CN111564481B

CN111564481B - Display substrate, manufacturing method thereof and display device

Info

Publication number: CN111564481B
Application number: CN202010435534.2A
Authority: CN
Inventors: 刘文祺; 孙中元; 薛金祥; 闫华杰
Original assignee: BOE Technology Group Co Ltd
Current assignee: BOE Technology Group Co Ltd
Priority date: 2020-05-21
Filing date: 2020-05-21
Publication date: 2023-09-22
Anticipated expiration: 2040-05-21
Also published as: CN111564481A; WO2021233002A1

Abstract

A display substrate, a manufacturing method thereof and a display device, wherein the display substrate comprises: a substrate, a pixel definition layer, a light emitting structure layer, a functional layer and a color film layer which are arranged on the substrate; the color film layer comprises: a plurality of optical filters; the orthographic projection of the adjacent optical filters on the substrate is overlapped, and the orthographic projection of the pixel definition layer on the substrate covers the orthographic projection of the overlapped part of the adjacent optical filters on the substrate; the functional layer is positioned between the light-emitting structure layer and the color film layer, and the orthographic projection on the substrate is at least partially overlapped with the overlapped part of the adjacent optical filters. The method and the device can reduce the influence of subsequent processes on the organic light-emitting layer by arranging the functional layer, and improve the display effect of the display substrate.

Description

Display substrate, manufacturing method thereof and display device

Technical Field

The disclosure relates to the field of display technologies, and in particular, to a display substrate, a manufacturing method thereof and a display device.

Background

Micro organic light Emitting diodes (Micro Organic Light-Emitting Diode, micro-OLED) are one type of Micro display that has been developed in recent years, and silicon-based OLED is one type of them. The silicon-based OLED can realize active addressing of pixels, and can realize preparation of various functional circuits including a time sequence control (TCON) circuit, an over-current protection (OCP) circuit and the like on a silicon-based substrate, thereby being beneficial to reducing the system volume and realizing light weight. The silicon-based OLED is prepared by adopting a mature complementary metal oxide semiconductor (Complementary Metal Oxide Semiconductor, CMOS for short) integrated circuit process, has the advantages of small volume, high resolution (Pixels Per Inch, PPI for short), high refresh rate and the like, and is widely applied to the field of near-to-eye display of Virtual Reality (VR for short) or augmented Reality (Augmented Reality, AR for short).

Disclosure of Invention

The display substrate, the manufacturing method thereof and the display device can reduce the influence of subsequent manufacturing processes on the organic light-emitting layer and improve the display effect of the display substrate.

In a first aspect, the present disclosure provides a display substrate, comprising: a substrate, a pixel definition layer, a light-emitting structure layer, a functional layer and a color film layer which are arranged on the substrate;

the color film layer comprises: a plurality of optical filters; the orthographic projection of the adjacent optical filters on the substrate is overlapped, and the orthographic projection of the pixel definition layer on the substrate covers the orthographic projection of the overlapped part of the adjacent optical filters on the substrate;

the functional layer is positioned between the light-emitting structure layer and the color film layer, and the orthographic projection on the substrate is at least partially overlapped with the overlapped part of the adjacent optical filters.

In some possible implementations, the display substrate further includes: the packaging layer is positioned between the light-emitting structure layer and the color film layer;

the encapsulation layer includes: the first inorganic packaging layer, the second inorganic packaging layer and the third organic packaging layer;

the first inorganic packaging layer is positioned on one side of the second inorganic packaging layer close to the substrate base plate;

The third organic packaging layer is positioned on one side of the second inorganic packaging layer away from the substrate base plate;

the manufacturing materials of the first inorganic packaging layer comprise: silicon nitride; the second inorganic packaging layer comprises the following manufacturing materials: silicon oxide; the third organic packaging layer comprises the following manufacturing materials: parylene; the thickness of the third organic encapsulation layer is 4500 nm to 5500 nm.

In some possible implementations, the functional layer is a single-layer structure and is a planar structure;

the functional layer is positioned between the first inorganic packaging layer and the second inorganic packaging layer or between the second inorganic packaging layer and the third organic packaging layer;

the functional layer is a transparent film layer;

the manufacturing materials of the functional layer comprise: polyvinyl chloride or titanium dioxide nanowires doped with plasticizers, stabilizers and ultraviolet light absorbers.

In some possible implementations, the functional layer is a multi-layer structure, and the functional layer includes: a first functional layer and a second functional layer;

the first functional layer is positioned between the first inorganic packaging layer and the second inorganic packaging layer, and the second functional layer is positioned between the second inorganic packaging layer and the third organic packaging layer;

The first functional layer and the second functional layer are transparent film layers;

the manufacturing materials of the first functional layer comprise: polyvinyl chloride or titanium dioxide nanowires doped with plasticizers, stabilizers and ultraviolet light absorbers;

the second functional layer is made of the following materials: polyvinyl chloride or titanium dioxide nanowires doped with plasticizers, stabilizers and ultraviolet light absorbers.

In some possible implementations, the first functional layer and the second functional layer are in a grid-like structure;

the first functional layer includes: a first wire and a plurality of first opening areas surrounded by the first wire; the second functional layer includes: the second wiring and a plurality of second opening areas surrounded by the second wiring;

there is no overlapping area between the orthographic projection of the plurality of first opening areas on the substrate and the orthographic projection of the plurality of second opening areas on the substrate.

In some possible implementations, the orthographic projection of the pixel defining layer on the substrate covers the orthographic projection of the first trace or the second trace on the substrate;

the orthographic projection of the first wire or the second wire on the substrate base plate is at least partially overlapped with the overlapped part of the adjacent optical filters.

In some possible implementations, the first functional layer is a grid-like structure, and the second functional layer is a planar structure;

the first functional layer includes: a first wire and a plurality of first opening areas surrounded by the first wire; the orthographic projection of the pixel definition layer on the substrate covers the orthographic projection of the first wiring on the substrate; orthographic projection of the first wiring on the substrate is at least partially overlapped with the overlapped part of the adjacent optical filters;

or the first functional layer is of a planar structure, and the second functional layer is of a grid structure;

the second functional layer includes: the second wiring and the second opening area surrounded by the second wiring; the orthographic projection of the pixel definition layer on the substrate covers the orthographic projection of the second wiring on the substrate; orthographic projection of the second wiring on the substrate is at least partially overlapped with the overlapped part of the adjacent optical filters;

alternatively, the first functional layer and the second functional layer are planar structures.

In some possible implementations, the cross-sectional shape of the first opening region includes: polygonal, circular or elliptical;

The cross-sectional shape of the second opening region includes: polygonal, circular or elliptical.

In some possible implementations, the first inorganic encapsulation layer and the second inorganic encapsulation layer are formed using a deposition process; the deposition density of the first inorganic encapsulation layer is less than the deposition density of the second inorganic encapsulation layer.

In some possible implementations, the display substrate further includes: the driving structure layer, the flat layer, the attaching layer and the cover plate;

the driving structure layer is positioned on one side of the light-emitting structure layer, which is close to the substrate base plate, and is connected with the light-emitting structure layer;

the flat layer is positioned at one side of the color film layer far away from the substrate base plate; the manufacturing materials of the flat layer comprise: parylene;

the laminating layer is located the flat layer is kept away from the one side of substrate base plate, the preparation material of laminating layer includes: silicon dioxide;

the cover plate is located at one side of the attaching layer away from the substrate base plate.

In a second aspect, the present disclosure also provides a display apparatus including: the display substrate.

