KR20150137186A - Bendable organic light emitting diode display device - Google Patents

Abstract

The present invention provides a bendable organic light emitting diode display device, which includes a substrate where a display region and a non-display region which is located around the display region and includes a banding region are defined; a light emitting diode which is formed on the display region; an encapsulation layer which covers the light emitting diode; and a barrier film which is formed on the encapsulation layer and is attached with a barrier pressure sensitive adhesive. A first groove corresponding to the bending region is formed on the barrier pressure sensitive adhesive and the barrier film. The bending region is bent toward the back side of the substrate.

Description

[0001] The present invention relates to an organic light emitting diode (OLED)

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an organic light emitting diode (OLED) display device, and more particularly, to a Ben Double organic light emitting diode display device having a narrow bezel and capable of preventing damage to an encapsulation film.

As the information society develops, the demand for display devices for displaying images is increasing in various forms. A liquid crystal display (LCD) device, a plasma display panel (PDP), or an organic light emitting diode (OLED) device as compared with a conventional cathode ray tube (CRT) ) Display device is actively researched and commercialized.

Of these flat panel display devices, organic light emitting diode display devices have various advantages such as short response time, large contrast ratio, wide viewing angle and low power consumption, and active research is underway to develop them as next generation display devices.

1 is a schematic cross-sectional view of a conventional organic light emitting diode display.

1, the organic light emitting diode display device 1 includes a substrate 10 on which a display area AA and a non-display area NA around the display area AA are defined, 10, and an encapsulation film 20 covering the light emitting diode D, as shown in FIG.

The light emitting diode D is located in the display area AA and a driving unit (not shown) for driving the light emitting diode D is located in the non-display area NA.

Although not shown, the light emitting diode D includes first and second opposing electrodes and an organic light emitting layer positioned between the first and second electrodes. In addition, on the substrate 10, a switching thin film transistor, which is a switching element and a driving thin film transistor, which is a driving element, are formed for each pixel region (not shown), and a first electrode of the light emitting diode D is connected to the driving thin film transistor do.

The encapsulation film 20 covers the light emitting diode D and is formed corresponding to the display area AA and the non-display area NA. The encapsulation film 20 blocks external moisture from penetrating into the light emitting diode D, thereby reducing the damage of the light emitting diode D.

On the other hand, in the organic light emitting diode display device 1, the width of the organic light emitting diode display device 1 is increased by the non-display area NA which is an area where no image is displayed. That is, the bezel and occupied space of the organic light emitting diode display device 1 increase due to the non-display area NA.

DISCLOSURE Technical Problem The present invention aims at providing a narrow bezel organic light emitting diode display device by solving the problem of increase in width of an organic light emitting diode display device by a non-display area.

In addition, by using a patterned barrier film in the bending region, it is possible to reduce the occurrence of cracks in the encapsulation film upon bending, thereby reducing the damage of the organic light emitting diode from external moisture, Device.

According to an aspect of the present invention, there is provided a display device including: a substrate having a display area and a non-display area located around the display area and including a bending area; A light emitting diode formed in the display region; An encapsulation film covering the light emitting diode; Wherein the barrier pressure sensitive adhesive and the barrier film have a first groove corresponding to the bending region and the bending region is formed on the encapsulation layer, Wherein the organic light emitting diode is bent to the backside of the substrate.

In the display device of the present invention, the first grooves are formed at both ends of the substrate in the first direction.

In the present invention, the length of the first groove is equal to the length of the substrate in the second direction perpendicular to the first direction.

The length of the first groove is smaller than the length of the substrate in the second direction perpendicular to the first direction and is larger than the length of the second direction of the display region in the second direction. do.

In the display device of the present invention, at least two or more first grooves are formed on both ends of the substrate.

In the display device of the present invention, the encapsulation film may include: a first inorganic film which is formed on the display region and the non-display region and is located on the light emitting diode; An organic layer disposed on the first inorganic film and formed in the display region; And a second inorganic film formed on the organic film and formed in the display region and the non-display region.

