JP2018105977A - Display - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a display that can improve display quality.SOLUTION: A display comprises: an insulating substrate; a support base material; and a protective member. The insulating substrate has a first lower surface and a first upper surface. The support base material has a second lower surface and a second upper surface. The first lower surface is opposed to the second upper surface. The protective member is opposed to the first upper surface. In this case, the second upper surface is smaller than the first upper surface, the first upper surface is smaller than the protective member.SELECTED DRAWING: Figure 5

Description

  Embodiments described herein relate generally to a display device.

  The display device includes a display panel and a cover glass that protects the display panel. The display panel includes a sheet-like substrate on which optical elements such as an organic electroluminescence (EL) element and a liquid crystal layer are formed.

  In the manufacturing process of a display device, in order to improve productivity, a technique is known in which a plurality of cell substrates are simultaneously formed on the same substrate and cut into a single cell by laser light or rotating teeth (for example, (See Patent Documents 1 to 3). The separated end face of the substrate forms an obtuse angle with the first upper surface on the display surface side of the substrate, and forms an acute angle with the second lower surface on the back surface side.

  When a cover glass is bonded to such a substrate, a wedge-shaped gap is formed between the back surface of the cover glass and the end surface of the substrate, so that bubbles can easily enter from the gap and the bonding area is reduced. In particular, in the case of a display device in which a display area for displaying an image is curved, if the bonding area is small due to the restoring force of the substrate that is curved along the curved surface of the cover glass, the cover glass may be peeled off. .

Japanese Patent Laid-Open No. 2006-143594 Japanese Unexamined Patent Publication No. 2016-11994 Japanese Patent Laying-Open No. 2015-103467

  An object of the present disclosure is to provide a display device capable of improving display quality.

  A display device according to an embodiment includes a support base, an insulating substrate, and a protection member. The support base has a first lower surface and a first upper surface. The insulating substrate has a second lower surface and a second upper surface. The second lower surface faces the first upper surface. The protection member is opposed to the second upper surface. At this time, the first upper surface is smaller than the second upper surface. The insulating substrate is smaller than the protective member.

FIG. 1 is a plan view showing a schematic configuration of the display device. FIG. 2 is a cross-sectional view showing a schematic configuration of the display panel in the display area. FIG. 3 is a cross-sectional view of the display device taken along line F3-F3 in FIG. FIG. 4 is a cross-sectional view of the display panel. FIG. 5 is a cross-sectional view of the display device taken along line F4-F4 in FIG. FIG. 6 is a plan view of the display panel before being bonded to the protective member. FIG. 7 is an enlarged cross-sectional view showing an example of the end surface of the array substrate. FIG. 8 is an enlarged sectional view showing another example of the end surface of the array substrate. FIG. 9 is a flowchart illustrating an example of a method for manufacturing a display device. FIG. 10 is a cross-sectional view of a display device of a comparative example shown for comparison with FIG. FIG. 11 is an enlarged cross-sectional view showing an example of the end surface of the array substrate according to the comparative example shown for comparison with FIGS. 7 and 8.

Several embodiments will be described with reference to the drawings.
It should be noted that the disclosure is merely an example, and those that can be easily conceived by a person skilled in the art while keeping the gist of the invention and appropriately coming into consideration are naturally included in the scope of the present invention. In addition, the drawings may be schematically represented in comparison with actual modes in order to clarify the description, but are merely examples, and do not limit the interpretation of the present invention. In each figure, reference numerals may be omitted for the same or similar elements arranged in succession. In addition, in the present specification and each drawing, components that perform the same or similar functions as those already described are denoted by the same reference numerals, and redundant detailed description may be omitted.

  In each embodiment, a display device DSP that is an organic EL display device is disclosed as an example of a display device. The display device DSP can be used for various devices such as a smartphone, a tablet terminal, a mobile phone terminal, a personal computer, a television receiver, an in-vehicle device, a game machine, and a wearable terminal.

  FIG. 1 is a plan view showing a schematic configuration of the display device DSP. FIG. 1 shows an XY plane defined by a first direction X and a second direction Y perpendicular to the first direction X. The third direction Z is a direction perpendicular to the first direction X and the second direction Y. In the illustrated example, the first direction X, the second direction Y, and the third direction Z are orthogonal to each other, but may intersect at an angle other than 90 degrees.