In a third aspect, the present disclosure further provides a method for manufacturing a display substrate, which is used for manufacturing the display substrate, and the method includes:

Providing a substrate base plate;

forming a pixel defining layer and a light emitting structure layer on the substrate base plate;

sequentially forming a functional layer and a color film layer on the light-emitting structure layer; the color film layer comprises: a plurality of optical filters; the orthographic projection of the adjacent optical filters on the substrate is overlapped, and the orthographic projection of the pixel definition layer on the substrate covers the orthographic projection of the overlapped part of the adjacent optical filters on the substrate;

In some possible implementations, the functional layer is a single-layer structure, and sequentially forming the functional layer and the color film layer on the light-emitting structure layer includes:

forming a first inorganic packaging layer on the light-emitting structure layer by adopting a chemical vapor deposition process;

forming a functional layer on the first inorganic encapsulation layer;

forming a second inorganic packaging layer on the functional layer by adopting an atomic layer deposition process;

forming a third organic packaging layer on the second inorganic packaging layer by adopting a molecular layer deposition process;

forming a color film layer on the third organic packaging layer;

Or alternatively, the process may be performed,

forming a second inorganic packaging layer on the first inorganic packaging layer by adopting an atomic layer deposition process;

forming a functional layer on the second inorganic encapsulation layer;

forming a third organic packaging layer on the functional layer by adopting a molecular layer deposition process;

and forming a color film layer on the third organic packaging layer.

the sequentially forming the functional layer and the color film layer on the light-emitting structure layer comprises the following steps:

forming a first functional layer on the first inorganic encapsulation layer;

forming a second inorganic packaging layer on the first functional layer by adopting an atomic layer deposition process;

forming a second functional layer on the second inorganic encapsulation layer;

forming a third organic packaging layer on the second functional layer by adopting a molecular layer deposition process;

and forming a color film layer on the third organic packaging layer.

In some possible implementations, the light emitting structure layer includes: a first electrode, an organic light emitting layer, and a second electrode, the forming a pixel defining layer and a light emitting structure layer on the substrate base plate including:

Forming a driving structure layer on the substrate base plate;

forming a first electrode on the driving structure layer;

sequentially forming a pixel defining layer, an organic light emitting layer, and a second electrode on the driving structure layer formed with the first electrode to form a light emitting structure layer;

after the functional layer and the color film layer are sequentially formed on the light-emitting structure layer, the method further comprises the steps of:

and a flat layer, a bonding layer and a cover plate are sequentially formed on the color film layer.

The disclosure provides a display substrate, a manufacturing method thereof and a display device, wherein the display substrate comprises: a substrate, a pixel definition layer, a light emitting structure layer, a functional layer and a color film layer which are arranged on the substrate; the color film layer comprises: a plurality of optical filters; the orthographic projection of the adjacent optical filters on the substrate is overlapped, and the orthographic projection of the pixel definition layer on the substrate covers the orthographic projection of the overlapped part of the adjacent optical filters on the substrate; the functional layer is positioned between the light-emitting structure layer and the color film layer, and the orthographic projection on the substrate is at least partially overlapped with the overlapped part of the adjacent optical filters. The method and the device can reduce the influence of subsequent processes on the organic light-emitting layer by arranging the functional layer, and improve the display effect of the display substrate.

Additional features and advantages of the disclosure will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the disclosure. Other advantages of the present disclosure may be realized and attained by the structure particularly pointed out in the written description and drawings.

Drawings

The accompanying drawings are included to provide an understanding of the technical aspects of the present disclosure, and are incorporated in and constitute a part of this specification, illustrate the technical aspects of the present disclosure and together with the embodiments of the disclosure, not to limit the technical aspects of the present disclosure.

Fig. 1 is a schematic structural diagram of a display substrate according to an embodiment of the disclosure;

fig. 2 is another schematic structural diagram of a display substrate according to an embodiment of the disclosure;

fig. 3 is a schematic structural diagram of a display substrate according to an embodiment of the disclosure;

fig. 4 is a schematic structural view of an organic light emitting layer according to an exemplary embodiment;

FIG. 5 is a schematic diagram of the circuit principle provided by an exemplary embodiment;

FIG. 6 is a schematic diagram of a circuit implementation of a voltage control circuit and a pixel drive circuit provided by an exemplary embodiment;

FIG. 7A is a top view of a first functional layer in an exemplary embodiment;

FIG. 7B is a top view of a second functional layer in an exemplary embodiment;

fig. 8 is a flowchart of a method for manufacturing a display substrate according to an embodiment of the disclosure;

fig. 9 to 17 are schematic diagrams illustrating a manufacturing method of a display substrate according to an exemplary embodiment.

Detailed Description

The present disclosure describes several embodiments, but the description is illustrative and not limiting, and many more embodiments and implementations are possible within the scope of the embodiments described in the present disclosure for one of ordinary skill in the art. Although many possible combinations of features are shown in the drawings and discussed in the detailed description, many other combinations of the disclosed features are possible. Any feature or element of any embodiment may be used in combination with or in place of any other feature or element of any other embodiment unless specifically limited.

The present disclosure includes and contemplates combinations of features and elements known to those of ordinary skill in the art. The embodiments, features and elements of the present disclosure that have been disclosed may also be combined with any conventional features or elements to form the technical solution defined by the claims. Any feature or element of any embodiment may also be combined with features or elements from other claims to form another claim. Thus, it should be understood that any of the features shown and/or discussed in this disclosure may be implemented alone or in any suitable combination. Accordingly, the embodiments are not to be restricted except in light of the attached claims and their equivalents. Further, various modifications and changes may be made within the scope of the appended claims.

Unless defined otherwise, technical or scientific terms used in this disclosure should be given the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The terms "first," "second," and the like, as used in this disclosure, do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that elements or items preceding the word are included in the element or item listed after the word and equivalents thereof, but does not exclude other elements or items. The terms "connected" or "connected," and the like, are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", etc. are used merely to denote relative positional relationships, which may also change accordingly when the absolute position of the object being described changes.

In this specification, a transistor means an element including at least three terminals of a gate electrode, a drain electrode, and a source electrode. The transistor has a channel region between a drain electrode (a drain electrode terminal, a drain region, or a drain electrode) and a source electrode (a source electrode terminal, a source region, or a source electrode), and a current can flow through the drain electrode, the channel region, and the source electrode. The channel region refers to a region through which current mainly flows.

In this specification, the first electrode may be a drain electrode, the second electrode may be a source electrode, or the first electrode may be a source electrode and the second electrode may be a drain electrode. In the case of using a transistor having opposite polarity, or in the case of a change in the direction of current during circuit operation, the functions of the "source electrode" and the "drain electrode" may be interchanged. Therefore, in this specification, "source electrode" and "drain electrode" may be exchanged with each other.

In this specification, "connected" includes a case where constituent elements are connected together by an element having some electric action. The "element having a certain electric action" is not particularly limited as long as it can transmit and receive an electric signal between the constituent elements connected. Examples of the "element having some electric action" include not only an electrode and a wiring but also a switching element such as a transistor, a resistor, an inductor, a capacitor, other elements having various functions, and the like.

In this specification, "film" and "layer" may be exchanged with each other. For example, the "conductive layer" may be sometimes replaced with a "conductive film". In the same manner, the "insulating film" may be replaced with the "insulating layer" in some cases.

In a display substrate, an encapsulation layer and a color film layer are required to be manufactured after an organic light-emitting layer, when the encapsulation layer is manufactured, the stress of an inorganic film layer in the encapsulation layer cannot be released due to the fact that the thickness of part of the organic film layer in the encapsulation layer is thin, so that the stress of the inorganic film layer in the encapsulation layer is large, defects such as breakage and the like are extremely easy to cause, and then the organic light-emitting layer cannot be protected. Therefore, the organic light-emitting layer is adversely affected in the subsequent process of the organic light-emitting layer, and the display effect of the display substrate is reduced.

Fig. 1 is a schematic structural view of a display substrate according to an embodiment of the disclosure, fig. 2 is another schematic structural view of a display substrate according to an embodiment of the disclosure, and fig. 3 is a schematic structural view of a display substrate according to an embodiment of the disclosure. As shown in fig. 1 to 3, a display substrate provided by an embodiment of the present disclosure includes: the light emitting device includes a substrate 10, a light emitting structure layer 20, a pixel defining layer 24, a functional layer 50, and a color film layer 30 disposed on the substrate 10.