In the benzal double organic light emitting diode display of the present invention, the second inorganic film is exposed through the first groove.

In the benzodiazo organic light emitting diode display of the present invention, the upper surface and the side surface of the organic film are completely covered by the second inorganic film.

The display device of the present invention may further include a polarizer disposed on the barrier film and having a second groove corresponding to the first groove.

In the benzodiazo organic light emitting diode display of the present invention, the light emitting diode may include: a first electrode located on the substrate; A second electrode spaced apart from the first electrode; And an organic light emitting layer disposed between the first and second electrodes, wherein light emitted from the organic light emitting layer is displayed through the second electrode.

In the organic light emitting diode display device according to the present invention, by bending the non-display area toward the back surface of the substrate using the flexible substrate, the problem of increase in width of the organic light emitting diode display device due to non- have. That is, a narrow bezel organic light emitting diode display device can be provided.

Further, by using the patterned barrier film in the bending region, cracking or damage to the encapsulation film during bending can be suppressed and penetration of external moisture can be reduced.

Accordingly, it is possible to provide a narrow-bezel double-double organic light emitting diode display device without damage to the light emitting diode.

1 is a schematic cross-sectional view of a conventional organic light emitting diode display.
2 is a schematic cross-sectional view of a benzodiazono organic light emitting diode display device according to a first embodiment of the present invention.
3 is an enlarged view of a portion A in Fig.
FIG. 4 is a schematic cross-sectional view illustrating a bending state of a display device according to a first embodiment of the present invention.
5A and 5B are enlarged views of the portion B in FIG.
6 is a schematic cross-sectional view of an organic light emitting diode display device according to a second embodiment of the present invention.
7 is a schematic plan view of an organic light emitting diode display device according to a second embodiment of the present invention.
FIG. 8 is a cross-sectional view illustrating a part of a bending state of a benzodiazono organic light emitting diode display device according to a second embodiment of the present invention.
FIG. 9 is a photograph showing a bending region of the display device of the second embodiment of the present invention.
10A to 10E are schematic cross-sectional views illustrating a manufacturing process of an organic light emitting diode display device according to a second embodiment of the present invention.

Hereinafter, the present invention capable of solving the above problems will be described in detail with reference to the drawings.

- First Embodiment -

FIG. 2 is a schematic cross-sectional view of a benzodiazo organic light emitting diode display device according to a first embodiment of the present invention, and FIG. 3 is an enlarged view of a portion A of FIG.

2, the organic light emitting diode display 100 includes a first substrate 110 having a display area AA and a non-display area NA defined around the display area AA, And a display element formed on the display area AA of the first substrate 110 and including a light emitting diode D. The organic light emitting diode display 100 may further include an encapsulation layer 120 covering the light emitting diode D and a barrier pressure sensitive adhesive 130 on the encapsulation layer 120. [ And a barrier film 140 adhered thereto. The barrier pressure sensitive adhesive 130 is positioned between the encapsulation layer 120 and the barrier film 140 and the barrier layer 140 is bonded to the encapsulation layer 140 through the barrier pressure- 120.

The first substrate 110 is a flexible substrate and the second substrate 112 may be attached under the first substrate 110 to increase the rigidity of the first substrate 110.

The first substrate 110 is made of at least one material selected from the group consisting of a polyester polymer, a silicone polymer, an acryl polymer, a polyolefin polymer, and combinations thereof. . For example, the first substrate 110 may be made of polyimide (PI), and the second substrate 112 may be made of polyethylene terephthalate (PET) or polyimide (PI) . In addition, the second substrate 112 may have a larger thickness than the first substrate 110. The second substrate 112 supports the first substrate 110 and may be omitted depending on the structure.

A display device including a light emitting diode D is formed on the first substrate 110 in correspondence with the display area AA.

Referring to FIG. 3 showing a display device, a semiconductor layer 150 is formed on the first substrate 110, and a gate insulating layer 152 and a gate electrode 154 are formed on the semiconductor layer 150. The gate electrode 154 is formed corresponding to the semiconductor layer 150.

