CN111564481A

CN111564481A - Display substrate, manufacturing method thereof and display device

Info

Publication number: CN111564481A
Application number: CN202010435534.2A
Authority: CN
Inventors: 刘文祺; 孙中元; 薛金祥; 闫华杰
Original assignee: BOE Technology Group Co Ltd
Current assignee: BOE Technology Group Co Ltd
Priority date: 2020-05-21
Filing date: 2020-05-21
Publication date: 2020-08-21
Anticipated expiration: 2040-05-21
Also published as: WO2021233002A1; CN111564481B

Abstract

A display substrate, a manufacturing method thereof and a display device are provided, wherein the display substrate comprises: the light-emitting device comprises a substrate, and a pixel defining layer, a light-emitting structure layer, a functional layer and a color film layer which are arranged on the substrate; the color film layer comprises: a plurality of optical filters; orthographic projections of adjacent optical filters on the substrate are partially overlapped, and orthographic projections of the pixel definition layer on the substrate cover orthographic projections of the overlapped parts of the adjacent optical filters on the substrate; the functional layer is positioned between the light-emitting structure layer and the color film layer, and orthographic projection on the substrate is at least partially overlapped with the overlapped part of the adjacent optical filter. According to the display substrate and the manufacturing method thereof, the functional layer is arranged, so that the influence of subsequent processing on the organic light emitting layer can be reduced, and the display effect of the display substrate is improved.

Description

Display substrate, manufacturing method thereof and display device

Technical Field

The present disclosure relates to but not limited to the field of display technologies, and in particular, to a display substrate, a manufacturing method thereof, and a display device.

Background

Micro Organic Light-Emitting diodes (Micro-OLEDs for short) are Micro displays that have been developed in recent years, and silicon-based OLEDs are one of them. The silicon-based OLED can realize active addressing of pixels, can prepare a plurality of functional circuits including a time sequence control (TCON) circuit, an over-current protection (OCP) circuit and the like on a silicon-based substrate, and is beneficial to reducing the system volume and realizing light weight. The silicon-based OLED is prepared by adopting a mature Complementary Metal Oxide Semiconductor (CMOS) integrated circuit process, has the advantages of small volume, high resolution (Pixel Per Inch, PPI for short), high refresh rate and the like, and is widely applied to the field of near-to-eye display of Virtual Reality (VR for short) or Augmented Reality (AR for short).

Disclosure of Invention

The disclosure provides a display substrate, a manufacturing method thereof and a display device, which can reduce the influence of subsequent processes on an organic light emitting layer and improve the display effect of the display substrate.

In a first aspect, the present disclosure provides a display substrate comprising: the light-emitting device comprises a substrate, and a pixel defining layer, a light-emitting structure layer, a functional layer and a color film layer which are arranged on the substrate;

the color film layer comprises: a plurality of optical filters; orthographic projections of adjacent optical filters on the substrate are partially overlapped, and orthographic projections of the pixel definition layer on the substrate cover orthographic projections of the overlapped parts of the adjacent optical filters on the substrate;

the functional layer is positioned between the light-emitting structure layer and the color film layer, and orthographic projection on the substrate is at least partially overlapped with the overlapped part of the adjacent optical filters.

In some possible implementations, the display substrate further includes: the packaging layer is positioned between the light emitting structure layer and the color film layer;

the encapsulation layer includes: a first inorganic encapsulation layer, a second inorganic encapsulation layer, and a third organic encapsulation layer;

the first inorganic packaging layer is positioned on one side of the second inorganic packaging layer close to the substrate base plate;

the third organic packaging layer is positioned on one side of the second inorganic packaging layer far away from the substrate;

the first inorganic packaging layer is made of materials including: silicon nitride; the manufacturing material of the second inorganic packaging layer comprises: silicon oxide; the third organic encapsulation layer is made of materials including: parylene; the thickness of the third organic encapsulation layer is 4500-5500 nanometers.

In some possible implementations, the functional layer is a single-layer structure and is a planar structure;

the functional layer is positioned between the first inorganic encapsulation layer and the second inorganic encapsulation layer, or between the second inorganic encapsulation layer and the third organic encapsulation layer;

the functional layer is a transparent film layer;

the functional layer is made of materials comprising: polyvinyl chloride or titanium dioxide nanowires doped with a plasticizer, a stabilizer and an ultraviolet light absorber.

In some possible implementations, the functional layer is a multilayer structure, and the functional layer includes: a first functional layer and a second functional layer;

the first functional layer is positioned between the first inorganic encapsulation layer and the second inorganic encapsulation layer, and the second functional layer is positioned between the second inorganic encapsulation layer and the third organic encapsulation layer;

the first functional layer and the second functional layer are both transparent film layers;

the first functional layer is made of a material comprising: polyvinyl chloride or titanium dioxide nanowires doped with a plasticizer, a stabilizer and an ultraviolet light absorber;

the manufacturing material of the second functional layer comprises: polyvinyl chloride or titanium dioxide nanowires doped with a plasticizer, a stabilizer and an ultraviolet light absorber.

In some possible implementations, the first functional layer and the second functional layer are a mesh-like structure;

the first functional layer includes: the first routing and a plurality of first opening regions surrounded by the first routing are formed; the second functional layer includes: the second routing wires and a plurality of second opening areas formed by the second routing wires in a surrounding mode;

the orthographic projection of the plurality of first opening areas on the substrate base plate and the orthographic projection of the plurality of second opening areas on the substrate base plate have no overlapping area.

In some possible implementations, an orthographic projection of the pixel defining layer on the substrate covers an orthographic projection of the first trace or the second trace on the substrate;

the orthographic projection of the first routing line or the second routing line on the substrate is at least partially overlapped with the overlapped part of the adjacent optical filters.

In some possible implementations, the first functional layer is a grid-like structure and the second functional layer is a planar structure;

the first functional layer includes: the first routing and a plurality of first opening regions surrounded by the first routing are formed; the orthographic projection of the pixel definition layer on the substrate base plate covers the orthographic projection of the first routing wire on the substrate base plate; the orthographic projection of the first routing line on the substrate base plate is at least partially overlapped with the overlapped part of the adjacent optical filter;

or the first functional layer is a planar structure, and the second functional layer is a latticed structure;

the second functional layer includes: the second routing wire and a second opening area surrounded by the second routing wire are arranged on the first opening area; the orthographic projection of the pixel definition layer on the substrate covers the orthographic projection of the second routing wire on the substrate; the orthographic projection of the second routing line on the substrate is at least partially overlapped with the overlapped part of the adjacent optical filters;

or, the first functional layer and the second functional layer are planar structures.

In some possible implementations, the cross-sectional shape of the first opening region includes: polygonal, circular or elliptical;

the cross-sectional shape of the second opening region includes: polygonal, circular or elliptical.

In some possible implementations, the first inorganic encapsulation layer and the second inorganic encapsulation layer are formed using a deposition process; the deposition density of the first inorganic encapsulation layer is less than the deposition density of the second inorganic encapsulation layer.

In some possible implementations, the display substrate further includes: the device comprises a driving structure layer, a flat layer, a laminating layer and a cover plate;

the driving structure layer is positioned on one side of the light emitting structure layer close to the substrate base plate and is connected with the light emitting structure layer;

the flat layer is positioned on one side of the color film layer far away from the substrate; the manufacturing material of the flat layer comprises: parylene;

the laminating layer is located the one side that the flat layer kept away from the substrate base plate, the preparation material of laminating layer includes: silicon dioxide;

the cover plate is positioned on one side of the laminating layer far away from the substrate base plate.

In a second aspect, the present disclosure also provides a display device, including: the display substrate is provided.