  As shown in FIG. 1, the display device DSP includes a display panel PNL, a first wiring board 1, a second wiring board 2, and a protection member 4. Although not shown, the display panel may further include a touch panel or the like superimposed on the display panel PNL.

The display panel PNL has a pair of end portions E1 and E2 along the first direction X and a pair of end portions E3 and E4 along the second direction Y. The display panel PNL includes a display area DA that displays an image and a non-display area NDA that surrounds the display area DA.
The display panel PNL includes a plurality of pixels PX arranged in a matrix in the first direction X and the second direction Y in the display area DA. The pixel PX is a minimum unit constituting a color image, and includes organic EL elements OLED1, OLED2, and OLED3 described later.

The first wiring board 1 is a flexible wiring board, for example, and is electrically connected to an external signal supply source that supplies a signal to the display panel PNL based on image data.
The second wiring board 2 is mounted in the non-display area NDA and electrically connects the display panel PNL and the first wiring board 1. The second wiring board 2 is mounted with a driving IC chip 3 that drives the display panel PNL, for example. The drive IC chip 3 may be mounted on the display panel PNL or the first wiring board 1. The drive IC chip 3 and the signal supply source are examples of drive components that drive the display panel PNL.

  The protection member 4 overlaps the display panel PNL in the XY plane. In the first direction X, the length LX1 of the protection member 4 is longer than the length LX2 of the display panel. In the second direction Y, the length LY1 of the protection member 4 is substantially the same as the length LY2 of the display panel PNL.

FIG. 2 is a cross-sectional view showing a schematic configuration of the display panel PNL in the display area DA. The protection member 4 and the support base 6 are opposed in the third direction Z. Hereinafter, the protection member 4 is defined as the upper side Z1 when viewed from the support base material 6, and the support base material 6 is defined as the lower side Z2 when viewed from the protection member 4.
As shown in FIG. 2, the display panel PNL includes an insulating substrate 10, switching elements SW1, SW2, and SW3, a reflective layer 31, organic EL elements OLED1, OLED2, and OLED3, a sealing material 40, a support base 6, and the like. Yes.

  The insulating substrate 10 is made of, for example, a polyimide resin, and has a first upper surface 10A and a first lower surface 10B opposite to the first upper surface 10A. The first upper surface 10 </ b> A of the insulating substrate 10 is covered with the first insulating film 21.

  The switching elements SW1, SW2, SW3 are formed on the first insulating film 21. In the illustrated example, the switching elements SW1, SW2, and SW3 are configured as top-gate thin film transistors, but may be configured as bottom-gate thin film transistors. Since the switching elements SW1, SW2, and SW3 have the same configuration, the structure thereof will be described in detail below with a focus on the switching element SW1. The switching element SW1 includes a semiconductor layer SC formed on the first insulating film 21. The semiconductor layer SC is covered with the second insulating film 22. The second insulating film 22 is also disposed on the first insulating film 21.

  The gate electrode WG of the switching element SW1 is formed on the second insulating film 22 facing the semiconductor layer SC. The gate electrode WG is covered with the third insulating film 23. The third insulating film 23 is also disposed on the second insulating film 22. The first to third insulating films 21, 22, and 23 are made of an inorganic material such as silicon oxide or silicon nitride, for example.

  The source electrode WS and the drain electrode WD of the switching element SW1 are formed on the third insulating film 23. The source electrode WS and the drain electrode WD are electrically connected to the semiconductor layer SC through contact holes that penetrate the second and third insulating films 22 and 23, respectively. The switching element SW1 is covered with a fourth insulating film 24. The fourth insulating film 24 is also disposed on the third insulating film 23. The fourth insulating film 24 is formed of an organic material such as a transparent resin such as an acrylic organic film or a polyimide organic film.

  The reflective layer 31 is formed on the fourth insulating film 24. The reflection layer 31 is made of a metal material having a high light reflectance such as aluminum or silver. The surface of the reflective layer 31 may be a flat surface or an uneven surface in order to impart light scattering properties.

