10, and is a cross-sectional view showing a state where the first curable resin is applied to the first non-application region.

Fig. 12 is a view for explaining the above-described manufacturing method, and is a perspective view showing the resin substrate.

Fig. 13 is a view for explaining the above-described manufacturing method, which is described next with reference to fig. 11 and 12, and is a cross-sectional view showing a state in which the resin substrate is attached to the display mother substrate and the second curable resin is applied to the second non-attached region, and a state in which the display mother substrate and the like are cut off (japanese text: break) to separate the display mother substrate into individual display panels.

Fig. 14 is a view for explaining the manufacturing method described above in fig. 13 and thereafter, and is a cross-sectional view for explaining a step of bonding the wiring substrate to the display panel and a step of forming the protective layer.

Fig. 15 is a view for explaining the manufacturing method described above in fig. 14 and thereafter, and is a cross-sectional view showing a state in which the display panel is cut to adjust the outer shape of the display panel.

Fig. 16 is a view for explaining a method of manufacturing the display device according to modification 1 of the above embodiment, and is a cross-sectional view showing a state in which the first curable resin is applied to both the first pasting region and the first non-pasting region.

Fig. 17 is a view for explaining a method of manufacturing the display device according to modification 2 of the above embodiment, and is a cross-sectional view showing a state in which the second curable resin is applied to both the second pasting region and the second non-pasting region.

Fig. 18 is a view for explaining a method of manufacturing the display device according to modification 4 of the above embodiment, and is a perspective view showing a polarizing plate.

Fig. 19 is a view for explaining a method of manufacturing the display device according to modification 6 of the above embodiment, and is a perspective view showing a polarizing plate.

Fig. 20 is a cross-sectional view showing a display device according to modification 8 of the above embodiment, and is a view showing a non-display region and the like.

Fig. 21 is a view for explaining a method of manufacturing the display device according to modification 8, and is a perspective view showing a resin substrate.

Detailed Description

In general, according to one embodiment, there is provided a method of manufacturing a display panel, including: a preparation step of preparing a display mother substrate having a display region and a pad region; a first bonding step of bonding a first resin substrate to the display region; a first resin coating step of coating a first curable resin on a first non-adhesion region including the pad region and to which the first resin substrate is not adhered; a curing step of curing the first curable resin; a carrying step of carrying the display mother substrate after the curing step; a peeling step of peeling the first curable resin from the first non-adhesive region after the carrying step; and a cutting step of cutting the display mother substrate into a plurality of display panels after the carrying step.

Hereinafter, an embodiment and a modification of the present invention will be described with reference to the drawings. It is to be noted that the disclosure is merely an example, and appropriate modifications can be easily made by those skilled in the art while maintaining the spirit of the invention, and this is naturally included in the scope of the invention. In addition, in order to more clearly explain the present invention, the drawings schematically show the width, thickness, shape, and the like of each part as compared with the actual form, and are merely examples, and are not intended to limit the explanation of the present invention. In the present specification and the drawings, the same reference numerals are given to the same elements as those described above with reference to the existing drawings, and detailed description thereof may be omitted as appropriate.

In the present specification, unless otherwise specified, expressions such as "α includes A, B or C", "α includes either A, B or C", and "α includes one selected from the group consisting of A, B and C" do not exclude a case where a plurality of combinations of a to C are included in α. Further, these expressions do not exclude the case where α includes other elements.

(one embodiment)

A method for manufacturing a display device according to an embodiment will be described. First, the structure of the display device manufactured by the above-described manufacturing method will be described. Fig. 1 is a perspective view showing a configuration of a display device DSP according to an embodiment.

As shown in fig. 1, the first direction X and the second direction Y are orthogonal to each other. The third direction Z is orthogonal to the first direction X and the second direction Y, respectively. Unlike the present embodiment, the first direction X and the second direction Y may intersect at an angle other than 90 °. Hereinafter, in this embodiment, a case where the display device is an organic Electro-luminescence (EL) display device will be described.

In the present embodiment, a side from the first insulating substrate 10 toward the electro-optical element (a direction of a tip of an arrow toward the third direction Z) is defined as up or up, and a direction opposite to the direction of the tip of the arrow toward the third direction Z is defined as down or down.

In the following description (excluding the claims), the terms are defined and used as follows for convenience. In the case of the "second member above the first member" and the "second member below the first member", the second member may be in contact with the first member or may be located at a position apart from the first member. In the latter case, a third member may be interposed between the first member and the second member. On the other hand, in the case of "a second member above the first member" and "a second member below the first member", the second member is in contact with the first member.

The display device DSP includes a display panel PNL, a wiring substrate 1, and a wiring substrate 2. The display panel PNL includes a flat first substrate SUB1, a flat polarizing plate POL disposed to face the first substrate SUB1, and a resin substrate 5. In this embodiment, the display panel PNL is an organic EL display panel having the organic EL element OLED as an electro-optical layer.

The display panel PNL includes a display area DA for displaying an image and a non-display area NDA other than the display area DA. The display panel PNL has a plurality of pixels PX in the display area DA. The plurality of pixels PX are arranged in a matrix in the first direction X and the second direction Y.

The first substrate SUB1 has a pad area MT located outside the area overlapping the polarizing plate POL. More specifically, three side edges of the first substrate SUB1 are aligned with 3 side edges of the polarizing plate POL in the third direction Z. The length of the side edge of the first substrate SUB1 parallel to the first direction X is substantially equal to the length of the side edge of the polarizing plate POL parallel to the first direction X. The length of the side edge of the first substrate SUB1 parallel to the second direction Y is longer than the length of the side edge of the polarizing plate POL parallel to the second direction Y. In other words, the area of the first substrate SUB1 parallel to the X-Y plane is larger than the area of the polarizing plate POL parallel to the X-Y plane. Here, the X-Y plane is a plane defined by the first direction X and the second direction Y.

In the illustrated example, the wiring substrate 1 is mounted above the pad (japanese text: パッド) area MT in the non-display area NDA. In the illustrated example, the length of the side edge of the wiring substrate 1 parallel to the first direction X is smaller than the length of the side edge of the first substrate SUB1 and the polarizing plate POL parallel to the first direction X, but may be equal to each other. The display panel PNL and the wiring substrate 1 are electrically connected to each other. The wiring substrate 2 is disposed below the wiring substrate 1.

The

wiring substrates

1 and 2 are flexible substrates having flexibility, for example. In addition, the flexible substrate applicable to this embodiment may have at least a portion thereof provided with a flexible portion formed of a bendable material.

In the present embodiment, the display device DSP has a bending area BA that is an area to be bent when it is housed in a case of an electronic apparatus or the like. In the figure, the bend area BA is hatched. That is, the bending area BA is bent such that the wiring substrate 1 and the wiring substrate 2 are disposed below the display area DA. The bending area BA is located within the non-display area NDA.

The resin substrate 5 is located below the display panel PNL and is bonded to the first substrate SUB 1. The resin substrate 5 is not disposed at a position facing the bent area BA in the third direction Z.

Fig. 2 is a cross-sectional view showing the display area DA of the display device DSP shown in fig. 1.