Further, an interlayer insulating film 156 covering the gate insulating film 152 and the gate electrode 154 is formed. A semiconductor layer contact hole exposing both sides of the semiconductor layer 150 is formed in the interlayer insulating layer 156.

A source electrode 158 and a drain electrode 162 are formed on the interlayer insulating layer 156 to contact both sides of the semiconductor layer 150 through the semiconductor layer contact holes. The source electrode 158 and the drain electrode 162 are spaced apart from each other.

The semiconductor layer 150, the gate insulating layer 152, the gate electrode 154, the interlayer insulating layer 156, the source electrode 158, and the drain electrode 162 constitute a driving thin film transistor.

Although not shown, a switching thin film transistor having a structure similar to that of the driving thin film transistor is formed, and a gate wiring and a data wiring which are connected to the switching thin film transistor and intersect with each other and define a plurality of pixel regions in the display region AA are formed . Further, a power wiring line spaced apart from the gate wiring or the data wiring may be formed.

A protective layer 164 having a drain contact hole exposing the drain electrode 162 of the driving thin film transistor is formed to cover the driving thin film transistor.

The light-emitting diode D is formed on the passivation layer 164. The light emitting diode D includes a first electrode 170 connected to the drain electrode 162 of the driving thin film transistor through the drain contact hole and an organic light emitting layer 172 formed on the first electrode 170. [ And a second electrode 174 formed on the organic light emitting layer 172. In addition, a bank 176 covering the edge of the first electrode 170 is formed.

That is, the first electrode 170 and the organic light emitting layer 172 formed for each pixel region, and the second electrode 174 covering the entire surface of the display region AA are stacked to form the light emitting diode D.

At this time, the first electrode 170 may be an anode and may be made of a conductive material having a relatively large work function value. For example, the first electrode 170 may be made of a transparent conductive material such as indium-tin-oxide (ITO) or indium-zinc-oxide (IZO) .

The second electrode 174 may be a cathode and may be made of a conductive material having a relatively low work function value. For example, the second electrode 174 may be made of aluminum or an aluminum alloy.

The organic light emitting layer 172 includes a light emitting material and holes and electrons provided from the first electrode 170 and the second electrode 174 are combined in the organic light emitting layer 172 to emit light. The organic light emitting layer 172 may include red, green, and blue organic light emission patterns, or may be formed of a plurality of light emitting layers complementary to each other to emit white light. In addition, the organic light emitting layer 172 may have a multi-layer structure in order to maximize the light emitting efficiency. For example, the organic light emitting layer 172 may include a hole injection layer (HTL), a hole transporting layer (HIL), an electron transporting layer, and an electron injection layer .

The light emitting diode (D) is very vulnerable to moisture. That is, when the external moisture penetrates into the organic light emitting diode D, the light emitting diode D is deteriorated and the service life is shortened.

An encapsulation film 120 is formed on the light emitting diode D in order to minimize the problem and to allow the organic light emitting diode display device 100 to have flexible characteristics.

In FIG. 2, the first electrode 170 is connected to the drain electrode 162 of the driving thin film transistor. However, the first electrode 170 may be connected to the source electrode 158 according to the type of the thin film transistor.

2, the encapsulation layer 120 includes a first inorganic layer 122 formed on the light emitting diode D and covering the display area AA and the non-display area NA, An organic layer 124 formed on the first inorganic layer 122 and covering the display area AA; a second organic layer 124 formed on the organic layer 124 and covering the display area AA and the non- And a second inorganic film 126 covering the light-shielding film NA.

Each of the first and second inorganic films 122 and 126 may be formed of an inorganic material such as silicon nitride (SiNx), silicon oxide (SiOx), aluminum oxide (AlOx) epoxy based organic materials or epoxy based thermosetting materials.

A barrier film 140 having a barrier pressure sensitive adhesive 130 is formed on the encapsulation film 120 to further prevent foreign moisture penetration and to provide a flat upper surface. Here, the term "barrier" means that there is resistance to moisture penetration, that is, moisture penetration delay characteristic.