  The organic EL elements OLED1, OLED2, and OLED3 are formed on the fourth insulating film 24 and emit, for example, red (R), green (G), and blue (B) light, respectively. The organic EL element OLED1 includes a pixel electrode PE1 and an organic light emitting layer ORG1. Similarly, the organic EL element OLED2 includes a pixel electrode PE2 and an organic light emitting layer ORG2. The organic EL element OLED3 includes a pixel electrode PE3 and an organic light emitting layer ORG3. In one example, the organic light emitting layer ORG1 is formed of a material that emits light of red wavelength, the organic light emitting layer ORG2 is formed of a material of emitting light of green wavelength, and the organic light emitting layer ORG3 is a material that emits light of blue wavelength. Is formed by. In the illustrated example, the organic EL elements OLED1 to OLED3 are partitioned by ribs 32, respectively.

  The pixel electrodes PE1, PE2, and PE3 are formed on the reflective layer 31. The organic EL element OLED1 is electrically connected to the switching element SW1. Similarly, the organic EL element OLED2 is electrically connected to the switching element SW2. The organic EL element OLED3 is electrically connected to the switching element SW3.

  The organic light emitting layer ORG1 is formed on the pixel electrode PE1. Similarly, the organic light emitting layer ORG2 is formed on the pixel electrode PE2, and the organic light emitting layer OGR3 is formed on the pixel electrode PE3.

  The organic EL elements OLED1, OLED2, and OLED3 further include a common electrode CE. The common electrode CE is formed on the organic light emitting layers ORG1 to ORG3. Further, the common electrode CE is also formed on the rib 32. One of the pixel electrode PE1 and the common electrode CE is an anode, and the other is a cathode. The same applies to the pixel electrodes PE2 and PE3. The pixel electrodes PE1, PE2, PE3 and the common electrode CE are made of a light-transmitting conductive material such as indium tin oxide (ITO) or indium zinc oxide (IZO). The reflective layer 31, the organic EL elements OLED, OLED2, OLED3, and the rib 32 are combined to form an organic EL structure layer 30.

  The sealing material 40 covers the organic EL elements OLED1, OLED2, and OLED3. The sealing material 40 prevents intrusion of moisture and gas into the organic EL elements OLED1, OLED2, and OLED3 and suppresses deterioration thereof. The sealing material 40 is comprised from the laminated body of an organic film and an inorganic film, for example.

  The support base 6 has a second upper surface 6A and a second lower surface 6B opposite to the second upper surface 6A. The second upper surface 6A of the support base 6 is bonded to the first lower surface 10B of the insulating substrate 10 by the adhesive layer AD2. The support base 6 is formed of a resin such as polyethylene terephthalate (PET), for example, and has a strength higher than that of the insulating substrate 10. The support base 6 suppresses deformation of the display panel PNL and prevents moisture and gas from entering the insulating substrate 10.

  The protection member 4 is located on the side facing the first upper surface 10A of the insulating substrate 10 and protects the display panel PNL. The protection member 4 includes a transparent cover member 41. The cover member 41 is made of glass, for example, and may be referred to as a cover glass. The cover member 41 may be made of resin. In the illustrated example, the protection member 4 includes a front film 42.

  The front film 42 is bonded to the upper surface 40A of the sealing material 40 by the adhesive layer AD1, and is bonded to the lower surface 41B of the cover member 41 by the adhesive layer AD3. The front film 42 is a polarizing plate that suppresses the influence of external light, for example. The front film 42 may be a phase difference plate that compensates for the phase difference of the circularly polarizing plate, a light transmissive film that protects the sealing material 40, or a laminated film thereof. May be.

As the protection member 4, at least one of the cover member 41 and the front film 42 may function. The protective member 4 is formed larger than the array substrate AR in plan view.
The adhesive layers AD1, AD2, AD3 are each formed from an adhesive. The adhesive includes a pressure-sensitive adhesive (pressure-sensitive adhesive). The adhesive layers AD1, AD2, AD3 may be a double-sided tape or the like in which an adhesive is applied to both surfaces of a film-like substrate.

FIG. 3 is a cross-sectional view of the display device DSP along the line F3-F3 in FIG. Here, a cross section of the display device DSP in the XZ plane defined by the first direction X and the third direction Z will be described.
Regarding the insulating substrate 10, the first upper surface 10A is larger than the first lower surface 10B. That is, in the first direction X, the length L1 of the first upper surface 10A is longer than the length L2 of the first lower surface 10B. The insulating substrate 10 has first side surfaces 10C and 10D. The first side surfaces 10C and 10D are both inclined surfaces inclined with respect to the third direction Z. The first side surface 10C is included in the end surface 53 of the array substrate AR, and the second side surface 10D is included in the end surface 54 of the array substrate AR. The end surface 53 is a surface along the end E3 of the display panel PNL shown in FIG. 1, and the end surface 54 is a surface along the end E4 of the display panel PNL. As will be described later with reference to FIG. 7, the angle formed between the first side surfaces 10C and 10D and the second upper surface 10A is an acute angle, and the angle formed between the first side surfaces 10C and 10D and the first lower surface 10B is an obtuse angle. The end E21 of the first upper surface 10A is located outside the end E22 of the first lower surface 10B, that is, on the side away from the display area DA. The first side surfaces 10C and 10D are surfaces formed by connecting the end E21 of the first upper surface 10A and the end E22 of the first lower surface 10B with a straight line.