As shown in fig. 2, the first substrate SUB1 includes a first insulating substrate 10, a plurality of switching (switching) elements SW, a plurality of light reflecting layers 4, a plurality of organic EL elements OLED, a sealing layer 41, a resin substrate 5, and the like. The pixel PX has a plurality of sub-pixels SPX. In the present embodiment, the pixel PX has three sub-pixels SPX. Each sub-pixel SPX has a single switching element SW, a single organic EL element OLED, and the like. In the explanation of fig. 2, the configuration of a single sub-pixel SPX is explained, but the configurations of other sub-pixels SPX are also the same. The first insulating substrate 10 is formed using an organic insulating material, for example, polyimide. Therefore, the first insulating substrate 10 may be referred to as an organic insulating substrate (resin substrate) more preferably. Alternatively, the first insulating substrate 10 may be referred to as an insulating layer, an organic insulating layer, or a resin layer. The first insulating substrate 10 has a first surface 10A and a second surface 10B opposite to the first surface 10A. The first insulating substrate 10 is covered with a first insulating film 11.

The switching element SW is formed above the first insulating film 11. In the illustrated example, the switching element SW is formed of a top gate thin film transistor, but may be formed of a bottom gate thin film transistor. The switching element SW has a semiconductor layer SC formed on the first insulating film 11. The semiconductor layer SC is covered with the second insulating film 12. Further, the second insulating film 12 is also disposed on the first insulating film 11.

The gate electrode WG of the switching element SW is formed on the second insulating film 12, and is located right above the semiconductor layer SC. The gate electrode WG is covered with a third insulating film 13. The third insulating film 13 is also disposed on the second insulating film 12.

The first insulating film 11, the second insulating film 12, and the third insulating film 13 are formed of an inorganic material such as silicon oxide or silicon nitride, for example.

The source electrode WS and the drain electrode WD of the switching element SW are formed on the third insulating film 13. The source electrode WS and the drain electrode WD are electrically connected to the semiconductor layer SC through contact holes penetrating the second insulating film 12 and the third insulating film 13, respectively. The switching element SW is covered with the fourth insulating film 14. The fourth insulating film 14 is also disposed on the third insulating film 13. The fourth insulating film 14 is made of an organic material such as a transparent resin, for example.

The light reflecting layer 4 is disposed on the fourth insulating film 14. The light reflecting layer 4 is made of a metal material having high light reflectance such as aluminum or silver. The surface of the light reflecting layer 4 (in other words, the surface on the polarizing plate POL side) may be a flat surface or may be a concave-convex surface for imparting light scattering properties.

The organic EL element OLED is formed on the fourth insulating film 14. In the illustrated example, the organic EL element OLED is electrically connected to the switching element SW. For example, the pixel PX includes an organic EL element OLED emitting red light, an organic EL element OLED emitting green light, and an organic EL element OLED emitting blue light. The color of light emitted from the organic EL element OLED is not limited to the present embodiment, and various modifications can be made.

In addition, unlike the present embodiment, the organic EL element OLED may be configured to emit white light. In this case, the display panel PNL may have a filter.

The organic EL element OLED has a pixel electrode PE formed on the light reflection layer 4. The pixel electrode PE is formed of a metal material such as aluminum or silver and/or a transparent conductive material such as Indium Tin Oxide (ITO) or Indium Zinc Oxide (IZO), for example.

A partition insulating layer 15 is provided on the fourth insulating film 14 and the pixel electrode PE. On the partition insulating layer 15, a through hole is provided at a position corresponding to the pixel electrode PE, or a slit is provided at a position corresponding to a column or a row where the pixel electrode PE is formed. Here, the partition insulating layer 15 has, as an example, a through hole at a position corresponding to the pixel electrode PE.

The organic EL element OLED also has an organic light-emitting layer ORG and a common electrode CE. One of the pixel electrode PE and the common electrode CE is an anode, and the other is a cathode. The organic light emitting layer ORG is located on the pixel electrode PE.

The common electrode CE is located on the organic light emitting layer ORG and the partition insulating layer 15. The common electrode CE is made of a transparent conductive material such as ITO or IZO. In the illustrated example, the organic EL elements OLED are divided by partition insulating layers 15, respectively. Although not shown, the organic EL element OLED is preferably sealed by a transparent sealing film.

In addition, unlike the present embodiment, the organic EL element may be configured as a so-called bottom emission type (japanese text: ボトムエミッションタイプ) that emits light toward the first insulating substrate 10. In this case, the position and the like of the light reflection layer 4 are variously adjusted.

In order to suppress the intrusion of oxygen and moisture, the sealing layer 41 covers the organic EL element OLED to prevent deterioration of the element. The sealing layer 41 may be formed of a laminate of an inorganic film and an organic film. The polarizing plate POL is disposed above the sealing layer 41 via the adhesive layer AD 5.

The resin substrate 5 is disposed below the first substrate SUB 1. The resin substrate 5 is bonded to the second surface 10B of the first insulating substrate 10 by an adhesive layer AD 2. As the material of the resin substrate 5, for example, a material excellent in heat resistance, exhaust gas shielding property, moisture resistance, strength and low cost is preferable. The resin substrate 5 has heat resistance to such an extent that it is not altered or deformed by the process temperature in the process of manufacturing the display device DSP, for example. The resin substrate 5 has a strength higher than that of the first insulating substrate 10, and functions as a support layer. By adding the resin substrate 5, the display panel PNL becomes difficult to bend without applying stress from the outside. The resin substrate 5 has, for example, moisture-proof properties for suppressing moisture or the like from entering the first insulating substrate 10, and exhaust gas-blocking properties for suppressing the entry of exhaust gas, and functions as a barrier layer. In the present embodiment, the resin substrate 5 is a film formed using polyethylene terephthalate, for example.

The pixel PX shown in fig. 1 is, for example, the smallest unit constituting a color image, and includes the organic EL element OLED described above.

Fig. 3 is another cross-sectional view of the display device DSP shown in fig. 1, and is a view showing a non-display area NDA and the like.

As shown in fig. 3, the resin substrate 5 includes a first portion 5a and a second portion 5b spaced apart from the first portion 5 a. The display panel PNL includes a first region AR1, a second region AR2 adjacent to the first region AR1, and a third region AR3 adjacent to the second region AR 2. The second region AR2 is located between the first region AR1 and the third region AR 3.

In the present embodiment, the first substrate SUB1 is defined as a plan view when viewed from the polarizing plate POL. The first area AR1 corresponds to an area overlapping the first portion 5a in plan view. The second region AR2 corresponds to a region where the resin substrate 5 is not arranged in a plan view. The third area AR3 corresponds to an area overlapping with the second portion 5b in plan view. Further, the first portion 5a is adhered to the first region AR1 by an adhesive layer AD2, and the second portion 5b is adhered to the third region AR3 by an adhesive layer AD 2.

The signal wiring 6 is continuously arranged from the first area AR1 to the third area AR 3. The signal wiring 6 corresponds to a power supply line, various control wirings, and the like. The pad PD is disposed in the third area AR 3. The pad PD is electrically connected to the signal wiring 6 through a contact hole CH formed on the fourth insulating film 14.

The wiring substrate 1 is mounted on the third area AR3 via the anisotropic conductive film 8 which is a conductive material. The wiring substrate 1 includes a core substrate (japanese text: コア substrate) 200, a connection wiring 100 disposed on the lower surface side of the core substrate 200, and a driver IC chip 3 disposed on the lower surface side of the core substrate 200. The driver IC chip 3 functions as a signal supply source for supplying a signal necessary for driving the display panel PNL.