The barrier film 140 may be formed of a material such as a base such as a cyclic olefin polymer (COP), a cyclic olefin copolymer (COC), polycarbonate (PC), or polyethylene terephthalate It may be a structure in which an inorganic film is formed on at least one surface of the film. The base film may be an isotropic film having a retardation value of 3 nm or less, and may be formed to a thickness of about 50 to 100 탆. The inorganic film may be formed of any one of silicon nitride (SiNx), silicon oxide (SiOx), and aluminum oxide (AlOx), and may be formed to a thickness of about 1 to 2 탆. The barrier pressure-sensitive adhesive 130 may be formed of an acryl-based, olefin-based, or silicon-based material.

The light emitting diode D described above is a so-called top-emission type in which light emitted from the organic light emitting layer 172 passes through the second electrode 174 by making the second electrode 174 have a transflective characteristic, emission method. Although not shown, a reflective electrode may be formed under the first electrode 170 to increase the light efficiency. In addition, a polarizer (not shown) may be attached to the outside of the barrier film 140 to prevent the visible light from being reflected by external light.

At this time, both ends of the organic light emitting diode display device 100 may be bent toward the back surface of the first substrate 110 to realize a narrow bezel.

4, which is a schematic cross-sectional view showing a bending state of a benzodiazono organic light emitting diode display device according to a first embodiment of the present invention, the non-display area NA is divided into the first substrate 110 The bezel width of the organic light emitting diode display device 100 can be reduced.

The non-display area NA is a region in which a driving circuit or the like for driving the light emitting diode D is formed, and is an area in which no image is displayed. Accordingly, by bending the non-display area NA toward the back surface of the first substrate 110 where no image is displayed, it is possible to realize a narrow bezel with a minimized bezel area.

- Second Embodiment -

Meanwhile, in the bending process, the barrier film 140 and the encapsulation film 120 may be damaged.

5A and 5B are enlarged cross-sectional views of the portion B of FIG. 4, respectively. As shown in FIG. 5A, cracks are generated in the barrier film 140 and the barrier pressure-sensitive adhesive 130 in the bending region BA during the bending process Or damage to the first inorganic film 122 and the second inorganic film 122 may occur, so that external moisture may directly penetrate into the first and second inorganic films 122 and 126. Cracks generated in the barrier pressure-sensitive adhesive 130 and the barrier film 140 are also transmitted to the first and second inorganic films 122 and 126 so that the moisture permeation prevention function of the encapsulation membrane 120 And the light emitting diode (D in FIG. 3) may be damaged.

That is, although the narrow bezel can be realized by bending the non-display area NA, since the barrier film 140 and the encapsulation film 120 are damaged in the bending area BA, Resulting in deterioration of the light emitting diode (D).

In the second embodiment, an organic light emitting diode display device capable of realizing a narrow bezel without damaging the barrier film 140 and the encapsulation film 120 is proposed.

FIG. 6 is a schematic cross-sectional view of an organic light emitting diode display device according to a second embodiment of the present invention, and FIG. 7 is a schematic plan view of an organic light emitting diode display device according to a second embodiment of the present invention.

6, the organic light emitting diode display 200 according to the second embodiment of the present invention includes a display area AA and a bending area BA surrounding the display area AA And a display device including a light emitting diode (D) formed on the display area (AA) of the first substrate (210). The organic light emitting diode display device 200 further includes an encapsulation layer 220 covering the light emitting diode D and a plurality of grooves 220 formed in the encapsulation layer 220, (Barrier pressure sensitive adhesive) 230 having barrier properties (e.g., Gr) and a barrier film 240.

The first substrate 210 is a flexible substrate and the second substrate 212 may be attached to the first substrate 210 under the first substrate 210 to increase the rigidity of the first substrate 210.