  In the support substrate 6, the second upper surface 6A is larger than the second lower surface 6B. That is, in the first direction X, the length L3 of the second upper surface 6A is longer than the length L4 of the second lower surface 6B. The support base 6 has first side surfaces 6C and 6D. The second side surfaces 6C and 6D are both inclined surfaces inclined with respect to the third direction Z. As will be described later, the angle formed between the second side surfaces 6C and 6D and the second upper surface 6A is an acute angle, and the angle formed between the second side surfaces 6C and 6D and the second lower surface 6B is an obtuse angle. The end E31 of the second upper surface 6A is located outside the end E32 of the second lower surface 6B, that is, on the side away from the display area DA. The second side surfaces 6C and 6D are surfaces formed by connecting the end E31 of the second upper surface 6A and the end E32 of the second lower surface 6B with a straight line.

In other words, each of the insulating substrate 10 and the support base 6 has an inversely tapered cross section in which the length in the first direction X increases as it goes from the bottom to the top in the third direction Z.
When attention is paid to the magnitude relationship between the insulating substrate 10 and the support base 6, the second upper surface 6 </ b> A is smaller than the first upper surface 10 </ b> A. That is, the length L3 of the second upper surface 6A is shorter than the length L1 of the first upper surface 10A. The length L2 of the first lower surface 10B is substantially the same as the length L3 of the second upper surface 6A. Further, the end E22 of the first lower surface 10B substantially coincides with the end E31 of the second upper surface 6A.

The insulating substrate 10 and the support base 6 are both smaller than the protective member 4 in the first direction X. That is, the length L5 of the protection member 4 is longer than the length L1 of the first upper surface 10A and the length L3 of the second upper surface 6A.
The second wiring board 2 is mounted between the insulating substrate 10 and the protection member 4 and bonded by a resin 60. The second wiring board 2 is bent so that the first wiring board 1 faces the second lower surface 6B.

4 is a cross-sectional view of the display panel PNL along the line F4-F4 in FIG. Here, a cross section of the display panel PNL before being bonded to the protective member 4 in the YZ plane defined by the second direction Y and the third direction Z will be described.
Regarding the insulating substrate 10, the first upper surface 10A is larger than the first lower surface 10B. That is, in the second direction Y, the length of the first upper surface 10A (symbol L9) is longer than the length of the first lower surface 10B (symbol L8). The insulating substrate 10 has third side surfaces 10E and 10F. The third side surfaces 10E and 10F are both inclined surfaces inclined with respect to the third direction Z. The third side surface 10E is included in the end surface 55 of the array substrate AR, and the third side surface 10F is included in the end surface 56 of the array substrate AR. The end surface 55 is a surface along the end E1 of the display panel PNL shown in FIG. 1, and the end surface 56 is a surface along the end E2 of the display panel PNL. As will be described later, the angle formed between the third side surfaces 10E and 10F and the first upper surface 10A is an acute angle, and the angle formed between the third side surfaces 10E and 10F and the first lower surface 10B is an obtuse angle. The end E21 of the first upper surface 10A is located outside the end E22 of the first lower surface 10B, that is, on the side away from the display area DA. The third side surfaces 10E and 10F are surfaces formed by connecting the end E21 of the first upper surface 10A and the end E32 of the first lower surface 10B with a straight line.