In a third aspect, the present disclosure further provides a method for manufacturing a display substrate, for manufacturing the display substrate, the method including:

providing a substrate base plate;

forming a pixel defining layer and a light emitting structure layer on the substrate;

forming a functional layer and a color film layer on the light-emitting structure layer in sequence; the color film layer comprises: a plurality of optical filters; orthographic projections of adjacent optical filters on the substrate are partially overlapped, and orthographic projections of the pixel definition layer on the substrate cover orthographic projections of the overlapped parts of the adjacent optical filters on the substrate;

In some possible implementations, the functional layer is a single-layer structure, and sequentially forming the functional layer and the color film layer on the light emitting structure layer includes:

forming a first inorganic packaging layer on the light-emitting structure layer by adopting a chemical vapor deposition process;

forming a functional layer on the first inorganic encapsulation layer;

forming a second inorganic packaging layer on the functional layer by adopting an atomic layer deposition process;

forming a third organic packaging layer on the second inorganic packaging layer by adopting a molecular layer deposition process;

forming a color film layer on the third organic packaging layer;

or,

forming a second inorganic packaging layer on the first inorganic packaging layer by adopting an atomic layer deposition process;

forming a functional layer on the second inorganic encapsulation layer;

forming a third organic packaging layer on the functional layer by adopting a molecular layer deposition process;

and forming a color film layer on the third organic packaging layer.

the functional layer and the color film layer sequentially formed on the light-emitting structure layer include:

forming a first functional layer on the first inorganic encapsulation layer;

forming a second inorganic packaging layer on the first functional layer by adopting an atomic layer deposition process;

forming a second functional layer on the second inorganic encapsulation layer;

forming a third organic packaging layer on the second functional layer by adopting a molecular layer deposition process;

and forming a color film layer on the third organic packaging layer.

In some possible implementations, the light emitting structure layer includes: the first electrode, organic luminescent layer and second electrode, it includes to form pixel definition layer and light emitting structure layer on the said substrate base plate:

forming a driving structure layer on the substrate base plate;

forming a first electrode on the driving structure layer;

sequentially forming a pixel defining layer, an organic light emitting layer and a second electrode on the driving structure layer on which the first electrode is formed to form a light emitting structure layer;

after the functional layer and the color film layer are sequentially formed on the light emitting structure layer, the method further comprises:

and sequentially forming a flat layer, a laminating layer and a cover plate on the color film layer.

The present disclosure provides a display substrate, a manufacturing method thereof and a display device, wherein the display substrate includes: the light-emitting device comprises a substrate, and a pixel defining layer, a light-emitting structure layer, a functional layer and a color film layer which are arranged on the substrate; the color film layer comprises: a plurality of optical filters; orthographic projections of adjacent optical filters on the substrate are partially overlapped, and orthographic projections of the pixel definition layer on the substrate cover orthographic projections of the overlapped parts of the adjacent optical filters on the substrate; the functional layer is positioned between the light-emitting structure layer and the color film layer, and orthographic projection on the substrate is at least partially overlapped with the overlapped part of the adjacent optical filter. According to the display substrate and the manufacturing method thereof, the functional layer is arranged, so that the influence of subsequent processing on the organic light emitting layer can be reduced, and the display effect of the display substrate is improved.

Additional features and advantages of the disclosure will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the disclosure. Other advantages of the disclosure may be realized and attained by the instrumentalities and combinations particularly pointed out in the specification and the drawings.

Drawings

The accompanying drawings are included to provide an understanding of the disclosed embodiments and are incorporated in and constitute a part of this specification, illustrate embodiments of the disclosure and together with the examples serve to explain the principles of the disclosure and not to limit the disclosure.

Fig. 1 is a schematic structural diagram of a display substrate according to an embodiment of the disclosure;

fig. 2 is another schematic structural diagram of a display substrate according to an embodiment of the disclosure;

fig. 3 is a schematic view of another structure of a display substrate according to an embodiment of the disclosure;

FIG. 4 is a schematic diagram of the structure of an organic light emitting layer provided in one exemplary embodiment;

FIG. 5 is a schematic diagram of the circuit principles provided by an exemplary embodiment;

FIG. 6 is a schematic diagram of a circuit implementation of a voltage control circuit and a pixel drive circuit provided in an exemplary embodiment;

FIG. 7A is a top view of a first functional layer in an exemplary embodiment;

FIG. 7B is a top view of a second functional layer in an exemplary embodiment;

fig. 8 is a flowchart of a method for manufacturing a display substrate according to an embodiment of the disclosure;

fig. 9 to 17 are schematic views illustrating a method for manufacturing a display substrate according to an exemplary embodiment.

Detailed Description

The present disclosure describes embodiments, but the description is illustrative rather than limiting and it will be apparent to those of ordinary skill in the art that many more embodiments and implementations are possible that are within the scope of the embodiments described in this disclosure. Although many possible combinations of features are shown in the drawings and discussed in the detailed description, many other combinations of the disclosed features are possible. Any feature or element of any embodiment may be used in combination with or instead of any other feature or element in any other embodiment, unless expressly limited otherwise.

The present disclosure includes and contemplates combinations of features and elements known to those of ordinary skill in the art. The embodiments, features and elements of the present disclosure that have been disclosed may also be combined with any conventional features or elements to form a technical solution as defined by the claims. Any feature or element of any embodiment may also be combined with features or elements from other aspects to form yet another aspect defined by the claims. Thus, it should be understood that any features shown and/or discussed in this disclosure may be implemented alone or in any suitable combination. Accordingly, the embodiments are not limited except as by the appended claims and their equivalents. Furthermore, various modifications and changes may be made within the scope of the appended claims.

Unless otherwise defined, technical or scientific terms used in the disclosure of the present disclosure should have the ordinary meaning as understood by those of ordinary skill in the art to which the disclosure belongs. The use of "first," "second," and similar terms in this disclosure is not intended to indicate any order, quantity, or importance, but rather is used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.

In this specification, a transistor refers to an element including at least three terminals, i.e., a gate electrode, a drain electrode, and a source electrode. The transistor has a channel region between a drain electrode (drain electrode terminal, drain region, or drain electrode) and a source electrode (source electrode terminal, source region, or source electrode), and current can flow through the drain electrode, the channel region, and the source electrode. The channel region is a region through which current mainly flows.

In this specification, the first electrode may be a drain electrode and the second electrode may be a source electrode, or the first electrode may be a source electrode and the second electrode may be a drain electrode. In the case of using transistors of opposite polarities, or in the case of changing the direction of current flow during circuit operation, the functions of the "source electrode" and the "drain electrode" may be interchanged. Therefore, in this specification, "source electrode" and "drain electrode" may be exchanged with each other.

In this specification, "connected" includes a case where constituent elements are connected together through an element having some sort of electrical action. The "element having a certain electric function" is not particularly limited as long as it can transmit and receive an electric signal between connected components. Examples of the "element having some kind of electric function" include not only an electrode and a wiring but also a switching element such as a transistor, a resistor, an inductor, a capacitor, other elements having various functions, and the like.

In the present specification, "film" and "layer" may be interchanged with each other. For example, the "conductive layer" may be sometimes replaced with a "conductive film". Similarly, the "insulating film" may be replaced with an "insulating layer".

In the display substrate, an encapsulation layer and a color film layer are required to be manufactured after an organic light emitting layer, when the encapsulation layer is manufactured, the stress of an inorganic film layer in the encapsulation layer cannot be released because the thickness of part of the organic film layer in the encapsulation layer is thin, so that the stress of the inorganic film layer in the encapsulation layer is large, the defects such as fracture and the like are easily caused, and the organic light emitting layer cannot be protected. Therefore, the organic light emitting layer is adversely affected in the subsequent process of the organic light emitting layer, and the display effect of the display substrate is reduced.