The protective layer PR is disposed on the signal wiring 6. In the illustrated example, the protective layer PR covers an end portion of the partition insulating layer 15, an end portion of the sealing layer 41, and an end portion of the wiring substrate 1.

Here, the bent area BA also shown in fig. 1 is included in the second area AR 2. Alternatively, the bent area BA is an area equivalent to the second area AR 2. The bending region BA is bent, and the pad PD is disposed on the back surface side of the display panel PNL.

Fig. 4 is a cross-sectional view showing the display device DSP, and shows a state in which the bending region BA of the display panel PNL is bent.

As shown in fig. 4, the bent area BA is bent such that the first area AR1 of the display panel PNL faces the wiring substrate 1. The display panel PNL has the second area AR2 where the resin substrate 5 is not disposed. Therefore, the radius of curvature of the bent area BA can be reduced (for example, 1.0mm or less). The pedestal portion 7 is disposed between the first region AR1 and the wiring substrate 1. Even when an impact is applied from the outside, the placement table unit 7 causes stress from the placement table unit 7 to the display panel PNL or the wiring substrate 1 in response to the impact, and thus the display panel PNL or the wiring substrate 1 is less likely to be damaged. Further, the adhesion between the first region AR1 and the wiring substrate 1 is improved by the placement base portion 7.

The adhesive layer a1 is disposed between the first region AR1 and the base portion 7, and adheres the two. The adhesive layer a2 is disposed between the wiring board 1 and the pedestal portion 7, and adheres the two. The adhesive layers a1 and a2 may be formed continuously as shown in the figure, or may be formed separately. The adhesive layers a1 and a2 are, for example, double-sided tapes.

The display device DSP is configured as described above.

As described above, by bending the bent portion BA of the display panel PNL, the edge of the electronic device or the like housing the display panel PNL can be narrowed or reduced in size. Further, the housing volume can be reduced without reducing the width of the non-display area NDA. As described above, from the viewpoint of folding the display panel PNL, the second region AR2 where the resin substrate 5 is not disposed is necessary in the display panel PNL.

Next, a method for manufacturing the display device DSP will be described. In particular, a method for manufacturing the display panel PNL will be described. Fig. 5 is a flowchart for explaining a method of manufacturing the display device DSP according to the present embodiment. In fig. 5, the entire manufacturing process of the display device DSP is not shown.

As shown in fig. 5, after the manufacturing process of the display device DSP is started, in step ST1, a substrate, a display mother substrate, and a polarizing plate are prepared, and then in step ST2, the polarizing plate is attached to the display mother substrate. Next, the process proceeds to step ST3, where the first curable resin is applied to the display mother substrate to which the polarizing plate is attached, and the first curable resin is cured. Then, in step ST4, the joined body including the substrate, the display mother substrate, the polarizing plate, and the like is conveyed.

Fig. 6 to 9 are used for step ST1, fig. 10 is used for step ST2, and fig. 11 is used for step ST 3.

Next, the substrate is peeled off from the display mother substrate in step ST5, and the resin substrate is attached to the display mother substrate in step ST 6. Then, the process proceeds to step ST7, where a second curable resin is applied to the display mother substrate to which the resin substrate is attached, and the second curable resin is cured. Next, the joined body is cut into a plurality of display panels in step ST8, and the first curable resin is peeled off from the display panels in step ST 9.

Fig. 13 will be used for steps ST6, ST7, and ST8, and fig. 14 will be used for step ST 9.

Then, in step ST10, a wiring board is mounted on the display panel, and in step ST11, the outer shape of the display panel is adjusted. Next, the process proceeds to step ST12, where the second curable resin is peeled off from the display panel. Next, the display panel is bent in step ST13, and the manufacturing process of the display device DSP is completed to obtain the display device DSP.

Note that, step ST10 will be described later using fig. 14, and step ST11 will be described later using fig. 15.

Next, a method for manufacturing the display device DSP will be described in detail. Fig. 6 is a diagram for explaining a method of manufacturing the display device DSP according to the present embodiment, and is a cross-sectional view showing a state in which the first insulating substrate 10, the first pattern layer PT1, and the sealing layer 41 are formed on the substrate GL.

As shown in fig. 6, first, a substrate GL is prepared. The substrate GL is formed of glass, for example. The first insulating substrate 10, the first pattern layer PT1, and the sealing layer 41 are sequentially formed on the substrate GL. Thereby, the display mother substrate DI having the first insulating substrate 10, the first pattern layer PT1, and the sealing layer 41 is formed on the substrate GL. Here, the first pattern layer PT1 includes a plurality of members located between the first insulating substrate 10 and the sealing layer 41 shown in fig. 2. Therefore, the first pattern layer PT1 includes a plurality of members from the first insulating film 11 to the common electrode CE, such as the organic EL element OLED. The sealing layer 41 formed above the substrate GL is not a continuous layer, and the first pattern layer PT1 is partially exposed.

Fig. 7 is a perspective view showing the substrate GL and the display mother substrate DI shown in fig. 6.

As shown in fig. 7, the display mother substrate DI has a plurality of effective regions Ca. The plurality of effective regions Ca are arranged in a matrix in the first direction X and the second direction Y. In the plurality of effective regions Ca arranged in the first direction X, short sides of the plurality of effective regions Ca are aligned in the first direction X. In the plurality of effective regions Ca arranged in the second direction Y, long sides of the plurality of effective regions Ca are aligned in the second direction Y. The display mother substrate DI has a non-effective region Cb, which is a region other than the effective region Ca.

Each effective region Ca corresponds to the first substrate SUB 1. In this embodiment, 12 first substrates SUB1 are formed on one display mother substrate DI. Although not shown in the drawings, each effective region Ca includes a display region DA, a bent region BA, and the like. In the figure, the bend area BA is hatched. For example, the plurality of bending regions BA are aligned in the first direction X in the plurality of effective regions Ca arranged in the first direction X.

A plurality of first alignment marks M1 and a plurality of second alignment marks M2 are formed on the display mother substrate DI. The first patterned layer PT1 has a first alignment mark M1 and a second alignment mark M2. The first alignment marks M1 are used to display the overall alignment of the mother substrate DI, for example, at the four corners of the display mother substrate DI. The second alignment marks M2 are used to align the effective regions Ca, and are formed around the respective effective regions Ca, for example.

When the plurality of first substrates SUB1 are separated from one display mother substrate DI, the display mother substrate DI is cut along the first predetermined breaking line e1 and the second predetermined breaking line e 2. The first line e1 is parallel to the first direction X, and the second line e2 is parallel to the second direction Y. In the present embodiment, the first line to break e1 passes through one side (short side) of the plurality of effective regions Ca aligned in the first direction X.

Fig. 8 is a cross-sectional view showing the substrate GL and the display mother substrate DI taken along the line VIII-VIII of fig. 7.

As shown in fig. 8, the effective region Ca includes a display region DA, a bent region BA, and a pad region MT.

The surface of the display mother substrate DI opposite to the substrate GL has a first pasting region Aa1 and a first non-pasting region Ab 1. The display area DA is located in the first pasting area Aa1, and the bending area BA and the pad area MT are located in the first non-pasting area Ab 1.

The first attached region Aa1 is a region to which the polarizing plate POL as the first resin substrate is attached, and the first non-attached region Ab1 is a region to which the polarizing plate POL is not attached. In the present embodiment, the first non-attachment region Ab1 is set in the effective region Ca in a one-to-one relationship. The plurality of first non-attachment regions Ab1 of the display mother substrate DI are disposed at intervals.