The first substrate 210 is made of at least one material selected from the group consisting of a polyester polymer, a silicone polymer, an acryl polymer, a polyolefin polymer, . For example, the first substrate 210 may be made of polyimide (PI), and the second substrate 212 may be made of polyethylene terephthalate (PET) or polyimide (PI) . In addition, the second substrate 212 may have a greater thickness than the first substrate 210. The second substrate 212 supports the first substrate 210 and may be omitted depending on its structure.

As described above, an array element such as a driving thin film transistor and a switching thin film transistor may be formed on the first substrate 210, and the light emitting diode D is connected to the driving thin film transistor.

The light emitting diode (D) is a top emission type and includes a first electrode connected to a drain electrode of the driving thin film transistor, an organic light emitting layer formed on the first electrode, and a second electrode formed on the organic light emitting layer .

The organic film 224 and the second inorganic film 226 are stacked on the light emitting diode D in order to reduce the penetration of external moisture into the light emitting diode D, A barrier film 240 having a barrier pressure-sensitive adhesive 230 attached to the encapsulation layer 220 is formed.

At this time, grooves Gr are formed in the barrier pressure-sensitive adhesive 230 and the barrier film 240 to correspond to the bending areas BA. The groove Gr penetrates the barrier pressure sensitive adhesive 230 and the barrier film 240 to expose the second inorganic film 226 through the groove Gr.

Even if the organic light emitting diode display device 200 is bent in the bending area BA for the narrow bezel implementation, the stress of the barrier pressure sensitive adhesive 230 and the barrier film 240 may be reduced by the groove Gr As a result, damage to the barrier pressure-sensitive adhesive 230 and the barrier film 240 is reduced. Therefore, deterioration of the light-emitting diode D due to external moisture permeation can be prevented.

7, the groove Gr is formed at both ends of the first substrate 210 (FIG. 6) along the long side direction X and extends along the short side direction Y of the first substrate 210. The length of the groove Gr may be the same as the short side length of the first substrate 210. That is, since the entire organic light emitting diode display device 200 is bent at the bending area BA, the groove Gr may be formed to have the same length as the short side length of the first substrate 210.

Although two grooves Gr formed on both sides are shown in FIG. 7, only one groove Gr may be formed when only one side is bent.

The grooves Gr may be formed at both ends of the first substrate 210 in the short side direction Y and the length of the grooves Gr may be equal to the long side length of the first substrate 210 . In this case, the first substrate 210 is bent in the short side direction.

That is, the groove Gr is formed at both ends of the first substrate 210 in the first direction, and the length of the groove Gr is longer than the length of the substrate 210 in the second direction perpendicular to the first direction. ≪ / RTI >

7, the length of the groove Gr is the same as the length of the short side of the first substrate 210, but the length of the groove Gr may be shorter than that of the first substrate 210. [ For example, the length of the groove Gr may be greater than the length of the first substrate 210 and greater than the length of the display area AA in order to prevent a crack corresponding to the display area AA .

That is, the groove Gr is formed at both ends of the first substrate 210 in the first direction, and the length of the groove Gr is longer than the length of the substrate 210 in the second direction perpendicular to the first direction. And may be larger than the second direction length of the display area AA.

In FIG. 7, the grooves Gr are formed on both sides, but two or more grooves Gr may be formed on both sides.

In addition, the width of the groove Gr can be adjusted according to the radius of curvature, that is, the curvature.

FIG. 8 is a cross-sectional view illustrating a part of a bending state of a benzodiazono organic light emitting diode display device according to a second embodiment of the present invention.

The organic light emitting diode display device having the barrier reducing pressure sensitive adhesive 230 and the barrier film 240 is bent from the bending area BA to the backside of the first substrate 210 to form a benz double organic light emitting diode display device having a narrow bezel . Since the grooves Gr corresponding to the bending areas BA are formed in the barrier pressure sensitive adhesive 230 and the barrier film 240 as shown in FIG. 8, the barrier pressure sensitive adhesive 230 and the barrier film 240 or cracks in the first and second inorganic films 222, 226 at the bottom can be minimized.