Fig. 1 is a schematic structural diagram of a display substrate provided in an embodiment of the present disclosure, fig. 2 is a schematic structural diagram of another display substrate provided in an embodiment of the present disclosure, and fig. 3 is a schematic structural diagram of another display substrate provided in an embodiment of the present disclosure. As shown in fig. 1 to 3, a display substrate provided by an embodiment of the present disclosure includes: a substrate 10, and a light emitting structure layer 20, a pixel defining layer 24, a functional layer 50 and a color film layer 30 disposed on the substrate 10.

The color film layer 30 includes: a plurality of filters 31; orthographic projections of adjacent filters on the base substrate 10 are partially overlapped, and orthographic projections of the pixel defining layer 24 on the base substrate cover orthographic projections of overlapped portions of the adjacent filters on the base substrate. The functional layer 50 is located between the light emitting structure layer 20 and the color film layer 30, and an orthographic projection on the substrate 10 at least partially overlaps with an overlapping portion of the adjacent filters.

In an exemplary embodiment, the substrate base plate 10 may be a silicon-based substrate or a glass substrate.

In one exemplary embodiment, the light emitting structure layer 20 includes: a first electrode 21, an organic light emitting layer 22, and a second electrode 23.

In one exemplary embodiment, the first electrode 21 is located on a side of the organic light emitting layer 22 close to the substrate 10, and the second electrode 23 is located on a side of the organic light emitting layer 22 away from the substrate 10.

In one exemplary embodiment, the display substrate may be a top emission structure.

In one exemplary embodiment, the first electrode 21 is a reflective electrode, and the first electrode 21 may have a multilayer composite structure.

In one exemplary embodiment, the first electrode 21 may include: the first conducting layer, the second conducting layer and the third conducting layer are arranged in a stacked mode.

In one exemplary embodiment, the first conductive layer and the third conductive layer may be made of titanium. The second conductive layer may be made of aluminum.

Fig. 4 is a schematic structural view of an organic light emitting layer according to an exemplary embodiment. As shown in fig. 4, an exemplary embodiment provides an organic light emitting layer including a first light emitting sublayer 331, a first charge generation layer 332, a second light emitting sublayer 333, a second charge generation layer 334, and a third light emitting sublayer 335 sequentially stacked between a first electrode and a second electrode.

The first light emitting sublayer 331 is used for emitting a first color light, and includes a first Hole Transport Layer (HTL)3311, a first luminescent material layer (EML)3312, and a first Electron Transport Layer (ETL)3313, which are sequentially stacked. The second light emitting sublayer 333 is for emitting a second color light, and includes a second hole transport layer 3331, a second light emitting material layer 3332, and a second electron transport layer 3333, which are sequentially stacked. The third light emitting sublayer 335 is configured to emit light of a third color, and includes a third hole transport layer 3351, a third light emitting material layer 3352, and a third electron transport layer 3353, which are sequentially stacked. The first charge generation layer 332 is disposed between the first light emitting sublayer 331 and the second light emitting sublayer 333, and is used for connecting the two light emitting sublayers in series to realize the transfer of carriers. The second charge generation layer 334 is disposed between the second light emitting sublayer 333 and the third light emitting sublayer 335, and is used for connecting the two light emitting sublayers in series to realize the transfer of carriers. Since the organic light emitting layer includes the first light emitting material layer emitting the first color light, the second light emitting material layer emitting the second color light, and the third light emitting material layer emitting the third color light, the light finally emitted from the organic light emitting layer is mixed light. For example, it may be arranged that the first light emitting material layer is a red light emitting material layer emitting red light, the second light emitting material layer is a green light emitting material layer emitting green light, and the third light emitting material layer is a blue light emitting material layer emitting blue light, so that the organic light emitting layer finally emits white light.

In practical implementation, the structure of the organic light emitting layer can be designed according to practical requirements. In each light-emitting sublayer, a hole injection layer and an electron injection layer may be further provided in order to improve the efficiency of injecting electrons and holes into the light-emitting material layer. In order to simplify the structure of the organic light emitting layer, the first electron transport layer 3313, the first charge generation layer 332, and the second hole transport layer 3331 may be eliminated, i.e., the second light emitting material layer 3332 may be directly disposed on the first light emitting material layer 3312.

In one exemplary embodiment, the organic light emitting layer may employ an organic light emitting layer emitting the first color light and an organic light emitting layer emitting the first color light as complementary light, which are sequentially stacked with respect to the base substrate, thereby emitting white light as a whole.

In an exemplary embodiment, the orthographic projection of the first electrode 21 on the substrate base plate 10 covers the orthographic projection of the organic light emitting layer 22 on the substrate base plate 10, that is, the size of the first electrode 21 is larger than that of the organic light emitting layer 22, so that the display brightness of the display base plate can be improved.

In one exemplary embodiment, the second electrode 23 may be a planar electrode. The second electrode 23 is a transmissive electrode for transmitting light emitted from the organic light emitting layer 22 and reflected by the first electrode 21.

In an exemplary embodiment, the second electrode 23 may be made of indium tin oxide or zinc tin oxide, or may be made of other transparent conductive materials.

As shown in fig. 1 to 3, there is some overlap in the boundaries of the filters of different colors in the display substrate. Since the pixel size in the display substrate is very small, the edge of the filter manufactured later is overlapped on the filter manufactured earlier, resulting in a difference in thickness between the filters, which results in non-uniformity of the color film layer, i.e., the surface of the color film layer 30 away from the substrate 10 is not flat.

In an exemplary embodiment, the color film layer 30 implements full-color display by combining white light with a color film, and the white light with the color film can implement a high resolution of more than 2000, which can meet VR/AR requirements.

In an exemplary embodiment, the plurality of filters 31 are arranged in an array.

In an exemplary embodiment, the shape of the optical filter 31 may be a hexagon, a long bar, or an approximately oval.

In one exemplary embodiment, the area of the filter 31 is less than 20 μm²。

In one exemplary embodiment, the manufacturing temperature of the optical filter 31 is less than 90 degrees.

In an exemplary embodiment, the color film layer 30 includes at least a first color filter, a second color filter and a third color filter. Or the color film layer 30 may further include: a white filter or other color filter.

In one exemplary embodiment, the color film layer 30 includes: the first color filter, the second color filter and the third color filter are taken as examples. The color film layer in one pixel region comprises a first color filter, a second color filter and a third color filter which are arranged along the arrangement mode of the plurality of sub-pixels in the pixel region.

In one exemplary embodiment, the first color filter, the second color filter, and the third color filter are disposed on the same surface. On a plane parallel to the surface, the second color filter is disposed on a first side of the first color filter, and the third color filter is disposed on a second side of the first color filter opposite to the first side.

In one exemplary embodiment, at least one of the second color filter and the third color filter covers a portion of the first color filter; at least part of the first color filter is not overlapped with the second color filter and the third color filter; the second color filter and the third color filter do not overlap at all.

In one exemplary embodiment, the patterning process includes: photoresist coating, exposure, development, etching, stripping and the like.

In one exemplary embodiment, a first color filter is formed using a first patterning process; the second color filter positioned on the first side of the first color filter is formed by adopting a second composition process, and the second color filter partially covers the first color filter, so that the contact area between the second color and the film layer below the color film layer can be reduced; and then, a third color filter positioned on the second side of the first color filter is formed by adopting a third composition process, and the third color filter partially covers the second color filter, so that the contact area between the third color and the film layer below the color film layer can be reduced.

In an exemplary embodiment, the first color filter may be a green (G) color filter, the second color filter may be a red (R) color filter, and the third color filter may be a blue (B) color filter, or the first color filter may be a blue color filter and the second color filter may be a green color filter. The third color filter may be a red color filter.