The surface of the display mother substrate DI facing the substrate GL has a second pasting region Aa2 and a second non-pasting region Ab 2. The display area DA and the pad area MT are located in the second pasting area Aa2, and the bending area BA is located in the second non-pasting area Ab 2.

The second pasting region Aa2 is a region to which the resin substrate 5 as the second resin substrate is pasted, and the second non-pasting region Ab2 is a region to which the resin substrate 5 is not pasted. In the present embodiment, the second non-attachment region Ab2 is set in the effective region Ca in a one-to-one relationship. The plurality of second non-attachment regions Ab2 of the display mother substrate DI are disposed at intervals from each other.

The first line e1 passes through the boundary between the effective region Ca and the ineffective region Cb. In the present embodiment, the first line to break e1 passes through the first non-attachment region Ab 1.

However, unlike the present embodiment, the first line to cut e1 may pass through the boundary between the first pasting region Aa1 and the first non-pasting region Ab1 (pad region MT). In this case, the first pasting region Aa1 meets the pad region MT in the second direction Y.

The third line e3 passes through the other boundary between the effective region Ca and the ineffective region Cb.

Although the substrate GL is shown in fig. 8, the display mother substrate DI is cut along the lines to cut (e1, e3) after the substrate GL is peeled off from the display mother substrate DI as described later.

As described above, the manufacturing process of the display device DSP includes a preparation process of preparing the display mother substrate DI having the display area DA, the pad area MT, and the like.

Fig. 9 is a view for explaining the above-described manufacturing method, and is a perspective view showing the polarizing plate POL. As shown in fig. 9, the polarizing plate POL has a shape of being attached to the first attachment region Aa1 and not being attached to the plurality of first non-attachment regions Ab 1. In the present embodiment, the polarizing plate POL has a plurality of first openings OP 1. The first openings OP1 correspond one-to-one to the first non-attachment regions Ab 1. The first opening OP1 has the same size as the first non-attachment region Ab1 in plan view, and is provided so as to completely overlap with the first non-attachment region Ab 1.

The polarizing plate POL of the present embodiment further includes a plurality of second openings OP2 and a plurality of third openings OP 3. The second openings OP2 correspond one-to-one to the first alignment marks M1. The second opening OP2 is provided to overlap the first alignment mark M1 in a plan view. The third openings OP3 correspond one-to-one to the second alignment marks M2. In a plan view, the third opening OP3 is provided to overlap the second alignment mark M2. By providing the second opening OP2 and the third opening OP3, good visibility of the alignment marks (M1, M2) can be ensured.

However, unlike the present embodiment, when the alignment mark (M1, M2) can be viewed across the polarizing plate POL, the polarizing plate POL may not have the second opening OP2 and the third opening OP 3.

As described above, the manufacturing process of the display device DSP includes a preparation process of preparing the polarizing plate POL.

Fig. 10 is a view for explaining the manufacturing method described above, following fig. 6 to 9, and is a cross-sectional view showing a state in which the polarizing plate POL is attached to the display mother substrate DI.

As shown in fig. 10, next, in the first bonding step, a polarizing plate POL as a first resin substrate is bonded to at least the display region DA of the display mother substrate DI. The display mother substrate DI has a surface Sf on the sealing layer 41 side and a back surface Sb on the first insulating substrate 10 side. The polarizing plate POL is attached to the surface Sf side of the display mother substrate DI and is attached to at least the sealing layer 41.

The display mother substrate DI has a first pasting region Aa1 and a first non-pasting region Ab 1. Therefore, the polarizing plate POL is attached to the first attachment region Aa1 without being attached to the first non-attachment region Ab 1.

In this embodiment, the display mother substrate DI has a first alignment mark M1 and a second alignment mark M2. Therefore, the polarizing plate POL is not attached to the region facing the first alignment mark M1 and the polarizing plate POL is not attached to the region facing the second alignment mark M2 by the second opening OP2 and the third opening OP 3.

More specifically, the first bonding step is performed by aligning the display mother substrate DI and the polarizing plate POL using the first alignment mark M1 and the second opening OP2 in a state where the adhesive layer AD5 is disposed between the surface Sf and the polarizing plate POL. This can suppress the occurrence of a relative positional shift between the display substrate DI and the polarizing plate POL.

As described above, the manufacturing process of the display device DSP includes the first attaching process of attaching the polarizing plate POL.

Fig. 11 is a view for explaining the above-described manufacturing method, which is described next to fig. 10, and is a cross-sectional view showing a state where the first curable resin RE1 is applied to the first non-sticking region Ab 1.

As shown in fig. 11, a first curable resin RE1 is applied to the first non-attached region Ab1 including the pad region MT and to which the polarizing plate POL is not attached. In the present embodiment, the first curable resin RE1 is independently applied for each first non-sticking area Ab 1. The layers of first curable resin RE1 are disposed at intervals from each other.

Further, the first curable resin RE1 is coated to such an extent that it fills the first opening OP1 and overflows to the outside of the first opening OP 1. In other words, the first curable resin RE1 is applied on the first pattern layer PT1 of the first non-attached region Ab1 and on the region surrounding the first non-attached region Ab1 in the polarizing plate POL. Then, a side surface S1 of the layer of the first curable resin RE1 is exposed to the outside of the first opening OP 1. The side surface S1 is exposed outside the first opening OP1 because the first curable resin RE1 is easily peeled off from the first pattern layer PT1 and the like in the subsequent manufacturing process.

In the present embodiment, an application apparatus using an ink jet method is used for applying first curable resin RE 1. However, unlike the present embodiment, a slit coater may be used to apply first curable resin RE 1. The first curable resin RE1 may be either a thermosetting resin or an ultraviolet curable resin.

Examples of the material used for the first curable resin RE1 include acrylic materials and urethane materials. The polyurethane material can easily obtain a desired rigidity, and is suitable for reinforcing the first non-sticking region Ab 1. However, in the case of the urethane material, the first curable resin RE1 tends to be cloudy as the rigidity is required to be high. In this case, when first curable resin RE1 is entirely coated, it may be difficult to read the alignment marks, and care must be taken.

In the first resin application step, the first curable resin RE1 is not applied to the region facing the first alignment mark M1 including the second opening OP2 and the region facing the second alignment mark M2 including the third opening OP 3.

As described above, the manufacturing process of the display device DSP includes the first resin application process of applying the first curable resin RE 1.

Here, in the first resin application step, the first curable resin RE1 may be applied at least to the first non-attachment region Ab 1. Therefore, unlike the present embodiment, only the first curable resin may be applied to the first non-attachment region Ab 1. In this case, a side S1 of the layer of the first curable resin RE1 is formed inside the first opening OP 1.

In addition, unlike the present embodiment, the first curable resin RE1 may be applied to the second opening OP2 and the third opening OP 3. In this case, the first curable resin RE1 may have a transparency to such an extent that visibility of the alignment marks (M1, M2) is not hindered. In view of the above transparency, for example, the haze (haze) of first curable resin RE1 is preferably 5% or less. In addition, in order to improve the peelability, the first curable resin E1 may be applied to the entire display mother substrate DI.