The color film layer 30 includes: a plurality of filters 31; the orthographic projection of the adjacent filters on the substrate 10 partially overlaps, and the orthographic projection of the pixel defining layer 24 on the substrate covers the orthographic projection of the overlapping portion of the adjacent filters on the substrate. The functional layer 50 is located between the light emitting structure layer 20 and the color film layer 30, and the orthographic projection on the substrate 10 is at least partially overlapped with the overlapping portion of the adjacent optical filters.

In an exemplary embodiment, the substrate base 10 may be a silicon-based substrate or a glass substrate.

In one exemplary embodiment, the light emitting structure layer 20 includes: a first electrode 21, an organic light emitting layer 22, and a second electrode 23.

In an exemplary embodiment, the first electrode 21 is located at a side of the organic light emitting layer 22 close to the substrate 10, and the second electrode 23 is located at a side of the organic light emitting layer 22 remote from the substrate 10.

In one exemplary embodiment, the display substrate may be a top emission structure.

In an exemplary embodiment, the first electrode 21 is a reflective electrode, and the first electrode 21 may be a multi-layer composite structure.

In one exemplary embodiment, the first electrode 21 may include: and laminating the first conductive layer, the second conductive layer and the third conductive layer.

In one exemplary embodiment, the first and third conductive layers may be made of titanium. The second conductive layer may be made of aluminum.

Fig. 4 is a schematic structural view of an organic light emitting layer according to an exemplary embodiment. As shown in fig. 4, an organic light emitting layer provided by an exemplary embodiment includes a first light emitting sub-layer 331, a first charge generating layer 332, a second light emitting sub-layer 333, a second charge generating layer 334, and a third light emitting sub-layer 335 sequentially stacked between a first electrode and a second electrode.

The first light emitting sub-layer 331 is for emitting a first color light, and includes a first Hole Transport Layer (HTL) 3311, a first light Emitting Material Layer (EML) 3312, and a first Electron Transport Layer (ETL) 3313 stacked in this order. The second light emitting sub-layer 333 is configured to emit a second color light, and includes a second hole transport layer 3331, a second light emitting material layer 3332, and a second electron transport layer 3333 stacked in order. The third light emitting sub-layer 335 is configured to emit a third color light, and includes a third hole transport layer 3351, a third light emitting material layer 3352, and a third electron transport layer 3353 stacked in order. The first charge generation layer 332 is disposed between the first light emitting sub-layer 331 and the second light emitting sub-layer 333, and is used for connecting the two light emitting sub-layers in series to realize carrier transfer. The second charge generation layer 334 is disposed between the second light emitting sub-layer 333 and the third light emitting sub-layer 335, and is used for connecting the two light emitting sub-layers in series to realize carrier transfer. Since the organic light emitting layer includes a first light emitting material layer emitting light of a first color, a second light emitting material layer emitting light of a second color, and a third light emitting material layer emitting light of a third color, light finally emitted from the organic light emitting layer is mixed light. For example, it is possible to provide that the first luminescent material layer is a red light emitting material layer emitting red light, the second luminescent material layer is a green light emitting material layer emitting green light, and the third luminescent material layer is a Lan Guangcai layer emitting blue light, so that the organic luminescent layer finally emits white light.

In practical implementation, the structure of the organic light emitting layer may be designed according to practical needs. In each light emitting sub-layer, a hole injection layer and an electron injection layer may be further provided in order to improve efficiency of injecting electrons and holes into the light emitting material layer. In order to simplify the structure of the organic light emitting layer, the first electron transport layer 3313, the first charge generation layer 332, and the second hole transport layer 3331 may be omitted, i.e., the second light emitting material layer 3332 may be directly disposed on the first light emitting material layer 3312.

In one exemplary embodiment, the organic light emitting layer may employ an organic light emitting layer emitting light of a first color and an organic light emitting layer emitting complementary light of the first color, which are sequentially stacked with respect to the substrate base plate, thereby emitting white light as a whole.

In an exemplary embodiment, the orthographic projection of the first electrode 21 on the substrate 10 covers the orthographic projection of the organic light emitting layer 22 on the substrate 10, that is, the size of the first electrode 21 is larger than the size of the organic light emitting layer 22, so that the display brightness of the display substrate can be improved.

In one exemplary embodiment, the second electrode 23 may be a planar electrode. The second electrode 23 is a transmissive electrode for transmitting light emitted from the organic light emitting layer 22 and reflected by the first electrode 21.

In an exemplary embodiment, the second electrode 23 may be made of indium tin oxide or zinc tin oxide, or may be made of other transparent conductive materials.

As shown in fig. 1 to 3, there is a certain overlap of boundaries of filters of different colors in the display substrate. Since the pixel size in the display substrate is small, the edge of the filter manufactured later may be superimposed on the filter manufactured earlier, resulting in a difference in thickness between the filters, thereby causing non-uniformity of the color film layer, i.e., non-flatness of the surface of the color film layer 30 away from the substrate 10.

In an exemplary embodiment, the color film layer 30 implements full color display by combining white light with color film, and high resolution of more than 2000 can be implemented by combining white light with color film, which can be adapted to VR/AR requirements.

In an exemplary embodiment, a plurality of filters 31 are arranged in an array.

In one exemplary embodiment, the shape of the filter 31 may be hexagonal, elongated, or approximately elliptical.

In an exemplary embodiment, the area of the filter 31 is less than 20 μm ² 。

In one exemplary embodiment, the preparation temperature of the optical filter 31 is less than 90 degrees.

In one exemplary embodiment, the color film layer 30 includes at least a first color filter, a second color filter, and a third color filter. Or the color film layer 30 may further include: white filters or filters of other colors.

In one exemplary embodiment, the color film layer 30 includes: the first color filter, the second color filter and the third color filter are exemplified. The color film layer in one pixel area comprises a first color filter, a second color filter and a third color filter which are arranged along the arrangement mode of a plurality of sub-pixels in the pixel area.

In one exemplary embodiment, the first color filter, the second color filter, and the third color filter are disposed on the same surface. The second color filter is disposed on a first side of the first color filter and the third color filter is disposed on a second side of the first color filter opposite the first side in a plane parallel to the surface.

In an exemplary embodiment, at least one of the second color filter and the third color filter covers a portion of the first color filter; at least part of the first color filter is not overlapped with the second color filter and the third color filter; the second color filter and the third color filter do not overlap at all.

In one exemplary embodiment, a patterning process includes: photoresist coating, exposure, development, etching, stripping and the like.

In one exemplary embodiment, a first patterning process is used to form a first color filter; the second color filter positioned on the first side of the first color filter is formed by adopting a second patterning process, and the second color filter partially covers the first color filter, so that the contact area between the second color and a film layer below the color film layer can be reduced; and then forming a third color filter positioned on the second side of the first color filter by adopting a third patterning process, wherein the third color filter partially covers the second color filter, so that the contact area between the third color and a film layer below the color film layer can be reduced.

In one exemplary embodiment, the first color filter may be a green (G) color filter, the second color filter may be a red (R) color filter, the third color filter may be a blue (B) color filter, or the first color filter may be a blue color filter, and the second color filter may be a green color filter. The third color filter may be a red filter.

In one exemplary embodiment, the adhesion of the green filter is greater than the adhesion of the red filter and the adhesion of the blue filter.

Taking the first color filter as a green (G) color filter, the second color filter as a red (R) color filter, the third color filter as a blue (B) color filter as an example, the green filter with high adhesion is formed first, the red filter with low adhesion is formed later, and the red filter with low adhesion is partially covered on the green filter with high adhesion, so that the contact area between the red filter with low adhesion and the film layer below the color film layer can be reduced. The green filter and the red filter have similar properties, and the adhesion force between the green filter and the red filter is larger than the adhesion force between the red filter and the film layer below the color film layer, so that compared with the situation that the red filter is not covered with the green filter at all, the red filter is partially covered with the green filter, and the possibility that the whole of the green filter and the red filter is peeled off from the film layer below the color film layer can be reduced. In addition, since the red filter has small adhesiveness and good fluidity, in the process of forming the red filter, it is possible to improve the uniformity of film thickness of the whole of the green filter and the red filter at the position where the both overlap. Then, a blue filter with small adhesiveness is formed, and the blue filter with small adhesiveness is partially covered on the green filter with large adhesiveness, so that the contact area between the blue filter with small adhesiveness and a film layer below the color film layer can be reduced. The green filter and the blue filter have similar properties, and the adhesion between the green filter and the blue filter is larger than the adhesion between the blue filter and the film layer below the color film layer, so that the partial coverage of the blue filter by the green filter can reduce the possibility of peeling of the whole of the green filter and the blue filter from the film layer below the color film layer compared with the case that the blue filter is not covered by the green filter at all. In addition, since the blue filter has small adhesiveness and good fluidity, in the process of forming the blue filter, the uniformity of film thickness of the whole of the green filter and the blue filter at the overlapping position of the two can be improved.