In one exemplary embodiment, the green filter has greater adhesiveness than the red filter and the blue filter.

Taking the first color filter as a green (G) color filter, the second color filter as a red (R) color filter, and the third color filter as a blue (B) color filter, the green filter with high adhesion is formed first, the red filter with low adhesion is formed later, and the part of the red filter with low adhesion covers the green filter with high adhesion, so that the contact area between the red filter with low adhesion and the film layer below the color film layer can be reduced. The green filter and the red filter have similar properties, and the adhesion between the green filter and the red filter is greater than the adhesion between the red filter and the film layer below the color film layer, so that the partial covering of the green filter by the red filter can reduce the possibility that the whole of the green filter and the red filter is peeled off from the film layer below the color film layer, compared with the case where the red filter does not cover the green filter at all. In addition, since the red filter has low adhesion and good fluidity, the uniformity of the film thickness of the green filter and the red filter as a whole at the position where the green filter and the red filter overlap each other can be improved in the process of forming the red filter. And then, forming a blue filter with small adhesiveness, and partially covering the blue filter with small adhesiveness on the green filter with large adhesiveness, so that the contact area between the blue filter with small adhesiveness and the lower film layer of the color film layer can be reduced. The green filter and the blue filter are similar in properties, and the adhesion between the green filter and the blue filter is greater than the adhesion between the blue filter and the film layer below the color film layer, so that the partial covering of the green filter by the blue filter can reduce the possibility that the entirety of the green filter and the blue filter is peeled off from the film layer below the color film layer, as compared with the case where the blue filter does not cover the green filter at all. Further, since the blue filter has a small adhesiveness and a good fluidity, the uniformity of the film thickness of the entire green filter and the blue filter at the position where they overlap can be improved in the process of forming the blue filter.

In an exemplary embodiment, the filters of the same color in different pixel regions are formed in the same process.

In an exemplary embodiment, the pixel defining layer 24 may be made of polyimide, acryl, or polyethylene terephthalate.

In one exemplary embodiment, the display substrate further includes: and a driving structure layer disposed between the base substrate 10 and the light emitting structure layer 20. The driving structure layer is connected to the first electrode 21. The drive structure layer includes: a transistor 11 provided in the base substrate 10, and a first insulating layer 12, a first conductive pillar 13, a reflective electrode 14, a second insulating layer 15, and a second conductive pillar 16 provided in this order on the base substrate 10.

In one exemplary embodiment, the active layer of the transistor 11 is disposed inside the base substrate 10.

In an exemplary embodiment, the transistor 11 may be a Metal Oxide Semiconductor (MOS) transistor.

In one exemplary embodiment, a transistor includes: an active layer, a gate electrode, a source electrode, a drain electrode, and a gate connection electrode. The source electrode and the drain electrode are respectively connected with the active layer, and the grid connecting electrode is connected with the grid electrode through the second conductive column. The transistor may be a bottom gate structure or may be a top gate structure.

In one exemplary embodiment, the active layer may be made of a material including: a metal oxide.

In an exemplary embodiment, the first insulating layer 12 and the second insulating layer 15 may be made of silicon oxide (SiOx), silicon nitride (SiNx), or silicon oxynitride (SiON). The structure of the first insulating layer 12 and the second insulating layer 15 may be a single-layer structure, or may be a multi-layer composite structure.

In an exemplary embodiment, the material of the first conductive pillar 13 and the second conductive pillar 16 may be tungsten.

In an exemplary embodiment, the reflective electrode 14 may be made of silver or aluminum. The structure of the reflective electrode 14 may be a single-layer structure, or may be a multi-layer composite structure.

The display substrate provided by the embodiment of the disclosure includes: the light-emitting device comprises a substrate, and a pixel defining layer, a light-emitting structure layer, a functional layer and a color film layer which are arranged on the substrate; the color film layer comprises: a plurality of optical filters; orthographic projections of adjacent optical filters on the substrate are partially overlapped, and orthographic projections of the pixel definition layer on the substrate cover orthographic projections of the overlapped parts of the adjacent optical filters on the substrate; the functional layer is positioned between the light-emitting structure layer and the color film layer, and orthographic projection on the substrate is at least partially overlapped with the overlapped part of the adjacent optical filter. The display substrate is arranged on the light emitting structure layer and the color film layer functional layer, so that the influence of subsequent processing on the organic light emitting layer can be reduced, and the display effect of the display substrate is improved.

In an exemplary embodiment, as shown in fig. 1 to 3, a display substrate includes: a display area 100, a peripheral area 200 surrounding the display area 100, and a binding area 300 disposed on a side of the peripheral area 200 remote from the display area 100.

In an exemplary embodiment, a plurality of sub-pixels are disposed in a regular arrangement in the display area 100. Each sub-pixel includes: a light emitting element and a pixel driving circuit for driving the light emitting element to emit light. A control circuit for supplying a control signal to the pixel driving circuit is provided in the peripheral region 200. The bonding area 300 is provided with a pad assembly that is bonded to an external Flexible Printed Circuit (FPC). Fig. 1 to 3 are illustrated by taking three sub-pixels 100A, 100B, and 100C in the display area as an example.

In one exemplary embodiment, the transistor may include: a switching transistor and a driving transistor. The plurality of transistors 11 on the base substrate 10 may constitute a pixel driving circuit.

Fig. 5 is a schematic diagram of the circuit principle provided by an exemplary embodiment. As shown in fig. 5, the plurality of sub-pixels in the display area are regularly arranged to form a plurality of display rows and a plurality of display columns. Each sub-pixel includes a pixel driving circuit 101 and a light emitting device 102 connected to the pixel driving circuit 101. The pixel driving circuit 101 includes at least a driving transistor. The control circuit includes at least a plurality of voltage control circuits 110, and each voltage control circuit 110 is connected to a plurality of pixel drive circuits 101. For example, one voltage control circuit 110 is connected to the pixel driving circuits 101 in one display row, first poles of driving transistors in the pixel driving circuits 101 in the display row are commonly connected to the voltage control circuit 110, a second pole of each driving transistor is connected to an anode of the light emitting device 102 of the present sub-pixel, and a cathode of the light emitting device 102 is connected to an input terminal of the second power supply signal VSS. The voltage control circuit 110 is connected to an input terminal of the first power signal VDD, an input terminal of the initialization signal Vinit, an input terminal of the reset control signal RE, and an input terminal of the emission control signal EM, respectively. The voltage control circuit 110 is configured to output an initialization signal Vinit to the first pole of the driving transistor in response to the reset control signal RE, and control the corresponding light emitting device 102 to be reset. The voltage control circuit 110 is further configured to output the first power supply signal VDD to the first pole of the driving transistor in response to the light emission control signal EM to drive the light emitting device 102 to emit light. The pixel driving circuits 101 in one display row are commonly connected with the voltage control circuit 110, so that the structure of the pixel driving circuits 101 in the display area 100 can be simplified, the occupied area of the pixel driving circuits 101 in the display area 100 is reduced, more pixel driving circuits 101 and light emitting devices 102 are arranged in the display area 100, and high PPI display is realized. The voltage control circuit 110 outputs the initialization signal Vinit to the first electrode of the driving transistor under the control of the reset control signal RE to control the corresponding light emitting device 102 to reset, so as to avoid the influence of the voltage loaded on the light emitting device 102 during the previous frame light emission on the next frame light emission, and improve the image sticking phenomenon.

In an exemplary embodiment, one voltage control circuit 110 may connect the pixel driving circuits 101 in two adjacent sub-pixels in the same display row, or may connect the pixel driving circuits 101 in three or more sub-pixels in the same display row.

