CN114023906B

CN114023906B - Display panel, display device and manufacturing method of substrate to be cut

Info

Publication number: CN114023906B
Application number: CN202111273501.3A
Authority: CN
Inventors: 李云龙; 卢鹏程; 张大成
Original assignee: BOE Technology Group Co Ltd; Yunnan Chuangshijie Optoelectronics Technology Co Ltd
Current assignee: BOE Technology Group Co Ltd; Yunnan Chuangshijie Optoelectronics Technology Co Ltd
Priority date: 2021-10-29
Filing date: 2021-10-29
Publication date: 2023-09-01
Anticipated expiration: 2041-10-29
Also published as: CN114023906A

Abstract

The embodiment of the disclosure provides a display panel, a display device and a manufacturing method of a substrate to be cut, relates to the technical field of display, and aims to solve the problem of mutual stripping between adjacent film layers in the display panel. The display panel comprises a substrate, a light emitting device, a first packaging layer, a second packaging layer, a color film layer and a first insulating layer. Wherein the light emitting device is disposed on the substrate and in the display area. The first encapsulation layer is disposed on a side of the light emitting device remote from the substrate. The second encapsulation layer is disposed on a side of the first encapsulation layer away from the light emitting device. The color film layer and the first insulating layer are arranged between the first packaging layer and the second packaging layer. The first insulating layer is provided with a first coverage area and at least one first blank area, the orthographic projection of the color film layer on the first insulating layer is positioned in the outer contour of the first coverage area, the at least one first blank area is far away from the display area compared with the color film layer, and in the at least one first blank area, the first packaging layer is in contact with the second packaging layer.

Description

Display panel, display device and manufacturing method of substrate to be cut

Technical Field

The invention relates to the technical field of display, in particular to a display panel, a display device and a manufacturing method of a substrate to be cut.

Background

An organic light emitting diode (Organic Light Emitting Diode, which may be abbreviated as OLED) display panel has the advantages of self-luminescence, low power consumption, wide viewing angle, fast response speed, high contrast ratio, etc., and thus becomes a mainstream development trend of the current display.

The OLED display panel may be formed by cutting a substrate to be cut. When a substrate to be cut is cut to form a plurality of display panels, the cutting stress may damage the bonding between the film layers of the substrate to be cut, so that the peeling (peeling) between the adjacent film layers in the formed display panel may occur.

Disclosure of Invention

The embodiment of the invention provides a display panel, a display device and a manufacturing method of a substrate to be cut, which are used for solving the problem of mutual stripping between adjacent film layers in the display panel.

In order to achieve the above purpose, the embodiment of the present invention adopts the following technical scheme:

in a first aspect, a display panel is provided. The display panel has a display area. The display panel comprises a substrate, a light emitting device, a first packaging layer, a second packaging layer, a color film layer and a first insulating layer. Wherein the light emitting device is disposed on the substrate and in the display area. The first encapsulation layer is disposed on a side of the light emitting device remote from the substrate. The second encapsulation layer is disposed on a side of the first encapsulation layer away from the light emitting device. The color film layer and the first insulating layer are arranged between the first packaging layer and the second packaging layer. The first insulating layer is provided with a first coverage area and at least one first blank area, the orthographic projection of the color film layer on the first insulating layer is positioned in the outer contour of the first coverage area, the at least one first blank area is far away from the display area compared with the color film layer, and in the at least one first blank area, the first packaging layer is in contact with the second packaging layer.

In some embodiments, at least one of the respective first blank areas is an edge blank area, the edge blank area being farther from the display area than the first coverage area.

In some embodiments, a surface of the substrate adjacent to the first encapsulation layer is provided with a first recess, the first recess is located in an edge blank area, and an outer edge of the first recess is substantially flush with an edge of the first encapsulation layer.

In some embodiments, at least one of the respective first blank areas is a hollowed-out area surrounded by the first coverage area.

In some embodiments, the display panel further includes a second insulating layer disposed between the first and second encapsulation layers, and the first and second insulating layers are located at two sides of the color film layer. The second insulating layer is provided with a second coverage area and at least one second blank area, orthographic projection of the color film layer on the second insulating layer is located in the outer contour of the second coverage area, the at least one second blank area is far away from the display area compared with the color film layer, and in the at least one second blank area, the first packaging layer is in contact with the second packaging layer.

In some embodiments, an edge of a second blank region is flush with an edge of a first blank region.

In some embodiments, the first encapsulation layer includes a first organic layer and at least one first inorganic layer, the first organic layer disposed on a side of the at least one first inorganic layer proximate to the second encapsulation layer. The second packaging layer comprises a second organic layer and at least one second inorganic layer, and the second organic layer is arranged on one side of the at least one second inorganic layer close to the first packaging layer. Wherein the first organic layer and the second organic layer are the same material, and the first organic layer and the second organic layer are in contact in at least one first empty region.

In some embodiments, the light emitting device includes a first electrode and a second electrode disposed on a side of the first electrode remote from the substrate. The display panel further includes a conductive pattern in contact with the second electrode. The color film layer also comprises a shielding pattern, and the orthographic projection of the conductive pattern on the substrate is positioned inside the orthographic projection of the shielding pattern on the substrate.

In some embodiments, the display panel further includes a pixel defining layer disposed on a side of the first encapsulation layer near the substrate, the pixel defining layer extending to a side of the conductive pattern away from the light emitting device. The first encapsulation layer extends to a side of the pixel defining layer away from the display area, and/or the pixel defining layer comprises a plurality of insulating patterns, and the insulating patterns are positioned on a side of the conductive patterns away from the light emitting device.

In some embodiments, an insulating pattern is located in a first blank region.

In some embodiments, the surface of the substrate adjacent to the first encapsulation layer is provided with a second recess and at least one retention pattern surrounded by the second recess, and an orthographic projection of the at least one insulation pattern on the substrate is located within the retention pattern.

In some embodiments, the base includes a silicon substrate and a circuit layer disposed on the silicon substrate.

In a second aspect, a display device is provided. The display device comprises the display panel provided by any one of the embodiments.

In a third aspect, a substrate to be cut is provided. The substrate to be cut is provided with a plurality of display areas and a peripheral area positioned at the periphery of each display area, wherein the peripheral area comprises a cutting area. The substrate to be cut comprises an initial substrate, a light emitting device, a first initial packaging layer, a second initial packaging layer, a plurality of color film layers and a first initial insulating layer. The light emitting device is arranged on the initial substrate and is positioned in a display area. The first initial encapsulation layer is disposed on a side of the light emitting device remote from the initial substrate, and covers the respective display regions and the peripheral region. The second initial encapsulation layer is disposed at a side of the first initial encapsulation layer away from the light emitting device, and covers the respective display regions and the peripheral region. The color film layers and the first initial insulating layers are arranged between the first initial packaging layer and the second initial packaging layer, each color film layer covers a display area, and orthographic projection of each color film layer on the initial substrate is located in orthographic projection of the first initial insulating layer on the initial substrate. In the dicing area, the first initial encapsulation layer and the second initial encapsulation layer are in contact.

In some embodiments, the substrate to be cut further includes a second initial insulating layer disposed between the first initial packaging layer and the second initial packaging layer, where the first initial insulating layer and the second initial insulating layer are located at two sides of each color film layer, and an orthographic projection of each color film layer on the initial substrate is located within an orthographic projection of the second initial insulating layer on the initial substrate.

In some embodiments, the orthographic projection of the first initial insulating layer on the initial substrate overlaps the orthographic projection of the second initial insulating layer on the initial substrate.

In a fourth aspect, a method for manufacturing a substrate to be cut is provided. The substrate to be cut is provided with a plurality of display areas and a peripheral area positioned at the periphery of each display area, and the peripheral area comprises a cutting area. The manufacturing method of the substrate to be cut comprises the following steps: light emitting devices are formed on the initial substrate, the light emitting devices being located in a display area. And forming a first initial encapsulation layer on the initial substrate with the light emitting device, wherein the first initial encapsulation layer is arranged on one side of the light emitting device away from the initial substrate, and the first initial encapsulation layer covers the display areas and the peripheral areas. And forming a plurality of color film layers and a first initial insulating layer on the initial substrate with the first initial packaging layer, wherein each color film layer covers a display area, and the orthographic projection of each color film layer on the initial substrate is positioned within the orthographic projection of the first initial insulating layer on the initial substrate. And forming a second initial packaging layer on the initial substrate with the color film layer and the first initial insulating layer, so that each color film layer and the first initial insulating layer are arranged between the first initial packaging layer and the second initial packaging layer. Wherein in the dicing area, the first initial encapsulation layer and the second initial encapsulation layer are in contact.

In some embodiments, the method for manufacturing a substrate to be cut further includes: before or after the step of forming the plurality of color film layers and the first initial insulating layer, and before the step of forming the second initial packaging layer, forming the second initial insulating layer on the initial substrate with the first initial packaging layer, wherein the first initial insulating layer and the second initial insulating layer are positioned on two sides of each color film layer, and the orthographic projection of each color film layer on the initial substrate is positioned inside the orthographic projection of the second initial insulating layer on the initial substrate.

In a fifth aspect, a method for manufacturing a display panel is provided, including cutting a substrate to be cut provided in any one of the above embodiments to form a plurality of display panels.

In the display panel provided by the embodiment of the disclosure, the first insulating layer is provided with first blank areas, and each first blank area is located on the outer side of the color film layer. Accordingly, an interface between the first insulating layer and the first encapsulation layer may be rugged, and an area of the interface may be increased, so that a friction force between the first insulating layer and the first encapsulation layer is increased. Therefore, when the substrate to be cut is cut to form a plurality of display panels, the transmission of cutting stress along the interface can be reduced, the problem that the first insulating layer and the first packaging layer in the display panels are mutually peeled off under the action of stress is further improved, and the problem that other film layers in the display panels are mutually peeled off under the action of stress is also improved.

It can be appreciated that the display device according to the second aspect includes the display panel, the substrate to be cut according to the third aspect may be used to manufacture the display panel, the manufacturing method of the substrate to be cut according to the fourth aspect may be used to manufacture the substrate to be cut, and the manufacturing method of the display panel according to the fifth aspect may be used to manufacture the display panel, so that the advantages achieved by the method of the fifth aspect may be referred to the advantages of the display panel and are not repeated herein.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a block diagram of a display device provided in some embodiments of the present disclosure;

FIG. 2 is a block diagram of a display panel provided in some embodiments of the present disclosure;

FIG. 3 is a cross-sectional view of the display panel of FIG. 2 taken along line AA';

FIG. 4 is a block diagram of a display panel provided in some embodiments of the present disclosure;

FIG. 5 is a cross-sectional view of the display panel of FIG. 2 taken along section line BB';

fig. 6A-6D are top views of display panels provided by some embodiments of the present disclosure;

FIG. 7 is a top view of a display panel provided by some embodiments of the present disclosure;

FIG. 8 is a top view of a display panel provided by some embodiments of the present disclosure;

fig. 9 is a structural view of a display panel in the related art;

fig. 10 is a structural view of a substrate to be cut in the related art;

FIG. 11 is a block diagram of a substrate to be diced provided in some embodiments of the present disclosure;

FIG. 12 is a block diagram of a display panel provided by some embodiments of the present disclosure;

FIG. 13 is a block diagram of a display panel provided by some embodiments of the present disclosure;

FIG. 14 is a block diagram of a display panel provided by some embodiments of the present disclosure;

FIG. 15 is a top view of a pixel defining layer in a display panel provided in some embodiments of the present disclosure;

FIG. 16 is a top view of a first insulating layer and a pixel defining layer in a display panel provided by some embodiments of the present disclosure;

FIG. 17 is a top view of a display panel provided by some embodiments of the present disclosure;

FIG. 18 is a cross-sectional view of the display panel of FIG. 17 taken along section line CC';

FIG. 19 is a top view of a substrate to be cut provided in some embodiments of the present disclosure;

FIG. 20 is a cross-sectional view of the substrate to be cut taken along line DD' in FIG. 19;

FIG. 21 is a block diagram of a substrate to be diced provided in some embodiments of the present disclosure;

fig. 22 is a flowchart of a method for manufacturing a substrate to be cut according to some embodiments of the present disclosure;

fig. 23A to 23F are process flow diagrams of a method for manufacturing a substrate to be cut according to some embodiments of the present disclosure.