In one exemplary embodiment, filters of the same color located in different pixel regions are formed in the same process.

In one exemplary embodiment, the pixel defining layer 24 may be made of polyimide, acryl, or polyethylene terephthalate.

In one exemplary embodiment, the display substrate further includes: a driving structure layer disposed between the substrate base 10 and the light emitting structure layer 20. The driving structure layer is connected to the first electrode 21. The driving structure layer includes: a transistor 11 provided in the substrate base 10, and a first insulating layer 12, a first conductive post 13, a reflective electrode 14, a second insulating layer 15, and a second conductive post 16 provided in this order on the substrate base 10.

In an exemplary embodiment, the active layer of the transistor 11 is disposed inside the substrate base 10.

In an exemplary embodiment, the transistor 11 may be a metal oxide semiconductor field effect transistor (Metal Oxide Semiconductor, abbreviated as MOS).

In one exemplary embodiment, a transistor includes: an active layer, a gate electrode, a source electrode, a drain electrode, and a gate connection electrode. The source electrode and the drain electrode are respectively connected with the active layer, and the gate connecting electrode is connected with the gate electrode through the second conductive column. The transistor may be a bottom gate structure or may be a top gate structure.

In an exemplary embodiment, the active layer may be made of a material including: a metal oxide.

In an exemplary embodiment, the first and second insulating layers 12 and 15 may be made of silicon oxide (SiOx), silicon nitride (SiNx), or silicon oxynitride (SiON). The structures of the first insulating layer 12 and the second insulating layer 15 may be a single-layer structure or may be a multi-layer composite structure.

In an exemplary embodiment, the first conductive pillars 13 and the second conductive pillars 16 may be made of tungsten.

In one exemplary embodiment, the reflective electrode 14 may be made of silver or aluminum. The structure of the reflective electrode 14 may be a single layer structure or may be a multi-layer composite structure.

The display substrate provided by the embodiment of the disclosure comprises: a substrate, a pixel definition layer, a light emitting structure layer, a functional layer and a color film layer which are arranged on the substrate; the color film layer comprises: a plurality of optical filters; the orthographic projection of the adjacent optical filters on the substrate is overlapped, and the orthographic projection of the pixel definition layer on the substrate covers the orthographic projection of the overlapped part of the adjacent optical filters on the substrate; the functional layer is positioned between the light-emitting structure layer and the color film layer, and the orthographic projection on the substrate is at least partially overlapped with the overlapped part of the adjacent optical filters. The organic light-emitting layer is arranged on the color film layer, and the color film layer is arranged on the organic light-emitting layer.

In an exemplary embodiment, as shown in fig. 1 to 3, a display substrate includes: a display area 100, a peripheral area 200 surrounding the display area 100, and a binding area 300 disposed at a side of the peripheral area 200 remote from the display area 100.

In one exemplary embodiment, a plurality of subpixels are disposed in the display area 100 in a regular arrangement. Each subpixel includes: a light emitting element and a pixel driving circuit for driving the light emitting element to emit light. A control circuit for supplying a control signal to the pixel driving circuit is provided in the peripheral region 200. The bonding region 300 is provided therein with a pad assembly bonded and connected to an external flexible circuit board (Flexible Printed Circuit, abbreviated as FPC). Fig. 1 to 3 are illustrative of three sub-pixels 100A, 100B, and 100C in a display area.

In one exemplary embodiment, a transistor may include: a switching transistor and a driving transistor. The plurality of transistors 11 on the substrate 10 may constitute a pixel driving circuit.

Fig. 5 is a schematic diagram of the circuit principle provided by an exemplary embodiment. As shown in fig. 5, a plurality of subpixels in the display area are regularly arranged to form a plurality of display rows and a plurality of display columns. Each sub-pixel includes a pixel driving circuit 101 and a light emitting device 102 connected to the pixel driving circuit 101. The pixel driving circuit 101 includes at least a driving transistor. The control circuit includes at least a plurality of voltage control circuits 110, and each voltage control circuit 110 is connected to a plurality of pixel driving circuits 101. For example, a voltage control circuit 110 is connected to the pixel driving circuits 101 in a display row, the first poles of the driving transistors in the pixel driving circuits 101 in the display row are commonly connected to the voltage control circuit 110, the second pole of each driving transistor is connected to the anode of the light emitting device 102 of the sub-pixel, and the cathode of the light emitting device 102 is connected to the input terminal of the second power supply signal VSS. The voltage control circuit 110 is connected to an input terminal of the first power supply signal VDD, an input terminal of the initialization signal Vinit, an input terminal of the reset control signal RE, and an input terminal of the emission control signal EM, respectively. The voltage control circuit 110 is configured to output an initialization signal Vinit to a first pole of the driving transistor in response to a reset control signal RE, controlling the corresponding light emitting device 102 to be reset. The voltage control circuit 110 is further configured to output a first power supply signal VDD to a first electrode of the driving transistor in response to the light emission control signal EM to drive the light emitting device 102 to emit light. By commonly connecting the pixel driving circuits 101 in one display row to the voltage control circuit 110, the structure of the pixel driving circuits 101 in the display area 100 can be simplified, and the occupied area of the pixel driving circuits 101 in the display area 100 can be reduced, so that more pixel driving circuits 101 and light emitting devices 102 are arranged in the display area 100, and high PPI display can be realized. The voltage control circuit 110 outputs the initialization signal Vinit to the first electrode of the driving transistor under the control of the reset control signal RE, and controls the corresponding light emitting device 102 to reset, so that the influence of the voltage loaded on the light emitting device 102 during the light emitting of the previous frame on the light emitting of the next frame can be avoided, and the afterimage phenomenon can be improved.

In an exemplary embodiment, one voltage control circuit 110 may be connected to the pixel driving circuits 101 in two adjacent sub-pixels in the same display line, or may be connected to the pixel driving circuits 101 in three or more sub-pixels in the same display line.

Fig. 6 is a schematic diagram of a circuit implementation of the voltage control circuit and the pixel driving circuit provided in an exemplary embodiment. As shown in fig. 6, the light emitting device may include an OLED. The anode of the OLED is connected to the second pole D of the driving transistor M0, and the cathode of the OLED is connected to the input terminal of the second power signal VSS.

In an exemplary embodiment, the voltage of the second power supply signal VSS may be a negative voltage or a ground voltage V _GND (typically 0V). The voltage of the initialization signal Vinit may be the ground voltage V _GND 。

In an exemplary embodiment, the OLED may be a Micro-OLED or a Mini-OLED to facilitate high PPI display.

In an exemplary embodiment, the voltage control circuit 110 is connected to two pixel driving circuits 101 in a display row. The pixel driving circuit 101 includes a driving transistor M0, a third transistor M3, a fourth transistor M4, and a storage capacitor Cst, and the voltage control circuit 110 includes a first transistor M1 and a second transistor M2. The driving transistor M0, the first transistor M1, the second transistor M2, the third transistor M3, and the fourth transistor M4 are transistors prepared in the substrate.