Fig. 6 is a schematic diagram of a circuit implementation of a voltage control circuit and a pixel driving circuit provided by an exemplary embodiment. As shown in fig. 6, the light emitting device may include an OLED. The anode of the OLED is connected to the second pole D of the driving transistor M0, and the cathode of the OLED is connected to the input terminal of the second power signal VSS.

In an exemplary embodiment, the voltage of the second power signal VSS may be a negative voltage or a ground voltage V_GND(typically 0V). The voltage of the initialization signal Vinit may be a ground voltage V_GND。

In one exemplary embodiment, the OLED may be a Micro-OLED or a Mini-OLED to facilitate high PPI display.

In one exemplary embodiment, the voltage control circuit 110 is connected to two pixel driving circuits 101 in one display row. The pixel driving circuit 101 includes a driving transistor M0, a third transistor M3, a fourth transistor M4, and a storage capacitor Cst, and the voltage control circuit 110 includes a first transistor M1 and a second transistor M2. The driving transistor M0, the first transistor M1, the second transistor M2, the third transistor M3, and the fourth transistor M4 are all transistors prepared in a substrate.

A control electrode of the first transistor M1 is connected to an input terminal of the reset control signal RE, and is configured to receive the reset control signal RE, a first electrode of the first transistor M1 is connected to an input terminal of the initialization signal Vinit, and is configured to receive the initialization signal Vinit, and a second electrode of the first transistor M1 is connected to a first electrode S of the corresponding driving transistor M0 and a second electrode of the second transistor M2, respectively. A control electrode of the second transistor M2 is connected to an input terminal of the light emission control signal EM, and is configured to receive the light emission control signal EM, a first electrode of the second transistor M2 is connected to an input terminal of the first power signal VDD, and is configured to receive the first power signal VDD, and a second electrode of the second transistor M2 is connected to a first electrode S of the corresponding driving transistor M0 and a second electrode of the first transistor M1, respectively. In an exemplary embodiment, the first transistor M1 and the second transistor M2 may be of different types, for example, the first transistor M1 is an N-type transistor and the second transistor M2 is a P-type transistor, or the first transistor M1 is a P-type transistor and the second transistor M2 is an N-type transistor. In some possible implementations, the types of the first transistor M1 and the second transistor M2 may be the same, and may be determined by design according to the actual application environment.

The pixel driving circuit 101 includes a driving transistor M0, a third transistor M3, a fourth transistor M4, and a storage capacitor Cst. The control electrode G of the driving transistor M0, the first electrode S of the driving transistor M0 are connected to the second electrode of the first transistor M1 and the second electrode of the second transistor M2, and the second electrode D of the driving transistor M0 is connected to the anode of the OLED. A control electrode of the third transistor M3 is coupled to the input terminal of the first control electrode scan signal S1 and is configured to receive the first control electrode scan signal S1, a first electrode of the third transistor M3 is coupled to the input terminal of the data signal DA and is configured to receive the data signal DA, and a second electrode of the third transistor M3 is coupled to the control electrode G of the driving transistor M0. A gate of the fourth transistor M4 is connected to the input terminal of the second gate scan signal S2 and is configured to receive the second gate scan signal S2, a first gate of the fourth transistor M4 is connected to the input terminal of the data signal DA and is configured to receive the data signal DA, and a second gate of the fourth transistor M4 is connected to the gate G of the driving transistor M0. A first terminal of the storage capacitor Cst is connected to the control electrode G of the driving transistor M0, and a second terminal of the storage capacitor Cst is connected to the ground GND. In an exemplary embodiment, the driving transistor M0 may be an N-type transistor, and the third transistor M3 and the fourth transistor M4 may be of different types, for example, the third transistor M3 is an N-type transistor and the fourth transistor M4 is a P-type transistor. When the voltage of the data signal DA is a voltage corresponding to a high gray level, the voltage of the data signal DA is prevented from being influenced by the threshold voltage of the third transistor M3, for example, of an N-type by turning on the fourth transistor M4 of the P-type to transmit the data signal DA to the gate G of the driving transistor M0. When the voltage of the data signal DA is a voltage corresponding to a low gray scale, the voltage of the data signal DA is prevented from being affected by the threshold voltage of the P-type fourth transistor M4 by turning on the N-type third transistor M3 to transmit the data signal DA to the gate G of the driving transistor M0. Thus, the range of the voltage input to the gate G of the driving transistor M0 can be increased.

In an exemplary embodiment, the third transistor M3 and the fourth transistor M4 may be of a type in which the third transistor M3 is a P-type transistor and the fourth transistor M4 is an N-type transistor.

In an exemplary embodiment, the pixel driving circuit may be a 3T1C, 5T1C, or 7T1C circuit structure, or may be a circuit structure having an internal compensation or external compensation function.

In one exemplary embodiment, as shown in fig. 1 to 3, the driving structure layer covers the entire display area 100 and the peripheral area 200.

The first insulating layer 12 and the second insulating layer 15 cover the entire display region and at least a part of the peripheral region. In one exemplary embodiment, as shown in fig. 1 to 3, the first and second insulating

layers

12 and 15 cover the entire display area 100 and the peripheral area 200.

In an exemplary embodiment, the first conductive pillars 13 and the second conductive pillars 16 are located in the display area 100 and the peripheral area 200.

In an exemplary embodiment, a via hole exposing a portion of the drain electrode is disposed on the first insulating layer 12, and the first conductive pillar 13 is disposed in the via hole of the first insulating layer 12. The reflective electrode 14 is connected to the drain electrode through the first conductive pillar 13. The second insulating layer 15 is provided with a via hole exposing the reflective electrode 14, and the second conductive pillar 16 is disposed in the via hole of the second insulating layer 15.

In an exemplary embodiment, as shown in fig. 1 to 3, the display substrate further includes: and an encapsulation layer 40. The encapsulation layer 40 is located between the light emitting structure layer 20 and the color film layer 30.

The encapsulation layer 40 includes: a first inorganic encapsulation layer 41, a second inorganic encapsulation layer 42, and a third organic encapsulation layer 43; the first inorganic packaging layer 41 is positioned on one side of the second inorganic packaging layer 42 close to the substrate base plate 10; the third organic encapsulation layer 43 is located on the side of the second inorganic encapsulation layer 42 away from the base substrate 10.

In an exemplary embodiment, the color film layer 30 is located in the display area 100.

In an exemplary embodiment, the encapsulation layer 40 covers the entire display area 100 and at least a portion of the peripheral area 200. In one exemplary embodiment, as shown in fig. 1 to 3, the encapsulation layer 40 covers the entire display area 100 and the entire peripheral area 200. The encapsulation layer 40 is configured to insulate water and oxygen to protect the light emitting structure layer.

In an exemplary embodiment, the material of the first inorganic encapsulation layer 41 may include: silicon nitride. The first inorganic encapsulation layer 41 can prevent the light emitting structure layer from being damaged when the second inorganic encapsulation layer 42 is fabricated. Since the first inorganic encapsulating layer 41 has inorganic characteristics, it not only has good encapsulating characteristics, but also has good adhesion with the second electrode, ensuring the encapsulating effect of the encapsulating layer.

In an exemplary embodiment, the material of the second inorganic encapsulation layer 42 may include: silicon oxide. The second inorganic packaging layer can prevent water and oxygen from entering the light-emitting structure layer, and the service life of the light-emitting structure layer can be prolonged.

In one exemplary embodiment, the thickness of the second inorganic encapsulation layer 42 is greater than the thickness of the first inorganic encapsulation layer 41.