  In the support substrate 6, the second upper surface 6A is larger than the second lower surface 6B. That is, in the second direction Y, the length L7 of the second upper surface 6A is longer than the length L6 of the second lower surface 6B. The support base 6 has fourth side surfaces 6E and 6F. The fourth side surfaces 6E and 6F are both inclined surfaces inclined with respect to the third direction Z. As will be described later, the angle formed between the fourth side surfaces 6E and 6F and the second upper surface 6A is an acute angle, and the angle formed between the fourth side surfaces 6E and 6F and the second lower surface 6B is an obtuse angle. The end E31 of the second upper surface 6A is located outside the end E32 of the second lower surface 6B, that is, on the side away from the display area DA. In other words, each of the insulating substrate 10 and the support base 6 has a reverse tapered cross section in which the length in the second direction Y increases from the lower side Z2 of the third direction Z toward the upper side Z1. . The fourth side surfaces 6E and 6F are surfaces formed by connecting the end E31 of the second upper surface 6A and the end E32 of the second lower surface 6B with a straight line.

  When attention is paid to the magnitude relationship between the insulating substrate 10 and the support base 6, the length L7 of the second upper surface 6A is shorter than the length L9 of the first upper surface 10A. The length L7 of the first lower surface 10B is substantially the same as the length L8 of the first upper surface 6A.

  FIG. 5 is a cross-sectional view of the display device DSP taken along line F4-F4 in FIG. Here, a cross section in a state where the display panel PNL shown in FIG. 4 is bonded to the protective member 4 is shown. As shown in FIG. 5, the protection member 4 has a central portion 9 and first and second side portions 7 and 8 on both sides thereof. The central portion 9 is parallel to the XY plane. The 1st and 2nd side parts 7 and 8 are curving toward lower Z2 rather than the center part 9, respectively. The display panel PNL is bonded along the protective member 4 and is curved toward the lower side Z2 like the first and second side portions 7 and 8. In addition, you may use the protective base material 4 formed in flat form.

  The display panel PNL includes the organic EL structure layer 30 shown in FIG. 2 in portions corresponding to the first and second side portions 7 and 8, and overlaps the display area DA. The angle θ11 formed by the end surface 55 and the lower surface 41B of the cover member 41 and the angle θ12 formed by the end surface 56 and the lower surface 41B of the cover member 41 are both obtuse.

When viewed from the normal direction W of each of the first and second side portions 7 and 8, the end portion E10 of the display area DA substantially coincides with the end portion E32 of the second lower surface 6B of the support base 6. Further, the end portions E21, E22, E31 are located on the lower side Z2 with respect to the broken line in FIG. 5 connecting the end portion E10 and the end portion E32.
As shown in FIG. 5, the insulating substrate 10 and the support base 6 are both smaller than the protective member 4 in the second direction Y in a state where the display panel PNL is bonded to the protective member 4.

FIG. 6 is a plan view of the display panel PNL before being bonded to the protection member 4. In the example shown in FIG. 6, the front film 42 is formed to have substantially the same size as the array substrate AR. The size of the front film 42 is not limited to this, and may be formed larger than the array substrate AR so as to be configured as a protective member, or may be formed smaller than the array substrate AR so as to cover only the display area DA. Also good.
The end E10 of the display area DA is located so as to substantially overlap the end E32 of the second lower surface 6B. That is, the second lower surface 6B of the support base 6 has substantially the same area as the display area DA.

  The end E21 of the first upper surface 10A is located outside the end E22 of the first lower surface 10B. That is, the first upper surface 10A is larger than the first lower surface 10B. The end E31 of the second upper surface 6A is located outside the end E32 of the second lower surface 6B. That is, the second upper surface 6A is larger than the second lower surface 6B. The end E22 of the first lower surface 10B is positioned so as to substantially overlap the end E31 of the second upper surface 6A. That is, the first lower surface 10B has substantially the same area as the second upper surface 6A.

  FIG. 7 is an enlarged cross-sectional view showing an example of the end faces 53, 54, 55, and 56 of the array substrate AR. Note that the end surfaces 53 and 55 have substantially the same shape as the end surface 56. The end face 54 has substantially the same shape as the end face 56 except that the second wiring board 2 is mounted. Therefore, the end surface 56 will be described in detail as a representative, and the overlapping description of the end surfaces 53, 54, and 55 may be omitted.