Detailed Description

The following description of the embodiments of the present disclosure will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present disclosure. All other embodiments obtained by one of ordinary skill in the art based on the embodiments provided by the present disclosure are within the scope of the present disclosure.

Throughout the specification and claims, unless the context requires otherwise, the word "comprise" and its other forms such as the third person referring to the singular form "comprise" and the present word "comprising" are to be construed as open, inclusive meaning, i.e. as "comprising, but not limited to. In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiment", "example", "specific example", "some examples", "and the like are intended to indicate that a particular feature, structure, material, or characteristic associated with the embodiment or example is included in at least one embodiment or example of the present disclosure. The schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

The terms "first" and "second" are used below for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the embodiments of the present disclosure, unless otherwise indicated, the meaning of "a plurality" is two or more.

In describing some embodiments, expressions of "coupled" and "connected" and their derivatives may be used. For example, the term "connected" may be used in describing some embodiments to indicate that two or more elements are in direct physical or electrical contact with each other. As another example, the term "coupled" may be used in describing some embodiments to indicate that two or more elements are in direct physical or electrical contact. However, the term "coupled" or "communicatively coupled (communicatively coupled)" may also mean that two or more elements are not in direct contact with each other, but yet still co-operate or interact with each other. The embodiments disclosed herein are not necessarily limited to the disclosure herein.

At least one of "A, B and C" has the same meaning as at least one of "A, B or C," both include the following combinations of A, B and C: a alone, B alone, C alone, a combination of a and B, a combination of a and C, a combination of B and C, and a combination of A, B and C.

"A and/or B" includes the following three combinations: only a, only B, and combinations of a and B.

As used herein, the term "if" is optionally interpreted to mean "when … …" or "at … …" or "in response to a determination" or "in response to detection" depending on the context. Similarly, the phrase "if determined … …" or "if detected [ stated condition or event ]" is optionally interpreted to mean "upon determining … …" or "in response to determining … …" or "upon detecting [ stated condition or event ]" or "in response to detecting [ stated condition or event ]" depending on the context.

The use of "adapted" or "configured to" herein is meant to be an open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

In addition, the use of "based on" is intended to be open and inclusive in that a process, step, calculation, or other action "based on" one or more of the stated conditions or values may be based on additional conditions or beyond the stated values in practice.

As used herein, "about," "approximately" or "approximately" includes the stated values as well as average values within an acceptable deviation range of the particular values as determined by one of ordinary skill in the art in view of the measurement in question and the errors associated with the measurement of the particular quantity (i.e., limitations of the measurement system).

As used herein, "parallel", "perpendicular", "equal", "flush" includes the stated case and an approximation to the stated case, the range of which is within an acceptable deviation range as determined by one of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., limitations of the measurement system). For example, "parallel" includes absolute parallel and approximately parallel, where the acceptable deviation range for approximately parallel may be, for example, a deviation within 5 °; "vertical" includes absolute vertical and near vertical, where the acceptable deviation range for near vertical may also be deviations within 5 °, for example. "equal" includes absolute equal and approximately equal, where the difference between the two, which may be equal, for example, is less than or equal to 5% of either of them within an acceptable deviation of approximately equal. "flush" includes absolute flush and near flush, where the distance between the two, which may be flush, for example, is less than or equal to 5% of either dimension within an acceptable deviation of near flush.

It will be understood that when a layer or element is referred to as being "on" another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may also be present between the layer or element and the other layer or substrate.

Exemplary embodiments are described herein with reference to cross-sectional and/or plan views as idealized exemplary figures. In the drawings, the thickness of layers and regions are exaggerated for clarity. Thus, variations from the shape of the drawings due to, for example, manufacturing techniques and/or tolerances, are to be expected. Thus, the exemplary embodiments should not be construed as limited to the shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to limit the scope of example embodiments.

Embodiments of the present disclosure provide a display device. The display device is a product with an image display function. For example, the display device may be: any one of a display, a television, a billboard, a digital photo frame, a laser printer with a display function, a telephone, a mobile phone, a personal digital assistant (Personal Digital Assistant, PDA), a digital camera, a portable camcorder, a viewfinder, a navigator, a vehicle, a large-area wall, a home appliance, an information inquiry apparatus (such as a business inquiry apparatus for e-government, banking, hospital, electric power, etc.), a monitor, and the like. The display device may also be a micro-display or a product containing a micro-display. The product containing the microdisplay may be any of a smart watch, smart bracelet, head mounted display, stereoscopic display mirror, and AR device (e.g., AR glasses), VR device (e.g., VR glasses), etc. For example, the micro-display may be a display having a display size ranging from about 0.2 inch to about 2.5 inches, but is not limited thereto, it being understood that the micro-display may also be a display having a smaller display size, such as a display size less than or equal to 0.2 inch.

Fig. 1 is a structural view of a display device. Referring to fig. 1, the display device 1 may include a display panel 10. The display device 1 may further include a circuit board 20 and a main board 30.

The main board 30 may include an input interface (not shown in the figure) configured to receive signals (e.g., electrical signals carrying pixel data of an image to be displayed). The main board 30 may further include a signal processing unit (not shown in the drawing) coupled to the input interface, the signal processing unit including, for example, a video image signal processing circuit, an IP conversion circuit, and the like. The signal processing unit is configured to perform predetermined signal processing (e.g., color space conversion, contrast adjustment, brightness adjustment, etc. on pixel data of an image to be displayed) on a signal received by the input interface, and to transmit the processed signal to the display panel 10.

The circuit board 20 may be coupled with the main board 30, and the circuit board 20 may also be coupled with the display panel 10, so that the main board 30 may transmit signals to the display panel 10 through the circuit board 20. Illustratively, the circuit board 20 is configured to receive signals transmitted by the motherboard 30 and forward the received signals to the display panel 10. Also illustratively, the circuit board 20 is configured to receive signals transmitted by the motherboard 30, to process the received signals, and to transmit the processed signals to the display panel 10.

The circuit board 20 may be a general circuit board, or may be a flexible circuit board (Flexible Printed Circuit, which may be simply referred to as FPC). Since the flexible wiring board is flexible, the main board 30 may be disposed at the back side 10b of the display panel 10, i.e., the side of the display panel 10 facing away from the display surface 10a, and the display panel 10 and the main board 30 are coupled by bending the flexible wiring board. In this way, the bezel of the display device 1 can be made narrower.

The embodiment of the disclosure also provides a display panel. The display panel may be used as the display panel in the display device of any of the above embodiments.

Fig. 2 is a structural view of a display panel. Fig. 3 is a cross-sectional view of the display panel of fig. 2 along section line AA'. Fig. 4 is a structural diagram of a display panel, showing a drive control circuit in the display panel.

Referring to fig. 2 and 3, if the types of the display panels are divided according to the display principle, the display panel 10 may be one of an OLED (Organic Light Emitting Diode ) display panel, a QLED (Quantum Dot Light Emitting Diodes, quantum dot light emitting diode) display panel, and a micro LED (including: miniLED or micro LED, the LED being a light emitting diode) display panel.

The display panel 10 includes a substrate Sub. The substrate Sub may support other structures in the display panel 10. The material of the substrate Sub may include glass, PI (Polyimide), PET (Polyethylene glycol terephthalate, polyethylene terephthalate), silicon (monocrystalline silicon or polycrystalline silicon), and the like. If the types of the display panel are divided according to the materials of the substrates included in the display panel, the display panel 10 may be a general display panel or a silicon-based display panel. Among them, materials of the substrate in the general display panel may include glass, PI, PET, and the like. The substrate in the silicon-based display panel may comprise a silicon substrate, the material of which is, for example, monocrystalline silicon. In some embodiments, the base Sub includes a silicon substrate 100 and the display panel 10 is a silicon-based display panel.

Referring to fig. 2, the display panel 10 may have a display area AA. The display panel 10 may also have a peripheral area SA. The peripheral area SA may be located on at least one side (e.g., one side; e.g., four sides, including upper and lower sides and left and right sides) of the display area AA.

In the display area AA, a plurality of sub-pixels P are provided, and the display panel 10 can be said to include a plurality of sub-pixels P provided in the display area AA. The display panel 10 may display a predetermined image in the display area AA by light emitted from the plurality of sub-pixels P disposed in the display area AA.

Specifically, the plurality of sub-pixels P may include a plurality of sub-pixels having different emission colors. Illustratively, the plurality of sub-pixels P includes a first sub-pixel P1, a second sub-pixel P2, and a third sub-pixel P3. The first, second and third sub-pixels P1, P2 and P3 respectively emit light of three primary colors, for example, the first sub-pixel P1 may emit red light, the second sub-pixel P2 may emit green light and the third sub-pixel P3 may emit blue light.

A sub-pixel P may include a light emitting device E and a pixel driving circuit M coupled to the light emitting device E. The light emitting device E and the pixel driving circuit M are disposed on the substrate 100. Since the sub-pixels P are disposed in the display area AA, it can also be said that the respective light emitting devices E are disposed in the display area AA.

The light emitting device E may be one of an organic light emitting diode OLED, a quantum dot light emitting diode QLED, a light emitting diode LED, and a liquid crystal light emitting device, but is not limited thereto. The embodiments of the present disclosure are not limited to the light emitting device, i.e., the light emitting device E may be any other light emitting device (e.g., a light emitting device that emits light by discharge) as long as they can emit light so that the display panel can display a picture.

Referring to fig. 3, in some embodiments, the light emitting device E is an organic light emitting diode including a first electrode 210, a second electrode 220, and a light emitting functional layer 230 between the first electrode 210 and the second electrode 220.

In some embodiments, the first electrode 210 is an anode and, correspondingly, the second electrode 220 is a cathode. The second electrode 220 may be transparent or translucent. Thus, when the light emitting device E is a top emission type light emitting device, the second electrode 220 may allow light emitted from the light emitting functional layer 230 to exit through the second electrode 220. The material of the second electrode 220 may include a metal oxide, such as Indium Tin Oxide (ITO) or Indium Zinc Oxide (IZO); the material of the second electrode 120 may further include a metal or an alloy, for example, a metal such as magnesium (Mg), titanium (Ti), silver (Ag), or an alloy formed of a plurality of metals.