The control electrode of the first transistor M1 is connected to the input terminal of the reset control signal RE and is configured to receive the reset control signal RE, the first electrode of the first transistor M1 is connected to the input terminal of the initialization signal Vinit and is configured to receive the initialization signal Vinit, and the second electrode of the first transistor M1 is connected to the first electrode S of the corresponding driving transistor M0 and the second electrode of the second transistor M2, respectively. The control electrode of the second transistor M2 is connected to the input terminal of the emission control signal EM, configured to receive the emission control signal EM, the first electrode of the second transistor M2 is connected to the input terminal of the first power signal VDD, configured to receive the first power signal VDD, and the second electrode of the second transistor M2 is connected to the first electrode S of the corresponding driving transistor M0 and the second electrode of the first transistor M1, respectively. In an exemplary embodiment, the types of the first transistor M1 and the second transistor M2 may be different, for example, the first transistor M1 is an N-type transistor, the second transistor M2 is a P-type transistor, or the first transistor M1 is a P-type transistor, and the second transistor M2 is an N-type transistor. In some possible implementations, the types of the first transistor M1 and the second transistor M2 may be the same, and may be determined according to the design of the practical application environment.

The pixel driving circuit 101 includes a driving transistor M0, a third transistor M3, a fourth transistor M4, and a storage capacitor Cst. The control electrode G of the driving transistor M0, the first electrode S of the driving transistor M0 is connected to the second electrode of the first transistor M1 and the second electrode of the second transistor M2, and the second electrode D of the driving transistor M0 is connected to the anode of the OLED. The control electrode of the third transistor M3 is connected to the input terminal of the first control electrode scan signal S1, configured to receive the first control electrode scan signal S1, the first electrode of the third transistor M3 is connected to the input terminal of the data signal DA, configured to receive the data signal DA, and the second electrode of the third transistor M3 is connected to the control electrode G of the driving transistor M0. The control electrode of the fourth transistor M4 is connected to the input terminal of the second control electrode scan signal S2, configured to receive the second control electrode scan signal S2, the first electrode of the fourth transistor M4 is connected to the input terminal of the data signal DA, configured to receive the data signal DA, and the second electrode of the fourth transistor M4 is connected to the control electrode G of the driving transistor M0. The first terminal of the storage capacitor Cst is connected to the gate electrode G of the driving transistor M0, and the second terminal of the storage capacitor Cst is connected to the ground terminal GND. In an exemplary embodiment, the driving transistor M0 may be an N-type transistor, and the types of the third transistor M3 and the fourth transistor M4 may be different, for example, the third transistor M3 is an N-type transistor, and the fourth transistor M4 is a P-type transistor. When the voltage of the data signal DA is a voltage corresponding to a high gray scale, the voltage of the data signal DA is prevented from being affected by, for example, the threshold voltage of the third transistor M3 of the N type by the fourth transistor M4 of the P type being turned on to transmit the data signal DA to the gate G of the driving transistor M0. When the voltage of the data signal DA is the voltage corresponding to the low gray level, the voltage of the data signal DA is prevented from being affected by the threshold voltage of the P-type fourth transistor M4 by turning on the N-type third transistor M3 to transmit the data signal DA to the gate G of the driving transistor M0. In this way, the voltage range input to the control electrode G of the driving transistor M0 can be increased.

In an exemplary embodiment, the types of the third transistor M3 and the fourth transistor M4 may be that the third transistor M3 is a P-type transistor and the fourth transistor M4 is an N-type transistor.

In one exemplary embodiment, the pixel driving circuit may be a 3T1C, 5T1C, or 7T1C circuit structure, or may be a circuit structure having an internal compensation or external compensation function.

In one exemplary embodiment, as shown in fig. 1 to 3, the driving structure layer covers the entire display region 100 and the peripheral region 200.

The first insulating layer 12 and the second insulating layer 15 cover the entire display area and at least a part of the peripheral area. In one exemplary embodiment, as shown in fig. 1 to 3, the first insulating layer 12 and the second insulating layer 15 cover the entire display region 100 and the peripheral region 200.

In one exemplary embodiment, the first conductive pillars 13 and the second conductive pillars 16 are located in the display region 100 and the peripheral region 200.

In an exemplary embodiment, a via hole exposing a portion of the drain electrode is provided on the first insulating layer 12, and the first conductive pillar 13 is provided in the via hole of the first insulating layer 12. The reflective electrode 14 is connected to the drain electrode through the first conductive post 13. The second insulating layer 15 is provided with a via hole exposing the reflective electrode 14, and the second conductive post 16 is disposed in the via hole of the second insulating layer 15.

In one exemplary embodiment, as shown in fig. 1 to 3, the display substrate further includes: encapsulation layer 40. The encapsulation layer 40 is located between the light emitting structure layer 20 and the color film layer 30.

The encapsulation layer 40 includes: a first inorganic encapsulation layer 41, a second inorganic encapsulation layer 42, and a third organic encapsulation layer 43; the first inorganic packaging layer 41 is positioned on one side of the second inorganic packaging layer 42 close to the substrate base plate 10; the third organic encapsulation layer 43 is located on the side of the second inorganic encapsulation layer 42 remote from the substrate base plate 10.

In an exemplary embodiment, the color film layer 30 is located in the display area 100.

In one exemplary embodiment, the encapsulation layer 40 covers the entire display area 100 and at least a portion of the peripheral area 200. In one exemplary embodiment, as shown in fig. 1 to 3, the encapsulation layer 40 covers the entire display area 100 and the entire peripheral area 200. The encapsulation layer 40 is configured to insulate water oxygen to protect the light emitting structure layer.

In an exemplary embodiment, the first inorganic encapsulation layer 41 may be made of materials including: silicon nitride. The first inorganic encapsulation layer 41 can avoid damage to the light emitting structure layer during fabrication of the second inorganic encapsulation layer 42. Since the first inorganic encapsulation layer 41 has inorganic characteristics, it has not only good encapsulation characteristics but also good adhesion with the second electrode, ensuring the encapsulation effect of the encapsulation layer.

In one exemplary embodiment, the second inorganic encapsulation layer 42 may be made of materials including: and (3) silicon oxide. The second inorganic packaging layer can prevent water and oxygen from entering the light-emitting structure layer, and the service life of the light-emitting structure layer can be prolonged.

In one exemplary embodiment, the thickness of the second inorganic encapsulation layer 42 is greater than the thickness of the first inorganic encapsulation layer 41.

In an exemplary embodiment, the fabrication materials of the third organic encapsulation layer 43 may include: parylene. Since the third organic encapsulation layer 43 has organic characteristics, not only has better organic encapsulation characteristics, but also has better particle coating capability, and can well coat particles on the film layer, so as to prevent penetration of the film layer. In addition, the material with the organic characteristic can well release the stress between the inorganic layers, and the defects of microcrack, peeling and the like of the film layer caused by larger stress are prevented. The third organic packaging layer 43 also has better flatness, and can provide a flatter substrate for the subsequent manufacture of the color film layer, so as to prevent the damage of the color film layer process to the second inorganic packaging layer.

In one exemplary embodiment, the thickness of the third organic encapsulation layer 43 is 4500 nm to 5500 nm.

In one exemplary embodiment, the first and second inorganic encapsulation layers 41 and 42 are formed using a deposition process; the deposition density of the first inorganic encapsulation layer 41 is less than the deposition density of the second inorganic encapsulation layer 42.

In one exemplary embodiment, as shown in fig. 1 and 2, the functional layer 50 may be a single layer structure and a planar structure. The functional layer 50 is located between the first inorganic encapsulation layer 41 and the second inorganic encapsulation layer 42, or between the second inorganic encapsulation layer 42 and the third organic encapsulation layer 43. Fig. 1 illustrates an example in which the functional layer 50 is located between the first inorganic encapsulation layer 41 and the second inorganic encapsulation layer 42, and fig. 2 illustrates an example in which the functional layer 50 is located between the second inorganic encapsulation layer 42 and the third organic encapsulation layer 43.

In one exemplary embodiment, the functional layer 50 is located in the entire display area 100.