Next, the process proceeds to a curing step to cure first curable resin RE 1. For example, the first curable resin RE1 is irradiated with ultraviolet rays to be cured. Thereby, the first non-attachment region Ab1 can be reinforced by the first curable resin RE 1. After the substrate GL is separated from the display mother substrate DI, the handling of the assembly of the display mother substrate DI, the polarizing plate POL, and the like becomes easy. Therefore, the subsequent manufacturing process of separating the substrate GL from the joined body can be easily performed.

After the curing step, the Young's modulus of first curable resin RE1 is preferably 0.4GPa to 4 GPa. The young's modulus can be obtained by using a polyurethane material, for example. When the young's modulus is within the above range, the above treatment becomes easier.

Further, the display mother substrate DI can be reinforced by the polarizing plate POL and the first curable resin RE 1. Further, since the first curable resin RE1 fills each opening, the handling property of the display mother substrate DI is improved. Therefore, the display mother substrate DI may be reinforced with an indirect material without the steps before the first pasting step, the first resin coating step, and the curing step.

The adhesion force of the first curable resin RE1 and the first pattern layer PT1 per unit area is lower than that of the polarizing plate POL and the sealing layer 41.

As described above, the manufacturing process of the display device DSP includes a curing process of curing the first curable resin RE 1.

After the curing step, the process proceeds to a conveying step to convey the assembly of the substrate GL, the display mother substrate DI, the polarizing plate POL, and the like.

Next, the process proceeds to a cleaning step of cleaning the substrate GL. The surface of the substrate GL opposite to the first insulating substrate 10 is cleaned by a cleaning device. Here, the substrate GL is dry-cleaned using a brush or the like. This makes it possible to remove foreign matter present on the back surface of the substrate GL. Then, the substrate GL, the display mother substrate DI, the polarizing plate POL, and the like are conveyed.

Next, the first insulating substrate 10 is irradiated with laser light from the back surface side of the substrate GL using laser light. By cleaning the substrate GL, the laser light can be favorably irradiated to the first insulating substrate 10. When the laser light reaches the first insulating substrate 10, ablation (ablation) is generated at the interface between the first insulating substrate 10 and the substrate GL, which is decomposed by absorbing the laser light. This generates a space at the interface between the substrate GL and the first insulating substrate 10, and the substrate GL is peeled off from the first insulating substrate 10. Then, the display mother substrate DI, the polarizing plate POL, and the like are conveyed.

Fig. 12 is a view for explaining the above-described manufacturing method, and is a perspective view showing the resin substrate 5. As shown in fig. 12, a resin substrate 5 as a second resin substrate is prepared. The resin substrate 5 has a shape that is stuck to the second sticking area Aa2 and not stuck to the plurality of second non-sticking areas Ab 2. In the present embodiment, the resin substrate 5 has a plurality of fourth openings OP 4. The fourth openings OP4 correspond to the second non-attached region Ab2 one-to-one. The fourth opening OP4 has the same size as the second non-attachment region Ab2 in plan view, and is provided so as to completely overlap with the second non-attachment region Ab 2.

In the present embodiment, the resin substrate 5 has no opening in the region facing the alignment mark (M1, M2).

As described above, the manufacturing process of the display device DSP includes a preparation process of preparing the resin substrate 5.

Fig. 13 is a view for explaining the above-described manufacturing method, which is described next with reference to fig. 11 and 12, and is a cross-sectional view showing a state where the resin substrate 5 is attached to the display mother substrate DI and the second curable resin RE2 is applied to the second non-attachment region Ab2, and a state where the display mother substrate DI and the like are cut off to separate into individual display panels.

As shown in fig. 13, next, in the second pasting step, the resin substrate 5 as the second resin substrate is pasted on at least the display area DA of the display mother substrate DI. The resin substrate 5 is bonded to the first insulating substrate 10 on the back surface Sb side of the display mother substrate DI.

The display mother substrate DI has a second pasting region Aa2 and a second non-pasting region Ab 2. Therefore, the resin substrate 5 is stuck to the second sticking area Aa2, not to the second non-sticking area Ab 2. The second non-attachment region Ab2 is surrounded by the resin substrate 5 in plan view. In the present embodiment, the resin substrate 5 is attached to the region facing the first alignment mark M1 and the region facing the second alignment mark M2.

More specifically, in the second bonding step, the resin substrate 5 is bonded to the display mother substrate DI after the display mother substrate DI and the resin substrate 5 are aligned with each other with the adhesive layer AD2 disposed between the first insulating substrate 10 and the resin substrate 5.

According to the above, the manufacturing process of the display device DSP includes the second bonding process of bonding the resin substrate 5.

Next, the process proceeds to a second resin application step, where second curable resin RE2 is applied to second non-attachment region Ab2 facing first non-attachment region Ab1 and to which resin substrate 5 is not attached. In the present embodiment, the second curable resin RE2 is independently applied for each second non-sticking area Ab 2. The layers of second curable resin RE2 are disposed at intervals from each other.

Also, the second curable resin RE2 is coated to the extent of filling the fourth opening OP4 and overflowing to the outside of the fourth opening OP 4. In other words, the second curable resin RE2 is applied to the region surrounding the second non-pasting region Ab2 in the first insulating substrate 10 side and the resin substrate 5 side of the second non-pasting region Ab 2. Then, a side S2 of the layer of the second curable resin RE2 is exposed to the outside of the fourth opening OP 4. The side surface S2 is exposed to the outside of the fourth opening OP4 because the second curable resin RE2 is easily peeled off from the resin substrate 5 and the like in the subsequent manufacturing process.

In the second resin coating step, the coating apparatus used in the first resin coating step can be used. The material used for the second curable resin RE2 is the same as the material used for the first curable resin RE 1. For example, a urethane material can be used for second curable resin RE 2.

However, the visibility may not be ensured on the back surface Sb side of the display mother substrate DI, unlike on the front surface Sf side of the display mother substrate DI. Therefore, the transparency of second curable resin RE2 may be low, and second curable resin RE2 may be opaque.

As described above, the manufacturing process of the display device DSP includes the second resin coating process of coating the second curable resin RE 2.

Here, in the second resin application step, second curable resin RE2 may be applied to at least second non-attachment region Ab 2. Therefore, unlike the present embodiment, only the second curable resin may be applied to the second non-attachment region Ab 2. In this case, the side S2 of the layer of the second curable resin RE2 is formed inside the fourth opening OP 4.

Next, the process proceeds to a curing step to cure second curable resin RE 2. For example, the second curable resin RE2 is irradiated with ultraviolet rays to be cured. Thereby, the second non-attachment region Ab2 can be reinforced by the second curable resin RE 2. Handling of the joined body of the display mother substrate DI, the polarizing plate POL, the resin substrate 5, and the like becomes easy. Therefore, the manufacturing process after the resin substrate 5 is bonded to the joined body can be easily performed.

The curing step includes a curing step of curing the first curable resin RE1 and a curing step of curing the second curable resin RE 2. After the curing step, the young's modulus of second curable resin RE2 is preferably 0.4GPa to 4 GPa.

Further, the display mother substrate DI can be reinforced by the resin substrate 5 and the second curable resin RE 2. Therefore, the display mother substrate DI may not be reinforced with an indirect material in the steps before the second pasting step, the second resin application step, and the curing step of the second curable resin RE 2.

The adhesion force of second curable resin RE2 and first insulating substrate 10 per unit area is lower than the adhesion force of resin substrate 5 and first insulating substrate 10.

As described above, the manufacturing process of the display device DSP includes a curing process of curing the second curable resin RE 2.