The pressure sensitive adhesive 230 and the barrier film 240 at the end of the substrate 210 face each other with the barrier pressure sensitive adhesive 230 and the barrier film 240 formed in the display region and the bending area BA between the pressure sensitive adhesive 230 and the barrier film 240, As shown in FIG.

9, which is a photograph showing a bending area of the benzodiazo organic light emitting diode display device according to the second embodiment of the present invention, the barrier pressure sensitive adhesive 230 and the barrier film 240 are bent in a bending area BA It can be confirmed that when the groove (Gr) is formed, moisture permeation due to cracking or damage during bending does not occur.

10A to 10E are schematic cross-sectional views illustrating a manufacturing process of an organic light emitting diode display device according to a second embodiment of the present invention.

10A, a first substrate 210 is mounted on a carrier substrate 280, and the entire surface of the first substrate 210 is processed. The first substrate 210 is a flexible substrate and the rigidity of the first substrate 210 can be maintained by attaching a carrier substrate 280, which is a glass substrate, to the rear surface of the first substrate 210.

A semiconductor material layer (not shown) is formed on the first substrate 210 and patterned to form a semiconductor layer 250. Next, a gate insulating film 252 and a gate electrode (not shown) are formed corresponding to the semiconductor layer 250 by forming and patterning an inorganic insulating material layer (not shown) and a first metal layer (not shown) on the semiconductor layer 250, 254 are formed.

Next, an interlayer insulating film 256 covering the gate electrode 254 is formed, and a mask layer is formed to expose both sides of the semiconductor layer 250 by performing a mask process.

Next, a second metal layer (not shown) is formed and patterned on the interlayer insulating layer 256 to form a source electrode 258 and a drain electrode 258 which are in contact with the semiconductor layer 250 through the semiconductor layer contact hole, (262).

The semiconductor layer 250, the gate insulating layer 252, the gate electrode 254, the interlayer insulating layer 256, the source electrode 258, and the drain electrode 262 constitute a driving thin film transistor.

Although not shown, a switching thin film transistor having a structure similar to that of the driving thin film transistor is formed on the first substrate 210. In the process of forming the gate electrode 254, a gate wiring connected to the gate electrode of the switching thin film transistor is formed. In the process of forming the source and drain electrodes 258 and 262, It is possible to form a data line to be connected. Further, a power supply line spaced apart from the data line in the process of forming the source and drain electrodes 258 and 262 can be formed. The power supply line may be connected to the source electrode 258 of the driving thin film transistor.

Next, a passivation layer 264 is formed to cover the driving thin film transistor and the switching thin film transistor and to have a drain contact hole exposing the drain electrode 262 of the driving thin film transistor.

Next, ITO, which is a transparent conductive material, is deposited on the passivation layer 264 and patterned to form the first electrode 270. The first electrode 270 is connected to the drain electrode 262 of the driving thin film transistor through the drain contact hole.

A bank 276 is formed along the edge of the first electrode 270 and an organic light emitting layer 272 is formed on the first electrode 270 surrounded by the bank 276. Then, the second electrode 274 covering the organic light emitting layer 272 is formed to form the light emitting diode D.

10B, a first inorganic film 222, an organic film 224, and a second inorganic film 226 are formed on the first substrate 210 on which the light emitting diode D is formed, And sequentially laminated.

The first and second inorganic films 222 and 226 are formed on both the display area AA and the non-display area NA while the organic film 224 is formed corresponding to the display area AA, So that moisture penetration can be prevented more efficiently.

For example, when the organic film 224 is also formed in the non-display area NA, the side of the organic film 224 may be exposed to be a path of moisture infiltration, AA, and the upper surface and the side surface of the organic film 224 are completely covered with the second inorganic film 226.

In addition, the first and second inorganic films 222 and 226 are also formed in the non-display area NA, thereby preventing external moisture from penetrating into the light emitting diode D.