The first electrode 210 may include a first conductive layer 211 and a second conductive layer 212. The material of the first conductive layer 211 may include a metal such as titanium (Ti) or silver (Ag), or an alloy formed of a plurality of metals such as titanium (Ti) or silver (Ag). The first conductive layer 211 may be configured to reflect light. When the light emitting device E is a top emission type light emitting device, light emitted from the light emitting functional layer 230 in the direction of the first electrode 210 may be reflected by the first conductive layer 211, so that the light may also exit from the second electrode 220 side, thereby improving light extraction. The second conductive layer 212 may include a material having a high work function. For example, the material of the second conductive layer 212 may include Indium Tin Oxide (ITO) or Indium Zinc Oxide (IZO). The second conductive layer 212 may be configured to be in contact with the light emitting function layer 230, for example, the second conductive layer 212 may be disposed on the first conductive layer 211, i.e., the second conductive layer 212 may be disposed on a side of the first conductive layer 211 near the light emitting function layer 230. Since the second conductive layer 212 includes a material having a high work function, the second conductive layer 212 is more likely to inject holes into the light emitting functional layer 230, and thus the light emitting efficiency of the light emitting device E can be improved.

The light emitting functional layer 230 may include a light emitting layer, such as an organic light emitting layer. The light emitting layer may emit light. The light emitting functional layer 230 may further include one or more of a hole injection layer, a hole transport layer, and an electron blocking layer between the light emitting layer and the anode (e.g., the first electrode 210). The light emitting functional layer 230 may further include one or more of an electron injection layer, an electron transport layer, and a hole blocking layer between the light emitting layer and the cathode (e.g., the second electrode 220).

The pixel driving circuit M may include a plurality of transistors T (e.g., field effect transistors) and at least one (e.g., one; e.g., a plurality of) capacitors. For example, the pixel driving circuit M may have a structure of "2T1C", "4T2C", "5T1C", "6T2C", "7T1C", "7T2C", or the like. Here, "T" represents a transistor, and a number located before "T" represents the number of transistors; "C" represents a capacitor, and the number preceding "C" represents the number of capacitors.

One transistor T may include: source Ts, drain Td and gate Tg. In some embodiments, the base Sub includes a silicon substrate 100, a portion of the silicon substrate 100 may be doped, and a source Ts and a drain Td of the transistor T may be formed.

The base Sub may further include a circuit layer 300 disposed on the silicon substrate 100. The circuit layer 300 may include one or more metal layers and one or more insulating layers. A metal layer and the transistor, two metal layers, and a metal layer and the light emitting device may be coupled through the contact hole CH. The contact hole CH may be filled with a conductive material, such as tungsten or other metals. The circuit layer 300 and the silicon substrate 100 may implement a pixel driving circuit M.

Illustratively, the circuit layer 300 may include a plurality of metal layers, such as a first metal layer 320, and a second metal layer 340. The circuit layer 300 may further include a plurality of interlayer insulating layers, such as a first interlayer insulating layer 310, a second interlayer insulating layer 330, and a third interlayer insulating layer 350. Wherein the first metal layer 320 is spaced apart from the transistor T by the first interlayer insulating layer 310 and coupled to the transistor T by the contact hole CH. The contact hole CH may be filled with a conductive material, such as a metal, e.g., tungsten. Similarly, the second metal layer 340 is spaced apart from the first metal layer 320 by the second interlayer insulating layer 330 and coupled to the first metal layer 320 by a contact hole. The light emitting device E is separated from the second metal layer 340 by a third interlayer insulating layer 350 and coupled to the second metal layer 340 by a contact hole. In this way, an electrical signal (e.g., a driving voltage or a driving current) in the pixel driving circuit M may sequentially pass through the transistor T, the first metal layer 320, and the second metal layer 340, and then be transmitted to the light emitting device E to drive the light emitting device E to emit light. It should be noted that the embodiments of the present disclosure do not limit the number of metal layers and insulating layers in the circuit layer 300, as long as the metal layers and insulating layers and the silicon substrate can implement the pixel driving circuit.

Referring to fig. 4, the display panel 10 may further include a driving control circuit 400 coupled with the plurality of pixel driving circuits M. The driving control circuit 400 may be disposed in a peripheral region of the display panel. In some embodiments, referring to the description above, the drive control circuit 400 may also be implemented by a metal layer and a silicon substrate.

In some embodiments, the drive control circuit 400 may include a scan drive circuit 410 (which may also be referred to as a gate drive circuit). Since the scan driving circuit 410 is disposed on the display panel 10, the scan driving circuit 410 may also be referred to as a GOA (Gate Driver on Array, scan driving circuit disposed on the array substrate).

The driving control circuit 400 may further include a timing control circuit 420 (may also be referred to as a timing controller Timer Control Register, abbreviated as TCON) and a data driving circuit 430 (may be, for example, a Source Driver IC).

Specifically, the timing control circuit 420 may be coupled to the scan driving circuit 410 and may also be coupled to the data driving circuit 430. The timing control circuit 420 may be configured to receive the display signal, and output the first control signal and the image data to the data driving circuit 430 and the second control signal to the scan driving circuit 410 in response to the display signal. Wherein the first control signal is configured to control the operation timing of the data driving circuit 430, and the second control signal is configured to control the operation timing of the scan driving circuit 410. The data driving circuit 430 is configured to convert the received image data into data signals of a plurality of sub-pixels P, and output the data signals to the pixel driving circuits M in the respective sub-pixels according to the operation timing determined by the first control signal. The scan driving circuit 410 is configured to output scan signals to the plurality of sub-pixels P according to the operation timing determined by the second control signal.

With continued reference to fig. 3, the display panel 10 further includes a color film layer 500. In some embodiments, the light emitting device E may emit white light, for example, the light emitting device E is a white OLED. At this time, the color film layer 500 may include a plurality of filters having different colors. A filter may be provided in a sub-pixel so that the sub-pixel may emit light of a corresponding color. Illustratively, the color film layer 500 may include a red filter 510 in the first subpixel P1, a green filter 520 in the second subpixel P2, and a blue filter 530 in the third subpixel P3.

Fig. 5 is a cross-sectional view of the display panel of fig. 2 along section line BB'. It should be noted that, for simplicity of the drawing, only the light emitting device and the film layer disposed on the side of the light emitting device away from the substrate are shown in fig. 5, and some of the film layers on the side of the light emitting device close to the substrate are omitted, for example, one or more metal layers and one or more insulating layers in the circuit layer are omitted. The specific structure of the silicon substrate is also omitted in fig. 5.

Referring to fig. 2 and 5, the display panel 10 further includes a first encapsulation layer 600. The first encapsulation layer 600 is disposed at a side of the light emitting device E remote from the substrate Sub. The first encapsulation layer 600 may cover the display area AA, and thus, the first encapsulation layer 600 may cover the light emitting device E to protect the light emitting device E. Illustratively, the first encapsulation layer 600 may be configured to isolate the light emitting device E from external moisture and oxygen (e.g., outside of the light emitting device), prevent the external moisture and oxygen from contacting the light emitting device E, and prevent the light emitting device E from being damaged by moisture and oxygen corrosion.

In some embodiments, the first encapsulation layer 600 may also extend to the peripheral area SA. Illustratively, the edge of the first encapsulation layer 600 may be flush with the edge of the substrate Sub. The material of the first encapsulation layer 600 includes, for example, siO ₂ 、Al ₂ O ₃ And Parylene (a thermoplastic polymer synthesized from para-xylene). The first encapsulation layer 600 may be fabricated using plasma enhanced chemical vapor deposition (Plasma Enhanced Chemical Vapor Deposition, which may be abbreviated as PECVD), atomic layer deposition (Atomic Layer Deposition, which may be abbreviated as ALD), molecular layer deposition (Molecular Layer Deposition, which may be abbreviated as MLD), and the like. In the process of manufacturing the first encapsulation layer 600, since there is no Mask (Mask) in the machine used in the PECVD process, the ALD process, and the MLD process, the process of manufacturing the first encapsulation layer 600 may be a full-face deposition process. In this way, the first encapsulation layer 600 may extend to the peripheral area SA, for example, the first encapsulation layer 600 may extend in a direction perpendicular to the thickness direction of the display panel (e.g., parallel to a plane defined by the first direction x and the second direction y, which are perpendicular to the third direction z, and which intersect), and edges of the first encapsulation layer 600 may be flush with edges of the substrate Sub.

The display panel 10 further includes a second encapsulation layer 700. The second encapsulation layer 700 is disposed at a side of the first encapsulation layer 600 remote from the light emitting device E. Similar to the first encapsulation layer 600, the second encapsulation layer 700 may cover the display area AA, and thus, the second encapsulation layer 700 may cover the light emitting device E to protect the light emitting device E. In addition, the second encapsulation layer 700 may also protect film layers disposed on a side of the second encapsulation layer 700 near the substrate Sub, such as the color film layer 500, the first insulation layer 800 (to be described in detail later), the second insulation layer 900 (to be described in detail later), and the first encapsulation layer 600.

In some embodiments, similar to the first encapsulation layer 600, the second encapsulation layer 700 may also be extended to the peripheral area SA. Illustratively, the second encapsulation layer 700 may extend in a direction perpendicular to the thickness direction of the display panel, and an edge of the second encapsulation layer 700 may be flush with an edge of the substrate Sub. The description may refer to the description of the first encapsulation layer 600 above, and will not be repeated here.

As described above, the display panel 10 further includes the color film layer 500. The color film layer 500 may be disposed between the first and second encapsulation layers 600 and 700.

The display panel 10 further includes a first insulating layer 800. The first insulating layer 800 and the color film layer 500 are disposed between the first and second encapsulation layers 600 and 700. That is, in the thickness direction (e.g., parallel to the third direction z) of the display panel 10, the first insulating layer 800 and the color film layer 500 are located between the first and second encapsulation layers 600 and 700.

In some embodiments, the first insulating layer 800 is located at a side of the color film layer 500 adjacent to the first encapsulation layer 600, that is, the first encapsulation layer 600, the first insulating layer 800, the color film layer 500, and the second encapsulation layer 700 are sequentially disposed in the thickness direction of the display panel 10. In other embodiments, the first insulating layer 800 is located on one side of the color film layer 500 near the second encapsulation layer 700, i.e. the first encapsulation layer 600, the color film layer 500, the first insulating layer 800 and the second encapsulation layer 700 are sequentially disposed in the thickness direction of the display panel 10.

The first insulating layer 800 has a first coverage area 810 and at least one (e.g., one; e.g., a plurality) of blank areas 820 other than the first coverage area 810.

It should be noted that, in this document, a film layer (e.g., the first insulating layer or the second insulating layer) having a blank area may mean that the film layer does not cover the blank area in the display panel. Having a film layer with a footprint may mean that in a display panel, the film layer covers the footprint.

Herein, a having a plurality of regions may mean dividing the region occupied by a in a direction perpendicular to the thickness direction of the display panel, forming a plurality of regions. A is, for example, a film layer (e.g., a first insulating layer or a second insulating layer) or a display panel.

Fig. 6A to 6D are plan views of the display panel. Fig. 7 is a top view of a display panel. Fig. 8 is a top view of a display panel. For convenience of explanation, fig. 6A to 6D, 7 and 8 show only a plurality of film layers disposed on the side of the first encapsulation layer away from the substrate, and the film layer disposed on the side of the first encapsulation layer close to the substrate is omitted, for example, the light emitting device is omitted. And, the specific structure of the silicon substrate is also omitted.