After the curing step of the second curable resin RE2, the process proceeds to a conveying step, and the resin substrate 5, the display mother substrate DI, the polarizing plate POL, and the like are conveyed.

Here, from the viewpoint of handling of the above-mentioned joined body, it is preferable to avoid the case where the second curable resin RE2 is unnecessarily peeled off before the first curable resin RE1 is peeled off from the above-mentioned joined body. Therefore, the adhesion of the second curable resin RE2 to the display mother substrate DI is preferably higher than the adhesion of the first curable resin RE1 to the display mother substrate DI. In detail, it is preferable that the adhesion force of the second curable resin RE2 and the first insulating substrate 10 is higher than that of the first curable resin RE1 and the first pattern layer PT 1.

For example, the material used for the second curable resin RE2 and the material used for the first curable resin RE1 are different from each other.

Alternatively, the adhesion area of the second curable resin RE2 to the first insulating substrate 10 and the resin substrate 5 can be made larger than the adhesion area of the first curable resin RE1 to the first pattern layer PT1 and the polarizing plate POL.

Then, the process proceeds to a cutting step, and the resin substrate 5, the display mother substrate DI, the polarizing plate POL, and the like are divided along the first lines to cut e 1. In the cutting step, the joined body is divided along the second lines to cut e2 shown in fig. 6 and the like. This enables the joined body to be cut into a plurality of display panels PNL.

In the present embodiment, when the joined body is divided, a score line is formed along the planned dividing line. However, unlike the present embodiment, when the joined body is divided, the joined body may be irradiated with a laser along the planned disconnection line.

Then, the process proceeds to a peeling step to peel the first curable resin RE1 from the first non-attachment region Ab 1. At this time, since the side surface S1 of the layer of the first curable resin RE1 is exposed as described above, the first curable resin RE1 can be easily peeled off from the polarizing plate POL or the like.

As described above, the manufacturing process of the display device DSP includes a peeling process of peeling the first curable resin RE 1.

As described above, in the present embodiment, after the cutting step, a peeling step of peeling off first curable resin RE1 is provided. However, unlike the present embodiment, the cutting step may be provided after the peeling step of peeling off first curable resin RE 1.

Then, the process proceeds to a lighting check. After the first curable resin RE1 is peeled off, the pad PD and the like in the pad area MT are exposed. In the lighting inspection, the presence or absence of the organic EL element which becomes a bright point or the presence or absence of the organic EL element which becomes a dead point is detected by the soldering land PD.

Fig. 14 is a view for explaining the manufacturing method described above after fig. 13, and is a cross-sectional view for explaining a step of bonding the wiring substrate 1 to the display panel PNL and a step of forming the protective layer PR.

As shown in fig. 14, after the display panel PNL having passed the lighting inspection is mounted on the wiring substrate 1, the protective layer PR is formed on the display panel PNL.

An anisotropic conductive film 8 is disposed between the wiring substrate 1 and the display panel PNL at a position overlapping with the pad PD, and pressure is applied from above the wiring substrate 1 and below the display panel PNL to heat the wiring substrate and the display panel PNL. Thereby, the anisotropic conductive film 8 melts, and the wiring substrate 1 and the display panel PNL are electrically and physically connected.

Next, on the signal wiring 6, a protective layer PR is formed. In the illustrated example, the protective layer PR covers the end portion 15E of the partition insulating layer 15 and the end portion 41E of the sealing layer 41. Further, the end portion 1E of the wiring substrate 1 is covered. The protective layer PR is formed using an organic insulating material such as epoxy resin, and is formed by being cured by UV irradiation or heat.

After the wiring substrate 1 is mounted on the display panel PNL, the inspection is performed again. This inspection is performed by driving the display panel PNL with the wiring substrate 1, the wiring substrate 2, and the drive IC chip 3.

Fig. 15 is a view for explaining the manufacturing method described above in fig. 14 and thereafter, and is a cross-sectional view showing a state in which the display panel PNL is cut off in order to adjust the outer shape of the display panel PNL.

As shown in fig. 15, the display panel PNL passes through the inspection after mounting the wiring substrate 1 and the like, and then proceeds to the cutting step. In the cutting step, the display panel PNL is divided along the third line to break e3, the fourth line to break e4, and the fifth line to break e5, and therefore the positions of these lines to break can be adjusted by the second alignment marks M2 and the third openings OP 3. The third line e3 is parallel to the first direction X, and the fourth line e4 and the fifth line e5 are parallel to the second direction Y.

In the present embodiment, the third line e3 passes through the short side of the effective region Ca parallel to the first direction X. Therefore, the first line e1 passes through one short side of the effective region Ca, and the third line e3 passes through the other short side of the effective region Ca. The fourth line e4 extends along one long side of the effective region Ca, and the fifth line e5 extends along the other long side of the effective region Ca.

In the cutting step, first, the display panel PNL is divided along the third lines to cut e 3. The second alignment mark M2 remains on the display panel PNL. Therefore, the display panel PNL is divided along the fourth line e4 and the fifth line e5 by adjusting the positions of the fourth line e4 and the fifth line e5 using the second alignment mark M2.

In the present embodiment, when the display panel PNL is divided, a scribe line (scribe line) is scribed along a line to be cut on the display panel PNL. However, unlike the present embodiment, when the display panels PNL are divided, the joined body may be irradiated with laser light along the planned disconnection lines.

This allows the outer shape of the display panel PNL to face the effective region Ca.

As described above, the manufacturing process of the display device DSP includes a cutting process of dividing the display panel PNL.

As shown in fig. 3, the process then proceeds to a peeling step to peel the second curable resin RE2 from the second non-attachment region Ab 2. As with the layer of the first curable resin RE1, the side surface S2 of the layer of the second curable resin RE2 is also exposed, and therefore the second curable resin RE2 can be easily peeled off from the first insulating substrate 10 or the like.

As described above, the manufacturing process of the display device DSP includes a peeling process of peeling the second curable resin RE 2. The peeling step includes a peeling step of peeling the first curable resin RE1 and a peeling step of peeling the second curable resin RE 2.

As shown in fig. 4, after the positioning of the pedestal portion 7, the pedestal portion 7 is bonded to the first portion 5a by the adhesive layer AD. Then, the bending area BA of the display panel PNL is bent such that the pad PD is disposed below the display panel PNL. In other words, with the pedestal portion 7 as a base point, the wiring substrate 1 is arranged below the pedestal portion 7, the bending region BA is bent, and the wiring substrate 1 is attached to the pedestal portion 7 through the adhesive layer a 2.

Through the above manufacturing process, the display device DSP is completed.

According to the method for manufacturing the display device DSP of the embodiment configured as described above, the display mother substrate DI can be reinforced without using an indirect material, or using the polarizing plate POL, or using the resin substrate 5 in the manufacturing process. Further, the amount of the first opening OP1 formed on the polarizing plate POL can be reinforced by the first curable resin RE 1. The amount of the fourth opening OP4 formed on the resin substrate 5 can be reinforced by the second curable resin RE 2.

As described above, a method for manufacturing the display panel PNL and a method for manufacturing the display device DSP can be obtained, which can suppress the increase in manufacturing cost. Further, a method for manufacturing the display panel PNL and a method for manufacturing the display device DSP can be obtained, in which the increase in the manufacturing time can be suppressed.