In an exemplary embodiment, the material of the third organic encapsulation layer 43 may include: parylene. The third organic encapsulating layer 43 has an organic property, so that the organic encapsulating layer not only has a better organic encapsulating property, but also has a better particle coating capability, and can well coat the particles on the film layer to prevent the film layer from being pierced. In addition, the material with organic characteristics can well release the stress between the inorganic layers, and prevent the defects of microcracks or peeling and the like caused by larger stress of the film layer. The third organic encapsulation layer 43 also has a better flatness characteristic, and can provide a flatter substrate for the subsequent color film layer fabrication, so as to prevent the color film layer fabrication process from damaging the second inorganic encapsulation layer.

In one exemplary embodiment, the thickness of the third organic encapsulation layer 43 is 4500 nanometers to 5500 nanometers.

In one exemplary embodiment, the first inorganic encapsulation layer 41 and the second inorganic encapsulation layer 42 are formed using a deposition process; the deposition density of the first inorganic encapsulation layer 41 is less than that of the second inorganic encapsulation layer 42.

In an exemplary embodiment, as shown in fig. 1 and 2, the functional layer 50 may be a single layer structure and a planar structure. The functional layer 50 is located between the first inorganic encapsulation layer 41 and the second inorganic encapsulation layer 42, or between the second inorganic encapsulation layer 42 and the third organic encapsulation layer 43. Fig. 1 illustrates an example in which the functional layer 50 is located between the first inorganic encapsulating layer 41 and the second inorganic encapsulating layer 42, and fig. 2 illustrates an example in which the functional layer 50 is located between the second inorganic encapsulating layer 42 and the third organic encapsulating layer 43.

In one exemplary embodiment, the functional layer 50 is located throughout the display area 100.

In one exemplary embodiment, the functional layer 50 is a transparent film layer; the light transmittance of the transparent film layer 50 is higher than 76%;

in one exemplary embodiment, the functional layer 50 is made of a material including: polyvinyl chloride or titanium dioxide nanowires doped with a plasticizer, a stabilizer and an ultraviolet light absorber. The functional layer 50 can shield ultraviolet light of more than 99.8%, and can prevent ultraviolet light used for manufacturing the color film layer 30 of more than 99.8% from being emitted into the organic light-emitting layer 22, so that adverse effects of the ultraviolet light used for manufacturing the color film layer on the organic light-emitting layer are effectively reduced.

When the functional layer 50 is made of polyvinyl chloride doped with a plasticizer, a stabilizer, and an ultraviolet absorber, the functional layer 50 has excellent mechanical properties, and the ultraviolet absorber is doped in the functional layer, so that the functional layer 50 can effectively absorb ultraviolet light.

When the functional layer 50 is made of the titanium dioxide nanowires, the titanium dioxide nanowires can effectively scatter and absorb ultraviolet rays because the particle size of the titanium dioxide reaches the nanometer level, and when ultraviolet rays act on the nanoparticles in the form of electromagnetic waves, electrons in the titanium dioxide nanowires are forced to vibrate at the frequency of incident ultraviolet rays due to the fact that the size of the nanoparticles is smaller than the wavelength of the ultraviolet rays, and the electrons become secondary propagation sources of the electromagnetic waves to scatter the ultraviolet rays. The titanium dioxide nanowire has excellent mechanical properties, and with the reduction of the size, the titanium dioxide nanowire can show better mechanical properties than other materials, so that the toughness of the functional layer is improved.

In an exemplary embodiment, since the functional layer 50 has better mechanical properties and better plasticity and toughness, the functional layer 50 is located between the first inorganic encapsulation layer 41 and the second inorganic encapsulation layer 42, or between the second inorganic encapsulation layer 42 and the third organic encapsulation layer 43, which can relieve the stress on the first inorganic encapsulation layer 41 and the second inorganic encapsulation layer 42, so that the stress on the first inorganic encapsulation layer 41 and the second inorganic encapsulation layer 42 is released, and the inorganic layer is prevented from being exploded or cracked due to excessive stress.

In one exemplary embodiment, as shown in fig. 3, the functional layer 50 may be a multi-layer structure. The functional layer 50 includes: a first functional layer 51 and a second functional layer 52. The first functional layer 51 is located between the first inorganic encapsulating layer 41 and the second inorganic encapsulating layer 42, and the second functional layer 52 is located between the second inorganic encapsulating layer 42 and the third organic encapsulating layer 43.

In one exemplary embodiment, the first functional layer is a transparent film layer; the light transmittance of the transparent film layer is higher than 76%.

In one exemplary embodiment, the first functional layer is made of a material including: polyvinyl chloride or titanium dioxide nanowires doped with a plasticizer, a stabilizer and an ultraviolet light absorber. The first functional layer can prevent more than 99.8% of ultraviolet light used for manufacturing the color film layer 30 from being injected into the organic light-emitting layer 22, and the adverse effect of the ultraviolet light used for manufacturing the color film layer on the organic light-emitting layer is effectively reduced.

In one exemplary embodiment, the second functional layer is a transparent film layer; the light transmittance of the transparent film layer is higher than 76%.

In one exemplary embodiment, the second functional layer is made of a material including: polyvinyl chloride or titanium dioxide nanowires doped with a plasticizer, a stabilizer and an ultraviolet light absorber. The second functional layer can prevent more than 99.8% of ultraviolet light used for manufacturing the color film layer 30 from being emitted into the organic light-emitting layer 22, and the adverse effect of the ultraviolet light used for manufacturing the color film layer on the organic light-emitting layer is effectively reduced.

In an exemplary embodiment, the material from which the first functional layer is made may be the same as, or may be different from, the material from which the second functional layer is made.

In an exemplary embodiment, the first functional layer may be a planar structure or a grid-like structure.

In an exemplary embodiment, the second functional layer may be a planar structure or a grid-like structure.

In an exemplary embodiment, fig. 7A is a top view of a first functional layer in an exemplary embodiment, and fig. 7B is a top view of a second functional layer in an exemplary embodiment. As shown in fig. 7A, the first functional layer is illustrated as a mesh structure, and fig. 7B is illustrated as a second functional layer as a mesh structure. As shown in fig. 7A and 7B, the first functional layer 51 and the second functional layer 52 may have a mesh-like structure. The first functional layer includes: a first trace 510 and a plurality of first open regions 511 surrounded by the first trace 510; the second functional layer includes: a second trace 520 and a second open region 521 surrounded by the second trace 520.

In an exemplary embodiment, the plurality of first opening regions are arranged in an array, and the plurality of second opening regions are arranged in an array.

In an exemplary embodiment, the first opening regions of adjacent rows may be staggered, and the plurality of second opening regions may be staggered.

In an exemplary embodiment, there is no overlapping area between the orthographic projection of the plurality of first opening regions on the substrate and the orthographic projection of the plurality of second opening regions on the substrate, so that ultraviolet light can be prevented from being emitted into the organic light emitting layer.

In an exemplary embodiment, the first functional layer and the second functional layer with the grid-shaped structures can make the stress of the first inorganic encapsulation layer and the second inorganic encapsulation layer more dispersed, can better release the stress of the first inorganic encapsulation layer and the second inorganic encapsulation layer, prevent the inorganic layer from being exploded or broken due to overlarge stress, and can improve the reliability and reliability of the display substrate.

Due to the overlapping area between the adjacent filters in the color film layer, each sub-pixel shrinks inwards, so that the stress of the parts, which are overlapped with the orthographic projection of the overlapping parts of the adjacent filters on the substrate, of the first inorganic packaging layer and the second inorganic packaging layer is larger. In an exemplary embodiment, an orthographic projection of the pixel definition layer on the substrate covers an orthographic projection of the first routing line or the second routing line on the substrate; the orthographic projection of the first wire or the second wire on the substrate base plate is at least partially overlapped with the overlapped part of the adjacent optical filter, the arrangement mode of the first wire or the second wire can relieve the local stress of the first inorganic packaging layer and the second inorganic packaging layer overlapped with the orthographic projection of the overlapped part of the adjacent optical filter on the substrate base plate, the stress of the first inorganic packaging layer and the second inorganic packaging layer can be better released, the inorganic layer is prevented from being exploded or broken due to overlarge stress, and the reliability of the display base plate can be improved.