Referring to fig. 5 and fig. 6A to fig. 6D, the orthographic projection of the color film layer 500 on the first insulation layer 800 is located within the outer contour of the first coverage area 810 of the first insulation layer 800.

In this context, the orthographic projection of a is a projection of a in the thickness direction of the display panel.

It should be noted that, in this context, the orthographic projection of a being located within B may mean one of the following three cases: first, all of the outer contour of the orthographic projection of A is located inside the outer contour of B. And secondly, a part of the front projected outer contour of the A coincides with the outer contour of the B, and the rest part is positioned inside the outer contour of the B. Third, all of the outer contours of the orthographic projection of A coincide with the outer contours of B.

In this context, when discussing the orthographic projection of the film layer (e.g., the first insulating layer, the color film layer, the second insulating layer, etc.), the thickness of the film layer may be ignored, i.e., the orthographic projection of the film layer may be the orthographic projection of the upper surface of the film layer (i.e., the side of the film layer away from the substrate) or the orthographic projection of the lower surface of the film layer (i.e., the side of the film layer closer to the substrate). For example, the front projection of the film layer may be the front projection of the larger of the upper and lower surfaces of the film layer.

In some embodiments, the first footprint 810 has only one closed contour, which is then the outer contour of the first footprint 810. In other embodiments, the first footprint 810 has a plurality of closed contours. Illustratively, the first coverage area 810 encompasses one or more blank areas, where the first coverage area 810 has a plurality of closed contours. In this case, the outer contour of the first coverage area 810 is the outermost closed contour among the respective closed contours of the first coverage area 810. Illustratively, the outer contour of the first coverage area 810 may be the closed contour furthest from the display area AA among the respective closed contours of the first coverage area 810.

Similarly, the outline of the front projection of the color film layer 500 on the first insulating layer 800 may also refer to the description about the outline of the first coverage area 810, which is not repeated herein.

Based on the above, in some embodiments, all of the outer contour of the orthographic projection of the color film layer 500 on the first insulation layer 800 is located inside the outer contour of the first coverage area 810 of the first insulation layer.

Since the orthographic projection of the color film layer 500 on the first insulating layer 800 is located within the outer contour of the first coverage area 810 of the first insulating layer, the first insulating layer 800 may be configured as a planarization layer, that is, since the first insulating layer 800 is provided, the surface 800a of the first insulating layer 800 remote from the light emitting device E may be a relatively flat surface.

Specifically, in some embodiments, the first insulating layer 800 is located on a side of the color film layer 500 near the light emitting device E, i.e., the color film layer 500 may be located on the first insulating layer 800. At this time, since the surface 800a of the first insulating layer 800 away from the light emitting device E may be a relatively flat surface, the color film 500 fabricated on the surface 800a may also be relatively flat, so as to reduce crosstalk between the sub-pixels.

In other embodiments, the first insulating layer 800 is located on a side of the color film layer 500 near the second encapsulation layer 700. At this time, since the surface of the first insulating layer 800 remote from the light emitting device E may be a relatively flat surface, a film layer fabricated on the surface, such as the second encapsulation layer 700, may be relatively flat. In some possible implementations, referring to fig. 3, the display panel 10 further includes a cover panel CG. The material of the cover CG is, for example, glass, in which case the cover CG may also be referred to as cover glass. Based on the above, since the first insulating layer 800 is located on the side of the color film layer 500 close to the second encapsulation layer 700, the surface of the first insulating layer 800 away from the light emitting device E may be a relatively flat surface, and thus, the surface provided with the cover CG may also be a relatively flat surface. Thus, the cover plate CG is smooth, and the problem that bubbles exist under the cover plate CG can be solved.

In addition, the first insulating layer 800 may also be configured as an adhesive layer. Illustratively, the adhesion between the first insulating layer 800 and the color film layer 500 is good. Since the first insulating layer 800 is provided, structural stability of the display panel 10 may be improved.

With continued reference to fig. 5, the material of the first insulating layer 800 may include a resin. The first insulating layer 800 may be manufactured using a coating process (coating). The thickness of the first insulating layer 800 may beOr 1 μm. For example, an insulating film may be formed on the substrate Sub using a coating process (coating), and then a portion of the insulating film corresponding to each of the blank regions may be removed, and the first insulating layer 800 may be formed.

Based on the above, the first insulating layer 800 having at least one (e.g., one; and as another example, a plurality of) blank regions may mean that the first insulating layer 800 does not cover the blank regions in the display panel 10. Illustratively, the display panel 10 may further include a plurality of connection pins configured to be coupled with the wiring board so as to input signals to the display panel through the connection pins. A connection pin may be disposed in a blank area of the first insulating layer 800, and since the blank area is not covered by the first insulating layer 800, the connection pin may be exposed by the first insulating layer 800 and may be coupled to the circuit board.

Each of the empty regions 820 of the first insulating layer 800 may include at least one (e.g., one; another, e.g., a plurality) of first empty regions 821, which may also be said to be at least one first empty region 821 of the first insulating layer 800. In each of the first blank regions 821, the first encapsulation layer 600 is in contact with the second encapsulation layer 700. It can also be said that an interface formed by the contact between the first encapsulation layer 600 and the second encapsulation layer 700 is disposed in a first empty region 821.

For convenience of description, an interface formed by the first encapsulation layer 600 contacting the second encapsulation layer 700 is referred to as a first interface IF1. In some possible implementations, for one first blank 821, the first interface IF1 may cover all of the first blank 821. In other possible implementations, the first interface IF1 covers only a portion of the first blank 821.

Since the first encapsulation layer 600 is in contact with the second encapsulation layer 700 in the first blank 821, the first encapsulation layer 600 and/or the second encapsulation layer 700 may cover the side SW1 of the first insulation layer 800. The side SW1 of the first insulating layer 800 may be a surface of the first insulating layer 800 that is distributed in a direction perpendicular to the thickness direction of the display panel.

At least one (e.g., one; and for another example, each) of the first blank area 821 is remote from the display area AA compared to the color film layer 500. It can also be said that at least one (e.g., one; and as another example, each) of the first blank 821 is located outside the color film layer 500. The outer side of the color film layer 500 may mean a side of the color film layer 500 away from the display area AA along the extending direction of the color film layer 500 (e.g., parallel to a plane defined by the first direction x and the second direction y). Based on this, a first blank area 821 may be located at a side of the color film 500 away from the display area AA. For example, the first blank area 821 may be located in the peripheral area SA, and the first blank area 821 is located outside of the orthographic projection of the color film layer 500 on the substrate Sub.

In some embodiments, referring to fig. 6A-6C, at least one of the respective first blank regions 821 is an edge blank region EB1. For convenience of explanation, hereinafter, an edge blank region in the first blank region 821 is referred to as a first edge blank region. The first edge blank region EB1 is farther from the display region AA than the first coverage region 810. It can also be said that the first edge blank area EB1 is located outside the first coverage area 810, for example, the first edge blank area EB1 is located on at least one side (for example, one side; for example, four sides, including upper and lower sides and left and right sides) of the first coverage area 810 away from the display area AA.

Referring to fig. 6A, in some possible implementations, a first edge blank area EB1 is located around the first footprint 810. At this time, the first edge blank region EB1 is annular, and the annular first edge blank region EB1 may surround the first coverage area 810.

Referring to fig. 6B and 6C, in other possible implementations, the first edge blank area EB1 is elongated. For example, referring to fig. 6B, an elongated first edge blank EB1 may extend along the first direction x, and the first edge blank EB1 may be located at one side of the color film layer 500 along the second direction y. Still further exemplary, referring to fig. 6C, an elongated first edge blank area EB1 may extend along the second direction y, and the first edge blank area EB1 may be located at one side of the color film layer 500 along the first direction x.

Referring to fig. 6D, in other possible implementations, the first edge blank area EB1 is curved. Illustratively, the bent first edge blank EB1 may include a first portion EB1a and a second portion EB1b. Wherein the first portion EB1a extends along the first direction x and is located at one side of the color film layer 500 along the second direction y; the second portion EB1b extends along the second direction y and is located at one side of the color film layer 500 along the first direction x.

In some embodiments, referring to fig. 7, at least one of the respective first blank regions is a hollowed-out region HB1. For convenience of explanation, hereinafter, the hollowed-out region in the first hollow region 821 is referred to as a first hollowed-out region HB1. Each first hollowed-out region HB1 is surrounded by a first coverage region 810.

Illustratively, the first insulating layer 800 includes a plurality of first hollowed-out regions HB1. The first hollow-out regions HB1 may be located at least one side of the color film layer 500, for example, the first hollow-out regions HB1 may be located at least one side of the color film layer 500 along the extending direction of the color film layer 500. In some possible implementations, the plurality of first hollowed-out regions HB1 may be located at one side of the color film layer 500. In other possible implementations, the plurality of first hollowed-out regions HB1 may be located on two sides of the color film layer 500, for example, on any of two sides of the color film layer 500 along the second direction y and two sides along the first direction x. In other possible implementations, the plurality of first hollowed-out regions HB1 are located around the color film layer 500, that is, on two sides of the color film layer 500 along the second direction y and on two sides of the color film layer along the first direction x.

In some embodiments, referring to fig. 8, each first blank 821 includes at least one edge blank EB1 and at least one first hollowed out portion HB1. Illustratively, each first hollow area 821 includes an annular first edge hollow area EB1 and a plurality of first hollow areas HB1, and the plurality of first hollow areas HB1 are located around the color film layer 500.

Fig. 9 is a structural diagram of a display panel in the related art. Fig. 10 is a diagram of a substrate to be cut in the related art. Fig. 11 is a diagram of a substrate to be cut provided in an embodiment of the present disclosure. Note that, in fig. 10 and 11, only the first initial encapsulation layer and the first initial insulating layer are shown, and other film layers, such as a color film layer and a second initial encapsulation layer, are omitted.

Referring to fig. 9, in the display panel 40 in the related art, the first insulating layer 800' has no first blank area. Illustratively, the orthographic projection of the first insulating layer 800' on the first encapsulation layer 600 overlaps the first encapsulation layer 600.

Referring to fig. 9 and 10, the display panel 40 may be manufactured by cutting the substrate 50 to be cut. The substrate 50 to be cut may include an initial base OS, and may further include a light emitting device, a first initial encapsulation layer O600, a second initial encapsulation layer, and a first initial insulation layer O800' disposed on the initial base OS. The substrate 50 to be cut may have a cutting region SL' in which a cutting Scribe Lane (Scribe Lane) is disposed. The substrate 50 to be cut may be cut along a dicing Lane (Scribe Lane), and the display panel 40 may be obtained. Specifically, after the initial substrate OS, the first initial encapsulation layer O600, the second initial encapsulation layer, and the first initial insulation layer O800 'are cut along the cutting region SL', the corresponding structure in the display panel 40 may be obtained.

In some embodiments, the edges of the first initial encapsulation layer O600 and the second initial encapsulation layer are flush with the initial substrate OS. Illustratively, referring to the description above, the first and second initial encapsulation layers O600 and O600 may be fabricated using a PECVD process, an ALD process, and an MLD process. Because there is no mask in the machine used in the PECVD process, the ALD process, and the MLD process, the fabrication process of the first initial encapsulation layer O600 and the second initial encapsulation layer may be a full-face deposition process. In this way, the first preliminary encapsulation layer O600 may be extended in a direction perpendicular to the thickness direction of the substrate to be cut, and edges of the first preliminary encapsulation layer O600 and the second preliminary encapsulation layer are flush with edges of the preliminary base OS.