(modification 1 of the above embodiment)

Next, modification 1 of the above embodiment will be described. Fig. 16 is a view for explaining a method of manufacturing the display device DSP according to modification 1, and is a cross-sectional view showing a state in which the first curable resin RE1 is applied to both the first pasting region Aa1 and the first non-pasting region Ab 1.

As shown in fig. 16, in the first resin application step, the first curable resin RE1 may be entirely applied to the polarizing plate POL. Since a single layer of the first curable resin RE1 is filled in the plurality of first openings OP1, the plurality of first non-attaching regions Ab1 can be reinforced with a single layer of the first curable resin RE 1. In this case, a single layer of the first curable resin RE1 can be filled into the plurality of second openings OP2 and the plurality of third openings OP 3. Therefore, the region facing the plurality of second openings OP2 and the region facing the plurality of third openings OP3 can be reinforced by a single layer of the first curable resin RE 1. In the case where the first curable resin RE1 is filled in the second opening OP2 and the third opening OP3, it is necessary to keep track of the transparency of the first curable resin RE1 in order to maintain the visibility of the alignment mark.

In the case where the first curable resin RE1 is entirely applied to the polarizing plate POL, the surface of the single layer of the first curable resin RE1 may not be flat. The surface of the single layer of the first curable resin RE1 is the surface on the opposite side of the single layer of the first curable resin RE1 facing the polarizing plate POL.

In the peeling step of peeling the first curable resin RE1, a single layer of the first curable resin RE1 may be peeled from the polarizing plate POL. Thereby, the first curable resin RE1 can be collectively peeled off from the plurality of first non-sticking areas Ab1 and the like. The same effects as those of the above embodiment can be obtained also in modification 1.

(modification 2 of the above embodiment)

Next, a modified example 2 of the above embodiment will be explained. Fig. 17 is a view for explaining a method of manufacturing the display device DSP according to modification 2, and is a cross-sectional view showing a state in which the second curable resin RE2 is applied to both the second pasting region Aa2 and the second non-pasting region Ab 2.

As shown in fig. 17, in the second resin application step, second curable resin RE2 may be entirely applied to resin substrate 5. Since a single layer of the second curable resin RE2 is filled in the plurality of fourth openings OP4, the plurality of second non-attaching regions Ab2 can be reinforced by a single layer of the second curable resin RE 2. On the back surface Sb side of the display mother substrate DI, the transparency of the second curable resin RE2 may be lower than the transparency of the first curable resin RE 1.

In the case where the second curable resin RE2 is entirely applied onto the resin substrate 5, the surface of the single layer of the second curable resin RE2 is preferably flat. This is because the production process after providing the second curable resin RE2 on the joined body can be easily performed. The surface of the single layer of the second curable resin RE2 is the surface on the opposite side of the single layer of the second curable resin RE2 facing the resin substrate 5.

In the peeling step of peeling the second curable resin RE2, a single layer of the second curable resin RE2 is peeled from the resin substrate 5. This allows the second curable resin RE2 to be peeled collectively from the plurality of second non-sticking areas Ab2 and the like. The same effects as those of the above embodiment can be obtained also in modification 2. In addition, from the viewpoint of avoiding unnecessary peeling of second curable resin RE2, second curable resin RE2 may be applied as in modification 2.

(modification 3 of the above embodiment)

Next, modification 3 of the above embodiment will be explained. Although not shown, in modification 3, first curable resin RE1 may be applied as in modification 1 (fig. 16) and second curable resin RE2 may be applied as in modification 2 (fig. 17).

(modification 4 of the above embodiment)

Next, a modified example 4 of the above embodiment will be explained. Fig. 18 is a diagram for explaining a method of manufacturing the display device DSP according to modification 4, and is a perspective view showing the polarizing plate POL.

As shown in fig. 18, in the preparation step of preparing the polarizing plate POL, the polarizing plate POL may be adhered to the sheet SH and divided into rectangular pieces. In the polarizing plate POL, a plurality of slits SL extending in the first direction X may be formed instead of the first opening OP 1.

In the plurality of effective regions Ca arranged in the first direction X, the first non-attached region Ab1 is along the first direction X. Therefore, in the display mother substrate DI, the slits SL of the polarizing plate POL can be opposed to the plurality of first non-attachment regions Ab1 and the plurality of second alignment marks M2 arranged in the first direction X. When the first curable resin RE1 is applied, it is only necessary to apply it to at least the first non-sticking area Ab1 in the slit SL. The first curable resin RE1 may be applied to the whole slit SL depending on the transparency of the first curable resin RE 1. In this case, the first curable resin RE1 is also applied to the region opposite to the second alignment mark M2.

In the case of using the sheet SH as described above, the adhesive force between the sheet SH and the polarizing plate POL is set to be lower than the adhesive force between the display mother substrate DI and the polarizing plate POL. The same effects as those of the above embodiment can be obtained also in modification 4.

(modification 5 of the above embodiment)

Next, a modified example 5 of the above embodiment will be explained. Although not shown, in the preparation step of preparing the resin substrate 5, the resin substrate 5 is attached to a thin plate and is formed by being divided into rectangular shapes. On the resin substrate 5, a plurality of slits extending in the first direction X are formed instead of the fourth opening OP4 described above. Therefore, the slits of the resin substrate 5 can be opposed to the plurality of second non-attachment regions Ab2 arranged in the first direction X in the display mother substrate DI. When the second curable resin RE2 is applied, the second curable resin RE2 can be applied to the entire slit.

(modification 6 of the above embodiment)

Next, a modified example 6 of the above embodiment will be described. Fig. 19 is a diagram for explaining a method of manufacturing the display device DSP according to modification 6, and is a perspective view showing the polarizing plate POL.

As shown in fig. 19, in the preparation step of preparing the polarizing plate POL, the polarizing plate POL is attached to the sheet SH and is formed in a rectangular shape as in modification 4. In modification 6, the effective regions Ca arranged in the first direction X are in contact with each other. In this way, when the effective regions Ca are in contact with each other, a method of forming the slits SL in the polarizing plate POL is effective.

Then, by cutting the display mother substrate DI or the like along the second line to cut e2, the long side of the effective region Ca can be obtained. Therefore, in modification 6, unlike the above-described embodiment, the display mother substrate DI and the like may be cut without setting the fourth line e4 to cut and the fifth line e5 to cut. The same effects as those of the above embodiment can be obtained also in modification 6.

(modification 7 of the above embodiment)

Next, a modified example 7 of the above embodiment will be explained. Although not shown, in the preparation step of preparing the resin substrate 5, the resin substrate 5 is attached to a thin plate and is formed by being divided into rectangular pieces. On the resin substrate 5, a plurality of slits extending in the first direction X are formed instead of the fourth opening OP4 described above. In modification 7, the effective regions Ca arranged in the first direction X are in contact with each other. In this way, when the effective regions Ca are in contact with each other, a technique of forming slits in the resin substrate 5 is effective.

(modification 8 of the above embodiment)

Next, a modified example 8 of the above embodiment will be described. First, the configuration of the display device DSP of modification example 8 will be described. Fig. 20 is a cross-sectional view showing the display device DSP according to modification 8, and shows a non-display area NDA and the like.

As shown in fig. 20, unlike the above-described embodiment, the display device DSP according to modification 8 further includes a resin substrate 30 provided between the sealing layer 41 and the polarizing plate POL. In modification 8, the resin substrate 30 functions as a first resin substrate instead of the polarizing plate POL. The resin substrate 30 is bonded to the sealing layer 41 by an adhesive layer AD 6. The polarizing plate POL is bonded to the resin substrate 30 through the adhesive layer AD 5.