In one exemplary embodiment, the first functional layer may be a mesh-like structure and the second functional layer may be a planar structure. The first functional layer includes: the first routing and a plurality of first opening regions surrounded by the first routing are formed; the orthographic projection of the pixel definition layer on the substrate covers the orthographic projection of the first routing wire on the substrate; the orthographic projection of the first routing line on the substrate base plate is at least partially overlapped with the overlapped part of the adjacent optical filters. At this time, the first functional layer is in a grid structure, so that the stress of the first inorganic packaging layer and the stress of the second inorganic packaging layer can be dispersed, the stress of the first inorganic packaging layer and the stress of the second inorganic packaging layer can be released better, an explosion film or fracture caused by overlarge stress of the inorganic layers can be prevented, and the reliability of the display substrate can be improved.

In one exemplary embodiment, the first functional layer may be a planar structure and the second functional layer may be a grid-like structure. The second functional layer includes: the second routing and a second opening area formed by the second routing in a surrounding mode; the orthographic projection of the pixel definition layer on the substrate covers the orthographic projection of the second routing wire on the substrate; the orthographic projection of the second routing line on the substrate base plate is at least partially overlapped with the overlapped part of the adjacent optical filters. At this moment, the second functional layer is of a grid structure, so that the stress of the second inorganic packaging layer can be dispersed, the stress of the second inorganic packaging layer can be released better, the inorganic layer is prevented from being exploded or broken due to overlarge stress, and the reliability of the display substrate can be improved.

In one exemplary embodiment, the first functional layer and the second functional layer may be planar structures.

In one exemplary embodiment, the cross-sectional shape of first open region 511 includes: polygonal, circular or elliptical, the polygon comprising: square or prismatic. As shown in fig. 7A, the cross-sectional shape of the first opening region is a square.

In an exemplary embodiment, the cross-sectional shape of the second opening region 521 includes: polygonal, circular or elliptical, the polygon comprising: square or prismatic. As shown in fig. 7B, the cross-sectional shape of the second opening region is a square.

In an exemplary embodiment, the sectional shape of the first opening region and the sectional shape of the second opening region may be the same or may be different, and fig. 7A and 7B illustrate an example in which the sectional shape of the first opening region and the sectional shape of the second opening region are the same.

In an exemplary embodiment, as shown in fig. 1 to 3, the display substrate further includes: the display substrate further includes: a planar layer 60, a conforming layer 70, and a cover plate 80. The flat layer 60 is located on one side of the color film layer 30 far away from the substrate base plate 10; the lamination layer 70 is located on a side of the flat layer 60 away from the substrate 10, and the cover plate 80 is located on a side of the lamination layer 70 away from the substrate 10.

In an exemplary embodiment, the planarization layer 60 and the lamination layer 70 cover the entire display area 100 and the entire peripheral area 200. The boundary of the cover plate 80 is located in the binding area 300.

In an exemplary embodiment, the material of the planarization layer 60 may include: parylene;

in an exemplary embodiment, the material of the conforming layer 70 can include: silica, the laminating layer that adopts inorganic material to make can better laminate with the apron.

In one exemplary embodiment, the cover plate 80 may be a glass cover plate.

In an exemplary embodiment, as shown in fig. 1 to 3, the display substrate further includes: and frame sealing glue 90. The cover plate 80 is fixed to the substrate 10 by the sealant 90.

In an exemplary embodiment, the frame sealing adhesive 90 is disposed between the substrate 10 and the cover plate 80, and can provide a guarantee for blocking water and oxygen intrusion, so that the service life of the silicon-based OLED display substrate is greatly prolonged. In another exemplary embodiment, the frame sealing adhesive may be disposed on a side surface of the cover plate, the peripheral side surface of the cover plate and the substrate are sealed by the frame sealing adhesive, and an end surface of the frame sealing adhesive on a side away from the substrate is located between a surface of the cover plate on a side close to the substrate and a surface of the cover plate on a side away from the substrate, so that a sealing effect can be ensured, and the frame sealing adhesive can be prevented from being higher than the cover plate to increase the thickness of the display substrate.

In an exemplary embodiment, as shown in fig. 1 to 3, the peripheral region 200 includes: a feeding electrode 201, an auxiliary electrode 202, a connection electrode 203, and a second electrode 23. The auxiliary electrode 202 is connected to the feeding electrode 201 through a first conductive pillar, and the connection electrode 203 is connected to the auxiliary electrode 202 through a second conductive pillar. The connecting electrode 203 is directly overlapped with the second electrode 23, i.e. the connecting electrode 203 is directly contacted with the second electrode 23, and no other film layer exists.

In an exemplary embodiment, the power supply electrode 201 is disposed on the same layer as the source/drain electrodes of the transistors in the driving structure layer in the display region, and is formed by the same process. The auxiliary electrode 202 is disposed on the same layer as the reflective electrode 14 in the driving structure layer in the display region, and is formed by the same process. The connection electrode 203 is disposed on the same layer as the first electrode 21 in the display region, and is formed by the same process.

In an exemplary embodiment, the second electrode 23 may be connected to the connection electrode 203 through a via hole, such that the connection electrode 203 and the auxiliary electrode 202 form a conductive path between the second electrode 23 and the power supply electrode 201. The voltage signal provided by the supply electrode 201 is transmitted to the second electrode 23 through the conductive path. The conductive path is referred to as a cathode ring structure.

In one exemplary embodiment, the cathode ring is a ring structure located in the peripheral region, and is a conductive channel surrounding the display region to supply power to the second electrode.

In an exemplary embodiment, as shown in fig. 1 to 3, the binding area 300 includes: a bonding electrode 301 and a bonding pad 302.

In an exemplary embodiment, the binding electrode 301 in the binding region 300 is disposed on the same layer as the source and drain electrodes of the transistor in the display region, and is formed by the same process.

Fig. 8 is a flowchart of a method for manufacturing a display substrate according to an embodiment of the disclosure. As shown in fig. 8, an embodiment of the present disclosure further provides a manufacturing method of a display substrate, which is used for manufacturing the display substrate, and the manufacturing method of the display substrate provided by the embodiment of the present disclosure includes the following steps:

step S100, a substrate is provided.

Step S200, forming a pixel defining layer and a light emitting structure layer on the substrate.

And step S300, sequentially forming a functional layer and a color film layer on the light-emitting structure layer.

The color film layer comprises: a plurality of optical filters; orthographic projections of adjacent optical filters on the substrate are partially overlapped, and orthographic projections of the pixel definition layer on the substrate cover orthographic projections of the overlapped parts of the adjacent optical filters on the substrate; the functional layer is positioned between the light-emitting structure layer and the color film layer, and orthographic projection on the substrate is at least partially overlapped with the overlapped part of the adjacent optical filter.

In one exemplary embodiment, a display substrate includes: a display area, a peripheral area, and a binding area.

The manufacturing method of the display substrate provided by the embodiment of the disclosure is used for manufacturing the display substrate provided by any one of the embodiments, and the implementation principle and the implementation effect are similar and are not repeated herein.

In one exemplary embodiment, the light emitting structure layer includes: a first electrode, an organic light emitting layer, and a second electrode, step S2 including: forming a driving structure layer on a substrate; forming a first electrode on the driving structure layer; and sequentially forming a pixel defining layer, an organic light emitting layer and a second electrode on the driving structure layer on which the first electrode is formed to form a light emitting structure layer.