As described above, since the first insulating layer 800 'does not have the first blank area in the display panel 40, the front projection of the first insulating layer 800' on the first encapsulation layer 600 may overlap with the first encapsulation layer 600. Based on the same principle, in the substrate 50 to be cut, the orthographic projection of the first preliminary insulating layer O800' on the first preliminary encapsulation layer O600 may overlap with the first preliminary encapsulation layer O600. The interface IF2' between the first initial insulating layer O800' and the first initial encapsulation layer O600 may thus be extended to the cutting region SL '. When the substrate 50 to be cut is cut along the cutting region SL ', stress generated by the cutting may be transferred to the display region AA along the interface IF2', so that the first insulating layer 800' and the first encapsulation layer 600 in the display panel 40 are peeled off (peeling) from each other under the stress.

Referring to fig. 5 and 11, the display panel 10 may be manufactured by cutting the substrate 60 to be cut. The substrate 60 to be cut may include an initial base OS, and may further include a light emitting device, a first initial encapsulation layer O600, a second initial encapsulation layer, and a first initial insulation layer O800 disposed on the initial base OS. It should be noted that, in the substrate to be cut 60, the other structures except for the first initial insulating layer O800 may be similar to the corresponding structures of the substrate to be cut 50 in fig. 10, and the description of the substrate to be cut 50 is referred to above, which is not repeated here. The substrate 60 to be cut may have a cutting area SL. The substrate to be cut may be cut along a dicing Lane (Scribe Lane) located at the dicing area SL, and the display panel 10 may be obtained. Specifically, after the initial substrate OS, the first initial encapsulation layer O600, the second initial encapsulation layer, and the first initial insulation layer O800 are cut along the cutting region SL, the corresponding structure in the display panel 10 may be obtained.

In the display panel 10 provided in the embodiments of the present disclosure, the first insulating layer 800 has first blank regions 821, at least one (e.g., one; for another example, each) of the first blank regions 821 is located far from the display region AA compared to the color film layer 500, i.e., at least one of the first blank regions 821 is located outside the color film layer 500. In this way, the interface between the first insulating layer 800 and the first encapsulation layer 600 may be rugged. The area of the interface may be increased compared to the display panel in the related art, so that the friction between the first insulating layer and the first encapsulation layer is increased. In this way, when the substrate 60 to be cut is cut to form a plurality of display panels 10, the transmission of the cutting stress along the interface can be reduced, so as to improve the problem that the first insulating layer 800 and the first encapsulation layer 600 in the display panel 10 are peeled off from each other under the stress, and also improve the problem that other film layers in the display panel 10 are peeled off from each other under the stress.

It should be noted that, in this document, the interface formed by the first insulating layer or the second insulating layer and the other film layer may be an interface formed by a portion of the first insulating layer or the second insulating layer located in its coverage area and the other film layer.

Further, in some embodiments, as described above, at least one of each first blank 821 is a first edge blank. Since the first edge margin is far from the display area compared to the first cover area in the display panel 10, i.e., the first edge margin is located outside the color film layer 500, the first edge margin may be located between the display area AA and the cutting area SL in the substrate 60 to be cut. In this way, the edge of the interface between the first preliminary insulating layer O800 and the first preliminary encapsulation layer O600 may be located between the display area AA and the cutting area SL, i.e., the interface does not extend to the cutting area SL. Based on this, when the substrate 60 to be cut is cut, the transmission of stress along the interface between the first initial insulating layer O800 and the first initial encapsulation layer O600 can be reduced, thereby improving the problem that the first insulating layer 800 and the first encapsulation layer 600 are peeled off from each other in the display panel under the stress.

In addition, since the first insulating layer 800 has the first edge margin, the first initial insulating layer O800 may not cover the scribe line in the substrate 60 to be cut forming the display panel 10. In this way, when the substrate 60 to be cut is cut along the dicing lines, the number of cut film layers can be reduced, so that the dicing process can be simpler and more controllable, and the problem of mutual peeling between the film layers in the display panel 10 can be improved.

In other embodiments, referring to fig. 7, 8 and 11, at least one of each first hollow region 821 is first hollow region HB1 as described above. Since the first hollow area HB1 is located at the outer side of the color film layer 500 in the display panel 10 compared to the color film layer 500, i.e., the first hollow area HB1 is located at the outer side of the color film layer 500, in the substrate 60 to be cut, the first hollow area HB may be located between the display area AA and the cutting area SL, i.e., between the display area AA and the cutting area SL, and the material of the first and/or second initial encapsulation layers may be surrounded by the first initial insulation layer O800, forming a structure in which a portion of the first and/or second initial encapsulation layers is nested in the first initial insulation layer O800. In this way, the friction force between the first initial insulating layer O800 and the first initial encapsulation layer O600 and/or the second initial encapsulation layer O700 may be increased, and when the substrate 60 to be cut is cut, the transmission of stress along the interface between the first initial insulating layer O800 and the first initial encapsulation layer O600 may be reduced, thereby improving the problem that the first insulating layer 800 and the first encapsulation layer 600 are peeled off from each other in the display panel 10 under the stress.

Fig. 12 is a cross-sectional view of a display panel. Referring to fig. 12, in some embodiments, the substrate Sub is provided with at least one (e.g., one; e.g., a plurality of) first concave portions PT1 near the surface Sa of the first encapsulation layer 600. A first recess PT1 is located in a first edge blank EB 1. And, the outer edge PT1e of the first concave portion PT1 is substantially flush with the edge 600e of the first encapsulation layer 600. The outer edge PT1e of the first concave portion PT1 may be an edge of the first concave portion PT1 away from the display area AA.

It should be noted that the outer edge PT1e of the first recess PT1 is substantially flush with the edge 600e of the first package layer 600 may include that the outer edge PT1e is absolutely flush and approximately flush with the edge 600 e. Wherein the outer edge PT1e is approximately flush with the edge 600e may mean that the distance between the outer edge PT1e and the edge 600e is less than or equal to 5% of the size of the first recess PT 1. Illustratively, the outer edge PT1e of the first recess being approximately flush with the edge 600e of the first encapsulation layer may mean that a distance between the outer edge PT1e of the first recess and the edge 600e of the first encapsulation layer in the first direction x is less than or equal to 5% of a dimension of the first recess PT1 in the first direction x.

Since the substrate Sub is provided with at least one (e.g., one; e.g., a plurality of) first recess portions PT1 near the surface Sa of the first encapsulation layer 600, the thickness h of the display panel 10 (e.g., the size of the display panel along the third direction z) in the first edge blank area EB1 may be reduced, and accordingly, the thickness at the dicing lane of the substrate to be diced forming the display panel may be reduced, so that the process of dicing the substrate to be diced to form the display panel is simpler, and the problem of mutual peeling between the film layers in the display panel may be improved.

With continued reference to fig. 5, in some embodiments, the display panel 10 further includes a second insulating layer 900. The second insulating layer 900 is disposed between the first package layer 600 and the second package layer 700, and the first insulating layer 800 and the second insulating layer 900 are located at two sides of the color film layer 500. For example, the first insulating layer 800, the color film layer 500, and the second insulating layer 900 may be sequentially disposed in the thickness direction of the display panel.

In some embodiments, the second insulating layer 900 may be located on a side of the color film layer 500 near the first encapsulation layer 600, and accordingly, the first insulating layer 800 is located on a side of the color film layer 500 near the second encapsulation layer 700, that is, in the thickness direction of the display panel 10, the first encapsulation layer 600, the second insulating layer 900, the color film layer 500, the first insulating layer 800, and the second encapsulation layer 700 may be sequentially disposed. In other embodiments, the second insulating layer 900 may be located on a side of the color film layer 500 near the second encapsulation layer 700, and accordingly, the first insulating layer 800 is located on a side of the color film layer 500 near the first encapsulation layer 600, that is, the first encapsulation layer 600, the first insulating layer 800, the color film layer 500, the second insulating layer 900 and the second encapsulation layer 700 may be sequentially disposed in the thickness direction of the display panel 10.

The second insulating layer 900 has a second coverage area 910 and at least one (e.g., each; e.g., a plurality) of blank areas 920 other than the second coverage area 910. The orthographic projection of the color film layer 500 on the second insulation layer 900 is located within the outer contour of the second coverage area 910 of the second insulation layer.

The beneficial effects of the second insulating layer 900 are similar to those of the first insulating layer 800, and reference may be made to the above related description, which is not repeated here.

In addition, the materials, manufacturing process and thickness of the second insulating layer 900 may be similar to those of the first insulating layer 800, and reference may be made to the above related descriptions, which are not repeated here. It should be noted that the material of the second insulating layer 900 may be the same as or different from the material of the first insulating layer 800, which is not limited in the embodiments of the present disclosure. Also, the thickness of the second insulating layer 900 may be the same as or different from the thickness of the first insulating layer 800, which is not limited by the embodiments of the present disclosure. In some embodiments, the thickness of the second insulating layer 900 is greater than the thickness of the first insulating layer 800.

The blank area 920 of the second insulating layer may comprise at least one (e.g., one; as another example, a plurality) second blank area 921, so to speak, the second insulating layer 900 has at least one second blank area 921. In at least one (e.g., one; and as another example, each) second blank area 921, the first encapsulation layer 600 is in contact with the second encapsulation layer 700.

Similarly to the first empty region of the first insulating layer, for one second empty region 921, the first interface IF1 formed by the first encapsulation layer 600 in contact with the second encapsulation layer 700 may cover the whole of the second empty region 921 or may cover only a part of the second empty region 921.

At least one (e.g., one; and as another example, each) of the second blank areas 921 is further away from the display area AA than the color film layer 500, which can also be said that at least one of the second blank areas 921 is located outside of the color film layer 500. The explanation of the second blank area 921 being located outside the color layer 500 may refer to the explanation of the first blank area being located outside the color layer hereinabove, and will not be repeated herein.

In some embodiments, at least one of the respective second blank areas 921 is an edge blank area EB2. For convenience of explanation, hereinafter, the edge blank region in the second blank region 921 will be referred to as a second edge blank region. A second edge blank area 921 is farther from the display area AA than the second coverage area 910, so to speak, a second edge blank area EB2 is located outside the second coverage area 910. The structure of the second edge void region and its relative position in the second insulating layer may be referred to the above description of the structure of the first edge void region and the relative position of the first edge void region in the first insulating layer, and will not be repeated herein.

In some embodiments, at least one of the respective second blank areas 921 is a hollowed-out area. For convenience of explanation, hereinafter, the hollowed-out region in the second hollow region 921 is referred to as a second hollowed-out region. At least one (e.g., one; and as another example, each) second hollowed out region is surrounded by a second covered region 910. The structure and position of the second hollow region may be referred to the above description about the structure and position of the first hollow region, and will not be described herein.

The second blank area may have similar beneficial effects to those of the first blank area, and reference may be made to the above description, which is not repeated here.

In some embodiments, an edge of a second blank 921 (e.g., one second blank 921; as another example, each second blank 921) is substantially flush with an edge of a first blank 821.