  As described with reference to FIGS. 4 and 5, the end surface 56 of the array substrate AR according to the present embodiment includes the third side surface 10 </ b> F of the insulating substrate 10 and the side surface 20 </ b> F of the barrier film 20. The angle θ1 formed between the third side surface 10F and the first upper surface 10A is an acute angle, and the angle θ2 formed between the third side surface 10F and the first lower surface 10B is an obtuse angle. In the example shown in FIG. 7, the side surface 20F of the barrier film 20 forms an acute angle with the main surface (upper surface) 20A of the barrier film 20, and forms an obtuse angle with the main surface (lower surface) 20B. The main surface 20A exposed from the sealing material 40 is covered with the above-described adhesive layer AD1 (shown in FIG. 2). Further, in the support base 6, an angle θ3 formed between the fourth side surface 6F and the second upper surface 6A is an acute angle, and an angle θ4 formed between the fourth side surface 6F and the second lower surface 6B is an obtuse angle.

  The end face of the display panel PNL constitutes the end face of the display device DSP. The end surface 56 of the array substrate AR constitutes the end surface of the display panel PNL together with the fourth side surface 6E of the support base 6. Therefore, the end surface of the display panel PNL according to the present embodiment has a shape inclined inward as it goes from the upper side Z1 to the lower side Z2. In the following description, the shape is referred to as an inverted taper shape.

  FIG. 8 is an enlarged sectional view showing another example of the end faces 53, 54, 55, 56 of the array substrate AR. The end face 56 shown in FIG. 8 is different from the end face 56 shown in FIG. Similar to the example shown in FIG. 7, in the other example shown in FIG. 8, the end face 56 forms an acute angle with the first upper surface 10A and forms an obtuse angle with the first lower surface 10B. 7 and 8, the distances between the end E21 of the first upper surface 10A of the insulating substrate 10 covered with the barrier film 20 and the end E30 of the organic EL structure layer 30 are denoted by reference numerals D1 and D2.

FIG. 9 is a flowchart showing an example of a method for manufacturing the display device DSP. A manufacturing method for manufacturing the display device DSP of the present embodiment will be described with reference to FIG.
In the manufacturing method of the display device DSP, first, a mother substrate on which a plurality of cells are formed is formed through mother substrate formation in steps S1 to S7. Next, the cells of the mother substrate are separated into pieces through the cell cutting process in step S8. The single cut cell corresponds to the array substrate AR described above. Further, when the display device DSP is assembled through steps S9 to S12, the display device DSP shown in FIG. 1 is completed.

More specifically, in the insulating substrate forming step of step S1, for example, the insulating substrate 10 is formed by applying and curing the material of the insulating substrate 10 on a support substrate such as a glass substrate.
In the barrier film forming step of step S2, the first to fourth insulating films 21, 22, 23, and 24 are sequentially stacked on the second upper surface 10A of the insulating substrate 10 to form the barrier film 20. In this step, the switching element SW1 shown in FIG. 2 and the like are also formed.

In the formation of the organic EL structure in step S3, the pixel electrode PE1, the organic light emitting layer ORG1, and the common electrode CE are sequentially stacked on the second main surface 20A of the barrier film 20 to form the organic EL structure layer 30.
In the formation of the sealing material in step S4, the sealing material 40 that covers the organic EL structure layer 30 is formed.
In the curing film sticking of step S5, the upper surface 40A of the sealing material 40 is covered with the curing film. The curing film protects the sealing material 40 and provides rigidity so that the insulating substrate 10 is not deformed in the manufacturing process.

  In the laser lift-off in step S6, the glass substrate is peeled from the insulating substrate 10. When the glass substrate is irradiated with laser light from the lower side Z2, the first lower surface 10B of the insulating substrate 10 absorbs the laser light and is slightly decomposed. A gap is generated at the interface between the glass substrate and the insulating substrate 10, and the glass substrate is peeled from the insulating substrate 10.

In the bonding of the support base material in step S <b> 7, the support base material 6 is bonded to the first lower surface 10 </ b> B of the insulating substrate 10.
In the cell cut process of step S8, the mother substrate on which the plurality of array substrates AR are formed is cut to form individual array substrates AR.

In the curing film peeling in step S9, a part of the curing film is peeled to form a terminal portion for mounting the second wiring board 2 in the non-display area NDA. Thereafter, the remaining curing film is peeled off.
In the front film bonding step in step S10, the front film 42 is bonded to the exposed upper surface 40A of the sealing material 40.

In the second wiring board mounting step in step S11, the second wiring board 2 electrically connected to the first wiring board 1 is mounted on the terminal portion of the array substrate AR.
In the cover member bonding step in step S12, the cover member 41 is bonded to the upper surface 5A of the front film 42, and the display device DSP shown in FIG. 1 is completed.