Next, a method for manufacturing the display device DSP according to modification 8 will be described. Here, a description will be given while comparing with the method of manufacturing the display device DSP of the above-described embodiment (fig. 6 to 15).

The manufacturing process of the display device DSP according to modification 8 includes a preparation process of preparing the resin substrate 30. Fig. 21 is a diagram for explaining a method of manufacturing the display device DSP according to modification example 8, and is a perspective view showing the resin substrate 30.

As shown in fig. 21, the resin substrate 30 has a shape of being attached to the first attachment region Aa1 and not being attached to the plurality of first non-attachment regions Ab 1. In modification 8, the resin substrate 30 includes a plurality of first openings OP1, a plurality of second openings OP2, and a plurality of third openings OP 3.

However, unlike modification 8, the resin substrate 30 may not have the second opening OP2 and the third opening OP 3. This is because the resin substrate 30 has high transparency, and the alignment marks (M1, M2) are easily visible through the polarizing plate POL.

In the above embodiment, as shown in fig. 10, the polarizing plate POL is attached to the display mother substrate DI with the adhesive layer AD 5. However, in modification 8, unlike the above-described embodiment, the resin substrate 30 is attached to the display mother substrate DI with the adhesive layer AD 6. In modification 8, the production is performed in the same manner as in the above-described embodiment, and the process is performed until the first curable resin RE1 is peeled off and the lighting inspection by probing is performed.

Next, the polarizing plate POL is attached to the resin substrate 30 with the adhesive layer AD 5.

Then, the wiring substrate 1 is mounted on the display panel PNL, and thereafter, the display device DSP is manufactured in the same manner as in the above-described embodiment. In modification 8, the same effects as those of the above embodiment can be obtained.

Although the embodiments of the present invention have been described, the above embodiments are presented as examples and are not intended to limit the scope of the invention. The above-described new embodiment can be implemented in other various forms, and various omissions, substitutions, and changes can be made without departing from the spirit of the invention. The above-described embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the balance thereof.

The method for manufacturing the display panel and the method for manufacturing the display device are not limited to the method for manufacturing the organic EL display panel and the method for manufacturing the organic EL display device. For example, the above-described manufacturing method can be applied to a method for manufacturing a liquid crystal display panel having a liquid crystal element as an electro-optical element and a method for manufacturing a liquid crystal display device. In this case, the display panel PNL is a liquid crystal display panel, and includes, for example, a first substrate SUB1, a second substrate, and a liquid crystal layer interposed between the first substrate and the second substrate. The electro-optical element may be an inorganic EL element.

The display panel PNL may be a reflective liquid crystal display panel that displays an image by selectively reflecting light incident from the second substrate side. Alternatively, the display panel PNL may be a transmissive liquid crystal display panel that displays an image by selectively transmitting light incident from the first substrate SUB1 side. In addition, although the reflection type is suitable when the display region DA and the wiring substrate 1 overlap each other in a plan view, a transmission type may be used if a backlight unit can be disposed between the first substrate SUB1 and the wiring substrate 1. In addition, the main configuration of the embodiment of the present invention is also substantially the same in the case where the display device DSP is a liquid crystal display device.

Claims

1. A method for manufacturing a display panel, comprising:

a preparation step of preparing a display mother substrate having a display region and a pad region;

a first bonding step of bonding a first resin substrate to the display region;

a first resin coating step of coating a first curable resin on a first non-adhesion region including the pad region and to which the first resin substrate is not adhered;

a curing step of curing the first curable resin;

a carrying step of carrying the display mother substrate after the curing step;

a peeling step of peeling the first curable resin from the first non-adhesive region after the carrying step; and

and a cutting step of cutting the display mother substrate into a plurality of display panels after the peeling step.

2. The method of manufacturing a display panel according to claim 1, wherein the first resin coating step is a step of coating the first curable resin on the first non-attachment region and the first resin substrate.

3. The method of manufacturing a display panel according to claim 2, wherein a side surface of the layer of the first curable resin is exposed when the peeling step is performed.

4. The method of manufacturing a display panel according to claim 1, wherein the first resin substrate is a polarizing plate.

5. The method for manufacturing a display panel according to claim 1,

further comprising:

a second bonding step of bonding a second resin substrate to the display region; and

a second resin coating step of coating a second curable resin on a second non-bonded region which is opposed to the first non-bonded region and to which the second resin substrate is not bonded,

the curing step includes a step of curing the second curable resin,

the peeling step includes a step of peeling the second curable resin from the second non-attachment region,

the display mother substrate has a front surface and a back surface,

the first resin substrate is attached to the front surface side, and the second resin substrate is attached to the back surface side.

6. The method for manufacturing a display panel according to claim 5,

the first resin coating step is a step of coating the first curable resin only to the first non-attachment region,

the second resin coating step is a step of coating the second curable resin on the second non-attachment region and the second resin substrate,

the second non-bonded region is surrounded by the second resin substrate in a plan view,

in the peeling step, a side surface of the layer of the first curable resin is exposed.

7. The method of manufacturing a display panel according to claim 5, wherein the adhesion of the second curable resin to the display mother substrate is larger than the adhesion of the first curable resin to the display mother substrate.

8. The method for manufacturing a display panel according to claim 1, wherein the young's modulus of the first curable resin is 0.4GPa to 4 GPa.

9. The method for manufacturing a display panel according to claim 1,

the display mother substrate is provided with an alignment mark,

in the first resin application step, the first curable resin is not applied to a region facing the alignment mark.

10. The method for manufacturing a display panel according to any one of claims 1 to 9,

the display mother substrate is provided with an alignment mark,

in the first bonding step, the first resin substrate is not bonded to a region facing the alignment mark.

11. A method for manufacturing a display panel, comprising:

a first bonding step of bonding a first resin substrate to the display region;

a curing step of curing the first curable resin;

a carrying step of carrying the display mother substrate after the curing step;

a cutting step of cutting the display mother substrate into a plurality of display panels after the carrying step; and

and a peeling step of peeling the first curable resin from the first non-adhesive region after the cutting step.

12. The method of manufacturing a display panel according to claim 11, wherein the first resin coating step is a step of coating the first curable resin on the first non-attachment region and the first resin substrate.

13. The method of manufacturing a display panel according to claim 12, wherein a side surface of the layer of the first curable resin is exposed when the peeling step is performed.

14. The method of manufacturing a display panel according to claim 11, wherein the first resin substrate is a polarizing plate.

15. The method for manufacturing a display panel according to claim 11,

further comprising:

the curing step includes a step of curing the second curable resin,

the display mother substrate has a front surface and a back surface,

16. The method for manufacturing a display panel according to claim 15,

17. The method of manufacturing a display panel according to claim 15, wherein the adhesion of the second curable resin to the display mother substrate is larger than the adhesion of the first curable resin to the display mother substrate.

18. The method for manufacturing a display panel according to claim 11, wherein the young's modulus of the first curable resin is 0.4GPa to 4 GPa.

19. The method for manufacturing a display panel according to claim 11,

the display mother substrate is provided with an alignment mark,

20. The method for manufacturing a display panel according to any one of claims 11 to 19,

the display mother substrate is provided with an alignment mark,