It should be noted that the edge of the second blank 921 being substantially flush with the edge of the first blank 821 may include the edge of the second blank 921 being absolutely flush and approximately flush with the edge of the first blank 821. Wherein the edge of the second blank area 921 is approximately flush with the edge of the first blank area 821 may mean that a distance between the edge of the second blank area 921 and the edge of the first blank area 821 is less than or equal to 5% of a size of the second blank area 921 or the first blank area 821. Illustratively, the edge of the second blank 921 being approximately flush with the edge of the first blank 821 may mean that a distance between the edge of the second blank 921 and the edge of the first blank 821 along the first direction x is less than or equal to 5% of a dimension of the second blank 921 or the first blank 821 along the first direction x.

Illustratively, the edge of each second blank 921 is flush with the edge of a first blank 821, and further, the front projection of the first insulating layer 800 on the substrate may overlap with the front projection of the second insulating layer 900 on the substrate. In this way, the first blank 821 and the second blank 921 can be manufactured through the same photolithography process, so that the process of manufacturing the display panel can be simpler, and the yield of products can be improved.

In some embodiments, the first encapsulation layer 600 includes at least one (e.g., one; and as another example, a plurality) of first inorganic layers 610 and first organic layers 620.

Wherein at least one first inorganic layer 610 may be disposed at a side of the light emitting device E remote from the substrate Sub. Illustratively, the light emitting devices E may be disposed between the substrate Sub and the respective first inorganic layers 610 in the thickness direction of the display panel 10.

A first inorganic layer 610 may be configured to isolate the light emitting device E from external moisture and oxygen (e.g., outside the light emitting device), i.e., to prevent external moisture and oxygen from contacting the light emitting device E, and to prevent the light emitting device E from being damaged by moisture and oxygen corrosion. Illustratively, moisture and oxygen may exist in the process of fabricating the color film layer 500 and the like on the substrate Sub with the first encapsulation layer 600, and the first inorganic layer 610 may isolate the light emitting device E from the moisture and oxygen in these processes to protect the light emitting device. The material of the first inorganic layer 610 may include an inorganic material such as SiO ₂ 、Al ₂ O ₃ And the like.

Illustratively, the first encapsulation layer 600 includes a plurality of first inorganic layers, e.g., the first encapsulation layer 600 mayTo include a first inorganic layer 611 and a first inorganic layer 612. In some embodiments, the material of the first inorganic layer 611 is SiO ₂ The thickness of the first inorganic layer 611 may be Or->The material of the first inorganic layer 612 is Al ₂ O ₃ The thickness of the first inorganic layer 612 may be +.> Or->

The first organic layer 620 may be disposed on a side of the at least one first inorganic layer 610 adjacent to the second encapsulation layer 700. For example, the first organic layer 620 may be disposed on the first inorganic layer 610, i.e., in a thickness direction of the display panel 10, and at least one of the first inorganic layer 610, the first organic layer 620, and the second encapsulation layer 700 may be sequentially disposed.

The first organic layer 620 may be configured to relieve stress of the one or more first inorganic layers 610. The first organic layer 620 may also be configured to planarize a surface of the first encapsulation layer 600, so that other film layers (e.g., the color film layer 500) subsequently fabricated on a side of the first encapsulation layer 600 away from the light emitting device E may be relatively flat.

The material of the first organic layer 620 may include an organic material including, for example, parylene. In some embodiments, the material of the first organic layer 620 is Parylene (a thermoplastic polymer synthesized from para-xylene).

First organic layer 620 may be of the thickness ofOr (b)

In some embodiments, the second encapsulation layer 700 includes a second organic layer 710 and at least one (e.g., one; e.g., a plurality of) second inorganic layers 720.

Wherein each of the second inorganic layers 720 may be disposed at a side of the first encapsulation layer 600 remote from the light emitting device E. A second inorganic layer 720 may be configured to isolate the light emitting device E from external moisture and oxygen (e.g., outside of the light emitting device E), i.e., to prevent external moisture and oxygen from contacting the light emitting device E, and to prevent the light emitting device E from being damaged by moisture and oxygen corrosion. Illustratively, moisture and oxygen may be present in the environment in which the display panel 10 is used, and a second inorganic layer 720 may be configured to isolate the light emitting device E from such moisture and oxygen to protect the light emitting device. In addition, the second inorganic layer 720 may be further configured to isolate respective film layers disposed at the side of the second inorganic layer 720 near the substrate Sub from external moisture and oxygen (e.g., the outside of the display panel) to protect the film layers.

The material of the second inorganic layer 720 may include an inorganic material such as SiO ₂ 、Al ₂ O ₃ And the like. Illustratively, the second encapsulation layer 700 includes a second inorganic layer 720, the material of the second inorganic layer 720 is SiO ₂ . The second inorganic layer 720 may have a thickness of Or->

The second organic layer 710 may be disposed on a side of the at least one second inorganic layer 720 near the first encapsulation layer 600. Illustratively, the first encapsulation layer 600, the second organic layer 710, and the respective second inorganic layers 720 may be sequentially disposed in the thickness direction of the display panel 10.

The second organic layer 710 may be configured to relieve stress of the one or more second inorganic layers 720. The second organic layer 710 may also be configured to planarize the surface of the second encapsulation layer 700 such that other film layers (e.g., cover glass) subsequently fabricated on the side of the second encapsulation layer 700 remote from the first encapsulation layer 600 may be relatively planar.

The material of the second organic layer 710 may include an organic material including, for example, parylene. In some embodiments, the material of the second organic layer 710 is Parylene (a thermoplastic polymer synthesized from para-xylene). The thickness of the second organic layer 710 may beOr->

In some embodiments, the material of the first organic layer 620 is the same as the material of the second organic layer 710. In the first blank 821, the first organic layer 620 and the second organic layer 710 are in contact. In this way, the bonding between the first and second encapsulation layers 600 and 700 is better in at least one (e.g., one; and as another example, each) first blank 821, and the problem of the first and second encapsulation layers 600 and 700 peeling from each other in the display panel can be improved.

In some embodiments, in the light emitting device E, the second electrode 220 is disposed at a side of the first electrode 210 remote from the substrate Sub. The display panel 10 further includes at least one (e.g., one; e.g., a plurality of) conductive patterns CR. A conductive pattern CR is in contact with the second electrode 220 such that the conductive pattern CR may be electrically connected with the second electrode 220. The conductive pattern CR may be configured to write an electrical signal to the second electrode 220 so that the light emitting device E may emit light.

In some possible implementations, a shape of a conductive pattern CR may be the same as the shape of the first electrode 210. The structure of a conductive pattern CR may also be the same as that of the first electrode 210, for example, a conductive pattern CR may include a third conductive layer CRa and a fourth conductive layer CRb, the material of the third conductive layer CRa may be the same as that of the first conductive layer of the first electrode, and the material of the fourth conductive layer CRb may be the same as that of the second conductive layer. Since a shape and structure of the conductive pattern CR are the same as those of the first electrode 210, the conductive pattern CR may be formed in the same process as the first electrode 210, for example, in the same etching process. Since a plurality of conductive patterns CR are provided, etching uniformity in manufacturing the first electrode 210 can be improved.

The display panel 10 may include a plurality of conductive patterns CR, which may be located around the display area AA, i.e., the plurality of conductive patterns CR may form a ring structure around the display area AA.

In some embodiments, the color film layer 500 further includes a shielding pattern 540. The orthographic projection of the conductive pattern CR on the substrate Sub is located within the orthographic projection of the shielding pattern 540 on the substrate Sub. In this way, the shielding pattern 540 may be configured to shield light reflected by the conductive pattern CR, and a display effect of the display panel 10 may be improved. In some possible implementations, the blocking pattern CR may be ring-shaped around the display area AA.

In some embodiments, the display panel 10 also includes a pixel definition layer PDL. The pixel defining layer PDL is disposed at a side of the first encapsulation layer 600 near the substrate Sub. Illustratively, the substrate Sub, the pixel defining layer PDL, and the first encapsulation layer 600 may be sequentially disposed in the thickness direction of the display panel 10.

The material of the pixel defining layer PDL may be an insulating material. The thickness of the pixel defining layer PDL may beOr->

The pixel defining layer PDL includes a plurality of openings W, and one opening W may expose at least a portion (e.g., a portion; e.g., all) of the first electrodes 210, or alternatively, one first electrode 210 (e.g., each first electrode 210) may correspond to one opening W of the pixel defining layer PDL. Through an opening W, the light emitting function layer 230 may contact with a first electrode 210, such that the first electrode 210 is coupled with the light emitting function layer 230. Based on this, the pixel defining layer PDL may be configured to separate the respective light emitting devices E from each other, and crosstalk between the sub-pixels may be reduced, improving the display effect of the display panel 10.

The pixel defining layer PDL may extend to a side of the conductive pattern CR remote from the light emitting device E. Illustratively, the orthographic projection of the conductive pattern CR on the substrate Sub may be located within the outer contour of the orthographic projection of the pixel defining layer PDL on the substrate Sub. The description of the outline of the orthographic projection of the pixel defining layer PDL on the substrate Sub may refer to the description of the outline of the first coverage area of the first insulating layer, which is not described herein.

Since the pixel defining layer PDL may extend to a side of the conductive pattern CR remote from the light emitting device E, an opening W of the pixel defining layer PDL may also be provided at the conductive pattern CR, and an opening W may expose at least a portion (e.g., a part; e.g., all) of a conductive pattern CR through which the second electrode 220 may contact the conductive pattern CR such that the second electrode 220 may be coupled with the conductive pattern CR. It can also be said that the material of the pixel defining layer PDL is filled between two adjacent conductive patterns CR. Since the material of the pixel defining layer PDL may be filled between the conductive patterns CR, the contact surface of the second electrode 220 and the plurality of conductive patterns CR may be relatively flat, and breakage of the second electrode 220 due to unevenness of the contact surface of the second electrode 220 and the plurality of conductive patterns CR may be improved, thereby improving structural stability of the second electrode 220 and also improving electrical connection stability between the second electrode 220 and the conductive patterns CR.

Fig. 13 is a structural view of a display panel. Fig. 14 is a structural view of a display panel. Fig. 15 is a top view of a pixel defining layer. Fig. 16 is a top view of the first insulating layer and the pixel defining layer. Fig. 17 is a top view of a display panel. Fig. 18 is a cross-sectional view of the display panel of fig. 17 along section line CC'. Note that the specific structure of the substrate is omitted in fig. 14 and 17, and the position of the first encapsulation layer 600 is shown by the first organic layer 620 and the position of the second encapsulation layer 700 is shown by the second organic layer 710 in fig. 14 and 18. Only the structure of the insulating pattern in the pixel defining layer is shown in fig. 15, 16 and 17, and other structures of the pixel defining layer, for example, a plurality of openings of the pixel defining layer are omitted.

Referring to fig. 13, in some embodiments, the first encapsulation layer 600 extends to a side of the pixel defining layer PDL away from the display area AA. Illustratively, at least a portion (e.g., a portion; e.g., all) of the edge 600e of the first encapsulation layer 600 is outside of the outer contour Pe of the pixel defining layer PDL. In this way, in the substrate to be cut forming the display panel 10 in fig. 13, the pixel defining layer PDL may not extend to the cut region. When the substrate to be cut is cut, the number of cut film layers can be reduced, so that the cutting process is simpler and controllable, and the problem of mutual stripping between the film layers in the display panel 10 can be solved.