In order to form the end face of the inversely tapered display panel PNL shown in FIGS. 7 and 8, in one example, in the cell cutting process of step S8, a mother substrate (array substrate AR before being singulated) is used. ) May be irradiated with laser light from the lower side Z2. The wavelength of the laser light is, for example, 266 nm or 532 nm.
In the cell cut process of step S8, the array substrate AR before being singulated and the support base material 6 before being singulated are bonded together through the support base material bonding process of step S7. Has been. The laser light emitted from the lower side Z2 evaporates the integrated array substrate AR and the support base 6 simultaneously. Therefore, the end surface 56 of the array substrate AR and the fourth side surface 6E of the support base 6 are formed in a substantially flush reverse taper shape.

  FIG. 10 is a cross-sectional view of a display device DSP of a comparative example shown for comparison with FIG. In the comparative example shown in FIG. 10, the end surfaces 55 and 56 of the array substrate AR form an acute angle with the lower surface 41 </ b> B of the cover member 41. In such a display device, as shown in FIG. 10, a wedge-shaped gap S is formed between the lower surface 41B of the cover member 41 and the end surfaces 55 and 56 of the array substrate AR.

  FIG. 11 is an enlarged cross-sectional view showing an example of the end surface of the array substrate AR according to the comparative example shown for comparison with FIGS. 7 and 8. A distance between the end E21 of the first upper surface 10A of the insulating substrate 10 covered with the barrier film 20 and the organic EL structure layer 30 is indicated by a reference symbol D3. As shown in FIG. 11, the distance D3 of the comparative example is shorter than the distances D1 and D2 shown in FIGS.

  In the display device DSP of the present embodiment configured as described above, the support base 6 is smaller than the insulating substrate 10, and the insulating substrate 10 is smaller than the cover member 41 or the front film 42. That is, when viewed macroscopically, the end surface of the display device DSP has an inversely tapered shape that goes inward as it goes from the upper side Z1 to the lower side Z2. Therefore, it is difficult to form a wedge-shaped gap between the lower surface 41B of the cover member 41 and the end surfaces 53, 54, 55, 56 of the array substrate AR.

  In the present embodiment, the end surface 56 of the array substrate AR included in the end portion of the display device DSP and the fourth side surface 6E of the support base 6 have an inversely tapered shape formed substantially flush with each other. Similarly, the end surface 53 of the array substrate AR and the second side surface 6C of the support substrate 6, the end surface 54 of the array substrate AR and the second side surface 6D of the support substrate 6, the end surface 55 of the array substrate AR and the first surface of the support substrate 6. Each of the four side surfaces 6F has an inversely tapered shape formed substantially flush with each other. Therefore, as shown in FIG. 5, no wedge-shaped gap is formed between the lower surface 41B of the cover member 41 and the end surfaces 55 and 56 of the array substrate AR.

  As in the comparative example shown in FIG. 10, if a wedge-shaped gap S is formed between the lower surface 41B of the cover member 41 and the end faces 55 and 56 of the array substrate AR, the array substrate starts from the gap S. AR is easy to peel off. In particular, as shown in FIG. 10, in the case of a display device in which the display area DA for displaying an image is curved, the display member DA is removed from the cover member 41 by the restoring force of the array substrate AR that is curved along the curved surface of the cover member 41. There is a risk of peeling.

  According to the present embodiment, no gap is formed between the protective film such as the cover member 41 or the front film 42 and the array substrate AR including the insulating substrate 10, and the cover member 41 and the insulating substrate 10 Can be expanded, and peeling from the cover member 41 can be suppressed.

  In the present embodiment, the end surfaces 50A and 50B of the array substrate AR are configured to form an acute angle with the first upper surface 10A of the insulating substrate 10 and to form an obtuse angle with the first lower surface 10B. According to such a configuration, the end surface 50C has an obtuse angle with the first upper surface 10A of the insulating substrate 10 and an acute angle with the first lower surface 10B, compared with the case where the insulating substrate 10 covered with the barrier film 20 is covered. The distance between the end E21 of the first upper surface 10A and the organic EL structure layer 30 is increased.