Referring to FIG. 10C, a linear film 282 is attached to one surface of the barrier pressure-sensitive adhesive 230 and a protection film 284 is attached to one surface of the barrier film 240 In the form of a film. The linear film 282 and the protection film 284 protect the barrier pressure sensitive adhesive 230 and the barrier film 240, respectively.

Next, as shown in Fig. 10D, an encapsulation film 220 composed of the first inorganic film 222, the organic film 224 and the second inorganic film 226 is formed by using the barrier pressure-sensitive adhesive 230 The barrier film 240 is attached. More specifically, the linear film 282 attached to the outermost portion of the film structure of the structure described in FIG. 10C is first removed, and the barrier pressure-sensitive adhesive 230 is attached on the second inorganic film 226. Thereafter, the protection film 284 is removed and a polarizer 250 is attached to the barrier film 240. The polarizer 250 is provided to prevent reflection of external light and may be omitted.

The polarizer 250 having no grooves is shown in FIG. 10D but grooves corresponding to the grooves Gr formed in the barrier film 240 and the barrier pressure-sensitive adhesive 230 may be formed on the polarizer 250 It is possible to prevent the polarizer 250 from being damaged during bending. That is, when the groove Gr formed in the barrier film 240 and the barrier pressure-sensitive adhesive 230 is referred to as a first groove, a polarizer 250 having a second groove in a region corresponding to the first groove is disposed The damage of the polarizer 250 when bending can also be improved.

Next, as shown in FIG. 10E, the carrier substrate 280 is separated and a second substrate 212 for supporting the first substrate 210 is attached to the rear surface of the first substrate 210 . Then, by bending the bending area BA, a benzodiazono organic light emitting diode display device according to the second embodiment of the present invention can be obtained.

As described above, in the benzodiazo organic light emitting diode display device according to the embodiment of the present invention, the groove corresponding to the bending region is formed in the barrier pressure-sensitive adhesive and the barrier film, so that even if bent in the bending region to reduce the width of the bezel, Damage to the pressure-sensitive adhesive and the barrier film is minimized. Therefore, a narrow bezel organic light emitting diode display device can be obtained while minimizing damage to the light emitting diode due to moisture penetration.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention as defined in the appended claims. It can be understood that

110, 210: first substrate 120, 220: encapsulation film
130, 230: barrier pressure-sensitive adhesive 140, 240: barrier film
D: light emitting diode Gr: groove

Claims (10)

A substrate having a display region and a non-display region located around the display region and including a bending region;
A light emitting diode formed in the display region;
An encapsulation film covering the light emitting diode;
A barrier film formed on the encapsulation film and having a barrier pressure-sensitive adhesive attached thereto,
Wherein the barrier pressure-sensitive adhesive and the barrier film have a first groove corresponding to the bending region, and the bending region is bent to the backside of the substrate.
The method according to claim 1,
Wherein the first grooves are formed at both ends of the substrate in the first direction.
3. The method of claim 2,
Wherein a length of the first groove is equal to a length of the substrate in a second direction perpendicular to the first direction.
3. The method of claim 2,
Wherein a length of the first groove is smaller than a length of the substrate in a second direction perpendicular to the first direction and larger than a length of the display region in the second direction.
3. The method of claim 2,
Wherein at least two or more first grooves are formed on both ends of the substrate.
The method according to claim 1,
The encapsulation membrane may be formed,
A first inorganic film disposed on the light emitting diode and formed in the display region and the non-display region;
An organic layer disposed on the first inorganic film and formed in the display region;
And a second inorganic film formed on the organic film and formed in the display region and the non-display region.
The method according to claim 6,
And the second inorganic film is exposed through the first groove.
The method according to claim 6,
Wherein the upper surface and the side surface of the organic film are completely covered by the second inorganic film.
The method according to claim 1,
Further comprising a polarizer formed on the barrier film and having a second groove corresponding to the first groove.
The method according to claim 1,
The light-
A first electrode located on the substrate;
A second electrode spaced apart from the first electrode;
And an organic light emitting layer disposed between the first and second electrodes,
And the light emitted from the organic light emitting layer is displayed through the second electrode.

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