Referring to fig. 5 and 14, in other embodiments, the pixel defining layer PDL includes a plurality of insulating patterns IP located at a side of the conductive pattern CR remote from the light emitting device E, i.e., in a direction perpendicular to the thickness direction of the display panel, the plurality of insulating patterns IP, the conductive pattern CR, and the light emitting device E may be sequentially disposed. Illustratively, the insulation pattern IP may be disposed in the region B shown in fig. 5.

Referring to fig. 14 and 15, in some possible implementations, a plurality of insulation patterns IP of the pixel defining layer PDL may be located around the display area AA, i.e., the plurality of insulation patterns IP may form a ring structure around the display area AA.

Since the pixel defining layer PDL includes a plurality of insulation patterns IP, a surface of the first encapsulation layer 600 disposed on the pixel defining layer PDL (e.g., a surface of the first encapsulation layer 600 remote from the pixel defining layer PDL) may be uneven. In this way, the interface between the first encapsulation layer 600 and the first insulation layer 800 and/or the second insulation layer 900 may be rugged, so that the friction between the first encapsulation layer 600 and the first insulation layer 800 and/or the second insulation layer 900 may be increased, and the problem of mutual peeling between the first encapsulation layer 600 and the first insulation layer 800 and/or the second insulation layer 900 in the display panel 10 may be improved. It will be appreciated that the interfaces between the other layers disposed on the pixel defining layer PDL may be uneven, and the friction between the other adjacent layers may be increased, so as to improve the problem of delamination between the layers.

In still other embodiments, referring to fig. 13, 14 and 15, the first encapsulation layer 600 extends to a side of the pixel defining layer PDL remote from the display area AA, and the pixel defining layer PDL includes a plurality of insulation patterns IP located at a side of the conductive pattern CR remote from the light emitting device E. Thus, the problem of mutual peeling between the film layers can be further improved.

Referring to fig. 14 and 16, in some embodiments, an insulation pattern IP (e.g., one insulation pattern IP; e.g., each insulation pattern IP) is located in a first blank area 821. In some possible implementations, edges of the first blank 821 and the second blank are flush, and at this time, an insulation pattern IP is located in a first blank 821 and also in a second blank.

For example, an insulation pattern IP may be located in a first hollowed-out area HB 1. In this way, in the first hollowed-out region HB1, the first encapsulation layer 600 may have a convex surface 600b, so that the first encapsulation layer 600 may contact a larger area of the side SW' of the first insulation layer 800 and/or the second insulation layer 900, an area of an interface between the first insulation layer 800 and the first encapsulation layer 600 may be increased, further, a friction force between the first insulation layer 800 or the second insulation layer 900 and the first encapsulation layer 600 may be increased, and a problem of mutual peeling between the first insulation layer 800 or the second insulation layer 900 and the first encapsulation layer 600 may be improved.

Further, referring to fig. 17 and 18, the surface of the substrate Sub adjacent to the first encapsulation layer 600 is provided with a second recess TP2 and at least one (e.g., one; e.g., a plurality of) retention pattern RP surrounded by the second recess TP 2. Illustratively, the second recess TP2 is annular surrounding the display area AA.

The orthographic projection of at least one (e.g., one; and as another example, each) of the insulation patterns IP on the substrate Sub is located within the retention pattern RP. In this way, the surface of the first encapsulation layer 600 away from the substrate may be more rugged, further increasing the area of the interface between the first insulation layer and the first encapsulation layer, further increasing the friction between the first insulation layer and the first encapsulation layer, and improving the problem of mutual peeling between the first insulation layer and the first encapsulation layer.

With continued reference to fig. 5, a surface of the substrate Sub adjacent to the first encapsulation layer 600 may be provided with a third recess TP3. The plurality of first electrodes 210 may be surrounded by the third recess TP3. The light emitting function layer 230 may be filled in the third recess TP3 such that the light emitting function layer 230 may be rugged. In this way, one or more of the light emitting functional layers 230 may be discontinuous or electrical connection stability may be reduced, cross-talk between adjacent light emitting devices may be reduced, and display effect of the display panel 10 may be improved.

The first, second, or third recess portions TP1, or TP may be formed by an etching process (e.g., a dry etching process). In some embodiments of the present invention, in some embodiments, the first, second and third recesses TP1, TP1 and TP may be formed in the same etching process.

In some embodiments, the display panel 10 further includes a Seal Ring S (Seal Ring). The seal ring S may comprise one or more metal layers. Adjacent metal layers may be separated by an insulating layer. The sealing ring S may further comprise one or more contact CDs, each of which may be provided in the insulating layer, the material of which may comprise a conductive material, such as a metal, e.g. tungsten. The seal ring S may be disposed in the peripheral area SA. The seal ring S may have a ring shape surrounding the display area AA. The seal ring S may be configured to protect the substrate Sub, and may also be configured to reduce an electrostatic Discharge (ESD) phenomenon of the substrate Sub, for example, the seal ring S may Discharge Static electricity in the substrate Sub, and may reduce ESD of the substrate.

The embodiment of the disclosure also provides a substrate to be cut. The display panel provided in any of the above embodiments may be formed by cutting the substrate to be cut.

The substrate to be cut may be a display panel motherboard; or may be a wafer die. Under the condition that the substrate to be cut is a display panel motherboard, the display panel motherboard comprises a plurality of common display panels, the display panel motherboard is cut along the cutting area to obtain the plurality of common display panels, and each common display panel comprises a display area and a peripheral area positioned at the periphery of the display area. In the case that the substrate to be cut is a wafer chip, the wafer chip includes a plurality of micro display chips (chips), and the wafer chip is cut along the cutting area to obtain a plurality of micro display chips, and one micro display chip may be a silicon-based display panel, where each silicon-based display panel includes a display area and a peripheral area located at the periphery of the display area.

Fig. 19 is a top view of a substrate to be cut according to an embodiment of the present disclosure. Fig. 20 is a cross-sectional view of the substrate to be cut of fig. 19 along section line DD'. Fig. 21 is a cross-sectional view of another substrate to be cut. Note that, in fig. 19, only the first initial encapsulation layer and the first initial insulating layer are shown, and other film layers, such as a color film layer, a second initial encapsulation layer, and the like, are omitted.

Referring to fig. 19 and 20, the substrate 60 to be cut includes a plurality of display areas AA and a peripheral area SA located at the periphery of each display area AA. The peripheral area SA includes a cutting area SL. In the process of cutting the substrate 60 to be cut, the substrate to be cut may be cut along a dicing Lane (Scribe Lane) located in the dicing area SL, and the display panel provided in any of the above embodiments may be obtained.

The substrate to be cut 60 includes an initial base OS, and the substrate to be cut 60 further includes at least one (e.g., one; e.g., a plurality of) light emitting devices E disposed on the initial base OS, the light emitting devices E being located in the display area AA.

The substrate to be cut 60 further includes a first initial encapsulation layer O600 and a second initial encapsulation layer O700. The first initial encapsulation layer O600 is disposed at a side of the light emitting device E remote from the initial substrate OS. The first preliminary encapsulation layer O600 covers the respective display area AA and the peripheral area SA. The second preliminary encapsulation layer O700 is disposed at a side of the first preliminary encapsulation layer O600 remote from the light emitting device E, and the second preliminary encapsulation layer O700 covers the respective display area AA and the peripheral area SA.

The substrate 60 to be cut further includes a plurality of color film layers 500. The structure of the color film layer 500 may be the same as that of the color film layer 500 in the above display panel, and reference may be made to the above related description, which is not repeated here. The substrate to be cut 60 further includes a first initial insulating layer O800, and each color film layer 500 and the first initial insulating layer O800 are disposed between the first initial encapsulation layer O600 and the second initial encapsulation layer O700. Each color film layer 500 covers a display area AA, and the orthographic projection of each color film layer 500 on the initial substrate OS is located within the orthographic projection of the first initial insulating layer O800 on the initial substrate OS.

It should be noted that, the structure with the name "initial" in the substrate 60 to be cut is cut, so that the corresponding structure in the display panel provided in any of the embodiments above can be obtained, for example, the initial substrate OS in the substrate 60 to be cut is cut, so that the substrate in the display panel can be obtained; cutting the first initial encapsulation layer O600 in the substrate 60 to be cut may obtain a first encapsulation layer in the display panel; cutting the second initial encapsulation layer O700 in the substrate 60 to be cut may obtain a second encapsulation layer in the display panel. Accordingly, the structure, materials and advantageous effects of the substrate 60 to be cut can be referred to the above description of the related structure of the display panel, which is not repeated herein.

In the substrate 60 to be cut, in the cutting region SL, the first and second preliminary encapsulation layers O600 and O700 are in contact. Illustratively, the first preliminary insulating layer O800 may include a plurality of first insulating layer patterns O810, and an outer contour of a front projection of each first insulating layer pattern O810 on the preliminary substrate OS is located between the display area AA and the cutting area SL, i.e., the first preliminary insulating layer O800 is not disposed in the cutting area SL, such that the first preliminary encapsulation layer O600 may be in contact with the second preliminary encapsulation layer O700 in the cutting area SL. In this way, when the substrate 60 to be cut is cut along the cutting area SL, the number of cut film layers is reduced, so that the cutting process is simpler and more controllable, and since the first initial insulating layer O800 is not disposed in the cutting area SL, the interface between the first initial insulating layer O800 and the first initial encapsulation layer O600 does not extend to the cutting area SL, and when the substrate to be cut is cut, the stress generated by cutting can be reduced to be transmitted along the interface between the first initial insulating layer O800 and the first initial encapsulation layer O600, thereby improving the problem of mutual peeling between the first insulating layer and the first encapsulation layer in the display panel.

In some embodiments, the substrate to be cut 60 further includes a second initial insulating layer O900. The second initial insulating layer O900 is disposed between the first initial encapsulation layer O600 and the second initial encapsulation layer O700, and the first initial insulating layer O800 and the second initial insulating layer O900 are located at both sides of each color film layer 500. The front projection of each color film layer 500 on the initial substrate OS is located within the front projection of the second initial insulating layer O900 on the initial substrate.

Similar to the first preliminary insulating layer O800, the second preliminary insulating layer O900 may include a plurality of second insulating layer patterns, each of which has an outer contour of an orthographic projection on the preliminary substrate between the display area AA and the cutting area SL, i.e., the cutting area SL is not provided with the second preliminary insulating layer. Thus, in the cutting region SL, the first preliminary encapsulation layer O600 may be in contact with the second preliminary encapsulation layer O700. The beneficial effects of the first insulating layer O800 are similar to those of the first insulating layer O800, and reference may be made to the above description, which is not repeated herein.

In some embodiments, the orthographic projection of the first initial insulating layer O800 on the initial substrate OS overlaps the orthographic projection of the second initial insulating layer O900 on the initial substrate OS. In this way, the first initial insulating layer O800 and the second initial insulating layer O900 can be manufactured by the same photolithography process, so that the manufacturing process of the display panel can be simplified, and the yield of the product can be improved.

Referring to fig. 21, in some embodiments, the initial substrate OS is provided with a first initial recess OTP1 near a surface of the first initial encapsulation layer O600. Cutting the first initial concave portion OTP1 may result in the first concave portion in the display panel provided in any of the above embodiments. The structure and the beneficial effects of the first initial concave portion OTP can be described with reference to the above description of the first concave portion in the display panel, which is not repeated here.