Moisture flowing toward the organic EL structure layer 30 through the insulating substrate 10 is prevented from penetrating into the organic EL structure layer 30 by the barrier film 20. According to the present embodiment, the distances D1 and D2 between the end portion E21 of the first upper surface 10A of the insulating substrate 10 covered with the barrier film 20 and the organic EL structure layer 30 can be increased. The reliability of interruption can be improved. As a result, the reliability of the display device DSP can be improved.
In addition, various suitable effects can be obtained from this embodiment.

  Although several embodiments of the present invention have been described, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and equivalents thereof. The configurations disclosed in the embodiments can be combined as appropriate.

  For example, the organic light emitting layer may be configured to emit white light, and a color filter may be provided on the array substrate or the front film at a position corresponding to the organic light emitting layer. A color conversion layer may be provided instead of the color filter. For example, although the switching element is configured as a top-gate thin film transistor, the switching element may be configured as a bottom-gate thin film transistor. For example, although the organic EL element is configured as a top emission type that emits light upward, the organic EL element may be configured as a bottom emission type that emits light downward.

  For example, the display device may be a liquid crystal display device. In that case, the array substrate corresponds to the insulating substrate 10, and the counter substrate corresponds to the front film 42. The array substrate and the counter substrate may have flexibility. Even when the display device is a liquid crystal display device, the bonding area between the cover member and the display device can be increased and peeling from the cover member can be suppressed as in the present embodiment.

  DESCRIPTION OF SYMBOLS 4 ... Protection member, 6 ... Support base material, 6A ... 2nd upper surface, 6B ... 2nd lower surface, 6C, 6D ... 2nd side surface, 6E, 6F ... 4th side surface, 7 ... 1st side part of a protection member, 8 2nd side of protection member, 10 ... insulating substrate, 10A ... first upper surface, 10B ... first lower surface, 10C, 10D ... first side surface, 10E, 10F ... third side surface, 41B ... lower surface of protection member, AD1 , AD2 ... adhesive layer, DA ... display area, DSP ... display device, E10 ... end of display area, E32 ... end of second lower surface, Z2 ... lower side, θ1 ... first side surface and first upper surface. Angle, θ2: Angle formed between the first side surface and the first lower surface, θ3: Angle formed between the second side surface and the second upper surface, θ4: Angle formed between the second side surface and the second lower surface, θ11, θ12: First The angle between the side and the lower surface of the protective member.

Claims (12)

An insulating substrate having a first upper surface and a first lower surface opposite to the first upper surface;
A support base material having a second upper surface facing the first lower surface and bonded via an adhesive layer, and a second lower surface opposite to the second upper surface;
A protective member that opposes the first upper surface and adheres via an adhesive layer,
The second upper surface is smaller than the first upper surface;
The display device, wherein the first upper surface is smaller than the protective member.   The display device according to claim 1, wherein the second lower surface is smaller than the second upper surface. The insulating substrate has a first side surface;
The display device according to claim 1, wherein an angle formed between the first side surface and the first upper surface is an acute angle. The protective member has a lower surface facing the first upper surface,
The display device according to claim 3, wherein an angle formed between the first side surface and the lower surface is an obtuse angle. The support substrate has a second side surface;
The display device according to claim 1, wherein an angle formed between the second side surface and the second upper surface is an acute angle. The protective member has a first part, and a first side part and a second side part located on both sides of the first part,
The first side portion and the second side portion are curved so as to be positioned below the first portion,
The display device according to claim 1, wherein the insulating substrate and the support base material are curved along the protective member. A protective member;
An insulating substrate facing the protective member and bonded via an adhesive layer;
A support substrate that is opposed to the insulating substrate and bonded through an adhesive layer,
The protective member has a lower surface facing the insulating substrate,
The insulating substrate has a first side surface;
The display device, wherein an angle formed between the lower surface and the first side surface is an obtuse angle. The protective member has a first part, and a first side part and a second side part located on both sides of the first part,
The display device according to claim 7, wherein the first side portion and the second side portion are curved so as to be positioned below the first portion.   The display device according to claim 8, wherein the insulating substrate and the support base material are curved along the protection member. The insulating substrate has a first upper surface that adheres to the protection member, and a first lower surface opposite to the first upper surface,
The display device according to claim 7, wherein the first lower surface is smaller than the first upper surface. The support base has a second upper surface that adheres to the insulating substrate, and a second lower surface opposite to the second upper surface,
The display device according to claim 10, wherein the second lower surface is smaller than the second upper surface.   The display device according to claim 11, wherein the first lower surface and the second upper surface have substantially the same size.

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