In one exemplary embodiment, functional layer 50 is a transparent film layer; the light transmittance of the transparent film layer 50 is higher than 76%;

in one exemplary embodiment, the functional layer 50 is made of materials including: polyvinyl chloride or titanium dioxide nanowires doped with plasticizers, stabilizers and ultraviolet light absorbers. Wherein, the functional layer 50 can shield more than 99.8% of ultraviolet light, and can block more than 99.8% of ultraviolet light adopted for manufacturing the color film layer 30 from being injected into the organic light-emitting layer 22, thereby effectively reducing adverse effect of ultraviolet light adopted for manufacturing the color film layer on the organic light-emitting layer.

When the functional layer 50 is made of polyvinyl chloride doped with a plasticizer, a stabilizer and an ultraviolet light absorber, the mechanical properties of the functional layer 50 are excellent, and the ultraviolet light absorber is doped in the functional layer, so that the functional layer 50 can effectively absorb ultraviolet light.

When the functional layer 50 is made of titanium dioxide nanowires, the particle size of titanium dioxide in the titanium dioxide nanowires reaches the nanometer level, so that ultraviolet rays can be effectively scattered and absorbed, and when ultraviolet rays act on the nanoparticles in the form of electromagnetic waves, electrons in the titanium dioxide nanowires are forced to vibrate at the frequency of incident ultraviolet waves as a secondary propagation source of the electromagnetic waves due to the fact that the size of the nanoparticles is smaller than the wavelength of the ultraviolet rays, so that the scattering of the ultraviolet rays is formed. The titanium dioxide nanowire is also excellent in mechanical property, and along with the reduction of the size, the titanium dioxide nanowire can show better mechanical property than other materials, so that the toughness of the functional layer can be improved.

In an exemplary embodiment, since the mechanical properties of the functional layer 50 are better, the functional layer 50 has better shaping and toughness, and is located between the first inorganic encapsulation layer 41 and the second inorganic encapsulation layer 42, or between the second inorganic encapsulation layer 42 and the third organic encapsulation layer 43, the stress on the first inorganic encapsulation layer 41 and the second inorganic encapsulation layer 42 can be relieved, so that the stress on the first inorganic encapsulation layer 41 and the second inorganic encapsulation layer 42 is relieved, and the rupture or the rupture of the inorganic layer due to the overlarge stress is avoided.

In one exemplary embodiment, as shown in fig. 3, the functional layer 50 may be a multi-layered structure. The functional layer 50 includes: a first functional layer 51 and a second functional layer 52. The first functional layer 51 is located between the first inorganic encapsulation layer 41 and the second inorganic encapsulation layer 42, and the second functional layer 52 is located between the second inorganic encapsulation layer 42 and the third organic encapsulation layer 43.

In one exemplary embodiment, the first functional layer is a transparent film layer; the light transmittance of the transparent film layer is higher than 76%.

In one exemplary embodiment, the first functional layer is made of a material including: polyvinyl chloride or titanium dioxide nanowires doped with plasticizers, stabilizers and ultraviolet light absorbers. The first functional layer can block more than 99.8% of ultraviolet light adopted for manufacturing the color film layer 30 from being emitted into the organic light-emitting layer 22, so that adverse effects of the ultraviolet light adopted for manufacturing the color film layer on the organic light-emitting layer are effectively reduced.

In one exemplary embodiment, the second functional layer is a transparent film layer; the light transmittance of the transparent film layer is higher than 76%.

In one exemplary embodiment, the second functional layer is made of a material including: polyvinyl chloride or titanium dioxide nanowires doped with plasticizers, stabilizers and ultraviolet light absorbers. The second functional layer can block more than 99.8% of ultraviolet light adopted for manufacturing the color film layer 30 from being emitted into the organic light-emitting layer 22, so that adverse effects of the ultraviolet light adopted for manufacturing the color film layer on the organic light-emitting layer are effectively reduced.

In one exemplary embodiment, the first functional layer may be made of the same material as the second functional layer, or may be different.

In an exemplary embodiment, the first functional layer may be a planar structure or a mesh-like structure.

In an exemplary embodiment, the second functional layer may be a planar structure or a mesh-like structure.

In one exemplary embodiment, fig. 7A is a top view of a first functional layer in one exemplary embodiment, and fig. 7B is a top view of a second functional layer in one exemplary embodiment. Fig. 7A illustrates a first functional layer as a mesh structure, and fig. 7B illustrates a second functional layer as a mesh structure. As shown in fig. 7A and 7B, the first functional layer 51 and the second functional layer 52 may be in a mesh-like structure. The first functional layer includes: the first wire 510 and a plurality of first opening regions 511 surrounded by the first wire 510; the second functional layer includes: the second trace 520 and a second opening area 521 surrounded by the second trace 520.

In one exemplary embodiment, the plurality of first opening regions are arranged in an array, and the plurality of second opening regions are arranged in an array.

In one exemplary embodiment, the first opening regions of adjacent rows may be staggered, and the plurality of second opening regions may be staggered.

In an exemplary embodiment, there is no overlapping area between the orthographic projection of the plurality of first opening regions on the substrate and the orthographic projection of the plurality of second opening regions on the substrate, so that ultraviolet light can be prevented from being incident on the organic light emitting layer.

In an exemplary embodiment, the first functional layer and the second functional layer of the grid-shaped structure may enable stress of the first inorganic packaging layer and stress of the second inorganic packaging layer to be more dispersed, stress of the first inorganic packaging layer and stress of the second inorganic packaging layer may be better released, explosion films or breakage caused by overlarge stress of the inorganic layers may be prevented, and reliability of the display substrate may be improved.

Because of the overlapping area between the adjacent optical filters in the color film layer, each sub-pixel is contracted inwards, so that local stress of the first inorganic packaging layer and the second inorganic packaging layer, which are overlapped with the overlapping part of the adjacent optical filters in orthographic projection mode, on the substrate is larger. In an exemplary embodiment, the orthographic projection of the pixel defining layer on the substrate covers the orthographic projection of the first trace or the second trace on the substrate; the orthographic projection of the first wire or the second wire on the substrate is at least partially overlapped with the overlapped part of the adjacent optical filters, the arrangement mode of the first wire or the second wire can relieve local stress of the first inorganic packaging layer and the second inorganic packaging layer overlapped with the orthographic projection of the overlapped part of the adjacent optical filters on the substrate, the stress of the first inorganic packaging layer and the second inorganic packaging layer can be better released, the occurrence of rupture of a film or fracture caused by overlarge stress of the inorganic layers can be prevented, and the reliability of the display substrate can be improved.

In one exemplary embodiment, the first functional layer may be a mesh-like structure and the second functional layer may be a planar structure. The first functional layer includes: the first wiring and the plurality of first opening areas are surrounded by the first wiring; orthographic projection of the pixel definition layer on the substrate covers orthographic projection of the first wiring on the substrate; the orthographic projection of the first wire on the substrate is at least partially overlapped with the overlapped part of the adjacent optical filters. At this time, the first functional layer is a grid structure, so that the stress of the first inorganic packaging layer and the stress of the second inorganic packaging layer are more dispersed, the stress of the first inorganic packaging layer and the stress of the second inorganic packaging layer can be better released, rupture of the rupture membrane or rupture caused by overlarge stress of the inorganic layer can be prevented, and the reliability of the display substrate can be improved.

In one exemplary embodiment, the first functional layer may be a planar structure and the second functional layer may be a mesh-like structure. The second functional layer includes: the second wiring and the second opening area surrounded by the second wiring; orthographic projection of the pixel definition layer on the substrate covers orthographic projection of the second wiring on the substrate; the orthographic projection of the second wire on the substrate base plate is at least partially overlapped with the overlapped part of the adjacent optical filters. At this time, the second functional layer is in a grid structure, so that the stress of the second inorganic packaging layer is more dispersed, the stress of the second inorganic packaging layer can be better released, rupture or rupture caused by overlarge stress of the inorganic layer is prevented, and the reliability of the display substrate can be improved.

In one exemplary embodiment, the first functional layer and the second functional layer may be planar structures.

In one exemplary embodiment, the cross-sectional shape of the first opening region 511 includes: polygonal, circular or elliptical, the polygonal including: square or prismatic. Fig. 7A illustrates an example in which the cross-sectional shape of the first opening area is square.