The embodiment of the disclosure also provides a manufacturing method of the substrate to be cut. By the method for manufacturing the substrate to be cut, the substrate to be cut provided by any one of the embodiments can be manufactured. The substrate to be cut to be formed is provided with a plurality of display areas and a peripheral area positioned at the periphery of each display area, and the peripheral area comprises a cutting area. The description of the above regions may refer to the description of the corresponding regions in the substrate to be cut, which is not repeated herein.

Fig. 22 is a flowchart of a method for manufacturing a substrate to be cut according to an embodiment of the disclosure. Fig. 23A to 23F are process flow diagrams of a method of manufacturing a substrate to be cut.

Referring to fig. 22, the method for manufacturing the substrate to be cut includes the steps of:

s1, forming a light-emitting device on an initial substrate.

Referring to fig. 23A, in some embodiments, a conductive layer may be formed on the initial substrate OS, and the conductive layer may be patterned by an etching process (e.g., a dry etching process) to form a plurality of first electrodes 210.

Referring to fig. 23B, in some possible implementations, in an etching process for etching the conductive layer to form the plurality of first electrodes 210, the initial substrate OS may also be etched to form a plurality of initial recesses, for example, a first initial recess OTP1, a second initial recess (not shown in the drawing), and a third initial recess OTP3.

In some embodiments, step S1 further includes forming an initial pixel defining layer OPDL on the initial substrate OS with the first electrode 210 after forming the first electrode 210.

The respective light emitting devices formed in step S1 are located in the display area AA.

S2, forming a first initial packaging layer on the initial substrate with the light-emitting device.

Referring to fig. 23C, a first initial encapsulation layer O600 is disposed at a side of the light emitting device E remote from the initial substrate OS. The first preliminary encapsulation layer O600 covers the respective display area AA and the peripheral area SA.

Illustratively, the first initial encapsulation layer O600 may be fabricated by using a PECVD process, an ALD process, and an MLD process. For example, the number of the cells to be processed, The first initial encapsulation layer O600 may include a first initial inorganic layer O611 and/or a first initial inorganic layer O612, and a first initial organic layer O620, which are sequentially disposed. Wherein the material of the first initial inorganic layer O611 is, for example, siO ₂ The material of the first initial inorganic layer O612 is, for example, al ₂ O ₃ The material of the first initial organic layer O620 is, for example, parylene. The first initial inorganic layer O611 may be fabricated by a PECVD process, the first initial inorganic layer O612 may be fabricated by an ALD process, and the first initial organic layer O620 may be fabricated by an MLD process.

S3, forming a plurality of color film layers and a first initial insulating layer on the initial substrate with the first initial packaging layer.

Referring to fig. 23D, each color film layer 500 covers a display area AA. The orthographic projection of each color film layer 500 on the initial substrate OS is located within the orthographic projection of the first initial insulating layer O800 on the initial substrate OS.

Illustratively, the color film layer and the first preliminary insulating layer O800 may be fabricated using a coating process and a photolithography process.

Specifically, the step of forming the first initial insulating layer O800 may include the substeps of:

s31, forming a first insulating film on the initial substrate OS. For example, a first insulating film is formed on the initial substrate OS by a coating process.

S32, removing the part of the first insulating film located in the cutting area SL to obtain a first initial insulating layer O800. For example, a portion of the first insulating film located at the cutting region SL may be removed by a photolithography process. In some possible implementations, portions of the first insulating film corresponding to the blank regions of the respective first insulating layers may also be removed by a photolithography process.

S4 (optionally), before or after the step of forming the plurality of color film layers and the first initial insulating layer, and before the step of forming the second initial encapsulation layer, forming the second initial insulating layer on the initial substrate with the first initial encapsulation layer.

Referring to fig. 23E, the first initial insulating layer O800 and the second initial insulating layer O900 are located at two sides of each color film layer 500, and the front projection of each color film layer 500 on the initial substrate OS is located within the front projection of the second initial insulating layer O900 on the initial substrate.

The second initial insulating layer O900 may be fabricated using a coating process and a photolithography process, for example.

Specifically, the step of forming the second initial insulating layer O900 may include the substeps of:

s41, forming a second insulating film on the initial substrate OS. For example, a second insulating film is formed on the initial substrate OS by a coating process.

S42, removing the portion of the second insulating film located in the cutting region SL to obtain a second initial insulating layer O900. Illustratively, the portion of the second insulating film located at the cutting region SL may be removed by a photolithography process. In some possible implementations, portions of the second insulating film corresponding to the blank regions of the respective second insulating layers may also be removed by a photolithography process.

In some possible implementations, step S32 and step S42 may be performed in the same process. Illustratively, between step S32, step S41 is performed, i.e., a first insulating film and a second insulating film are formed on the initial substrate OS. Then, step S32 and step S42 may be performed in the same process, for example, by removing portions of the first insulating film and the second insulating film located in the cut region SL, portions of the first insulating film corresponding to the blank regions of the respective first insulating layers, and portions of the second insulating film corresponding to the blank regions of the respective second insulating layers through the same photolithography process, to form the first initial insulating layer O800 and the second initial insulating layer O900. In this way, the orthographic projection of the first initial insulating layer O800 on the initial substrate OS may overlap with the orthographic projection of the second initial insulating film O900 on the initial substrate OS.

S5, forming a second initial packaging layer on the initial substrate with the color film layer and the first initial insulating layer.

Referring to fig. 23F, each color film layer 500 and the first initial insulating layer O800 are disposed between the first and second initial encapsulation layers O600 and O700.

The manufacturing process of the second initial packaging layer O700 may be the same as that of the first initial packaging layer, and reference may be made to the above related description, which is not repeated here.

In the substrate to be cut formed through the above steps, in the cutting region SL, the first and second preliminary encapsulation layers O600 and O700 are in contact.

The embodiment of the disclosure also provides a manufacturing method of the display panel. The display panel provided by any one of the embodiments can be manufactured by the manufacturing method of the display panel.

The manufacturing method of the display panel comprises the following steps: cutting the substrate to be cut provided in any of the above embodiments to form a plurality of display panels. For example, the substrate to be cut may be cut along a cutting region of the substrate to be cut to form a plurality of display panels. Reference is made to the above for specific description, and no further description is given here.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A display panel, characterized by having a display area;

the display panel includes:

a substrate;

a light emitting device disposed on the substrate and disposed in the display region;

the first packaging layer is arranged on one side of the light-emitting device, which is far away from the substrate;

the second packaging layer is arranged on one side, far away from the light-emitting device, of the first packaging layer; the first encapsulation layer comprises a first organic layer and at least one first inorganic layer; the first organic layer is arranged on one side of the at least one first inorganic layer, which is close to the second packaging layer;

the color film layer and the first insulating layer are arranged between the first packaging layer and the second packaging layer;

the first insulating layer is provided with a first coverage area and at least one first blank area, the orthographic projection of the color film layer on the first insulating layer is positioned in the outer contour of the first coverage area, the at least one first blank area is far away from the display area compared with the color film layer, and the first packaging layer is in contact with the second packaging layer in the at least one first blank area;

at least one of the respective first blank areas is an edge blank area, which is further away from the display area than the first coverage area; at the location of the edge blank, edges of the first encapsulation layer and the second encapsulation layer are flush with edges of the substrate.

2. The display panel of claim 1, wherein the display panel comprises,

the substrate is provided with a first concave part close to the surface of the first packaging layer, the first concave part is positioned in an edge blank area, and the outer edge of the first concave part is flush with the edge of the first packaging layer.

3. The display panel according to any one of claim 1 to 2, wherein,

at least one of the first blank areas is a hollowed-out area, and the hollowed-out area is surrounded by the first coverage area.

4. The display panel of claim 1, further comprising:

the second insulating layer is arranged between the first packaging layer and the second packaging layer, and the first insulating layer and the second insulating layer are positioned on two sides of the color film layer;

the second insulating layer is provided with a second coverage area and at least one second blank area, the orthographic projection of the color film layer on the second insulating layer is located in the outer contour of the second coverage area, the at least one second blank area is far away from the display area compared with the color film layer, and in the at least one second blank area, the first packaging layer is in contact with the second packaging layer.

5. The display panel of claim 4, wherein the display panel comprises,

the edge of a second blank area is flush with the edge of a first blank area.

6. The display panel according to claim 1 or 4, wherein,

the second packaging layer comprises a second organic layer and at least one second inorganic layer, and the second organic layer is arranged on one side of the at least one second inorganic layer close to the first packaging layer;

wherein the first organic layer and the second organic layer are the same material, and the first organic layer and the second organic layer are in contact in the at least one first empty region.

7. The display panel of claim 1, wherein the display panel comprises,

the light emitting device comprises a first electrode and a second electrode, wherein the second electrode is arranged on one side of the first electrode away from the substrate;

the display panel further includes:

a conductive pattern in contact with the second electrode;

the color film layer further comprises a shielding pattern, and the orthographic projection of the conductive pattern on the substrate is positioned in the orthographic projection of the shielding pattern on the substrate.

8. The display panel of claim 7, further comprising:

The pixel defining layer is arranged on one side of the first packaging layer close to the substrate, and extends to one side of the conductive pattern far away from the light emitting device;

the first encapsulation layer extends to a side of the pixel defining layer away from the display area, and/or the pixel defining layer includes a plurality of insulating patterns located at a side of the conductive pattern away from the light emitting device.

9. The display panel of claim 8, wherein the display panel comprises,

an insulating pattern is located in a first empty region.

10. The display panel of claim 8, wherein the display panel comprises,

the surface of the substrate, which is close to the first packaging layer, is provided with a second concave part and at least one reserved pattern surrounded by the second concave part, and the orthographic projection of the at least one insulating pattern on the substrate is positioned in the reserved pattern.

11. The display panel of claim 1, wherein the display panel comprises,

the base includes a silicon substrate and a circuit layer disposed on the silicon substrate.

12. A display device comprising the display panel according to any one of claims 1 to 11.

13. A method for manufacturing a substrate to be cut is characterized in that,

The substrate to be cut is provided with a plurality of display areas and a peripheral area positioned at the periphery of each display area, and the peripheral area comprises a cutting area;

the manufacturing method of the substrate to be cut comprises the following steps:

forming a light emitting device on an initial substrate, the light emitting device being located in a display area;

forming a first initial encapsulation layer on an initial substrate with the light emitting device, wherein the first initial encapsulation layer is arranged on one side of the light emitting device away from the initial substrate, and the first initial encapsulation layer covers each display area and the peripheral area; the first initial packaging layer comprises a first initial organic layer and at least one first initial inorganic layer, and the at least one first initial inorganic layer and the first initial organic layer are sequentially arranged on one side, far away from the initial substrate, of the light-emitting device;

forming a plurality of color film layers and a first initial insulating layer on an initial substrate with a first initial packaging layer, wherein each color film layer covers a display area, and the orthographic projection of each color film layer on the initial substrate is positioned within the orthographic projection of the first initial insulating layer on the initial substrate; the orthographic projection of the cutting area on the initial substrate is positioned outside the orthographic projection of the first initial insulating layer on the initial substrate;

Forming a second initial encapsulation layer on an initial substrate with a color film layer and a first initial insulation layer, so that each color film layer and the first initial insulation layer are arranged between the first initial encapsulation layer and the second initial encapsulation layer;

wherein in the dicing area, the first initial encapsulation layer and the second initial encapsulation layer are in contact.