In an exemplary embodiment, the functional layer has a single-layer structure, and the step S3 includes: forming a first inorganic packaging layer on the light-emitting structure layer by adopting a chemical vapor deposition process; forming a functional layer on the first inorganic encapsulation layer; forming a second inorganic packaging layer on the functional layer by adopting an atomic layer deposition process; forming a third organic packaging layer on the second inorganic packaging layer by adopting a molecular layer deposition process; and forming a color film layer on the third organic packaging layer.

In another exemplary embodiment, the functional layer has a single-layer structure, and step S3 includes: forming a first inorganic packaging layer on the light-emitting structure layer by adopting a chemical vapor deposition process; forming a second inorganic packaging layer on the first inorganic packaging layer by adopting an atomic layer deposition process; forming a functional layer on the second inorganic encapsulation layer; forming a third organic packaging layer on the functional layer by adopting a molecular layer deposition process; and forming a color film layer on the third organic packaging layer.

In one exemplary embodiment, the functional layer is a multilayer structure, the functional layer comprising: a first functional layer and a second functional layer; step S3 includes: forming a first inorganic packaging layer on the light-emitting structure layer by adopting a chemical vapor deposition process; forming a first functional layer on the first inorganic encapsulation layer; forming a second inorganic packaging layer on the first functional layer by adopting an atomic layer deposition process; forming a second functional layer on the second inorganic encapsulation layer; forming a third organic packaging layer on the second functional layer by adopting a molecular layer deposition process; and forming a color film layer on the third organic packaging layer.

In an exemplary embodiment, after step S3, the method for manufacturing a display substrate further includes: and sequentially forming a flat layer, a laminating layer and a cover plate on the color film layer.

A method for manufacturing a display substrate according to an exemplary embodiment is described below with reference to fig. 9 to 17, taking a functional layer as a multi-layer structure as an example.

Step S1, providing a substrate 10, where the transistor 11 located in the display area 100, the power supply electrode 201 located in the peripheral area 200, and the bonding electrode 301 located in the bonding area 300 are disposed on the substrate 10, as shown in fig. 9.

Step S2, forming a first insulating layer 12 on the base substrate 10; forming a first conductive pillar 13 in the via hole of the first insulating layer 12; forming a reflective electrode 14 positioned in the display region 100 and an auxiliary electrode 202 positioned in the peripheral region 200 on the first insulating layer 12; forming a second insulating layer 15 on the first insulating layer 12 on which the reflective electrode 14 and the auxiliary electrode 202 are formed; a second conductive pillar 16 is formed in the via hole of the second insulating layer 15 to form a driving structure layer, as shown in fig. 10.

Step S3 is to form the first electrode 21 in the display area 100 and the connection electrode 203 in the peripheral area on the driving structure layer, form the pixel definition layer 24 on the driving structure layer formed with the first electrode 21, and sequentially form the organic light emitting layer 22 in the display area 100 and the second electrode 23 in the display area 100 and the peripheral area 200 on the driving structure layer formed with the pixel definition layer, as shown in fig. 11.

Step S4, a chemical vapor deposition process is used to form the first inorganic encapsulation layer 41 covering the entire display area 100 and the entire peripheral area 200 on the second electrode 23, as shown in fig. 12.

Step S5, forming the first functional layer 51 on the first inorganic encapsulating layer 41 covering the entire display area 100, as shown in fig. 13.

Step S6, forming the second inorganic encapsulation layer 42 covering the entire display area 100 and the entire peripheral area 200 on the first functional layer 51 using an atomic layer deposition process, as shown in fig. 14.

Step S7 is to form the second functional layer 52 on the second inorganic encapsulating layer 42 to cover the entire display area 100, as shown in fig. 15.

Step S8 is to form a third organic encapsulation layer 43 covering the entire display area 100 and the entire peripheral area 200 on the second functional layer 52 using a molecular layer deposition process, as shown in fig. 16.

Step S9 is to form a color film layer 30 on the third organic encapsulation layer 43, as shown in fig. 17.

Step S10, forming a flat layer 60, a bonding layer 70 and a cover plate 80 on the color film layer 30, and filling a sealant 90 between the cover plate 80 and the substrate 10, as shown in fig. 3.

An embodiment of the present disclosure further provides a display device, including: any one of the foregoing embodiments provides a display substrate.

In an exemplary embodiment, a display device includes: a VR device or an AR device.

The drawings in this disclosure relate only to the structures to which the embodiments of the disclosure relate, and other structures may refer to general designs.

For clarity, the thickness and dimensions of layers or microstructures are exaggerated in the drawings that are used to describe embodiments of the present disclosure. It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "under" another element, it can be "directly on" or "under" the other element or intervening elements may be present.

Although the embodiments disclosed in the present disclosure are described above, the descriptions are only for the convenience of understanding the present disclosure, and are not intended to limit the present disclosure. It will be understood by those skilled in the art of the present disclosure that various changes in form and details may be made therein without departing from the spirit and scope of the disclosure, and that the scope of the disclosure is to be limited only by the terms of the appended claims.

Claims

1. A display substrate, comprising: the light-emitting device comprises a substrate, and a pixel defining layer, a light-emitting structure layer, a functional layer and a color film layer which are arranged on the substrate;

2. The display substrate of claim 1, further comprising: the packaging layer is positioned between the light emitting structure layer and the color film layer;

3. The display substrate according to claim 2, wherein the functional layer has a single-layer structure and a planar structure;

the functional layer is a transparent film layer;

4. The display substrate according to claim 2, wherein the functional layer is a multilayer structure, and the functional layer comprises: a first functional layer and a second functional layer;

5. The display substrate of claim 4, wherein the first functional layer and the second functional layer are in a grid-like structure;

6. The display substrate according to claim 5, wherein an orthographic projection of the pixel definition layer on the substrate covers an orthographic projection of the first trace or the second trace on the substrate;

7. The display substrate of claim 4, wherein the first functional layer is a grid-like structure and the second functional layer is a planar structure;

8. The display substrate according to any one of claims 5 to 7, wherein a cross-sectional shape of the first opening region includes: polygonal, circular or elliptical;

9. The display substrate of claim 2, wherein the first inorganic encapsulation layer and the second inorganic encapsulation layer are formed using a deposition process; the deposition density of the first inorganic encapsulation layer is less than the deposition density of the second inorganic encapsulation layer.

10. The display substrate of claim 2, further comprising: the device comprises a driving structure layer, a flat layer, a laminating layer and a cover plate;

11. A display device, comprising: a display substrate according to any one of claims 1 to 10.

12. A method for manufacturing a display substrate, the method being used for manufacturing the display substrate according to any one of claims 1 to 10, the method comprising:

providing a substrate base plate;

13. The display substrate according to claim 12, wherein the functional layer is a single-layer structure, and the sequentially forming the functional layer and the color film layer on the light emitting structure layer comprises:

forming a functional layer on the first inorganic encapsulation layer;

forming a color film layer on the third organic packaging layer;

or,

forming a functional layer on the second inorganic encapsulation layer;

and forming a color film layer on the third organic packaging layer.

14. The display substrate of claim 12, wherein the functional layer is a multi-layer structure, and the functional layer comprises: a first functional layer and a second functional layer;

forming a first functional layer on the first inorganic encapsulation layer;

forming a second functional layer on the second inorganic encapsulation layer;

and forming a color film layer on the third organic packaging layer.

15. The display substrate according to claim 12, wherein the light emitting structure layer comprises: the first electrode, organic luminescent layer and second electrode, it includes to form pixel definition layer and light emitting structure layer on the said substrate base plate:

forming a driving structure layer on the substrate base plate;

forming a first electrode on the driving structure layer;