In one exemplary embodiment, the cross-sectional shape of the second opening area 521 includes: polygonal, circular or elliptical, the polygonal including: square or prismatic. Fig. 7B illustrates an example in which the cross-sectional shape of the second opening area is square.

In one exemplary embodiment, the cross-sectional shape of the first opening area and the cross-sectional shape of the second opening area may be the same, or may be different, and fig. 7A and 7B illustrate an example in which the cross-sectional shape of the first opening area and the cross-sectional shape of the second opening area are the same.

In one exemplary embodiment, as shown in fig. 1 to 3, the display substrate further includes: the display substrate further includes: a planar layer 60, a bonding layer 70 and a cover plate 80. The flat layer 60 is positioned on one side of the color film layer 30 away from the substrate base plate 10; the bonding layer 70 is located on a side of the planarization layer 60 away from the substrate 10, and the cover plate 80 is located on a side of the bonding layer 70 away from the substrate 10.

In one exemplary embodiment, the flat layer 60 and the bonding layer 70 cover the entire display area 100 and the entire peripheral area 200. The boundary of the cover plate 80 is located at the binding area 300.

In one exemplary embodiment, the material of which the planarization layer 60 is made may include: parylene;

in one exemplary embodiment, the bonding layer 70 may be made of materials including: the silicon dioxide and the bonding layer made of inorganic materials can be bonded with the cover plate better.

In one exemplary embodiment, the cover plate 80 may be a glass cover plate.

In one exemplary embodiment, as shown in fig. 1 to 3, the display substrate further includes: and (5) frame sealing glue 90. The cover plate 80 is fixed to the substrate 10 by a frame sealing adhesive 90.

In an exemplary embodiment, the frame sealing glue 90 is disposed between the substrate 10 and the cover plate 80, which can provide a guarantee for blocking water and oxygen invasion, so that the service life of the silicon-based OLED display substrate is greatly prolonged. In another exemplary embodiment, the frame sealing glue may be disposed on a side surface of the cover plate, the peripheral side surface of the cover plate and the substrate are sealed by the frame sealing glue, and an end surface of the side of the frame sealing glue away from the substrate is located between a surface of the side of the cover plate adjacent to the substrate and a surface of the side of the cover plate away from the substrate, thereby not only ensuring a sealing effect, but also preventing the frame sealing glue from being higher than the cover plate to increase the thickness of the display substrate.

In one exemplary embodiment, as shown in fig. 1 to 3, the peripheral region 200 includes: a power supply electrode 201, an auxiliary electrode 202, a connection electrode 203, and a second electrode 23. The auxiliary electrode 202 is connected to the power supply electrode 201 through a first conductive post, and the connection electrode 203 is connected to the auxiliary electrode 202 through a second conductive post. The connection electrode 203 is directly overlapped with the second electrode 23, that is, the connection electrode 203 is directly contacted with the second electrode 23, and no other film layer exists.

In an exemplary embodiment, the power supply electrode 201 is disposed at the same layer as the source and drain electrodes of the transistors in the driving structure layer in the display region, and is formed using the same process. The auxiliary electrode 202 is disposed on the same layer as the reflective electrode 14 in the driving structure layer in the display region, and is formed by the same process. The connection electrode 203 is disposed on the same layer as the first electrode 21 in the display region and is formed by the same process.

In an exemplary embodiment, the second electrode 23 may be connected to the connection electrode 203 through a via hole such that the connection electrode 203 and the auxiliary electrode 202 form a conductive path between the second electrode 23 and the power supply electrode 201. The voltage signal provided by the supply electrode 201 is transmitted to the second electrode 23 via the conductive path. The conductive channels are referred to as cathode ring structures.

In one exemplary embodiment, the cathode ring is a ring-like structure located in the peripheral region, being a conductive channel surrounding the display region, to effect power to the second electrode.

In one exemplary embodiment, as shown in fig. 1 to 3, the binding area 300 includes: a bonding electrode 301 and a bonding pad 302.

In one exemplary embodiment, the bonding electrode 301 in the bonding region 300 is disposed at the same layer as the source and drain electrodes of the transistors in the display region and is formed using the same process.

Fig. 8 is a flowchart of a method for manufacturing a display substrate according to an embodiment of the disclosure. As shown in fig. 8, an embodiment of the present disclosure further provides a method for manufacturing a display substrate, which is used for manufacturing a display substrate, and the method for manufacturing a display substrate provided by the embodiment of the present disclosure includes the following steps:

step S100, a substrate is provided.

Step S200, forming a pixel defining layer and a light emitting structure layer on a substrate.

Step S300, sequentially forming a functional layer and a color film layer on the light-emitting structure layer.

The color film layer comprises: a plurality of optical filters; the orthographic projection of the adjacent optical filters on the substrate is overlapped, and the orthographic projection of the pixel definition layer on the substrate covers the orthographic projection of the overlapped part of the adjacent optical filters on the substrate; the functional layer is positioned between the light-emitting structure layer and the color film layer, and the orthographic projection on the substrate is at least partially overlapped with the overlapped part of the adjacent optical filters.

In one exemplary embodiment, a display substrate includes: a display area, a peripheral area, and a binding area.

The manufacturing method of the display substrate provided by the embodiment of the present disclosure is used for manufacturing the display substrate provided by any one of the foregoing embodiments, and the implementation principle and the implementation effect are similar and are not repeated here.

In one exemplary embodiment, the light emitting structure layer includes: a first electrode, an organic light emitting layer and a second electrode, step S2 includes: forming a driving structure layer on a substrate base plate; forming a first electrode on the driving structure layer; a pixel defining layer, an organic light emitting layer, and a second electrode are sequentially formed on the driving structure layer formed with the first electrode to form a light emitting structure layer.

In an exemplary embodiment, the functional layer is a single layer structure, and step S3 includes: forming a first inorganic packaging layer on the light-emitting structure layer by adopting a chemical vapor deposition process; forming a functional layer on the first inorganic encapsulation layer; forming a second inorganic packaging layer on the functional layer by adopting an atomic layer deposition process; forming a third organic packaging layer on the second inorganic packaging layer by adopting a molecular layer deposition process; and forming a color film layer on the third organic packaging layer.

In another exemplary embodiment, the functional layer is a single layer structure, and step S3 includes: forming a first inorganic packaging layer on the light-emitting structure layer by adopting a chemical vapor deposition process; forming a second inorganic packaging layer on the first inorganic packaging layer by adopting an atomic layer deposition process; forming a functional layer on the second inorganic encapsulation layer; forming a third organic packaging layer on the functional layer by adopting a molecular layer deposition process; and forming a color film layer on the third organic packaging layer.

In one exemplary embodiment, the functional layer is a multi-layered structure, the functional layer including: a first functional layer and a second functional layer; the step S3 comprises the following steps: forming a first inorganic packaging layer on the light-emitting structure layer by adopting a chemical vapor deposition process; forming a first functional layer on the first inorganic encapsulation layer; forming a second inorganic packaging layer on the first functional layer by adopting an atomic layer deposition process; forming a second functional layer on the second inorganic encapsulation layer; forming a third organic packaging layer on the second functional layer by adopting a molecular layer deposition process; and forming a color film layer on the third organic packaging layer.

In an exemplary embodiment, after step S3, the method for manufacturing a display substrate further includes: and forming a flat layer, an attaching layer and a cover plate on the color film layer in sequence.

A method for manufacturing a display substrate according to an exemplary embodiment is described below with reference to fig. 9 to 17 by taking a multi-layer structure as an example.

In step S1, a substrate 10 is provided, and the substrate 10 is provided with a transistor 11 located in the display area 100, a power supply electrode 201 located in the peripheral area 200, and a bonding electrode 301 located in the bonding area 300, as shown in fig. 9.

Step S2, forming a first insulating layer 12 on the substrate 10; forming a first conductive pillar 13 in the via hole of the first insulating layer 12; forming a reflective electrode 14 located in the display region 100 and an auxiliary electrode 202 located in the peripheral region 200 on the first insulating layer 12; forming a second insulating layer 15 on the first insulating layer 12 on which the reflective electrode 14 and the auxiliary electrode 202 are formed; second conductive pillars 16 are formed in the vias of the second insulating layer 15 to form a driving structure layer, as shown in fig. 10.

In step S3, the first electrode 21 located in the display area 100 and the connection electrode 203 located in the peripheral area are formed on the driving structure layer, the pixel definition layer 24 is formed on the driving structure layer formed with the first electrode 21, and the organic light emitting layer 22 located in the display area 100 and the second electrode 23 located in the display area 100 and the peripheral area 200 are sequentially formed on the driving structure layer formed with the pixel definition layer, as shown in fig. 11.

In step S4, a chemical vapor deposition process is used to form a first inorganic encapsulation layer 41 on the second electrode 23, which covers the entire display region 100 and the entire peripheral region 200, as shown in fig. 12.

In step S5, a first functional layer 51 covering the entire display area 100 is formed on the first inorganic encapsulation layer 41, as shown in fig. 13.

In step S6, a second inorganic encapsulation layer 42 covering the entire display region 100 and the entire peripheral region 200 is formed on the first functional layer 51 using an atomic layer deposition process, as shown in fig. 14.

Step S7, a second functional layer 52 covering the entire display area 100 is formed on the second inorganic encapsulation layer 42, as shown in fig. 15.

In step S8, a molecular layer deposition process is used to form a third organic encapsulation layer 43 on the second functional layer 52, which covers the entire display region 100 and the entire peripheral region 200, as shown in fig. 16.

In step S9, a color film layer 30 is formed on the third organic encapsulation layer 43, as shown in fig. 17.

In step S10, a flat layer 60, an adhesive layer 70 and a cover plate 80 are formed on the color film layer 30, and a frame sealing adhesive 90 is filled between the cover plate 80 and the substrate 10, as shown in fig. 3.

The embodiment of the disclosure also provides a display device, including: the display substrate provided in any one of the foregoing embodiments.

In one exemplary embodiment, a display apparatus includes: VR device or AR device.

The drawings in the present disclosure relate only to structures to which embodiments of the present disclosure relate, and other structures may be referred to as general designs.

In the drawings for describing embodiments of the present disclosure, thicknesses and dimensions of layers or microstructures are exaggerated for clarity. It will be understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "under" another element, it can be "directly on" or "under" the other element or intervening elements may be present.

While the embodiments disclosed in the present disclosure are described above, the embodiments are only employed for facilitating understanding of the present disclosure, and are not intended to limit the present disclosure. Any person skilled in the art to which this disclosure pertains will appreciate that numerous modifications and changes in form and details can be made without departing from the spirit and scope of the disclosure, but the scope of the disclosure is to be determined by the appended claims.

Claims

1. A display substrate, comprising: a substrate, a pixel definition layer, a light-emitting structure layer, a functional layer and a color film layer which are arranged on the substrate; further comprises: the packaging layer is positioned between the light-emitting structure layer and the color film layer; the encapsulation layer includes: the first inorganic packaging layer, the second inorganic packaging layer and the third organic packaging layer; the first inorganic packaging layer is positioned on one side of the second inorganic packaging layer close to the substrate base plate; the third organic packaging layer is positioned on one side of the second inorganic packaging layer away from the substrate base plate;

the functional layer is positioned between the light-emitting structure layer and the color film layer, and the orthographic projection on the substrate base plate is at least partially overlapped with the overlapped part of the adjacent optical filters;

the functional layer is a multilayer structure, and the functional layer comprises: the first functional layer is positioned between the first inorganic packaging layer and the second inorganic packaging layer, the second functional layer is positioned between the second inorganic packaging layer and the third organic packaging layer, and the first functional layer and the second functional layer are transparent film layers; at least one film layer in the first functional layer and the second functional layer is in a grid structure;

The manufacturing materials of the first functional layer and the second functional layer comprise: polyvinyl chloride or titanium dioxide nanowires doped with plasticizers, stabilizers and ultraviolet light absorbers;

the first inorganic packaging layer and the second inorganic packaging layer are formed by adopting a deposition process; the deposition density of the first inorganic packaging layer is smaller than that of the second inorganic packaging layer;

the first functional layer is in a grid structure, the second functional layer is in a grid structure, or the first functional layer is in a planar structure, the second functional layer is in a grid structure, or the first functional layer is in a grid structure, and the second functional layer is in a planar structure;

when the first functional layer is a grid structure, the first functional layer includes: a first wire and a plurality of first opening areas surrounded by the first wire;

when the second functional layer is a mesh-like structure, the second functional layer includes: the second wiring and a plurality of second opening areas surrounded by the second wiring;

when the first functional layer is in a grid structure and the second functional layer is in a grid structure, the orthographic projection of the pixel definition layer on the substrate covers the orthographic projection of the first wire or the second wire on the substrate, and the orthographic projection of the first wire or the second wire on the substrate is at least partially overlapped with the overlapped part of the adjacent optical filter;

When the first functional layer is in a grid structure and the second functional layer is in a planar structure, the orthographic projection of the pixel definition layer on the substrate covers the orthographic projection of the first wiring on the substrate, and the orthographic projection of the first wiring on the substrate is at least partially overlapped with the overlapped part of the adjacent optical filters;

when the first functional layer is in a planar structure and the second functional layer is in a grid structure, the orthographic projection of the pixel definition layer on the substrate covers the orthographic projection of the second wiring on the substrate, and the orthographic projection of the second wiring on the substrate is at least partially overlapped with the overlapping part of the adjacent optical filters.

2. The display substrate according to claim 1, wherein the first inorganic encapsulation layer is made of a material comprising: silicon nitride; the second inorganic packaging layer comprises the following manufacturing materials: silicon oxide; the third organic packaging layer comprises the following manufacturing materials: parylene; the thickness of the third organic encapsulation layer is 4500 nm to 5500 nm.

3. The display substrate according to claim 1, wherein when the first functional layer and the second functional layer are in a lattice structure,

4. A display substrate according to claim 1 or 3, wherein the cross-sectional shape of the first opening region comprises: polygonal, circular or elliptical;

5. The display substrate of claim 2, wherein the display substrate further comprises: the driving structure layer, the flat layer, the attaching layer and the cover plate;

6. A display device, comprising: the display substrate according to any one of claims 1 to 5.

7. A method of manufacturing a display substrate according to any one of claims 1 to 5, the method comprising:

providing a substrate base plate;

the functional layer is located between the light-emitting structure layer and the color film layer, and the orthographic projection on the substrate is at least partially overlapped with the overlapping part of the adjacent optical filters, and the display substrate further comprises: the packaging layer is positioned between the light-emitting structure layer and the color film layer; the encapsulation layer includes: the first inorganic packaging layer is positioned on one side, close to the substrate, of the second inorganic packaging layer; the third organic packaging layer is positioned on one side of the second inorganic packaging layer away from the substrate base plate; the functional layer is a multilayer structure, and the functional layer comprises: the first functional layer is positioned between the first inorganic packaging layer and the second inorganic packaging layer, the second functional layer is positioned between the second inorganic packaging layer and the third organic packaging layer, and the first functional layer and the second functional layer are transparent film layers; at least one of the first functional layer and the second functional layer is in a grid structure; the manufacturing materials of the first functional layer and the second functional layer comprise: polyvinyl chloride or titanium dioxide nanowires doped with plasticizers, stabilizers and ultraviolet light absorbers;

8. The display substrate according to claim 7, wherein sequentially forming the functional layer and the color film layer on the light emitting structure layer comprises:

forming a first functional layer on the first inorganic encapsulation layer;

forming a second functional layer on the second inorganic encapsulation layer;

And forming a color film layer on the third organic packaging layer.

9. The display substrate according to claim 7, wherein the light emitting structure layer comprises: a first electrode, an organic light emitting layer, and a second electrode, the forming a pixel defining layer and a light emitting structure layer on the substrate base plate including:

forming a driving structure layer on the substrate base plate;

forming a first electrode on the driving structure layer;